KR20010072416A - 접촉 부재 - Google Patents
접촉 부재 Download PDFInfo
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- KR20010072416A KR20010072416A KR1020017001804A KR20017001804A KR20010072416A KR 20010072416 A KR20010072416 A KR 20010072416A KR 1020017001804 A KR1020017001804 A KR 1020017001804A KR 20017001804 A KR20017001804 A KR 20017001804A KR 20010072416 A KR20010072416 A KR 20010072416A
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- 238000000034 method Methods 0.000 claims abstract description 22
- 230000006378 damage Effects 0.000 claims abstract description 17
- 239000000463 material Substances 0.000 claims abstract description 15
- 230000008569 process Effects 0.000 claims abstract description 12
- 210000000056 organ Anatomy 0.000 claims abstract description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 27
- 229910052802 copper Inorganic materials 0.000 claims description 27
- 239000010949 copper Substances 0.000 claims description 27
- 238000000576 coating method Methods 0.000 claims description 21
- 239000011248 coating agent Substances 0.000 claims description 19
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- 150000002739 metals Chemical class 0.000 claims description 7
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 5
- 230000007797 corrosion Effects 0.000 claims description 5
- 238000005260 corrosion Methods 0.000 claims description 5
- 229910052719 titanium Inorganic materials 0.000 claims description 5
- 239000010936 titanium Substances 0.000 claims description 5
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 4
- 239000012634 fragment Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 2
- 229910052741 iridium Inorganic materials 0.000 claims description 2
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052758 niobium Inorganic materials 0.000 claims description 2
- 239000010955 niobium Substances 0.000 claims description 2
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 229910052703 rhodium Inorganic materials 0.000 claims description 2
- 239000010948 rhodium Substances 0.000 claims description 2
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims description 2
- 229910052707 ruthenium Inorganic materials 0.000 claims description 2
- 229910052715 tantalum Inorganic materials 0.000 claims description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 2
- 125000006850 spacer group Chemical group 0.000 claims 2
- 238000012546 transfer Methods 0.000 abstract description 7
- 239000000243 solution Substances 0.000 description 20
- 239000000758 substrate Substances 0.000 description 14
- 238000007747 plating Methods 0.000 description 12
- 241000196324 Embryophyta Species 0.000 description 11
- 239000010410 layer Substances 0.000 description 7
- 239000007788 liquid Substances 0.000 description 7
- 230000006835 compression Effects 0.000 description 5
- 238000007906 compression Methods 0.000 description 5
- 238000009713 electroplating Methods 0.000 description 4
- 239000011810 insulating material Substances 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000003792 electrolyte Substances 0.000 description 3
- 230000007704 transition Effects 0.000 description 3
- 240000001973 Ficus microcarpa Species 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 238000005554 pickling Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000004071 soot Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000003818 cinder Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000005246 galvanizing Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 229910001174 tin-lead alloy Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/004—Sealing devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/005—Contacting devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
- C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacture Of Switches (AREA)
- Control Of Metal Rolling (AREA)
Abstract
Description
Claims (18)
- 전해 공정에 의해 처리되는 실질적으로 판 형상인 물체에 전류를 공급하기 위한 접촉 부재로서,상기 접촉 부재(15,16)는 하나 또는 그 이상의 접촉 영역(26)을 구비하고, 상기 접촉 영역은, 인쇄기판재료(L)의 전도 표면상의 접촉 영역에 압착된 접촉 부재(15,16)로 부터 전도 표면으로 큰 전류가 전달될 때 상기 접촉 영역에 인접한 전도 표면 영역에 손상이 발생하지 않도록 형성되는 것을 특징으로 하는 접촉 부재.
- 제 1 항에 있어서, 상기 접촉 부재(15,16)는 경계선(34)에 의해 한정되는 접촉 영역(26)을 구비하고, 상기 접촉 영역의 형상은, 전체 접촉 영역(26)의 크기(F)에 대한 전체 경계선(34) 길이(L)의 제곱의 비(V) 즉,V = L2/ F가 25 % 이상이 되도록 한 것을 특징으로 하는 접촉 부재.
