JP7607230B2 - Coating device and coating method - Google Patents

Description

The present invention relates to an apparatus and method for applying a coating liquid to a workpiece such as a semiconductor wafer.

The most commonly used method for coating a resin film such as a resist on a semiconductor substrate is the spin coating method, in which a coating liquid is dropped onto the rotating substrate while the substrate is rotating, forming a uniform thin film by centrifugal force. In the spin coating method, the dropped coating liquid splashes onto the inner wall of the coating device and can dry, causing the resin components to adhere to the inner wall. The adhered resin components must be removed periodically.

As a method for cleaning a coating device, Patent Document 1 proposes providing a chemical drip nozzle on the side of a cup surrounding a rotating wafer chuck to wash away waste processing liquid in a semiconductor manufacturing device in which resist is dripped onto a wafer placed on a wafer chuck to form a thin resist film by centrifugal force.

Japanese Unexamined Patent Publication No. 62-73670

Makes it easier to clean the coating equipment and improves maintainability.

One aspect of the present invention relates to a coating method that includes a holding step of holding a workpiece on a holding surface of a rotating stage, a cleaning liquid supplying step of supplying a cleaning liquid to an inner wall of a container arranged to surround the rotating stage, and a coating step of supplying a coating liquid to the workpiece held on the rotating stage from a first main surface side of the workpiece that does not face the holding surface and rotating the rotating stage after the cleaning liquid supplying step, in which the cleaning liquid is supplied to the first main surface side of the workpiece held on the rotating stage while rotating the rotating stage, and the cleaning liquid is scattered from the workpiece onto the inner wall by centrifugal force.

Another aspect of the present invention is a container having a rotating stage that holds a workpiece on a holding surface, a bottom, and a sidewall that stands up from the bottom and surrounds the rotating stage, the height of the sidewall being higher than the height of the rotating stage, a rotating unit that rotates the rotating stage about a rotation axis that intersects with the holding surface, a coating liquid supply unit that supplies a coating liquid to the workpiece from a side of a first main surface of the workpiece that does not face the holding surface, a cleaning liquid supply unit that supplies a cleaning liquid to the workpiece from the side of the first main surface of the workpiece, and a control unit that controls the rotating unit, the coating liquid supply unit, and the cleaning liquid supply unit, wherein the coating liquid supply unit has a coating nozzle, and the cleaning liquid supply unit , a cleaning nozzle, the coating liquid supply unit and the cleaning liquid supply unit are controlled by the control unit so that, after the cleaning nozzle discharges the cleaning liquid while the coating nozzle is in a predetermined retracted position and the cleaning nozzle is in a first position, the coating nozzle discharges the coating liquid while the cleaning nozzle is in a predetermined retracted position and the coating nozzle is in a second position different from the first position, and the rotating unit is controlled by the control unit so that the rotating stage is rotated while the cleaning nozzle is discharging the cleaning liquid at the first position, and the cleaning liquid supplied to the workpiece is scattered against the side wall by centrifugal force.

The present invention makes it easier to clean the coating device, improving maintainability.

1 is a diagram showing a schematic view of a main part of a coating device according to an embodiment of the present invention; 1 is a block diagram showing a configuration of a coating apparatus according to an embodiment of the present invention. 2 is a flowchart illustrating a coating method according to one embodiment of the present invention. 11 is a cross-sectional view illustrating a schematic internal state of the coating device in a cleaning liquid supplying step. FIG. FIG. 4 is a cross-sectional view that illustrates a schematic internal state of the coating device in a coating liquid supplying step.

The coating method according to this embodiment includes a holding step of holding the object to be treated on the holding surface of the rotating stage, a cleaning liquid supplying step of supplying cleaning liquid to the inner wall of a container arranged to surround the rotating stage, and a coating step of supplying coating liquid to the object to be treated held on the rotating stage from the side of the first main surface that does not face the holding surface of the object to be treated after the cleaning liquid supplying step, and rotating the rotating stage. The object to be treated with the coating liquid attached thereto rotates due to the coating step. In the coating step, the rotation of the rotating stage may be started before the coating liquid is supplied, or may be performed after the coating liquid is supplied. In other words, the coating liquid may be supplied to the rotating object to be treated, or the object to which the coating liquid has been supplied may be rotated.

