WO1996031841A1 - Method and device for filling cavities - Google Patents
Method and device for filling cavities Download PDFInfo
- Publication number
- WO1996031841A1 WO1996031841A1 PCT/EP1996/001470 EP9601470W WO9631841A1 WO 1996031841 A1 WO1996031841 A1 WO 1996031841A1 EP 9601470 W EP9601470 W EP 9601470W WO 9631841 A1 WO9631841 A1 WO 9631841A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- cavities
- openings
- filling
- sieve
- card
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the invention relates to a method for filling cavities according to the preamble of claim 1 and an apparatus for performing the method.
- the cavities to be filled are now very small.
- the mass to be filled must therefore be "placed” very precisely.
- the amount of potting is extremely difficult due to the complicated shapes of the cavities and the built-in parts to calculate; it is generally measured. Overall, the dosage of the potting compound is extremely difficult. It should also be noted here that the clock rates when producing such cards must be extremely high in order to be able to offer marketable prices.
- the invention is based on the object of demonstrating a method of the type mentioned at the beginning by means of which the problems mentioned at the outset are solved. In particular, it revolves around filling cavities in flat structures quickly and correctly.
- An essential point of the invention is that a kind of "screen printing" method is used.
- the use of a sieve with open meshes in the area of the access openings to the cavities and the streaking of the filler by means of a squeegee makes it possible to place the filler mass very precisely, ie to uncontaminate the card area outside the chip-receiving cavity leave so that you can laminate a top layer in the subsequent operation.
- the cover layer can be laminated on (or also glued on) without one , the surface smoothing or leveling intermediate processing step.
- the method according to the invention is therefore very simple and can also be carried out automatically at very high clock rates.
- the cavities can also be filled in several successive work steps if the filling material or further intermediate processing steps require this. This is particularly easy because no actual dosing is necessary and high spatial precision can be achieved without special measures.
- Such a further step can also be covering the entire arrangement with an adhesive, for example, in order to glue on an uppermost layer.
- Figure 1 is a plan view of a contactless chip card in the half-open state
- Figure 2 shows a section along the line II-II of Figure 1;
- FIG. 3 shows a schematic block diagram of a production device for producing chip cards according to FIGS. 1 and 2 using the method according to the invention.
- the card shown in FIGS. 1 and 2 is a contactless chip card.
- the overall structure of an anti-theft card would look similar.
- a mask layer 11 is laminated onto a base layer 10, in which there is a recess 12 which forms a cavity for receiving electronic components.
- An overlay layer 13 covering the surface is laminated onto the mask layer 11.
- a coil 15 and a chip 14 connected to it are arranged in the recess 12, the function of which is sufficiently known from the literature and therefore no longer need to be discussed further.
- the recess 12 forming the cavity for receiving the electronic components is now filled with a plastic, so that the overlay layer 13 is laminated on the one hand on the mask layer 11 and on the other hand on the filler material in the recess 12 or glued to it.
- the filling compound in the recess 12 is filled into the cavity by means of a sieve and a doctor blade. This can ensure that it is filled completely and without air pockets, without projecting beyond the surface of the mask layer 11. This ensures that the overlay layer 13 can be applied exactly.
- a device which is shown schematically in FIG. 3, is used to produce a chip card shown in FIGS. 1 and 2.
- the mask film 11 is punched in a punch 20 to form the recesses 12, which is then stapled onto the base layer 10 in a first stapling machine 21.
- the assembly takes place in an assembly device 22 with the electronic components, in the present part with the chip 14 and the coil 15. Now a filling device 23 is used
- a sieve (not shown) is placed and filling material is filled into the recess 12 flush with the surface by means of a doctor blade.
- the overlay layer 13 is then placed (and possibly after interim curing or interim polymerisation) and tacked in a second stapling machine 21 '.
- this three-layer body thus formed is placed in a laminator 24 in which the three layers are firmly connected to one another.
- chip cards are punched out of the continuous band in a punch 25.
- personalization measures, printing and the like are carried out in further intermediate steps, not shown here and known per se, or finally.
- laying on a sieve also means continuous processes, such as unrolling a sieve.
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Abstract
Non-contact smart cards are known in which the components are set in cavities inside the card. The process of filling the cavities with a filler is extremely awkward and prone to error. It is proposed that a sieve with open meshes in the aperture region of the smart card should be positioned to allow filler material to be pushed into the cavities with a doctor blade.
