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WO1998030352A1 - Fer a souder du type sans contact et pouvant effectuer une soudure discontinue - Google Patents

Fer a souder du type sans contact et pouvant effectuer une soudure discontinue Download PDF

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Publication number
WO1998030352A1
WO1998030352A1 PCT/JP1998/000021 JP9800021W WO9830352A1 WO 1998030352 A1 WO1998030352 A1 WO 1998030352A1 JP 9800021 W JP9800021 W JP 9800021W WO 9830352 A1 WO9830352 A1 WO 9830352A1
Authority
WO
WIPO (PCT)
Prior art keywords
nozzle
chamber
temperature
gas
gas flow
Prior art date
Application number
PCT/JP1998/000021
Other languages
English (en)
Japanese (ja)
Inventor
Akio Mitumoto
Kensei Matubara
Original Assignee
Kabushikigaisha Taiseikaken
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kabushikigaisha Taiseikaken filed Critical Kabushikigaisha Taiseikaken
Priority to JP53073998A priority Critical patent/JP3345722B2/ja
Publication of WO1998030352A1 publication Critical patent/WO1998030352A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/012—Soldering with the use of hot gas
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/02—Soldering irons; Bits
    • B23K3/03—Soldering irons; Bits electrically heated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/02—Soldering irons; Bits
    • B23K3/03—Soldering irons; Bits electrically heated
    • B23K3/0338—Constructional features of electric soldering irons
    • B23K3/0353—Heating elements or heating element housings

Definitions

  • Non-contact soldering iron capable of intermittent soldering
  • the present invention relates to a soldering iron capable of intermittently and non-contactly soldering electronic components, for example.
  • soldering iron In this type of soldering iron, a method is widely used in which a tip chip heated by a heater or the like is brought into contact with a land of an electronic substrate to melt the solder, and the tip chip is separated to solidify the solder.
  • an air passage is formed in the soldering iron 100, a heating nozzle 101 is built in, and a nozzle 102 made of stainless steel is provided at the tip.
  • Non-contact soldering irons which are soldered by blowing high-temperature air, have also been proposed.
  • an object of the present invention is to provide a soldering iron that can quickly generate a high-temperature gas flow in response to an intermittent soldering operation in a non-angled ⁇ soldering iron.
  • the soldering iron according to the present invention includes a first chamber for generating a main heating gas flow having a first nozzle at a tip thereof, and a second nozzle which is opened to cover the outside of the first nozzle.
  • a nozzle means provided at the tip, surrounding at least the first chamber, and including at least a second chamber for generating a preheating gas flow; and an inner wall in the first chamber near the central first nozzle.
  • a first core heating means having a heat source for heating an inert gas ejected from a nozzle port through the clearance, and forming at least a distal end of the first chamber; Heating means including at least a second heating means surrounding the heat source of the first core heating means, storing heat, and passing between the first chamber and the second chamber and heating an inert gas.
  • An inert gas supply means for communicating with the first chamber, supplying an inert gas, and branching and supplying the inert gas to be supplied to the first chamber to the second chamber; Inert gas supplied to 1 chamber While the gas passes through the clearance, the temperature rises to a predetermined heating temperature, and the inert gas that rises in temperature and expands in the first chamber is branched and lined into the second chamber by its back pressure. It is characterized by the following.
  • the gas stream is preferably a high concentration of inert gas. This is because an inert gas such as nitrogen gas is preferable in consideration of the effect of O 2 in air on soldering quality.
  • the first core heating means only needs to generate heat, such as a nichrome wire heater, a ceramic heater, a high frequency heater, a medium frequency heater, a low frequency heater, an infrared heater, a plasma heater, an ultrasonic heater, An elema heating element or the like can be used.
  • the first core heating means has an inner wall and a clearance inside the first chamber, and has a rod-like shape inserted therein. heating evening, lock de-shaped heating evening force desirable especially A ⁇ 2 0 made 3.
