USD1098057S1 - Susceptor cover - Google Patents
Susceptor coverInfo
- Publication number
- USD1098057S1 USD1098057S1 US29/888,138 US202329888138F USD1098057S US D1098057 S1 USD1098057 S1 US D1098057S1 US 202329888138 F US202329888138 F US 202329888138F US D1098057 S USD1098057 S US D1098057S
- Authority
- US
- United States
- Prior art keywords
- susceptor cover
- susceptor
- cover
- view
- elevational view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Description
Claims (1)
- The ornamental design for a susceptor cover as shown and described.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022-022681D | 2022-10-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD1098057S1 true USD1098057S1 (en) | 2025-10-14 |
Family
ID=
Citations (83)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4978567A (en) * | 1988-03-31 | 1990-12-18 | Materials Technology Corporation, Subsidiary Of The Carbon/Graphite Group, Inc. | Wafer holding fixture for chemical reaction processes in rapid thermal processing equipment and method for making same |
| US5304248A (en) * | 1990-12-05 | 1994-04-19 | Applied Materials, Inc. | Passive shield for CVD wafer processing which provides frontside edge exclusion and prevents backside depositions |
| US5584936A (en) * | 1995-12-14 | 1996-12-17 | Cvd, Incorporated | Susceptor for semiconductor wafer processing |
| US5840124A (en) * | 1997-06-30 | 1998-11-24 | Emcore Corporation | Wafer carrier with flexible wafer flat holder |
| USD404370S (en) * | 1997-08-20 | 1999-01-19 | Tokyo Electron Limited | Cap for use in a semiconductor wafer heat processing apparatus |
| US6214122B1 (en) * | 1997-03-17 | 2001-04-10 | Motorola, Inc. | Rapid thermal processing susceptor |
| US20030085223A1 (en) * | 2001-09-28 | 2003-05-08 | Neilson Zeng | Patterned microwave susceptor element and microwave container incorporating same |
| US20040011293A1 (en) * | 2002-07-16 | 2004-01-22 | International Business Machines Corporation | Susceptor pocket with beveled projection sidewall |
| US6815352B1 (en) * | 1999-11-09 | 2004-11-09 | Shin-Etsu Chemical Co., Ltd. | Silicon focus ring and method for producing the same |
| US20050152089A1 (en) * | 2003-12-26 | 2005-07-14 | Ngk Insulators, Ltd. | Electrostatic chuck and manufacturing method for the same, and alumina sintered member and manufacturing method for the same |
| US20050217585A1 (en) * | 2004-04-01 | 2005-10-06 | Blomiley Eric R | Substrate susceptor for receiving a substrate to be deposited upon |
| US20050223994A1 (en) * | 2004-04-08 | 2005-10-13 | Blomiley Eric R | Substrate susceptors for receiving semiconductor substrates to be deposited upon and methods of depositing materials over semiconductor substrates |
| US20050284372A1 (en) * | 2004-06-28 | 2005-12-29 | Applied Materials, Inc. | Chamber component having grooved surface with depressions |
| US20060057826A1 (en) * | 2002-12-09 | 2006-03-16 | Koninklijke Philips Electronics N.V. | System and method for suppression of wafer temperature drift in cold-wall cvd systems |
| US20070144442A1 (en) * | 2005-12-22 | 2007-06-28 | Kyocera Corporation | Susceptor |
| USD548705S1 (en) * | 2005-09-29 | 2007-08-14 | Tokyo Electron Limited | Attracting disc for an electrostatic chuck for semiconductor production |
| USD557226S1 (en) * | 2005-08-25 | 2007-12-11 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
| USD559994S1 (en) * | 2005-03-30 | 2008-01-15 | Tokyo Electron Limited | Cover ring |
| USD559993S1 (en) * | 2005-03-30 | 2008-01-15 | Tokyo Electron Limited | Cover ring |
| US7459057B2 (en) * | 1998-05-15 | 2008-12-02 | Applied Materials, Inc. | Substrate retainer |
| US20090050272A1 (en) * | 2007-08-24 | 2009-02-26 | Applied Materials, Inc. | Deposition ring and cover ring to extend process components life and performance for process chambers |
