JP4804992B2 - Component mounting equipment - Google Patents

Description

  The present invention relates to a component mounting apparatus, and more particularly to a component mounting apparatus that quickly mounts an appropriate component on a board of a variety of types and a minimum lot.

2. Description of the Related Art Conventionally, there is a component mounting apparatus that produces a board unit by mounting electronic components (hereinafter simply referred to as components) on a circuit board (hereinafter simply referred to as a substrate) carried into the apparatus main body. For example, components such as IC (integrated circuit) that are directly related to the original calculation function and components for digital trimming that are also called chip components for setting the characteristics of these devices and circuits to a certain level. There is. (For example, refer to Patent Document 1.)
JP 05-198983 A

  In any case, the conventional component mounting apparatus has been mainly aimed at the production of a relatively large amount of board units, but in recent years, the demand for various types and small lots has increased. In particular, in recent years, in response to customers' demands, it is also necessary to produce board units of various types and extremely small lots that can handle subtle differences in shipping destinations and specifications.

For example, although the circuit configuration is almost the same, there is an increasing demand for a board unit in which only input or output power (volt, ampere, or watt) differs depending on the application.
If the type (also referred to as model) of the board unit is different, the type of component mounted on the board is also different, so a component mounting program must be created for each board model.

  Further, in order to efficiently perform the component mounting process, it is also necessary to perform setup change such as rearrangement of a component supply device such as a tape feeder. And it is necessary to produce substrate units as quickly as possible.

  However, when producing a large variety of very small lot board units, the time for creating the component mounting program and the time for changing the setup are larger than the production time, and the production efficiency is drastically reduced.

  In view of the above-described conventional situation, an object of the present invention is to provide a component mounting apparatus that quickly mounts an appropriate component on a substrate of a variety of types and a minimum lot of models.

The component mounting apparatus according to the present invention, in the board production line, according to the model of the board unit when the board is completed as a board unit, the type indicating the model and the part specification information of the part to be mounted on the board are justified.・ Product type and part specification information acquisition means acquired in-time, board data acquisition means for acquiring board data according to the type acquired by the product type and part specification information acquisition means, and when completed as a board unit Based on the component specification information, the substrate data, and the feeder arrangement table data, storage means for storing feeder arrangement table data that can handle a plurality of boards having different specifications of the board unit, the component specification information on the board Creating means for creating a part mounting program for mounting a part in a just-in-time manner, and And a component placing means for performing a mounting process of the components to the substrate on the basis of the component mounting program created by means, said program generating means, while performing the component mounting process in the board production line, said When it is determined that the board data related to the board on which the component mounting process is executed next by the board data acquisition means is different from the board data related to the board on which the component mounting process is currently executed in the board production line, the board data Based on the board data, the part specification information, and the feeder arrangement table data, the board data acquired by the acquisition unit is set as new board data, and the part specification information is added to the board that performs the component mounting process next. A new part mounting program for mounting parts is created .

  In this component mounting apparatus, for example, when the board data acquired by the board data acquisition means is the same as the board data related to the board on which the component mounting processing is currently being executed, the component mounting means is executed until immediately before. The component mounting process is executed on the board based on the component mounting program. In addition, for example, when the board data acquired by the board data acquisition unit is different from the board data related to the board on which the component mounting process has been executed immediately before, the program creation unit is acquired by the board data acquisition unit. A configuration is made so as to create a component mounting program for mounting the component of the component specification information on the substrate based on the substrate data, the component specification information, and the feeder arrangement table data as the new substrate data. Is done.

  The component specification information may be described by, for example, a two-dimensional code assigned to the surface of the board. For example, a component specification information database searched using an identifier assigned to the surface of the board as a key For example, it may be acquired from an external host device together with the board identification information.

For example, when the component mounting device is the most upstream device in the line, the program creation means is configured to output the created component mounting program to the component mounting device of the component mounting device downstream of the line.

For example, when the component mounting device is the second or subsequent device from the most upstream line, the component mounting means is based on the component mounting program output from the program creation unit of the most upstream component mounting device. The component mounting process is executed.

  According to the present invention, it is possible to provide a component mounting apparatus that quickly mounts appropriate components on substrates of various types and types of extremely small lots.

Embodiments of the present invention will be described below with reference to the drawings.
FIG. 1 is a diagram showing an example of a board unit production line on which a component mounting apparatus according to an embodiment of the present invention is arranged. In the example shown in the figure, four substrate unit production lines are shown. Originally, a substrate supply device is arranged at the start point of the line, but this is not shown in the figure.

  In the figure, in the first production line shown in the upper right of the figure, two component mounting apparatuses 1 are connected to the production line from the beginning of the line (on the downstream side of the line continuous with the substrate supply device not shown). Are connected in series, and a reflow furnace 2 is disposed at the end.

