KR20010023152A - 처리할 물품상의 전기적 접촉점상의 금속층의 두께를균일화하기 위한 장치 및 방법 - Google Patents
처리할 물품상의 전기적 접촉점상의 금속층의 두께를균일화하기 위한 장치 및 방법 Download PDFInfo
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- KR20010023152A KR20010023152A KR1020007001776A KR20007001776A KR20010023152A KR 20010023152 A KR20010023152 A KR 20010023152A KR 1020007001776 A KR1020007001776 A KR 1020007001776A KR 20007001776 A KR20007001776 A KR 20007001776A KR 20010023152 A KR20010023152 A KR 20010023152A
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- 239000002184 metal Substances 0.000 title claims abstract description 40
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 40
- 238000000034 method Methods 0.000 title claims abstract description 13
- 238000009713 electroplating Methods 0.000 claims abstract description 46
- 239000011888 foil Substances 0.000 claims abstract description 16
- 239000004020 conductor Substances 0.000 claims abstract description 15
- 238000001465 metallisation Methods 0.000 claims abstract description 15
- 230000005684 electric field Effects 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims description 24
- 238000009826 distribution Methods 0.000 claims description 6
- 239000012811 non-conductive material Substances 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000002161 passivation Methods 0.000 claims description 2
- 230000009471 action Effects 0.000 abstract description 2
- 238000007747 plating Methods 0.000 description 10
- 239000003792 electrolyte Substances 0.000 description 8
- 238000000151 deposition Methods 0.000 description 5
- 230000008021 deposition Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000008151 electrolyte solution Substances 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 238000009827 uniform distribution Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229920001780 ECTFE Polymers 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000000866 electrolytic etching Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000006223 plastic coating Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/004—Sealing devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/005—Contacting devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
- C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacture Of Switches (AREA)
- Control Of Metal Rolling (AREA)
Abstract
Description
Claims (12)
- a) 이송 평면에 대해 반대편으로 위치된 카운터전극b) 처리해야할 물품과 접촉하도록 연속적으로 순환하는 이송 수단에 체결되어 있고,ⅰ. 전기 전도성이며,ⅱ. 금속으로 이루어진 표면을 갖고,ⅲ. 서로에 대해 이동가능하며,ⅳ. 처리해야할 물품을 위하여 1이상의 접촉점을 각각 갖는 클램프, 및c) 카운터 전극과 클램프 사이에서 전류 유동을 생성하기 위한 1이상의 전류원을 갖는 전기도금 플랜트에서 수평의 이송 평면으로 유도된 처리해야할 물품의 전해 처리 중에 컨덕터 호일 및 인쇄회로기판과 같이 처리해야할 물품상의 전기 접촉점상의 금속층 두께를 균일하게 하기 위한 장치에 있어서,카운터전극(2, 3) 과 클램프 (4) 사이에는 전기장을 위한 상부 및 하부 실드 (15, 16) 가 위치되고, 상기 실드는 이송 평면에서 안내되어 처리해야할 물품이 클램프부 (13, 14) 와 접촉하지 않도록 이송 평면에 근접하게 뻗어있는 것을 특징으로 하는 장치.
- 제 1 항에 있어서, 실드 (15, 16) 는 거의 평평한 이루어지고, 전기도금 플랜트에서 이송 평면에 대해서는 거의 수직으로, 처리해야할 물품의 이송 방향에 대해서는 거의 수평으로 정렬되는 것을 특징으로 하는 장치.
- 제 1 항 또는 제 2 항에 있어서, 실드 (15, 16) 는 전기 전도 재료로 이루어지고, 이 재료는 표면에 절연 코팅 또는 아노드성 페시베이션층을 갖도록 제공되고, 또는 실드 (15, 16) 는 전기 비전도성 재료로 이루어지는 것을 특징으로 하는 장치.
- 제 3 항에 있어서, 전기 전도 연결은 실드 (15, 16) 사이에 제공되고 또한 전기 전도 재료와 카운터 전극 (2, 3) 사이에 제공되는 것을 특징으로 하는 장치.