In the cleaning liquid supplying process, while rotating the rotating stage, the cleaning liquid is supplied to the first main surface side of the workpiece held on the rotating stage, and the cleaning liquid is scattered from the workpiece onto the inner wall by centrifugal force. This makes it possible to remove the resin components that have adhered to the inner wall in the previous process. In addition, the inner wall of the container can be covered or wetted with the cleaning liquid before applying the coating liquid to the workpiece. As a result, the coating liquid is prevented from adhering to and solidifying on the inner wall.

In the cleaning liquid supplying process, the cleaning liquid may be supplied to the outer edge of the first main surface side of the workpiece. The centrifugal force generated by the rotation of the rotating stage causes the cleaning liquid to splash toward the inner wall of the container. By supplying the cleaning liquid to the outer edge, which is close to the inner wall of the container, the cleaning liquid can be efficiently splashed onto the inner wall of the container. In addition, the cleaning liquid is prevented from adhering to the object to be coated (e.g., a substrate) located in the center of the workpiece.

Preferably, the workpiece has a substrate, a holding sheet for holding the substrate, and a frame for holding the outer edge of the holding sheet. In the cleaning liquid supplying step, if the cleaning liquid is dripped from, for example, a nozzle so that the cleaning liquid is supplied to the frame portion of the workpiece, the cleaning liquid is difficult to supply to the substrate, but the cleaning liquid is scattered toward the outside of the frame due to centrifugal force and onto the inner wall of the container. On the other hand, in the coating step, the coating liquid is supplied to the substrate provided at the center of the workpiece by dripping the coating liquid from, for example, a nozzle (separate from the nozzle for the cleaning liquid). Thus, it is possible to achieve both the application of the coating liquid to the substrate and the supply of the cleaning liquid to the inner wall of the container in a simple manner.

The position of the holding surface that holds the workpiece on the rotating stage may be higher in the cleaning liquid supplying process than in the coating process. The height of the holding surface refers to the position in the normal direction of the holding surface. The further the holding surface is from the bottom surface of the container (the direction from the bottom surface toward the workpiece), the higher the height of the holding surface is. By raising the height of the holding surface in the cleaning liquid supplying process, the scattered cleaning liquid adheres to a higher position on the inner wall of the container. The attached cleaning liquid hangs down along the inner wall due to gravity and can cover the inner wall. This allows the cleaning liquid to be scattered in the area of the inner wall of the container where the coating liquid is expected to adhere, and the inner wall of the device can be covered or wetted with the cleaning liquid. As a result, the effect of removing the attached resin components and the effect of covering the inner wall of the container with the cleaning liquid can be improved.

In the cleaning liquid supplying step, the cleaning liquid may be supplied to the workpiece at a plurality of positions on the rotating stage. Here, the plurality of positions means relative positions in the coating device that are not dependent on the rotation of the rotating stage. The cleaning liquid supplied to the outer edge of the workpiece may scatter in a direction away from the rotating shaft due to centrifugal force and adhere to the inner wall of the container, but is unlikely to scatter on the inner wall located on the opposite side of the rotating shaft from the dripping position. As a result, depending on the position of the inner wall of the container, there may be areas where the cleaning liquid is less scattered and areas where it is more scattered. However, by supplying the cleaning liquid at a plurality of positions, the cleaning liquid can be uniformly scattered regardless of the position of the inner wall of the container, and the inner wall of the container can be covered with the cleaning liquid.
The coating device may be provided with a mechanism for rotating the inner wall of the container. By supplying the cleaning liquid to the rotating workpiece while rotating the inner wall of the container, the same effect as supplying the cleaning liquid to multiple positions on the rotation stage can be obtained.

The coating liquid contains, for example, a resin component. In that case, the cleaning liquid preferably contains a solvent that dissolves the resin component. As a result, the resin component adhering to the inner wall of the container dissolves in the solvent, reducing its viscosity, and falls down the inner wall to the bottom of the container. Therefore, the resin component adhering to the inner wall of the container is recovered from the bottom.

Prior to the coating process, a cleaning liquid (second cleaning liquid) may be retained in the space below the rotating stage of the container. Most of the coating liquid supplied in the coating process is used to form a film on the substrate, but some of it may scatter toward the inner wall of the container in the outer circumferential direction and adhere to the inner wall of the container without being used to form a film. However, the scattered coating liquid is covered with the cleaning liquid supplied in the cleaning liquid supply process, which prevents it from adhering to the inner wall, so it moves to the bottom of the container and mixes with the cleaning liquid retained at the bottom. Therefore, by discharging the cleaning liquid (second cleaning liquid) retained at the bottom, it is possible to easily remove the excess coating liquid that was not used to form a film on the substrate.

