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WO1998008645A2 - Appareil destine a perforer des matieres de type bande continue - Google Patents

Appareil destine a perforer des matieres de type bande continue Download PDF

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Publication number
WO1998008645A2
WO1998008645A2 PCT/GB1997/002283 GB9702283W WO9808645A2 WO 1998008645 A2 WO1998008645 A2 WO 1998008645A2 GB 9702283 W GB9702283 W GB 9702283W WO 9808645 A2 WO9808645 A2 WO 9808645A2
Authority
WO
WIPO (PCT)
Prior art keywords
laser
web
substrate material
laser beam
guide means
Prior art date
Application number
PCT/GB1997/002283
Other languages
English (en)
Other versions
WO1998008645A3 (fr
Inventor
Robert Jones
Michael Hazell
Original Assignee
British Polythene Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GBGB9617821.5A external-priority patent/GB9617821D0/en
Application filed by British Polythene Limited filed Critical British Polythene Limited
Priority to AU40248/97A priority Critical patent/AU4024897A/en
Priority to EP97937715A priority patent/EP0925141A2/fr
Publication of WO1998008645A2 publication Critical patent/WO1998008645A2/fr
Publication of WO1998008645A3 publication Critical patent/WO1998008645A3/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1603—Laser beams characterised by the type of electromagnetic radiation
    • B29C65/1606—Ultraviolet [UV] radiation, e.g. by ultraviolet excimer lasers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1603—Laser beams characterised by the type of electromagnetic radiation
    • B29C65/1612—Infrared [IR] radiation, e.g. by infrared lasers
    • B29C65/1616—Near infrared radiation [NIR], e.g. by YAG lasers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1603—Laser beams characterised by the type of electromagnetic radiation
    • B29C65/1612—Infrared [IR] radiation, e.g. by infrared lasers
    • B29C65/1619—Mid infrared radiation [MIR], e.g. by CO or CO2 lasers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/74—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by welding and severing, or by joining and severing, the severing being performed in the area to be joined, next to the area to be joined, in the joint area or next to the joint area
    • B29C65/747—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by welding and severing, or by joining and severing, the severing being performed in the area to be joined, next to the area to be joined, in the joint area or next to the joint area using other than mechanical means
    • B29C65/7473—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by welding and severing, or by joining and severing, the severing being performed in the area to be joined, next to the area to be joined, in the joint area or next to the joint area using other than mechanical means using radiation, e.g. laser, for simultaneously welding and severing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/20—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines
    • B29C66/21—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being formed by a single dot or dash or by several dots or dashes, i.e. spot joining or spot welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/45—Joining of substantially the whole surface of the articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/834—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools moving with the parts to be joined
    • B29C66/8351—Jaws mounted on rollers, cylinders, drums, bands, belts or chains; Flying jaws
    • B29C66/83511—Jaws mounted on rollers, cylinders, drums, bands, belts or chains; Flying jaws jaws mounted on rollers, cylinders or drums

