JP2002289979A - Electronic component and its manufacturing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component in which a deformation such as a warpage or the like in an assembling step is reduced and an apparatus for manufacturing the same at a low cost. SOLUTION: The electronic component comprises a chip-like element 7 mounted on the main surface of a substrate 3. The component further comprises a groove 5 provided at the substantially central part of a longitudinal direction on the opposite surface of the main surface of the substrate 3 to traverse the opposite surface. Thus, when the substrate 3 is heated by a heater 2 mounted on a stage 1, a warp generated by largely expanding the vicinity of the lower surface of the substrate 3 by early temperature rising as compared with the upper surface occurs at each unit of the region by about 1/2 partitioned by the groove 5 on the substrate 3. Accordingly, when an elongation amount due to the thermal expansion of the upper and lower surface sides of the substrate 3 of the region is considered, the size of the warp, that is, a warp size W1 becomes about 1/4 as compared with the warp size of the entire substrate 3 when the groove 5 is not provided on the substrate 3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component manufactured by mounting a chip-shaped element on a main surface of a substrate and an apparatus for manufacturing the same, and particularly, to secure reliability of electrical connection in an assembly process. The present invention relates to an electronic component that can be manufactured and an apparatus for manufacturing the same.

[0002]

2. Description of the Related Art A conventional electronic component will be described with reference to FIG. FIGS. 5A and 5B show a state immediately after a substrate is placed on a stage and a state immediately before a chip-like element is mounted on a substrate when a conventional electronic component is assembled. It is a front view. In FIG. 5A, a stage 100 is provided with a heater 101.
1, the stage 100 is preheated to a predetermined temperature. The board 102 is a printed board made of, for example, glass epoxy, and has a predetermined circuit pattern (not shown) and pads 103 formed thereon. In FIG. 5B, a chip-like element 105 fixed to a chuck 104 is arranged so as to face the substrate 102, and the chip-like element 105
Of the solder bump 106 and the pad 103 of the substrate 102
Aligned. The chuck 104 is lowered from the state shown in FIG.
And press against. The solder bump 106 is formed on the heated substrate 1
02 comes into contact with the pad 103 and is melted.
Then, the solder bump 106 solidifies as the temperature of the substrate 102 decreases thereafter. As a result, the solder bumps 106 and the pads 103 are electrically connected, and an electronic component is completed through a predetermined underfill process. In addition, the stage 1
There is a case where another member (stage block) is attached to 00 using a bolt or the like. In this case, the substrate 102 placed on the upper surface of the stage block is heated via the stage block.

[0003]

However, according to the above-mentioned conventional electronic components, there is a problem that warpage occurs when the substrate 102 is heated. That is, as shown in FIG. 5B, in the substrate 102, the temperature near the heated lower surface rises faster than that of the upper surface, so that the lower surface side expands more thermally and becomes concave upward. Dimension W
A) occurs. If the chip-like element 105 is pressed against the substrate 102 in this state, the electrical connection between the solder bump 106 and the pad 103 becomes unstable near the center of the substrate 102, and the reliability may be reduced. Further, even when the solder bump 106 and the pad 103 are electrically connected, the substrate 102 tends to return to a flat state as shown in FIG. Stress is applied to the electrical connection portion consisting of
As a result, the reliability of the electrical connection may be reduced. Further, in order to reduce the warpage of the substrate 102 due to heating in the assembly process, a material having a low coefficient of thermal expansion may be used as the material of the substrate 102. However, since such a material is expensive, there is a problem that it is contrary to a demand for a price reduction. Also, when a stage block is mounted on the stage 100, the stage block may be warped due to a temperature difference between the upper surface and the lower surface of the stage block, or due to mounting means (bolts or the like) for mounting the stage block. appear. This makes it difficult for the substrate 102 to be stably placed on the upper surface of the stage block, for example, by being inclined. Therefore, the reliability of the electrical connection between the solder bump 106 and the pad 103 may be reduced. Further, when a material having a low coefficient of thermal expansion is used as the material of the stage block, there is a problem that the price of the stage block becomes high.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and has as its object to provide an electronic component capable of ensuring the reliability of electrical connection in an assembling process, and an apparatus for manufacturing the same. I do.