  • One of the features of the present invention is to arrange the outer nozzle around the inner nozzle, form the outer gas flow by utilizing the temperature rise expansion of the inner gas flow, and preheat with the outer gas flow, Surrounded by the outside gas flow.
  • the point is that soldering is performed by the inside gas flow in the surrounding air.
  • soldering can be performed in a short time in a non-contact manner, and the effects of leakage current, noise, and harmonics on products can be eliminated.
  • the core heating means quickly raises the inert gas to a desired temperature without having to set the temperature to a high temperature such as when merely flowing the inert gas.
  • the soldering work can be quickly performed not only in the case of continuous soldering but also in the case of intermittent soldering.
  • static electricity the friction of the gas flow, especially when the gas flow is ejected at a high speed, charges the gas flow, and there is still concern about the electrical effects on the product. .
  • the main heating gas flow and scope as the ejection pressure of the preheating gas stream charged gas flow is enough not a concern of electrical influence, specifically to a pressure of 1 ⁇ 3 kgicm 2 ⁇ G
  • the gas pressure from the first nozzle is higher than the gas pressure from the second nozzle. Also, by selecting such a pressure range, It is possible to prevent lowering of the retained energy on the flow side and shorten the soldering time.
  • the second heating means is preferably formed at least at the tip end of the first chamber, and is made of a member having a heat storage function for transferring heat from the first core heating means. It is preferable that the nozzle member has a nozzle member, and a nozzle orifice is inserted into the nozzle opening to adjust the nozzle diameter.
  • This second heating means is preferably a copper or copper alloy nozzle member.
  • the first chamber has a gas communication port communicating with the second chamber, and the inert gas supplied to the first chamber is heated and expanded by the first core heating means.
  • the pressure is preferably such that the inert gas supplied to the first chamber 1 is partially supplied to the second chamber via the gas flow port.
  • the opening diameter of the first nozzle is larger than the opening diameter of the branch supply port of the second chamber, and the first nozzle is sprayed with the heated inert gas from the tip opening of the first nozzle.
  • a part of the inert gas supplied into the first nozzle by the back pressure in the nozzle is preferably supplied to the second nozzle.
  • soldering is performed in an atmosphere where the adhered molten solder can be slowly cooled with moderate temperature characteristics, and rapidly cooled in an atmosphere at room temperature or below immediately before the start of solidification. It is important to do so.
  • the gas flow is made into an inner / outer double, preheated by the outer preheating gas flow, soldered by the inner main heating gas flow, and then slowly cooled to just before the start of solidification by the outer preheating gas flow to room temperature. Exposure to the following atmosphere allows rapid cooling.
  • the inert gas supplied to the first nozzle is 250 to 100 ° C., particularly 300 to 6 ° C.
  • the first core heating means 0 (it is preferable to be heated to TC, and the inert gas supplied to the second nozzle is 100 to 300, particularly preferably 150 to 200 ° C. Further, it is preferable that the flow rate of the inert gas injected from the first nozzle is 1 to 3 ⁇ // min in order to increase the heat input and shorten the soldering time.
  • the inner diameter of the tip of the first chamber, which forms the second heating means, and the first core heating is set to a size set so that the temperature can be raised to a predetermined temperature after passing the inert gas force passing therethrough.
  • a clearance of 0.1 to 0.15 mm can be adopted.
  • the opening diameter of the first nozzle can be 0.2 to 1 mm to 5, and the opening diameter of the second nozzle can be 2 to 3 mm ⁇ .
  • a cylindrical body having a nozzle portion at a front end, wherein a high-temperature gas injection mechanism for heating a gas flow supplied from the rear to a predetermined temperature in the cylindrical body and ejecting the gas flow from the nozzle portion.
  • a core heat source extending in the axial direction of the cylindrical body via a predetermined clearance with the inner wall of the cylindrical body, and a heat storage cover surrounding the outer periphery of the core heat source and extending in the axial direction forming a part of the cylindrical body
  • a high-temperature gas injection mechanism comprising: a heating means comprising a heating means, wherein the clearance is set such that a gas flow reaching the upstream of the heating means has a predetermined injection temperature before being fired from the nozzle portion after passing through the clearance.
