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WO1998008645A3 - Appareil destine a perforer des matieres de type bande continue - Google Patents

Appareil destine a perforer des matieres de type bande continue Download PDF

Info

Publication number
WO1998008645A3
WO1998008645A3 PCT/GB1997/002283 GB9702283W WO9808645A3 WO 1998008645 A3 WO1998008645 A3 WO 1998008645A3 GB 9702283 W GB9702283 W GB 9702283W WO 9808645 A3 WO9808645 A3 WO 9808645A3
Authority
WO
WIPO (PCT)
Prior art keywords
web
laser
emission wavelength
materials
ablation
Prior art date
Application number
PCT/GB1997/002283
Other languages
English (en)
Other versions
WO1998008645A2 (fr
Inventor
Robert Jones
Michael Hazell
Original Assignee
British Polythene Ltd
Robert Jones
Michael Hazell
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GBGB9617821.5A external-priority patent/GB9617821D0/en
Application filed by British Polythene Ltd, Robert Jones, Michael Hazell filed Critical British Polythene Ltd
Priority to AU40248/97A priority Critical patent/AU4024897A/en
Priority to EP97937715A priority patent/EP0925141A2/fr
Publication of WO1998008645A2 publication Critical patent/WO1998008645A2/fr
Publication of WO1998008645A3 publication Critical patent/WO1998008645A3/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1603—Laser beams characterised by the type of electromagnetic radiation
    • B29C65/1606—Ultraviolet [UV] radiation, e.g. by ultraviolet excimer lasers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1603—Laser beams characterised by the type of electromagnetic radiation
    • B29C65/1612—Infrared [IR] radiation, e.g. by infrared lasers
    • B29C65/1616—Near infrared radiation [NIR], e.g. by YAG lasers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1603—Laser beams characterised by the type of electromagnetic radiation
    • B29C65/1612—Infrared [IR] radiation, e.g. by infrared lasers
    • B29C65/1619—Mid infrared radiation [MIR], e.g. by CO or CO2 lasers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/74—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by welding and severing, or by joining and severing, the severing being performed in the area to be joined, next to the area to be joined, in the joint area or next to the joint area
    • B29C65/747—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by welding and severing, or by joining and severing, the severing being performed in the area to be joined, next to the area to be joined, in the joint area or next to the joint area using other than mechanical means
    • B29C65/7473—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by welding and severing, or by joining and severing, the severing being performed in the area to be joined, next to the area to be joined, in the joint area or next to the joint area using other than mechanical means using radiation, e.g. laser, for simultaneously welding and severing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/20—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines
    • B29C66/21—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being formed by a single dot or dash or by several dots or dashes, i.e. spot joining or spot welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/45—Joining of substantially the whole surface of the articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/834—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools moving with the parts to be joined
    • B29C66/8351—Jaws mounted on rollers, cylinders, drums, bands, belts or chains; Flying jaws
    • B29C66/83511—Jaws mounted on rollers, cylinders, drums, bands, belts or chains; Flying jaws jaws mounted on rollers, cylinders or drums

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Replacement Of Web Rolls (AREA)
  • Laser Beam Processing (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Treatment Of Fiber Materials (AREA)
  • Laminated Bodies (AREA)
  • Making Paper Articles (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)

Abstract

L'appareil faisant l'objet de cette invention sert à effectuer des perforations sur une bande d'une matière support telle qu'un film polymère (15), comprenant un laser statique (20), un déflecteur de faisceau amovible, par exemple un tambour rotatif (30), contenant une pluralité de réflecteurs optiques (35) disposés de façon à dévier par séquences et de façon sélective le faisceau sur des emplacements cibles successifs de la bande, afin d'effectuer des perforations par ablation de la surface. Pour cela, il y a deux possibilités: soit on sélectionne le laser dont la longueur d'onde d'émission coïncide avec une bande d'absorption moléculaire à une fréquence de résonance, soit la matière proprement dite est dopée de façon à présenter une absorbance appropriée à la longueur d'onde d'émission type du laser disponible.
PCT/GB1997/002283 1996-08-27 1997-08-27 Appareil destine a perforer des matieres de type bande continue WO1998008645A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
AU40248/97A AU4024897A (en) 1996-08-27 1997-08-27 Apparatus for perforating web like materials
EP97937715A EP0925141A2 (fr) 1996-08-27 1997-08-27 Appareil destine a perforer des matieres de type bande continue

