JPH04267348A - Molding die into tab - Google Patents
Molding die into tabInfo
- Publication number
- JPH04267348A JPH04267348A JP4918491A JP4918491A JPH04267348A JP H04267348 A JPH04267348 A JP H04267348A JP 4918491 A JP4918491 A JP 4918491A JP 4918491 A JP4918491 A JP 4918491A JP H04267348 A JPH04267348 A JP H04267348A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- resin
- mold
- tab
- suction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000465 moulding Methods 0.000 title claims abstract description 27
- 239000004065 semiconductor Substances 0.000 claims abstract description 69
- 239000011347 resin Substances 0.000 claims abstract description 48
- 229920005989 resin Polymers 0.000 claims abstract description 48
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 230000000694 effects Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 239000000969 carrier Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14065—Positioning or centering articles in the mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14065—Positioning or centering articles in the mould
- B29C2045/14155—Positioning or centering articles in the mould using vacuum or suction
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明はＴＡＢフィルムキャリア
の樹脂モールドに用いるＴＡＢのモールド金型に関する
。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a TAB molding die used for resin molding of TAB film carriers.
【０００２】0002
【従来の技術】ＴＡＢ（Ｔａｐｅ Ａｕｔｏｍａｔｅｄ
Ｂｏｎｄｉｎｇ） フィルムキャリアに半導体素子を
搭載して樹脂モールドして成る半導体装置には、ＴＡＢ
フィルムキャリアのインナーリードと半導体素子との接
合側を樹脂封止し、配線パターンが形成されていない半
導体素子の裏面をモールド樹脂から露出させて樹脂モー
ルドするタイプの製品がある。半導体素子の裏面を樹脂
モールドしないことにより、これらの製品は半導体素子
からの熱放散性に優れるといった特長がある。上記のよ
うな製品を樹脂モールドする場合は、半導体素子を搭載
したＴＡＢフィルムキャリアを金型でクランプし、キャ
ビティ内に樹脂を注入してモールドするが、半導体素子
の裏面をモールド樹脂から露出させるため、下金型のキ
ャビティの底面に半導体素子の裏面を当接させ、半導体
素子の裏面に樹脂が回り込まないように金型でクランプ
して樹脂モールドしている。[Prior art] TAB (Tape Automated
Bonding) Semiconductor devices made by mounting semiconductor elements on a film carrier and resin molding are
There is a type of product in which the bonding side of the inner lead of the film carrier and the semiconductor element is sealed with resin, and the back side of the semiconductor element on which no wiring pattern is formed is exposed from the molding resin and molded with resin. By not molding the back side of the semiconductor element with resin, these products have the advantage of excellent heat dissipation from the semiconductor element. When molding the above product with resin, the TAB film carrier carrying the semiconductor element is clamped with a mold, and resin is injected into the cavity and molded. However, in order to expose the back side of the semiconductor element from the molding resin. , the back side of the semiconductor element is brought into contact with the bottom of the cavity of the lower mold, and the semiconductor element is clamped with a mold to prevent the resin from getting around to the back side of the semiconductor element to perform resin molding.
【０００３】0003
【発明が解決しようとする課題】しかしながら、半導体
素子の裏面をキャビティの底面に当接させてＴＡＢフィ
ルムキャリアをクランプする方法では、樹脂を注入した
際に、樹脂の注入圧によって半導体素子が浮き上がり、
半導体素子の裏面側にも樹脂が回り込んでしまい確実な
樹脂モールドができないという問題点が生じている。そ
こで、本発明は上記問題点を解消すべくなされたもので
あり、その目的とするところは、半導体素子の裏面を露
出させて樹脂モールドするタイプの半導体装置の製品に
ついて、樹脂の回り込みを防止して確実に樹脂モールド
することができるＴＡＢのモールド金型を提供しようと
するものである。However, in the method of clamping the TAB film carrier by bringing the back surface of the semiconductor element into contact with the bottom surface of the cavity, when resin is injected, the semiconductor element is lifted up by the injection pressure of the resin.
A problem arises in that the resin gets around to the back side of the semiconductor element, making it impossible to perform reliable resin molding. Therefore, the present invention has been made to solve the above problems, and its purpose is to prevent the resin from getting around in semiconductor device products of the type in which the back side of the semiconductor element is exposed and molded with resin. The present invention aims to provide a TAB molding die that can reliably perform resin molding.