  • the cylinder preferably has a flow opening for diverting the supply gas flow to the outside of the cylinder when the back pressure in the cylinder becomes equal to or higher than a predetermined value.
  • a temperature sensor is provided in front of the nozzle portion in front of the core heat source to detect a gas flow temperature after passing through the clearance and to control the core heat source temperature.
  • the inert gas when supplying an inert gas to the soldering iron and performing heating and jetting, the inert gas is supplied to the first chamber, and the inert gas is supplied to the front of the first chamber. Raising the temperature to a predetermined third temperature through a clearance formed by a core heat source extending in the axial direction near the nozzle provided at the tip and a heat storage cover surrounding the core heat source; An inert gas is supplied through a communication port to a second chamber surrounding the first chamber by a back pressure generated by a temperature rise and expansion of the inert gas, and is located in front of the second chamber. Raising the temperature to a predetermined second temperature by passing through the outer periphery of the heat storage cover,
  • a non-contact type soldering method in which a gas flow surrounded by a gas at a second temperature and centered on a gas at a second temperature is injected to a predetermined soldering site.
  • the time for raising the temperature of the inert gas through the clearance between the core heat source and the heat storage cover in the first chamber is preferably set to a time that quickly responds to the intermittent work of soldering. Good.
  • oxidation and porosity may be caused, and oxidation of solder immediately before solidification is the largest cause of generation of bridges, knuckles, and errata.
  • the low-temperature nitrogen gas atmosphere is set to room temperature, specifically, a temperature of 25 ° C. or lower, but it is preferable to secure a quenching effect.
  • the temperature may be between 120 ° C. and 130 ° C.
  • the work surface is exposed to a low-temperature nitrogen gas atmosphere, the molten solder is rapidly cooled from the front surface side. It is preferable because a finer rapidly solidified structure can be obtained.
  • the main heating gas flow generation chamber 1 is preferably formed around the heating element from the viewpoint of manufacturing simplicity, but may be formed inside the heating element.
  • the shape of the nozzle is not particularly limited, but it is preferable to use a diverge X-in nozzle, for example, since it is better to jet the gas stream at a higher speed.
  • the preheating gas flow may be ejected straight around the main heating gas flow, but a spiral fin and a spiral groove are formed on the inner surface of the preheating gas flow generation chamber 1 so that the preheating gas flow is formed into a spiral shape.
  • the tip of the second nozzle may be made to protrude from the tip of the first nozzle, or the positional relationship may be reversed.
  • the latter is preferable when the element of the work is small, especially when the element has an ultra fine pitch, for example, when soldering electronic components.
  • the main body of the trowel is grounded, and negative charges are electrostatically induced inside the main heating gas flow generation chamber and the preheating gas flow generation chamber to remove the brass charges of the main heating gas flow and the preheating gas flow. It is better to be able to do it.
  • the soldering portion of the work is preheated by the preheating gas flow, even if the tip is brought into contact with the soldering portion, the temperature drop of the tip is small and the tip is preheated. As a result of being heated by the gas flow and rapidly raising the temperature, the thermal stress of the tip can be reduced.
  • the temperature of the tip of the soldering iron is lower than that of the above-mentioned tip and sufficient for preheating the solder.
  • the preheated gas flow is blown around the above-mentioned tip, and the preheated gas flow is blown onto the soldering portion of the work to preheat the preheated gas. Then, the preheated gas is blown out of the preheated work by the tip. It is possible to provide a contact-type soldering method characterized in that the soldering is performed in an atmosphere surrounded by a flow.
  • the preheated gas flow reduces the heat cycle of the tip and quickly returns the temperature-reduced tip to a predetermined temperature, and is more effective than the above-described case of forming the inner / outer double gas flow.
  • High temperature is preferred Forces may affect the work and elements (eg, electronic elements) near the soldering site. Therefore, a low-temperature gas flow, which is lower than the preheating gas flow, is sprayed around the preheating gas flow from the tip of the soldering iron, and the pre-heating of the work soldering part and the work near the soldering part at the time of soldering are performed.
