TW202031451A - Resin molding device and method for manufacturing resin-molded product comprising a resin discharge mechanism, a flow sensor, a resin molding mechanism, and a control section - Google Patents

Abstract

Provided is a resin molding device, which automatically and accurately control a discharge quantity of liquid resin. A resin molding device is characterized by comprising a resin discharge mechanism, a flow sensor, a resin molding mechanism, and a control unit. The resin discharge mechanism includes a plunger and a resin containing section that contains the liquid resin and includes a discharge opening for discharging the liquid resin. The resin discharge mechanism discharges the liquid resin contained in the resin containing section through the discharge opening by means of movement of the plunger. The flow sensor is mounted in the resin discharge mechanism. The flow sensor detects the flow rate of the liquid resin. The resin molding mechanism carries out molding of resin by using the liquid resin discharged from the resin discharge mechanism. The control unit controls the movement of the plunger and also controls the plunger to suck back according to the flow rate of the liquid resin detected by the flow sensor.

Description

Resin molding device and manufacturing method of resin molded product

The present invention relates to a resin molding device and a method for manufacturing a resin molded product

When performing liquid resin molding, it is necessary to suppress or prevent deviations in the amount of liquid resin.

Therefore, Patent Document 1 discloses that a predetermined amount of liquid resin 30 is supplied to the mold cavity by sucking backward to improve the disconnection of the liquid resin 30. Specifically, according to the drawings and descriptions of Patent Document 1, in the resin molding apparatus, by rotating the servo motor 31, the plunger 35 is moved forward and backward in the syringe 28, and the liquid resin 30 in the syringe 28 is discharged into the mold cavity. 16. At this time, the encoder 39 of the servo motor 31 is used to detect the resin pressure of the liquid resin 30 received via the plunger 35 as the torque value applied to the servo motor 31, and it is reversed based on the detected torque value. Suck. As a result, the disconnection of the liquid resin 30 can be improved, so that a predetermined amount of the liquid resin 30 can be supplied to the cavity 16.

[Prior Technical Literature] [Patent Literature] Patent Document 1: Japanese Patent Application Publication No. 2017-100285.

[The problem to be solved by the invention]

Although Patent Document 1 controls the amount of liquid resin supplied to the cavity by suction, it cannot automatically set the suction and requires manual operation. Because the suction setting needs to be changed according to the nature of the liquid resin, it needs to be proficient in manual setting, and there may be deviations depending on the person.

Therefore, an object of the present invention is to provide a resin molding apparatus and a method for manufacturing a resin molded product, which can automatically set the back suction for controlling the discharge amount of the liquid resin. [Means to solve the problem]

In order to achieve the object, the resin molding apparatus of the present invention is characterized by including: Resin discharge mechanism; flow sensor; resin molding mechanism and control unit, The resin discharge mechanism includes a plunger and a resin accommodating part capable of accommodating liquid resin, and has a discharge port for discharging the liquid resin, The resin discharge mechanism discharges the liquid resin contained in the resin accommodating portion from the discharge port by the movement of the plunger, The flow sensor is mounted on the resin discharge mechanism, The flow sensor is used to measure the flow rate of the liquid resin, The resin molding mechanism uses the liquid resin discharged from the resin discharge mechanism to perform resin molding, While controlling the movement of the plunger, the control unit controls the back suction of the plunger based on the flow rate of the liquid resin measured by the flow sensor.

The method of manufacturing a resin molded article of the present invention is characterized by comprising: In the resin discharge step, the liquid resin is discharged from the resin discharge mechanism; in the resin molding step, the discharged liquid resin is used for resin molding; in the resin discharge step, the flow sensor installed in the resin discharge mechanism is used to measure the The flow rate of the liquid resin is controlled by the back suction of the resin discharge mechanism based on the measured flow rate. [Invention Effect]

According to the present invention, it is possible to provide a resin molding apparatus and a method for manufacturing a resin molded product, which can automatically set the suction for controlling the discharge amount of the liquid resin.

Hereinafter, examples of the present invention will be described in detail. However, the present invention is not limited at all by the following description.

In the resin molding apparatus of the present invention, for example, after the movement of the plunger for discharging the liquid resin is stopped, the control unit may control the back suction of the plunger so that the flow rate of the liquid resin Close to 0. In this case, for example, the resin molding apparatus of the present invention may be able to carry out the back suction of the plunger at least twice.

In the resin molding apparatus of the present invention, for example, the flow sensor may be an ultrasonic flow sensor.

In the resin molding apparatus of the present invention, for example, the flow sensor may be provided between the discharge port side end of the resin storage portion and the discharge port.

In the resin molding apparatus of the present invention, the resin molding mechanism is not particularly limited. For example, it may include a molding die, and may or may not include members other than the molding die. The forming mold is not particularly limited, and may be a general forming mold, for example, a forming mold including an upper mold and a lower mold. In the present invention, the forming mold is not particularly limited, and may be a metal mold, a ceramic mold, etc., for example.

The manufacturing method of the resin molded article of this invention can be performed using the resin molding apparatus of this invention, for example. More specifically, for example, in the resin discharging step, by the movement of the plunger, the liquid resin contained in the resin accommodating part is discharged from the discharge port, and the liquid resin is discharged by the control part It is possible to control the back suction of the plunger based on the flow rate of the liquid resin measured by the flow sensor while controlling the movement of the plunger. In addition, in the resin molding step, the resin molding mechanism may perform resin molding using the discharged liquid resin.

According to the present invention, for example, in a resin molding apparatus, the flow rate of the liquid resin is measured by a flow sensor provided near the discharge port of the distributor (resin discharge mechanism), and after the movement of the plunger for discharging the liquid resin is stopped, The feedback controls the movement of the plunger so that the flow rate is close to 0, which can automatically set the back suction of the dispenser. However, the present invention is not limited to this. For example, the position where the flow sensor is installed is not limited to the vicinity of the discharge port of the resin discharge mechanism, and it can be installed anywhere. However, if the flow sensor is installed near the discharge port of the resin discharge mechanism, it is easy to measure the flow rate of the liquid resin more accurately. In addition, installing the flow sensor near the discharge port of the resin discharge mechanism means, for example, installing the flow sensor at a position where the flow rate of the liquid resin immediately before being discharged from the discharge port can be measured. Specifically, for example, it means that the flow sensor is provided between the end of the discharge port and the discharge port of the resin container.