Definitions

  • This invention relates industrial processes for producing perforated webs or sheet form materials, and, in particular, though not exclusively, to apparatus for use in non-contact perforating ("punching") of continuous web or indefinite lengths of sheet form materials, particularly paper webs or polymer sheets and films considered as thin or ultra-thin.
  • the apparatus used in an industrial process for perforating materials should be capable of providing a variety of openings of a desired shape without difficulty.
  • perforation and hole are used to generally indicate the formation of an opening or cut in a material without any intended restriction as to the shape so formed unless otherwise stated.
  • the perforating of web like materials as part of an industrial process also requires providing openings through the material consistently and efficiently at minimum cost. Frequently the material must be foraminated to a high degree but use of mechanical impact methods may result in distortion or possible weakening of the material due to localised stretching of the material or other damage resulting from contact with the foraminating device. Very thin paper webs or polymer films are difficult to process mechanically. Furthermore with mechanical devices alteration of the selected size of hole usually involves some process down-time and manipulation of the hole-punching devices to change the sizes to be cut, spacing etc.
  • the holes are typically 10 mm diameter and arranged at 100 mm centres with a 300 mm gap at each side across the width of the film.
  • the pattern is repeated at 80 mm intervals.
  • Ablation processes are in general initiated by optical energy at wavelengths in the range 0.2 to 10 ⁇ m and the commonly employed lasers are Neody ⁇ nium: Yttrium aluminium garnet (Nd:YAG -wavelength ⁇ 1 ⁇ m) and Carbon Dioxide (C0 2 - wavelength ⁇ 9 to "11 ⁇ m) .
  • the wavelength for ablation of a particular material is dependent upon the material type and composition.
  • Kapton for example ablates efficiently at 0.28 ⁇ m which coincides with an emission wavelength of an U.V. Excimer laser.
  • EP-A-0 281 686 discloses a method of and apparatus for the perforating of a paper substrate material with a pulsed laser.
  • the use of mirrors, in conjunction with prisms and focussing lenses to direct and focus the radiation beam or beams is also disclosed.
  • the apparatus disclosed utilises polygon mirrors with their optical axis parallel to the width of a sheet of substrate being fed through the apparatus.
  • the mirrors can be rotated in synchronisation or asychronisation with the speed of the sheet of material but they are always independent in space of one another.
  • the apparatus proposed there would be complex to make and operate partly due to the dual nature of the arrangement for the directing of the laser beam to several points at one moment in time, as well as expensive due to the use of so much expensive optical equipment such as polygon mirrors. Further in view of the fact that beam splitting is a critical feature of the proposed apparatus, each time the beam is split there is a reduction in the power density of the beam. This raises a potential problem with regard to whether the divided beam will have sufficient power to achieve the desired surface energy level to achieve ablation of the substrate material rather then thermal dissipation therein.
  • EP-A-0 234 805 discloses a method and apparatus for the formation of weakened areas in a tube like substrate, for example for use with beverage containers .
  • the document uses internally disposed mirrors to effect the weakening of the substrate material which may be polythene.
  • EP-A-0 155 035 describes the perforation of a polyolefin film bag for air-venting purposes by use of a laser to form the minimum perforation obtainable i.e. not more than about 150 ⁇ m, preferably 70-90 ⁇ m. These sizes are too small for the present purposes. Particularly such a proposal is totally unsuited for the purposes of producing perforated polyethylene films as obtainable by the mechanical hole punch process referred to in Table 1 above.
  • a method of forming larger holes and / or slots is described in O-A-96/19 313 possibly utilising a C0 2 laser in view of its efficiency in converting radiant energy to heat in the material to be perforated. This involves additionally directing a gas which may be oxygen enriched to burn the required holes. Such a proposal does not provide ablation and cannot be adopted to give good hole quality through multiple layers.
  • An object of the present invention is to provide improvements in or relating to perforation of substrates on a commercial scale.
  • a further object is to provide an improved means for forming relatively large holes in thin web or sheet form substrates, particularly plastics film substrates .
  • an aim of the present invention is concerned with providing apparatus for the perforating of web- like substrates, particularly polymeric materials such as polyethylenes by an ablation technique using energy from a focussed or coherent electromagnetic radiation source.
  • a further objective of the invention is to provide a method of applying energy emitted by a laser source device successfully in an industrial process for non-contact perforation of web substrates.
  • apparatus for the non- impact formation of one or more perforations in a web of substrate material