  • the element may be protected from the heat of the preheated gas stream with a cold gas stream. Further, according to the present invention, it is possible to provide a soldering iron used in the above-mentioned contact-type soldering method.
  • the tip of the tip is placed around the heating element.
  • a preheating gas flow generation chamber is opened to the periphery to form a preheating gas flow generation chamber, and the heat generated by the heating element generates a preheating gas flow at a temperature lower than the tip chip and at a temperature sufficient to preheat the solder, and It is possible to provide a hornworm-type soldering iron characterized in that it is ejected to the surroundings.
  • a low-temperature gas flow generation chamber is formed around the preheating gas flow generation chamber, and the leading end side is opened around the leading end opening of the preheating gas flow.
  • a structure may be adopted in which a low-temperature gas flow lower than the preheating gas flow is generated by convection heat from the generation chamber 1 and heating by Z or radiant heat, and the low-temperature gas flow is jetted around the preheating gas flow.
  • high-temperature inert gas such as high-temperature nitrogen gas is sprayed onto the soldering part when soldering with a soldering robot or an automatic soldering machine.
  • an inert gas purge device suitable for protecting the soldering portion from the atmosphere and preheating.
  • the inert gas purging apparatus has a soldering iron shape as a whole, and has a built-in heating element.
  • a preheating gas flow generation chamber is formed around the heating element while opening the tip side around the tip of the heating element while the heating element can be heated.
  • a high-temperature gas flow is generated by the radiant heat and is ejected forward.
  • FIG. 1 is a sectional view showing a principal part of a first embodiment of a soldering iron according to the present invention.
  • FIG. 2 is a sectional view showing a principal part of a second embodiment of the soldering iron according to the present invention.
  • FIG. 3 is a sectional view taken along the line II.
  • FIG. 4 is a diagram for explaining a soldering method using the above-mentioned soldering iron.
  • FIG. 5 is a sectional view showing a first modification of the above-mentioned soldering iron.
  • FIG. 6 is a sectional view showing a second modification of the above-mentioned soldering iron.
  • FIG. 7 is a sectional view showing a principal part of a third embodiment of the soldering iron according to the present invention.
  • FIG. 8 is a sectional view showing a principal part of a third embodiment of the soldering iron according to the present invention.
  • FIG. 9 is a perspective view showing the holder 135 in the soldering iron of FIG.
  • FIG. 10 is a configuration diagram showing a conventional non-contact soldering iron.
  • FIG. 11 is a view showing a preferred embodiment of the inert gas purge device according to the present invention.
  • FIG. 12 is a diagram showing a modification of FIG.
  • FIG. 1 illustrates the present invention.
  • a preferred embodiment of such a non-contact soldering iron is shown.
  • the rear end of the iron body 11 is attached to the tip of the iron base by means of a screw or the like, and the iron body 11 is attached to the inner and outer double stainless steel cylinders 12 and 13 and the center.
  • a rod-shaped alumina ceramic heater (core heating means) 14 14.
  • a copper first nozzle 19 (also used as a heat storage cover) 19 having an opening diameter of 2 to 3 mm is fitted and fixed, and the inner diameter surface of the first nozzle 19 and the heating nozzle are fixed.
  • a clearance of 0.1 to 0.15 mm is formed between the outer diameter surface of evening 14 and the outer diameter surface.
  • a stainless steel pipe 61 is inserted into the tip of the first nozzle 19 to adjust the nozzle diameter to 0.5 to 1.0 mm.
  • a main heating gas flow having a high temperature enough to melt and soften the solder by heating the heater is generated.
  • the preheating gas flow generation chamber 1 (second chamber 1) 18 that generates a preheating gas flow at a temperature sufficient to perform
  • a preheat nozzle (second nozzle) 20 that covers the entire outer periphery of the first nozzle 19 is externally fitted to the end of the outer stainless steel cylinder 12.
  • the base of the trowel has a hollow shape and the inside is a gas supply passage.