- 제 4 항에 있어서, 실드 (15, 16) 와 카운터 전극 (2, 3) 사이의 전기 전도 연결은 전기 저항을 갖는 것을 특징으르 하는 장치.
- 제 1 항 내지 제 5 항 중 어느 한 항에 있어서, 클램프 상부 (13) 에는 클램프 상부에 거의 평행하게 정렬되어 있고 또한 이송 평면에 대해 또한 접촉점 (6) 에 대해 거의 평행하게 정렬된 스크린 (22) 이 체결되어, 상기 스크린이 이송 평면에서 안내되는 처리해야할 물품 및 접촉점과 접촉하지 않는 것을 특징으로 하는 장치.
- 제 6 항에 있어서, 전기도금 플랜트에서 처리해야할 물품의 이송 방향으로 도시된 스크린 (22) 은 클램프의 상호 간격에 대응하는 폭을 갖고, 인접한 스크린이 상호 중첩할 수 있는 정도의 폭으로 되어 있는 것을 특징으로 하는 장치.
- 제 1 항 내지 제 7 항 중 어느 한 항에 있어서, 스크린 (22) 또는 상부 실드 (15) 에는 추가의 상부 스크린 (26) 이 제공되며, 이 상부 스크린은 거의 수평으로 정렬되어 있으며, 하부 실드 (16) 에는 하부 스크린 (27) 이 체결되어 있으며, 이 하부 스크린은 거의 수평으로 정렬되어 있는 것을 특징으로 하는 장치.
- 제 8 항에 있어서, 처리해야할 물품의 금속층 두께의 분포에 영향을 주며, 개구 (30) 는 수평으로 정렬된 스크린 (26, 27) 에 제공되어 있는 것을 특징으로 하는 장치.
- 제 1 항 내지 제 9 항 중 어느 한 항에 있어서, 처리해야할 물품에 전기 접촉을 제공하는 접촉점 (6) 은 클램프부 (13, 14) 의 최외각 단부에 배치되는 것을 특징으로 하는 장치.
- a) 이송 평면에 대해 반대편으로 위치된 카운터전극b) 처리해야할 물품과 접촉하도록 연속적으로 순환하는 이송 수단에 체결되어 있고,ⅰ. 전기 전도성이며,ⅱ. 금속으로 이루어진 표면을 갖고,ⅲ. 서로에 대해 이동가능하며,ⅳ. 처리해야할 물품을 위하여 1이상의 접촉점을 각각 갖는 클램프, 및c) 카운터 전극과 클램프 사이에서 전류 유동을 생성하기 위한 1이상의 전류원을 갖는 전기도금 플랜트에서 수평의 이송 평면으로 유도된 처리해야할 물품의 전해 처리 중에 컨덕터 호일 및 인쇄회로기판과 같이 처리해야할 물품상의 전기 접촉점상의 금속층 두께를 균일하게 하기 위한 방법에 있어서,카운터전극(2, 3) 과 클램프 (4) 사이에는 전기장을 위한 상부 및 하부 실드 (15, 16) 가 위치되고, 상기 실드는 이송 평면에서 안내되어 처리해야할 물품이 클램프부 (13, 14) 와 접촉하지 않도록 이송 평면에 근접하게 뻗어있는 것을 특징으로 하는 방법.
