JP2002368426A - Multilayer ceramic electronic component, method of manufacturing the same, and electronic device - Google Patents

Abstract

(57) [Summary] [PROBLEMS] To handle a soft ceramic green sheet until it is laminated while being backed by a carrier film, and after lamination, terminals are formed on both opposing end faces of the laminate. A structure can be obtained, so that another step for forming a conductor film to be a terminal after lamination can be eliminated. A first terminal (25) located on a first end face (24) side of a laminate (23) for connection to mounting components (31, 32, 33) is formed of a conductive film.
A second terminal 27 located on the second end face 26 side of the laminate 23 for connection to the second end face 26 is connected to an exposed end face of the terminal via-hole conductor 30 extending from the inside of the laminate 23 to the second end face 26. Give by.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer ceramic electronic component, a method of manufacturing the same, and an electronic device having such a multilayer ceramic electronic component. It is about.

[0002]

2. Description of the Related Art A multilayer ceramic electronic component of interest to the present invention is also called a multilayer ceramic substrate, and has a multilayer body having a multilayer structure composed of a plurality of ceramic layers.

[0003] Inside the laminate, circuit elements are provided so as to form a desired circuit with passive elements such as capacitors, inductors and / or resistors. In addition, an active element such as a semiconductor IC chip and a part of a passive element are mounted on the outside of the laminate as needed.

[0004] Further, the laminated ceramic electronic component compounded as described above is mounted on a suitable wiring board and used to constitute a desired electronic device.

[0005] Such a multilayer ceramic electronic component is
For example, in the field of mobile communication terminals, LCR
Used as a composite high-frequency component, or in the field of computers, as a component in which an active element such as a semiconductor IC chip is combined with a passive element such as a capacitor, an inductor or a resistor, or simply as a semiconductor IC package. are doing.

More specifically, the multilayer ceramic electronic component includes a PA module substrate, an RF diode switch,
It is widely used to form various electronic components such as filters, chip antennas, various package components, and composite devices.

FIG. 7 is a sectional view schematically showing a conventional multilayer ceramic electronic component.

The multilayer ceramic electronic component 1 shown in FIG.
Is provided with a laminate 3 composed of a plurality of laminated ceramic layers 2. The laminate 3 is provided with appropriate circuit elements.

As the above-mentioned circuit elements, some first terminals 5 located on the first end face 4 in the stacking direction of the stacked body 3 and the first terminals 5 opposite to the first end face 4 of the stacked body 3 Some second terminals 7 located on the end face 6 of the second, several internal conductor films 8 formed along a specific interface between the ceramic layers 2 and penetrate the specific ceramic layer 2 There are several via-hole conductors 9 formed as described above.

The above-mentioned first terminal 5 is used for connection to a mounting component (not shown), and is provided by a conductor film formed by printing and sintering a conductive paste. The mounted components include a case for shielding in addition to electronic components.

The second terminal 7 is used for connection to a wiring board (not shown), and is formed by printing and sintering a conductive paste as in the case of the first terminal 5. Provided by the conductor film.

FIG. 8 sequentially shows typical steps included in the method for manufacturing the multilayer ceramic electronic component 1 shown in FIG.

First, as shown in FIG. 8A, for example, a thickness of 50 to 100 made of polyethylene terephthalate is used.
On the carrier film 10 having a thickness of 10 μm, a ceramic green sheet 11 having a thickness of 10 to 150 μm to be a ceramic layer 2 is formed. Thereby, the composite sheet 12 in which the ceramic green sheet 11 is backed by the carrier film 10 is obtained.

In proceeding with the subsequent steps up to the lamination of the ceramic green sheets 11, the ceramic green sheets 11
It is handled in the state of.

The reason why the ceramic green sheet 11 is handled in a state in which it is lined with the carrier film 10 is that the ceramic green sheet 11 has extremely low strength, is soft and brittle, and it is extremely difficult to handle it alone. Because there is. By handling the ceramic green sheet 11 in the state of the composite sheet 12, the handling becomes easy, the alignment of the ceramic green sheet 11 in each step is facilitated, and when the conductive paste is dried later, ,
It is possible to prevent the ceramic green sheet 11 from undesirably thermally contracting or waving.

Although the shrinkage rate of the above-mentioned heat shrinkage is lower than that of the ceramic green sheet 11, it is inevitable that the carrier film 10 also shrinks more or less. In order to minimize such thermal shrinkage of the carrier film 10, as the material, in addition to the above-described polyethylene terephthalate, a material having a relatively high glass transition point or a film which has been heat-treated in advance is used. Is preferred.