  • a first gas circulation port 22 is formed at the rear end of the trowel main body 11 to form a main heating gas flow generation chamber.
  • An inert gas is supplied to one of the seventeen.
  • the gas supply passage may be constituted by a hose or the like supported outside the base of the iron.
  • a gas flow port 25 is formed on the base side of the inner stainless steel cylinder 13, and a part of the inert gas that has been heated and expanded in the main heating gas generation chamber 17 is generated by the back pressure.
  • the preheated gas flow generation chamber 18 is branched and supplied.
  • a sensor 27 for detecting and controlling the temperature of the main heating gas flow is attached to the end of the heater 14, and although not shown, the stainless steel cylinders 12 and 13 are grounded. It is connected.
  • the heating nozzle 14 is heated to a surface temperature of 700 to 900 ° C, and the radiant heat causes the first nozzle 19 to be heated to 300 to 57 (TC,
  • TC TC
  • the inert gas is supplied into the inner stainless steel 12 and reaches the clearance, the temperature is raised to 300 to 600 ° C and expanded two to three times, and the first nozzle 1 is used as the main heating gas flow.
  • part of the expanded inert gas is guided to the preheating gas flow generation chamber 18 by its back pressure, where the radiant heat of the first nozzle 19 and the gas itself are Maintained at 150 to 280 ° C by convection heat and injected as a preheating gas flow around the main heating gas flow, so that the main heating gas flow does not lower the temperature and entrains oxygen
  • pre-heating the soldering part by gas flow You can also.
  • FIGS. 2 and 3 show a second embodiment of a non-contact soldering iron according to the present invention.
  • the rear end of the iron body 11 is attached to the tip of the iron base 10 by a method such as screwing and screwing.
  • the inner stainless steel tube 13 is supported on the inner surface of the outer stainless steel tube 12 by a spacer piece (not shown). Have been.
  • the heating heater 14 is supported on the inner surface of the inner stainless steel tube 13 by a metal cover 15, and a plate-shaped spacer 16 is formed at the rear end of the cover 15.
  • Main heating gas flow generation chamber that generates a main heating gas flow that is hot enough to melt and soften the solder by heating the heater between 15 and the inner stainless steel cylinder 13
  • a first nozzle 19 made of molybdenum is fitted to the tip of the inner stainless steel cylinder 13, and the first nozzle 19 is projected from a through hole in the tip wall of the outer stainless steel cylinder 12.
  • the tip of the outer stainless steel tube 12 covers the entire outer periphery of the first nozzle 19
  • the second nozzle 20 is externally fitted.
  • the base 10 has a hollow shape and the inside is a gas supply passage 21, and a first gas circulation port 22 is provided at the rear end of the A second gas flow port 23 is formed in the plate-like spacer 16, and a third gas flow port 24 is formed in the tip of the cover 15.
  • the generated main heating gas flow is guided toward the first nozzle 19.
  • the gas supply passage 21 may be constituted by a hose or the like supported outside the iron base 10.
  • a fourth gas flow port 25 is formed on the inner stainless steel 13 behind the cover 15 at the end of the outer stainless steel cylinder 12 to form a fifth heated gas flow port 26.
  • a part of the inert gas heated and expanded in the chamber 17 is branched and supplied to the preheating gas flow generation chamber 18 by the back pressure.
  • a sensor 17 for detecting the temperature of the main heating gas flow 30 and performing control is attached, and although not shown, a stainless steel 1 2 And 13 are connected to ground.
  • the heating heater 14 is energized, and nitrogen gas is supplied to the gas supply passage 21 in the base 10.
  • the nitrogen gas may be preheated to a predetermined temperature, for example, 40 to 50 ° C.
  • the nitrogen gas is guided to the main heating gas flow generation chamber 17 through the gas flow ports 22 and 23, and is heated to 250 to 600 ° C. by the heating heater 14 so that the main heating is performed.
  • a gas stream 30 is generated, and the main heated gas stream 30 is ejected from the first nozzle 19 via the gas flow port 24.
