CN120103554A - A high-speed optical module heat dissipation structure and high-speed optical module - Google Patents
A high-speed optical module heat dissipation structure and high-speed optical module Download PDFInfo
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- CN120103554A CN120103554A CN202510600303.5A CN202510600303A CN120103554A CN 120103554 A CN120103554 A CN 120103554A CN 202510600303 A CN202510600303 A CN 202510600303A CN 120103554 A CN120103554 A CN 120103554A
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
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- G02B6/4269—Cooling with heat sinks or radiation fins
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Abstract
The invention relates to the technical field of high-speed optical modules, in particular to a high-speed optical module radiating structure and a high-speed optical module, wherein the high-speed optical module radiating structure comprises a radiating shell, a radiating cavity and a radiating cavity, wherein the radiating shell is internally provided with a mounting cavity which is used for mounting functional components of the high-speed optical module; the heat dissipation component is arranged in the mounting cavity and connected with the functional component for dissipating heat of the functional component, and the heat dissipation fins are arranged on the heat dissipation shell and are close to the heat dissipation component. The heat dissipation structure of the high-speed optical module is optimized, and heat of the core heating element which cannot be directly conducted out is indirectly and rapidly conducted out through the heat dissipation structure, so that the heat dissipation effect of the whole module is improved, the influence of heat dissipation on the operation of the module is reduced, and the performance and the service stability of the module are improved.
Description
Technical Field
The invention relates to the technical field of high-speed optical modules, in particular to a high-speed optical module radiating structure and a high-speed optical module.
Background
With the rapid development of information technology, the speed and capacity requirements of data transmission are continually increasing. As a key component in an optical communication network, a high-speed optical module plays an important role in converting an electrical signal into an optical signal and transmitting the optical signal at a high speed. The performance directly affects the operation efficiency and stability of the whole optical communication system. In the working process of the high-speed optical module, a large amount of heat is generated by the internal electronic element and the optical device during high-speed operation, and the heating element cannot directly contact with the external shell for heat transfer, so that if the heat cannot be effectively dissipated in time, the internal temperature of the module can be rapidly increased. The excessively high temperature not only can influence the performance of electronic elements in the optical module, so that the working parameters of the electronic elements drift, the transmission quality of signals is reduced, the problem of increased error rate and the like is solved, but also can negatively influence the luminous efficiency and the service life of the optical device, accelerate the ageing of the optical device, and even cause the optical module to fail to work normally when serious.
At present, the common high-speed optical module heat dissipation modes in the market mainly comprise natural heat dissipation, air cooling heat dissipation, simple heat dissipation fin heat dissipation and the like. The natural heat dissipation mode only depends on natural heat exchange between the module and the surrounding environment to dissipate heat, and the heat dissipation efficiency is extremely low and is only suitable for some low-power-consumption and low-speed optical modules. Although the air cooling heat dissipation improves the heat dissipation efficiency to a certain extent, equipment such as a fan is additionally arranged, the complexity and the power consumption of the system are increased, meanwhile, the fan can generate noise in the operation process, the reliability of the fan is relatively low, the fan needs to be regularly maintained and replaced, and the fan is not suitable for the field of optical communication with extremely high requirements on stability and reliability. The simple radiating fin radiates heat to enhance the radiating effect by increasing the radiating area, but the radiating capability of a large amount of heat generated by the high-speed optical module is limited, so that the increasing radiating requirement is difficult to meet.
Disclosure of Invention
Therefore, the invention aims to provide a high-speed optical module radiating structure and a high-speed optical module, and the radiating structure of the high-speed optical module is optimized to indirectly and rapidly conduct out the heat generated by a core heating element which cannot directly conduct out the heat through the radiating structure, so that the radiating effect of the whole module is improved, the influence of heat dissipation on the operation of the module is reduced, and the performance and the service stability of the module are improved.