The surface of the carrier film 10 which is in contact with the ceramic green sheet 11 is subjected to a release treatment such as Si coating, so that the carrier film 10 to be described later can be separated from the ceramic green sheet 11. Preferably, it is made easily achievable.

Next, as shown in FIG. 8B, several through holes 13 for forming the via hole conductors 9 are provided in the composite sheet 12. The through-hole 13 may be provided only in the ceramic green sheet 11 without penetrating the carrier film 10.

Next, as shown in FIG.
3 is filled with a conductive paste to form a conductive paste body 14 to be a via-hole conductor 9, and by applying the conductive paste on the main surface facing the outside of the ceramic green sheet 11, A conductive paste film 15 to be the first terminal 5 or the internal conductor film 8 is formed. The conductive paste body 14 and the conductive paste film 15 are then dried.

Next, as shown in FIG. 8 (4), the carrier film 10 is peeled off from the ceramic green sheets 11, and then a plurality of ceramic green sheets 11 are laminated and then pressed in the laminating direction. The raw state of the laminate 3, that is, the raw laminate 16 is produced.

The peeling of the carrier film 10 may be performed before the lamination of the ceramic green sheets 11 as described above. However, the peeling of the composite sheet 12 is performed so that the carrier film 10 is positioned on the upper side. The ceramic green sheets 11 may be stacked as they are, and the carrier film 10 may be peeled off each time the stacking of one ceramic green sheet 11 is completed.

Next, as shown in FIG. 8 (5), the conductive paste film 17 to be the second terminal 7 is
6 is formed by printing a conductive paste on one end face. This conductive paste film 17 is then dried.

The conductive paste film 17 formed after obtaining the raw laminate 16 is not for the second terminal 7 but for the first terminal 5 as described above. It may be something. In this case, the conductive paste film for the second terminal 7 is provided by the conductive paste film 15 formed in the step shown in FIG.

Next, the green laminate 16 in the state shown in FIG. 8 (5) is fired. Thus, a sintered laminate 3 for the multilayer ceramic electronic component 1 as shown in FIG. 7 is obtained. A mounting component (not shown) is mounted on the first end face 4 side of the laminate 3 as necessary, and the mounting component is electrically connected to a conductive film providing the first terminal 4. State. Thus, the multilayer ceramic electronic component 1 is completed.

The conductor films serving as the first and second terminals 5 and 7 are, for example, plated with nickel, if necessary, and further plated with gold, tin or solder. Is done.

Although not shown, the multilayer ceramic electronic component 1 is electrically connected to a wiring board disposed so as to face the second end face 6 via a conductor film providing a second terminal 7. It is implemented in the state that was done.

[0027]

According to the manufacturing method of the multilayer ceramic electronic component 1 as shown in FIG. 8, the ceramic green sheet 11 is formed in a state of a composite sheet 12 backed by a carrier film 10. Since it is handled up to the lamination process of 11, the conductive paste film cannot be formed on both surfaces thereof,
Therefore, after the raw laminate 16 is obtained, the conductive paste must be printed and dried again to form the conductive paste film 17 as shown in FIG. 8 (5). Therefore, first, such a separate printing and drying step causes a problem that productivity is reduced.

It is to be noted that a step of firing the raw laminate 16 in the state shown in FIG. 8D, printing the conductive paste film 17, drying, and firing again is employed. In this case, 2
Since the calcination process of the degree is necessary, more than the case described above,
The productivity is reduced, and the manufacturing cost is increased.

In the above-described green laminate 16, the pressure at the time of pressing, and in the fired laminate 3, the shrinkage of the raw laminate 16 due to shrinkage during firing.
Alternatively, the laminate 3 may be distorted, warped, or bent in the planar direction. In addition, the process shown in FIG. 8 generally corresponds to a plurality of raw laminates 16 or a plurality of laminates 3 which are to be taken out by dividing the plurality of laminated ceramic electronic components 1 later. It is performed to obtain a mother laminate in which the parts are assembled. Under such circumstances, the following problem may be caused.

First, for printing of the conductive paste film 17,
Usually, screen printing is applied, but due to the above-described distortion in the planar direction, it is possible to print in a highly accurate alignment state on all the raw laminates 16 or 3 in the mother laminate. Relatively difficult.

Although the mother laminate has a thickness of about 1 to 2 mm, it is difficult to print in a flat state due to the above-described warpage or bending, and as a result, the printed pattern is blurred. In particular, it is difficult to print a thin line having a line width / space of 100 μm / 100 μm or less.