- 제 11 항에 있어서, 금속층의 두께는 처리해야할 물품의 전해 금속화 주에 균일화되고, 카운터 전극은 아노드로 처리해야할 물품은 캐쏘드로 전환되는 것을 특징으로 하는 방법.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19736352A DE19736352C1 (de) | 1997-08-21 | 1997-08-21 | Vorrichtung zur Kontaktierung von flachem Behandlungsgut in Durchlaufgalvanisieranlagen |
| DE19736352.0 | 1997-08-21 | ||
| PCT/DE1998/002503 WO1999010568A2 (de) | 1997-08-21 | 1998-08-19 | Vorrichtung und verfahren zum vergleichmässigen der dicke von metallschichten an elektrischen kontaktierstellen auf behandlungsgut |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20010023152A true KR20010023152A (ko) | 2001-03-26 |
| KR100535198B1 KR100535198B1 (ko) | 2005-12-08 |
Family
ID=7839698
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR10-2000-7001776A Expired - Lifetime KR100535198B1 (ko) | 1997-08-21 | 1998-08-19 | 처리할 물품상의 전기적 접촉점상의 금속층의 두께를 균일화하기 위한 장치 및 방법 |
| KR1020017001804A Expired - Lifetime KR100626130B1 (ko) | 1997-08-21 | 1999-07-13 | 전기화학 처리 장치 및 전해 처리되는 인쇄기판재료로의 전류 공급 방법 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020017001804A Expired - Lifetime KR100626130B1 (ko) | 1997-08-21 | 1999-07-13 | 전기화학 처리 장치 및 전해 처리되는 인쇄기판재료로의 전류 공급 방법 |
Country Status (11)
| Country | Link |
|---|---|
| US (2) | US6319383B1 (ko) |
| EP (1) | EP1007766B1 (ko) |
| JP (1) | JP4194238B2 (ko) |
| KR (2) | KR100535198B1 (ko) |
| CN (1) | CN1158412C (ko) |
| AT (1) | ATE217036T1 (ko) |
| BR (1) | BR9811978A (ko) |
| CA (1) | CA2301315A1 (ko) |
| DE (2) | DE19736352C1 (ko) |
| TW (1) | TW420727B (ko) |
| WO (1) | WO1999010568A2 (ko) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10215463C1 (de) * | 2002-03-28 | 2003-07-24 | Atotech Deutschland Gmbh | Durchlaufanlage und Verfahren zum elektrolytischen Metallisieren von Werkstück |
| DE10340888B3 (de) | 2003-09-04 | 2005-04-21 | Atotech Deutschland Gmbh | Stromversorgungseinrichtung in einer Vorrichtung zur elektrochemischen Behandlung |
| US20060037865A1 (en) * | 2004-08-19 | 2006-02-23 | Rucker Michael H | Methods and apparatus for fabricating gas turbine engines |
| JP4700406B2 (ja) * | 2005-05-13 | 2011-06-15 | 日本メクトロン株式会社 | シート状製品のめっき方法 |
| DE102005024102A1 (de) * | 2005-05-25 | 2006-11-30 | Atotech Deutschland Gmbh | Verfahren, Klammer und Vorrichtung zum Transport eines Behandlungsgutes in einer Elektrolyseanlage |
| US20060286024A1 (en) * | 2005-06-15 | 2006-12-21 | Baker R Terry K | Synthesis and cleaving of carbon nanochips |
| US6979229B1 (en) * | 2005-06-24 | 2005-12-27 | Sunpex Technology Co., Ltd. | Electrical connector assembly for a vehicle |
| DE102005039100A1 (de) * | 2005-08-09 | 2007-02-15 | Gebr. Schmid Gmbh & Co. | Einrichtung zur Aufnahme bzw. Halterung mehrerer Substrate und Galvanisiereinrichtung |
| CN101343771B (zh) * | 2007-07-13 | 2010-10-06 | 富葵精密组件(深圳)有限公司 | 电镀装置 |
| DE102009057466A1 (de) * | 2009-12-03 | 2011-06-09 | Hübel, Egon, Dipl.-Ing. (FH) | Vorrichtung und Verfahren zum elektrischen Kontaktieren von Behandlungsgut in Galvanisieranlagen |
| NL2005480C2 (nl) | 2010-10-07 | 2012-04-11 | Meco Equip Eng | Inrichting voor het eenzijdig elektrolytisch behandelen van een vlak substraat. |
