KR100372500B1 - 탑재형서비스모듈을갖는스퍼터링장치 - Google Patents
탑재형서비스모듈을갖는스퍼터링장치 Download PDFInfo
- Publication number
- KR100372500B1 KR100372500B1 KR1019970703813A KR19970703813A KR100372500B1 KR 100372500 B1 KR100372500 B1 KR 100372500B1 KR 1019970703813 A KR1019970703813 A KR 1019970703813A KR 19970703813 A KR19970703813 A KR 19970703813A KR 100372500 B1 KR100372500 B1 KR 100372500B1
- Authority
- KR
- South Korea
- Prior art keywords
- module
- service module
- process module
- shelf
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (5)
- 기판 상에 층을 형성하는 클러스터 공구 시스템(50, 100)이며,상기 클러스터 공구 시스템(50, 100)은,기판 상에 층을 형성하는 동안에 부착 공정을 거치는 제1 장치를 갖는 프로세스 챔버를 구비하고 층을 형성하는 다수의 프로세스 모듈(20, 22, 24)과,프로세스 모듈(20, 22, 24) 내의 제1 장치를 대체하기에 적당한 적어도 하나의 대체 장치(80)를 가지며 대체 장치(80)의 탈가스를 소정 레벨로 감소시키기에 적당한 진공에서 유지되는 서비스 모듈(52)과,서비스 모듈(52)을 프로세스 모듈(20, 22, 24)로부터 격리하는 밸브(32, 34, 36)와,서비스 모듈(52) 및 프로세스 모듈(20, 22, 24)의 진공 상태를 제공하는 진공화 수단(58)과,제1 장치를 진공 하에 대체하기 위하여 제1 장치를 프로세스 모듈(20, 22, 24)로부터 서비스 모듈(52)로 운반하고 대체 장치(80)를 서비스 모듈(52)로부터 프로세스 모듈(20, 22, 24)로 운반하도록 된 요소(40)를 포함하고,각각의 프로세스 모듈(20, 22, 24) 및 서비스 모듈(52)에 제거 가능하게 부착된 중앙 하우징(14)을 구비하고,밸브(32, 34, 36)는 서비스 모듈(52)을 중앙 하우징(14) 및 각각의 프로세스 모듈(20, 22, 24)로부터 격리하고,진공화 수단(58)은 각각의 프로세스 모듈(20, 22, 24), 서비스 모듈(52) 및 중앙 하우징(14)을 진공 상태로 진공화하고, 밸브(32, 34, 36)가 개방된 때 각각의 프로세스 모듈(20, 22, 24), 서비스 모듈(52) 및 중앙 하우징(14)을 진공화하는 것은 진공을 충분히 유지하도록 되어 있고,운반 요소는 중앙 하우징(14) 내에 위치된 단일 로봇 요소(40)이고, 로봇 요소(40)는 제1 장치를 진공 하에 대체하기 위하여 제1 장치를 소정 프로세스 모듈(20, 22, 24)로부터 서비스 모듈(52)로 운반하고 대체 장치(80)를 서비스 모듈(52)로부터 소정 프로세스 모듈(20, 22, 24)로 운반하며,단일 서비스 모듈(52)이 제공되는 것을 특징으로 하는 클러스터 공구 시스템.
- 제1항에 있어서, 대체 장치(80)를 서비스 모듈(52) 내에 저장하는 저장 요소(62)와, 로봇 요소(40)가 제1 장치를 저장 요소(62) 내에 배치시키고 진공 하에서 대체 장치(80)를 저장 요소(62)로부터 소정 프로세스 모듈(20, 22, 24)로 운반하도록 저장 요소(62)를 서비스 모듈(52) 내에서 이동시키는 구동 기구(70)를 더 포함하는 것을 특징으로 하는 클러스터 공구 시스템.
- 제1항 또는 제2항에 있어서, 대체 장치(80)를 저장하고 제1 장치를 수용하는 적어도 하나의 선반(72 내지 78)을 갖는 랙(62)을 구비하는 저장 요소를 더 포함하는 것을 특징으로 하는 클러스터 공구 시스템.
- 제3항에 있어서, 선반(72 내지 78)을 로봇 요소(40)와 정렬될 수 있도록 이동시키는 구동 기구(70)를 더 포함하는 것을 특징으로 하는 클러스터 공구 시스템.