In the printing of the conductive paste film 17 on the mother laminate in the raw state before firing, if a printing failure is caused due to the above-described cause, the conductive printing film 17 having the printing failure is removed. Cannot be repaired, and as a result, all raw laminates 16 in the mother laminate must be treated as defective, leading to increased costs.

Some multilayer ceramic electronic components have a cavity for accommodating other electronic components. In this case, the conductive paste film formed after the lamination is preferably a conductive paste film to be formed on the end face side opposite to the end face with the opening of the cavity, in terms of making printing easier. preferable. However, when printing for forming such a conductive paste film is performed on the raw laminate before firing, the pressure at the time of printing causes the raw laminate to be dented in the cavity portion. High printing accuracy cannot be desired.

Accordingly, an object of the present invention is to provide a multilayer ceramic electronic component and a method of manufacturing the same, and an electronic device using the multilayer ceramic electronic component, which can solve the above-described problems. That is.

[0035]

According to the present invention, there is provided a laminate comprising a plurality of laminated ceramic layers and including circuit elements, and a first laminate of the laminate for connection to a mounted component.
And a second terminal located on a second end face opposite to the first end face of the laminate for connection to a wiring board. The first terminal is provided by a conductor film formed on a first end face side, and the second terminal is provided to solve the above-mentioned technical problem. , Provided by an exposed end face of the terminal via-hole conductor extending from the inside of the laminate to the second end face.

In the multilayer ceramic electronic component according to the present invention, it is preferable that one second terminal is provided by a plurality of terminal via-hole conductors.

In the case described above, the plurality of terminal via-hole conductors providing one second terminal may include a part thereof that is not electrically connected to the circuit element.

In the multilayer ceramic electronic component according to the present invention, when the circuit element includes a wiring via-hole conductor for wiring inside the multilayer body, the terminal via-hole conductor is different from the wiring via-hole conductor. They may have different cross-sectional dimensions.

In the above case, the terminal via-hole conductor preferably has a larger cross-sectional dimension than the wiring via-hole conductor.

The present invention can be advantageously applied to a multilayer ceramic electronic component having a cavity in which an opening is located along the first end face.

In the present invention, the terminal via-hole conductor may have a portion exposed on the side surface of the laminate.

The present invention is also directed to a method for manufacturing a multilayer ceramic electronic component as described above.

The method for manufacturing a laminated ceramic electronic component according to the present invention comprises the steps of: forming a ceramic green sheet on a carrier film to obtain a composite sheet lined with the ceramic green sheet by the carrier film; A step of providing a through-hole so as to penetrate at least the ceramic green sheet in the sheet; a step of forming a conductive paste body by filling the through-hole with a conductive paste; and facing the outside of the ceramic green sheet in the composite sheet A step of forming a conductive paste film by applying a conductive paste on the main surface; a step of peeling the carrier film from the ceramic green sheets; and a raw state of the laminate by laminating a plurality of ceramic green sheets. Make things That step and, and a step of firing the raw laminate, at least a portion of the conductive paste films first
A conductive film for forming the terminal is formed, and at least a part of the conductive paste forms a terminal via conductor.

The step of manufacturing the raw laminate includes cutting the raw laminate so that a portion of the conductive paste forming the terminal via-hole conductor is exposed on the side surface of the raw laminate. May be included.

The present invention is further directed to an electronic device including the above-described multilayer ceramic electronic component.

The electronic device according to the present invention is provided such that the electronic device is mounted on the first end face side of the multilayer body while being electrically connected to the multilayer ceramic electronic component via a conductor film providing a first terminal. Wiring for mounting a multilayer ceramic electronic component in a state in which the component is arranged so as to face the second end surface of the multilayer body and is electrically connected via an end surface of a terminal via-hole conductor providing a second terminal. And a substrate.

[0047]

FIG. 1 is a sectional view schematically showing a multilayer ceramic electronic component 21 according to an embodiment of the present invention.

The multilayer ceramic electronic component 21 has a multilayer body 23 composed of a plurality of ceramic layers 22 stacked. In the laminate 23, various circuit elements are provided in relation to a specific one of the ceramic layers 22.

As the above-described circuit elements, some first terminals 25 located on the first end face 24 side in the stacking direction of the stacked body 23 and the first terminals 25 opposite to the first end face 24 of the stacked body 23 Some second terminals 27 located on the side of the second end face 26, some internal conductor films 28 formed along a specific interface between the ceramic layers 22, and penetrate the specific ceramic layer 22. There are several via hole conductors 29 and 30 formed as such.