The second cleaning liquid retained at the bottom has the property of dispersing or dissolving the coating liquid (resin component). The second cleaning liquid may contain the same components as the cleaning liquid (first cleaning liquid) used in the cleaning liquid supplying process. The second cleaning liquid may be the cleaning liquid supplied in the cleaning liquid supplying process that has migrated to the bottom of the container and retained there. To facilitate removal of the cleaning liquid, for example, a drain hole for discharging the liquid may be provided at the bottom of the container.

The coating device and coating method according to this embodiment are described in detail below with reference to the drawings.

Figure 1 is a cross-sectional view showing a schematic configuration of a coating apparatus according to one embodiment of the present invention. Figure 2 is a block diagram of a coating apparatus according to one embodiment of the present invention. This coating apparatus is used, for example, to form a resin film that serves as the basis for a mask on a substrate formed of a semiconductor material or the like.

The coating device 100 includes a rotating stage 20 that holds the workpiece 10 on a holding surface, a container 21 that surrounds the rotating stage 20, a rotating unit 22 that rotates the rotating stage 20, a coating liquid supplying unit 23 that supplies a coating liquid to the workpiece 10 from the side of the first main surface S1 of the workpiece 10 that does not face the holding surface, and a cleaning liquid supplying unit 24 that supplies a cleaning liquid from the first main surface S1 side of the workpiece 10.

In the example of FIG. 1, the workpiece 10 includes a substrate 11, a holding sheet 12 that holds the substrate 11, and a frame 13 that holds the outer edge of the holding sheet 12. The workpiece 10 is held by the holding sheet 12 on the holding surface S0 of the rotating stage 20. The workpiece 10 has a main surface S1 (main surfaces of the substrate 11 and holding sheet 12) that does not face the holding surface S0, and a main surface S2 (contact surface with the holding surface S0 of the holding sheet 12) that faces the holding surface. The holding sheet 12 is, for example, a dicing tape.

The holding sheet 12 may be treated to be water-repellent. The water-repellent treatment suppresses adhesion of hydrophilic coating liquid and cleaning liquid to the holding sheet, and the process of cleaning the holding sheet after forming the coating film can be omitted. Known materials and processing methods can be used for the water-repellent treatment method.

The object 10 to be processed is held on the rotating stage 20. The rotating stage 20 can rotate around a rotation axis in a direction intersecting the holding surface S0 (preferably, the direction normal to the holding surface S0). The rotating stage 20 may have a fixing part for fixing the frame 13 of the object 10 to be processed. The fixing part is, for example, a clamp.

The rotating stage 20 may hold the workpiece 10 by an adsorption mechanism. The adsorption mechanism may be, for example, vacuum adsorption or electrostatic adsorption. Vacuum adsorption is preferable because it simplifies the configuration of the device. In this case, the rotating stage may be formed with suction holes connected to a suction pump, or the surface of the rotating stage may be formed of a porous material connected to a suction pump. The number and spacing of the suction holes may be set appropriately depending on the size of the rotating stage and the workpiece, etc.

The rotating stage 20 can also move in the direction normal to the holding surface S0, thereby changing the position (height) in the normal direction of the holding surface S0. The position (height) in the normal direction of the holding surface S0 can be changed by the lifting unit 27.

The container 21 has a bottom 21a and a side wall 21b that stands up from the bottom 21a, and is open at the top. The side wall 21b surrounds the rotating stage 20, and the height of the side wall 21b is higher than the height of the rotating stage 20 (when a lifting section 27 is provided, the maximum height at which the distance to the bottom 21a is maximum). The rotating stage 20 and the object to be treated 10 are stored in the container 21. The bottom side of the container 21 can be filled with a cleaning liquid. In this case, a drain hole 30 for draining the cleaning liquid is provided in the bottom 21a of the container or in the side wall 21b below the rotating stage.

The rotating unit 22 rotates the rotating stage 20 around a rotation axis in a direction intersecting the holding surface S0 (preferably, the direction normal to the holding surface S0). The rotating unit 22 may be composed of, for example, a rotating body connected to the rotating stage and a motor that rotates the rotating body.