  As described above, the component mounting device 1 is a device that automatically mounts a component taken out from the component supply device arranged in the own device onto a board that is automatically carried into the own device from the substrate supply device. is there. The reflow furnace 2 is a device for fixing a component mounted (mounted) on a substrate on the substrate.

  In the next second production line, one dispenser 3 is first arranged, and then one component mounting apparatus 1 is arranged. The dispenser 3 is a device that attaches or applies paste-like solder or the like to a position where components on a substrate are mounted. The dispenser 3 may be disposed on the upstream side of the production line of the component mounting apparatus 1 or may be disposed on the downstream side depending on the type of component mounted on the board unit to be manufactured.

  Since the two component mounting apparatuses 1 of the first production line are models with a dispensing function added inside, the dispenser 3 is not arranged on either the upstream side or the downstream side.

  In the third production line, one component mounting apparatus 1 with a dispensing function and a reflow furnace 2 are arranged. In the fourth production line, one component mounting device 1, one dispenser 3, and one reflow furnace 2 are arranged in this order.

  Each device of each of these production lines is connected to the host management device 5 via the signal line 4, and the operation state is managed by the host management device 5. In addition, the host management device 5 can perform processing such as setup and teaching before starting production on each device.

FIG. 2 (a) is an external perspective view of the component mounting apparatus according to the embodiment of the present invention, and FIG. 2 (b) is a perspective view schematically showing the internal configuration by removing the upper and lower protective covers.
As shown in FIG. 2A, the component mounting apparatus 1 includes an alarm lamp 6 for notifying the operating state at the left end portion on the ceiling cover, and a liquid crystal display and a touch-type input at the front portion of the upper protective cover 7. An operation input display device 8 is provided which is composed of a device and can input various instructions by external operation.

  On the lower base 9, a pair of fixed and movable parallel substrate guide rails 11 are disposed in the center so as to extend horizontally in the X-axis direction (from diagonally lower right to diagonally upper left). Has been. A loop-shaped conveyance belt (conveyor belt) that is not visible in the drawing is disposed so as to be in contact with the lower portion of the board guide rails 11.

The conveyor belt is driven by a belt drive motor (not shown), travels in the X-axis direction, carries the substrate from the upstream side of the line, and carries it out to the downstream side of the line.
As shown in FIG. 2 (b), component supply stages 12 are arranged on the front and rear sides of the base 9, respectively. Although not particularly illustrated, a large number of tape-type component supply devices are arranged on the component supply stage 12.

  Above the base 9, it is divided into left and right (X-axis direction), and both ends are fixed to two Y-axis fixing legs 13, and two Y-axis rails straddle the two board guide rails 11. 14 (14a, 14b) are disposed, and the X-axis rail 15 is disposed so as to be slidably supported in the Y-axis direction by being passed between the two Y-axis rails 14.

  One work head 16 is supported on the X-axis rail 15 so as to be slidable along the X-axis rail 15 in the X-axis direction. The working head 16 is provided with a mounting head which is hidden in the drawing but is attached to the tip of the working head 16 in a detachable manner.

  The work head 16 is disposed inside the base 9 of the apparatus main body 1 via a plurality of signal cords (not shown) that are protected and accommodated in a belt-like chain body 18 that is bendable and hollow inside. It is connected to the central control unit on the electrical component motherboard.

  The work head 16 is supplied with electric power and a control signal from the central control unit through these signal codes, and transmits image data indicating information on a substrate positioning mark and a component mounting position to the central control unit. Also, the 2D code or serial number information given to the board is read and transmitted to the central control unit.

  Although not shown in FIG. 2 (b), a plurality of types for recognizing images of components adsorbed by the adsorption nozzle 17 of the mounting head are provided between the board guide rail 11 and the component supply stage 12. There are arranged a part change camera and a nozzle changer that accommodates a plurality of types of suction nozzles that are replaceably mounted on the mounting head. In addition to the above-described central control unit, the base 9 is provided with a substrate positioning device, a substrate fixing mechanism for fixing the substrate between the two substrate guide rails 11 and the like, although not particularly illustrated. ing.

  In this component mounting apparatus 1, a Y-axis ball screw unit is provided in the two Y-axis rails 14a and 14b, although not particularly shown. Accordingly, the work head 16 shown in FIG. 2 (b) can be a large substrate or a small substrate depending on the type of component supply device such as a tape-type component supply device arranged on the component supply stage 12. The Y-axis ball screw unit moves in the Y-axis direction in the Y-axis rails 14a and 14b, respectively, and the fixing position thereof is changed according to the type of the component supply device and the size of the board.

As described above, the component mounting apparatus 1 of this example is a uniaxial, inexpensive and small component mounting apparatus capable of performing component mounting processing in accordance with the type of component supply apparatus and the size of various substrates. .
FIG. 3 is a block diagram showing a system configuration of the component mounting apparatus 1 configured as described above. As shown in the figure, the system of the component mounting apparatus 1 includes a CPU 20 and a control unit including an i / o (input / output) control unit 22 and an image processing unit 23 connected to the CPU 20 via a bus 21. . A memory 24 is connected to the CPU 20. The memory 24 includes a program area and a data area (not shown).