- 선행 항 중 어느 한 항에 있어서, 상기 접촉 부재(15,16)는, 각각 하나의 접촉 영역(26)을 구비하고 간격부(25)에 의해서 분리되는 2 개 이상의 돌부(24)를 구비하며, 상기 접촉 영역(26)들은, 모든 접촉 영역(26)들 및 물체(L) 상의 대응 접촉 영역들을 따라서 전기 접촉이 이루어지도록 실질적으로 하나의 평면상에 배치되고 정렬되는 것을 특징으로 하는 접촉 부재.
- 제 3 항에 있어서, 상기 돌부(24)는, 실질적으로 원형이고 접촉 영역(26)이 놓이는 평면에 평행인 부분을 구비하는 것을 특징으로 하는 접촉 부재.
- 제 3 항 및 제 4 항 중 어느 한 항에 있어서, 상기 돌부(24)의 개수는 짝수이고, 돌부(24)들은 열(row)을 이뤄 배치되는 것을 특징으로 하는 접촉 부재.
- 제 5 항에 있어서, 각 접촉 영역(26) 직각사각형, 평행사변형 및 사다리꼴의 모서리에 마련되도록, 4 개의 돌부(24)가 마련되고 배치되는 것을 특징으로 하는 접촉 부재.
- 제 3 항에 있어서, 홈 형태의 하나 이상의 간격부(25)를 구비한 것을 특징으로 하는 접촉 부재.
- 제 7 항에 있어서, 원의 단편 형상을 가지는 다수개의 접촉 영역(26)으로 원형 표면을 분할하는 다수개의 홈(25)을 구비하고, 상기 홈(25)은 원형 표면의 중심을 가로지르는 것을 특징으로 하는 접촉 부재.
- 제 8 항에 있어서, 원의 단편 형상을 가지는 동일한 크기의 4 개의 접촉 영역(26)을 원형 표면을 분할하고 서로 직교하는 2 개의 홈(25)을 구비하는 것을 특징으로 하는 접촉 부재.
- 제 1 항 및 제 2 항 중 어느 한 항에 있어서, 상기 접촉 부재(15,16)는 하나 이상의 접촉 영역(26)을 구비하고, 상기 접촉 영역(26)은 별 모양, 삼엽(三葉)형 및 아령형인 것을 특징으로 하는 접촉 부재.
- 선행 항 중 어느 한 항에 있어서, 상기 접촉 부재는 바람직하게는 티타늄, 니오븀, 탄탈륨 또는 그 금속들이나 다른 금속들의 합금으로 만들어지는 것을 특징으로 하는 접촉 부재.
- 선행 항 중 어느 한 항에 있어서, 상기 접촉 영역(26)은 실질적으로 구리로 만들어진 것을 특징으로 하는 접촉 부재.
- 선행 항 중 어느 한 항에 있어서, 상기 접촉 영역(26)은 금, 플래티늄, 이리듐, 루테늄, 로듐, 그 금속들의 합금 또는 혼합된 산화물로 이루어진 전기전도성, 내식성 코팅으로 피복된 것을 특징으로 하는 접촉 부재.
- 전해 공정에 의해 처리되는 실질적으로 판형인 물체에 전류를 공급하기 위한 접촉 기관으로서, 하나 이상의 봉 및 하나 이상의 접촉 부재를 포함하며, 상기 하나 이상의 접촉 부재는 상기 봉의 일단부에 정렬되고, 상기 봉은 상기 접촉 부재가물체의 표면상에 압착될 수 있도록 복원력에 의해 접촉 부재와 함께 이동할 수 있는 것을 특징으로 하는 접촉 기관.
