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WO1997015704A3 - Electroplating plant - Google Patents

Electroplating plant Download PDF

Info

Publication number
WO1997015704A3
WO1997015704A3 PCT/DE1996/001936 DE9601936W WO9715704A3 WO 1997015704 A3 WO1997015704 A3 WO 1997015704A3 DE 9601936 W DE9601936 W DE 9601936W WO 9715704 A3 WO9715704 A3 WO 9715704A3
Authority
WO
WIPO (PCT)
Prior art keywords
auxiliary
electrolyte
catholyte
electroplating
anolyte
Prior art date
Application number
PCT/DE1996/001936
Other languages
German (de)
French (fr)
Other versions
WO1997015704A2 (en
Inventor
Karl Hans Fuchs
Original Assignee
Lea Ronal Gmbh
Karl Hans Fuchs
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lea Ronal Gmbh, Karl Hans Fuchs filed Critical Lea Ronal Gmbh
Priority to EP96945489A priority Critical patent/EP0801692A2/en
Priority to JP9512202A priority patent/JPH10511743A/en
Publication of WO1997015704A2 publication Critical patent/WO1997015704A2/en
Publication of WO1997015704A3 publication Critical patent/WO1997015704A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/18—Regeneration of process solutions of electrolytes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

The invention concerns an electroplating plant comprising an electroplating container and a supply container between which the electrolyte circulates. In the supply container the metal content of the electrolyte is supplemented by a soluble anode which is associated with an auxiliary cathode located in an auxiliary catholyte which is separated from the electrolyte by a diaphragm which is impermeable to metallic ions. The insoluble anodes of the electroplating container are located in an auxiliary anolyte separated from the electrolyte by diaphragms which are impermeable to anions. The essential advantage of the invention is that insoluble anodes and necessary organic additives for the production of precision coatings, for example in the field of printed circuit boards, can also be used. According to a particularly advantageous development, the auxiliary catholyte and the auxiliary anolyte are guided in a common circuit such that opposed shifts in the pH value of the auxiliary catholyte and auxiliary anolyte are largely compensated as a result of their being continually mixed.
PCT/DE1996/001936 1995-10-26 1996-10-11 Electroplating plant WO1997015704A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP96945489A EP0801692A2 (en) 1995-10-26 1996-10-11 Electroplating plant
JP9512202A JPH10511743A (en) 1995-10-26 1996-10-11 Plating equipment

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE1995139865 DE19539865A1 (en) 1995-10-26 1995-10-26 Continuous electroplating system
DE19539865.3 1995-10-26

Publications (2)

Publication Number Publication Date
WO1997015704A2 WO1997015704A2 (en) 1997-05-01
WO1997015704A3 true WO1997015704A3 (en) 1997-07-10

Family

ID=7775839

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1996/001936 WO1997015704A2 (en) 1995-10-26 1996-10-11 Electroplating plant

Country Status (4)

Country Link
EP (1) EP0801692A2 (en)
JP (1) JPH10511743A (en)
DE (1) DE19539865A1 (en)
WO (1) WO1997015704A2 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1264918B1 (en) * 2001-06-07 2011-11-23 Shipley Co. L.L.C. Electrolytic copper plating method
ITMI20011374A1 (en) * 2001-06-29 2002-12-29 De Nora Elettrodi Spa ELECTROLYSIS CELL FOR THE RESTORATION OF THE CONCENTRATION OF METAL IONS IN ELECTRODEPOSITION PROCESSES
DE10341998A1 (en) * 2003-09-04 2005-03-31 Gramm Gmbh & Co. Kg Galvanizing or coating applicator has non-self priming pump with secondary self priming pump between process chamber and discharge tank
EP2548998B1 (en) * 2011-07-20 2015-07-01 Enthone Inc. Apparatus for electrochemical deposition of a metal
DE102012024758B4 (en) 2012-12-18 2024-02-01 Maschinenfabrik Niehoff Gmbh & Co Kg Device and method for electrolytically coating an object and their use
JP6079368B2 (en) * 2013-03-28 2017-02-15 三菱マテリアル株式会社 Sn alloy plating method, Sn alloy plating solution recycling method, and apparatuses thereof
US9765443B2 (en) * 2015-09-02 2017-09-19 Applied Materials, Inc. Electroplating processor with current thief electrode
CN105755510B (en) * 2015-12-14 2018-12-07 南京航空航天大学 A kind of electroformed nickel system and its working method with nickel ion supplementary device
US11174564B2 (en) * 2018-10-31 2021-11-16 Unison Industries, Llc Electroforming system and method
EP3875642A1 (en) * 2020-03-04 2021-09-08 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Method for preparing rinsing water from printed circuit board and / or substrate production
CN116024634A (en) * 2022-09-26 2023-04-28 深圳崇达多层线路板有限公司 Electroplating device and application