In the present invention, "flow sensor" is synonymous with "flow meter".

In the present invention, "suction backward" refers to moving the plunger in a direction opposite to the direction in which the liquid resin is discharged. Specifically, for example, when discharging the liquid resin, the plunger is pushed in the inner direction of the resin accommodating portion, and when sucking back, the plunger is pulled out in the opposite direction, that is, the outer direction of the resin accommodating portion.

In the present invention, "liquid" means, for example, having fluidity. In addition, "fluidity" means that it has fluidity at any temperature. For example, it may have fluidity at normal temperature or may have fluidity at a very high temperature. In addition, the "liquid state" in the present invention may be, for example, liquid at normal temperature and having fluidity, or may be liquid at very high temperature and having fluidity. In addition, in the present invention, neither the term "fluidity" or "liquid" considers the level of fluidity, in other words, the degree of viscosity is not considered. In the present invention, the "liquid resin" may be, for example, a resin in a liquid state at room temperature, or a resin (melted resin) that has fluidity by heating and melting.

In the present invention, the resin material (resin used for resin molding) is not particularly limited. For example, it may be thermosetting resin such as epoxy resin and silicone resin, or may be thermoplastic resin. In addition, it may be a composite material containing a part of thermosetting resin or thermoplastic resin. The thermosetting resin is, for example, a liquid resin at room temperature. After heating, the viscosity decreases, and after heating continues, a polymerization reaction occurs and solidifies to become a cured resin.

In the present invention, "resin molding" is not particularly limited. For example, components such as wafers may be resin-encapsulated, or only resin-molding may be performed without resin encapsulation. Similarly, in the present invention, the "resin molded product" is not particularly limited. For example, it may be a resin molded product (finished or semi-finished product) in which components such as wafers are resin-encapsulated, or it may be resin-molded without resin encapsulation. Finished or semi-finished products.

In addition, in the present invention, "resin molding" may be, for example, resin molding of one or both surfaces of a molding object. However, the present invention is not limited to this. For example, it is also possible to perform only resin molding without using a molding object. In addition, for example, components such as wafers fixed to one or both surfaces of the molding object may be resin-encapsulated, or the components may not be resin-encapsulated, and only one or both surfaces of the molding object may be resin-molded.

In the present invention, the method of "resin molding" is not particularly limited. For example, it may be compression molding, transfer molding, extrusion molding, or the like.

The "resin molding" in the present invention refers to, for example, a state where the resin is cured (hardened) and the cured resin is molded. The hardness of the cured resin is not particularly limited. For example, it may be the degree to which the cured resin does not flow or the degree required to protect the chip encapsulated by the resin, regardless of the hardness. In addition, in the present invention, the curing (hardening) of the resin is not limited to a state in which the resin is completely cured (hardened), and it may be in a state where it can be further cured.

Generally speaking, "electronic component" refers to the chip before resin encapsulation, and the state of the chip with resin encapsulation. In the present invention, when only "electronic component" is expressed, unless otherwise specified, it means that the chip has been encapsulated. Resin-encapsulated electronic components (electronic components as finished products). The "chip" in the present invention specifically includes passive component chips such as resistors, capacitors, and inductors, semiconductor chips such as diodes, transistors, integrated circuits (IC), semiconductor components for power control, and sensors , Filters and other chips. In addition, in the present invention, the component to be resin-encapsulated is not limited to the wafer. For example, it may be at least one of a wafer, wires, bumps, electrodes, wiring patterns, etc., and may also include components that are not wafer-shaped.

In the present invention, the "resin molded product" is not particularly limited, and may be, for example, an electronic component in which a wafer is resin-encapsulated. In addition, the "resin molded product" in the present invention may be, for example, a semiconductor product, an intermediate product for manufacturing a single or plural electronic components such as a circuit module. In addition, the "resin molded product" in the present invention is not limited to electronic components and intermediate products in which the wafer is resin-encapsulated, and may be resin molded products other than the above.

The following describes the specific embodiments of the present invention based on the drawings. Each figure is schematically depicted in an appropriately omitted or exaggerated manner for ease of understanding. For the same constituent element, the same drawing mark is marked.

[Example 1]

In this embodiment, an example of the resin molding apparatus of the present invention and an example of the method of manufacturing a resin molded article of the present invention using it will be described.

First, the cross-sectional view of FIG. 1 shows an example of the structure of the resin discharge mechanism, the flow sensor, and the control part in the resin molding apparatus of the present invention. As shown in the figure, the dispenser (resin discharge mechanism) 19 includes a syringe (resin housing portion) 28 and a plunger 35. In addition, the dispenser 19 further includes a delivery mechanism 27 and a nozzle 29. In addition, the delivery mechanism 27, the syringe 28, and the nozzle 29 are integrated. By rotating the servo motor 31 provided in the delivery mechanism 27, the plunger 35 can advance and retreat inside the syringe 28 with the aid of the button screw 32, the slider 33, and the rod 34, respectively. The inside of the syringe 28 can contain liquid resin. The tip of the nozzle 29 has a discharge port 41, and the liquid resin contained in the syringe 28 can be discharged from the discharge port 41. The flow sensor 100 is attached to the vicinity of the discharge port 41 of the nozzle 29, and can measure the flow rate of the liquid resin immediately before discharge. In addition, the position where the flow sensor 100 is installed may be any position from the end of the syringe 28 on the side of the discharge port 41 (the end on the side where the nozzle 29 is installed) to the discharge port 41, for example. More specifically, the position where the flow sensor 100 is installed may be, for example, any position in the nozzle 29 where the flow rate of the liquid resin can be measured. In addition, while controlling the movement of the plunger 35 by the control unit 22, the back suction of the plunger 35 is controlled based on the flow rate of the liquid resin measured by the flow sensor 100. Thereby, it is possible to realize the automation of the previous suction setting, which was originally performed manually and used to control the discharge amount of the liquid resin. Therefore, with the present invention, for example, by automatically controlling the discharge movement and the suction movement, the dripping state of the liquid resin can be eliminated at an early stage. In addition, for example, the discharge amount of the liquid resin can be automatically and accurately controlled, and the deviation of the supply amount of the liquid resin can be suppressed or prevented.