  • the ejection amount of this main heating gas stream 30 is set to 0.5 to 2.0 liters Z, and the ejection pressure is set to 0.1 to 2.0 kgf / cm 2 ⁇ G.
  • a part of the nitrogen gas heated and expanded in the main heating gas flow generation chamber 117 is guided by the back pressure to the preheating gas flow generation chamber 118 via the gas flow port 25, and is 1 0 0 ⁇ 2 0 0 a C be heated preheat gas flow 3 1 produced by radiant heat from the convection and heat arsenide Isseki 1 4 hot nitrogen gas in the flow generating chamber one 1 7, the gas flow port 2 6 Around the main heating gas flow 30 from the second nozzle 20 through It is squirted over.
  • the ejection amount of this preheating gas stream 31 is set to 0.5 to 2.0 liters Z, and the ejection pressure is set to 0.1 to 2.0 kgf / cm 2 ⁇ G.
  • a preheating gas flow 31 is blown onto the soldering portion W of the substrate to preheat the soldering portion W, and then the main heating gas flow 30 is blown.
  • 0 is sprayed onto the soldering site W with its surroundings covered by the preheating gas flow 31 as shown in Fig. 3, and it does not scatter around as it is in the past, so the solder melts immediately .
  • the molten solder is slowly cooled by a preheating gas stream 31 until just before the start of solidification, and then rapidly cooled by being exposed to the atmosphere.
  • the non-contact soldering iron of the present example required 1 second. It was confirmed that the soldering could be completed in a certain degree. Therefore, the non-contact type soldering of the present embodiment can be practically adopted instead of the conventional soldering port bot / soldering in the automatic soldering machine.
  • the molten solder when the heat of the molten solder is rapidly absorbed by the surroundings, the molten solder is rapidly cooled as a whole, and fine quenched crystals, fine columnar crystals, and fine free crystals are formed, but the columnar crystals are crystal columns. Grain boundaries containing impurities and gases are likely to be generated in parallel with the crystal, and the free crystals are likely to contain flux gases and impurity gases.
  • the main heating gas flow 30 and the preheating gas flow 31 with appropriate pressure are blown to the molten solder, the solder and flux do not flow out of the soldering portion W, and the molten solder force is applied. Pressurizes and releases gas, eliminating bubbles and gas holes.
  • the dendrites can be filled with the molten solder by this pressurization, and microporosity and macroporosity (porosity) can be prevented, resulting in a dense crystal structure.
  • the whole of the molten solder is rapidly cooled, so that the distance between the liquidus and solidus of the molten solder is substantially reduced, and the pressurizing effect is exerted, resulting in macro-segregation (Pb, Sn, etc.) and micro-segregation.
  • Pb, Sn, etc. macro-segregation
  • micro-segregation Dendritic crystals, layered structure, nucleated structure, etc., of segregation are reduced, impurities and gas are reduced, and solidified solder with fine crystal structure can be obtained.
  • the ejection pressure of the main heating gas flow 30 and the preheating gas flow 31 is set appropriately. Therefore, electrification due to gas friction is unlikely to occur, and since the iron body 11 is grounded, the main heating gas flow generation chamber 117 As a result, the positive charge of the main heating gas flow 30 and the preheating gas flow 31 can be removed by electrostatically inducing a negative charge inside the flow generation chamber 18, and as a result, the electrostatic breakdown at the soldering site W is reduced. The fear can be reliably eliminated.
  • FIG. 5 shows a first modification of the above embodiment.
  • the tip of the second nozzle 20 protrudes forward from the tip of the first nozzle 19, and the inner stainless steel tube 13 is made of beryllium copper, chromium copper, or another alloy having good heat conductivity.
  • the inner alloy tube 13 and the first nozzle 19 are integrally formed, and the second nozzle 20 and the outer stainless steel tube 12 are integrally formed.
  • the first nozzle 19 employs a divergent nozzle structure in which the inner surface expands in an arcuate cross section.