The invention solves the technical problems by the following technical means:
a high-speed optical module heat dissipation structure, comprising:
the device comprises a heat dissipation shell, a first light source, a second light source and a first light source, wherein a mounting cavity is formed in the heat dissipation shell and is used for mounting functional components of the high-speed optical module;
The heat dissipation component is arranged in the mounting cavity, connected with the functional component and used for dissipating heat of the functional component;
When the first heat dissipation component and the second heat dissipation component are buckled on the functional component, a closed space is formed, and the functional component is subjected to omnibearing heat dissipation;
When the first heat dissipation component and the second heat dissipation component are buckled, a high-heat-conductivity adhesion material is arranged at the buckled joint, modified heat-conductivity silica gel is adopted as the high-heat-conductivity adhesion material, and the modified heat-conductivity silica gel is prepared by taking the heat-conductivity silica gel as a carrier and carrying out ultrasonic and vacuum defoaming on graphene aerogel loaded with surface-modified hexagonal boron nitride nanosheets;
And the radiating fins are arranged on the radiating shell and are close to the radiating component.
Based on the scheme, the application also carries out the following improvement:
further, the heat dissipation shell comprises a module cover plate and a module base, the heat dissipation fins are arranged on one side of the module cover plate, a first heat conduction piece is arranged on the other side of the module cover plate, a second heat conduction piece is arranged on the module base, and the first heat conduction piece corresponds to the second heat conduction piece.
According to the technical means, the functional component and the heat dissipation component of the high-speed optical module can be installed in the module cover plate and the module base, and when the heat dissipation component dissipates heat, the heat can be further transferred and dissipated up and down between the module cover plate and the module base through the first heat conduction piece and the second heat conduction piece, so that the heat dissipation efficiency is improved.
Further, the first heat conducting piece is arranged to be a first heat conducting bulge, the first heat conducting bulge is fixedly arranged on the module cover plate, the second heat conducting piece is arranged to be a second heat conducting bulge, the second heat conducting bulge is fixedly arranged on the module base, and the first heat conducting bulge and the second heat conducting bulge are oppositely arranged;
the free ends of the first heat conduction bulge and the second heat conduction bulge are respectively provided with a first heat transfer element.
According to the technical means, the heat conduction piece is arranged to be the heat conduction protrusion, so that up-and-down heat transfer between the module cover plate and the module base is facilitated, and the heat transfer efficiency is improved by arranging the first heat transfer piece.
Further, the first heat dissipation assembly comprises a heat dissipation cover, a partition plate and a second heat transfer element, wherein the partition plate is fixedly arranged in the heat dissipation cover and used for separating the heat dissipation cover to form a first groove and a second groove, the first groove and the second groove are used for dissipating heat of the functional component and sealing the functional component, and the second heat transfer element is arranged on the heat dissipation cover and is in contact with the heat dissipation shell.
According to the technical means, through the arrangement of the heat dissipation cover, heat can be dissipated to the functional component, and the heat is quickly transferred to the heat dissipation shell through the second heat conduction piece, so that heat dissipation is accelerated, and meanwhile, the functional component is covered, and dust and the like are prevented from entering the functional component.
Further, the first heat dissipation assembly further comprises a plurality of clamping blocks, and the clamping blocks are respectively arranged at the edge of the heat dissipation cover.
According to the technical means, the clamping blocks are arranged, so that on one hand, the functional components can be stably installed, and when the functional components are contacted, heat can be dissipated, so that the heat dissipation performance is enhanced, and on the other hand, the clamping blocks are convenient to be buckled with the second heat dissipation assembly, so that a closed heat dissipation space is formed with the second heat dissipation assembly.
Further, the second heat dissipation assembly comprises a bottom plate, a heat dissipation table and a third heat conduction piece, wherein the heat dissipation table is arranged on the bottom plate and corresponds to the functional component, and the third heat conduction piece is arranged on the bottom plate and is in contact with the heat dissipation shell.