Description
Verfahren und Vorrichtung zum Verfüllen von Hohlräumen Method and device for filling cavities
Beschreibungdescription
Die Erfindung betrifft ein Verfahren zum Verfüllen von Hohräumen nach dem Oberbegriff des Patentanspruches l sowie eine Vorrichtung zur Durchführung des Verfahrens.The invention relates to a method for filling cavities according to the preamble of claim 1 and an apparatus for performing the method.
Bei ID-Karten, in denen Chips montiert sind, oder auch in kartenförmigen Diebstahlsicherungen oder dergleichen flächi¬ gen Gebilden mit eingebauten aktiven oder passiven elektroni¬ schen Schaltungen müssen diese vollständig und sicher einge¬ bettet werden. Insbesondere kommt es darauf an, daß die ein- gebauten Chips oder dergleichen Bauteile mit einer MasseIn the case of ID cards in which chips are mounted, or also in card-shaped theft protection devices or similar flat structures with built-in active or passive electronic circuits, these must be completely and securely embedded. It is particularly important that the built-in chips or similar components have a mass
"vergossen" werden, welche den Hohraum in der Karte vollstän¬ dig ausfüllt. Im allgemeinen wird dann eine weitere Schicht auf die Karte aufgesiegelt oder geklebt, so daß es der Karte später nicht mehr anzusehen ist, daß sich in ihr Bauteile be- finden. Insbesondere bei kontaktlosen Chipkarten ist es wich¬ tig, daß die eingebauten Teile von außen nicht mehr sichtbar und zugänglich sind. Dadurch werden die besonderen Vorteile derartiger Karten erreicht, die u.a. darin liegen, daß sie feuchtigkeitsdicht sind und keinerlei Verschleiß unterliegen.be "shed", which completely fills the cavity in the card. In general, a further layer is then sealed or glued to the card, so that the card can no longer be seen later that there are components in it. In the case of contactless chip cards in particular, it is important that the built-in parts are no longer visible and accessible from the outside. This achieves the special advantages of such cards, which include are that they are moisture-proof and not subject to wear.
Die auszufüllenden Hohlräume sind nun sehr klein. Die einzu¬ füllende Masse muß also sehr genau "plaziert" werden. Darüber hinaus ist die Vergußmenge aufgrund der komplizierten Formen der Hohlräume und der eingebauten Teile nur äußerst schwer zu
berechnen; sie wird im allgemeinen ausgemessen. Insgesamt ist die Dosierung der Vergußmasse äußerst schwierig. Zu beachten ist hierbei noch die Tatsache, daß die Taktraten bei Herstel¬ lung derartiger Karten außerordentlich hoch sein müssen, um marktfähige Preise bieten zu können.The cavities to be filled are now very small. The mass to be filled must therefore be "placed" very precisely. In addition, the amount of potting is extremely difficult due to the complicated shapes of the cavities and the built-in parts to calculate; it is generally measured. Overall, the dosage of the potting compound is extremely difficult. It should also be noted here that the clock rates when producing such cards must be extremely high in order to be able to offer marketable prices.
Der Erfindung liegt die Aufgabe zugrunde, ein Verfahren der eingangs genannten Art aufzuzeigen, mittels dessen die ein¬ gangs genannten Probleme gelöst werden. Insbesondere dreht es sich darum, Hohlräume in flächigen Gebilden schnell und kor¬ rekt aufzufüllen.The invention is based on the object of demonstrating a method of the type mentioned at the beginning by means of which the problems mentioned at the outset are solved. In particular, it revolves around filling cavities in flat structures quickly and correctly.
Diese Aufgabe wird durch ein Verfahren nach Anspruch 1 und eine Vorrichtung nach Anspruch 4 gelöst.This object is achieved by a method according to claim 1 and an apparatus according to claim 4.