The coating liquid supply unit 23 supplies the coating liquid from the side of the first main surface S1 toward the substrate 11 of the workpiece 10. The coating liquid supply unit includes, for example, a coating nozzle 23a, a tank in which the coating liquid is stored, and a pump that adjusts the pressure of the raw material liquid to be discharged. An opening is formed at the tip of the coating nozzle 23a, and the coating liquid is supplied from the tank to the coating nozzle 23a and then dripped from this opening at a predetermined amount and pressure. The shape of the opening of the coating nozzle 23a is not particularly limited, and may be, for example, circular or slit-shaped. There may be multiple coating nozzles 23a.

The coating liquid contains, for example, a resist material as a resin component. Examples of the resist material include thermosetting resins containing polyimide, photoresists containing phenolic resins, and water-soluble resists containing acrylic resins.

The cleaning liquid supply unit 24 supplies the cleaning liquid to the workpiece 10 from the first main surface S1 side. Preferably, the cleaning liquid supply unit 24 supplies the cleaning liquid from the first main surface S1 side toward the frame 13 provided on the outer edge of the workpiece 10. The cleaning liquid supply unit includes, for example, a cleaning nozzle 24a, a tank in which the cleaning liquid is stored, and a pump that adjusts the pressure of the cleaning liquid to be discharged. An opening is formed at the tip of the cleaning nozzle 24a. After the cleaning liquid is supplied from the tank to the cleaning nozzle 24a, it is dripped from this opening at a predetermined amount and pressure. The shape of the opening of the cleaning nozzle 24a is not particularly limited, and may be, for example, circular or slit-shaped. There may be multiple cleaning nozzles 24a.

The cleaning solution contains a solvent that dissolves at least a portion of the resin component contained in the coating solution. The solvent may be selected appropriately depending on the resin component. Examples of solvents that dissolve the resist material include propylene glycol monomethyl ether acetate (PGMEA), methyl ethyl ketone (MEK), isopropyl alcohol (IPA), ethanol, acetone, water, etc. The cleaning solution contains one of these alone or two or more of them.

The coating device 100 may also include a nozzle movement unit 25 that moves the coating nozzle 23a in the coating liquid supply unit 23 and the cleaning nozzle 24a in the cleaning liquid supply unit 24. The nozzle movement unit 25 moves the coating nozzle 23a at least in a plane parallel to the holding surface S0. The nozzle movement unit 25 also moves the cleaning nozzle 24a at least in a plane parallel to the holding surface S0. In addition, the nozzle movement unit may move the coating nozzle and/or the cleaning nozzle in at least one of the vertical direction and the circumferential direction of the substrate. The movement mechanism included in the nozzle movement unit is not particularly limited, and a known mechanism may be used.

The coating device 100 also includes a control unit 26. The control unit 26 includes, for example, a computer, and controls the coating liquid supply unit 23, the cleaning liquid supply unit 24, the rotation unit 22, the lifting unit 27, and the nozzle movement unit 25. The control unit 26 individually controls the position of the coating nozzle, the amount of coating liquid supplied, the position of the cleaning nozzle, the amount of cleaning liquid supplied, the rotation speed of the rotating stage 20, the position (height) of the rotating stage 20, and the like.

More specifically, the control unit 26 controls the coating liquid supply unit 23 and the cleaning liquid supply unit 24 so that, after the cleaning nozzle 24a is in a predetermined retracted position and the coating nozzle 23a is in a first position, the coating nozzle 23a discharges the coating liquid when the cleaning nozzle 24a is in a predetermined retracted position and the coating nozzle 23a is in a second position. The first position is, for example, a position farther from the rotation axis of the rotating stage 20 than the second position (i.e., on the outer periphery side). More specifically, the first position may be a position corresponding to the frame 13 of the workpiece 10, and the second position may be a position corresponding to the substrate 11 of the workpiece 10. The retracted position is a position sufficiently distant from the workpiece 10. The movement of the cleaning nozzle 24a from the retracted position to the first position and from the first position to the retracted position, and the movement of the application nozzle 23a from the retracted position to the second position and from the second position to the retracted position can be performed by the nozzle movement unit 25 under the control of the control unit 26.

The control unit 26 also controls the rotating unit 22 to rotate the rotating stage 20 while the cleaning nozzle 24a is discharging the cleaning liquid at the first position. The rotation speed of the rotating unit 22 is controlled so that the cleaning liquid supplied to the workpiece 10 is scattered against the side wall 21b of the container by centrifugal force.