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1293648A (en) * 1969-06-06 1972-10-18 Australian Iron Steel Pty Ltd Addition of metal ions to electrolytic plating baths
US4038160A (en) * 1975-07-03 1977-07-26 Albright & Wilson Limited Method of regenerating a chromium electroplating bath
FR2479856A1 (en) * 1980-04-04 1981-10-09 Electricite De France Regeneration of metal plating soln. - using cell contg. anodic membrane and soluble metal anode
US4469564A (en) * 1982-08-11 1984-09-04 At&T Bell Laboratories Copper electroplating process
US5100517A (en) * 1991-04-08 1992-03-31 The Goodyear Tire & Rubber Company Process for applying a copper layer to steel wire
GB2254859A (en) * 1991-04-18 1992-10-21 Nippon Cmk Kk In printed wiring board manufacturing use of waste etchant as copper ion sourcefor electroplating bath
DE4221970A1 (en) * 1992-06-30 1994-01-05 Schering Ag Sodium alkenyl or alkynyl salt use in metal electroplating bath to bind halogen - useful for preventing toxic halogen gas emission, esp. from zinc@, nickel@ or copper@ plating bath e.g. fluorine@, chlorine@, bromine@ or iodine@ at inert anode

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8801827D0 (en) * 1988-01-27 1988-02-24 Jct Controls Ltd Improvements in electrochemical processes
DE4405741C1 (en) * 1994-02-23 1995-06-01 Atotech Deutschland Gmbh Electrolytic deposition of metal coating

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1293648A (en) * 1969-06-06 1972-10-18 Australian Iron Steel Pty Ltd Addition of metal ions to electrolytic plating baths
US4038160A (en) * 1975-07-03 1977-07-26 Albright & Wilson Limited Method of regenerating a chromium electroplating bath
FR2479856A1 (en) * 1980-04-04 1981-10-09 Electricite De France Regeneration of metal plating soln. - using cell contg. anodic membrane and soluble metal anode
US4469564A (en) * 1982-08-11 1984-09-04 At&T Bell Laboratories Copper electroplating process
US5100517A (en) * 1991-04-08 1992-03-31 The Goodyear Tire & Rubber Company Process for applying a copper layer to steel wire
GB2254859A (en) * 1991-04-18 1992-10-21 Nippon Cmk Kk In printed wiring board manufacturing use of waste etchant as copper ion sourcefor electroplating bath
DE4221970A1 (en) * 1992-06-30 1994-01-05 Schering Ag Sodium alkenyl or alkynyl salt use in metal electroplating bath to bind halogen - useful for preventing toxic halogen gas emission, esp. from zinc@, nickel@ or copper@ plating bath e.g. fluorine@, chlorine@, bromine@ or iodine@ at inert anode

Also Published As

Publication number Publication date
EP0801692A2 (en) 1997-10-22
DE19539865A1 (en) 1997-04-30
WO1997015704A2 (en) 1997-05-01
JPH10511743A (en) 1998-11-10

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