[0005]

In order to solve the above-mentioned technical problems, an electronic component according to the present invention is an electronic component manufactured by mounting a chip-shaped element on a main surface of a substrate, An opening provided on a surface opposite to the main surface is provided, and the openings are provided so as to intersect in a direction in which greater warpage occurs when the substrate is heated.

According to this, when the substrate is heated, the substrate is warped in units of a region defined by the opening provided on the opposite surface. Therefore, warpage is reduced as compared with a case where no opening is provided, without using a material having a low coefficient of thermal expansion. Further, since the substrate is defined by the openings along the direction in which greater warpage occurs when the substrate is heated, large warpage among the warpages occurring when no opening is provided is reliably reduced.

In order to solve the above-mentioned technical problem, an electronic component manufacturing apparatus according to the present invention is an electronic component manufacturing apparatus for manufacturing an electronic component by mounting a chip-shaped element on a main surface of a substrate. , A stage to which the substrate is fixed, and attached to the stage along opposing peripheries of the substrate, and
A clamp mechanism for pressing and fixing the substrate to the stage, and a portion of the clamp mechanism that contacts the substrate is inclined with respect to the main surface of the substrate.

According to this, the inclined surface of the clamp mechanism contacts the substrate and presses it, thereby fixing the substrate to the stage. Thereby, the substrate is fixed when the substrate is heated, so that the warpage of the substrate is suppressed. Further, when the substrate is to be expanded due to thermal expansion, the substrate extends along the opposing outer periphery of the substrate and along the inclined surface of the clamp mechanism, so that deformation such as warpage or undulation of the substrate is suppressed. .

[0009] Further, an electronic component manufacturing apparatus according to the present invention, in the above-described manufacturing apparatus, is characterized in that opposing outer peripheries are along a direction in which greater warpage occurs when the substrate is heated. .

[0010] According to this, the inclined surface of the clamp mechanism contacts and presses the substrate along the direction in which greater warpage occurs when the substrate is heated, thereby fixing the substrate to the stage. . Therefore, a large warp of the warp generated when the substrate is not pressed is reliably suppressed.

[0011] In order to solve the above-mentioned technical problems, an electronic component manufacturing apparatus according to the present invention is an electronic component manufacturing apparatus for manufacturing an electronic component by mounting a chip-shaped element on a substrate. A heater block for heating, and a stage block mounted on the heater block and having a main surface fixed to the substrate, wherein the stage block is heated on a surface opposite to the main surface in the stage block. The opening is provided so as to intersect with the direction in which the larger warpage occurs.

According to this, when the stage block is heated, the stage block is defined by the opening so as to be along the direction in which greater warpage occurs. Therefore, when the stage block is heated, warpage occurs in units of the partitioned area,
Among the warpages generated when no opening is provided, a large warpage is reliably reduced.

[0013] In order to solve the above-mentioned technical problem, an electronic component manufacturing apparatus according to the present invention is an electronic component manufacturing apparatus for manufacturing an electronic component by mounting a chip-shaped element on a substrate. A heater block for heating, a stage block mounted on the heater block and having a main surface fixed to the substrate, and mounted on the heater block along opposing outer peripheries of the stage block; A clamp mechanism for pressing and fixing the stage block to the block is provided, and a portion of the clamp mechanism that contacts the stage block is inclined with respect to the main surface of the stage block.

According to this, the stage block is fixed to the heater block by the inclined surface of the clamp mechanism coming into contact with and pressing the stage block. Thereby, since the stage block is fixed when heated, the warpage of the stage block is suppressed. When the stage block is going to expand due to thermal expansion, along the opposing outer circumference of the stage block, and
Since the stage block extends along the inclined surface of the clamp mechanism, deformation such as warpage or undulation of the stage block is suppressed.