  In addition, the i / o control unit 22 has an illumination device 26 for illuminating the component mounting position of the substrate 25 and a component 27 sucked by a suction nozzle 17 (see FIG. 2B) of the mounting head from below. An illumination device 28 for illuminating is connected.

  Further, an X-axis motor 29, a Y-axis motor 31, a Z-axis motor 32, and a θ-axis motor 33 are connected to the i / o control unit 22 via respective amplifiers (AMP). The X-axis motor 29 drives the work head 16 in the X direction via the X-axis rail 15, and the Y-axis motor 31 drives the X-axis rail, that is, the work head 16 in the Y direction via the Y-axis rail 14. The Z-axis motor 32 drives the mounting head of the work head 16 up and down, and the θ-axis motor 33 rotates the mounting head, that is, the suction nozzle 17 by 360 degrees.

  Each of the amplifiers is provided with an encoder (not shown). The encoders of the motors (X-axis motor 29, Y-axis motor 31, Z-axis motor 32, θ-axis motor 33) are provided by these encoders. An encoder value corresponding to the rotation is input to the CPU 20 via the i / o control unit 22.

As a result, the CPU 20 can recognize the front and rear, left and right, up and down current positions of the mounting head, and the rotation angle.
Further, a vacuum unit 34 is connected to the i / o control unit 22. The vacuum unit 34 is pneumatically connected to the suction nozzle 17 of the mounting head via a vacuum tube 35.

  The vacuum tube 35 is provided with a pneumatic sensor 36. The vacuum unit 34 causes the suction nozzle 17 to suck the component 27 by vacuum, or releases suction by vacuum release, air blow, and vacuum break (vacuum break).

  At this time, air pressure data in the vacuum tube 35 is output from the pneumatic sensor 36 to the CPU 20 as an electrical signal via the i / o control unit 22. Thereby, the CPU 20 knows the state of the air pressure in the vacuum tube 35, can recognize whether or not the suction nozzle 17 is ready to suck the component 27, and the sucked component 27 is normally Whether it is adsorbed can be recognized.

  Further, a positioning device, a belt drive motor, a substrate sensor, an abnormality display lamp, and the like are connected to the i / o control unit 22 via respective drivers. As described above, the positioning device is disposed below the board guide rail 11 in the base 9 of the component mounting apparatus 1 and positions the board 25 guided into the apparatus.

  The belt drive motor circulates and drives the conveyor belt that is integrally disposed on the guide rail 11. The substrate sensor detects the loading and unloading of the substrate 25. The abnormality display lamp 6 (see FIG. 2 (a)) is lit or blinked when an abnormality such as an operation abnormality of the component mounting apparatus 1 or a foreign object entering the work area, and notifies the on-site worker of the occurrence of the abnormality. Also, a warning notification is given that the parts replenishment timing is approaching by blinking or lighting.

  The i / o control unit 22 is connected with a communication i / o interface 37, a recording device 38, and the operation input display device 8 shown in FIG. The communication i / o interface 37 is connected to these processing devices in a wired or wireless manner when, for example, teaching processing or the like is performed by another processing device such as a personal computer, so that communication with the CPU 20 is possible. To do.

  The recording device 38 can be mounted with various recording media such as hard disk, MO, FD, CD-ROM / RW, flash memory device, etc., and the component mounting process, component master creation process, and component mounting of the component mounting apparatus 1 A database such as a program for teaching processing, parts table data, NC data from CAD, board data to be described later, and feeder arrangement table data of the own apparatus is held.

  The above program is loaded into the program area of the memory 24 by the CPU 20 and used for control processing of each unit. The data is also read into the data area of the memory 24, subjected to a predetermined process, and the processed and updated data is stored and stored in a predetermined data area of a predetermined recording medium.

  The image processing unit 23 includes a substrate mounting position recognition camera 39 that images the component mounting position of the substrate 25 that is disposed on the work head 16 and is illuminated by the lighting device 26, and a component that is integrated with the lighting device 28. A recognition camera 41 is connected.

  In the operation input display device 8 described above, when the component mounting operation is performed, the image of the component mounting position of the substrate 25 captured by the image processing unit 23 with the substrate mounting position recognition camera 39 on the work head 16 side, or the same image processing. The unit 23 displays on the display screen the image of the component 27 captured by the component recognition camera 41 on the main device side.

  Further, the operation input display device 8 displays a teaching screen at the time of executing the teaching process, displays a part master creation screen at the time of creating the part master, and is necessary for processing in the on-board data master at the time of setup creation or change. Display setup information.