- 제1항 또는 제2항에 있어서, 서비스 모듈은 서비스 모듈(52)을 탈가스에 적당한 진공 레벨로 진공화하는 펌프(60)를 포함하는 것을 특징으로 하는 클러스터 공구 시스템.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US35200094A | 1994-12-08 | 1994-12-08 | |
| US08/352000 | 1994-12-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR100372500B1 true KR100372500B1 (ko) | 2003-04-21 |
Family
ID=23383365
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019970703813A Expired - Fee Related KR100372500B1 (ko) | 1994-12-08 | 1995-11-09 | 탑재형서비스모듈을갖는스퍼터링장치 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US5620578A (ko) |
| EP (1) | EP0796354B1 (ko) |
| JP (1) | JPH11504386A (ko) |
| KR (1) | KR100372500B1 (ko) |
| AU (1) | AU4281496A (ko) |
| CA (1) | CA2206109A1 (ko) |
| DE (1) | DE69525372T2 (ko) |
| TW (1) | TW359849B (ko) |
| WO (1) | WO1996017971A1 (ko) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6254747B1 (en) * | 1996-12-25 | 2001-07-03 | Nihon Shinku Gijutsu Kabushiki Kaisha | Magnetron sputtering source enclosed by a mirror-finished metallic cover |
| US5944857A (en) * | 1997-05-08 | 1999-08-31 | Tokyo Electron Limited | Multiple single-wafer loadlock wafer processing apparatus and loading and unloading method therefor |
| US6312525B1 (en) | 1997-07-11 | 2001-11-06 | Applied Materials, Inc. | Modular architecture for semiconductor wafer fabrication equipment |
| US6688375B1 (en) * | 1997-10-14 | 2004-02-10 | Applied Materials, Inc. | Vacuum processing system having improved substrate heating and cooling |
| US6042623A (en) * | 1998-01-12 | 2000-03-28 | Tokyo Electron Limited | Two-wafer loadlock wafer processing apparatus and loading and unloading method therefor |
| US6558509B2 (en) * | 1999-11-30 | 2003-05-06 | Applied Materials, Inc. | Dual wafer load lock |
| US7172497B2 (en) * | 2001-01-05 | 2007-02-06 | Asm Nutool, Inc. | Fabrication of semiconductor interconnect structures |
| US6953392B2 (en) * | 2001-01-05 | 2005-10-11 | Asm Nutool, Inc. | Integrated system for processing semiconductor wafers |
| TWI222154B (en) * | 2001-02-27 | 2004-10-11 | Asm Nutool Inc | Integrated system for processing semiconductor wafers |
| US20040259348A1 (en) * | 2001-02-27 | 2004-12-23 | Basol Bulent M. | Method of reducing post-CMP defectivity |
| US20040089421A1 (en) * | 2002-02-15 | 2004-05-13 | Komandur Srinivasan M. | Distributed control system for semiconductor manufacturing equipment |
| US20050205209A1 (en) * | 2004-03-18 | 2005-09-22 | Aelan Mosden | Replacing chamber components in a vacuum environment |
| US8815013B2 (en) * | 2006-07-19 | 2014-08-26 | Intermolecular, Inc. | Method and system for isolated and discretized process sequence integration |
| US20080276867A1 (en) * | 2007-05-09 | 2008-11-13 | Jason Schaller | Transfer chamber with vacuum extension for shutter disks |
| CN101674893B (zh) * | 2007-05-09 | 2012-08-08 | 应用材料公司 | 用真空延伸室储放遮盘的传输室及包含该传输室的主框架及设备组 |
| CN102284307A (zh) * | 2011-06-08 | 2011-12-21 | 大连海事大学 | 模块化集成式可分区操作的大型真空装置 |
| US9746678B2 (en) * | 2014-04-11 | 2017-08-29 | Applied Materials | Light wave separation lattices and methods of forming light wave separation lattices |
| US9666461B1 (en) * | 2016-02-05 | 2017-05-30 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor process and semiconductor processing device using the same |
| TWI742201B (zh) * | 2016-12-02 | 2021-10-11 | 美商應用材料股份有限公司 | 整合式原子層沉積工具 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3314395A (en) * | 1964-10-23 | 1967-04-18 | Melpar Inc | Thin film circuit vacuum processing facility |
| US3516386A (en) * | 1965-07-16 | 1970-06-23 | Boeing Co | Thin film deposition fixture |
| US4909695A (en) * | 1986-04-04 | 1990-03-20 | Materials Research Corporation | Method and apparatus for handling and processing wafer-like materials |
| JP2859632B2 (ja) * | 1988-04-14 | 1999-02-17 | キヤノン株式会社 | 成膜装置及び成膜方法 |
| US5076205A (en) * | 1989-01-06 | 1991-12-31 | General Signal Corporation | Modular vapor processor system |
| JPH0733576B2 (ja) * | 1989-11-29 | 1995-04-12 | 株式会社日立製作所 | スパツタ装置、及びターゲツト交換装置、並びにその交換方法 |