  • the inner diameter of the tip of the first nozzle 19 is set to 0.1 to 0.5 mm
  • the inner diameter of the second nozzle 20 is set to 0.5 to 4.0 mm
  • a flat surface 20a of 1-2 mm is formed on the inner surface of the tip portion of the nozzle 20 to stabilize the preheating gas flow.
  • the die nozzle is used as the first nozzle 19, so that a high-speed main heating gas flow can be obtained by the structure, and the tip of the second nozzle 20 is connected to the first nozzle 19. Since the preheating gas flow and the high-speed main heating gas flow accelerate each other, the main heating gas flow and the high-speed preheating gas flow are further increased. As a result, even after a certain distance between the tip of the first and second nozzles 19 and 20 and the work soldering site, Thermal decay of the main heating gas flow and the preheating gas flow until reaching the work soldering site is small, and the consumption of nitrogen gas (or air) can be suppressed.
  • FIG. 6 shows a second modification.
  • a hollow ceramic heater is used as the heater 14, and a main heating gas flow generation chamber 117 is formed inside the heater 14.
  • a coil-shaped material 17a made of a molybdenum-based alloy or a tungsten-based alloy is housed in the heater 14 to impart a swirl to the main heating gas flow to reduce heat unevenness of the main heating gas flow.
  • the second nozzle 2 A spiral fin or a spiral groove is formed on at least one of 0 and Z or the outer surface of the outer cylinder 12 and the first nozzle 19 and Z or the outer surface of the inner nozzle 13 so as to impart a swirl to the preheating gas flow. Is also good.
  • FIG. 7 shows a third embodiment of the present invention.
  • the soldering iron body 30 and the grip portion (trowel base) 31 and the force, and the iron body 30 have a heating heater (for example, a round barbed aluminum nitride
  • the tip of the heater 32 is inserted into the hole of the tip holder 33, the tip 34 of the tip holder 33 is fixed to the tip 34, and the heat of the heating heater 32 is generated.
  • the tip 34 is transmitted to the tip 34 to be heated.
  • the rear end of the heater 32 is inserted into and held by a central hole of a holder 135 built in the tip of the grip portion 30, and the heating heater 32 is provided with a temperature sensor (not shown). ) Is attached.
  • An auxiliary heater for controlling the temperature of the preheated gas flow may be installed.
  • a plurality of nitrogen gas supply holes are formed in an annular shape in the holder 35, and the end of a nitrogen gas supply pipe 36 inserted into the grip portion 30 is connected to the holder 35, and a heater 3 2
  • a power line 32a extends rearward in the nitrogen gas supply pipe 36 from the rear end.
  • a first protective cover 37 is fixed to the end of the grip portion 30.
  • the first protective cover 37 covers the periphery of the heating heater 32 and is provided between the tip holder 33 and the heating cover 32.
  • a predetermined gap for example, 1 mm, is left to the front end side with a predetermined gap, and the front end is opened around the front end tip 34, thus constituting the preheating gas flow generation chamber 38.
  • the tip of the first protective cover 37 extends as close to the tip 34 as possible, so that it does not touch the workpiece during soldering.
  • the heater 32 is energized to heat the tip chip 34 at 280 to 38 (while heating to TC, while nitrogen gas is applied to the soldering iron).
  • the supply pipe 36 is supplied with nitrogen gas having a pressure of 1.0 to 5.0 kg / cm 2 , a flow rate of 4 liters Zmin, and a purity of 99 to 99.9%. Good, intermittent supply, then preheating gas flow
  • the nitrogen gas passing through the chamber 38 is heated to 200 CC to 25 O CC by the radiant heat of the tip 34 due to the heat generated by the heater 32, increasing its volume and discharged forward as it is. You.
  • the flow rate and pressure of the nitrogen gas can be adjusted by setting the inner diameter and number of the nitrogen gas supply holes of the holder 135. It is also possible with an external pressure regulator or flow regulator.
  • a preheating gas flow is blown to the soldering portion of the board for 2 to 5 seconds to preheat the soldering portion, thereby activating a low residue flux at the soldering portion.
  • the tip 34 may be brought into contact with the soldering portion at the same time as the preheating gas flow is sprayed.