[0015]

(First Embodiment) A first embodiment of the present invention.
Will be described with reference to FIG. Figure 1
(A) and (B) show a state immediately after the substrate is mounted on the stage and a state immediately before the chip-like element is mounted on the substrate when the electronic component according to the present embodiment is assembled. FIG. In FIG. 1A, a stage 1 is provided with a heater 2, and the heater 2 preheats the stage 1 to a predetermined temperature. The board 3 is a printed board made of, for example, glass epoxy, and FIG.
Are formed of the same material and outer dimensions as the substrate 102 shown in FIG. 1, a circuit pattern (not shown) is formed, and pads 4 are formed on the main surface (the upper surface in FIG. 1). Further, the substrate 3 is provided with a groove 5 as an opening crossing the opposite surface, substantially at the center in the longitudinal direction on the opposite surface of the main surface. In FIG. 1 (B), a chip-like element 7 made of, for example, a semiconductor chip fixed to a chuck 6 is arranged opposite to the substrate 3, and the solder bumps 8 of the chip-like element 7 and the pads 4 of the substrate 3 are arranged. Aligned.

From the state shown in FIG. 1B, the chuck 6 descends to press the chip-like element 7 and the substrate 3 against each other. The solder bumps 8 are melted by contacting the pads 4 of the preheated substrate 3. Then, the solder bumps 8 are solidified by lowering the temperature of the substrate 3 thereafter. Thereby, the solder bumps 8 and the pads 4 are electrically connected.
Further, an electronic component is completed through a predetermined underfill process.

Here, the feature of the electronic component according to the present embodiment is that the substrate 3 is provided with the groove 5 in the vicinity of the center in the longitudinal direction on the opposite surface of the main surface so as to cross the opposite surface. That is. As a result, when the substrate 3 is heated, the warpage caused by the fact that the temperature near the lower surface rises faster than the upper surface and expands more greatly is caused by the area defined by the groove 5, that is, the dimension of the substrate 3 in the longitudinal direction. Is generated in units of about 1/2 of the area. And about 1/2
In the region of, the amount of elongation due to thermal expansion on the upper surface side and the lower surface side is about そ れ ぞ れ of the amount of elongation on the upper surface side and the lower surface side of the entire substrate 102 shown in FIG. . Therefore, the magnitude of the warpage of the substrate 3 in this region, that is, the warpage dimension W1 in FIG.
Is about 寸 法 of the warp dimension WA of the entire conventional substrate 102 shown in FIG.

As described above, according to the present embodiment, in the substrate 3 made of the same material as the conventional one, by providing the groove 5 on the surface opposite to the main surface, the warpage dimension W1 is reduced to about １ ／ of the conventional one. Reduced. Therefore, it is possible to provide an electronic component in which the reliability of the electrical connection is ensured by greatly reducing the warpage generated in the assembly process.

Although the case where only one groove 5 is provided has been described, a plurality of grooves 5 may be provided in parallel according to the size and shape of the substrate 3. Further, the grooves 5 can be provided in a lattice shape.

Although the groove 5 is provided so as to cross the surface opposite to the main surface of the substrate 3, the invention is not limited to this, and the groove 5 is not crossed, that is, does not reach the side surface of the substrate 3. A groove 5 may be provided.

Although the groove 5 is provided near the center in the longitudinal direction on the surface opposite to the main surface of the substrate 3, the groove 5 may be provided near the center in the direction in which the warp increases when heated. For example, the thermal expansion coefficient may have directionality depending on the material of the substrate 3. In such a case, the substrate 3
In consideration of the dimensions and shape and the coefficient of thermal expansion that varies depending on the direction, a direction in which the warp is larger when heated is found, and the groove 5 may be provided substantially near the center of the direction.

The groove 5 may be intermittent. Further, as an opening in place of the groove 5, a slit penetrating the substrate 3 may be provided to such an extent that the strength of the substrate 3 is not reduced. In this case, the slits may be provided continuously so as not to cross the opposite surface of the substrate 3 or may be provided intermittently.