Ein wesentlicher Punkt der Erfindung liegt darin, daß eine Art "Siebdruck"-Verfahren angewendet wird. Durch die Anwen¬ dung eines Siebes mit offenen Maschen im Bereich der Zugangs¬ öffnungen zu den Hohlräumen und das Durchstreichen der Füll- asse mittels einer Rakel ist es möglich, die Füllmasse sehr exakt zu plazieren, also die Kartenfläche außerhalb des Chip- Aufnahmehohlraums unkontaminiert zu lassen, so daß man im nachfolgenden Arbeitsgang eine Deckschicht auflaminieren kann. Dadurch wiederum, daß man keine Dosierung im eigentli- chen Sinne vornehmen muß und mit dem Abnehmen des Siebes nach Auffüllen des Hohlraumes dieser bündig zur ansonsten nicht beschmutzten Oberfläche der Karte gefüllt ist, kann das Auf¬ laminieren (oder auch Aufkleben) der Deckschicht ohne einen, die Oberfläche glättenden oder einebnenden Zwischenbearbei- tungsschritt erfolgen. Das erfindungsgemäße Verfahren ist also sehr einfach und kann auch gleichzeitig mit sehr hohen Taktraten automatisiert durchgeführt werden.An essential point of the invention is that a kind of "screen printing" method is used. The use of a sieve with open meshes in the area of the access openings to the cavities and the streaking of the filler by means of a squeegee makes it possible to place the filler mass very precisely, ie to uncontaminate the card area outside the chip-receiving cavity leave so that you can laminate a top layer in the subsequent operation. In turn, since there is no need for metering in the actual sense and when the screen is removed after the cavity has been filled, it is filled flush with the otherwise uncleaned surface of the card, so that the cover layer can be laminated on (or also glued on) without one , the surface smoothing or leveling intermediate processing step. The method according to the invention is therefore very simple and can also be carried out automatically at very high clock rates.
Man kann die Hohlräume auch in mehreren nacheinander statt- findenden Arbeitsgängen dann erfüllen, wenn das Füllmaterial
oder weitere verarbeitungstechnische Zwischenschritte dies erfordern. Dies ist deshalb so besonders einfach, weil keine eigentliche Dosierung notwendig ist und eine hohe räumliche Präzision ohne besondere Maßnahmen erreichbar ist. Ein sol- eher weiterer Schritt kann beispielsweise auch das Überdecken der gesamten Anordnung mit einem Kleber sein, um eine oberste Schicht aufzukleben.The cavities can also be filled in several successive work steps if the filling material or further intermediate processing steps require this. This is particularly easy because no actual dosing is necessary and high spatial precision can be achieved without special measures. Such a further step can also be covering the entire arrangement with an adhesive, for example, in order to glue on an uppermost layer.
Nachfolgend wird ein Ausführungsbeispiel der Erfindung anhand der beiliegenden Abbildungen näher erläutert. Hierbei zeigen:An exemplary embodiment of the invention is explained in more detail below with the aid of the attached figures. Here show:
Figur 1 eine Draufsicht auf eine kontaktlose Chipkarte im halbgeöffneten Zustand;Figure 1 is a plan view of a contactless chip card in the half-open state;
Figur 2 einen Schnitt entlang der Linie II-II aus Figur 1;Figure 2 shows a section along the line II-II of Figure 1;
Figur 3 ein schematisiertes Blockschaltbild einer Produk¬ tionseinrichtung zum Herstellen von Chipkarten ge¬ mäß den Figuren 1 und 2 unter Verwendung des erfin- dungsgemäßen Verfahrens.3 shows a schematic block diagram of a production device for producing chip cards according to FIGS. 1 and 2 using the method according to the invention.
Die in den Figuren 1 und 2 gezeigte Karte ist eine kontakt¬ lose Chipkarte. Eine Diebstahlsicherungskarte würde in ihrem Gesamtaufbau ähnlich aussehen. Bei dieser schematisiert dar- gestellten Karte ist auf einer Bodenschicht 10 eine Masken¬ schicht 11 auflaminiert, in welcher sich eine Ausnehmung 12 befindet, die einen Hohlraum zur Aufnahme elektronischer Bau¬ teile bildet. Auf der Maskenschicht 11 ist eine die Oberflä¬ che abdeckende Overlay-Schicht 13 auflaminiert. In der Aus- nehmung 12 sind eine Spule 15 und ein an diese angeschlosse¬ ner Chip 14 angeordnet, deren Funktion aus der Literatur hin¬ reichend bekannt ist und die darum nicht mehr weiter disku¬ tiert werden müssen.The card shown in FIGS. 1 and 2 is a contactless chip card. The overall structure of an anti-theft card would look similar. In the case of this schematically illustrated card, a mask layer 11 is laminated onto a base layer 10, in which there is a recess 12 which forms a cavity for receiving electronic components. An overlay layer 13 covering the surface is laminated onto the mask layer 11. A coil 15 and a chip 14 connected to it are arranged in the recess 12, the function of which is sufficiently known from the literature and therefore no longer need to be discussed further.