  • apparatus includes : means to transport and convey the web of substrate material through the apparatus,- a concentrated or focussed electromagnetic energy device for generating a coherent beam capable of ablating a substrate material, preferably a laser source device having a transmission wavelength which falls within an absorption band of a transmission spectrum of the substrate material; and means for directing the beam to the web of substrate material whereby the beam is selectively and sequentially directed towards target perforation sites upon the substrate in succession, e.g. by periodically interposing a device for reflecting or deflecting the path of the beam to direct the beam to effect ablation and perforating of the web.
  • the beam directing means comprises an array of reflective surfaces arranged on a support which in use is movable to bring each reflective surface successively through the path of the laser beam in a repeatable manner and thereby automatically switch the beam from one target site to the next according to a predetermined programme of operation.
  • the switching is put into effect by the controlled location of the array of reflective surfaces and simultaneous controlled advancement of the web of substrate material under the beam directing means.
  • the laser may be run from a static operational position adjacent the web transport system, essentially under continuous operation during a production run, with all the necessary switching of the beam being achieved by the beam delivery mechanism wherein a reflecting surface or surfaces acts to redirect the beam of ablating radiation against the web of substrate material precisely where and when it is required and so effectively provide a means of turning the radiation on and off with regard to a target point on the substrate.
  • a reflecting surface or surfaces acts to redirect the beam of ablating radiation against the web of substrate material precisely where and when it is required and so effectively provide a means of turning the radiation on and off with regard to a target point on the substrate.
  • the means for applying or re-directing the ablating radiation comprises a body rotatable about an axis parallel to the direction of the radiation emitted from the laser which body is provided with a number of reflecting surfaces which as the body rotates selectively and sequentially direct the laser radiation onto the web of substrate material.
  • the rotatable body comprises a drum the rotation of the which causes reflective devices to intercept the beam from the source device and re-direct it to the web of substrate material sequentially and in a repeatable predetermined pattern.
  • the drum is rotated by a motor, the operation of which is controllable by a computer or microprocessor to enable it to be synchronised with the web transport system.
  • consideration must be given to a number of factors. These factors include the nature of the actual substrate material involved, the thickness of the substrate material (single or multi-layer) , the size of the perforation required, and the density of the perforations required.
  • the operational characteristics of the laser itself have a bearing on the operation of the apparatus and in particular the speed at which the web of substrate material can be processed using the apparatus .
  • the substrate material may inherently have an appropriate absorption band coincident with the emission wavelength of the selected irradiation source.
  • the source is a carbon dioxide (C0 2 ) laser which is a laser suitable for industrial use
  • the polymer film may be a polyimide, a Phillips type hot pressed film polythene (see Figure 4), a Corlona 800 Shell polythene, or another commercially available polythene rich in pendent methylene or other group imparting appropriate absorbance characteristics to the material.
  • the chosen substrate material does not have an appropriate absorption band matching the preferred laser source device or any others which may be available, then in accordance with an inventive aspect of this invention consideration should be given to modifying the chosen substrate material to make it acquire the desired absorption characteristics.
  • This aspect can also be applied to achieve perforation of paper substrates in a similar way to the processing of polymer films as particularly described herein.
  • Suitable dopants include inorganic materials such as opacifiers, fillers and pigments e.g. polysiloxanes , silicates and titania, and substrate compatible organic materials including appropriately absorbing polymer additives such as typical polyethylene compatible co- monomers e.g. vinyl acetate, ethyl acrylate, methyl acrylate, butyl acrylate, a vinyl ester, or an ester of acrylic acid or methacrylic acid, and mixtures thereof, to obtain a doping effect by forming a copolymer with the base polymer.
  • inorganic materials such as opacifiers, fillers and pigments e.g. polysiloxanes , silicates and titania
  • substrate compatible organic materials including appropriately absorbing polymer additives such as typical polyethylene compatible co- monomers e.g. vinyl acetate, ethyl acrylate, methyl acrylate, butyl acrylate, a vinyl ester, or an ester of acrylic acid
  • Such a copolymer includes in its matrix additional functionalities capable of absorbing at the desired wavelengths when irradiated.
  • additional functionalities capable of absorbing at the desired wavelengths when irradiated.
  • EVA ethylene-vinyl acetate
  • the appropriate dopant/additive material to be selected and the amount of dopant/additive material employed are dependent upon a number of factors such as: (i) the wavelength required; (ii) the required mechanical strength of the polymer film; and (iii) provision of an ablation rate adequate for a practical production environment.