  In addition, the operation input display device 8 displays board data, feeder arrangement table, JIT (just in time, in this case, “when it is finally” or “when it is just right” during component mounting processing on a multi-product / mini-lot board. Display the production instruction data optimized and automatically created.

  FIG. 4A is a diagram showing an external configuration of the line management apparatus 5 shown in FIG. 1, and FIG. 4B is a block diagram showing the system configuration. As shown in FIG. 2A, the line management device 5 is composed of a personal computer, for example, and a display 43 and a keyboard 44 are connected to the main body 42 via a connection cable (not shown).

  A pointing device (mouse) 45 is connected to the keyboard 44. In addition, a floppy disk (registered trademark), a CD-ROM (compact disc read only memory), a flash memory, and other various storage media for loading a program or storing created data are attached to and detached from the main body 42. Can be installed freely.

  As shown in FIG. 2B, the system of the line management apparatus 5 includes a CPU (central processing unit) 46, a ROM (read only memory) 48, a RAM (Random) connected to the CPU 46 via a bus 47. (Access Memory) 49, HD (hard disk) 51, LANi / o (local area network input / output) control unit 52, display 43 and keyboard 44 shown in FIG. The printer 53 is used.

The ROM 48 stores a control program for the line management device 5. The CPU 46 controls the operation of each of the above parts by the control program.
The RAM 49 temporarily stores data input from the keyboard 44, intermediate data being calculated by the CPU 46, and the like.

  The HD 51 stores various data, files, tables, etc. input from the keyboard 44 or read from an external recording medium, and these data, files, tables, etc. are transferred to the RAM 49 under the control of the CPU 46. To do.

  The LANi / o control unit 52 is connected to the component mounting apparatus 1 of the board production line, the reflow furnace 3 and the like via the LAN by the signal line 4 shown in FIG. The LANi / o control unit 52 controls input / output of each of the connected units under the control of the CPU 46.

  The display 43 is composed of a CRT (cathode ray tube) display device, and displays input data or a calculation result performed by the CPU 46. The display 43 may be an LCD (liquid crystal display) display device.

  The keyboard 44 includes a plurality of operation keys for inputting numbers, characters, and various commands, and outputs status signals of these operation keys to the CPU 46. The mouse 45 outputs a two-dimensional movement speed signal and designates an arbitrary position on the screen displayed on the display 43.

  The CPU 46 starts control of each unit and each device connected to the LAN based on a start instruction input from the keyboard 44 while controlling each unit described above. Similarly, a parts replenishment notice list is generated based on the input from the keyboard 44 and the parts table of the parts mounting processing program read from a prescribed recording medium, and the notice list is stored in a prescribed storage area of the HD 51.

  In response to a request from the component mounting apparatus 1, the CPU 46 reads necessary data from a database such as component specification information, board data, and feeder arrangement table stored in the HD 51, and stores the read data on the LAN. It transmits to the component mounting apparatus 1 via the signal line 4 shown in FIG.

  FIG. 5 is a diagram for explaining the JIT optimization implemented as the first embodiment and the production instruction data automatically created as a result, in the board unit production line having the above configuration. In this example, the case where there are two component mounting apparatuses 1 in one line shown in the first production line of FIG. 1 will be described.

  Note that the JIT optimization and the method for automatically creating manufacturing instruction data as a result are basically the same even when there is only one component mounting apparatus 1 per line. In addition, when there are two component mounting apparatuses 1 in one line, it is determined that the same type of board units will be produced in the first machine (the component mounting apparatus 1 on the upstream side of the line) and the second machine (the component mounting apparatus 1 on the downstream side of the line). I don't mean.

  That is, there is a case where the board unit A is produced by the first machine and the board unit B is produced by the second machine. In such a case, the board unit A produced in the first machine passes through the second machine and is discharged downstream. Further, the board of the board unit B suitable for production in the second machine (the board before component mounting) passes through the first machine and is carried into the second machine.

  A substrate 25 shown in FIG. 5 (hereinafter, the number is indicated as 25a) indicates a substrate that flows in the substrate unit manufacturing line shown in FIG. 1 in this example. A 2D code 54 (hereinafter, the number is indicated as 54a) is printed on these substrates 25a. In general, the amount of information that a 2D code has is large and is not compared with a dozen characters of a barcode. If the maximum information amount according to the standard is alphanumeric, 4296 characters can be recorded.

  In this example, since the amount of information up to that point is not required, the 2D code 54a is shown larger than the size of the substrate 25a in FIG. 5, but the total size of the 2D code 54a is actually 7.625 mm □. The size is such that 311 alphanumeric characters of information can be recorded.

  In the 2D code 54a, board information and component specification information 55 are recorded. A serial number is recorded in the board information. In addition, as shown in FIG. 5, the component specification information 55 records a circuit symbol on the board and standard data of components mounted on the circuit in association with each other.