(Second Embodiment) A second embodiment of the present invention will be described with reference to FIG. FIG. 2 (A), (B)
FIGS. 3A and 3B are a front view and a side view, respectively, showing a state where a substrate is mounted on a stage and fixed when the electronic component manufacturing apparatus according to the embodiment is used. FIG. 2 (A)
, Two clamp mechanisms 9 are provided on each long side of the substrate 3,
That is, they are attached to the stage 1 by the locking member 10 so as to be able to advance and retreat along two opposing long sides. Here, in order to accommodate substrates 3 having different dimensions and shapes, the stage 1 is provided with locking holes (not shown) at a plurality of positions so that the clamp mechanism 9 can be moved in the left-right direction in FIG. . In FIG. 2B, an inclined surface 11 is provided at a portion where the clamp mechanism 9 contacts the substrate 3, that is, at a portion where the substrate 3 is pressed.

According to the present embodiment, after the substrate 3 is placed on the stage 1, the clamping mechanism 9 is advanced toward the stage 1 and the locking mechanism 9 is pressed with the inclined surface 11 pressing the substrate 3. It is attached to the stage 1 using a member 10. Thereby, the warpage generated when the substrate 3 is heated is suppressed by the clamp mechanism 9. Further, the clamp mechanism 9 is provided along each long side of the substrate 3, that is, along a direction in which the substrate 3 warps more when heated. Therefore, a large warp of the warp generated when the substrate 3 is heated is reliably suppressed. When the substrate 3 is to be expanded by thermal expansion, it extends in the left-right direction in FIG. 2A along two opposing long sides and along the inclined surface 11 of the clamp mechanism 9. . Therefore, the deformation of the substrate 3, such as warpage or undulation, is suppressed because the substrate 3 that is to be expanded by thermal expansion is not completely fixed to the stage 1.

When the substrate 3 is to be extended due to thermal expansion, the substrate 3 is moved along the inclined surface 11 of the clamp mechanism 9.
Of the substrate 3 may be chamfered so as to be inclined so as to easily stretch the edge.

Although the case where the substrate 3 provided with the groove 5 is clamped has been described, the present embodiment can also be applied to a substrate not provided with the groove 5.

Further, the case where two clamp mechanisms 9 are provided for each of two opposing long sides of the substrate 3 has been described. However, the present invention is not limited to this, and one or more clamp mechanisms 9 may be provided in the vicinity of the center for each long side, or three or more may be provided for each of the long sides according to the size and shape of the substrate 3.

Although the clamp mechanism 9 is provided along each long side of the substrate 3, it is sufficient if the clamp mechanism 9 is provided along a direction in which the substrate is warped more when heated. For example, substrate 3
Depending on the material, the thermal expansion coefficient may have directionality. In such a case, in consideration of the size and shape of the substrate 3 and the coefficient of thermal expansion that varies depending on the direction, a direction in which the warpage is larger when heated is found, and the clamp mechanism 9 is provided along the direction. Just do it.

(Third Embodiment) A third embodiment of the present invention will be described with reference to FIG. FIG. 3 (A), (B)
Shows a state immediately after the stage block is mounted on the heater block and a state immediately before the chip-shaped element is mounted on the substrate when the electronic component manufacturing apparatus according to the present embodiment is used, respectively. It is a front view. FIG. 3 (A),
2B, the heater 2 is provided in the heater block 12, and the heater 2 preheats the heater block 12 to a predetermined temperature. A stage block 13 is mounted on the upper surface of the heater block 12. The stage block 13 is provided with a groove 14 as an opening crossing the opposite surface, substantially at the center in the longitudinal direction on the opposite surface of the main surface (the upper surface in FIG. 3). A substrate 15 is placed on the stage block 13, and a chip-like element 7, for example, a semiconductor chip, fixed to a chuck 6 is arranged opposite to the substrate 15, and the solder bump 8 of the chip-like element 7 and the substrate 15 Of the pad 4 is aligned.

From the state of FIG. 3B, the chip-like element 7 and the substrate 15 are pressed against each other in the same manner as in the first embodiment.
The solder bumps 8 and the pads 4 are electrically connected. Further, an electronic component is completed through a predetermined underfill process.