Next, the structure of the dispenser 19 in FIG. 1 and its movement (method of use) will be further described in detail.

As shown in the figure, the dispenser 19 is integrated by connecting the delivery mechanism 27, the syringe 28 and the nozzle 29. Therefore, the syringe 28 or the nozzle 29 can be replaced with another syringe 28 or the nozzle 29 according to its use.

The delivery mechanism 27 has a servo motor 31, a round head screw 32 rotated by the servo motor 31, a slider 33 that is mounted on a nut (not shown) of the round head screw to change the rotational movement into linear motion, and a slider 33 fixed to the slider 33 A rod 34 having an insertion hole at the top end and a plunger 35 attached to the top end of the rod 34 is provided inside. The button head screw 32 is supported by a button head screw bearing 36 and an anti-vibration member 37 mounted on the top end of the button head screw 32. The slider 33 advances or retreats in the Y direction, for example, along a guide rail 38 that is attached to the base of the delivery mechanism 27. With the rotation of the servo motor 31, the plunger 35 is moved forward or backward in the Y direction by the button screw 32, the slider 33, and the rod 34, respectively.

The servo motor 31 is a motor capable of controlling the rotation of the motor. The servo motor 31 has a rotation detector (encoder) 39 that monitors the rotation of the motor. The encoder 39 detects, for example, the rotation angle and rotation speed of the servo motor 31, and provides feedback to the control unit 22. For example, PLC (Programmable Logic Controller), a controller, a driver, etc. are provided in the control part 22. For example, based on the command signal of the PLC and the feedback signal from the encoder 39, the control unit 22 can control the rotation of the servo motor 31. For example, by controlling the rotation of the servo motor 31, position control, speed control, torque control, etc. of the plunger 35 can be performed with high accuracy.

In addition, in the following description, unless otherwise specified, the resin amount of the liquid resin 30 and the movement amount of the plunger 35 refer to the resin amount per unit time and the movement amount per unit time. In order to maintain the liquid resin 30 delivered by the delivery mechanism 27 at a constant resin amount within a predetermined time, it is necessary to maintain the movement amount of the plunger 35 constant within a predetermined time. In order to maintain the movement amount of the plunger 35 constant within a predetermined time, the plunger 35 advances at a constant movement speed V. Thereby, a predetermined amount of liquid resin 30 can be stably sent out within a predetermined time.

The syringe 28 containing the liquid resin 30 is connected to the tip of the delivery mechanism 27 with a screw 40 for syringe mounting. The plunger 35 is inserted into the syringe 28 in such a manner that the outer diameter of the plunger 35 and the inner diameter of the syringe 28 coincide. An O-ring (not shown) as a seal is attached around the plunger 35. The movement amount (stroke) of the plunger 35 is controlled by controlling the rotation of the servo motor 31. Based on the product of the internal cross-sectional area of the syringe 28 and the movement amount of the plunger 35, the resin amount of the liquid resin 30 discharged from the dispenser 19 is calculated.

At the tip of the nozzle 29, as described above, a discharge port 41 for discharging the liquid resin 30 is provided. The direction of the discharge port 41 is set to any direction, such as directly below, front side, and diagonally downward. In addition, in order to prevent dripping of the liquid resin 30, the diameter and shape of the discharge port 41 can be optimally changed according to the viscosity of the liquid resin 30.

Next, referring to Fig. 1, the operation of the dispenser 19 to discharge the liquid resin 30 will be described. By rotating the servo motor 31, the button head screw 32 rotates. By rotating the round head screw 32, the slider 33 mounted on the nut of the round head screw advances along the guide rail 38 in the -Y direction. By advancing the slider 33, the rod 34 fixed to the slider 33 advances in the −Y direction together with the slider 33. In the syringe 28, the rod 34 advances in the -Y direction, so that the plunger 35 attached to the tip of the rod 34 advances in the -Y direction. By advancing the plunger 35 in the -Y direction, the liquid resin 30 contained in the syringe 28 is pushed and the liquid resin 30 is pushed out in the -Y direction. The liquid resin 30 pushed out by the plunger 35 is discharged from the discharge port 41 provided at the tip of the nozzle 29.

As described above, the movement of the plunger 35 is controlled by the control unit 22. Furthermore, the flow rate of the liquid resin 30 is measured by the flow rate sensor 100. Based on the measured flow rate, the back suction of the plunger 35 is controlled by the control unit 22. Thus, as described above, the discharge amount of the liquid resin can be automatically and accurately controlled, for example, it is possible to suppress or prevent the deviation of the supply amount of the liquid resin.

In addition, depending on the viscosity of the liquid resin 30, the surface tension of the liquid resin 30 may cause the liquid resin 30 to remain as residual resin under the discharge port 41 of the nozzle 29. In this case, even if the resin amount of the liquid resin 30 sent from the syringe 28 is controlled to be constant, it is impossible to discharge all the liquid resin 30 that should be discharged from the nozzle 29. In other words, a part of the liquid resin 30 remains as residual resin. Therefore, it is impossible to discharge all the liquid resin 30 that should be discharged from the nozzle 29 to the cavity 16 (refer to FIG. 3, described later). In order to prevent the occurrence of this situation, it is necessary that no residual resin remains, and all the liquid resin 30 that should be discharged from the nozzle 29 is discharged.

With reference to the graph of FIG. 5, an example of the resin discharge mechanism of this embodiment and the method of controlling the discharge amount of liquid resin by the control unit will be described. In the graphs in (a) and (b) of Fig. 5, the horizontal axis indicates the elapsed time. The vertical axis of the graph of Fig. 5(a) represents the moving speed of the plunger 35. When the moving speed is positive (greater than 0), it means that the plunger 35 is pushed in the inner direction of the syringe 28, that is, moves in the direction in which the liquid resin 30 is discharged (pushed out). When the moving speed is negative (less than 0), it means that the plunger 35 is pulled out to the outside of the syringe 28, that is, moved in the direction opposite to the direction in which the liquid resin 30 is discharged. And, because of this, the movement of the plunger 35 in the opposite direction to the discharge direction of the liquid resin 30 is referred to as "reverse suction". In addition, the vertical axis of the graph of FIG. 5( b) represents the flow rate of the liquid resin 30 measured by the flow sensor 100.