The first terminal 25 is connected to the first end face 2
It is provided by a conductor film formed on the four sides. Components such as other electronic components 31 and 32 and a case 33 are mounted on the first end surface 24 side.
For example, it is connected to the first terminal 25 by solder, gold bump, or conductive adhesive.

More specifically, the terminal electrode 34 of the electronic component 31 is connected to the first terminal 25 by solder or a conductive adhesive 35. In the electronic component 32, the gold bump 36 provided thereon is connected to the first terminal 25. In addition, a bonding portion by the gold bump 36 is sealed with a resin 37. In mounting such electronic components,
Although not shown, wire bonding may be applied. The case 33 is made of, for example, metal, and the lower edge thereof is made of a first material such as solder or conductive adhesive.
Terminal 25.

The conductor film for providing the first terminal 25 is formed on a ceramic green sheet to be the ceramic layer 22 by
The conductive paste is applied by printing such as screen printing or the like, and is formed by baking the conductive paste in a firing step for obtaining the laminate 23.

If further refinement of the conductor film is necessary, a fine pattern is formed on another base material by etching of a metal foil, additive plating, or the like.
This may be transferred onto a ceramic green sheet to form a conductor film.

On the other hand, the second terminal 27 is provided with a via-hole conductor 30 extending from the inside of the laminate 23 to the second end face 26.
Given by the exposed end face. Via hole conductor 3
Even if the cross-sectional shape of 0 is circular or oval,
It may be square.

The second terminal 27 is used for electrical connection to a conductive land 39 formed on a wiring board 38 for mounting the multilayer ceramic electronic component 21. That is, the wiring board 38 is disposed so as to face the second end face 26, and the multilayer ceramic electronic component 21
Is a terminal via-hole conductor 30 for providing the second terminal 27.
With the exposed end face electrically connected to the conductive land 39 via the solder 40 and mechanically fixed,
It is mounted on a wiring board 38.

As described above, the multilayer ceramic electronic component 2
A desired electronic device 41 is configured by the electronic component 1, the electronic components 31 and 32, the mounted components such as the case 33, and the wiring board 38.

When the electronic device 41 is applied to, for example, a portable terminal device, a high drop impact strength is particularly required. In order to obtain high drop impact strength, the wiring board 3
It is necessary to increase the bonding area of the second terminal 27 to the conductive land 39 on the upper surface 8, and for that purpose, one of the methods is to increase the exposed area, that is, the cross-sectional dimension of the terminal via-hole conductor 30. As described above, an embodiment in which the cross-sectional dimension of the terminal via-hole conductor 30 is increased will be described later with reference to FIG. 2 as another embodiment. Problems may be encountered.

First, at the time of manufacturing the multilayer ceramic electronic component 21, a step of peeling the carrier film from the ceramic green sheet is performed. When the cross-sectional dimension of the via-hole conductor increases, the conductive paste for the via-hole conductor becomes The carrier paste is apt to be robbed along with the carrier film, and the conductive paste in the through-hole tends to be deficient.

In particular, the recent demand for a reduction in the height of electronic components promotes the reduction of the thickness of the ceramic layer 22, that is, the ceramic green sheet in the multilayer ceramic electronic component 21, and therefore the aspect ratio (= thickness) of the via-hole conductor 30. / Width) is reduced, and the tendency described above becomes more pronounced.

As described above, if the conductive paste for the via-hole conductor 30 is deficient, poor conduction of the electric path through the via-hole conductor 30 may occur, or undesired deformation may occur in the pressing step. This may cause cracks in the firing step.

Since the conductive paste and the ceramic have inherently different firing shrinkage rates, if the cross-sectional dimension of the via-hole conductor 30 is increased, cracks and delamination may occur due to the difference in firing shrinkage rates. It will be easier.

In order to increase the area of the second terminal 27 while avoiding such a problem, in this embodiment, as shown in FIG. 1, one second terminal 27 is connected to a plurality of terminals. The configuration provided by the via-hole conductor 30 is employed.

In this embodiment, of the four terminal via-hole conductors 3 providing the second terminal 27 on the left-hand side of FIG. 1, two right-side terminal via-hole conductors 30 (a) are provided.
Are not electrically connected to the circuit elements inside the laminated body 23, and should be so-called dummy via-hole conductors in connection with the internal circuit elements. Such a dummy via-hole conductor 30 (a) is
There is a case where it is not desired to electrically connect with the internal circuit element due to the circuit design inside the device, but in such a case, this can be advantageously employed.

