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WO1998047189A1 - Composant electroluminescent - Google Patents

Composant electroluminescent Download PDF

Info

Publication number
WO1998047189A1
WO1998047189A1 PCT/DE1998/000831 DE9800831W WO9847189A1 WO 1998047189 A1 WO1998047189 A1 WO 1998047189A1 DE 9800831 W DE9800831 W DE 9800831W WO 9847189 A1 WO9847189 A1 WO 9847189A1
Authority
WO
WIPO (PCT)
Prior art keywords
electroluminescent
substrate
component according
encapsulation
component
Prior art date
Application number
PCT/DE1998/000831
Other languages
German (de)
English (en)
Inventor
Wolfgang Grothe
Werner Gruenwald
Martin HÜPPAUFF
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Publication of WO1998047189A1 publication Critical patent/WO1998047189A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations

Definitions

  • the invention relates to an electroluminescent component in layered construction according to the preamble of claim 1.
  • the LEDs commonly used so far consist mainly of inorganic semiconductor materials.
  • electroluminescent components have also been known, the essential components of which are organic materials. rialien are.
  • O-LEDs generally contain one or more thin layers of organic charge transport compounds as the electroluminescent medium, but at least one such layer in a sandwich construction between the two electrodes for driving the O-LED, as described, for example, in WO 9 013 148 based on poly (p-phenylene vinylene).
  • Charge transport connections are generally understood to mean all connections which in some way transport charges, ie holes and / or electrons.
  • This class of compounds also includes all those compounds which are part of the emitter layer of the component, that is to say photoluminescent materials, such as, for example, fluorescent dyes. A large number of organic compounds that transport charges are described in the relevant literature.
  • Organic electroluminescent components such as the O-LED, have the disadvantage that they degrade under the influence of oxygen and water.
  • a basic distinction can be made between two degradation processes, the degradation of the interface electrode or the organic medium and the degradation the organic materials themselves. In both processes, oxygen and water or water vapor play a decisive role.
  • the same problem is also encountered with inorganic electroluminescent components, for example based on zinc sulfide (ZnS) or related systems, which degrade in the presence of water vapor. These components therefore also require special protection.
  • ZnS zinc sulfide
  • Encapsulations that consist of cover layers that protect the areas of the cathodes are described, for example, in EP-B1-0 468 439 and EP-B1-0 468 440.
  • These cover layers consist of evaporated pure metals or of codeposed metal composites that have metallic or organic components.
  • the disadvantage of these cover layers is that they must be evaporated onto the cathode using a mask. This procedure is very complex, particularly in the case of complicated structures.
  • the encapsulations described in the two above-mentioned publications alone are not sufficient to prevent the above-mentioned degradation processes, which is why they must be combined with further encapsulations.
  • the encapsulation consists of a glass body or a glass plate that is glued to the substrate. This cape The selection process must be carried out under an inert gas atmosphere, since otherwise air is trapped in the space between the glass body and the cathode, which leads to the destruction of the cathode.
  • a disadvantage of this encapsulation is its lack of flexibility, which prevents the production of a flexible display.
  • the electroluminescent component with the features of the main claim has the advantage that an encapsulation is provided in the form of the protective layer obtained by the plasma polymerization, which is both flexible and scratch-resistant and degradation-inhibiting due to its material properties and can also be produced inexpensively.
  • a plurality of protective layers obtained in this way by plasma polymerization are preferably provided for the encapsulation in order to largely prevent permeation of oxygen or water into the component protected by the encapsulation.
  • the process for depositing protective layers obtained by plasma polymerization onto the electroluminescent component is not part of the subject of this invention and can be found, for example, in the following publications: "Thin Layers (1991), Number 2, Pages 10ff" and “Material and Innovation 3/4 (1990 ) 3, page 50ff ".
  • the electroluminescent component is accordingly a flexible component designed, in which case the substrate preferably consists of a film, for example PET, polycarbonate or polyester.
  • a plasma polymerization layer is preferably deposited on the flexible substrate, which is transparent and transmits the light emitted by the electroluminescent layer structure.
  • This protective layer which is obtained by plasma polymerization, reduces the diffusion of water and oxygen through the flexible film-shaped substrate to such an extent that a long-life electroluminescent component of flexible design can be provided.
  • An additional advantage is that the generally non-scratch-resistant film is made scratch-resistant due to the plasma polymerized layer (s) deposited thereon.
  • the layered electroluminescent component in the figure is constructed from bottom to top from a carrier or substrate 1, a base electrode, for example an anode 2, a hole-injecting layer 3, one or more hole-transporting layer (s) 5, one or more Electron-transporting layer (s) 6, an electron-injecting layer 7 and a top electrode, for example a cathode 8.
  • a voltage, which originates from a current source Q, is applied to the base electrode and the top electrode 8.
  • the entire layer structure is encased by an encapsulation 9, which according to the invention consists of a protective layer obtained by plasma polymerization, preferably several such protective layers, and is transparent, flexible, scratch-resistant and inhibits degradation.
  • the substrate 1 is formed from a film which consists of a non-scratch-resistant material selected from the group consisting of PET, PEN, PES, PVC, PE, PP, polyamide, polycarbonate and polyester.
  • An outer coating 9a of the substrate 1, as shown in the figure, achieves a scratch-resistant and largely permeation-resistant seal of the flexible film material from which the substrate is made.