| US20090269490A1 (en) * | 2008-04-25 | 2009-10-29 | Yoshikazu Moriyama | Coating apparatus and coating method |
| US20100044974A1 (en) * | 2008-08-19 | 2010-02-25 | Lam Research Corporation | Edge rings for electrostatic chucks |
| US20100098519A1 (en) * | 2008-10-17 | 2010-04-22 | Memc Electronic Materials, Inc. | Support for a semiconductor wafer in a high temperature environment |
| USD646764S1 (en) * | 2010-11-04 | 2011-10-11 | Faster S.P.A. | Sealing gasket |
| US20120263569A1 (en) * | 2011-04-14 | 2012-10-18 | Scott Wayne Priddy | Substrate holders and methods of substrate mounting |
| US20140113458A1 (en) * | 2012-10-24 | 2014-04-24 | Applied Materials, Inc. | Minimal contact edge ring for rapid thermal processing |
| USD709537S1 (en) * | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring |
| USD709538S1 (en) * | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring |
| USD709536S1 (en) * | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring |
| USD709539S1 (en) * | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring |
| US20140262193A1 (en) * | 2013-03-13 | 2014-09-18 | Techest Co., Ltd. | Edge ring cooling module for semi-conductor manufacture chuck |
| US20150041314A1 (en) * | 2012-03-29 | 2015-02-12 | Kyocera Corporation | Annular member and film-forming device in which same is used |
| USD724553S1 (en) * | 2013-09-13 | 2015-03-17 | Asm Ip Holding B.V. | Substrate supporter for semiconductor deposition apparatus |
| US20150368829A1 (en) * | 2014-06-23 | 2015-12-24 | Applied Materials, Inc. | Substrate thermal control in an epi chamber |
| US20160083840A1 (en) * | 2014-09-24 | 2016-03-24 | Applied Materials, Inc. | Graphite susceptor |
| US20160133504A1 (en) * | 2014-11-12 | 2016-05-12 | Applied Materials, Inc. | Susceptor design to reduce edge thermal peak |
| US9376752B2 (en) * | 2012-04-06 | 2016-06-28 | Applied Materials, Inc. | Edge ring for a deposition chamber |
| US20160240398A1 (en) * | 2015-02-12 | 2016-08-18 | Hermes-Epitek Corporation | Wafer Holder |
| USD767234S1 (en) * | 2015-03-02 | 2016-09-20 | Entegris, Inc. | Wafer support ring |
| USD770992S1 (en) * | 2015-06-12 | 2016-11-08 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
| USD783922S1 (en) * | 2014-12-08 | 2017-04-11 | Entegris, Inc. | Wafer support ring |
| US20170117228A1 (en) * | 2015-10-27 | 2017-04-27 | Siltronic Ag | Susceptor for holding a semiconductor wafer having an orientation notch, a method for depositing a layer on a semiconductor wafer, and semiconductor wafer |
| USD796012S1 (en) * | 2015-02-26 | 2017-08-29 | Toyoda Gosei Co., Ltd. | Gasket |
| USD810705S1 (en) * | 2016-04-01 | 2018-02-20 | Veeco Instruments Inc. | Self-centering wafer carrier for chemical vapor deposition |
| US20180144969A1 (en) * | 2016-11-18 | 2018-05-24 | Applied Materials, Inc. | Hybrid substrate carrier |
| US20180155838A1 (en) * | 2016-12-03 | 2018-06-07 | Applied Materials, Inc. | Process kit design for in-chamber heater and wafer rotating mechanism |
| USD830981S1 (en) * | 2017-04-07 | 2018-10-16 | Asm Ip Holding B.V. | Susceptor for semiconductor substrate processing apparatus |
| USD840364S1 (en) * | 2017-01-31 | 2019-02-12 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
| USD861757S1 (en) * | 2015-12-28 | 2019-10-01 | Ntn Corporation | Inner ring for tapered roller bearing |
| USD870314S1 (en) * | 2017-08-31 | 2019-12-17 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
| USD871609S1 (en) * | 2017-08-31 | 2019-12-31 | Hitachi High-Technologies Corporation | Electrode plate peripheral ring for a plasma processing apparatus |
| USD876504S1 (en) * | 2017-04-03 | 2020-02-25 | Asm Ip Holding B.V. | Exhaust flow control ring for semiconductor deposition apparatus |