When the second terminal 27 is provided by a set of the plurality of terminal via-hole conductors 30, when the connection with the conductive land 39 is achieved by the solder 40, the solder 40 is applied to each of the plurality of terminal via-hole conductors 13. Adhesion takes place in the form of a column having a relatively small bonding strength, and it has been confirmed that a desired bonding strength can be obtained by optimizing the size and number of such columnar solders 40. According to the structure of the second terminal 27,
An effect that the solder 40 can be prevented from being consumed more than necessary can be expected.

The multilayer ceramic electronic component 2 shown in FIG.
1 can be manufactured as follows. In addition,
8 of the conventional multilayer ceramic electronic component 1 are substantially the same as those shown in (1) to (4) when manufacturing the multilayer ceramic electronic component 21. The following description, as applied,
This is performed with reference to (1) to (4). The description given with reference to FIG. 8 can be applied to the method for manufacturing the multilayer ceramic electronic component 21 unless otherwise specified.

First, as shown in FIG. 8A, a ceramic green sheet 11 to be a ceramic layer 22 is formed on a carrier film 10. by this,
Ceramic green sheet 11 is used as carrier film 10
The composite sheet 12 backed by the above is obtained.

Next, as shown in FIG. 8 (2), through holes 13 are formed in the composite sheet 12 by applying a drill, a punch, a laser or the like. Note that the through holes 13 may be provided only in the ceramic green sheet 11.

Next, as shown in FIG.
3 is filled with a conductive paste and dried to form a conductive paste body 14 in each through-hole 13. In addition, a conductive paste film 15 is formed on a main surface of the composite sheet 12 facing the outside of the ceramic green sheet 11 by applying a conductive paste in a desired pattern and drying the paste. The conductive paste body 1
The formation of each of the conductive paste film 4 and the conductive paste film 15 may be performed first or simultaneously.

In the formation of the conductor film for providing the first terminal 25 in particular, instead of the formation of the conductive paste film 15 as described above, as described above, metal foil etching, additive plating, or the like is used. A pattern is formed on another base material, and this is
You may make it transfer on top.

Next, as shown in FIG. 8D, the carrier film 10 is peeled off from the ceramic green sheets 11 and a plurality of ceramic green sheets 11 are laminated to correspond to the raw state of the laminate 23. A raw laminate 16 is produced.

The raw laminate 16 shown in FIG.
Is to be the conventional laminated body 3 shown in FIG. 7 as described above, so that the layout of circuit elements is different from that of the laminated body 23 shown in FIG. Body 23
The conductive laminate for the terminal via-hole conductor 30 for providing the second terminal 27 is provided in the raw laminate to be formed.

Next, the green laminate is pressed in the laminating direction and then subjected to a firing step. As a result, FIG.
Is obtained. Thus, the laminate 23
After obtaining the first end face 24 of the laminate 23, if necessary.
On the side, a printed resistor is formed and an insulating layer is formed. Also, if necessary, for example, nickel plating is applied to the exposed end faces of the conductor film for providing the first terminal 25 and the terminal via-hole conductor 30 for providing the second terminal 27, and further, gold, Tin or solder plating is applied.

Next, as shown in FIG. 1, electronic components 31 and 32 are mounted on the first end face 24 side of the laminate 23,
And the case 33 is mounted. Note that the case 33 may be filled with resin, and the electronic components 31 and 32 may be sealed thereby.

FIG. 2 is a sectional view schematically showing a laminate 43 provided in a multilayer ceramic electronic component according to another embodiment of the present invention. In FIG. 2, elements corresponding to the elements shown in FIG. 1 are denoted by the same reference numerals, and redundant description will be omitted.

The laminate 43 for the multilayer ceramic electronic component shown in FIG. 2 is characterized by a terminal via-hole conductor 44 for providing the second terminal 27. That is, the terminal via-hole conductor 44 has a cross-sectional dimension different from that of another via-hole conductor, that is, the wiring via-hole conductor 29, and more specifically, has a larger cross-sectional dimension than the wiring via-hole conductor 29.

The reason why the cross-sectional dimensions of the terminal via-hole conductor 44 are increased is that the wiring board 38 shown in FIG.
This is for increasing the bonding area of the second terminal 27 to the upper conductive land 39. In the case where the problem of the deficiency of the conductive paste for the terminal via hole conductor 44 as described above and the problem of cracks and delamination due to the difference in firing shrinkage between the conductive paste and the ceramic are not so serious, The structure as shown in FIG. 2 can be advantageously employed.

