KR20130080976A - Light emitting device package - Google Patents

Abstract

The light emitting device package according to the embodiment is supported by the body, the body is formed with a cavity, the first lead frame and the second lead frame and spaced apart from each other mounted on the bottom surface of the cavity is mounted on the first lead frame The light emitting device may be disposed on and at least a portion of the body may be formed of a metal layer, and the metal layer may be spaced apart from the first lead frame and the second lead frame.

Description

A light emitting device package

An embodiment relates to a light emitting device package.

Light Emitting Diode (LED) is a device that converts electrical signals into light by using the characteristics of compound semiconductors. It is widely used in household appliances, remote control, electric signboard, display, and various automation devices. There is a trend.

In general, miniaturized LEDs are made of a surface mounting device for mounting directly on a PCB (Printed Circuit Board) substrate, and an LED lamp used as a display device is also being developed as a surface mounting device type . Such a surface mount device can replace a conventional simple lighting lamp, which is used for a lighting indicator for various colors, a character indicator, an image indicator, and the like.

As the use area of the LED is widened as described above, it is important to increase the luminance and reliability of the LED, as the luminance and reliability required for a lamp used in daily life, a lamp for a structural signal, etc. are enhanced.

In the light emitting device package including the light emitting device, a chemical reaction is caused by heat generated from the light emitting device and moisture and oxygen penetrated from the outside, causing the package body to deteriorate.

Patent 10-1054769 discloses a protective film formed on the surface of the package body to prevent degradation of the light emitting device package.

Embodiments attempt to form at least a portion of the body with a metal layer to prevent the body from deteriorating.

The light emitting device package according to the embodiment is supported by the body, the body is formed with a cavity, the first lead frame and the second lead frame and spaced apart from each other mounted on the bottom surface of the cavity is mounted on the first lead frame The light emitting device may be disposed on and at least a portion of the body may be formed of a metal layer, and the metal layer may be spaced apart from the first lead frame and the second lead frame.

In the light emitting device package according to the embodiment, the body constituting the inner portion of the cavity through which heat emitted from the light emitting device is directly transmitted may be formed of a metal layer, thereby preventing the body from being burned out and burning black.

In addition, the metal layer may increase the luminance by reflecting the light emitted from the light emitting device.

Therefore, the light emitting device package has an effect of improving reliability.

1 (a) is a plan view showing a plane of the light emitting device package according to the embodiment, Figure 1 (b) is a cross-sectional view showing a cross section of the light emitting device package of FIG.
FIG. 2 is a front view illustrating a front surface of the light emitting device package of FIG. 1.
3A is a plan view showing a plane of the light emitting device package according to the embodiment, and FIG. 3B is a cross-sectional view showing a cross section of the light emitting device package of FIG.
4A is a perspective view illustrating a lighting device including a light emitting device package according to an embodiment, and FIG. 4B is a cross-sectional view illustrating a DD ′ section of the lighting device of FIG. 4A.
5 is an exploded perspective view illustrating a backlight unit including a light emitting device package according to an embodiment.
6 is an exploded perspective view illustrating a backlight unit including a light emitting device package according to an embodiment.

Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. To fully disclose the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout.

The terms spatially relative, "below", "beneath", "lower", "above", "upper" May be used to readily describe a device or a relationship of components to other devices or components. Spatially relative terms should be understood to include, in addition to the orientation shown in the drawings, terms that include different orientations of the device during use or operation. For example, when flipping a device shown in the figure, a device described as "below" or "beneath" of another device may be placed "above" of another device. Thus, the exemplary term "below" can include both downward and upward directions. The device can also be oriented in other directions, so that spatially relative terms can be interpreted according to orientation.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. It is noted that the terms "comprises" and / or "comprising" used in the specification are intended to be inclusive in a manner similar to the components, steps, operations, and / Or additions.

Unless otherwise defined, all terms (including technical and scientific terms) used in the present specification may be used in a sense that can be commonly understood by those skilled in the art. Also, commonly used predefined terms are not ideally or excessively interpreted unless explicitly defined otherwise.

The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. Also, the size and area of each component do not entirely reflect actual size or area.

Further, the angle and direction mentioned in the description of the structure of the light emitting device in the embodiment are based on those shown in the drawings. In the description of the structure of the light emitting device in the specification, reference points and positional relationship with respect to angles are not explicitly referred to, refer to the related drawings.

1 is a cross-sectional view showing a cross section of a light emitting device package according to an embodiment.