  In this example, not all the circuits printed on the board 25a are used, that is, the components are not mounted on all the circuits. Only the components described in the component specification information 55 are mounted on a circuit corresponding to the components.

  In addition, the recording devices 38 of the two component mounting apparatuses 1 each store a database of board data 56 and feeder arrangement table data 57 in advance, and the CPU 20 stores the data from the databases as needed. 24 to be used for JIT optimization.

  The board data 56 shown in FIG. 5 indicates board data corresponding to the specification of the board 25a indicated by the board information of the 2D code 54a. Note that even if the specifications of the substrate 25a are the same, the types of the substrates need not be the same.

That is, even if the specifications of the board 25a are the same, the types of components to be mounted differ depending on the model, so that the component specification information 55 of the 2D code 54a also differs.
The board data 56 is described in association with X coordinate, Y coordinate, θ coordinate, circuit symbol, and component standard data. That is, in the board data 56, all the circuit symbols on the board describe the X coordinate, Y coordinate, and θ coordinate of the component mounted on the circuit.

  However, fixed part standards that do not change even if the model changes are described with actual names, but each data column corresponding to a part standard that changes depending on the model has an authentic X coordinate, Y coordinate, θ coordinate, circuit While the symbols are described, a pseudo part standard is described in the part standard column.

  This is because, when teaching the substrate 25a using the substrate data 56, teaching must be performed for all circuit symbols, so that the true X coordinate, Y coordinate, θ coordinate, and circuit symbol are described. On the other hand, because it is a general-purpose board in the sense that the board 5a exists, that is, a board that covers multiple types of models within a certain range, there is a possibility that parts with different standards may be mounted on the same circuit other than fixed parts This is because a specific actual part name (part standard) cannot be described.

In the example shown in the board data 56 of FIG. 5, the part standards 500001 and 800001 shown in the lower two lines are standard names of fixed parts, and the part standards in the upper three lines are pseudo names.
Further, the recording devices 38 of the two component mounting apparatuses 1 have the same number of substrates as described above, corresponding to the number of types of substrate units that can be produced by the two component mounting apparatuses 1. Data 56 is stored in advance.

  And the feeder arrangement | positioning table data 57 shown in FIG. 5 is arrangement | positioning of the feeder (tape feeder, ie, tape-type component supply apparatus) for every two component mounting apparatuses 1 and every those stage (component supply stage 12). Show.

  The feeder arrangement table data 57 does not depend on each board corresponding to one to one for each type of board unlike the feeder arrangement table of a normal component mounting apparatus, and can be produced on this one line. It is prepared in advance so as to cope with a plurality of substrates having different specifications.

  Usually, 50 to 70 feeders can be arranged on one stage. When the front (F) stage and the rear (R) stage are combined, a maximum of 70 × 140 feeders can be arranged. That is, 140 types of components can be mounted.

  In addition, if the feeders with completely different component tapes are placed on the two component mounting devices 2, the options for combinations of components to be mounted on the substrate will be expanded, so it will be possible to deal with various types of substrates with different specifications. It is.

  The CPU 20 of the component mounting apparatus 1 reads the board data 56 from the database based on the board information read from the 2D code 54a, and further reads the feeder arrangement table data 57. The board data 56, the feeder arrangement table data 57, and Based on the component specification information 55, JIT optimization is performed, and as a result, production instruction data (an NC program (component mounting program) 58) shown in FIG. 5 is automatically created.

FIG. 6 is a flowchart of the JIT optimization and the process for automatically producing manufacturing instruction data as a result in the present example.
In FIG. 6, when the board loading is started, the CPU 20 reads the 2D code in which the component specification information and the board information are described (S1).

In this process, first, the work head 16 is moved to the position of the 2D code 54 a of the substrate 25 a that is carried into the apparatus main body and positioned between the two substrate guide rails 11.
Then, the 2D code 54 a is illuminated by the lighting device 26, and the 2D code 54 a is read by the substrate mounting position recognition camera 39. In the read 2D code 54a, component specification information 55 as shown in FIG. 5 is described in addition to the board information indicating the board model (board name).

Based on the board information read from the 2D code 54a, the CPU 20 reads board data 56 corresponding to the board information from the database of the recording device 38.
Next, the CPU 20 determines whether or not the board data 56 read from the database of the recording device 38 based on the board information matches the board data 56 stored in a predetermined storage area of the memory 24 ( S2).

  And if both data are the same (S2 is the same), in that case, next, whether this apparatus (component mounting apparatus 1) is No. 1 apparatus (apparatus arranged in the most upstream line). Is determined (S4).

This process is a determination process for avoiding unnecessary processes because the JIT optimization of the present invention does not need to be performed by other than the first machine.
If it is determined in the process S2 that the two data are different (S2 is different), the correct substrate data 56 is read (S3), and the process proceeds to the process S4.