FIG. 3 is a sectional view schematically showing a multilayer ceramic electronic component 51 according to still another embodiment of the present invention.

The multilayer ceramic electronic component 5 shown in FIG.
1 includes a laminated body 53 including a plurality of laminated ceramic layers 52. On the side of the first end face 54 in the stacking direction of the stacked body 53, a cavity 55 having an opening positioned along the first end face 54 is provided, and another electronic component 56 is accommodated in the cavity 55. Have been. In the laminate 53, the ceramic layer 5
Various circuit elements are provided in connection with the two particular ones.

As the circuit elements described above, first, the laminate 5
3 there is a first terminal located on the first end face 54 side.
In this embodiment, as the first terminals, the external conductor film 57 located on the first end face 54 of the multilayer body 53, the wire bonding pad 58 located on the step in the cavity 55, and the cavity There is a die bond pad 59 located on the bottom surface of 55.

Further, as a circuit element, the first
The second end face 60 located on the second end face 60 side opposite to the end face 54
Terminal 61. The second terminal 61 is provided by an exposed end face of the via-hole conductor 62 extending from the inside of the stacked body 53 to the second end face 60, as in the case of the embodiment shown in FIG.

One second terminal 61 is provided by the plurality of terminal via conductors 62. In addition, of the four terminal via-hole conductors 62 that provide the second terminal 61 on the left-hand side of FIG. 3, the two terminal-hole via-hole conductors 62 (a) on the left are electrically connected to circuit elements inside the stacked body 53. They are not connected and are configured with so-called dummy via-hole conductors.

The circuit element is a ceramic layer 5
Some internal conductor films 63 formed along a specific interface between the two, and some wiring via-hole conductors 64 formed so as to penetrate the specific ceramic layer 52
There is.

The above-described electronic component 56 is electrically connected to the die bonding pad 59 and is mechanically fixed.
It is in a state of being electrically connected via bonding wires 65.

In this embodiment, as in the case of the above-described embodiment, the ceramic layer 52 should be used in producing a green laminate for obtaining the laminate 53 provided in the multilayer ceramic electronic component 51. In the state of the composite sheet in which the ceramic green sheet is lined with a carrier film, a through-hole is provided in the ceramic green sheet, and a conductive paste is filled in the through-hole to form a conductive paste body to be the via-hole conductors 62 and 64. The external conductor film 57 serving as the first terminal, the wire bonding pad 58 and the die bonding pad 5 are formed and provided on one main surface of the ceramic green sheet, for example, with a conductive paste.
9 and the internal conductor film 63 may be formed, and it is not necessary to form a conductor film to be a terminal after laminating the ceramic green sheets or firing the green laminate.

In each of the embodiments shown in FIGS. 1 to 3 described above, the terminal via-hole conductor 30, 44 or 6
The second terminal 27 or 61 is provided only by the end face exposed from the second end face 26 or 60 of the second 2, so that the second terminal 27 or 61 is provided on the side surface of the laminate 23, 43 or 53. Not formed. However, the second
In the case where a solder fillet is required for design between the terminal and the conductive land of the wiring board to be connected, and the second terminal needs to be formed also on the side surface of the laminate, FIG. A structure as described with reference to FIG. 5 or FIG. 6 is employed.

FIGS. 4 to 6 show a plurality of raw laminates or portions corresponding to a plurality of laminates which are to be taken out by dividing the plurality of laminated ceramic electronic components 1 later. A part of the mother laminated body 71 is schematically shown in a cross-sectional view.

The mother laminate 71 shown in FIG. 4 is provided with a normal via-hole type terminal via-hole conductor 72. The mother laminate 71 shown in FIG. 5 is provided with a through-hole type terminal via-hole conductor 73. The mother laminated body 71 shown in FIG. 6 is of a through-hole type, and is a terminal via hole provided by a conductive paste provided only on the inner peripheral surface of the through hole 74 without filling the through hole 74. A conductor 75 is provided.

In order to take out the laminated body for each laminated ceramic electronic component from these mother laminated bodies 71, when the mother laminated body 71 is cut along a dividing line 76 as shown by a dashed line, the terminal Via hole conductors 72, 7
3 and 75 can also be exposed on the side surfaces of the laminate.