Die den Hohlraum zur Aufnehmung der elektronischer Bauteile bildende Ausnehmung 12 ist nun mit einem Kunststoff gefüllt,
so daß die Overlay-Schicht 13 einerseits auf der Masken¬ schicht 11 und andererseits auf dem Füllmaterial in die Aus¬ nehmung 12 auflaminiert oder auf diese aufgeklebt ist. Wich¬ tig ist hierbei die Tatsache, daß die Füllmasse in der Aus- nehmung 12 mittels eines aufgelegten Siebes und einer Rakel in den Hohlraum eingefüllt wird. Dadurch kann sichergestellt werden, daß dieser gänzlich und ohne Lufteinschlüsse gefüllt ist, ohne dabei über die Oberfläche der Maskenschicht 11 her¬ vorzustehen. Dies stellt sicher, daß die Overlay-Schicht 13 exakt aufbringbar ist.The recess 12 forming the cavity for receiving the electronic components is now filled with a plastic, so that the overlay layer 13 is laminated on the one hand on the mask layer 11 and on the other hand on the filler material in the recess 12 or glued to it. What is important here is the fact that the filling compound in the recess 12 is filled into the cavity by means of a sieve and a doctor blade. This can ensure that it is filled completely and without air pockets, without projecting beyond the surface of the mask layer 11. This ensures that the overlay layer 13 can be applied exactly.
Zur Herstellung einer in den Figuren 1 und 2 gezeigten Chip¬ karte wird eine Vorrichtung verwendet, die schematisiert in Figur 3 dargestellt ist. Es wird hierbei zunächst die Masken- folie 11 in einer Stanze 20 zur Bildung der Ausnehmungen 12 gestanzt, die anschließend in einer ersten Heftmaschine 21 auf die Bodenschicht 10 aufgeheftet wird. Danach erfolgt die Bestückung in einer Bestückungseinrichtung 22 mit den elek¬ tronischen Bauteilen, im vorliegenden Teil mit dem Chip 14 und der Spule 15. Nun werden in eine Fülleinrichtung 23 einA device, which is shown schematically in FIG. 3, is used to produce a chip card shown in FIGS. 1 and 2. First, the mask film 11 is punched in a punch 20 to form the recesses 12, which is then stapled onto the base layer 10 in a first stapling machine 21. Then the assembly takes place in an assembly device 22 with the electronic components, in the present part with the chip 14 and the coil 15. Now a filling device 23 is used
(nicht gezeigtes) Sieb aufgelegt und Füllmaterial mittels ei¬ ner Rakel in die Ausnehmung 12 oberflächenbündig eingefüllt. Danach (ggf. nach zwischenzeitlicher Härtung bzw. zwischen¬ zeitlichem Auspolymerisieren) wird die Overlay-Schicht 13 aufgelegt und in einer zweiten Heftmaschine 21' aufgeheftet.A sieve (not shown) is placed and filling material is filled into the recess 12 flush with the surface by means of a doctor blade. The overlay layer 13 is then placed (and possibly after interim curing or interim polymerisation) and tacked in a second stapling machine 21 '.
Nach dem Heften in der zweiten Heftmaschine 21' kommt dieser so ausgebildete dreischichtige Körper in einen Laminator 24, in welchem die drei Schichten miteinander fest verbunden wer- den.After stapling in the second stapling machine 21 ', this three-layer body thus formed is placed in a laminator 24 in which the three layers are firmly connected to one another.
Abschließend werden in einer Stanze 25 die Chipkarten aus dem kontinuierlichen Band herausgestanzt.
Selbstverständlich ist es möglich, in weiteren, hier nicht gezeigten und an sich bekannten Zwischenschritten oder auch abschließend Personalisierungsmaßnahmen, Bedruckung und dergleichen durchzuführen.Finally, the chip cards are punched out of the continuous band in a punch 25. Of course, it is possible to carry out personalization measures, printing and the like in further intermediate steps, not shown here and known per se, or finally.