Further, the control unit 26 controls the lifting unit 27 so that while the cleaning nozzle 24a is discharging the cleaning liquid at the first position, the distance to the bottom 21a of the holding surface S0 is maintained at a first distance _X1 , and while the coating nozzle 23a is discharging the coating liquid at the second position, the distance to the bottom 21a of the holding surface S0 is maintained at a second distance _X2 that is closer than the first distance _X1 ( _X2 < _X1 ).

The coating method according to one embodiment of the present invention can be carried out, for example, as follows, using the coating device 100 described above. Figure 3 shows a flowchart illustrating the coating method according to one embodiment of the present invention.

Prior to applying the coating liquid, the drain valve 29 provided on the container 21 is closed, and the cleaning liquid is allowed to remain in the bottom 21a of the container 21 (ST01). The cleaning liquid is, for example, water, and has the property of dispersing or dissolving the coating liquid. As a result, at least the space below the rotating stage 20 in the container 21 is filled with the cleaning liquid.

Next, the object to be processed 10 is placed on the rotating stage 20 (ST02).

Next, as shown in FIG. 4, the height of the rotating stage 20 is changed by the lifting unit 27 (ST03). Here, the rotating stage 20 is raised so that the height of the rotating stage 20 is higher (i.e., the distance between the bottom 21a of the container and the rotating stage 20 is larger) compared to the state after step ST05 described below. This step may be performed before step ST01 or ST02.

Next, with the application nozzle 23a moved to the retracted position, the rotating stage 20 is rotated and the cleaning nozzle 24a is moved to the first position to supply cleaning liquid toward the frame 13 of the workpiece 10 (ST04: cleaning liquid supply process). The state inside the application device 100 in this state is shown in Figure 4. The cleaning liquid dropped onto the frame 13 is scattered toward the side wall 21b of the container by centrifugal force. As a result, the inner wall of the container is coated with the components of the cleaning liquid, and a protective layer 28 (see Figure 5) is formed on the inner wall of the container.

In this process, the movement of the cleaning nozzle and the application of the cleaning liquid may be repeated multiple times to supply the cleaning liquid at multiple positions on the rotating stage. By supplying the cleaning liquid at multiple positions, unevenness in the amount of the cleaning liquid scattered depending on the position on the inner wall of the container can be suppressed, and the inner wall of the container can be uniformly covered with the cleaning liquid.
The cleaning liquid splashed toward the side wall 21b of the container moves downward along the side wall 21b. Since the drain valve 29 is closed, the cleaning liquid is not discharged but mixes with the cleaning liquid at the bottom of the container and remains there.

The rotation speed of the turntable in the cleaning liquid supply process is not particularly limited, but may be 300 rpm or more, or 500 rpm or more. The rotation speed of the turntable may be 2000 rpm or less, or 1500 rpm or less.

The viscosity of the cleaning solution is not particularly limited. From the viewpoint of productivity, the viscosity of the cleaning solution at 20°C measured in accordance with JIS Z 8803 may be 1 mPa·s or more and 1000 mPa·s or less.

Next, as shown in FIG. 5, the height of the rotating stage 20 is adjusted by the lifting unit 27 (ST05). Here, the rotating stage 20 is lowered so that the height of the rotating stage 20 is lowered (i.e., the distance between the bottom 21a of the container and the rotating stage 20 is reduced) compared to the state after the above-mentioned step ST03.

Next, with the cleaning nozzle 24a moved to the retracted position, the coating nozzle 23a is moved to the second position, and the coating liquid is supplied toward the substrate 11 of the workpiece 10 while the rotating stage is rotated (ST06: Coating liquid supply process). The state inside the coating device 100 in this state is shown in FIG. 5. The coating liquid dropped onto the substrate 11 uniformly covers the surface of the substrate due to centrifugal force. Meanwhile, some of the coating liquid may splash toward the side wall 21b of the container. However, since a protective layer 28 is formed on the inner wall of the container, adhesion of the coating liquid to the inner wall of the container is suppressed. The coating liquid that has splashed and adhered to the inner wall of the container moves downward along the inner wall and mixes with the cleaning liquid at the bottom of the container.