| USD888903S1 (en) * | 2018-12-17 | 2020-06-30 | Applied Materials, Inc. | Deposition ring for physical vapor deposition chamber |
| US20210066113A1 (en) * | 2017-09-07 | 2021-03-04 | Showa Denko K.K. | Susceptor, cvd apparatus, and method for manufacturing epitaxial wafer |
| US20210202294A1 (en) * | 2019-12-26 | 2021-07-01 | Showa Denko K.K. | Susceptor |
| US20210225688A1 (en) * | 2020-01-21 | 2021-07-22 | Asm Ip Holding B.V. | Susceptor with sidewall humps for uniform deposition |
| USD933725S1 (en) * | 2019-02-08 | 2021-10-19 | Applied Materials, Inc. | Deposition ring for a substrate processing chamber |
| USD933619S1 (en) * | 2018-10-12 | 2021-10-19 | Valqua, Ltd. | Seal member for semiconductor production apparatus |
| US20210375663A1 (en) * | 2018-10-04 | 2021-12-02 | Toyo Tanso Co., Ltd. | Susceptor |
| US20210375591A1 (en) * | 2018-04-20 | 2021-12-02 | Lam Research Corporation | Edge exclusion control |
| US20220013337A1 (en) * | 2020-07-08 | 2022-01-13 | Taiwan Semiconductor Manufacturing Company Limited | Plasma etcher edge ring with a chamfer geometry and impedance design |
| JP1711120S (en) | 2021-10-22 | 2022-03-29 | Suceptor cover | |
| JP1711119S (en) | 2021-10-22 | 2022-03-29 | Susceptoring | |
| USD948463S1 (en) * | 2018-10-24 | 2022-04-12 | Asm Ip Holding B.V. | Susceptor for semiconductor substrate supporting apparatus |
| US20220246462A1 (en) * | 2019-04-16 | 2022-08-04 | Tokai Carbon Korea Co., Ltd | Sic edge ring |
| US11469118B2 (en) * | 2017-06-13 | 2022-10-11 | Ngk Insulators, Ltd. | Member for semiconductor manufacturing apparatus |
| US20220361300A1 (en) * | 2021-05-10 | 2022-11-10 | The Boeing Company | Induction-heating system including a susceptor for generating induction heating below a selected curie temperature |
| US20220380263A1 (en) * | 2020-02-12 | 2022-12-01 | Skc Solmics Co., Ltd. | Ceramic component and plasma etching apparatus comprising same |
| US20220399190A1 (en) * | 2021-06-10 | 2022-12-15 | Ngk Insulators, Ltd. | Focus ring placement table |
| USD992615S1 (en) * | 2018-12-07 | 2023-07-18 | Tokyo Electron Limited | Focus ring |
| USD992614S1 (en) * | 2018-12-06 | 2023-07-18 | Tokyo Electron Limited | Focus ring |
| USD1016761S1 (en) * | 2020-12-10 | 2024-03-05 | Nuflare Technology, Inc. | Top plate for semiconductor manufacturaing equipment |
| US20240145281A1 (en) * | 2022-10-27 | 2024-05-02 | Applied Materials, Inc. | Detection and analysis of substrate support and pre-heat ring in a process chamber via imaging |
| USD1034493S1 (en) * | 2022-11-25 | 2024-07-09 | Ap Systems Inc. | Chamber wall liner for a semiconductor manufacturing apparatus |
| USD1034491S1 (en) * | 2020-07-27 | 2024-07-09 | Applied Materials, Inc. | Edge ring |
| US20240258154A1 (en) * | 2023-02-01 | 2024-08-01 | Asm Ip Holding B.V. | Method, assembly and system for film deposition and control |
| USD1038049S1 (en) * | 2020-11-18 | 2024-08-06 | Applied Materials, Inc. | Cover ring for use in semiconductor processing chamber |
| US20240282618A1 (en) * | 2023-02-20 | 2024-08-22 | Kioxia Corporation | Jig, semiconductor manufacturing apparatus, and method of operating semiconductor manufacturing apparatus |
| USD1040304S1 (en) * | 2018-12-17 | 2024-08-27 | Applied Materials, Inc. | Deposition ring for physical vapor deposition chamber |
| USD1049067S1 (en) * | 2022-04-04 | 2024-10-29 | Applied Materials, Inc. | Ring for an anti-rotation process kit for a substrate processing chamber |
| USD1053230S1 (en) * | 2022-05-19 | 2024-12-03 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
| USD1069054S1 (en) * | 2022-08-08 | 2025-04-01 | As America, Inc. | Gasket |
Patent Citations (87)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4978567A (en) * | 1988-03-31 | 1990-12-18 | Materials Technology Corporation, Subsidiary Of The Carbon/Graphite Group, Inc. | Wafer holding fixture for chemical reaction processes in rapid thermal processing equipment and method for making same |