As shown in Fig. 5(a), the pushing speed of the plunger 35 remains constant for a constant time from the beginning to the end of pushing the plunger 35. Thus, as shown in FIG. 5(b), the flow rate of the liquid resin 30 is gradually increased and then the flow rate remains constant until the plunger 35 is pushed in. Then, as shown in (1), after the plunger 35 has been pushed in, the back sucking starts immediately. In addition, for example, the timing of the start of suction can be input to the control unit 22 in advance. Specifically, for example, the time required to discharge a predetermined amount of the liquid resin 30 is calculated based on the viscosity of the liquid resin 30 and the like. Then, based on the calculated time, the timing of the end of pushing in of the plunger 35 and the start of suction can be determined in advance and input to the control unit 22. Due to the reverse suction, as shown in (2), the flow rate of the liquid resin 30 is reduced to zero. The amount of suction in (1) may be input to the control unit 22 in advance, and the control unit 22 may also control the amount of suction according to the flow rate of the liquid resin 30 measured by the flow sensor 100. And, as shown in (3), when the flow rate of the liquid resin 30 is 0, the moving speed of the plunger 35 is set to 0 (that is, the plunger 35 is stopped). At this time, as shown in (4), the flow rate of the liquid resin 30 may become negative (backflow) due to suction. When this reverse flow continues beyond the predetermined flow rate, as shown in (5), the plunger 35 moves in the discharge direction of the liquid resin 35 again. And, as shown in (6), when the flow rate of the liquid resin 30 is 0, the moving speed of the plunger 35 is set to 0 (the plunger 35 is stopped) as shown in (7). Repeat (4)-(7) to make the moving speed of the plunger 35 and the flow rate of the liquid resin 30 approach zero. In theory, it is preferably 0, but it does not need to be 0. In practice, the value should be small enough within a range that does not cause problems. In addition, the movement of (3) to (7) can be based on the flow rate of the liquid resin 30 measured by the flow sensor 100, and the control unit 22 controls the backward suction of the plunger 35. In the present invention, controlling the suction of the plunger, for example, as shown in Fig. 5(b)(4) and Fig. 5(a)(5), also includes the step of pushing out the plunger to correct the excessive suction.

Next, referring to the graph of FIG. 6, an example of controlling the discharge amount of liquid resin after manual suction setting is shown. In the graphs of (a) and (b) of Fig. 6, the horizontal axis both indicate elapsed time. The vertical axis of the graph of Fig. 6(a) is the same as that of Fig. 5(a), and represents the moving speed of the plunger 35. In addition, the vertical axis of the graph of FIG. 6(b) represents the load torque value (hereinafter, simply referred to as "torque value") that the liquid resin 35 transmits to the servo motor 31 by the pressing plunger 35. The example of FIG. 6 shows the change of the movement speed and torque value of the plunger when the reverse suction is manually set, and only one reverse suction action is performed. In the suction setting of this example, while observing the discharge volume and discharge status, test discharge time, suction start timing, suction volume (plunger moving amount), suction speed (plunger moving speed), etc. , Visually judge the state of the liquid resin in the discharge port. In fact, the test discharge was repeated several times.

As shown in Fig. 6(a), the pushing speed of the plunger 35 is kept constant for a constant time from the beginning to the end of pushing the plunger 35. As a result, as shown in FIG. 6(b), the flow rate of the liquid resin 30 gradually increases and then remains constant until the plunger 35 is pushed in. So far, it is the same as in Figure 5.

In the example shown in Figure 6, as shown in Figure 6 (a) and (b), the backward suction is set in advance so that the torque value immediately after the plunger 35 is pushed is large, and whenever the torque value drops And when it is close to 0, suck back. Therefore, the liquid resin 30 will also continue to be discharged between the time the plunger 35 is pushed in and the suction starts. Therefore, the discharge amount of the liquid resin 30 may be excessive. Therefore, it is necessary to consider in advance the amount of the liquid resin 30 discharged between the end of the plunger 35 push-in and the start of the reverse suction, and determine the timing of the end of the plunger 35 pushing and the start of the reverse suction. In addition, if the concentration or the like of the liquid resin 30 changes according to the type of the liquid resin 30, the timing of the end of pushing in of the plunger 35 and the start of suction also changes. For these reasons, manual suction control must be skilled. Furthermore, the time between the end of the plunger 35 being pushed in and the start of sucking back is wasted, which may cause the work efficiency of discharging the liquid resin to decrease.

In this regard, according to the present invention, the control unit can automatically control the suction. Therefore, for example, as shown in FIG. 5, the suction is performed quickly, and precise control can be performed, and it is easy to suppress or prevent the problem of excessive discharge of the liquid resin. In addition, the graph of Fig. 5(b) uses a dotted line to show an example of manual control of the resin flow rate when suction is reversed. Compared with the example of the present invention (solid line), the present invention can easily suppress or prevent the problem of excessive discharge of liquid resin. In addition, the manual suction setting performed in the liquid resin discharge amount control described in FIG. 6 is not required.

In addition, the graphs in FIG. 5 and FIG. 6 are only examples and do not limit the present invention in any way.

In addition, in the present invention, the flow sensor for measuring the flow rate of the liquid resin is not particularly limited. For example, a well-known flow sensor or a conventional flow sensor can be used as appropriate. As the flow sensor that can be used in the present invention, for example, an ultrasonic flow sensor, a thermal type flow sensor, etc. can be cited, and an ultrasonic flow sensor is preferable. As an ultrasonic flow sensor that can be used in the present invention, for example, a clamp-on type flow sensor manufactured by Keyence Corporation, trade name "FD-X" series (trade name FD-XS1 , FD-XS8, FD-XS20) etc.

Using an ultrasonic flow sensor can measure the flow rate of a fluid in the following manner, for example. That is, first, sensors are provided at two points upstream and downstream of the fluid flow path, respectively. In addition, it is possible to measure the ultrasonic velocity from upstream to downstream and the ultrasonic velocity from downstream to upstream between the sensors at these two points. The ultrasonic wave from upstream to downstream is affected by the fluid velocity, and the ultrasonic velocity becomes faster. On the other hand, because the ultrasonic waves from downstream to upstream proceed against the flow of the fluid, the speed of the ultrasonic waves slows down. Therefore, by calculating the difference between the ultrasonic velocity from upstream to downstream and the ultrasonic velocity from downstream to upstream, it is possible to calculate the fluid flow rate based on this, and then to calculate the fluid flow rate. In addition, in the present invention, a liquid resin is used as the fluid, and the flow rate of the liquid resin can be measured (calculated).