  • the dopants may comprise up to 20%, say from 1-10% of the film, by weight.
  • the dopant may comprise less than
  • a significant advantage of this invention is that it enables relatively large holes, greater than 1 mm (0.001 metres) to be formed in thin polymer foils, for example thin films of polyethylenes of say 70 ⁇ m, or less, up to about 400 ⁇ m thick.
  • the invention is also usefully employed in perforating multiple layers simultaneously, which by ablation permits fast perforation cleanly through the layers which remain separable.
  • the invention also provides the capability of trepanning very large holes accurately by adopting a sequential close perforation process.
  • the wavelength of the radiation emitted by the laser must be suitable for the substrate material i.e. of the correct order, otherwise the substrate material will not ablate but will melt and burn. Therefore, the laser is selected or if possible tuned to emit a wavelength which coincides with or is substantially the same as the absorption wavelength of the substrate material being ablated.
  • selecting and installing a laser source device is a major capital investment n any production line, it is preferred to consider preliminary modification of the substrate material.
  • the absorption wavelength of the substrate material is adjusted during initial manufacture thereof, e.g. during a preliminary melt processing step prior to film forming, or during a paper web forming step, by the addition of suitable dopant or additive materials such as pigments or co-monomer identified as providing the appropriate absorption characteristics as mentioned above.
  • laser source devices A wide choice of laser source devices is available and it is considered that the invention can be worked with any laser capable of delivering radiation of the correct wavelength and of sufficient power density to effect ablation rather than melting of the substrate material.
  • Preferred lasers are the high powered readily available monochromatic lasers such as excimer lasers and carbon dioxide lasers.
  • Fig 1 shows a schematic block diagram illustrating a generalised process of the invention for perforating a material using a laser
  • Fig 2 shows an optical absorption spectrum through a known 50 ⁇ m polythene film sample
  • Fig 3 is a graph representing rate of ablation of polythene sheet by etch rate versus fluence for the sample of Fig 2 using a 193 ⁇ m excimer laser at etch rates of 35 ⁇ m and 50 ⁇ m
  • Fig 4 shows the optical absorption spectrum of a
  • FIG. 6 shows the optical absorption spectrum of a generic polythene rich in pendent methylene groups ;
  • Fig 7 shows a schematic diagram of a preferred embodiment of an apparatus for forming hole(s) in a polymer film according to the present invention
  • Fig 8 is a schematic end view of the apparatus of
  • Fig 7; Fig 9 shows schematically the parameters involved in hole formation utilising the invention;
  • Fig 10 represents by a graph the relationship between height above work surface and drum radius for the apparatus of Fig 7 ;
  • Fig 11 shows optical absorption spectra (C0 2 laser) for 3 polythene foil types (A, B, and C) used in this invention;
  • Fig 12 shows the results of ablation of a 50 ⁇ m thick inorganic material doped polymer foil type (A) the absorption spectrum of which is shown in Fig. 11;
  • Fig 13 shows the results of ablation of a 150 ⁇ m thick foil (C) , including both an inorganic dopant and a copolymer dopant in the polymer sample the absorption spectrum of which is shown in Fig. 11; and
  • Fig 14 shows the results of ablation of a doped
  • FIG. 1 of the drawings there is shown by way of block diagrams a general layout of a method of perforating a web of substrate material.
  • the method is applied to a web of substrate material which is a polymer film 15, here, a sheet of polythene.
  • the polymer film 15 is transported through a perforation operation zone by, for example, a conventional sheet or film transport conveyor system 23.
  • a laser perforating apparatus 20 is set up with respect to the polymer film 15 being transported.
  • This apparatus includes beam shaping optics 21, to ensure that the laser beam is coherent and well defined, and beam delivery optics 22 to relay the beam accurately and precisely to the surface of the polymer film 15.
  • the beam delivery system is based on the technique known as beam time mul tiplexing by virtue of the fact that the beam is sequentially switched to illuminate different target sites on the film 15.
  • the alternative technique of beam division mul tiplexing has the disadvantage of reducing the energy of the beam by division. Therefore greater care would have to be taken with that technique to ensure that the desired ablation is achieved.
  • the inventive concept of targetting a specific absorption band can still be relied upon provided the divided beam can still effect ablation. Where the energy density delivered to a target site is not adequate to achieve ablation the bulk material absorbs the energy will only melt and hole formation becomes erratic.
  • the apparatus includes a laser 20 with beam shaping optics, beam delivery optics mechanism (non-contact perforating means) 25, and film transport means (not shown) for transporting the polymer film 15 through the processing equipment in the direction shown by the arrow past the laser and under the beam delivery mechanism 25.