Here, the feature of the electronic component manufacturing apparatus according to the present embodiment is that the stage block 13 has a groove 14 near the center in the longitudinal direction on the opposite surface of the main surface so as to cross the opposite surface. It is provided. As a result, when the stage block 13 is heated, the warpage caused by the fact that the temperature near the lower surface rises faster than the upper surface and expands more greatly is caused by the area defined by the groove 14, that is, the longitudinal direction of the stage block 13. Approximately 1 /
It occurs in units of only two areas. And this about 1
In the area of / 2, the expansion amount due to the thermal expansion of the upper surface side and the lower surface side is about ２ of the expansion amount of the upper surface side and the lower surface side when the stage block 13 does not have the groove 14, respectively. become. Therefore, the size of the warpage of the stage block 13 in this area, that is, FIG.
The warp dimension W2 of the conventional stage block having no groove is about ４ of the warp dimension of the entire stage block.

As described above, according to the present embodiment, in the stage block 13 made of the same material as the conventional one, by providing the groove 14 on the surface opposite to the main surface, the warpage dimension W2 can be reduced to about 1/4 of the conventional one. To be reduced. This allows
It is possible to provide an electronic component manufacturing apparatus capable of securing reliability of electrical connection in an assembling process.

Although the case where only one groove 14 is provided has been described, a plurality of grooves 14 may be provided in parallel according to the size and shape of the stage block 13. Also,
The grooves 14 can be provided in a lattice shape.

Further, the groove 14 is provided so as to cross the surface opposite to the main surface of the stage block 13. However, the present invention is not limited to this, so that the groove 14 does not cross the opposite surface, that is, does not reach the side surface of the stage block 13. Then, the groove 14 may be provided.

The groove 14 may be intermittent. Further, as an opening replacing the groove 14, the stage block 13
May be provided to such an extent that the strength of the stage block 13 is not reduced. In this case, the slit may be provided continuously so as not to cross the opposite surface of the stage block 13, or may be provided intermittently.

(Fourth Embodiment) A fourth embodiment of the present invention will be described with reference to FIG. FIG. 4 (A), (B)
When the electronic component manufacturing apparatus according to the present embodiment is used, the stage block is placed on the heater block,
It is the front view and side view which each show the fixed state. As shown in FIGS. 4A and 4B, in the present embodiment, the clamp mechanism 9 that has pressed and fixed the substrate in the second embodiment replaces the stage block 13 having the groove 14 with the stage block 13. It is pressed and fixed without using bolts or the like.

According to the present embodiment, the heater block 12
After the stage block 13 is mounted thereon, the clamp mechanism 9 moves forward toward the heater block 12, and while the inclined surface 11 presses the stage block 13, the heater block 12 is Attached to Thereby, the warpage generated when the stage block 13 is heated is suppressed by the clamp mechanism 9. Further, the clamp mechanism 9 is provided along each long side of the stage block 13, that is, along a direction in which the stage block 13 warps more when heated. Therefore, of the warpage generated when the stage block 13 is heated, a large warpage is reliably suppressed. Further, when the stage block 13 is to be extended by thermal expansion, the stage block 13 extends in the left-right direction in FIG. 4A along two opposing long sides and along the inclined surface 11 of the clamp mechanism 9. extend. Accordingly, since the stage block 13 that is to be extended by thermal expansion is not completely fixed to the heater block 12, deformation such as warpage or undulation of the stage block 13 is suppressed.

The stage block 13 is thermally expanded.
Is inclined, the inclined surface 11 of the clamp mechanism 9
In order to make the stage block 13 easily stretch along the ridge, the ridge to be clamped among the ridges of the stage block 13 may be chamfered to form a slope.

The case where the stage block 13 provided with the groove 14 is clamped has been described.
This embodiment can be applied to a stage block in which is not provided.

Further, the case where two clamp mechanisms 9 are provided for each of two opposing long sides of the stage block 13 has been described. The present invention is not limited to this, and one clamp mechanism 9 may be provided for each long side near the center in accordance with the size and shape of the stage block 13.
Three or more of each may be provided.

In each of the above embodiments, the quadrilateral substrate or the stage block has been described. The present invention is not limited to this, and the present invention can be applied to a case where the substrate or the stage block is oval or oval. In these cases, instead of providing the clamp mechanism 9 on the two opposing long sides of the substrate or the stage block, the clamp mechanism 9 is provided on the opposing outer periphery along the direction in which the warp increases when heated. May be provided.