The rotation speed of the rotating stage in the coating liquid supplying process is not particularly limited, but may be 300 rpm or more, or 500 rpm or more. The rotation speed of the table may be 5000 rpm or less, or 3000 rpm or less. When the coating liquid is supplied, the rotating stage may be stopped or may be rotating at a slower speed (e.g., 10 rpm or more and 50 rpm or less).

The viscosity of the coating liquid is not particularly limited. From the viewpoint of productivity, the viscosity of the raw material liquid at 20°C measured in accordance with JIS Z 8803 may be 1 mPa·s or more and 1000 mPa·s or less. Usually, the viscosity of the coating liquid is higher than the viscosity of the cleaning liquid supplied in the cleaning liquid supplying process.

The amount of coating liquid to be supplied may be set appropriately depending on the thickness of the coating film of the desired resin component. The thickness of the coating film is not particularly limited, but for example, in the case of a resin film used in plasma dicing, it is, for example, 5 μm or more and 60 μm or less.

Next, the workpiece 10 is removed from the rotating stage 20 (ST07). The removed workpiece 10 is subjected to a drying process, and a resin film is formed on the substrate 11. The drying conditions are not particularly limited, and may be set appropriately in consideration of the components and concentration of the coating liquid, the heat resistance of the holding sheet 12, and the like. Examples of the drying mechanism include heat drying using a heater, reduced pressure drying using an exhaust device, and hot air drying using an air supply device.
After step ST07, another object to be processed 10 may be prepared and steps ST02 to ST07 may be repeated.

Next, the drain valve 29 is opened, and the cleaning liquid is drained through the drain hole 30 provided at the bottom of the container (ST08).

The rotation speed of the rotating stage 20 in the cleaning liquid supplying process (ST04) and the rotation speed of the rotating stage 20 in the coating liquid supplying process (ST06) may be different. From the viewpoint of promoting the scattering of the cleaning liquid onto the inner wall of the container while suppressing the scattering of the coating liquid onto the inner wall of the container, it is preferable that the rotation speed of the rotating stage 20 in the cleaning liquid supplying process is faster than the rotation speed of the rotating stage 20 in the coating liquid supplying process.

The coating device and coating method of the present invention can form a uniform resin film on a substrate, and is particularly suitable for use as a device and method for forming a mask for dicing a substrate by plasma processing.

100: Coating device 10: Workpiece 11: Substrate 12: Holding sheet 13: Frame 20: Rotating stage 21: Container 21a: Bottom 21b: Side wall 22: Rotating section 23: Coating liquid supply section 23a: Coating nozzle 24: Cleaning liquid supply section 24a: Cleaning nozzle 25: Nozzle movement section 26: Control section 27: Lifting section 28: Protective layer 29: Discharge valve 30: Discharge hole

Claims (6)

a holding step of holding the object to be processed on a holding surface of a rotating stage;
a cleaning liquid supplying step of supplying a cleaning liquid to an inner wall of a container provided so as to surround the rotating stage;
a coating step of supplying a coating liquid to the object held on the rotating stage from a side of a first main surface of the object that does not face the holding surface after the cleaning liquid supply step, and rotating the rotating stage;
In the cleaning liquid supplying step, the cleaning liquid is supplied to the first main surface side of the object to be processed held on the rotation stage while rotating the rotation stage, and the cleaning liquid is scattered from the object to the inner wall by centrifugal force ;
A coating method , wherein a position of the holding surface of the rotating stage in the cleaning liquid supplying step is higher than a position of the holding surface of the rotating stage in the coating step . The coating method according to claim 1, wherein in the cleaning liquid supplying step, the cleaning liquid is supplied to the outer edge of the first main surface side of the workpiece, and the cleaning liquid supplied to the outer edge is scattered onto the inner wall by centrifugal force. the processing target object includes a substrate, a holding sheet for holding the substrate, and a frame for holding an outer edge of the holding sheet;
The cleaning liquid supplying step supplies the cleaning liquid to the frame,
The coating method according to claim 2 , wherein the coating step includes supplying the coating liquid to the substrate. 4. The coating method according to claim 1, wherein in the cleaning liquid supplying step, the cleaning liquid is supplied to the object at a plurality of positions on the rotating stage. The coating liquid contains a resin component,
The coating method according to claim 1 , wherein the cleaning liquid contains a solvent that dissolves the resin component. The coating method according to claim 1 , further comprising, prior to the coating step, a step of retaining the cleaning liquid in a space of the container at least below the rotating stage.

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