According to the above measurement principle, in theory, the ultrasonic flow sensor can measure the flow of fluid without being affected by the temperature and viscosity of the fluid. Therefore, compared with a thermal flow sensor, the use of an ultrasonic flow sensor is easier to suppress or prevent the measurement error of the flow rate due to the temperature and viscosity of the fluid. In addition, if a clamp-type flow sensor that can be installed outside the pipe is used, it can be easily installed without cutting the pipe, and the flow can be measured without touching the liquid resin, and no washing is required.

Next, FIG. 2 is a plan view showing an example of the structure of the resin molding apparatus of the present invention. In addition, the cross-sectional view of FIG. 3 shows an example of the structure of a molding die (resin molding mechanism) of the resin molding apparatus of FIG. 2 and an example of a method of discharging (supplying) liquid resin from the molding die.

As shown in FIG. 2, the resin molding apparatus 1 includes a substrate supply and storage unit 2, four molding units 3A, 3B, 3C, 3D, and a supply unit 4 as constituent elements. The substrate supply and storage assembly 2, the molding assembly 3A to the molding assembly 3D, and the supply assembly 4 as the constituent elements can be attached to and detached from each other with respect to other constituent elements, and can be replaced.

The substrate supply and storage assembly 2 is provided with a pre-packaged substrate supply portion 6 for supplying the pre-packaged substrate 5 and a packaged substrate accommodating portion 8 for accommodating the packaged substrate 7. For example, a light emitting diode (Light Emitting Diode: LED) chip or the like is mounted on the pre-package substrate 5 as an optical element. The substrate supply and storage unit 2 is provided with a loader 9 and an unloader 10, and a rail 11 supporting the loader 9 and the unloader 10 is arranged in the X direction. The loader 9 and the unloader 10 can move along the rail 11 in the X direction.

The loader 9 and the unloader 10 supported by the rail 11 can move in the X direction between the substrate supply and storage unit 2, the respective forming units 3A, 3B, 3C, 3D, and the supply unit 4. The loader 9 is provided with a moving mechanism 12 for supplying the pre-package substrate 5 to the upper mold in each of the molding units 3A, 3B, 3C, and 3D. In each forming assembly, the moving mechanism 12 moves in the Y direction. The unloader 10 is provided with a moving mechanism 13 for receiving the packaged substrate 7 from the upper mold in each of the forming units 3A, 3B, 3C, and 3D. In each forming assembly, the moving mechanism 13 can move in the Y direction.

Each forming unit 3A, 3B, 3C, 3D is provided with a lower mold 14 that can be raised and lowered, and an upper mold disposed opposite to the lower mold 14 (not shown, see Fig. 3(a)). The upper mold and the lower mold 14 constitute a forming mold. The molding die composed of the upper mold and the lower mold 14 corresponds to the "resin molding mechanism" of the resin molding apparatus of the present invention. The upper mold and the lower mold 14 may each be part of the "resin molding mechanism". Each molding unit 3A, 3B, 3C, 3D has a mold clamping mechanism 15 for clamping and opening the upper mold and the lower mold 14. The cavity 16 is provided in the lower mold 14 as a space for accommodating and curing the liquid resin. The cavity 16 is on the lower mold 14, and is a receiving portion for containing liquid resin. The mold surface of the cavity 16 is covered with a release film 17.

The supply unit 4 is provided with a resin supply mechanism 18 that supplies liquid resin to the cavity 16. The resin supply mechanism 18 is supported by the rail 11 and can move in the X direction along the rail 11. The resin supply mechanism 18 is provided with a dispenser 19 as a liquid resin discharge mechanism. In each of the molding units 3A, 3B, 3C, and 3D, the dispenser 19 can be moved in the Y direction by the moving mechanism 20 to discharge the liquid resin into the cavity 16. The dispenser 19 shown in FIG. 1 is a single-liquid type dispenser using a liquid resin obtained by mixing a main agent and a curing agent in advance. As the main agent, for example, silicone resin, epoxy resin, etc. having thermosetting and translucency can be used.

The supply unit 4 is provided with a vacuuming mechanism 21. Immediately before the upper mold and the lower mold 14 are clamped in each of the molding assemblies 3A, 3B, 3C, and 3D, the vacuum mechanism 21 can forcibly suck air from the cavity 16 and discharge air. The supply unit 4 is provided with a control unit 22 for controlling the overall operation of the resin molding apparatus 1. In FIG. 2, the vacuuming mechanism 21 and the control unit 22 are provided in the supply unit 4. However, the present invention is not limited to this. For example, the vacuuming mechanism 21 and the control unit 22 may be provided in other components.

Next, referring to FIGS. 2 and 3, a mechanism for the resin supply mechanism 18 to supply the liquid resin 30 (see FIG. 3) to the cavity 16 provided in the lower mold 14 will be described. In addition, Fig. 3(a) is a cross-sectional view, and Fig. 3(b) is a plan view. In addition, the liquid resin 30 is not particularly limited, and may be, for example, a liquid resin that is liquid at room temperature. In addition, as the liquid resin 30, for example, a molten resin produced by melting a solid resin material at room temperature may be used. Both liquid resin and molten resin are a form of liquid resin. Liquid resin is a form of fluid material.

In each of the forming units 3A, 3B, 3C, and 3D in FIG. 2, as shown in FIG. 3(a), an upper mold 23, a lower mold 14, and a film pressing member 24 are provided. The upper mold 23 and the lower mold 14 constitute a molding die (resin molding mechanism) as described above. The molding units 3A, 3B, 3C, and 3D each have a mold clamping mechanism 15 (see FIG. 2) for clamping and opening the molding mold.

