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WO1997017745A1 - Structure de support pour circuit integre - Google Patents

Structure de support pour circuit integre Download PDF

Info

Publication number
WO1997017745A1
WO1997017745A1 PCT/JP1995/002278 JP9502278W WO9717745A1 WO 1997017745 A1 WO1997017745 A1 WO 1997017745A1 JP 9502278 W JP9502278 W JP 9502278W WO 9717745 A1 WO9717745 A1 WO 9717745A1
Authority
WO
WIPO (PCT)
Prior art keywords
contact
block
socket
pin
pins
Prior art date
Application number
PCT/JP1995/002278
Other languages
English (en)
Japanese (ja)
Inventor
Shigeru Matsumura
Original Assignee
Advantest Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP14394894A priority Critical patent/JP3281180B2/ja
Priority claimed from JP14394894A external-priority patent/JP3281180B2/ja
Application filed by Advantest Corporation filed Critical Advantest Corporation
Priority to PCT/JP1995/002278 priority patent/WO1997017745A1/fr
Priority to US08/817,964 priority patent/US6012929A/en
Priority to KR1019960706232A priority patent/KR100202326B1/ko
Publication of WO1997017745A1 publication Critical patent/WO1997017745A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting

Definitions

  • the present invention relates to a structure of an IC socket in which a multi-pin BGA (Ball grid array) package type device or the like is repeatedly attached and detached in a semiconductor test equipment.
  • BGA Bit grid array
  • the BGA package is an IC package in which the lead wire of the device (DUT) 50 is a terminal of a hemispherical solder ball.
  • the number of pins is from 100 to 300 pins, and the pin spacing is 1.27 mm, 1. Omm, etc.
  • the DUT 50 is subjected to various electrical tests to perform a characteristic measurement pass / fail inspection. For this reason, the DUT 50 is mounted on an IC socket to perform an electrical test, and is removed from the IC socket after the test.
  • the IC socket In the IC test apparatus, in order to inspect a large number of DUTs 50, the IC socket is frequently attached and detached. For this reason, the contact between the DUT 50 and the terminal of the IC socket gradually causes poor contact and the contact pressure decreases, resulting in unstable contact.
  • FIG. 3 An example of the structure of the contact part of the IC socket used for inspection of the BGA package type device of the prior art is described below with reference to FIGS. 3 and 4.
  • FIG. 3 An example of the structure of the contact part of the IC socket used for inspection of the BGA package type device of the prior art is described below with reference to FIGS. 3 and 4.
  • FIG. 3 An example of the structure of the contact part of the IC socket used for inspection of the BGA package type device of the prior art is described below with reference to FIGS. 3 and 4.
  • the configuration of the test head portion includes a device holding mechanism 68 shown in FIG. 3, an IC socket, and a contact board 70 shown in FIG.
  • the IC socket includes a socket housing 62 and a plurality of contact bins 64.
  • the IC socket is mounted on a contact port 70, and the DUT 50 is pressed from above by a pressing mechanism to provide electrical contact.
  • the contact pin 64 is a panel-shaped pin, and the upper terminal of this pin is electrically connected to the DUT pin 51 by pressure contact with the hemispherical surface of the solder bump. ⁇ is formed, and the lower terminal portion of the contact pin 64 forms a compressive connection with the terminal pattern 72 on the surface of the contact board 70 by pressurized contact.
  • the terminal pattern 72 may be formed by a through hole, and the contact board 70 and the lower terminal of the contact pin 64 may be electrically connected by soldering.
  • the contact pin 64 as a whole has a central portion curved in a U-shape, and has a spring property for maintaining the upper and lower electrical contact pressures or the upper electrical contact pressure.
  • the contact pin 64 is formed integrally with the socket housing 62. Each of these pins is arranged in a grid at a position corresponding to each pin 51 of the DUT, and makes contact with the corresponding terminal pattern 72 immediately below each pin to form an electrical connection and form a contact board. Connected from the lower part of the device 70 to the device test equipment 80 side.
  • an electrical connection is formed by soldering with a through hole corresponding directly below each pin 64 and connected from the lower part of the contact board 70 to the device test apparatus 80 side.
  • the device holding mechanism 68 ensures that all contact bins 64 of the DUT mounted on the IC socket are in contact with each other, and has a holding mechanism by hand or air pressure from above the DUT. I have. This holding pressure is used to ensure that all pins of the hemispherical terminal of pin 51 are in contact with each other. Pressing with strong pressing force. As a result, the spring force of the IC socket is likely to be reduced. For this reason, pins that cause poor contact or contact instability appear in the connection bin 64. IC sockets in this state will be replaced immediately. It is also a consumable because it may be replaced a certain number of times or every time it is used.
  • the IC socket that electrically tests the DUT 50 with the IC test equipment is repeatedly attached and detached, so even a single contact pin 64 may cause poor contact or unstable contact. If there were any pins, the entire expensive IC socket had to be replaced.
  • connection is made by soldering, it is necessary to remove the soldering and replace it again in order to replace the IC socket, which is very costly.
  • the problem to be solved by the present invention is to provide a structure in which an IC socket is divided so that defective pins can be replaced in contact block units, and can be used for a wide variety of DUTs.
  • the purpose is to have a versatile IC socket structure. Disclosure of the invention
  • FIG. 1 shows a first solution according to the present invention.
  • a block housing 20 having a plurality of block grooves 22 for mounting 30 is provided, and a plurality of contact bins 3 2 corresponding to the pitch of the device 50 are provided. Are arranged in a row and a contact block 30 is provided. It is a means of implementation.
  • the contact block 30 is divided and has a removable structure, so that a structure in which only the defective contact block 30 can be easily replaced can be realized.
  • a block housing 20 having a plurality of block grooves 22 for mounting a contact block 30b is provided, and a rubber-like elastic body is provided.
  • a contact block 3 Ob is formed by winding a compress film 38 having a narrow pitch parallel conductor pattern formed on the surface of a core material 36 as a contact board 70. This is a means of electrical connection to the connection electronics pad formed above by pressurized contact.
  • the contact block 30b is divided and not easily soldered, so that it can be easily removed, so that only the defective contact block 30b can be removed.
  • the structure is such that it can be easily replaced and the same contact block 3 Ob can be used regardless of the DUT 50 pin-to-pin pitch.
  • a package holder 10 is provided in the block housing 20 for positioning and guiding the pin 51 of the device 50 to a position directly below the contact bin 32 of the contact block 30.
  • the package holder 10 and the block housing 20 are separated to provide a support structure to guide the DUT 50, so that only the package holder 10 side corresponds to the external dimensions of the DUT 50.