| US5304248A (en) * | 1990-12-05 | 1994-04-19 | Applied Materials, Inc. | Passive shield for CVD wafer processing which provides frontside edge exclusion and prevents backside depositions |
| US5584936A (en) * | 1995-12-14 | 1996-12-17 | Cvd, Incorporated | Susceptor for semiconductor wafer processing |
| US6214122B1 (en) * | 1997-03-17 | 2001-04-10 | Motorola, Inc. | Rapid thermal processing susceptor |
| US5840124A (en) * | 1997-06-30 | 1998-11-24 | Emcore Corporation | Wafer carrier with flexible wafer flat holder |
| USD404370S (en) * | 1997-08-20 | 1999-01-19 | Tokyo Electron Limited | Cap for use in a semiconductor wafer heat processing apparatus |
| US7459057B2 (en) * | 1998-05-15 | 2008-12-02 | Applied Materials, Inc. | Substrate retainer |
| US6815352B1 (en) * | 1999-11-09 | 2004-11-09 | Shin-Etsu Chemical Co., Ltd. | Silicon focus ring and method for producing the same |
| US20030085223A1 (en) * | 2001-09-28 | 2003-05-08 | Neilson Zeng | Patterned microwave susceptor element and microwave container incorporating same |
| US20040011293A1 (en) * | 2002-07-16 | 2004-01-22 | International Business Machines Corporation | Susceptor pocket with beveled projection sidewall |
| US20060057826A1 (en) * | 2002-12-09 | 2006-03-16 | Koninklijke Philips Electronics N.V. | System and method for suppression of wafer temperature drift in cold-wall cvd systems |
| US20050152089A1 (en) * | 2003-12-26 | 2005-07-14 | Ngk Insulators, Ltd. | Electrostatic chuck and manufacturing method for the same, and alumina sintered member and manufacturing method for the same |
| US20050217585A1 (en) * | 2004-04-01 | 2005-10-06 | Blomiley Eric R | Substrate susceptor for receiving a substrate to be deposited upon |
| US20050223994A1 (en) * | 2004-04-08 | 2005-10-13 | Blomiley Eric R | Substrate susceptors for receiving semiconductor substrates to be deposited upon and methods of depositing materials over semiconductor substrates |
| US20050284372A1 (en) * | 2004-06-28 | 2005-12-29 | Applied Materials, Inc. | Chamber component having grooved surface with depressions |
| USD559994S1 (en) * | 2005-03-30 | 2008-01-15 | Tokyo Electron Limited | Cover ring |
| USD559993S1 (en) * | 2005-03-30 | 2008-01-15 | Tokyo Electron Limited | Cover ring |
| USD557226S1 (en) * | 2005-08-25 | 2007-12-11 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
| USD548705S1 (en) * | 2005-09-29 | 2007-08-14 | Tokyo Electron Limited | Attracting disc for an electrostatic chuck for semiconductor production |
| US20070144442A1 (en) * | 2005-12-22 | 2007-06-28 | Kyocera Corporation | Susceptor |
| US20090050272A1 (en) * | 2007-08-24 | 2009-02-26 | Applied Materials, Inc. | Deposition ring and cover ring to extend process components life and performance for process chambers |
| US20090269490A1 (en) * | 2008-04-25 | 2009-10-29 | Yoshikazu Moriyama | Coating apparatus and coating method |
| US20100044974A1 (en) * | 2008-08-19 | 2010-02-25 | Lam Research Corporation | Edge rings for electrostatic chucks |
| US20100098519A1 (en) * | 2008-10-17 | 2010-04-22 | Memc Electronic Materials, Inc. | Support for a semiconductor wafer in a high temperature environment |
| USD646764S1 (en) * | 2010-11-04 | 2011-10-11 | Faster S.P.A. | Sealing gasket |
| US20120263569A1 (en) * | 2011-04-14 | 2012-10-18 | Scott Wayne Priddy | Substrate holders and methods of substrate mounting |
| USD709536S1 (en) * | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring |
| USD709537S1 (en) * | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring |
| USD709538S1 (en) * | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring |
| USD709539S1 (en) * | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring |
| US20150041314A1 (en) * | 2012-03-29 | 2015-02-12 | Kyocera Corporation | Annular member and film-forming device in which same is used |
| US9376752B2 (en) * | 2012-04-06 | 2016-06-28 | Applied Materials, Inc. | Edge ring for a deposition chamber |
| US20140113458A1 (en) * | 2012-10-24 | 2014-04-24 | Applied Materials, Inc. | Minimal contact edge ring for rapid thermal processing |
| US9558982B2 (en) * | 2012-10-24 | 2017-01-31 | Applied Materials, Inc. | Minimal contact edge ring for rapid thermal processing |
| US20140262193A1 (en) * | 2013-03-13 | 2014-09-18 | Techest Co., Ltd. | Edge ring cooling module for semi-conductor manufacture chuck |
| USD724553S1 (en) * | 2013-09-13 | 2015-03-17 | Asm Ip Holding B.V. | Substrate supporter for semiconductor deposition apparatus |
| US20150368829A1 (en) * | 2014-06-23 | 2015-12-24 | Applied Materials, Inc. | Substrate thermal control in an epi chamber |
| US20160083840A1 (en) * | 2014-09-24 | 2016-03-24 | Applied Materials, Inc. | Graphite susceptor |
| US20160133504A1 (en) * | 2014-11-12 | 2016-05-12 | Applied Materials, Inc. | Susceptor design to reduce edge thermal peak |
| USD783922S1 (en) * | 2014-12-08 | 2017-04-11 | Entegris, Inc. | Wafer support ring |
| US20160240398A1 (en) * | 2015-02-12 | 2016-08-18 | Hermes-Epitek Corporation | Wafer Holder |
| USD796012S1 (en) * | 2015-02-26 | 2017-08-29 | Toyoda Gosei Co., Ltd. | Gasket |
| USD767234S1 (en) * | 2015-03-02 | 2016-09-20 | Entegris, Inc. | Wafer support ring |
| USD770992S1 (en) * | 2015-06-12 | 2016-11-08 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
| US20170117228A1 (en) * | 2015-10-27 | 2017-04-27 | Siltronic Ag | Susceptor for holding a semiconductor wafer having an orientation notch, a method for depositing a layer on a semiconductor wafer, and semiconductor wafer |
| US11380621B2 (en) * | 2015-10-27 | 2022-07-05 | Siltronic Ag | Susceptor for holding a semiconductor wafer having an orientation notch, a method for depositing a layer on a semiconductor wafer, and semiconductor wafer |
| USD861757S1 (en) * | 2015-12-28 | 2019-10-01 | Ntn Corporation | Inner ring for tapered roller bearing |
| USD810705S1 (en) * | 2016-04-01 | 2018-02-20 | Veeco Instruments Inc. | Self-centering wafer carrier for chemical vapor deposition |
| US20180144969A1 (en) * | 2016-11-18 | 2018-05-24 | Applied Materials, Inc. | Hybrid substrate carrier |
| US20180155838A1 (en) * | 2016-12-03 | 2018-06-07 | Applied Materials, Inc. | Process kit design for in-chamber heater and wafer rotating mechanism |
| USD840364S1 (en) * | 2017-01-31 | 2019-02-12 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
| USD876504S1 (en) * | 2017-04-03 | 2020-02-25 | Asm Ip Holding B.V. | Exhaust flow control ring for semiconductor deposition apparatus |
| USD830981S1 (en) * | 2017-04-07 | 2018-10-16 | Asm Ip Holding B.V. | Susceptor for semiconductor substrate processing apparatus |
| US11469118B2 (en) * | 2017-06-13 | 2022-10-11 | Ngk Insulators, Ltd. | Member for semiconductor manufacturing apparatus |
| USD870314S1 (en) * | 2017-08-31 | 2019-12-17 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
| USD871609S1 (en) * | 2017-08-31 | 2019-12-31 | Hitachi High-Technologies Corporation | Electrode plate peripheral ring for a plasma processing apparatus |
| US20210066113A1 (en) * | 2017-09-07 | 2021-03-04 | Showa Denko K.K. | Susceptor, cvd apparatus, and method for manufacturing epitaxial wafer |
| US20210375591A1 (en) * | 2018-04-20 | 2021-12-02 | Lam Research Corporation | Edge exclusion control |
| US20210375663A1 (en) * | 2018-10-04 | 2021-12-02 | Toyo Tanso Co., Ltd. | Susceptor |
| USD933619S1 (en) * | 2018-10-12 | 2021-10-19 | Valqua, Ltd. | Seal member for semiconductor production apparatus |