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
GB9617821.5 1996-08-27
GBGB9617821.5A GB9617821D0 (en) 1996-08-27 1996-08-27 Improvements in or relating to processing of polymer films
GB9707203.7 1997-04-09
GBGB9707203.7A GB9707203D0 (en) 1996-08-27 1997-04-09 Improvements in or relating to polymer films

Publications (2)

Publication Number Publication Date
WO1998008645A2 WO1998008645A2 (fr) 1998-03-05
WO1998008645A3 true WO1998008645A3 (fr) 1998-07-09

Family

ID=26309924

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB1997/002283 WO1998008645A2 (fr) 1996-08-27 1997-08-27 Appareil destine a perforer des matieres de type bande continue

Country Status (6)

Country Link
EP (1) EP0925141A2 (fr)
AT (1) ATE234703T1 (fr)
AU (1) AU4024897A (fr)
DE (1) DE69720049T2 (fr)
ES (1) ES2186299T3 (fr)
WO (1) WO1998008645A2 (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9812725D0 (en) * 1998-06-13 1998-08-12 Exitech Ltd The use of material dopants for improving performance of machines to laser drill microvia holes in printed circuit boards and other electrical packages
GB2338201A (en) * 1998-06-13 1999-12-15 Exitech Ltd Laser drilling of holes in materials
GB2357987A (en) * 2000-01-10 2001-07-11 Danisco Flexible Ltd Web treatment
US6538230B2 (en) * 2001-05-17 2003-03-25 Preco Laser Systems, Llc Method and apparatus for improving laser hole resolution
US7823366B2 (en) * 2003-10-07 2010-11-02 Douglas Machine, Inc. Apparatus and method for selective processing of materials with radiant energy
WO2007104343A1 (fr) 2006-03-16 2007-09-20 Freescale Semiconductor, Inc. Procédé et système de syntonisation d'antenne
US8814430B2 (en) 2010-02-23 2014-08-26 Kraft Foods R&D, Inc. Food package having opening feature
WO2015153998A1 (fr) * 2014-04-03 2015-10-08 3M Innovative Properties Company Film segmente et procede de fabrication de celui-ci
SE2150081A1 (en) * 2018-07-05 2021-01-26 Preco Inc LASER PROCESSING HYDROGEL MATERIALS
EP4070908A1 (fr) * 2021-04-09 2022-10-12 INTERLAS GmbH & Co. KG Procédé et appareil de microperforation d'une bande en mouvement

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1255431A (en) * 1969-02-27 1971-12-01 Watch Stones Co Ltd In Thun Method and apparatus for forming holes in a workpiece
EP0329438A1 (fr) * 1988-02-16 1989-08-23 The Wiggins Teape Group Limited Dispositif de laser pour marquer à répétition un matériel mobile en forme de feuille
DE4000561A1 (de) * 1990-01-10 1991-07-11 Laser Lab Goettingen Ev Energiestrahlablationsverfahren

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1255431A (en) * 1969-02-27 1971-12-01 Watch Stones Co Ltd In Thun Method and apparatus for forming holes in a workpiece
EP0329438A1 (fr) * 1988-02-16 1989-08-23 The Wiggins Teape Group Limited Dispositif de laser pour marquer à répétition un matériel mobile en forme de feuille
DE4000561A1 (de) * 1990-01-10 1991-07-11 Laser Lab Goettingen Ev Energiestrahlablationsverfahren

Also Published As

Publication number Publication date
DE69720049D1 (de) 2003-04-24
ATE234703T1 (de) 2003-04-15
ES2186299T3 (es) 2003-05-01
DE69720049T2 (de) 2003-09-25
EP0925141A2 (fr) 1999-06-30
WO1998008645A2 (fr) 1998-03-05
AU4024897A (en) 1998-03-19

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