| DE102012206800B3 (de) * | 2012-04-25 | 2013-09-05 | Atotech Deutschland Gmbh | Verfahren und Vorrichtung zum elektrolytischen Abscheiden eines Abscheidemetalls auf einem Werkstück |
| DE102012019389B4 (de) * | 2012-10-02 | 2018-03-29 | Atotech Deutschland Gmbh | Haltevorrichtung für eine Ware und Behandlungsverfahren |
| US9362440B2 (en) * | 2012-10-04 | 2016-06-07 | International Business Machines Corporation | 60×120 cm2 prototype electrodeposition cell for processing of thin film solar panels |
| CN104805490A (zh) * | 2015-04-29 | 2015-07-29 | 广汽吉奥汽车有限公司 | 一种电镀单体零件、端部电镀结构及电镀方法 |
| JP6469168B2 (ja) * | 2017-05-22 | 2019-02-13 | 丸仲工業株式会社 | 水平搬送メッキ処理装置における板状被処理物のクランプ治具 |
| JP6893849B2 (ja) * | 2017-08-16 | 2021-06-23 | 住友電気工業株式会社 | プリント配線板用めっき装置及び金属製治具 |
| JP2021183587A (ja) | 2020-05-22 | 2021-12-02 | 武田薬品工業株式会社 | 複素環化合物 |
| CN215925114U (zh) * | 2021-01-30 | 2022-03-01 | 厦门海辰新能源科技有限公司 | 导电夹及镀膜机 |
| EP4206364A1 (en) | 2022-01-03 | 2023-07-05 | Atotech Deutschland GmbH & Co. KG | Device for gripping a workpiece, method of manufacturing the device, and conveying system and apparatus for electrochemical surface treatment comprising at least one such device |
| CN114703533B (zh) * | 2022-04-06 | 2023-08-29 | 天津市津荣天晟金属表面处理有限公司 | 微型断路器动触头局部镀厚银生产线 |
| JP2023180832A (ja) * | 2022-06-10 | 2023-12-21 | 株式会社Screenホールディングス | めっき装置およびめっき方法 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2248718A (en) * | 1939-04-01 | 1941-07-08 | Pittsburgh Plate Glass Co | Connector clip |
| US2339996A (en) * | 1941-08-11 | 1944-01-25 | Grace Dehnert Kight | Breaker point |
| DE2512762C3 (de) | 1975-03-22 | 1978-05-11 | Chrom-Schmitt Kg, 7570 Baden-Baden | Vorrichtung zum Fuhren von Werkstücken in galvanischen Metallisierungs-, insbesondere Verchromungsanlagen |
| US4085997A (en) * | 1977-03-30 | 1978-04-25 | The Boeing Company | Anodize clamp |
| DE3027751A1 (de) * | 1980-07-22 | 1982-02-18 | Siemens AG, 1000 Berlin und 8000 München | Vorrichtung zum galvanischen metallisieren von substraten |
| US4385967A (en) | 1981-10-07 | 1983-05-31 | Chemcut Corporation | Electroplating apparatus and method |
| DE3612220A1 (de) | 1986-04-11 | 1987-10-15 | Schering Ag | Haltezange |
| DE3624481A1 (de) * | 1986-07-19 | 1988-01-28 | Schering Ag | Anordnung zur elektrolytischen behandlung von plattenfoermigen gegenstaenden |
| US4755271A (en) * | 1986-07-28 | 1988-07-05 | Siemens Aktiengesellschaft | Electroplating apparatus for plate-shaped workpieces, particularly printed circuit boards |
| DE3726571C1 (en) * | 1987-08-10 | 1989-03-23 | Siemens Ag | Screening and positioning frame |
| US4879007B1 (en) | 1988-12-12 | 1999-05-25 | Process Automation Int L Ltd | Shield for plating bath |
| DE4005209A1 (de) * | 1990-02-20 | 1991-08-22 | Schering Ag | Vorrichtung zum abblenden von feldlinien in einer galvanikanlage |
| DE4106733A1 (de) * | 1991-03-02 | 1992-09-03 | Schering Ag | Vorrichtung zum abblenden von feldlinien in einer galvanikanlage (iii) |