| USD948463S1 (en) * | 2018-10-24 | 2022-04-12 | Asm Ip Holding B.V. | Susceptor for semiconductor substrate supporting apparatus |
| USD992614S1 (en) * | 2018-12-06 | 2023-07-18 | Tokyo Electron Limited | Focus ring |
| USD992615S1 (en) * | 2018-12-07 | 2023-07-18 | Tokyo Electron Limited | Focus ring |
| USD1040304S1 (en) * | 2018-12-17 | 2024-08-27 | Applied Materials, Inc. | Deposition ring for physical vapor deposition chamber |
| USD888903S1 (en) * | 2018-12-17 | 2020-06-30 | Applied Materials, Inc. | Deposition ring for physical vapor deposition chamber |
| USD933725S1 (en) * | 2019-02-08 | 2021-10-19 | Applied Materials, Inc. | Deposition ring for a substrate processing chamber |
| US20220246462A1 (en) * | 2019-04-16 | 2022-08-04 | Tokai Carbon Korea Co., Ltd | Sic edge ring |
| US20210202294A1 (en) * | 2019-12-26 | 2021-07-01 | Showa Denko K.K. | Susceptor |
| US20210225688A1 (en) * | 2020-01-21 | 2021-07-22 | Asm Ip Holding B.V. | Susceptor with sidewall humps for uniform deposition |
| US20220380263A1 (en) * | 2020-02-12 | 2022-12-01 | Skc Solmics Co., Ltd. | Ceramic component and plasma etching apparatus comprising same |
| US20220013337A1 (en) * | 2020-07-08 | 2022-01-13 | Taiwan Semiconductor Manufacturing Company Limited | Plasma etcher edge ring with a chamfer geometry and impedance design |
| USD1034491S1 (en) * | 2020-07-27 | 2024-07-09 | Applied Materials, Inc. | Edge ring |
| USD1038049S1 (en) * | 2020-11-18 | 2024-08-06 | Applied Materials, Inc. | Cover ring for use in semiconductor processing chamber |
| USD1016761S1 (en) * | 2020-12-10 | 2024-03-05 | Nuflare Technology, Inc. | Top plate for semiconductor manufacturaing equipment |
| US20220361300A1 (en) * | 2021-05-10 | 2022-11-10 | The Boeing Company | Induction-heating system including a susceptor for generating induction heating below a selected curie temperature |
| US20220399190A1 (en) * | 2021-06-10 | 2022-12-15 | Ngk Insulators, Ltd. | Focus ring placement table |
| USD1037186S1 (en) * | 2021-10-22 | 2024-07-30 | Nuflare Technology, Inc. | Susceptor ring |
| JP1711119S (en) | 2021-10-22 | 2022-03-29 | Susceptoring | |
| JP1711120S (en) | 2021-10-22 | 2022-03-29 | Suceptor cover | |
| USD1047884S1 (en) * | 2021-10-22 | 2024-10-22 | Nuflare Technology, Inc. | Susceptor cover |
| USD1049067S1 (en) * | 2022-04-04 | 2024-10-29 | Applied Materials, Inc. | Ring for an anti-rotation process kit for a substrate processing chamber |
| USD1053230S1 (en) * | 2022-05-19 | 2024-12-03 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
| USD1069054S1 (en) * | 2022-08-08 | 2025-04-01 | As America, Inc. | Gasket |
| US20240145281A1 (en) * | 2022-10-27 | 2024-05-02 | Applied Materials, Inc. | Detection and analysis of substrate support and pre-heat ring in a process chamber via imaging |
| USD1034493S1 (en) * | 2022-11-25 | 2024-07-09 | Ap Systems Inc. | Chamber wall liner for a semiconductor manufacturing apparatus |
| US20240258154A1 (en) * | 2023-02-01 | 2024-08-01 | Asm Ip Holding B.V. | Method, assembly and system for film deposition and control |
| US20240282618A1 (en) * | 2023-02-20 | 2024-08-22 | Kioxia Corporation | Jig, semiconductor manufacturing apparatus, and method of operating semiconductor manufacturing apparatus |
Non-Patent Citations (3)
| Title |
|---|
| Semicorex susceptor, Date Jun. 10, 2023 [online], [retrieved May 16, 2025],https://www.semicorex.com/products/Wafer-Susceptor.html (Year: 2023). * |
| Vet china mocvd susceptor,Date Mar. 18, 2022 [online], [retrieved May 16, 2025], https://www.youtube.com/watch?v=T8YC8b84DOQ (Year: 2022). * |
| Vet china susceptor,Date Apr. 12, 2020 [online], [retrieved May 16, 2025], https://www.youtube.com/watch?v=iAVM00Q3zKc (Year: 2020). * |
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