【０００４】0004
【課題を解決するための手段】本発明は上記目的を達成
するため次の構成を備える。すなわち、半導体素子を搭
載したＴＡＢフィルムキャリアをクランプし、半導体素
子の裏面をモールド樹脂から露出させて樹脂モールドす
るＴＡＢのモールド金型において、前記半導体素子の裏
面が当接する金型面に、樹脂モールド時に半導体素子の
裏面をエア吸着する吸着部を設け、該吸着部に連通する
エア吸引機構を設けたことを特徴とする。また、半導体
素子の裏面が当接する金型面に、半導体素子の外周縁が
当接する部位に沿って吸着部としての吸引溝を設けたこ
とを特徴とする。Means for Solving the Problems The present invention has the following configuration to achieve the above object. That is, in a TAB molding die in which a TAB film carrier on which a semiconductor element is mounted is clamped and resin molded with the back side of the semiconductor element exposed from the molding resin, the resin mold is placed on the mold surface that the back side of the semiconductor element comes into contact with. The present invention is characterized in that a suction section that sucks air to the back surface of a semiconductor element is provided, and an air suction mechanism that communicates with the suction section is provided. Furthermore, the present invention is characterized in that a suction groove serving as a suction portion is provided on the mold surface against which the back surface of the semiconductor element abuts, along a portion against which the outer peripheral edge of the semiconductor element abuts.
【０００５】[0005]
【作用】ＴＡＢフィルムキャリアを金型でクランプする
とともに半導体素子の裏面を金型面に当接させ、エア吸
引機構を作動して吸着部で半導体素子の裏面を金型面に
吸着して樹脂注入してモールドする。半導体素子が金型
面に吸着されることにより半導体素子の裏面側に注入樹
脂が回り込まずに樹脂モールドできる。半導体素子の外
周縁に沿って吸引溝を設けることにより金型面への半導
体素子の吸着が効果的になされる。[Operation] Clamp the TAB film carrier with the mold, bring the back side of the semiconductor element into contact with the mold surface, activate the air suction mechanism, use the suction part to attract the back side of the semiconductor element to the mold surface, and inject resin. and mold. Since the semiconductor element is attracted to the mold surface, resin molding can be performed without the injected resin going around to the back side of the semiconductor element. By providing suction grooves along the outer periphery of the semiconductor element, the semiconductor element can be effectively attracted to the mold surface.
【０００６】[0006]
【実施例】以下、本発明の好適な実施例を添付図面に基
づいて詳細に説明する。図１は本発明に係るＴＡＢのモ
ールド金型の一実施例を示す断面図である。図で１０は
ＴＡＢフィルムキャリアであり、１２はＴＡＢフィルム
キャリア１０に搭載した半導体素子である。半導体素子
１２は一括ボンディングによってＴＡＢフィルムキャリ
ア１０のインナーリード１４に接合されている。２０お
よび２２は上金型および下金型であり樹脂モールドのた
めのキャビティ凹部が凹設され、キャビティ凹部の外縁
にはＴＡＢフィルムキャリア１０をクランプする突縁２
４が設けられている。DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings. FIG. 1 is a sectional view showing an embodiment of a TAB mold according to the present invention. In the figure, 10 is a TAB film carrier, and 12 is a semiconductor element mounted on the TAB film carrier 10. The semiconductor element 12 is bonded to the inner lead 14 of the TAB film carrier 10 by batch bonding. Reference numerals 20 and 22 denote an upper mold and a lower mold, each having a cavity recess for resin molding, and a protruding edge 2 for clamping the TAB film carrier 10 on the outer edge of the cavity recess.
4 is provided.
【０００７】下金型２２のキャビティ凹部には樹脂モー
ルド時に半導体素子１２を吸着する吸着部としての吸引
溝２６および吸引孔２８を設ける。図２は下金型のキャ
ビティ凹部を示す。図のように吸引溝２６は半導体素子
１２の外周縁に沿って、外周縁よりもわずかに内側に細
溝状に形成し、キャビティ凹部の中央に穿設した吸引孔
２８と吸引溝２６とを連通させて設ける。吸引孔２８は
金型外部に設けたエア吸引機構に連通される。なお、吸
引溝２６の内側部分はキャビティ凹部の面と面一に形成
し、吸引孔２８に連通する連通路で分離されて島部３０
となる。A suction groove 26 and a suction hole 28 are provided in the cavity concave portion of the lower mold 22 as a suction portion for sucking the semiconductor element 12 during resin molding. FIG. 2 shows the cavity recess of the lower mold. As shown in the figure, the suction groove 26 is formed in the shape of a narrow groove along the outer periphery of the semiconductor element 12 slightly inside the outer periphery, and the suction groove 26 is connected to a suction hole 28 bored in the center of the cavity recess. Provided in communication. The suction hole 28 communicates with an air suction mechanism provided outside the mold. Note that the inner part of the suction groove 26 is formed flush with the surface of the cavity recess, and is separated by a communication path communicating with the suction hole 28 to form the island part 30.
becomes.