  • the laser perforating apparatus 25 is positioned so that the laser beam emitted from the laser 10 is transverse disposed to the direction of transport of the polymer film 15.
  • the laser 20 used in the illustrated arrangement is selected with regard to the polymer film or films to be processed and, in particular, the materials to be or likely to be processed using the equipment. This is primarily due to the fact that in the treatment of polymeric films in particular ablation of the material by laser irradiation is preferable so as to provide clean and well defined perforations as explained hereinbefore to avoid melting and burning of the material .
  • the wavelength of the light emitted by the laser should be at the absorption wavelength of the polymeric material. Since industrial lasers generally have a certain wavelength of emission, it may be necessary to adjust the wavelength of absorption of the material of the polymer film to ensure ablation as discussed hereinbefore.
  • the apparatus uses a C0 2 laser with high output powers in the wavelength range 9 ⁇ m to 11 ⁇ m.
  • the laser 20 provides the energy required for perforating the polymer film 15 and this is in the form of a focussed, i.e. a well defined sharp, beam of coherent radiation.
  • a focussed, i.e. a well defined sharp, beam of coherent radiation i.e. a well defined sharp, beam of coherent radiation.
  • Those experienced in the field of lasers will understand the principles of beam shaping and alignment. Briefly, once the beam is emitted from the laser it passes through beam shaping optics 21 (Fig. 1) . The geometry of the beam is modified by the beam shaping optics 21 so that the fluence (energy per unit area) in the plane of the film 15 is maximised and limited to the dimensions of the perforation.
  • the beam delivery mechanism uses optical devices, here mirrors 35, to re-direct and position the beam leaving the beam shaping optics for correct ablation of the surface of the film 15 to obtain perforation.
  • optical devices here mirrors 35
  • mirrors 35 to re-direct and position the beam leaving the beam shaping optics for correct ablation of the surface of the film 15 to obtain perforation.
  • multiple perforations are rapidly and successively ablated by beam time mul tiplexing. Consequently at any one moment in time there is only one beam acting on the substrate but the speed of operation is such that this would not be obvious to an observer .
  • the beam delivery optics 25 comprises a drum 30 rotatable about an axis substantially parallel to the direction of the laser radiation but not coaxial therewith.
  • the drum has an outer surface onto which is affixed a number of mirrors 35.
  • the drum 30 is arranged transversely to the direction of travel of a web substrate to be perforated and extends over the full width thereof.
  • the drum 30 is turned about its axis of rotational symmetry by a belt drive means here illustrated but unnumbered where power from a motor which may be an electric motor is transferred through a belt to a speed reduction drive-wheel attached to the drum 30.
  • a belt drive means here illustrated but unnumbered where power from a motor which may be an electric motor is transferred through a belt to a speed reduction drive-wheel attached to the drum 30.
  • the perforation process requires the polymer film 15 to be being transported into an appropriate target zone, and the drum 30 to be rotated by the motor whilst the C0 2 laser 20 emits a beam of radiation which passes through the beam shaping means 21 before impinging against one of the mirrors 35 on the drum 30 and to be deflected downwards onto the polymer film 15 where it ablates the material of the film 15 and forms a perforation.
  • the invention relies on use of ablation as opposed to melting and this can only occur where the irradiated target material is capable of a strong molecular absorption resonant with the incident wavelength.
  • the laser choice is limited by the material's natural molecular absorption bands.
  • ablation rate depends on energy density. In order to break bonds and eject material from the body of the polymer a threshold energy must be available thus requiring a critical energy density. As the energy density is increased more material can be volatilised. However eventually the rate saturates.
  • the rate at which material is ablated is determined, for a given energy density by the absorption of the material at the laser wavelength. A stronger absorption results in resonant absorption by a chemical bond which then breaks by ablation in preference to melting and hence more material is removed in a single shot. If the band is weak much of the pulse energy is converted to thermal energy and therefore wasted. Tests performed on polymer materials have shown that a 1/e absorption length of 1-2 ⁇ m results in saturated ablation at a rate of ⁇ 2 ⁇ m/shot from a typical excimer laser used for ablation of polymer having an emission wavelength: 193 nm; an energy per pulse: 4 mJ; and a duty cycle: 5 Hz, 20 ns pulse.
  • the energy density must reach a critical level over the whole of the shape to be ablated if a hole is to be generated in a single pass.
  • the energy emitted from the laser must be increased as the square of the diameter of a hole to be formed.
  • the energies available from a typical excimer laser as specified in the preceding paragraph are suitable for holes around 200 ⁇ m in diameter but for larger holes the beam must be scanned. Also an excimer is not suitable for trepanning large holes because the energy delivery rate is too low.