Referring to FIG. 1, the light emitting device package 100 includes a cavity C, and a part of the light emitting device package 100 is mounted on a body 130 formed of a metal layer 112, a lead frame 160, and a cavity C so that a lead frame ( The light emitting device 140 disposed on the 160 and the resin material 150 filled in the cavity C may be included.

The body 130 serves as a housing, and a cavity C is formed at a central portion thereof, so that the light emitting device 140 may be mounted inside the cavity C.

In addition, the body 130 may surround the lead frame 160 and include a wall portion 120 surrounding the side surface of the cavity C and a bottom portion 116 forming the bottom surface of the cavity C. .

Body 130, when the total is usually are formed as PPA (Polyphthalamide) containing TiO _2, by the heat generated in the light emitting device 140 to meet the TiO ₂ contained in the water and PPA penetration from the outside react with each other, O ^{2 -} deteriorates the ions and by the PPA reaction ^PPA-ions and OH ^- ions are generated, the generated O ^2.

Therefore, in order to prevent this, the wall portion 120 directly affected by the heat generated from the light emitting device 140 may include the metal layer 112.

The metal layer 112 is spaced apart from the first lead frame 161 and the second lead frame 162, and the power applied to the first lead frame 161 and the second lead frame 162 is the metal layer 112. Do not connect to.

The metal layer 112 may be formed to surround the cavity C, and the metal layer 112 may include titanium (Ti), copper (Cu), nickel (Ni), gold (Au), chromium (Cr), and tantalum ( Ta, platinum (Pt), tin (Sn), silver (Ag), phosphorus (P), aluminum (Al), indium (In), palladium (Pd), cobalt (Co), silicon (Si), germanium ( At least one of Ge), hafnium (Hf), ruthenium (Ru), and iron (Fe) may be formed, and may be formed in a single layer or multiple layers. However, the present invention is not limited thereto.

In addition, the metal layer 112 may be formed of the same material as at least one of the first lead frame 161 and the second lead frame 162, as described above, the first lead frame 161 and the second lead. In the case of forming the same material as at least one of the frames 162, the process of manufacturing the body 130 can be simplified.

The metal layer 112 may be formed of a material having at least one of reflectance and thermal conductivity.

When the metal layer 112 is formed of a material having excellent reflectivity, the light emitted from the light emitting device 140 may be reflected by the metal layer 112 to increase the amount of light directed toward the upper portion of the light emitting device package 100. The luminance of the light emitting device package 100 may increase.

In addition, when the metal layer 112 is formed of a material having excellent thermal conductivity, damage to the light emitting device package 100 due to heat emitted from the light emitting device 140 may be reduced.

In addition, the cohesive force of the metal layer 112 and the mold layer 114 may be enhanced by having a surface roughness at a portion where the metal layer 112 and the mold layer 114 to be described later are in contact.

The wall part 120 may include a mold layer 114 to electrically insulate the metal layer 112, the first lead frame 161, and the second lead frame 162. The mold layer 114 may be positioned between the metal layer 112, the first leadframe 161, and the second leadframe 162.

The mold layer 114 and the bottom portion 116 of the wall portion 120 are made of a resin material such as polyphthalamide (PPA), silicon (Si), aluminum (Al), aluminum nitride (AlN), and liquid crystal polymer ( PSG, photo sensitive glass, polyamide 9T (PA9T), neogeotactic polystyrene (SPS), metal, sapphire (Al ₂ O ₃ ), beryllium oxide (BeO), printed circuit board (PCB) It may be formed of at least one. The mold layer 114 and the bottom portion 116 may be formed by injection molding, an etching process, but are not limited thereto.

Referring back to FIG. 1, the body 130 may be formed with a cavity C having an upper side open to expose the light emitting device 140 to the outside, and the cavity C may form an inner surface of the wall part 120. It can be formed to be inclined. The angle of reflection of light emitted from the light emitting device 140 may vary according to the angle of the inclined surface, and thus the directivity angle of the light emitted to the outside may be adjusted.

As the directivity of the light decreases, the concentration of light emitted from the light emitting device 140 to the outside increases. On the contrary, as the directivity of the light increases, the concentration of light emitted to the outside from the light emitting device 140 decreases.

On the other hand, the shape viewed from above the cavity (C) formed in the body 130 may be a shape of a circle, a square, a polygon, an oval, and the like, in particular may be a curved shape of the corner, but is not limited thereto.