Es sei weiterhin darauf hingewiesen, daß unter dem Begriff "Auflegen eines Siebes" auch kontinuierliche Verfahren, wie Abrollen eines Siebes, zu verstehen sind.It should also be pointed out that the term “laying on a sieve” also means continuous processes, such as unrolling a sieve.
BezugszeichenlisteReference list
10 Bodenschicht10 bottom layer
11 Maskenschicht11 mask layer
12 Ausnehmung12 recess
13 Overlay-Schicht13 overlay layer
14 Chip14 chip
15 Spule15 coil
20 Stanze20 punches
21 Heftmaschine21 stapler
22 Bestückungseinrichtung22 placement device
23 Fülleinrichtung23 filling device
24 Laminator24 laminator
25 Stanze
25 punches
Claims
1. Verfahren zum Verfüllen von Hohlräumen mit mindestens einseitigen Öffnungen in einem flächigen Gebilde, insbe¬ sondere in einer (kontaktlosen) ID- oder Chipkarte,1. Method for filling cavities with at least one-sided openings in a flat structure, in particular in a (contactless) ID or chip card,
d a d u r c h g e k e n n z e i c h n e t ,characterized ,
daß auf die Flächen des Gebildes, in welchen die Öffnun¬ gen sitzen, ein Sieb aufgelegt wird, das mindestens im Bereich der Öffnungen offene Maschen hat, und daß mit einer Rakel Füllmaterial durch die offenen Maschen in die Hohlräume eingefüllt wird.that a screen is placed on the surfaces of the structure in which the openings sit, which has open meshes at least in the area of the openings, and that filler material is filled into the cavities through the open meshes with a doctor blade.
2. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß die Hohlräume in mehreren, nacheinander stattfinden¬ den Arbeitsgängen verfüllt werden.2. The method according to claim 1, characterized in that the cavities are filled in a plurality of operations taking place one after the other.
3. Verfahren nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, daß die gesamte Fläche des Gebildes, in welcher die Öff¬ nungen sitzen, mit einem Füllmaterial, insbesondere mit einem Kleber bedeckt wird.3. The method according to any one of the preceding claims, characterized in that the entire surface of the structure, in which the openings are seated, is covered with a filling material, in particular with an adhesive.
4. Vorrichtung zum Verfüllen von Hohlräumen mit mindestens einseitigen Öffnungen in einem flächigen Gebilde, insbe¬ sondere in einer (kontaktlosen) ID- oder Chipkarte, um¬ fassend ein Sieb und Einrichtungen zum Auflegen des Sie¬ bes auf die Fläche des Gebildes, in welcher die Öffnun¬ gen sitzen, wobei im Sieb mindestens in dem Bereich der Öffnungen offene Maschen vorgesehen sind, sowie eine Ra¬ kel, zum Durchstreichen von Füllmaterial durch die offe¬ nen Maschen und zum Füllen der Hohlräume. 4. Device for filling cavities with at least one-sided openings in a flat structure, in particular in a (contactless) ID or chip card, comprising a sieve and devices for placing the sieve on the surface of the structure in which the openings are seated, open meshes being provided in the sieve at least in the region of the openings, and a doctor blade for sweeping filler material through the open meshes and for filling the cavities.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19512800.1 | 1995-04-05 | ||
| DE19512800 | 1995-04-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO1996031841A1 true WO1996031841A1 (en) | 1996-10-10 |
Family
ID=7758879
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/EP1996/001470 WO1996031841A1 (en) | 1995-04-05 | 1996-04-03 | Method and device for filling cavities |
Country Status (1)
| Country | Link |
|---|---|
| WO (1) | WO1996031841A1 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998018623A1 (en) * | 1996-10-31 | 1998-05-07 | Tomas Meinen | Method and device for producing smart cards, id cards or the like |
| DE19710656A1 (en) * | 1997-03-14 | 1998-09-17 | Fd Fleischhauer Datentraeger U | Contactless smart card has core sheet stamped out |
| US5840879A (en) * | 1996-12-06 | 1998-11-24 | Wang; Edge R. | Reagents and solid supports for improved synthesis and labeling of polynucleotides |
| WO1999021130A1 (en) * | 1997-10-22 | 1999-04-29 | Meinen, Ziegel & Co. Gmbh | Method and device for producing chip cards, id cards and similar which have raised surface segments |