  If the two data are different in the determination of the process S2, the model of the board 25a that has just read the 2D code 54a is different from the model of the board 25a that has just finished the component mounting process.

  Therefore, in the process of reading the correct substrate data 56, the substrate data 56 is read from the database of the recording device 38 based on the substrate information read from the 2D code 54a, and the read substrate data 56 is set as correct data. This is a process of storing in a predetermined storage area of the memory 24.

  As a result, the board data 56 previously stored in the memory 24 is replaced with the board data 56 corresponding to the board information indicated in the 2D code 54a of the newly read board 25a.

  If it is determined in step S4 that this apparatus (part mounting apparatus 1) is No. 1 (Yes in S4), it is subsequently determined whether or not manufacturing instruction data of this specification exists (S5). . This process is a process for determining whether or not the manufacturing instruction data 58 shown in FIG. 5 corresponding to the acquired part specification information 55 has already been created and stored in the memory 24. The same JIT optimization is performed. This is a determination process that is performed to avoid double waste.

  If the manufacturing instruction data 58 corresponding to the acquired component specification information 55 is stored in the memory 24 (Yes in S5), it is further determined whether or not the feeder arrangement is correct (S6).

  This process is because even if the manufacturing instruction data 58 corresponding to the acquired part specification information 55 already exists, the feeder arrangement may be different from the currently selected feeder arrangement list. This is a process for rechecking the arrangement.

  When the re-checked feeder arrangement is correct (Yes in S6), mounting is performed according to the manufacturing instruction data 58 confirmed to be correct (S8). That is, a component mounting process is performed on the board 25a.

  It should be noted that when the manufacturing instruction data 58 corresponding to the acquired component specification information 55 is not found in the memory 24 in the determination in the process S5 (No in S5), or in the determination in S6, the re-checked feeder arrangement is correct. If not, JIT optimization is performed (S7), and the process proceeds to the process S8.

  In this JIT optimization, the CPU 20 describes, in the component specification information 55, the pseudo part name standard corresponding to the circuit symbol of the board data 56 based on the circuit symbol shown in the component specification information 55 read from the 2D code 54a. Rewrite to the standard of parts.

  And, the device, stage, and so on corresponding to the total of five parts standards (there are not limited to five, but many parts) including the rewritten parts standards and the typical parts standards originally provided. Three pieces of data of the feeder are read from the feeder arrangement table data 57, and these data are combined to optimize the data.

  In addition, the most upstream component mounting apparatus 1 indicates which production line the device belongs to, how many component mounting apparatuses are arranged in the production line, and the stage of each component mounting apparatus, The feeder arrangement table data 57 recognizes how the feeders are arranged.

  Therefore, a mounting program (manufacturing instruction data 58) is created so that mounting processing is completed in a downstream apparatus for a board whose component mounting cannot be completed by the own apparatus. Thereby, the manufacturing instruction data 58 shown in FIG. 5 is automatically created.

  In the example of the manufacturing instruction data 58 shown in FIG. 5, as can be seen from the description in the apparatus column, the apparatus numbers 1 to 5 are described, and the board is composed of five component mounting apparatuses from the first machine to the fifth machine. The component mounting process 25a is completed.

As described above, the manufacturing instruction data 58 shown in FIG. 5 is automatically created by performing the mounting process, that is, the data optimization in the JIT.
Although not specifically shown, the component mounting apparatus is not limited to the one-axis type (only one working head) as shown in FIG. 2 (b), but also a two-axis type or a four-axis type. is there.

  In that case, the classification of the first machine, the second machine,... Described above is the JIT optimization process performed by the first machine by the work head that mounts the components on the uppermost board of the uppermost component mounting apparatus. Will be in charge. Further, in this case, each axis needs to be set so as to be processed by an individual mounting program. The same applies to the case of Example 2 or 3 described below.

  FIG. 7 is a diagram for explaining JIT optimization implemented as the second embodiment in the board unit production line according to the embodiment of the present invention and production instruction data automatically created as a result.

  The data configuration of the component specification information 55, the board data 56, the feeder arrangement table data 57, and the manufacturing instruction data 58 shown in FIG. 7 includes the part specification information 55, the board data 56, the feeder arrangement table data 57, and the like shown in FIG. And the data structure of the manufacturing instruction data 58 is the same.

  That is, in the second embodiment, since the acquisition method of the board information and the component specification information 55 is only different from that in the first embodiment, various data used for JIT optimization and the result of the optimization The manufacturing instruction data generated as will be described using the same data as in FIG.

  In this example, only the serial number is described in the 2D code 54 (hereinafter, the number is indicated as 54b) given to the substrate 25 (hereinafter, the number is indicated as 25b). The CPU 20 of the component mounting apparatus 1 inquires the host management apparatus 5 about the serial number read from the 2D code 54b.