Lead frame 160 is a metal material, for example, titanium (Ti), copper (Cu), nickel (Ni), gold (Au), chromium (Cr), tantalum (Ta), platinum (Pt), tin (Sn), silver (Ag), phosphorus (P), aluminum (Al), indium (In), palladium (Pd), cobalt (Co), silicon (Si), germanium (Ge), hafnium (Hf), ruthenium (Ru) and iron (Fe) may include one or more materials or alloys. In addition, the lead frame 160 may be formed to have a single layer or a multi-layer structure, but is not limited thereto.

In particular, the surface of the lead frame 160 may be formed of a reflective layer in order to reflect the light generated from the light emitting device 140, for example, may be formed of a silver (Ag) plating layer having excellent reflectance.

In addition, the lead frame 160 may be configured of the first lead frame 161 and the second lead frame 162 to apply different power. Here, the first lead frame 161 and the second lead frame 162 may be formed spaced apart from each other at a predetermined interval and may be partially wrapped by the body 130.

The light emitting device 140 is a type of semiconductor device that is mounted on an upper surface of any one of the first lead frame 161 and the second lead frame 162 and emits light having a predetermined wavelength by a power applied from the outside. It can be implemented based on Group 3 and 5 compounds such as GaN (gallium nitride), AlN (aluminum nitride), InN (indium nitride), GaAs (gallium arsenide). For example, the light emitting device 140 may be a light emitting diode.

The light emitting diode may be, for example, a colored light emitting diode that emits light such as red, green, blue, or white, or a UV (Ultra Violet) light emitting diode that emits ultraviolet light. In the embodiment, a single light emitting diode is illustrated as being provided at the central portion, but the present invention is not limited thereto, and it is also possible to include a plurality of light emitting diodes.

In addition, the light emitting diode is applicable to both a horizontal type in which all the electric terminals are formed on the upper surface or a vertical type formed in the upper and lower surfaces.

The resin 150 may be filled in the cavity C to seal the light emitting device 140 and the wire. In this case, the resin material 150 may be formed of a light-transmissive resin material such as silicon or epoxy, and may be formed by filling the material in the cavity C and then UV or heat curing the material.

The surface of the resin material 150 may be formed in a concave lens shape, a convex lens shape, a flat shape, and the like, and a direction angle of light emitted from the light emitting device 140 may vary according to the shape of the resin material 150. have.

In addition, another lens-shaped resin material may be formed or attached on the resin material 150, but is not limited thereto.

The resin 150 may include a phosphor. Here, the phosphor may be selected according to the wavelength of the light emitted from the light emitting device 140 to allow the light emitting device package 100 to realize white light.

That is, the phosphor may be excited by the light having the first light emitted from the light emitting device 140 to generate the second light. For example, the light emitting device 140 is a blue light emitting diode and the phosphor is a yellow phosphor. In this case, the yellow phosphor may be excited by blue light to emit yellow light, and the light emitting device package 100 may be white light as blue light generated by the blue light emitting diode and yellow light generated by being excited by blue light are mixed. Can be provided.

Similarly, when the light emitting element 140 is a green light emitting diode, a magenta phosphor or a mixture of blue and red phosphors is mixed. When the light emitting element 140 is a red light emitting diode, a cyan phosphor or a blue and green phosphor is used. For example,

Such a fluorescent material may be a known fluorescent material such as a YAG, TAG, sulfide, silicate, aluminate, nitride, carbide, nitridosilicate, borate, fluoride or phosphate.

FIG. 2 is a front view illustrating a front surface of the light emitting device package of FIG. 1.

In FIG. 2, the description of the same configuration described in FIG. 1 will be omitted, and the mold layer 114 will be described in detail.

Referring to FIG. 2, the thickness d1 of the mold layer 114 may be formed thicker than the thickness d2 of the lead frame 160.

When the mold layer 114 is formed as described above, the metal layer 112, the first lead frame 161, and the second lead frame 162 may be prevented from contacting each other, and thus may be electrically insulated.

The thickness d1 of the mold layer 114 may be 0.2 mm to 0.4 mm.

When the thickness d1 of the mold layer 114 is smaller than 0.2 mm, the mold layer 114 may be thinner than the thickness d2 of the first lead frame 161 and the second lead frame 162, and the metal layer 112 and the first layer may be thinner. The lead frame 161 and the second lead frame 162 may be electrically connected. In addition, when the thickness d1 of the mold layer 114 is larger than 0.4 mm, the area occupying the inner surface of the wall portion 120 becomes large, and thus, the portion where heat generated in the light emitting element 140 directly contacts becomes large. It is not possible to effectively prevent the body 130 from deteriorating.

3A is a plan view showing a plane of the light emitting device package according to the embodiment, and FIG. 3B is a cross-sectional view showing a cross section of the light emitting device package of FIG.