【０００８】次に、上記実施例のモールド金型を用いて
ＴＡＢフィルムキャリアをモールドする方法について説
明する。まず、半導体素子１２を搭載したＴＡＢフィル
ムキャリア１０を金型上まで搬送し、下金型２２に位置
決めするとともに上金型２０との間でクランプする。Ｔ
ＡＢフィルムキャリア１０をクランプすると同時にエア
吸引機構を作動させ、吸引溝２６および吸引孔２８部分
で半導体素子１２の裏面をキャビティの底面に吸着させ
る。半導体素子１２の裏面をキャビティの底面に吸着し
た状態でキャビティ２５内に樹脂を充填する。充填樹脂
が硬化した後、樹脂モールド部を離型してＴＡＢフィル
ムキャリア１０を金型から取り出す。こうして、半導体
素子１２の裏面を樹脂モールド部から露出させてモール
ドした製品を得ることができる。Next, a method of molding a TAB film carrier using the mold of the above embodiment will be explained. First, the TAB film carrier 10 on which the semiconductor element 12 is mounted is transported to above the mold, positioned on the lower mold 22, and clamped between it and the upper mold 20. T
At the same time as the AB film carrier 10 is clamped, the air suction mechanism is operated to attract the back surface of the semiconductor element 12 to the bottom surface of the cavity at the suction groove 26 and suction hole 28 portion. The cavity 25 is filled with resin while the back surface of the semiconductor element 12 is adsorbed to the bottom surface of the cavity. After the filled resin is cured, the resin mold part is released and the TAB film carrier 10 is taken out from the mold. In this way, a molded product can be obtained in which the back surface of the semiconductor element 12 is exposed from the resin mold section.
【０００９】上記実施例のＴＡＢのモールド金型を用い
て樹脂モールドした場合は、半導体素子１２を下金型２
２のキャビティ底面に吸着した状態で樹脂を充填するか
ら、半導体素子のキャビティ底面への保持が確実にでき
、注入樹脂圧によって半導体素子が浮き上がったりせず
半導体素子の裏面側への樹脂の回り込みをなくして樹脂
モールドすることができる。吸引溝２６は半導体素子１
２の外周縁に沿って設けたから半導体素子のキャビティ
底面への吸着が効果的にでき、半導体素子を確実に支持
する。半導体素子に作用する吸着効果について半導体素
子サイズ８ ｍｍ×１０ｍｍ、吸引溝の幅３ｍｍ とし
て試算するとおよそ１ｋｇ 程度となる。この吸着力は
半導体素子に対する吸着作用としてはかなり大きな効果
ということができる。なお、半導体素子の裏面はその加
工工程においてきわめて平坦に形成されるから金型への
吸着性も良好となる。また、吸着時には半導体素子がキ
ャビティ内壁に押接されるが、島部３０が受け部となり
半導体素子が過度に歪まないよう支持する。また、かり
に半導体素子の外周縁から裏面に注入樹脂が漏れても、
吸引溝部分で樹脂が硬化してそれ以上内側に入り込まな
いようにすることができる。このようにいて樹脂モール
ドすることにより外観的にも見栄えのよい製品を確実に
製造することが可能になる。When the TAB mold of the above embodiment is used for resin molding, the semiconductor element 12 is placed in the lower mold 2.
Since the resin is filled while being adsorbed to the bottom of the cavity in step 2, the semiconductor element can be reliably held on the bottom of the cavity, and the semiconductor element will not be lifted up by the pressure of the injected resin, and the resin will not flow around to the back side of the semiconductor element. It can be resin molded without it. The suction groove 26 is the semiconductor element 1
2, the semiconductor element can be effectively attracted to the bottom surface of the cavity, and the semiconductor element can be reliably supported. Assuming that the semiconductor element size is 8 mm x 10 mm and the width of the suction groove is 3 mm, the suction effect acting on the semiconductor element is approximately 1 kg. This adsorption force can be said to have a fairly large effect as an adsorption effect on semiconductor elements. Note that since the back surface of the semiconductor element is formed extremely flat during the processing process, it has good adhesion to the mold. Further, when the semiconductor element is attracted, the semiconductor element is pressed against the inner wall of the cavity, but the island portion 30 serves as a receiving part and supports the semiconductor element so that it is not excessively distorted. In addition, even if the injected resin leaks from the outer edge of the semiconductor element to the back side,
The resin hardens in the suction groove and prevents it from entering any further inside. By resin molding in this way, it is possible to reliably manufacture a product with a good appearance.