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

L'invention concerne un composant électroluminescent du type de construction en couches, comprenant un substrat (1) sur lequel sont disposées au moins deux électrodes (2, 8), une électrode de base et une électrode supérieure renfermant un milieu électroluminescent (4, 6), ainsi qu'un encapsulage (9) entourant les constituants du composant sur le substrat (1). En vue d'obtenir un encapsulage souple, économique, résistant au rayage ainsi qu'à la dégradation, l'encapsulage (9) selon l'invention est caractérisé en ce qu'il renferme au moins une couche protectrice obtenue par polymérisation au plasma.
PCT/DE1998/000831 1997-04-11 1998-03-21 Composant electroluminescent WO1998047189A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19715054.3 1997-04-11
DE19715054A DE19715054A1 (de) 1997-04-11 1997-04-11 Elektrolumineszierendes Bauelement

Publications (1)

Publication Number Publication Date
WO1998047189A1 true WO1998047189A1 (fr) 1998-10-22

Family

ID=7826159

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1998/000831 WO1998047189A1 (fr) 1997-04-11 1998-03-21 Composant electroluminescent

Country Status (2)

Country Link
DE (1) DE19715054A1 (fr)
WO (1) WO1998047189A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002021610A1 (fr) * 2000-09-11 2002-03-14 Osram Opto Semiconductors Gmbh Encapsulation au plasma pour composants electroniques et microelectroniques tels que des oled
DE102016115921A1 (de) 2016-08-26 2018-03-01 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1145338B1 (fr) * 1998-12-16 2012-12-05 Samsung Display Co., Ltd. Matiere de barriere contre les conditions d'ambiance destinee a des dispositifs electroluminescents organiques et son procede de fabrication
US7404751B2 (en) 2002-09-17 2008-07-29 Dai Nippon Printing Co., Ltd. Method of manufacturing a light emitting display panel and a light emitting display panel
US20070020451A1 (en) 2005-07-20 2007-01-25 3M Innovative Properties Company Moisture barrier coatings

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05101886A (ja) * 1991-10-08 1993-04-23 Tdk Corp 電界発光素子の保護
EP0566736A1 (fr) * 1990-11-30 1993-10-27 Idemitsu Kosan Company Limited Dispositif a electroluminescence organique
DE4343412A1 (de) * 1993-12-18 1995-06-22 Basf Ag Elektrolumineszierende Anordnungen
JPH07169567A (ja) * 1993-12-16 1995-07-04 Idemitsu Kosan Co Ltd 有機ｅｌ素子
WO1996008122A1 (fr) * 1994-09-08 1996-03-14 Idemitsu Kosan Co., Ltd. Procede d'enrobage d'un element electroluminescent organique et d'un autre element electroluminescent organique

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0566736A1 (fr) * 1990-11-30 1993-10-27 Idemitsu Kosan Company Limited Dispositif a electroluminescence organique
JPH05101886A (ja) * 1991-10-08 1993-04-23 Tdk Corp 電界発光素子の保護
JPH07169567A (ja) * 1993-12-16 1995-07-04 Idemitsu Kosan Co Ltd 有機ｅｌ素子
DE4343412A1 (de) * 1993-12-18 1995-06-22 Basf Ag Elektrolumineszierende Anordnungen
WO1996008122A1 (fr) * 1994-09-08 1996-03-14 Idemitsu Kosan Co., Ltd. Procede d'enrobage d'un element electroluminescent organique et d'un autre element electroluminescent organique
EP0781075A1 (fr) * 1994-09-08 1997-06-25 Idemitsu Kosan Company Limited Procede d'enrobage d'un element electroluminescent organique et d'un autre element electroluminescent organique

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
GUSTAFSSON G ET AL: "FLEXIBLE LIGHT-EMITTING DIODES MADE FROM SOLUBLE CONDUCTING POLYMERS", NATURE, vol. 357, no. 6378, 11 June 1992 (1992-06-11), pages 477 - 479, XP000574074 *
PATENT ABSTRACTS OF JAPAN vol. 017, no. 450 (E - 1416) 18 August 1993 (1993-08-18) *
PATENT ABSTRACTS OF JAPAN vol. 095, no. 010 30 November 1995 (1995-11-30) *

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002021610A1 (fr) * 2000-09-11 2002-03-14 Osram Opto Semiconductors Gmbh Encapsulation au plasma pour composants electroniques et microelectroniques tels que des oled
US6933538B2 (en) 2000-09-11 2005-08-23 Osram Opto Semiconductors Gmbh Plasma encapsulation for electronic and microelectronic components such as organic light emitting diodes
DE10044841B4 (de) * 2000-09-11 2006-11-30 Osram Opto Semiconductors Gmbh Plasmaverkapselung für elektronische und mikroelektronische Bauelemente wie OLEDs sowie Verfahren zu dessen Herstellung
DE102016115921A1 (de) 2016-08-26 2018-03-01 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements
US10840413B2 (en) 2016-08-26 2020-11-17 Osram Oled Gmbh Optoelectronic device and method of producing an optoelectronic device
DE102016115921B4 (de) 2016-08-26 2023-09-21 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements
DE102016115921B9 (de) 2016-08-26 2024-02-15 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements

Also Published As

Publication number Publication date
DE19715054A1 (de) 1998-10-15

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