As shown in FIG. 3(a), the mold release film 17 covers the mold surface of the cavity 16 and the surrounding mold surface. The film pressing member 24 is a member for pressing and fixing the release film 17 on the mold surface of the lower mold 14 around the cavity 16. The film pressing member 24 has an opening in the center, and the molding die is located inside the opening. In the upper mold 23, for example, the pre-package substrate 5 on which the LED chip 25 and the like are mounted is fixedly arranged by suction or clamping. An independent mold cavity 26 corresponding to each LED chip 25 is provided inside the mold cavity 16.

As shown in the figure, the release film 17 is supplied so as to cover the entire surface of the cavity 16. The release film 17 is heated by a heater (not shown) provided in the lower mold 14. The release film 17 after heating is softened and stretched. Around the cavity 16, the softened release film 17 is pressed and fixed to the mold surface of the lower mold 14 by the film pressing member 24. The softened release film 17 is adsorbed along the mold surface of each independent cavity 26. In addition, FIG. 3(a) shows a case where the film pressing member 24 is used. The present invention is not limited to this, and the release film 17 and the film pressing member 24 may not be used.

As shown in FIG. 1, the dispenser 19 has a delivery mechanism 27 that delivers a predetermined amount of the liquid resin 30, a syringe 28 that stores (accommodates) the liquid resin 30, and a nozzle 29 that discharges the liquid resin 30. In the dispenser 19, the delivery mechanism 27, the syringe 28, and the nozzle 29 are connected and constituted as one body. Therefore, the respective constituent elements (the delivery mechanism 27, the syringe 28, and the nozzle 29) can be attached to and detached from each other, and the constituent element units can be replaced with the same and different constituent units. For example, the liquid resin 30 having different materials and different viscosities can be stored in a plurality of syringes 28 in advance, and the required syringes 28 can be installed in the dispenser 19 and used according to the product. Furthermore, it is possible to select and use syringes 28 with different capacities.

By replacing the nozzle 29, the direction in which the liquid resin 30 is discharged can be set to any direction such as directly below, front side, and diagonally below. Furthermore, the diameter of the discharge port of the nozzle 29 can be changed in accordance with the viscosity of the liquid resin 30. In addition, a static mixer can be provided between the syringe 28 and the nozzle 29. For example, even when a phosphor or the like is added as an additive to the liquid resin 30, by stirring the liquid resin 30 with a static mixer, the liquid resin 30 can be discharged in a uniform state without precipitation of the phosphor. .

The dispenser 19 can also move in the up and down direction (Z direction). It is possible to make the distributor 19 shown in Figure 3 (a) and (b) in the vertical plane (in the plane containing the Y axis and Z axis) or in the horizontal plane (in the plane containing the X axis and Y axis) with a certain One point is the center and reciprocates with partial rotation. In this case, the tip portion of the dispenser 19 reciprocates so as to draw a part of the arc.

Next, referring to FIGS. 2 and 3, the operation of the resin molding apparatus 1 in the case of using the molding unit 3C will be described. This method is an example of the method of manufacturing a resin molded article of the present invention using the resin molding apparatus 1. First, for example, the pre-package substrate 5 on which the LED chip 25 is mounted is transferred from the pre-package substrate supply unit 6 to the loader 9 so that the surface on which the LED chip 25 is mounted faces downward. Next, the loader 9 is moved from the substrate supply and storage unit 2 along the rail 11 in the +X direction to the forming unit 3C.

Next, in the forming unit 3C, the moving mechanism 12 is used to move the loader 9 in the -Y direction to a predetermined position between the lower mold 14 and the upper mold 23 (see FIG. 3(a)). The package front substrate 5 with the surface of the LED chip 25 mounted on the lower side is fixed to the lower surface of the upper mold 23 by suction or clamping. After the substrate 5 before packaging is placed on the lower surface of the upper mold, the loader 9 is moved to the original position of the substrate supply and storage assembly 2.

Next, the resin supply mechanism 18 is used to move the distributor 19 from the standby position of the supply assembly 4 along the rail 11 to the molding assembly 3C in the -X direction. Thus, the resin supply mechanism 18 is moved to a predetermined position near the lower mold 14 of the molding unit 3C. The moving mechanism 20 is used to move the distributor 19 to a predetermined position above the lower mold 14.

Next, as shown in (a) and (b) of FIG. 3, the liquid resin 30 is discharged from the nozzle 29 of the distributor 19. Specifically, the liquid resin 30 is discharged from the nozzle 29 of the distributor 19 toward the cavity 16 provided in the lower mold 14. Thus, the liquid resin 30 is supplied to the cavity 16.

Next, after the liquid resin 30 is supplied into the cavity 16, the moving mechanism 20 is used to retreat the dispenser 19 to the resin supply mechanism 18. The resin supply mechanism 18 is moved to the original standby position of the supply unit 4.

Next, in the molding unit 3C, the lower mold 14 is raised using the mold clamping mechanism 15 to clamp the upper mold 23 and the lower mold 14. By clamping the mold, the LED chip 25 mounted on the substrate 5 before packaging is immersed in the liquid resin 30 supplied to the cavity 16. At this time, a cavity bottom surface member (not shown) provided in the lower mold 14 can be used to apply a predetermined resin pressure to the liquid resin 30 in the cavity 16.

In addition, in the process of clamping the mold, the vacuum mechanism 21 may also be used to suck the inside of the cavity 16. As a result, air remaining in the cavity 16 and air bubbles contained in the liquid resin 30 are discharged to the outside of the molding die. Furthermore, the inside of the cavity 16 is set to a predetermined degree of vacuum.

Next, a heater (not shown) provided in the lower mold 14 is used to heat the liquid resin 30 for the time required for curing the liquid resin 30. Thus, the liquid resin 30 is cured to form a cured resin. Thereby, the LED chip 25 mounted on the pre-encapsulation substrate 5 is resin-encapsulated with the cured resin formed corresponding to the shape of the cavity 16. After the liquid resin 30 is cured, the mold clamping mechanism 15 is used to mold the upper mold 23 and the lower mold 14.

Next, the loader 9 is evacuated to an appropriate position where the unloader 10 is not prevented from moving to the forming unit 3C. For example, the loader 9 is retracted from the substrate supply and storage unit 2 to an appropriate position of the molding unit 3D or the supply unit 4. Then, the unloader 10 is moved from the substrate supply and storage unit 2 along the rail 11 in the +X direction to the forming unit 3C.