【００１０】0010
【発明の効果】本発明に係るＴＡＢのモールド金型を用
いてモールドする場合には、半導体素子の裏面を金型の
キャビティ内壁に吸着させて樹脂モールドするから、半
導体素子の裏面に樹脂を回り込ませずにモールドでき、
半導体素子の裏面をモールド樹脂の外面に露出させた製
品を確実に製造することができる。また、金型面に半導
体素子の外周縁を吸着する吸引溝を設けることにより半
導体素子の吸着が効果的になされ半導体装置のより確実
な製造が可能になる等の著効を奏する。[Effects of the Invention] When molding is performed using the TAB mold according to the present invention, the back side of the semiconductor element is adsorbed to the inner wall of the cavity of the mold and resin molded, so that the resin wraps around the back side of the semiconductor element. Can be molded without
It is possible to reliably manufacture a product in which the back surface of the semiconductor element is exposed to the outer surface of the mold resin. In addition, by providing suction grooves on the mold surface for suctioning the outer peripheral edge of the semiconductor element, the semiconductor element can be effectively suctioned, and the semiconductor device can be manufactured more reliably.
【図１】ＴＡＢのモールド金型の一実施例の断面図であ
る。FIG. 1 is a sectional view of an embodiment of a TAB mold.
【図２】ＴＡＢのモールド金型のキャビティ底面を示す
説明図である。FIG. 2 is an explanatory diagram showing the bottom surface of the cavity of the TAB mold.
１０ ＴＡＢフィルムキャリア １２ 半導体素子 １４ インナーリード ２０ 上金型 ２２ 下金型 ２６ 吸引溝 ２８ 吸引孔 ３０ 島部 10 TAB film carrier 12 Semiconductor element 14 Inner lead 20 Upper mold 22 Lower mold 26 Suction groove 28 Suction hole 30 Island part
Claims (2)
キャリアをクランプし、半導体素子の裏面をモールド樹
脂から露出させて樹脂モールドするＴＡＢのモールド金
型において、前記半導体素子の裏面が当接する金型面に
、樹脂モールド時に半導体素子の裏面をエア吸着する吸
着部を設け、該吸着部に連通するエア吸引機構を設けた
ことを特徴とするＴＡＢのモールド金型。1. In a TAB molding die in which a TAB film carrier on which a semiconductor element is mounted is clamped and resin molded with the backside of the semiconductor element exposed from the molding resin, the backside of the semiconductor element is in contact with the mold surface. A TAB molding die, characterized in that it is provided with a suction part that sucks air to the back side of a semiconductor element during resin molding, and is provided with an air suction mechanism that communicates with the suction part.
、半導体素子の外周縁が当接する部位に沿って吸着部と
しての吸引溝を設けたことを特徴とする請求項１記載の
ＴＡＢのモールド金型。2. The TAB according to claim 1, wherein a suction groove as a suction portion is provided on the mold surface against which the back surface of the semiconductor element abuts, along a portion where the outer peripheral edge of the semiconductor element abuts. mold mold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4918491A JPH04267348A (en) | 1991-02-21 | 1991-02-21 | Molding die into tab |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4918491A JPH04267348A (en) | 1991-02-21 | 1991-02-21 | Molding die into tab |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04267348A true JPH04267348A (en) | 1992-09-22 |
Family
ID=12823955
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4918491A Pending JPH04267348A (en) | 1991-02-21 | 1991-02-21 | Molding die into tab |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04267348A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL1009563C2 (en) * | 1998-07-06 | 2000-01-10 | Fico Bv | Mold, wrapping device and wrapping method. |
| JP2001094019A (en) * | 1999-09-24 | 2001-04-06 | Sharp Corp | Semiconductor device and method of manufacturing the same |
| WO2013007544A1 (en) * | 2011-07-11 | 2013-01-17 | Osram Opto Semiconductors Gmbh | Method for producing an optoelectronic semiconductor component by means of transfer molding |
-
1991
- 1991-02-21 JP JP4918491A patent/JPH04267348A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL1009563C2 (en) * | 1998-07-06 | 2000-01-10 | Fico Bv | Mold, wrapping device and wrapping method. |
| WO2000002242A1 (en) * | 1998-07-06 | 2000-01-13 | Fico B.V. | Mould, encapsulating device and method of encapsulation |
| JP2003513432A (en) * | 1998-07-06 | 2003-04-08 | フィーコ ビー．ブイ． | Mold, sealing device and sealing method |
| US7211215B1 (en) | 1998-07-06 | 2007-05-01 | Fico B.V. | Mould, encapsulating device and method of encapsulation |
| JP2001094019A (en) * | 1999-09-24 | 2001-04-06 | Sharp Corp | Semiconductor device and method of manufacturing the same |
| WO2013007544A1 (en) * | 2011-07-11 | 2013-01-17 | Osram Opto Semiconductors Gmbh | Method for producing an optoelectronic semiconductor component by means of transfer molding |
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