- 제 14 항에 있어서, 상기 접촉 부재(15,16)는 경계선에 의해 한정되는 접촉 영역(26)을 구비하고, 상기 접촉 영역은 의 형상은, 전체 접촉 영역(26)의 크기(F)에 대한 전체 경계선(34) 길이(L)의 제곱의 비(V) 즉,V = L2/ F가 25 % 이상이 되도록 한 것을 특징으로 하는 접촉 기관.
- 제 14 항에 있어서, 상기 접촉 부재(15,16)는, 각각 하나의 접촉 영역(26)을 구비하고 간격부(25)에 의해서 분리되는 2 개 이상의 돌부(24)를 구비하며, 상기 접촉 영역(26)들은, 모든 접촉 영역(26)들 및 물체(L) 상의 대응 접촉 영역들을 따라서 전기 접촉이 이루어지도록 실질적으로 하나의 평면상에 배치되고 정렬되는 것을 특징으로 하는 접촉 기관.
- 전해 공정에 의해 처리되는 실질적으로 판형인 물체에 전류를 공급하기 위한 방법으로서, 하나 이상의 전류 전달 접촉 부재가 상기 물체의 표면상에 압착되고, 그에 따라 접촉 부재와 물체 사이에 전류 유동이 발생되며,상기 접촉 부재(15,16)는 하나 또는 그 이상의 접촉 영역(26)을 구비하고, 상기 접촉 영역은, 인쇄기판재료(L)의 전도 표면상의 접촉 영역에 압착된 접촉 부재(15,16)로 부터 전도 표면으로 큰 전류가 전달될 때 상기 접촉 영역에 인접한 전도 표면 영역에 손상이 발생하지 않도록 형성되는 것을 특징으로 하는 전류 공급 방법.
- 제 17 항에 있어서, 상기 접촉 부재(15,16)는 경계선에 의해 한정되는 접촉 영역(26)을 구비하고, 상기 접촉 영역은 의 형상은, 전체 접촉 영역(26)의 크기(F)에 대한 전체 경계선(34) 길이(L)의 제곱의 비(V) 즉,V = L2/ F가 25 % 이상이 되도록 한 것을 특징으로 하는 접촉 기관.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19736352A DE19736352C1 (de) | 1997-08-21 | 1997-08-21 | Vorrichtung zur Kontaktierung von flachem Behandlungsgut in Durchlaufgalvanisieranlagen |
| PCT/DE1998/002503 WO1999010568A2 (de) | 1997-08-21 | 1998-08-19 | Vorrichtung und verfahren zum vergleichmässigen der dicke von metallschichten an elektrischen kontaktierstellen auf behandlungsgut |
| DEPCT/DE98/02503 | 1998-08-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20010072416A true KR20010072416A (ko) | 2001-07-31 |
| KR100626130B1 KR100626130B1 (ko) | 2006-09-20 |
Family
ID=7839698
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR10-2000-7001776A Expired - Lifetime KR100535198B1 (ko) | 1997-08-21 | 1998-08-19 | 처리할 물품상의 전기적 접촉점상의 금속층의 두께를 균일화하기 위한 장치 및 방법 |
| KR1020017001804A Expired - Lifetime KR100626130B1 (ko) | 1997-08-21 | 1999-07-13 | 전기화학 처리 장치 및 전해 처리되는 인쇄기판재료로의 전류 공급 방법 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR10-2000-7001776A Expired - Lifetime KR100535198B1 (ko) | 1997-08-21 | 1998-08-19 | 처리할 물품상의 전기적 접촉점상의 금속층의 두께를 균일화하기 위한 장치 및 방법 |
Country Status (11)
| Country | Link |
|---|---|
| US (2) | US6319383B1 (ko) |
| EP (1) | EP1007766B1 (ko) |
| JP (1) | JP4194238B2 (ko) |
| KR (2) | KR100535198B1 (ko) |
| CN (1) | CN1158412C (ko) |
| AT (1) | ATE217036T1 (ko) |
| BR (1) | BR9811978A (ko) |
| CA (1) | CA2301315A1 (ko) |
| DE (2) | DE19736352C1 (ko) |
| TW (1) | TW420727B (ko) |
| WO (1) | WO1999010568A2 (ko) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10215463C1 (de) * | 2002-03-28 | 2003-07-24 | Atotech Deutschland Gmbh | Durchlaufanlage und Verfahren zum elektrolytischen Metallisieren von Werkstück |
| DE10340888B3 (de) | 2003-09-04 | 2005-04-21 | Atotech Deutschland Gmbh | Stromversorgungseinrichtung in einer Vorrichtung zur elektrochemischen Behandlung |