According to the technical means, the heat dissipation is carried out through the contact of the heat dissipation platform and the bottom surface of the functional component, and the heat can be rapidly dissipated to the bottom of the heat dissipation shell by matching with the bottom plate and the third heat conduction piece.
Further, the functional component is provided with a through hole, the area of the functional component is communicated with the area of the heat dissipation platform through the through hole, and a fourth heat conduction piece is arranged between two adjacent heat dissipation platforms.
According to the technical means, through the arrangement of the through holes, the heat dissipation speed is improved, and through the arrangement of the fourth heat conduction piece between the heat dissipation tables, heat dissipation can be further accelerated, and meanwhile, the stability of temperature is maintained.
Further, the second heat dissipation assembly further comprises two side plates, the two side plates are respectively and fixedly arranged on two sides of the bottom plate, and clamping grooves are formed in the two side plates.
According to the technical means, the side plates are provided with the clamping grooves, so that the clamping grooves are conveniently clamped with the clamping blocks, and a closed heat dissipation space is formed.
The application also discloses a high-speed optical module, which comprises the high-speed optical module radiating structure.
By adopting the high-speed optical module with the heat radiation structure, the heat radiation performance of the high-speed optical module can be improved, so that the service stability and the service life of the high-speed optical module are improved.
The application adopting the scheme has the following beneficial effects:
1. according to the application, the heat generated by the core heating element which cannot directly conduct heat can be indirectly and rapidly conducted out through the heat radiation structure by adopting the heat radiation component to be in contact with the functional component of the high-speed optical module, so that the heat radiation effect of the whole module is improved, the influence of heat radiation on the operation of the module is reduced, and the performance and the service stability of the module are improved;
2. In the application, the heat dissipation components are arranged as the first heat dissipation component and the second heat dissipation component and are respectively arranged at the upper side and the lower side of the functional component, and a closed heat dissipation space can be formed, so that heat can be dissipated from two parts of the module cover plate and the module base, the heat dissipation efficiency is improved, and the temperature stability can be maintained;
3. In the application, the first heat dissipation component not only can rapidly dissipate heat of the functional component, but also can cover the upper part of the functional component to prevent dust and the like from entering the functional component, and is matched with the second heat dissipation component to rapidly dissipate heat of the lower part of the functional component, and the through holes are arranged between the functional component and the second heat dissipation component so as to improve the heat dissipation speed, thereby improving the heat dissipation performance of the high-speed optical module, and further improving the service stability and service life of the high-speed optical module.
Drawings
The application can be further illustrated by means of non-limiting examples given in the accompanying drawings;
fig. 1 is a schematic diagram of a partially disassembled structure of a heat dissipation structure of a high-speed optical module in an embodiment of the present application;
fig. 2 is a schematic diagram of heat conduction in a heat dissipation structure of a high-speed optical module according to an embodiment of the present application;
fig. 3 is a schematic structural diagram of functional components in a heat dissipation structure of a high-speed optical module according to an embodiment of the present application;
Fig. 4 is a schematic structural diagram of a second heat dissipation assembly in a heat dissipation structure of a high-speed optical module according to an embodiment of the present application;
Fig. 5 is a schematic structural diagram of a first heat dissipation assembly in a heat dissipation structure of a high-speed optical module according to an embodiment of the present application;
fig. 6 is a schematic structural diagram of a module base in a high-speed optical module heat dissipation structure according to an embodiment of the present application;
fig. 7 is a schematic structural diagram of a module cover plate in a high-speed optical module heat dissipation structure according to an embodiment of the present application;
Main symbol element description:
100. The module cover plate comprises 110 parts of a module cover plate, heat dissipation fins, 120 parts of a first heat conduction member, 130 parts of a first accommodating groove, 200 parts of a functional part, 210 parts of a circuit board, 220 parts of a special-shaped through groove, 221 parts of a notch, 230 parts of an array optical fiber jumper wire, 240 parts of an optical connector, 250 parts of a coupling lens, 260 parts of a first heating chip, 270 parts of a second heating chip, 280 parts of a third heating chip, 290 parts of a fourth heating chip;
300. the module comprises a module base, 310, a second heat conduction piece, 320 and a second accommodating groove;
400. The heat dissipation component 410, the second heat dissipation assembly 411, the bottom plate 412, the first heat dissipation platform 413, the second heat dissipation platform 414, the third heat dissipation platform 415, the side plate 416, the clamping groove 420, the first heat dissipation assembly 421, the heat dissipation cover 422, the partition plate 423, the first groove 424, the second groove 425 and the clamping block.