In the following, the same configuration shown and described in Figs. 1 (a) and 1 (b) will be omitted, and only the differences will be described.

3 (a) and 3 (b), the metal layer 212 is different from FIGS. 1 (a) and 1 (b) and has a wall portion 220 in which heat generated in the light emitting device 240 is in direct contact. It may be formed only on the inner side of the, and the outer side and the upper portion of the body 230 may be formed of a mold layer 214.

When the light emitting device package 200 is formed as described above, the light emitting device package 200 may be electrically insulated when the light emitting device package 200 comes into contact with an external conductive material, thereby ensuring safety.

In addition, since the mold layer 214 is formed while surrounding the metal layer 212, the bonding force between the metal layer 212 and the mold layer 214 may be strengthened, and structural stability may be ensured.

4A and 4B, the lighting device 300 may include a body 310, a cover 330 fastened to the body 310, and a closing cap 350 positioned at both ends of the body 310. have.

The lower surface of the body 310 is fastened to the light emitting device module 340, the body 310 is conductive so that the heat generated in the light emitting device package 344 can be discharged to the outside through the upper surface of the body 310 And it may be formed of a metal material having an excellent heat dissipation effect.

The light emitting device package 344 may be mounted on the PCB 342 in a multi-colored, multi-row array to form an array. The light emitting device package 344 may be mounted at the same interval or may be mounted with various separation distances as necessary to adjust brightness. . The PCB 342 may be a metal core PCB (MCPCB) or a PCB made of FR4.

Meanwhile, the light emitting device package 344 may include a plurality of holes and a film made of a conductive material.

Since a film formed of a conductive material such as a metal generates a large amount of optical interference, the intensity of a light wave can be enhanced by the interaction of light waves, so that light can be extracted and diffused effectively. It is possible to effectively extract light through interference and diffraction of light. Therefore, the efficiency of the lighting device 300 can be improved. At this time, it is preferable that the size of the plurality of holes formed in the film is smaller than the wavelength of light generated in the light source portion.

The cover 330 may be formed in a circular shape to surround the lower surface of the body 310, but is not limited thereto.

The cover 330 protects the light emitting device module 340 from the outside and the like. In addition, the cover 330 may include diffusing particles to prevent glare of the light generated from the light emitting device package 344, and to uniformly emit light to the outside, and at least of the inner and outer surfaces of the cover 330 A prism pattern or the like may be formed on either side. In addition, a phosphor may be applied to at least one of an inner surface and an outer surface of the cover 330.

On the other hand, since the light generated from the light emitting device package 344 is emitted to the outside through the cover 330, the cover 330 should have excellent light transmittance, and has sufficient heat resistance to withstand the heat generated by the light emitting device package 344. The cover 330 is preferably formed of a material including polyethylene terephthalate (PET), polycarbonate (PC), polymethyl methacrylate (PMMA), or the like. .

Closing cap 350 is located at both ends of the body 310 may be used for sealing the power supply (not shown). In addition, the closing cap 350 is formed with a power pin 352, the lighting device 300 according to the embodiment can be used immediately without a separate device to the terminal from which the existing fluorescent lamps are removed.

5 is an exploded perspective view illustrating a backlight unit including a light emitting device package according to an embodiment.

5 is an edge-light method, and the liquid crystal display device 400 may include a liquid crystal display panel 410 and a backlight unit 470 for providing light to the liquid crystal display panel 410.

The liquid crystal display panel 410 may display an image using light provided from the backlight unit 470. The liquid crystal display panel 410 may include a color filter substrate 412 and a thin film transistor substrate 414 facing each other with the liquid crystal interposed therebetween.

The color filter substrate 412 may implement a color of an image displayed through the liquid crystal display panel 410.

The thin film transistor substrate 414 is electrically connected to the printed circuit board 418 on which a plurality of circuit components are mounted through the driving film 417. The thin film transistor substrate 414 may apply a driving voltage provided from the printed circuit board 418 to the liquid crystal in response to a driving signal provided from the printed circuit board 418.

The thin film transistor substrate 414 may include a thin film transistor and a pixel electrode formed of a thin film on another substrate of a transparent material such as glass or plastic.

The backlight unit 470 may convert the light provided from the light emitting device module 420, the light emitting device module 420 into a surface light source, and provide the light guide plate 430 to the liquid crystal display panel 410. Reflective sheet for reflecting the light emitted from the rear of the light guide plate 430 and the plurality of films 450, 460, 464 to uniform the luminance distribution of the light provided from the 430 and improve the vertical incidence ( 440).