| US20060037865A1 (en) * | 2004-08-19 | 2006-02-23 | Rucker Michael H | Methods and apparatus for fabricating gas turbine engines |
| JP4700406B2 (ja) * | 2005-05-13 | 2011-06-15 | 日本メクトロン株式会社 | シート状製品のめっき方法 |
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| DE102012019389B4 (de) * | 2012-10-02 | 2018-03-29 | Atotech Deutschland Gmbh | Haltevorrichtung für eine Ware und Behandlungsverfahren |
| US9362440B2 (en) * | 2012-10-04 | 2016-06-07 | International Business Machines Corporation | 60×120 cm2 prototype electrodeposition cell for processing of thin film solar panels |
| CN104805490A (zh) * | 2015-04-29 | 2015-07-29 | 广汽吉奥汽车有限公司 | 一种电镀单体零件、端部电镀结构及电镀方法 |
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-
1997
- 1997-08-21 DE DE19736352A patent/DE19736352C1/de not_active Expired - Fee Related
-
1998
- 1998-08-03 TW TW087112726A patent/TW420727B/zh not_active IP Right Cessation
- 1998-08-19 WO PCT/DE1998/002503 patent/WO1999010568A2/de active IP Right Grant
- 1998-08-19 AT AT98951219T patent/ATE217036T1/de not_active IP Right Cessation
- 1998-08-19 DE DE59803992T patent/DE59803992D1/de not_active Expired - Lifetime
- 1998-08-19 CA CA002301315A patent/CA2301315A1/en not_active Abandoned
- 1998-08-19 KR KR10-2000-7001776A patent/KR100535198B1/ko not_active Expired - Lifetime
- 1998-08-19 EP EP98951219A patent/EP1007766B1/de not_active Expired - Lifetime
- 1998-08-19 JP JP2000507870A patent/JP4194238B2/ja not_active Expired - Lifetime
- 1998-08-19 CN CNB988082500A patent/CN1158412C/zh not_active Expired - Lifetime
- 1998-08-19 BR BR9811978-8A patent/BR9811978A/pt not_active Application Discontinuation
- 1998-08-19 US US09/485,785 patent/US6319383B1/en not_active Expired - Fee Related
-
1999
- 1999-07-13 KR KR1020017001804A patent/KR100626130B1/ko not_active Expired - Lifetime
- 1999-07-13 US US09/762,759 patent/US6887113B1/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| DE19736352C1 (de) | 1998-12-10 |
| TW420727B (en) | 2001-02-01 |
| WO1999010568A2 (de) | 1999-03-04 |
| US6319383B1 (en) | 2001-11-20 |
| KR100626130B1 (ko) | 2006-09-20 |
| US6887113B1 (en) | 2005-05-03 |
| DE59803992D1 (de) | 2002-06-06 |
| BR9811978A (pt) | 2000-08-15 |
| WO1999010568A3 (de) | 1999-08-19 |
| ATE217036T1 (de) | 2002-05-15 |
| JP4194238B2 (ja) | 2008-12-10 |
| EP1007766B1 (de) | 2002-05-02 |
| KR20010023152A (ko) | 2001-03-26 |
| CN1267341A (zh) | 2000-09-20 |
| EP1007766A2 (de) | 2000-06-14 |
| JP2001514333A (ja) | 2001-09-11 |
| KR100535198B1 (ko) | 2005-12-08 |
| CA2301315A1 (en) | 1999-03-04 |
| CN1158412C (zh) | 2004-07-21 |
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