Detailed Description
The following embodiments of the present invention are described in terms of specific examples, and those skilled in the art will appreciate the advantages and capabilities of the present invention from the disclosure herein. It should be noted that, the illustrations provided in the following embodiments are for illustrative purposes only, and are shown in schematic drawings, not physical drawings, and are not to be construed as limiting the present invention, and in order to better illustrate the embodiments of the present invention, some components in the drawings may be omitted, enlarged or reduced, and do not represent the actual product size, and it may be understood by those skilled in the art that some well-known structures in the drawings and descriptions thereof may be omitted.
In the description of the present invention, it should be understood that, if there are terms such as "upper", "lower", "left", "right", "front", "rear", etc. that indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, it is merely for convenience in describing the present invention and simplifying the description, and it is not indicated or implied that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, so that the terms describing the positional relationships in the drawings are merely for exemplary illustration and are not to be construed as limiting the present invention, and specific meanings of the terms may be understood by those of ordinary skill in the art according to specific circumstances:
It should be noted that the illustrations provided in the following embodiments merely illustrate the basic concept of the present invention by way of illustration, and only the components related to the present invention are shown in the drawings and are not drawn according to the number, shape and size of the components in actual implementation, and the form, number and proportion of the components in actual implementation may be arbitrarily changed, and the layout of the components may be more complicated.
As shown in fig. 1 to 7, an embodiment of the present application discloses a heat dissipation structure of a high-speed optical module, which includes a heat dissipation housing, a heat dissipation component 400, and a heat dissipation fin 110, wherein a mounting cavity is formed in the heat dissipation housing, and the mounting cavity is used for mounting a functional component 200 of the high-speed optical module. The heat dissipation member 400 is disposed in the mounting cavity and connected to the functional member 200 for dissipating heat from the functional member 200. The heat dissipation fins 110 are disposed on the heat dissipation case and are close to the heat dissipation member 400 for increasing a heat dissipation area and enhancing heat dissipation capability.
In this embodiment, as shown in fig. 3, the functional component 200 includes a circuit board 210, a first heat generating chip 260, a second heat generating chip 270, a third heat generating chip 280, a fourth heat generating chip 290, an array optical fiber jumper 230, a coupling lens 250 and an optical connector 240, where one end of the array optical fiber jumper 230 is connected to the optical connector 240 and the other end is connected to the coupling lens 250. The coupling lens 250 is coupled to the second heat generating chip 270 and the fourth heat generating chip 290, the third heat generating chip 280 and the fourth heat generating chip 290 are mounted on the surface of the circuit board 210, and the first heat generating chip 260 and the second heat generating chip 270 are mounted on the heat dissipating member 400 and electrically connected to the front surface of the circuit board 210.
In the present embodiment, the circuit board 210 is provided with a shaped through groove 220 for improving electrical performance, increasing a heat radiating area, and mounting the first and second heat generating chips 260 and 270. Notches 221 are also provided on both sides of the circuit board 210 to facilitate the installation of the heat dissipation member 400. The circuit board 210 is provided with through holes at the third heat generating chip 280 and the fourth heat generating chip 290, and the through holes are used for corresponding to the heat dissipation component 400.