In the HD 51 of the host management apparatus 5, list data in which each serial number, board information, and component specification information 55 are associated with each other is stored in advance as a database.
Associating the serial number with the board information described above, if the production plan is planned such as a board unit of model A, b board units of model B,... If the number is before the number a, the model A board unit is being produced, and the production of the model B starts immediately after the serial number exceeds the number a. The production of the model B starts immediately after the serial number exceeds the number a + b.

  The CPU 46 of the host management device 5 that has received an inquiry from the CPU 20 of the component mounting apparatus 1 reads the board information and the component specification information 55 corresponding to the serial number for which the inquiry has been received from the database, and uses the board information and the component specification information 55 as the board information. The CPU 20 of the component mounting apparatus 1 is notified.

FIG. 8 is a flowchart of the JIT optimization performed as the second embodiment and a process for automatically producing manufacturing instruction data as a result.
In FIG. 8, when the board loading is started, the CPU 20 reads the serial number from the 2D code of the board 25b (S101).

Thus, in this example, what the working head 16 reads from the 2D code 54b of the substrate 25b positioned in the apparatus main body is the serial number.
As described above, based on the serial number read from the 2D code 54b, the CPU 20 of the component mounting apparatus 1 inquires the host management apparatus 5 about necessary information corresponding to the serial number.

  The CPU 46 of the host management device 5 reads the board information and the component specification information 55 corresponding to the received serial number from the database, and notifies the CPU 20 of the component mounting device 1 of the board information and the component specification information 55. Thereby, the board information and the component specification information 55 are acquired (S102).

Hereinafter, the processing of steps S103 to S109 shown in FIG. 8 is the same as the processing of steps S2 to S8 shown in FIG.
As described above, if the board information and the component specification information 55 are not provided in the 2D code of the board, but are provided in the host management device 5, the 2D code of the board only needs to record the serial number. The display of the 2D code can be made simpler.

  FIG. 9 is a diagram for explaining the JIT optimization implemented as the third embodiment in the board unit production line according to the embodiment of the present invention and the production instruction data automatically created as a result.

  The data structure of the part specification information 55, board data 56, feeder arrangement table data 57, and manufacturing instruction data 58 shown in FIG. 9 is the same as the part specification information 55, board data 56, and feeder arrangement shown in FIG. The data structure of the table data 57 and the manufacturing instruction data 58 is the same.

  That is, in the third embodiment, since the acquisition method of the board information and the component specification information 55 is only different from the case of the first or second embodiment, various data used for JIT optimization and its appropriateness The manufacturing instruction data generated as a result of the conversion will be described using the same data as in FIG.

  In this example, the 2D code 54 (hereinafter, the number is indicated as 54c) assigned to the substrate 25 (hereinafter, the number is indicated as 25c) is the same as that of the first or second embodiment. Are not given from the beginning, but are given by the component mounting apparatus 1.

FIG. 10 is a flowchart of JIT optimization implemented as the third embodiment and processing for automatically producing manufacturing instruction data as a result.
In FIG. 10, when the board loading is started, the CPU 20 of the component mounting apparatus 1 inquires the host management apparatus 5 about necessary information for the loaded board 25c.

  The host management device 5 reads the count value of the counter built in the CPU 46, recognizes how far the production of the substrate unit is currently progressing, and sets the value obtained by incrementing the count value of the counter by “1” to the next serial number. And

  Then, the board information linked to the serial number and the component specification information 55 are read from the database, and the serial number, the board information, and the component specification information 55 are notified to the CPU 20 of the component mounting apparatus 1. Thereby, the serial number, the board information, and the component specification information 55 are acquired (S201).

  The component mounting apparatus 1 includes a simple printing device on the work head 16, although not particularly illustrated. The component mounting apparatus 1 converts the serial number in the three pieces of information acquired from the host management apparatus 5 into a 2D code 54c, and prints the 2D code 54c at a predetermined position on the substrate 25c by the printing apparatus (S202). ).

Hereinafter, the processes of steps S203 to S209 shown in FIG. 10 are the same as the processes of steps S2 to S8 shown in FIG.
In this way, a 2D code having only a serial number may be printed on the board by the component mounting apparatus. Also, instead of printing, labels with back glue printed with serial numbers are continuously arranged on tape-like release paper, and the labels are in ascending order, but compared with the serial numbers obtained from the host management device 5 However, you may make it stick on the predetermined position of a board | substrate.

  As described above, according to the component mounting apparatus of the present invention, general-purpose board data and feeder arrangement table data are provided, and a component mounting program corresponding to the component specification information is obtained simply by acquiring a serial number and component specification information. Since it is automatically created and component mounting processing is executed on the board with the serial number, it is possible to provide a component mounting apparatus that quickly mounts appropriate components even on boards of various types and extremely small lots. It becomes possible.

