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WO1997015704A3 - Installation galvanoplastique - Google Patents

Installation galvanoplastique Download PDF

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Publication number
WO1997015704A3
WO1997015704A3 PCT/DE1996/001936 DE9601936W WO9715704A3 WO 1997015704 A3 WO1997015704 A3 WO 1997015704A3 DE 9601936 W DE9601936 W DE 9601936W WO 9715704 A3 WO9715704 A3 WO 9715704A3
Authority
WO
WIPO (PCT)
Prior art keywords
auxiliary
electrolyte
catholyte
electroplating
anolyte
Prior art date
Application number
PCT/DE1996/001936
Other languages
German (de)
English (en)
Other versions
WO1997015704A2 (fr
Inventor
Karl Hans Fuchs
Original Assignee
Lea Ronal Gmbh
Karl Hans Fuchs
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lea Ronal Gmbh, Karl Hans Fuchs filed Critical Lea Ronal Gmbh
Priority to EP96945489A priority Critical patent/EP0801692A2/fr
Priority to JP9512202A priority patent/JPH10511743A/ja
Publication of WO1997015704A2 publication Critical patent/WO1997015704A2/fr
Publication of WO1997015704A3 publication Critical patent/WO1997015704A3/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/18—Regeneration of process solutions of electrolytes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

L'invention concerne une installation galvanoplastique comprenant une cuve de galvanoplastie et une cuve d'alimentation entre lesquelles circule l'électrolyte. Dans la cuve d'alimentation, la teneur en métal de l'électrolyte est complétée par une anode soluble à laquelle est associée une cathode auxiliaire située dans un catholyte auxiliaire séparé de l'électrolyte par un diaphragme imperméable aux ions métalliques. Les anodes non solubles de la cuve de galvanoplastie se trouvent dans un anolyte auxiliaire séparé de l'électrolyte par l'intermédiaire de diaphragmes imperméables aux anions. Le principal avantage de cette invention réside dans la possibilité d'utiliser des anodes non solubles, mais également des additifs organiques indispensables, par exemple dans le domaine des cartes de circuits, pour des revêtements précis. Dans une variante perfectionnée particulièrement avantageuse, il est prévu que le catholyte auxiliaire et l'anolyte auxiliaire soient guidés dans un circuit commun, afin que les écarts opposés du pH du catholyte auxiliaire et de l'anolyte auxiliaire soient largement compensés par leur mélange continu.
PCT/DE1996/001936 1995-10-26 1996-10-11 Installation galvanoplastique WO1997015704A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP96945489A EP0801692A2 (fr) 1995-10-26 1996-10-11 Installation galvanoplastique
JP9512202A JPH10511743A (ja) 1995-10-26 1996-10-11 メッキ設備

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE1995139865 DE19539865A1 (de) 1995-10-26 1995-10-26 Durchlauf-Galvanikanlage
DE19539865.3 1995-10-26

Publications (2)

Publication Number Publication Date
WO1997015704A2 WO1997015704A2 (fr) 1997-05-01
WO1997015704A3 true WO1997015704A3 (fr) 1997-07-10

Family

ID=7775839

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1996/001936 WO1997015704A2 (fr) 1995-10-26 1996-10-11 Installation galvanoplastique

Country Status (4)