| EP0578699B1 (de) | 1991-04-12 | 1995-07-12 | Siemens Aktiengesellschaft | Galvanisiereinrichtung für plattenförmige werkstücke, insbesondere leiterplatten |
| DE9309768U1 (de) * | 1993-07-01 | 1993-11-04 | Metzka GmbH, 90596 Schwanstetten | Kontaktiereinrichtung für ein Leiterplattengestell einer Galvanikanlage |
| DE19539868C1 (de) * | 1995-10-26 | 1997-02-20 | Lea Ronal Gmbh | Transportvorrichtung und Transportsystem zur vertikalen Führung von plattenähnlichen Gegenständen zur chemischen oder elektrolytischen Oberflächenbehandlung |
| DE19612555C2 (de) | 1996-03-29 | 1998-03-19 | Atotech Deutschland Gmbh | Verfahren zur selektiven elektrochemischen Behandlung von Leiterplatten und Vorrichtung zur Durchführung des Verfahrens |
| AU2882197A (en) | 1996-05-30 | 1998-01-05 | M + B Plating Racks, Inc. | Holding clamp for electroplating articles in a bath |
| US6132583A (en) * | 1997-05-16 | 2000-10-17 | Technic, Inc. | Shielding method and apparatus for use in electroplating process |
| US5985123A (en) * | 1997-07-09 | 1999-11-16 | Koon; Kam Kwan | Continuous vertical plating system and method of plating |
| DE29721741U1 (de) | 1997-12-09 | 1998-03-05 | Strecker, Günther, 74080 Heilbronn | Klammerartige Haltevorrichtung für Tauchgalvanisierung |
-
1997
- 1997-08-21 DE DE19736352A patent/DE19736352C1/de not_active Expired - Fee Related
-
1998
- 1998-08-03 TW TW087112726A patent/TW420727B/zh not_active IP Right Cessation
- 1998-08-19 WO PCT/DE1998/002503 patent/WO1999010568A2/de active IP Right Grant
- 1998-08-19 AT AT98951219T patent/ATE217036T1/de not_active IP Right Cessation
- 1998-08-19 DE DE59803992T patent/DE59803992D1/de not_active Expired - Lifetime
- 1998-08-19 CA CA002301315A patent/CA2301315A1/en not_active Abandoned
- 1998-08-19 KR KR10-2000-7001776A patent/KR100535198B1/ko not_active Expired - Lifetime
- 1998-08-19 EP EP98951219A patent/EP1007766B1/de not_active Expired - Lifetime
- 1998-08-19 JP JP2000507870A patent/JP4194238B2/ja not_active Expired - Lifetime
- 1998-08-19 CN CNB988082500A patent/CN1158412C/zh not_active Expired - Lifetime
- 1998-08-19 BR BR9811978-8A patent/BR9811978A/pt not_active Application Discontinuation
- 1998-08-19 US US09/485,785 patent/US6319383B1/en not_active Expired - Fee Related
-
1999
- 1999-07-13 KR KR1020017001804A patent/KR100626130B1/ko not_active Expired - Lifetime
- 1999-07-13 US US09/762,759 patent/US6887113B1/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| DE19736352C1 (de) | 1998-12-10 |
| TW420727B (en) | 2001-02-01 |
| WO1999010568A2 (de) | 1999-03-04 |
| US6319383B1 (en) | 2001-11-20 |
| KR100626130B1 (ko) | 2006-09-20 |
| US6887113B1 (en) | 2005-05-03 |
| DE59803992D1 (de) | 2002-06-06 |
| BR9811978A (pt) | 2000-08-15 |
| WO1999010568A3 (de) | 1999-08-19 |
| ATE217036T1 (de) | 2002-05-15 |
| JP4194238B2 (ja) | 2008-12-10 |
| EP1007766B1 (de) | 2002-05-02 |
| KR20010072416A (ko) | 2001-07-31 |
| CN1267341A (zh) | 2000-09-20 |
| EP1007766A2 (de) | 2000-06-14 |
| JP2001514333A (ja) | 2001-09-11 |
| KR100535198B1 (ko) | 2005-12-08 |
| CA2301315A1 (en) | 1999-03-04 |
| CN1158412C (zh) | 2004-07-21 |
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