  • the block housing 20 is shared.
  • the package holder 10 with the split structure has the same pin count and pin arrangement, but the device outline may differ depending on the product type and the manufacturer, even if the pin interval is the same. Other parts are common Has a role that can be used.
  • the block housing 20 having the divided structure has a role of being able to be replaced in units of the contact block 30 in the event of poor contact or unstable contact of the contact bin 32.
  • the contact block 30 having the divided structure has an effect that can be commonly used if the number of pins in a row is equal to or less than DUT 50.
  • the same contact block 30b can be used regardless of the pitch of the DUT 50, so that a highly versatile contact block is used. It can be made into a lock structure.
  • FIG. 1 is a structural view of an IC socket according to the present invention, which is divided into three parts: a knock holder 10, a block housing 20, and a contact block 30.
  • FIG. 2 is a structural diagram of a contact block 3 Ob when the compressive elastomer of the present invention is used.
  • Figure 3 is an overview of the BGA package and the IC socket used for conventional device inspection.
  • FIG. 4 is an example of a conventional IC socket when a panel panel is used as a pin, and a cross-sectional structure diagram of a connector board 70.
  • the first embodiment according to the present invention is a structural example in which a leaf spring is used for a pin. This will be described with reference to FIG.
  • the configuration of the IC socket is: It is configured to be divided into a package holder 10, a block housing 20, and a contact block 30.
  • the package holder 10 has a guide structure for correctly positioning the DUT directly above the corresponding contact bin 32, and the guide is formed by a square package guide 14.
  • the external shape of the device may differ depending on the product type or manufacturer, even if the number of pins is the same, the number of pins is E, and the distance between pins is Z. For this reason, a split structure is adopted to accommodate these different external shapes.
  • the housing mounting hole 12 of this package holder 10 is inserted by inserting the block housing 20 from below, sandwiched by the contact board 70, and then screwed at the four corners.
  • the structure is fixed by pressing.
  • the block housing 20 includes a plurality of block grooves 22, a boss 24, and a block retainer 26.
  • the block groove 22 is a groove for mounting the contact block 30.
  • the number of block grooves, the groove length, and the arrangement pitch of the plurality of block grooves 22 are N rows of blocks corresponding to the number of pins N in the X direction for each type of DUT 50.
  • the number of grooves, the groove length corresponding to the number M of pins in the y direction, and the pitch P of the block groove 22 corresponding to the pin interval are formed.
  • the boss 24 is a protruding surface for positioning the height when the DUT is pressed from above, and functions as a DUT stopper.
  • a DUT stopper there are four rectangular parallelepipeds, but in addition, a cylindrical or triangular prism may be provided at multiple places. As a result, excessive pressing force is applied to the contact pin 32 side. To prevent deformation.
  • the block retainer 26 is a side for holding the package holder 10 when it is mounted and fixed.
  • the contact block 30 is a structure in which a plurality of contact pins 32 are arranged and accommodated in one row.
  • Each contact pin 32 is a flat plate-like pin as in the past, and is integrated with the contact block 30 and has M or more pins corresponding to the number M of pins in the y direction.
  • Contact bins 32 are installed with the corresponding pin spacing.
  • a versatile combination of IC sockets as shown in the following example can be realized.
  • both the N column and the M pin are different.
  • the block housing 20 common to these two types of DUTs is an N-20 row, using the block housing 20 of the block groove 22 corresponding to the 12 pin, and For the block block 30, use 20 pins with 12 pins. After that, it is sufficient to separately prepare package holders 10 corresponding to the two types of DUTs. As described above, in most cases, if the DUT has the same pitch, the block housing 20 and the contact block 30 can be shared. It indicates that it is possible.
  • a second embodiment of the present invention will be described with reference to the drawings.
  • the second embodiment according to the present invention is an example in which the structure of a contact pin used in the contact block 30 is a contact block 30b using a conductive elastomer (Elastomer). is there. This will be described with reference to FIG.
  • the structures of the package holder 10 and the block housing 20 are the same as in the first embodiment.
  • the contact block 30 b has a conductive elastomer structure, and is composed of a core material 36 and a conductive film 38.
  • the core material 36 is a columnar rubber-like elastic body.
  • the Diao Xiao film 38 is a thin flexible polyimide film wound around the core material 36 so as to make one round, and a number of narrow pitch parallel films are wound on the surface of this film.
  • the gold pattern treated copper pattern forms the core material 36 in an annular shape. This is installed in the block groove 22 of the block housing 20 shown in FIG. At this time, the block housing 20 uses a structure made of an insulating material such as resin so that the contact of the contact block 3 Ob does not short-circuit.
  • the contact is an annular conductive pattern that makes compressive contact.
  • Examples of the dimensions of the contact 39, which is an individual annular pattern, are, for example, a conductor width of 0.08 mm, the pitch between the contacts is 0.18 mm, Form parallel E rows.
  • the DUT 50 has the pin shape of the pin 51 or the pin array in which the E row is arranged in a lattice shape. This can be applied in the same way.
  • the contact block 30b can be used for all DUTs 50 by preparing one type corresponding to the maximum number of pins of the DUT 50. It indicates that it can be shared. Industrial applicability
  • the contact block 30 By making the contact block 30 detachable, if a contact failure or instability of the contact bin 32 at one place occurs, one contact Only the contact block 30 needs to be replaced, which eliminates the need to replace the entire expensive IC socket, and has the advantage of reducing the cost of replacement parts.
  • each component can be combined to minimize the variety of DUT pins and external shapes.
  • the configuration can cope with. For example, if the pin spacing is the same, the pin number can be dealt with by exchanging only the package holder 10 corresponding to the knocker outer shape.
  • the block housing 20 and the contact block 30 can be used as they are. In addition to this, even when the number of pins N in the X direction is different, it can be dealt with by replacing only the package holder 10.
  • the contact structure in which the film is wound on one core material 36 has a uniform height without any variation.
  • a contact is formed.
  • the same contact block 30b can be used regardless of the pitch between pins of the solder bump of the DUT 5 There is.
  • the structure is simple, it can be manufactured at low cost and the cost of parts can be reduced.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Connecting Device With Holders (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