[0089]

As described above, according to the multilayer ceramic electronic component of the present invention, the first terminal located on the first end face side of the multilayer body for connection to the mounted component is the first terminal. 1
Is provided by a conductive film formed on the end face side of the laminate, and a second terminal located on the second end face side of the laminate for connection to the wiring board is connected from the inside of the laminate to the second end face. This is provided by the exposed end face of the terminal via-hole conductor extending up to.

Therefore, when producing a green laminate for obtaining a laminate provided in such a multilayer ceramic electronic component, a through-hole is provided in the ceramic green sheet constituting the green laminate, and a through hole is formed. Is filled with a conductive paste to form a conductive paste serving as a via-hole conductor, and a conductive film may be formed simply on one main surface of the ceramic green sheet. That is, after the green laminate is obtained or after the green laminate is fired, the terminals are formed on both the first and second end surfaces without performing the step of forming the conductor film to be the terminals. The obtained laminated body can be obtained.

Further, from the above, the ceramic green sheets can be handled in a state of being backed by a carrier film until the stage of lamination, and the above-described through-holes can be handled while being backed by the carrier film. It is possible to form a hole, apply a conductive paste for forming a conductive paste body, and form a conductive film. Therefore, the formation of the conductive paste body and the formation of the conductor film can be performed with high accuracy, and the miniaturization of the multilayer ceramic electronic component and the high density of the wiring can be advantageously achieved. .

In particular, printing for forming a conductive film on a mother laminate, which is to be taken out by dividing a plurality of laminated ceramic electronic components later, or on a raw laminated body having a cavity formed therein It is relatively difficult to ensure high reliability and high accuracy in printing for forming a conductive film, but according to the present invention, such a mother laminate or a raw laminate in which a cavity is formed is used. Since there is no need to perform printing, there is no possibility of encountering a defect that may occur in such a printing process, so that the yield can be improved and the cost can be reduced.

Further, in the present invention, as described above, the second terminal for connection to the wiring board is provided by the terminal via-hole conductor, and such a via-hole conductor cuts into the laminate. Since it is in a state, the strength against peeling or detachment from the laminate is much higher than that of a conductor film simply formed on the surface of the laminate.
Therefore, the mounting strength of the multilayer ceramic electronic component to a wiring board on which the multilayer ceramic electronic component is mounted can be increased, and the impact strength of an electronic device including such a multilayer ceramic electronic component can be increased.

In addition, since the step of printing and baking a conductive paste for forming the terminals after firing the green laminate is unnecessary, the lamination of the components contained in the conductive paste is performed in such a baking step. The problem that undesirable diffusion into the body occurs can be avoided, and the laminated body does not cause poor characteristics.

In the present invention, one second terminal is
If the terminal via-hole conductor that provides the second terminal is provided with a plurality of terminal via-hole conductors or the cross-sectional dimension of the terminal via-hole conductor that provides the second terminal is increased, the bonding area to the conductive land on the wiring board can be increased. And the bonding strength with the wiring board can be increased.

In particular, when the one second terminal is provided by a plurality of terminal via-hole conductors, instead of increasing the cross-sectional dimensions of the terminal via-hole conductor, the conductive paste for the via-hole conductor becomes a carrier film. It is possible to avoid problems such as cracking or delamination easily occurring due to deprivation during peeling or a difference in firing shrinkage between the conductive paste and the ceramic.

Further, in the present invention, when the raw laminate is manufactured, the raw laminate is formed such that a part of the conductive paste forming the terminal via-hole conductor is exposed to the side surface of the raw laminate. By cutting, a part of the terminal via-hole conductor can be exposed on the side surface of the laminate. When the terminal via-hole conductor is exposed on the side surface of the multilayer body, a solder fillet can be formed between the second terminal and the conductive land of the wiring board connected to the second terminal. The reliability of the connection can be further improved.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view schematically showing a multilayer ceramic electronic component 21 according to an embodiment of the present invention, together with a wiring board 38 on which the multilayer ceramic electronic component 21 is mounted.

FIG. 2 is a sectional view schematically showing a laminate 43 provided in a multilayer ceramic electronic component according to another embodiment of the present invention.

FIG. 3 is a sectional view schematically showing a multilayer ceramic electronic component 51 according to still another embodiment of the present invention.

FIG. 4 is a cross-sectional view schematically illustrating a part of a mother laminated body 71 for obtaining a plurality of laminated ceramic electronic components, for explaining still another embodiment of the present invention.

FIG. 5 is a diagram corresponding to FIG. 4 for explaining still another embodiment of the present invention.