In this embodiment, as shown in fig. 1 and 6-7, the heat dissipation housing includes a module cover plate 100 and a module base 300. The heat dissipation fins 110 are disposed on the upper side of the module cover plate 100 and near the upper side of the heat dissipation member 400 to increase the heat dissipation area and heat dissipation capacity. The inner side of the module cover plate 100 is provided with a first heat conducting piece 120, the module base 300 is provided with a second heat conducting piece 310, the first heat conducting piece 120 corresponds to the second heat conducting piece 310, when the module cover plate 100 and the module base 300 are folded, the first heat conducting piece 120 is contacted with the second heat conducting piece 310, so that heat is transferred up and down between the module cover plate 100 and the module base 300, and heat dissipation efficiency is improved.
In the present embodiment, the first heat conductive member 120 is provided as a first heat conductive protrusion fixedly provided on the module cover plate 100. The second heat conductive member 310 is provided as a second heat conductive protrusion fixedly provided on the module base 300. The first heat conduction protrusion and the second heat conduction protrusion are opposite, namely can directly abut against each other, and can also have a gap.
In some embodiments, when the first and second heat conductive protrusions have gaps at opposite ends thereof, the free ends of the first and second heat conductive protrusions are provided with first heat transfer members to increase heat transfer efficiency and reduce thermal resistance. When the opposite ends of the first heat conduction protrusion and the second heat conduction protrusion are directly abutted, heat transfer can be directly contacted.
The first and second thermally conductive bumps are provided as a high thermally conductive material, for example, copper bumps, silicon carbide bumps, graphene bumps, aluminum nitride bumps, or the like.
In the present embodiment, as shown in fig. 1 and 4-5, the heat sink 400 includes a first heat sink assembly 420 and a second heat sink assembly 410. The first heat dissipation component 420 and the second heat dissipation component 410 may be disposed on the upper and lower sides of the first heat generating chip 260, the second heat generating chip 270, the third heat generating chip 280, and the fourth heat generating chip 290, and cooperate with the module cover plate 100 and the module base 300 to form sandwich heat dissipation. The first heat dissipation component 420 and the second heat dissipation component 410 may further be wrapped on the upper and lower sides of the first heat generating chip 260, the second heat generating chip 270, the third heat generating chip 280 and the fourth heat generating chip 290 to form a closed heat dissipation space, so that the heat dissipation efficiency is improved, and meanwhile, the influence of heat on other components is reduced.
In the present embodiment, when the first heat dissipation component 420 and the second heat dissipation component 410 are disposed on the upper and lower sides of the first heat generating chip 260, the second heat generating chip 270, the third heat generating chip 280, and the fourth heat generating chip 290, a sandwich type heat dissipation is formed:
As shown in fig. 5, the first heat dissipation assembly 420 includes a heat dissipation cap 421, a partition 422, and a second heat transfer member. The partition 422 is integrally formed in the heat dissipation case 421, and is used for separating the heat dissipation case 421 to form a first groove 423 and a second groove 424 for dissipating heat and sealing an upper region of the functional component 200. The second heat transfer member is disposed on the outer surface of the heat dissipation case 421 and contacts the heat dissipation case to rapidly transfer heat to the module cover plate 100.
As shown in fig. 4, the second heat dissipation assembly 410 includes a bottom plate 411, a heat dissipation stage, and a third heat conduction member. The heat dissipation stage is provided on the bottom plate 411 and corresponds to the functional component 200 for dissipating heat from a lower region of the functional component 200. The third heat conductive member is disposed on the bottom plate 411 and contacts the heat dissipation case to rapidly transfer heat to the module base 300.