It is a figure which shows the example of the board | substrate unit manufacturing line by which the component mounting apparatus in embodiment of this invention is arrange | positioned. (a) is an external perspective view of a component mounting apparatus according to an embodiment of the present invention, and (b) is a perspective view schematically showing an internal configuration by removing upper and lower protective covers. It is a block diagram which shows the system configuration | structure of a component mounting apparatus. (a) is a diagram showing an external configuration of a line management device, and (b) is a block diagram showing its system configuration. It is a figure explaining the JIT optimization implemented as 1st Embodiment in the board | substrate unit manufacturing line in embodiment of this invention, and the manufacturing instruction data automatically produced as a result. It is a flowchart of the process by which JIT optimization implemented as 1st Embodiment and manufacturing instruction data are automatically produced as a result. It is a figure explaining the JIT optimization implemented as 2nd Embodiment in the board | substrate unit manufacturing line in embodiment of this invention, and the manufacturing instruction data automatically produced as a result. It is a flowchart of the process by which JIT optimization implemented as 2nd Embodiment and manufacturing instruction data are produced automatically as a result. It is a figure explaining the JIT optimization implemented as 3rd Embodiment in the board | substrate unit manufacturing line in embodiment of this invention, and the manufacturing instruction data automatically produced as a result. It is a flowchart of the process by which JIT optimization implemented as 3rd Embodiment and manufacturing instruction data are produced automatically as a result.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 2 Reflow furnace 3 Dispenser 4 Signal line 5 Host management apparatus 6 Alarm lamp 7 Upper protective cover 8 Operation input display device 9 Base 11 Substrate guide rail 12 Parts supply stage 13 Y axis fixed leg 14 (14a, 14b ) Y-axis rail 15 X-axis rail 16 Work head 17 Suction nozzle 18 Chain body 20 CPU
21 Bus 22 i / o control unit 23 Image processing unit 24 Memory 25 (25a, 25b, 25c) Board 26 Illumination device 27 Parts 28 Illumination device 29 X-axis motor 31 Y-axis motor 32 Z-axis motor 33 θ-axis motor 34 Vacuum unit 35 Vacuum tube 36 Air pressure sensor 37 Communication i / o interface 38 Recording device 39 Board mounting position recognition camera 41 Component recognition camera 42 Main body 43 Display 44 Keyboard 45 Pointing device (mouse)
46 CPU (central processing unit)
47 bus 48 ROM (read only memory)
49 RAM (Random Access Memory)
51 HD (hard disk)
52 LANi / o (local area network input / output) control unit 53 Printer 54a, 54b 2D code 55 Component specification information 56 Substrate data 57 Feeder arrangement table data 58 Manufacturing instruction data (NC program (component mounting program))

Claims (7)

In the board production line, depending on the model of the board unit when the board is completed as a board unit, the type that shows the model and the type that acquires the component specification information of the parts to be mounted on the board in just in time And component specification information acquisition means;
Board data obtaining means for obtaining board data according to the kind obtained by the kind and part specification information obtaining means;
Storage means for storing feeder arrangement table data capable of dealing with a plurality of substrates having different substrate unit specifications when completed as a substrate unit;
Based on the component specification information, the substrate data, and the feeder arrangement table data, a program creation means for creating a component mounting program for mounting the component of the component specification information on the substrate in just-in-time,
Component mounting means for performing a mounting process of the component on the board based on the component mounting program created by the program creation means;
With
In the board production line, the program creation means is configured to receive the board data related to a board on which a component mounting process is executed next after being acquired by the board data acquisition means while the component mounting means is executing a component mounting process on the board. When it is determined that the board data is different from the board data related to the board on which the component mounting processing is currently being executed in the board production line, the board data and the component specification are used as the new board data. Based on the information and the feeder arrangement table data, create a new component mounting program for mounting the component of the component specification information on the board that performs the component mounting process next,
A component mounting device characterized by that. When the board data acquired by the board data acquisition means is the same as the board data related to the board that is currently executing the component mounting process,
The component mounting means executes the mounting process of the component on the board based on the component mounting program being executed until immediately before.
The component mounting apparatus according to claim 1.   2. The component mounting apparatus according to claim 1, wherein the product type and component specification information are described by a two-dimensional code given to a surface of the substrate.   2. The component mounting apparatus according to claim 1, wherein the product type and component specification information is acquired from a component specification information database searched using an identifier assigned to the surface of the board as a key.   2. The component mounting apparatus according to claim 1, wherein the product type and component specification information is acquired from an external host device together with board identification information.   2. The program creating means, when the component mounting device is the most upstream device, outputs the created component mounting program to the component mounting device of the component mounting device downstream of the line. Parts mounting equipment. When the component mounting device is the second or subsequent device from the most upstream line, the component mounting means is arranged on the board based on the component mounting program output from the program creation unit of the upstream component mounting device. The component mounting apparatus according to claim 6, wherein a component mounting process is executed.