Next, in the molding unit 3C, after the moving mechanism 13 is moved in the -Y direction to a predetermined position between the lower mold 14 and the upper mold 23, the moving mechanism 13 receives the packaged substrate (resin molded product) from the upper mold 23 7. After receiving the packaged substrate 7, the moving mechanism 13 is returned to the unloader 10. The unloader 10 is returned to the substrate supply and accommodating assembly 2 to accommodate the packaged substrate 7 in the packaged substrate accommodating section 8. At this point in time, the resin encapsulation of the first pre-packaged substrate 5 is completed, and the first packaged substrate 7 is completed. Since this method is a method of manufacturing the packaged substrate 7 as a resin molded product, as described above, it can be said to be an example of the method for manufacturing a resin molded product of the present invention using the resin molding apparatus 1.

Next, the loader 9 retracted to an appropriate position of the forming unit 3D or the supply unit 4 is moved to the substrate supply and storage unit 2. The next pre-package substrate 5 is delivered from the pre-package substrate supply unit 6 to the loader 9. The resin encapsulation is repeated as described above.

The control unit 22 controls the supply of the substrate 5 before packaging, the movement of the resin supply mechanism 18 and the distributor 19, the discharge of the liquid resin 30, the clamping and opening of the upper mold 23 and the lower mold 14, and the accommodation of the packaged substrate 7 .

In addition, when it is determined that the discharge state of the dispenser 19 is abnormal in a specific molding unit, the control unit 22 may issue an alarm indicating that the operation of the molding unit is abnormal. As a result, the operator can perform appropriate measures such as temporarily stopping the molding assembly. The control unit 22 may stop the operation of the forming unit.

In addition, for example, the syringe 28 or nozzle 29 can be replaced with a different syringe 28 or nozzle 29 in the dispenser 19. By replacing the syringe 28 or the nozzle 29, the liquid resin 30 with different materials and different viscosities can be used separately according to the product.

According to this embodiment, as described above, the control unit 22 controls the movement of the plunger 35 and controls the back suction of the plunger 35 based on the flow rate of the liquid resin 30 measured by the flow sensor 100. Thus, for example, even when liquid resins 30 with different materials and different viscosities are used, it is possible to maintain a constant discharge amount of the liquid resin 30 within a predetermined time. Thus, for example, even if the material and viscosity of the liquid resin 30 are different, the production efficiency of the resin molding apparatus 1 can be stabilized. Furthermore, for example, the diameter of the discharge port 41 of the nozzle 29 can be optimized in accordance with the viscosity of the liquid resin 30. Therefore, while the dispenser 19 can be constructed very simply, the most suitable liquid resin 30 can also be used according to the product.

In addition, as described above, the resin molding apparatus 1 of the present embodiment functions as a liquid resin 30 discharge device. In other words, the resin molding device 1 corresponds to a discharge device for the liquid resin 30. In addition, the dispenser 19 functions as a discharge mechanism of the liquid resin 30 as described above. In other words, the distributor 19 is a discharge mechanism that discharges the liquid resin 30, and corresponds to the "resin discharge mechanism" of the present invention.

In addition, FIG. 4 shows an example of a modification of this embodiment. 4 is a cross-sectional view showing only the distributor 19, that is, a part of the resin discharge mechanism and the flow sensor 100. More specifically, FIG. 4 only shows the tip portion of the syringe 28 and the plunger 35, the nozzle 29 and the discharge port 41, the liquid resin 30 in the syringe 28 and the nozzle 29, and the flow rate near the discharge port 41 installed in the nozzle 29感器100。 Sensor 100. As shown in the figure, this resin discharge mechanism is the same as the dispenser 19 of FIG. 1 except that the nozzle 29 has a long length, is flexible, and can be deformed (soft). In addition, in the resin molding apparatus of FIG. 4, parts not shown in the figure are the same as those in FIGS. 1-3.

The configuration of FIG. 4 has the following advantages, for example. In the prior art, when only the nozzle is lengthened, the reactivity of suction becomes worse. However, in this modification, because an ultrasonic sensor is installed near the discharge port, it is possible to control suction by using flow rate information near the discharge port. Therefore, since the nozzle can be extended and the syringe can be arranged in an empty space, the capacity of the syringe 28 can be increased. The capacity of the syringe 28 is not particularly limited. For example, it can be a large capacity of 20 ounces (530 mL) or more. In addition, because the nozzle 29 is long in length and flexible and can be deformed, the tip of the nozzle 29 and the syringe 28 can move independently of each other. That is, the freedom of movement of the tip of the nozzle 29 is high. Therefore, for example, after the liquid resin 30 is discharged, the tip of the nozzle 29 moves, so that the residual liquid resin 30 adhering to the discharge port 41 can be dropped from the discharge port 41.

In this embodiment, examples of the resin molding apparatus and resin molding method used when resin encapsulating LED chips are listed and described. But the present invention is not limited to this. For example, resin-encapsulated objects can also be semiconductor chips such as ICs and transistors, or they can be passive components. The present invention can also be applied when resin-encapsulating one or a plurality of electronic components mounted on a substrate such as a printed circuit board and a ceramic substrate.

Furthermore, the present invention is not limited to the case of resin encapsulation of electronic components, and the present invention can be applied when manufacturing optical components such as lenses, optical elements, and light guide plates by resin molding, when manufacturing ordinary resin molded products, and the like.

In addition, for example, there is a two-component resin material in which two liquid resins composed of a main agent and a curing agent are mixed in a certain ratio when actually performing resin molding. The present invention can also be applied to a resin molding apparatus using a two-component resin material.

In addition, in this embodiment, a resin molding apparatus and a resin molding method using compression molding have been described. But the present invention is not limited to this. For example, the present invention can also be applied to a resin molding apparatus and a resin molding method using transfer film molding. In this case, for example, to a resin accommodating portion formed by a cylindrical space provided in a molding die (a lift member called a plunger is arranged below, and is usually a portion that accommodates a resin material made of solid resin, called For the bowl) discharge the liquid resin. In this case, the above-mentioned bowl corresponds to a resin container that contains liquid resin.