In the present embodiment, the heat dissipation cover 421 and the partition 422 are made of a high thermal conductive material, for example, diamond, copper, silicon carbide, graphene, aluminum nitride, or the like. The first groove 423 and the second groove 424 can seal the first heating chip 260, the second heating chip 270, the fourth heating chip 290 and the coupling lens 250 in the first groove 423 and the second groove 424 respectively, and are attached to the upper surfaces of the first heating chip 260, the second heating chip 270, the fourth heating chip 290 and the coupling lens 250, so that a protection box is realized while heat dissipation is performed, and impurities such as dust are prevented from entering. At this time, the third heat-generating chip 280 is located outside the heat-dissipating cover 421, and a second heat transfer element is also disposed between the third heat-generating chip 280 and the inner side surface of the module cover 100, so as to quickly transfer the heat of the third heat-generating chip 280 to the module cover 100.
In another embodiment, the heat dissipation cover 421 may also cover the third heat generating chip 280, and simultaneously dissipate heat and protect the third heat generating chip 280.
The second heat transfer element is also made of a highly thermally conductive material, such as diamond, copper, silicon carbide, graphene, aluminum nitride, and the like. The second heat transfer member may be manufactured in a round shape, a square shape, etc., and the material used may be the same as or different from the heat dissipation cap 421. The module cover plate 100 is provided with a first accommodating groove 130, the lower surface of the second heat transfer element is in contact with the upper surface of the heat dissipation cover 421, and the upper surface of the second heat transfer element is positioned in the first accommodating groove 130, so that heat generated by the first heating chip 260, the second heating chip 270 and the fourth heating chip 290 during operation can be quickly transferred to the module cover plate 100 through the heat dissipation cover 421 and the second heat transfer element, and further, heat is quickly dissipated.
In the present embodiment, the bottom plate 411 and the heat sink are made of a high thermal conductive material, such as copper, silicon carbide, graphene, aluminum nitride, or the like. The heat dissipation platform is provided with a plurality of, preferably 3, and 3 heat dissipation platforms can adopt modes such as welding, spiro union, riveting to fix with bottom plate 411, also can integrated into one piece, preferably integrated into one piece, and the shaping of being convenient for, simultaneously, can not influence the heat transfer effect because of the joining of other materials.
The 3 heat dissipation stages are divided into a first heat dissipation stage 412, a second heat dissipation stage 413 and a third heat dissipation stage 414, the first heat dissipation stage 412 and the second heat dissipation stage 413 respectively correspond to the first heat generating chip 260 and the second heat generating chip 270, and the first heat generating chip 260 and the second heat generating chip 270 are respectively attached to the upper surfaces of the first heat dissipation stage 412 and the second heat dissipation stage 413 and pass through the special-shaped through groove 220 on the circuit board 210 to be electrically connected with the front surface of the circuit board 210. The third heat dissipation base 414 corresponds to the fourth heat dissipation chip 290, and a through hole is formed between the fourth heat dissipation chip 290 and the circuit board 210, so that when the fourth heat dissipation chip 290 works, heat can be directly or indirectly transferred to the third heat dissipation base 414 through the circuit board 210 and the through hole, and heat dissipation is accelerated. Heat transfer through the circuit board 210 and heat transfer through the through holes, the heat dissipation efficiency is higher and the temperature stability is more reliable than direct heat transfer of the circuit board 210.
The third heat conducting piece is arranged on the lower surface of the bottom plate 411, the second accommodating groove 320 is formed in the module base 300, the upper surface of the third heat conducting piece is in contact with the outer surface of the base, the lower surface of the third heat conducting piece is located in the second accommodating groove 320, heat can be quickly transferred to the module base 300 through the heat dissipation table, the bottom plate 411 and the third heat conducting piece, and therefore heat is dissipated, and the heat is transferred to the module cover plate 100 through the first heat conducting piece 120 and the second heat conducting piece 310, so that heat dissipation is further accelerated.
In this embodiment, the third heat transfer member is also made of a high heat conductive material, such as diamond, copper, silicon carbide, graphene, aluminum nitride, or the like. The third heat transfer member may be manufactured in a round shape, a square shape, etc., and the material used may be the same as or different from the heat dissipation cap 421.