Country Link
EP (1) EP0801692A2 (fr)
JP (1) JPH10511743A (fr)
DE (1) DE19539865A1 (fr)
WO (1) WO1997015704A2 (fr)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1264918B1 (fr) * 2001-06-07 2011-11-23 Shipley Co. L.L.C. Méthode de placage électrolytique de cuivre
ITMI20011374A1 (it) * 2001-06-29 2002-12-29 De Nora Elettrodi Spa Cella di elettrolisi per il ripristino della concentrazione di ioni metallici in processi di elettrodeposizione
DE10341998A1 (de) * 2003-09-04 2005-03-31 Gramm Gmbh & Co. Kg Vorrichtung und Verfahren zur Oberflächenbehandlung von Werkstücken in einem Kreislaufsystem
EP2548998B1 (fr) * 2011-07-20 2015-07-01 Enthone Inc. Appareil de dépôt électro-chimique d'un métal
DE102012024758B4 (de) 2012-12-18 2024-02-01 Maschinenfabrik Niehoff Gmbh & Co Kg Vorrichtung und Verfahren zum elektrolytischen Beschichten eines Gegenstandes und deren Verwendung
JP6079368B2 (ja) * 2013-03-28 2017-02-15 三菱マテリアル株式会社 Ｓｎ合金めっき方法及びＳｎ合金めっき液のリサイクル方法、並びにこれらの装置
US9765443B2 (en) * 2015-09-02 2017-09-19 Applied Materials, Inc. Electroplating processor with current thief electrode
CN105755510B (zh) * 2015-12-14 2018-12-07 南京航空航天大学 一种带镍离子补充装置的电铸镍系统及其工作方法
US11174564B2 (en) * 2018-10-31 2021-11-16 Unison Industries, Llc Electroforming system and method
EP3875642A1 (fr) * 2020-03-04 2021-09-08 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Procédé de traitement des eaux de rinçage provenant de la fabrication de cartes de circuit imprimé et/ou de substrats
CN116024634A (zh) * 2022-09-26 2023-04-28 深圳崇达多层线路板有限公司 电镀装置及应用

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1293648A (en) * 1969-06-06 1972-10-18 Australian Iron Steel Pty Ltd Addition of metal ions to electrolytic plating baths
US4038160A (en) * 1975-07-03 1977-07-26 Albright & Wilson Limited Method of regenerating a chromium electroplating bath
FR2479856A1 (fr) * 1980-04-04 1981-10-09 Electricite De France Installation de traitement de surface par depot metallique et procede de regeneration des bains de depot metallique par voie electrolytique
US4469564A (en) * 1982-08-11 1984-09-04 At&T Bell Laboratories Copper electroplating process
US5100517A (en) * 1991-04-08 1992-03-31 The Goodyear Tire & Rubber Company Process for applying a copper layer to steel wire
GB2254859A (en) * 1991-04-18 1992-10-21 Nippon Cmk Kk In printed wiring board manufacturing use of waste etchant as copper ion sourcefor electroplating bath
DE4221970A1 (de) * 1992-06-30 1994-01-05 Schering Ag Verwendung von Alkenylen und Alkinylen als Zusätze in galvanischen Metallabscheidungsbädern

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8801827D0 (en) * 1988-01-27 1988-02-24 Jct Controls Ltd Improvements in electrochemical processes
DE4405741C1 (de) * 1994-02-23 1995-06-01 Atotech Deutschland Gmbh Verfahren zur elektrolytischen Abscheidung von Metallen aus Elektrolyten mit Prozeßorganik

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1293648A (en) * 1969-06-06 1972-10-18 Australian Iron Steel Pty Ltd Addition of metal ions to electrolytic plating baths
US4038160A (en) * 1975-07-03 1977-07-26 Albright & Wilson Limited Method of regenerating a chromium electroplating bath
FR2479856A1 (fr) * 1980-04-04 1981-10-09 Electricite De France Installation de traitement de surface par depot metallique et procede de regeneration des bains de depot metallique par voie electrolytique
US4469564A (en) * 1982-08-11 1984-09-04 At&T Bell Laboratories Copper electroplating process
US5100517A (en) * 1991-04-08 1992-03-31 The Goodyear Tire & Rubber Company Process for applying a copper layer to steel wire
GB2254859A (en) * 1991-04-18 1992-10-21 Nippon Cmk Kk In printed wiring board manufacturing use of waste etchant as copper ion sourcefor electroplating bath
DE4221970A1 (de) * 1992-06-30 1994-01-05 Schering Ag Verwendung von Alkenylen und Alkinylen als Zusätze in galvanischen Metallabscheidungsbädern

Also Published As

Publication number Publication date
EP0801692A2 (fr) 1997-10-22
DE19539865A1 (de) 1997-04-30
WO1997015704A2 (fr) 1997-05-01
JPH10511743A (ja) 1998-11-10

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