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WO1996031841A1 - Procede et dispositif permettant de remplir des cavites - Google Patents

Procede et dispositif permettant de remplir des cavites Download PDF

Info

Publication number
WO1996031841A1
WO1996031841A1 PCT/EP1996/001470 EP9601470W WO9631841A1 WO 1996031841 A1 WO1996031841 A1 WO 1996031841A1 EP 9601470 W EP9601470 W EP 9601470W WO 9631841 A1 WO9631841 A1 WO 9631841A1
Authority
WO
WIPO (PCT)
Prior art keywords
cavities
openings
filling
sieve
card
Prior art date
Application number
PCT/EP1996/001470
Other languages
German (de)
English (en)
Inventor
Tomas Meinen
Original Assignee
Tomas Meinen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tomas Meinen filed Critical Tomas Meinen
Publication of WO1996031841A1 publication Critical patent/WO1996031841A1/fr

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to a method for filling cavities according to the preamble of claim 1 and an apparatus for performing the method.
  • the cavities to be filled are now very small.
  • the mass to be filled must therefore be "placed” very precisely.
  • the amount of potting is extremely difficult due to the complicated shapes of the cavities and the built-in parts to calculate; it is generally measured. Overall, the dosage of the potting compound is extremely difficult. It should also be noted here that the clock rates when producing such cards must be extremely high in order to be able to offer marketable prices.
  • the invention is based on the object of demonstrating a method of the type mentioned at the beginning by means of which the problems mentioned at the outset are solved. In particular, it revolves around filling cavities in flat structures quickly and correctly.
  • An essential point of the invention is that a kind of "screen printing" method is used.
  • the use of a sieve with open meshes in the area of the access openings to the cavities and the streaking of the filler by means of a squeegee makes it possible to place the filler mass very precisely, ie to uncontaminate the card area outside the chip-receiving cavity leave so that you can laminate a top layer in the subsequent operation.
  • the cover layer can be laminated on (or also glued on) without one , the surface smoothing or leveling intermediate processing step.
  • the method according to the invention is therefore very simple and can also be carried out automatically at very high clock rates.
  • the cavities can also be filled in several successive work steps if the filling material or further intermediate processing steps require this. This is particularly easy because no actual dosing is necessary and high spatial precision can be achieved without special measures.
  • Such a further step can also be covering the entire arrangement with an adhesive, for example, in order to glue on an uppermost layer.
  • Figure 1 is a plan view of a contactless chip card in the half-open state
  • Figure 2 shows a section along the line II-II of Figure 1;
  • FIG. 3 shows a schematic block diagram of a production device for producing chip cards according to FIGS. 1 and 2 using the method according to the invention.
  • the card shown in FIGS. 1 and 2 is a contactless chip card.
  • the overall structure of an anti-theft card would look similar.
  • a mask layer 11 is laminated onto a base layer 10, in which there is a recess 12 which forms a cavity for receiving electronic components.
  • An overlay layer 13 covering the surface is laminated onto the mask layer 11.
  • a coil 15 and a chip 14 connected to it are arranged in the recess 12, the function of which is sufficiently known from the literature and therefore no longer need to be discussed further.
  • the recess 12 forming the cavity for receiving the electronic components is now filled with a plastic, so that the overlay layer 13 is laminated on the one hand on the mask layer 11 and on the other hand on the filler material in the recess 12 or glued to it.
  • the filling compound in the recess 12 is filled into the cavity by means of a sieve and a doctor blade. This can ensure that it is filled completely and without air pockets, without projecting beyond the surface of the mask layer 11. This ensures that the overlay layer 13 can be applied exactly.
  • a device which is shown schematically in FIG. 3, is used to produce a chip card shown in FIGS. 1 and 2.
  • the mask film 11 is punched in a punch 20 to form the recesses 12, which is then stapled onto the base layer 10 in a first stapling machine 21.
  • the assembly takes place in an assembly device 22 with the electronic components, in the present part with the chip 14 and the coil 15. Now a filling device 23 is used
  • a sieve (not shown) is placed and filling material is filled into the recess 12 flush with the surface by means of a doctor blade.
  • the overlay layer 13 is then placed (and possibly after interim curing or interim polymerisation) and tacked in a second stapling machine 21 '.
  • this three-layer body thus formed is placed in a laminator 24 in which the three layers are firmly connected to one another.
  • chip cards are punched out of the continuous band in a punch 25.
  • personalization measures, printing and the like are carried out in further intermediate steps, not shown here and known per se, or finally.
  • laying on a sieve also means continuous processes, such as unrolling a sieve.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

Les cartes à puce connues, sans contact, présentent des composants intégrés dans des cavités à l'intérieur de la carte. Il est extrêmement délicat de remplir ces cavités avec un matériau de remplissage, et en outre, les risques d'erreurs sont très élevées. On propose, selon l'invention, de positionner un tamis présentant des mailles ouvertes au niveau de l'ouverture de la carte à puce, afin de permettre le remplissage des cavités avec un matériau de remplissage au moyen d'une racle.
PCT/EP1996/001470 1995-04-05 1996-04-03 Procede et dispositif permettant de remplir des cavites WO1996031841A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19512800.1 1995-04-05
DE19512800 1995-04-05

Publications (1)

Publication Number Publication Date
WO1996031841A1 true WO1996031841A1 (fr) 1996-10-10

Family

ID=7758879

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP1996/001470 WO1996031841A1 (fr) 1995-04-05 1996-04-03 Procede et dispositif permettant de remplir des cavites

Country Status (1)

Country Link
WO (1) WO1996031841A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998018623A1 (fr) * 1996-10-31 1998-05-07 Tomas Meinen Procede et dispositif pour produire des cartes a puce, des cartes d'identification ou similaires
DE19710656A1 (de) * 1997-03-14 1998-09-17 Fd Fleischhauer Datentraeger U Chipkarte
US5840879A (en) * 1996-12-06 1998-11-24 Wang; Edge R. Reagents and solid supports for improved synthesis and labeling of polynucleotides
WO1999021130A1 (fr) * 1997-10-22 1999-04-29 Meinen, Ziegel & Co. Gmbh Procede et dispositif pour produire des cartes a puces, des cartes d'identification ou similaires, comportant des sections superficielles saillantes
EP0947952A3 (fr) * 1998-03-31 2002-05-02 Omron Corporation Porteur de données et méthode de sa production

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2279817A (en) * 1993-07-02 1995-01-11 Gec Avery Ltd A method of encapsulating components on a printed circuit

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2279817A (en) * 1993-07-02 1995-01-11 Gec Avery Ltd A method of encapsulating components on a printed circuit

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998018623A1 (fr) * 1996-10-31 1998-05-07 Tomas Meinen Procede et dispositif pour produire des cartes a puce, des cartes d'identification ou similaires
US5840879A (en) * 1996-12-06 1998-11-24 Wang; Edge R. Reagents and solid supports for improved synthesis and labeling of polynucleotides
DE19710656A1 (de) * 1997-03-14 1998-09-17 Fd Fleischhauer Datentraeger U Chipkarte
WO1999021130A1 (fr) * 1997-10-22 1999-04-29 Meinen, Ziegel & Co. Gmbh Procede et dispositif pour produire des cartes a puces, des cartes d'identification ou similaires, comportant des sections superficielles saillantes
EP0947952A3 (fr) * 1998-03-31 2002-05-02 Omron Corporation Porteur de données et méthode de sa production

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