In another embodiment, the third heat generating chip 280 may also correspond to the second heat dissipating platform 413, and in this case, a through hole is also formed between the third heat generating chip 280 and the circuit board 210, so that when the third heat generating chip 280 works, heat can be directly or indirectly transferred to the second heat dissipating platform 413 through the circuit board 210 and the through hole, and heat dissipation is accelerated. Heat transfer through the circuit board 210 and heat transfer through the through holes, the heat dissipation efficiency is higher and the temperature stability is more reliable than direct heat transfer of the circuit board 210.
In this embodiment, a fourth heat conducting member is disposed between the first heat dissipating stage 412, the second heat dissipating stage 413 and the third heat dissipating stage 414, and the fourth heat conducting member may be a heat conducting silica gel, a heat conducting gel or the like, so as to communicate the heat dissipating stages, which is beneficial to maintaining the stability of temperature.
In this embodiment, when the first heat dissipation component 420 and the second heat dissipation component 410 can be wrapped on the upper and lower sides of the first heat generating chip 260, the second heat generating chip 270, the third heat generating chip 280 and the fourth heat generating chip 290 to form a closed heat dissipation space, the first heat dissipation component 420 and the second heat dissipation component 410 not only include the structures of the above embodiments, but also include the following structures:
The first heat dissipation assembly 420 further includes a plurality of clamping blocks 425, and the plurality of clamping blocks 425 are respectively arranged at edges of the heat dissipation cover 421.
The second heat dissipation assembly 410 further includes two side plates 415, wherein the two side plates 415 are fixedly disposed on two sides of the bottom plate 411, and the two side plates 415 are provided with clamping grooves 416.
When the first heat dissipation component 420 and the second heat dissipation component 410 are clamped and coated on the upper side and the lower side of the first heat generation chip 260, the second heat generation chip 270, the third heat generation chip 280 and the fourth heat generation chip 290, the clamping blocks 425 are clamped in the clamping grooves 416 to form a closed structure, the circuit board 210 can be stably mounted through the cooperation of the clamping blocks 425 and the clamping grooves 416, heat can be dissipated when the edge of the circuit board 210 is contacted, and the heat dissipation of the heat generation chips is enhanced through the cooperation of the first heat dissipation component 420 and the second heat dissipation component 410.
In this embodiment, the fixture block 425 and the heat dissipation cover 421 are arranged at the edge of the heat dissipation cover 421 in an integrally formed manner, and the side plate 415 and the clamping groove 416 are formed on the bottom plate 411 in an integrally formed manner, so that the processing is convenient, and the same high heat conduction material is adopted, which is beneficial to heat dissipation.
In this embodiment, a high thermal conductive adhesive material, such as modified thermal conductive silica gel, thermal conductive epoxy, thermal conductive double sided tape, or the like, is disposed at the connection between the clamping block 425 and the clamping groove 416. Through setting up high heat conduction adhesion material, on the one hand, can make the installation of first radiating component 420 and second radiating component 410 more stable, on the other hand, can promote the closure of junction, simultaneously, can not influence the radiating effect.
In this embodiment, the high thermal conductivity adhesion material is modified thermal conductivity silica gel, and the modified thermal conductivity silica gel is prepared by taking thermal conductivity silica gel as a carrier and loading nano thermal conductivity material. The specific preparation method comprises the following steps:
Placing the hexagonal boron nitride nano-sheet in a 3-aminopropyl triethoxysilane solution, reacting for 1-2h, stirring while reacting to obtain a surface modified hexagonal boron nitride nano-sheet, filtering, and drying to obtain a dried surface modified hexagonal boron nitride nano-sheet;
Adding 10 parts by weight of surface-modified hexagonal boron nitride nano-sheets into 30 parts by weight of graphene oxide solution with the concentration of 2-4 mg/mL, adding 0.1 part by weight of ethylenediamine cross-linking agent, and performing ultrasonic treatment for 30min under the condition of 200-300W to obtain self-assembly liquid;
And (3) subpackaging the self-assembled liquid, subpackaging in a forming die, freeze-drying at the temperature of minus 20 to minus 30 ℃ to obtain graphene aerogel loaded with hexagonal boron nitride nano sheets, reducing the graphene gel in acetic acid solution for 2 hours at the temperature of 85 ℃, filtering, washing with deionized water for 3 times to obtain reduced graphene oxide, and forming amide bonds between amino groups on the surfaces of the hexagonal boron nitride nano sheets and carboxyl groups of the reduced graphene oxide to obtain the graphene aerogel with enhanced interface bonding.