  • Ablation is the key to forming a high quality hole in the polymer and only occurs if the incident energy input is resonant with a sample absorption.
  • a short list of such wavelengths is obtained from the optical absorption spectrum absorption.
  • Figure 2 shows the optical absorption spectrum of a 50 ⁇ m known polythene foil sample (80% LDPE, 20% LLDPE) between 0.190 ⁇ m and 25 ⁇ m. The spectrum is corrected for background absorption. The bands are listed in Table 2 with lasers having emission near that wavelength.
  • the absorption spectrum of Fig. 2 shows that the sample has an absorption of around 90% (10% transmission) through 50 ⁇ m at the excimer wavelength, 193 nm. This corresponds to an absorption length of 20 ⁇ m.
  • the ablation rate depends on energy density of the incident laser beam at the absorption band.
  • polymer samples were exposed to energy densities of between 1 and 10 J/cm 2 from sources operating outside an absorption band; C0 2 laser at 10.6 ⁇ m and 9.4 ⁇ m and an excimer laser at 251 nm. In each case the polythene sheet melted uncontrollably.
  • the data confirms that the ablation rate is saturating around 10 J/cm 2 so that simply increasing the energy density will not lead to a significant increase in cutting rate.
  • the saturation rate is in line with expectation due to the relatively weak absorption of the band. Ablation through two layers was tested and was confirmed to be clean, without melting. The two layers did not melt together.
  • the area of material ablated depends on laser power. An energy density of 10 J/cm 2 is required to ablate 0.5 ⁇ m of material .
  • the laser used here was a high power excimer laser suitable for ablation of polymer, as follows: Product: Lambda Physik LPX325i; Nova tube and Halo safe for high reliability and ease of use;
  • This laser emitted only 4 mJ per pulse, resulting in a maximum hole diameter, without scanning, of 225 ⁇ m.
  • the maximum energy available from this class of laser is around
  • the total film thickness normally varies between 70 ⁇ m and 400 ⁇ m; thus between 140 and 800 pulses would be needed to ablate a 225 ⁇ m diameter hole. Further the film may travel at either 40 m/min or
  • a C0 2 laser would be preferred as it is a highly reliable cheap source with low maintenance costs and is widely used in industry.
  • a typical system as detailed in Table 3 offers high powers, 1 kW at high repetition rates, 5 kHz, and is highly reliable.
  • Effective power (at nominal power) approx 2.5 kW approx 2.5 kW Effective poser 45 A 55 A (and by) Max. Current 63 A NH 80 A NH consumption Fuses
  • the C0 2 wavelengths can be generated in one of a number of ways, such as, the non-limitative examples of; (i) Using an alternative polymer such as polyimide (ii) Doping current polythene with, for example, a polysiloxane or titania pigment.
  • Changing the material may have major implications for the production process, recycling, cost and mechanical strength all of which must be assessed when considering the feasibility of changing the material to match the spectral absorption characteristics to a preferred laser source.
  • a polyimide ablation rate of 10 ⁇ m from 1 J/cm 2 pulse yielding a 400 ⁇ m deep hole, equivalent to cutting through 8 layers of 50 ⁇ m film, can be formed in 8 ms .
  • the diameter of the hole cut in this time with a standard 1000 W laser delivery 200 mJ per pulse is around 5 mm. Lasers operating at several times this power and repetition rate are not uncommon (see Table 3) although more expensive thus higher repetition rates are feasible if required.
  • drum scanner design and practical operating conditions are determined from the time needed to cut the holes, the beam geometry, polymer traverse speed and pattern repeat .
  • Time: the optimum time to expose the sheet is given by the time to ablate the sample: t N/R where R is the laser repetition rate and N, the number of pulses to ablate the working thickness is given by:
  • N T/T a where T is the total thickness to be processed and T a is the thickness ablated per shot.
  • Beam geometry for this application the laser pulse is required to cut through several layers of the polymer repeated pulses thus, to ensure the shape formed is the same for each layer, the laser spot must be directed to the same point on the polymer surface throughout the exposure .
  • the beam traverse and polymer velocities must therefore be matched. In such as case the exposed area is the circular beam area,- V 4 d 2
  • V ⁇ can be related to the drum rotation rate and the height of the mirror above the work surface :
  • V b (Cp-C 3 ) ⁇ Equating the polymer velocity, V , and the directed beam velocity V ⁇ .-
  • D The working height of the drum above the travelling surface, D, can be chosen independently where:
  • the pattern repeat time must be greater than the time to generate all the perforations across the sheet: tr _> n t
  • Drum geometry and operation first the feasibility of cutting the perforation in the time allowed must be confirmed for the specified operating conditions.
  • the working beam scanner parameters can be determined.
  • Perforation cutting for all the conditions defined in Table 1 can be met for a given drum radius, C s , and number of mirror sets, X, over the drum by varying the drum rotation frequency, f, and the height above the work surface, D. Realistic operating frequencies and working heights can be achieved with 5 mirror sets on the drum.
  • Increasing the working height is achieved by an increased number of mirror sets, for example:

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Replacement Of Web Rolls (AREA)
  • Laser Beam Processing (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Treatment Of Fiber Materials (AREA)
  • Laminated Bodies (AREA)
  • Making Paper Articles (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)

Abstract

L'appareil faisant l'objet de cette invention sert à effectuer des perforations sur une bande d'une matière support telle qu'un film polymère (15), comprenant un laser statique (20), un déflecteur de faisceau amovible, par exemple un tambour rotatif (30), contenant une pluralité de réflecteurs optiques (35) disposés de façon à dévier par séquences et de façon sélective le faisceau sur des emplacements cibles successifs de la bande, afin d'effectuer des perforations par ablation de la surface. Pour cela, il y a deux possibilités: soit on sélectionne le laser dont la longueur d'onde d'émission coïncide avec une bande d'absorption moléculaire à une fréquence de résonance, soit la matière proprement dite est dopée de façon à présenter une absorbance appropriée à la longueur d'onde d'émission type du laser disponible.
PCT/GB1997/002283 1996-08-27 1997-08-27 Appareil destine a perforer des matieres de type bande continue WO1998008645A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
AU40248/97A AU4024897A (en) 1996-08-27 1997-08-27 Apparatus for perforating web like materials
EP97937715A EP0925141A2 (fr) 1996-08-27 1997-08-27 Appareil destine a perforer des matieres de type bande continue

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
GB9617821.5 1996-08-27
GBGB9617821.5A GB9617821D0 (en) 1996-08-27 1996-08-27 Improvements in or relating to processing of polymer films
GB9707203.7 1997-04-09
GBGB9707203.7A GB9707203D0 (en) 1996-08-27 1997-04-09 Improvements in or relating to polymer films

Publications (2)

Publication Number Publication Date
WO1998008645A2 true WO1998008645A2 (fr) 1998-03-05
WO1998008645A3 WO1998008645A3 (fr) 1998-07-09