The present invention is not limited to the above-described embodiments, and can be arbitrarily and appropriately changed and selected as needed without departing from the spirit of the present invention. Things.

[0043]

According to the present invention, when the substrate or the stage block is heated, the substrate or the stage block is warped in units of a region defined by the opening provided on the opposite surface of the main surface. In addition, warpage is reduced as compared with a case where no opening is provided, without using a material having a low coefficient of thermal expansion. In addition, a large warp of the warp generated when no opening is provided is reliably reduced. Also, when the substrate or the stage block is heated, the substrate or the stage block is fixed by the clamp mechanism,
Warpage of the substrate or the stage block is suppressed. Furthermore,
A large warp of the warp that occurs when the substrate or the stage block is not pressed is reliably suppressed by the clamp mechanism. Accordingly, the present invention provides an excellent practical use that can provide an electronic component and a manufacturing apparatus thereof that can ensure the reliability of electrical connection by reducing deformation such as warpage in an assembly process. It has a special effect.

[Brief description of the drawings]

FIGS. 1A and 1B show a state immediately after a substrate is placed on a stage and a chip-like element on a substrate when an electronic component according to a first embodiment of the present invention is assembled. It is a front view which shows the state immediately before mounting | wearing, respectively.

FIGS. 2A and 2B show a state where a substrate is mounted on a stage and fixed when an electronic component manufacturing apparatus according to a second embodiment of the present invention is used. Show,
It is a front view and a side view.

FIGS. 3A and 3B show states immediately after a stage block is placed on a heater block when an electronic component manufacturing apparatus according to a third embodiment of the present invention is used; It is a front view which shows the state immediately before a chip-shaped element is mounted on a board | substrate, respectively.

FIGS. 4A and 4B show a state where a stage block is placed on a heater block and fixed when an electronic component manufacturing apparatus according to a fourth embodiment of the present invention is used. It is a front view and a side view which respectively show.

FIGS. 5A and 5B show a state immediately after a substrate is placed on a stage and a state immediately before a chip-like element is mounted on a substrate when a conventional electronic component is assembled. It is a front view shown each.

[Explanation of symbols]

 Reference Signs List 1 stage 2 heater 3, 15 substrate 4 pad 5, 14 groove (opening) 6 chuck 7 chip-shaped element 8 solder bump 9 clamp mechanism 10 locking member 11 inclined surface 12 heater block 13 stage block W1, W2 warpage dimension

Claims (5)

[Claims] 1. An electronic component manufactured by mounting a chip-shaped element on a main surface of a substrate, comprising: an opening provided on a surface opposite to the main surface; An electronic component characterized by being provided so as to intersect in a direction in which a larger warpage occurs when heated. 2. An electronic component manufacturing apparatus for manufacturing an electronic component by mounting a chip-shaped element on a main surface of a substrate, comprising: a stage to which the substrate is fixed; and an opposing outer periphery of the substrate. A clamp mechanism is attached to each of the stages and presses and fixes the substrate against the stage, and a portion of the clamp mechanism that contacts the substrate is inclined with respect to a main surface of the substrate. An electronic component manufacturing apparatus characterized in that: 3. The electronic component manufacturing apparatus according to claim 2, wherein the opposing outer circumferences are along a direction in which a larger warpage occurs when the substrate is heated. Parts manufacturing equipment. 4. An electronic component manufacturing apparatus for manufacturing an electronic component by mounting a chip-shaped element on a substrate, comprising: a heater block for heating the substrate; a heater block mounted on the heater block; A stage block to which the substrate is fixed on a surface, and an opening is provided on a surface of the stage block opposite to the main surface so as to intersect in a direction in which greater warpage occurs when the stage block is heated. An electronic component manufacturing apparatus, comprising: 5. An electronic component manufacturing apparatus for manufacturing an electronic component by mounting a chip-shaped element on a substrate, comprising: a heater block for heating the substrate; a heater block mounted on the heater block; A stage block to which the substrate is fixed, a clamp mechanism attached to the heater block along opposing outer peripheries of the stage block, and pressing and fixing the stage block to the heater block And a portion of the clamp mechanism that contacts the stage block is inclined with respect to a main surface of the stage block.