And (3) carrying out ultrasonic treatment on 5 parts by weight of heat-conducting silica gel and 2 parts by weight of graphene aerogel for 30min under the condition of 800-1000W, uniformly mixing, and then carrying out vacuum defoaming to obtain the modified heat-conducting silica gel. Through tests, the in-plane heat conductivity coefficient of the modified heat-conducting silica gel is 28.4W/m.K, the out-of-plane heat conductivity coefficient is increased to 3.6W/m.K, and the surface has certain adhesion, so that the heat resistance between the clamping block 425 and the clamping groove 416 can be reduced, and the heat dissipation is accelerated.
In this embodiment, since the heating chip in the functional component 200 is the main heat source of the module, heat is directly or indirectly transferred to the second heat dissipation component 410 and then transferred to the module base 300, meanwhile, heat is directly or indirectly transferred to the module cover plate 100 through the first heat dissipation component 420, and since the upper surface of the module cover plate 100 is the main heat dissipation surface, part of heat is transferred to the module cover plate 100 through the first heat conduction member 120, the second heat conduction member 310 and the contact surface, and finally, heat is dissipated through the heat dissipation fins 110 arranged on the module cover plate 100 and the external environment.
The embodiment of the application also discloses a high-speed optical module, which comprises the high-speed optical module radiating structure in the embodiment.
By adopting the high-speed optical module with the heat dissipation structure, the heat dissipation performance of the high-speed optical module can be improved, so that the service stability and the service life of the high-speed optical module are improved.
The high-speed optical module radiating structure and the high-speed optical module provided by the invention are described in detail. The description of the specific embodiments is only intended to aid in understanding the method of the present invention and its core ideas. It should be noted that it will be apparent to those skilled in the art that various modifications and adaptations of the invention can be made without departing from the principles of the invention and these modifications and adaptations are intended to be within the scope of the invention as defined in the following claims.
It should be noted that references in the specification to "one embodiment," "an embodiment," "some alternative embodiments," "an example embodiment," "some embodiments," etc., indicate that the embodiment described may include a particular feature, structure, or characteristic, but every embodiment may not necessarily include the particular feature, structure, or characteristic. Moreover, such phrases are not necessarily referring to the same embodiment. Furthermore, when a particular feature, structure, or characteristic is described in connection with an embodiment, it is submitted that it is within the knowledge of one skilled in the art to effect such feature, structure, or characteristic in connection with other embodiments whether or not explicitly described.
It should be noted that the above embodiments are merely for illustrating the technical solution of the present application and not for limiting the same, and although the present application has been described in detail with reference to the above embodiments, it should be understood by those skilled in the art that the technical solution described in the above embodiments may be modified or some or all of the technical features may be equivalently replaced, and these modifications or substitutions do not make the essence of the corresponding technical solution deviate from the scope of the technical solution of the embodiments of the present application.
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202510600303.5A CN120103554B (en) | 2025-05-12 | 2025-05-12 | High-speed optical module heat radiation structure and high-speed optical module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202510600303.5A CN120103554B (en) | 2025-05-12 | 2025-05-12 | High-speed optical module heat radiation structure and high-speed optical module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN120103554A true CN120103554A (en) | 2025-06-06 |
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