| JPH0449523A (ja) * | 1990-06-18 | 1992-02-18 | Denki Kagaku Kogyo Kk | 磁気記録媒体の製造法及びその装置 |
| US5223112A (en) * | 1991-04-30 | 1993-06-29 | Applied Materials, Inc. | Removable shutter apparatus for a semiconductor process chamber |
| JPH081923B2 (ja) * | 1991-06-24 | 1996-01-10 | ティーディーケイ株式会社 | クリーン搬送方法及び装置 |
-
1995
- 1995-11-08 TW TW084111832A patent/TW359849B/zh not_active IP Right Cessation
- 1995-11-09 EP EP95941368A patent/EP0796354B1/en not_active Expired - Lifetime
- 1995-11-09 AU AU42814/96A patent/AU4281496A/en not_active Abandoned
- 1995-11-09 JP JP8517586A patent/JPH11504386A/ja active Pending
- 1995-11-09 CA CA002206109A patent/CA2206109A1/en not_active Abandoned
- 1995-11-09 DE DE69525372T patent/DE69525372T2/de not_active Expired - Lifetime
- 1995-11-09 KR KR1019970703813A patent/KR100372500B1/ko not_active Expired - Fee Related
- 1995-11-09 WO PCT/US1995/014436 patent/WO1996017971A1/en active IP Right Grant
-
1996
- 1996-01-04 US US08/583,200 patent/US5620578A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US5620578A (en) | 1997-04-15 |
| JPH11504386A (ja) | 1999-04-20 |
| WO1996017971A1 (en) | 1996-06-13 |
| CA2206109A1 (en) | 1996-06-13 |
| AU4281496A (en) | 1996-06-26 |
| DE69525372D1 (de) | 2002-03-21 |
| EP0796354A1 (en) | 1997-09-24 |
| DE69525372T2 (de) | 2002-10-10 |
| EP0796354B1 (en) | 2002-02-06 |
| TW359849B (en) | 1999-06-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100372500B1 (ko) | 탑재형서비스모듈을갖는스퍼터링장치 | |
| US4944860A (en) | Platen assembly for a vacuum processing system | |
| US4952299A (en) | Wafer handling apparatus | |
| EP1048059B1 (en) | Two-wafer loadlock wafer processing apparatus and loading and unloading method therefor | |
| US4923584A (en) | Sealing apparatus for a vacuum processing system | |
| US5019233A (en) | Sputtering system | |
| US5223001A (en) | Vacuum processing apparatus | |
| EP0244951B1 (en) | Method and apparatus for handling and processing wafer like materials | |
| US4795299A (en) | Dial deposition and processing apparatus | |
| EP0898299B1 (en) | Compartmentalized substrate processing chamber | |
| US5697750A (en) | Controlled environment enclosure and mechanical interface | |
| EP0358443B1 (en) | Mask cassette loading device | |
| KR920005622B1 (ko) | 음극 스퍼터링 장치 | |
| US6103069A (en) | Chamber design with isolation valve to preserve vacuum during maintenance | |
| US20020159864A1 (en) | Triple chamber load lock | |
| US6120229A (en) | Substrate carrier as batchloader | |
| US20010005476A1 (en) | Processing method and processing unit for substrate | |
| JP2002517055A (ja) | 基板取扱いおよび処理システムと方法 | |
| US20050205209A1 (en) | Replacing chamber components in a vacuum environment | |
| WO1998050946A1 (en) | Multiple single-wafer loadlock wafer processing apparatus and loading and unloading method therefor | |
| JP2012079407A (ja) | ディスク被覆システム | |
| US6136168A (en) | Clean transfer method and apparatus therefor | |
| EP0886617A1 (en) | Door drive mechanisms for substrate carrier and load lock | |
| US6537012B2 (en) | Vacuum processing apparatus and a vacuum processing system | |
| EP0244950B1 (en) | Method and apparatus for handling and processing wafer-like materials |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| N231 | Notification of change of applicant | ||
| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
|
| A201 | Request for examination | ||
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U12-oth-PR1002 Fee payment year number: 1 |
|
| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 4 |
|
| FPAY | Annual fee payment |
Payment date: 20070125 Year of fee payment: 5 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 5 |
|
| LAPS | Lapse due to unpaid annual fee | ||
| PC1903 | Unpaid annual fee |
St.27 status event code: A-4-4-U10-U13-oth-PC1903 Not in force date: 20080205 Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| PC1903 | Unpaid annual fee |
St.27 status event code: N-4-6-H10-H13-oth-PC1903 Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE Not in force date: 20080205 |