La présente invention concerne un support polyvalent pour circuit intégré, comportant des barrettes de contact séparées, ce qui permet de remplacer une barrette dont une broche est défectueuse. Ce support pour circuit intégré convient pour des dispositifs en cours d'essai très divers, et il comporte un logement de barrettes (20) présentant plusieurs rainures (22) destinées à recevoir les barrettes de contact (30), et comporte des barrettes de contact pourvues de broches de contact (32) aux mêmes pas que ceux du dispositif (50) auquel le support pour circuit intégré est branché.
PCT/JP1995/002278 1994-06-02 1995-11-08 Structure de support pour circuit integre WO1997017745A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP14394894A JP3281180B2 (ja) 1994-06-02 1994-06-02 Ｉｃソケット構造
PCT/JP1995/002278 WO1997017745A1 (fr) 1994-06-02 1995-11-08 Structure de support pour circuit integre
US08/817,964 US6012929A (en) 1995-11-08 1995-11-08 IC socket structure
KR1019960706232A KR100202326B1 (ko) 1995-11-08 1995-11-08 Ic 소켓

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP14394894A JP3281180B2 (ja) 1994-06-02 1994-06-02 Ｉｃソケット構造
PCT/JP1995/002278 WO1997017745A1 (fr) 1994-06-02 1995-11-08 Structure de support pour circuit integre

Publications (1)

Publication Number Publication Date
WO1997017745A1 true WO1997017745A1 (fr) 1997-05-15

Family

ID=26436311

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP1995/002278 WO1997017745A1 (fr) 1994-06-02 1995-11-08 Structure de support pour circuit integre

Country Status (1)

Country Link
WO (1) WO1997017745A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5454267U (fr) * 1977-09-19 1979-04-14
JPS59165442A (ja) * 1983-03-10 1984-09-18 Yamaichi Electric Mfg Co Ltd 接触子
JPH0264182U (fr) * 1988-11-01 1990-05-14
JPH07335353A (ja) * 1994-06-02 1995-12-22 Advantest Corp Ｉｃソケット構造

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5454267U (fr) * 1977-09-19 1979-04-14
JPS59165442A (ja) * 1983-03-10 1984-09-18 Yamaichi Electric Mfg Co Ltd 接触子
JPH0264182U (fr) * 1988-11-01 1990-05-14
JPH07335353A (ja) * 1994-06-02 1995-12-22 Advantest Corp Ｉｃソケット構造

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