| EP0947952A3 (en) * | 1998-03-31 | 2002-05-02 | Omron Corporation | A data carrier and a production method for the same |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2279817A (en) * | 1993-07-02 | 1995-01-11 | Gec Avery Ltd | A method of encapsulating components on a printed circuit |
-
1996
- 1996-04-03 WO PCT/EP1996/001470 patent/WO1996031841A1/en active Application Filing
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2279817A (en) * | 1993-07-02 | 1995-01-11 | Gec Avery Ltd | A method of encapsulating components on a printed circuit |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998018623A1 (en) * | 1996-10-31 | 1998-05-07 | Tomas Meinen | Method and device for producing smart cards, id cards or the like |
| US5840879A (en) * | 1996-12-06 | 1998-11-24 | Wang; Edge R. | Reagents and solid supports for improved synthesis and labeling of polynucleotides |
| DE19710656A1 (en) * | 1997-03-14 | 1998-09-17 | Fd Fleischhauer Datentraeger U | Contactless smart card has core sheet stamped out |
| WO1999021130A1 (en) * | 1997-10-22 | 1999-04-29 | Meinen, Ziegel & Co. Gmbh | Method and device for producing chip cards, id cards and similar which have raised surface segments |
| EP0947952A3 (en) * | 1998-03-31 | 2002-05-02 | Omron Corporation | A data carrier and a production method for the same |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE3723547C2 (en) | Carrier element for installation in ID cards | |
| EP0709805B1 (en) | Method for producing data carriers with embedded elements and device for carrying out this method | |
| EP0726541B1 (en) | Method for the fabrication of identity cards | |
| EP0852040A2 (en) | Ic board module for producing an ic board and process for producing an ic board | |
| DE3122981A1 (en) | METHOD FOR INSTALLING IC COMPONENTS IN ID CARD | |
| DE112004001727T5 (en) | Method for producing an electronic module | |
| DE19716912B4 (en) | Method for fixing a chip module in a chip card | |
| WO1998009252A1 (en) | Process for manufacturing chip cards | |
| DE19617621C2 (en) | Process for the production of a laminate, use of flexible material in the production of a laminate and laminate produced according to the mentioned process | |
| DE19645071C2 (en) | Process for the production of chip cards | |
| EP1147488B1 (en) | Method for embedding an ic component into a foamed layer of a chip card | |
| DE102010046965A1 (en) | Transponder inlay for a personal identification document and a method of making a transponder inlay | |
| DE3781150T2 (en) | BROCHURE OR SIMILAR, METHOD AND DEVICE FOR PRODUCING THE SAME. | |
| DE102012221988B4 (en) | Method for producing a sandwich-like electronic component, electronic component, detector element and radiation detector | |
| WO1996031841A1 (en) | Method and device for filling cavities | |
| DE4401588C2 (en) | Method for capping a chip card module and chip card module | |
| WO2001037622A2 (en) | Printed conductor support layer for laminating into a chip card, method for producing a printed conductor support layer and injection molding tool for carrying out the method for producing a printed conductor support layer | |
| DE102012013538A1 (en) | Method for manufacturing sandwich element, involves injecting liquid, foamable material injected into free space for connecting covering layers to sandwich element, where covering layers are formed as preformed fiber semi-finished products | |
| DE3528686A1 (en) | METHOD AND PRODUCTION OF ID CARD AND ID CARD | |
| EP2174271B1 (en) | Method and device for producing a portable data carrier with a built-in element | |
| DE102017131236A1 (en) | METHOD FOR PRODUCING ADHESIVE SURFACES BY MEANS OF A 3D PRINTING DEVICE | |
| DE60132681T2 (en) | Method for realizing a mixed chip card | |
| DE102021003336A1 (en) | Process for manufacturing a chip card body | |
| DE19645069C2 (en) | Method and device for producing chip cards, ID cards or the like | |
| DE102018104435A1 (en) | Method for producing labels with a surface profile |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AK | Designated states |
Kind code of ref document: A1 Designated state(s): JP US |
|
| AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): AT BE CH DE DK ES FI FR GB GR IE IT LU MC NL PT SE |
|
| DFPE | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101) | ||
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
| 122 | Ep: pct application non-entry in european phase |