The light emitting device module 420 may include a PCB substrate 422 such that a plurality of light emitting device packages 424 and a plurality of light emitting device packages 424 may be mounted to form an array.

In particular, the light emitting device package 424 includes a film in which a plurality of holes are formed on the light emitting surface, so that the lens may be omitted, thereby implementing a slim light emitting device package and simultaneously improving light extraction efficiency. Therefore, the thinner backlight unit 470 can be implemented.

On the other hand, the backlight unit 470 is a diffusion film 460 for diffusing light incident from the light guide plate 430 toward the liquid crystal display panel 410, and a prism film 450 for condensing the diffused light to improve vertical incidence. It may be configured as), and may include a protective film 464 for protecting the prism film 450.

6 is an exploded perspective view illustrating a backlight unit including a light emitting device package according to an embodiment.

However, the parts shown and described in Fig. 5 are not repeatedly described in detail.

6 illustrates a direct method, the liquid crystal display 500 may include a liquid crystal display panel 510 and a backlight unit 570 for providing light to the liquid crystal display panel 510.

Since the liquid crystal display panel 510 is the same as that described with reference to FIG. 7, a detailed description thereof will be omitted.

The backlight unit 570 includes a plurality of light emitting device modules 523, a reflective sheet 524, a lower chassis 530 in which the light emitting device modules 523 and the reflective sheet 524 are accommodated, and an upper portion of the light emitting device module 523. It may include a diffusion plate 540 and a plurality of optical film 560 disposed in the.

Light emitting device module 523 A plurality of light emitting device packages 522 may be mounted to include a PCB substrate 521 to form an array.

In particular, the light emitting device package 522 is formed of a conductive material, and by providing a film including a plurality of holes on the light emitting surface, it is possible to omit the lens to implement a slim light emitting device package, at the same time light extraction efficiency Can improve. Therefore, it becomes possible to realize the backlight unit 570 which is thinner.

The reflective sheet 524 reflects the light generated from the light emitting device package 522 in the direction in which the liquid crystal display panel 510 is located to improve light utilization efficiency.

Meanwhile, the light generated by the light emitting device module 523 is incident on the diffusion plate 540, and the optical film 560 is disposed on the diffusion plate 540. The optical film 560 includes a diffusion film 566, a prism film 550, and a protective film 564.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It should be understood that various modifications may be made by those skilled in the art without departing from the spirit and scope of the present invention.

100 and 200: light emitting device packages 112 and 212: metal layer
114, 214: mold layers 116, 216: bottom portion
120, 220: wall portions 130, 230: body
140 and 240: light emitting elements 150 and 250: resin

Claims (12)

A body formed with a cavity;
A first lead frame and a second lead frame supported by the body and positioned on the bottom surface of the cavity and spaced apart from each other; And
A light emitting device mounted on the cavity and positioned on the first lead frame;
At least a portion of the body is made of a metal layer, the metal layer is a light emitting device package spaced apart from the first lead frame and the second lead frame. The method of claim 1,
The body,
A wall portion surrounding a side of the cavity; And
A bottom portion forming a bottom surface of the cavity,
The wall portion includes the metal layer and the mold layer,
The mold layer is formed between the metal layer and the first lead frame and the second lead frame so that the metal layer and the first lead frame and the second lead frame is electrically insulated. The method of claim 2,
The thickness of the mold layer is a light emitting device package thicker than the thickness of the first lead frame and the second lead frame. The method of claim 2,
The mold layer has a thickness of 0.2mm to 0.4mm light emitting device package. The method of claim 2,
The metal layer may include,
The light emitting device package is located on the inner side of the wall portion. The method of claim 5,
The metal layer
A light emitting device package surrounding an inner surface of the cavity. The method of claim 1,
The metal layer is a light emitting device package comprising a material excellent in at least one of reflectance and thermal conductivity. The method of claim 1,
The metal layer is titanium (Ti), copper (Cu), nickel (Ni), gold (Au), chromium (Cr), tantalum (Ta), platinum (Pt), tin (Sn), silver (Ag), phosphorus At least one of (P), aluminum (Al), indium (In), palladium (Pd), cobalt (Co), silicon (Si), germanium (Ge), hafnium (Hf), ruthenium (Ru), and iron (Fe) Light emitting device package comprising any one. The method of claim 1,
The metal layer is a light emitting device package of the same material as the first lead frame and the second lead frame. The method of claim 1,
The light emitting device package further comprises a resin filled in the cavity. A lighting device comprising the light emitting device package of any one of claims 1 to 10. A backlight device comprising the light emitting device package of claim 1.

Images