In this embodiment, an example of discharging liquid resin into the cavity provided in the lower mold is described, but the present invention is not limited to this. For example, it may be in the space including the upper surface of the substrate and the space including the wafers (semiconductor wafers, passive component wafers and other electronic components wafers) mounted on the upper surface of the substrate to mount on the substrate The liquid resin is discharged from the surface covered by the wafer. In addition, for example, in a space containing the upper surface of a semiconductor substrate such as a silicon wafer, the liquid resin may be discharged so as to cover functional parts such as a semiconductor circuit formed on the semiconductor substrate. In addition, for example, the liquid resin may be discharged in the space containing the upper surface of the film that should be finally accommodated in the cavity of the forming mold. The space is, for example, a recess formed by recessing the film. The liquid resin is discharged to the recess formed by recessing the film. Examples of the purpose of the film include the transfer of a shape formed by unevenness on the surface of the film, the transfer of a pattern previously formed on the film, and the like in order to improve the releasability. An appropriate transport mechanism is used to transport the liquid resin contained in the recess of the film together with the film, and finally the liquid resin is contained in the cavity of the molding die. In either case, the liquid resin discharged from the space may be finally accommodated in the cavity of the molding die, and solidified in the cavity after the molding die is closed. In either case, for example, the liquid resin can be discharged from the outside of the opposing pair of forming dies to the accommodating part, and the components including at least the accommodating part can be transported between the forming dies.

In this embodiment, four forming modules 3A, 3B, 3C, and 3D are arranged in the X direction between the substrate supply and storage module 2 and the supply module 4. It is also possible to form the substrate supply and storage unit 2 and the supply unit 4 into a single unit, and to install one molding unit 3A in the X direction in this unit. In addition, the molding unit 3A may be mounted to this one unit in a row along the X direction, and the other molding unit 3B may be mounted to the molding unit 3A.

In addition, the present invention is not limited to the above-mentioned embodiments, and the above-mentioned respective embodiments can be arbitrarily and appropriately combined, changed or selectively adopted as needed within the scope not departing from the gist of the present invention.

This application claims priority based on Japanese Patent Application No. 2019-031057 filed on February 22, 2019. The entire content of the Japanese patent application is incorporated herein by reference.

1: Resin molding device 2: Substrate supply and storage unit 3A, 3B, 3C, 3D: forming components 4: Supply components 5: Package front substrate 6: Substrate supply part before packaging 7: Packaged substrate (resin molded product) 8: Packaged substrate housing part 9: Loader 10: Unloader 11: Orbit 12, 13, 20: mobile mechanism 14: Lower mold of forming mold (resin forming mechanism) 15: Clamping mechanism 16: mold cavity 17: Release film 18: Resin supply mechanism 19: Distributor (resin discharge mechanism) 21: Vacuum mechanism 22: Control Department 23: Upper mold of forming mold (resin forming mechanism) 24: Membrane pressing member 25: LED chip 26: Independent cavity 27: Sending organization 28: Syringe (resin containing part) 29: Nozzle (discharge part) 30: Liquid resin 31: Servo motor (rotating mechanism) 32: Round head screw (rotating shaft) 33: Slider (direct moving part) 34: Rod 35: Plunger (moving part) 36: Round head screw bearing 37: Anti-vibration member 38: Rail 39: Encoder (Detection Department) 40: Screws for syringe installation 41: Outlet 100: Flow sensor

1 is a cross-sectional view schematically showing an example of the structure of a resin discharge mechanism, a flow sensor, and a control part in a resin molding apparatus of the present invention.

Fig. 2 is a plan view showing an example of the structure of the resin molding apparatus of the present invention including the resin discharge mechanism, flow sensor, and control section of Fig. 1.

FIG. 3 is a schematic diagram showing an example in which resin is discharged by the resin discharge mechanism of FIG. 1. Fig. 3(a) is a cross-sectional view, and Fig. 3(b) is a plan view.

Fig. 4 is a cross-sectional view schematically showing a part of a modification of the resin discharge mechanism of Fig. 1.

FIG. 5 is a graph showing an example of control of the discharge amount of liquid resin in the resin molding apparatus and resin molded product manufacturing method of the present invention.

Fig. 6 is a graph showing an example of control of the discharge amount of liquid resin after manual setting of the back suction.

19: Distributor (resin discharge mechanism)

22: Control Department

27: Sending organization

28: Syringe (resin containing part)

29: Nozzle (discharge part)

30: Liquid resin

31: Servo motor (rotating mechanism)

32: Round head screw (rotating shaft)

33: Slider (direct moving part)

34: Rod

35: Plunger (moving part)

36: Round head screw bearing

37: Anti-vibration member

38: Rail

39: Encoder (Detection Department)

40: Screws for syringe installation

41: Outlet

100: Flow sensor

Claims (6)

A resin molding device comprising: Resin discharge mechanism; flow sensor; resin molding mechanism; and control unit, The resin discharge mechanism includes a plunger and a resin accommodating portion capable of accommodating liquid resin, and has a discharge port for discharging the liquid resin, The resin discharge mechanism discharges the liquid resin contained in the resin accommodating portion from the discharge port by the movement of the plunger, The flow sensor is mounted on the resin discharge mechanism, The flow rate sensor measures the flow rate of the liquid resin, The resin molding mechanism uses the liquid resin discharged from the resin discharge mechanism to perform resin molding, While controlling the movement of the plunger, the control unit controls the back suction of the plunger based on the flow rate of the liquid resin measured by the flow sensor. The resin molding apparatus according to claim 1, wherein after the movement of the plunger for discharging the liquid resin is stopped, the control unit controls the back suction of the plunger so that the flow rate of the liquid resin is close to 0 . The resin molding apparatus according to claim 2, wherein the back suction of the plunger can be performed at least twice. The resin molding apparatus according to any one of claims 1 to 3, wherein the aforementioned flow sensor is an ultrasonic flow sensor. The resin molding apparatus according to any one of claims 1 to 3, wherein the flow sensor is provided between the discharge port side end of the resin storage portion and the discharge port. A method of manufacturing a resin molded product, which includes the following steps: In the resin discharge step, the liquid resin is discharged from the resin discharge mechanism; and The resin molding step uses the discharged liquid resin to perform resin molding, In the resin discharge step, the flow rate of the liquid resin is measured using a flow sensor installed in the resin discharge mechanism, and based on the measured flow rate, the back suction of the resin discharge mechanism is controlled.

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