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EP (1) EP0925141A2 (fr)
AT (1) ATE234703T1 (fr)
AU (1) AU4024897A (fr)
DE (1) DE69720049T2 (fr)
ES (1) ES2186299T3 (fr)
WO (1) WO1998008645A2 (fr)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2338201A (en) * 1998-06-13 1999-12-15 Exitech Ltd Laser drilling of holes in materials
WO1999065639A1 (fr) * 1998-06-13 1999-12-23 Exitech Limited Perçage par laser de trous dans des materiaux
GB2357987A (en) * 2000-01-10 2001-07-11 Danisco Flexible Ltd Web treatment
WO2006069261A3 (fr) * 2004-12-22 2006-08-31 Douglas Machine Inc Appareil et procede de traitement selectif de materiaux par energie rayonnante
US8175560B2 (en) 2006-03-16 2012-05-08 Freescale Semiconductor, Inc. Method and system for tuning an antenna
USRE44886E1 (en) * 2001-05-17 2014-05-13 Preco, Inc. Method and apparatus for improving laser hole resolution
US8814430B2 (en) 2010-02-23 2014-08-26 Kraft Foods R&D, Inc. Food package having opening feature
US20170174852A1 (en) * 2014-04-03 2017-06-22 3M Innovative Properties Company Apertured film and method of making an apertured film with a laser
WO2020010238A1 (fr) * 2018-07-05 2020-01-09 Preco, Inc. Matériaux d'hydrogel de traitement laser
US20220324058A1 (en) * 2021-04-09 2022-10-13 INTERLAS GmbH & Co. KG Microperforation method with a moving web

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3656988A (en) * 1969-02-27 1972-04-18 Watch Stones Co Ltd Method for the fabrication of holes in a workpiece by means of laser-beams and apparatus for the performance of the aforesaid method
GB8803560D0 (en) * 1988-02-16 1988-03-16 Wiggins Teape Group Ltd Laser apparatus for repetitively marking moving sheet
DE4000561A1 (de) * 1990-01-10 1991-07-11 Laser Lab Goettingen Ev Energiestrahlablationsverfahren

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2338201A (en) * 1998-06-13 1999-12-15 Exitech Ltd Laser drilling of holes in materials
WO1999065639A1 (fr) * 1998-06-13 1999-12-23 Exitech Limited Perçage par laser de trous dans des materiaux
GB2357987A (en) * 2000-01-10 2001-07-11 Danisco Flexible Ltd Web treatment
USRE44886E1 (en) * 2001-05-17 2014-05-13 Preco, Inc. Method and apparatus for improving laser hole resolution
US7823366B2 (en) 2003-10-07 2010-11-02 Douglas Machine, Inc. Apparatus and method for selective processing of materials with radiant energy
WO2006069261A3 (fr) * 2004-12-22 2006-08-31 Douglas Machine Inc Appareil et procede de traitement selectif de materiaux par energie rayonnante
US8175560B2 (en) 2006-03-16 2012-05-08 Freescale Semiconductor, Inc. Method and system for tuning an antenna
US8814430B2 (en) 2010-02-23 2014-08-26 Kraft Foods R&D, Inc. Food package having opening feature
US20170174852A1 (en) * 2014-04-03 2017-06-22 3M Innovative Properties Company Apertured film and method of making an apertured film with a laser
WO2020010238A1 (fr) * 2018-07-05 2020-01-09 Preco, Inc. Matériaux d'hydrogel de traitement laser
US20220324058A1 (en) * 2021-04-09 2022-10-13 INTERLAS GmbH & Co. KG Microperforation method with a moving web

Also Published As

Publication number Publication date
DE69720049D1 (de) 2003-04-24
ATE234703T1 (de) 2003-04-15
ES2186299T3 (es) 2003-05-01
WO1998008645A3 (fr) 1998-07-09
DE69720049T2 (de) 2003-09-25
EP0925141A2 (fr) 1999-06-30
AU4024897A (en) 1998-03-19

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