FIG. 6 is a diagram corresponding to FIG. 4 for explaining still another embodiment of the present invention.

FIG. 7 is a cross-sectional view schematically showing a conventional multilayer ceramic electronic component 1 which is interesting for the present invention.

8 is a cross-sectional view schematically illustrating typical steps included in the method for manufacturing the multilayer ceramic electronic component 1 illustrated in FIG. 7 in order.

[Explanation of symbols]

Reference Signs List 10 carrier film 11 ceramic green sheet 12 composite sheet 13, 74 through hole 14 conductive paste body 15 conductive paste film 21, 51 laminated ceramic electronic component 22, 52 ceramic layer 23, 43, 53 laminated body 24, 54 first End surface 25 First terminal 26, 60 Second end surface 27, 61 Second terminal 28, 63 Internal conductor film 29, 64 Via hole conductor for wiring 30, 44, 62, 72, 73, 75 Via hole conductor for terminal 31 , 32, 56 Electronic component 33 Case 38 Wiring board 39 Conductive land 40 Solder 41 Electronic device 57 External conductor film 58 Pad for wire bond 59 Pad for die bond 71 Mother laminated body 76 Dividing line

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H05K 1/11 H05K 3/40 D 3/40 K H01L 23/12 BNF term (Reference) 5E317 AA01 AA22 AA24 BB04 BB11 CC22 CC25 CD21 CD34 GG16 5E346 AA12 AA15 AA38 AA43 AA60 BB01 BB16 CC17 CC31 DD02 DD34 EE24 EE29 FF18 FF35 GG04 GG06 GG08 HH32 HH33

Claims (10)

[Claims] 1. A laminate comprising a plurality of laminated ceramic layers and including a circuit element, and a first terminal located on a first end face side of the laminate for connection to a mounted component. And a second terminal located on a second end face side opposite to the first end face of the laminate for connection to a wiring board, wherein: The first terminal is provided by a conductor film formed on the first end face side, and the second terminal is provided by exposing a terminal via-hole conductor extending from the inside of the laminate to the second end face. The multilayer ceramic electronic component is provided by the end face. 2. The multilayer ceramic electronic component according to claim 1, wherein one second terminal is provided by a plurality of via-hole conductors for the terminal. 3. The multilayer type according to claim 2, wherein the plurality of terminal via-hole conductors that provide one second terminal include those that are not electrically connected to the circuit element in a part thereof. Ceramic electronic components. 4. The circuit element includes a wiring via-hole conductor for wiring inside the laminate, and the terminal via-hole conductor has a cross-sectional dimension different from that of the wiring via-hole conductor. 4. The multilayer ceramic electronic component according to any one of 1 to 3. 5. The multilayer ceramic electronic component according to claim 4, wherein said terminal via-hole conductor has a larger cross-sectional dimension than said wiring via-hole conductor. 6. The multilayer ceramic electronic component according to claim 1, further comprising a cavity having an opening located along the first end face. 7. The multilayer ceramic electronic component according to claim 1, wherein the terminal via-hole conductor has a portion exposed on a side surface of the multilayer body. 8. The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein a step of obtaining a composite sheet in which a ceramic green sheet is lined with a carrier film; A step of providing a through hole so as to penetrate the ceramic green sheet; a step of forming a conductive paste body by filling a conductive paste in the through hole; and a step outside the ceramic green sheet in the composite sheet. A step of forming a conductive paste film by applying a conductive paste on the main surface facing; a step of peeling the carrier film from the ceramic green sheet; and a step of stacking a plurality of the ceramic green sheets. Manufacture of raw body And baking the raw laminate. At least a portion of the conductive paste film forms the conductor film that provides the first terminal, and at least a portion of the conductive paste body A method for manufacturing a multilayer ceramic electronic component, wherein the terminal via-hole conductor is formed. 9. The step of fabricating the raw laminate includes forming the raw laminate such that a part of the conductive paste forming the terminal via-hole conductor is exposed to a side surface of the raw laminate. The method for manufacturing a multilayer ceramic electronic component according to claim 8, comprising a step of cutting the body. 10. The multilayer ceramic electronic component according to claim 1, wherein said multilayer ceramic electronic component is electrically connected to said multilayer ceramic electronic component via said conductor film providing said first terminal. 1 and electrically connected to a mounting component mounted on an end face side of the stack via an end face of the terminal via-hole conductor which is arranged to face the second end face of the laminate and provides the second terminal. And a wiring board on which the multilayer ceramic electronic component is mounted in the separated state.