  • the concentration of O 2 is 5 ppm or less, flat soldering is possible.
  • the tip 34 is brought into contact with the soldering site and heated to supply the low-residue flux-containing threaded solder, which melts at the soldering site in a preheated gas flow atmosphere. A solder pile is formed. Next, the tip 34 is separated from the soldering site, and the molten solder is exposed to the atmosphere of the preheated gas flow, while rapidly cooling by blowing nitrogen gas at room temperature from the back surface of the substrate.
  • the pressurized high-temperature nitrogen gas 65 can be used to pressurize and fill the gaps between the molten metals with the molten solder melt, preventing micro-macroporosity (porosity) and achieving a dense crystal structure. Become.
  • the whole of the molten solder is rapidly cooled, so that the distance between the liquidus and solidus of the molten solder is substantially reduced, and a pressurizing effect is exerted, and macro-segregation (Pb, Sn, etc.)
  • the solidified solder of fine crystal structure with few impurities and gas can be obtained by reducing the segregation of dendrite, lamellar structure, nucleated structure, etc.
  • the solder flux is preheated to activate the flux and prevent the flux-solder ball from scattering, so that a smooth and good soldering operation can be performed.
  • Preheating the electronic board before contacting the board mitigating local and rapid temperature rise (heat shock) of the electronic board and preventing thermal destruction of electronic components, as well as flux, electronic board and supplied solder
  • the wire can also be preheated, so that the hot brittleness of the solder layer can be prevented.
  • the solder and flux can be preheated with high-temperature nitrogen gas, the amount of heat stored in the tip of the soldering iron is small, and even if the tip of the chip is extremely fine, sufficient amount of heat can be used for soldering, resulting in low-temperature soldering. Can be achieved. Further, since the soldering iron chip is in a non-oxidizing atmosphere, the oxidation of the chip is prevented, the wettability of the molten solder can be improved, and the chip cleaning is almost unnecessary, and the chip life can be greatly improved.
  • FIG. 8 shows a fourth embodiment of the present invention.
  • a second protective cover 39 is fixed to the tip of the grip portion 30 outside the first protective cover 37, and the second protective force bar 39 is a first protective cover 3 7 is airtightly covered with a predetermined gap, for example, a gap of mm, and extends to the front end, and the front end is opened near the front end of the first protective cover 37, thereby generating a low-temperature gas flow.
  • a chamber 40 is configured.
  • a nitrogen gas supply hole is formed in the holder 135 such that the nitrogen gas is supplied to the low-temperature gas flow generation chamber 140 so that the nitrogen gas is also supplied to the holder 135.
  • soldering is performed in substantially the same manner as in the above-described second embodiment.
  • the substrate is exposed to the low temperature generated at 0, for example, the nitrogen gas atmosphere at room temperature. : Prevents child parts from receiving thermal alum.
  • FIG. 11 shows a preferred embodiment of an inert gas purging apparatus to which the concept of the present invention is applied.
  • the inert gas purging device comprises a main body 30 and a grip portion 31.
  • the main body 30 has a built-in heater (for example, a round barbed aluminum nitride heater) 32, and a tip of the heater 32.
  • a heat-insulating member made of a copper-based alloy with good thermal conductivity.
  • Body 33 is inserted into the hole, and the heat generated by the heater 32 is transmitted to the heat retaining member 33 to heat the heat retaining member 33.
  • the rear end of the heater 32 is inserted and held in the center hole of a holder 35 built in the tip of the grip portion 30, and a temperature sensor 39 is attached to the heater 32.
  • a temperature sensor 39 is attached to the heater 32.
  • a plurality of nitrogen gas supply holes are formed in an annular shape in the holder 35, and the end of a nitrogen gas supply pipe 36 passed through the grip portion 30 is connected to the holder 135, and a heater is provided.
  • the power line 32 extends from the rear end of the line 32, and the nitrogen gas supply pipe 36 extends rearward in the line.
  • a first protective cover 37 is fixed to the end of the grip portion 30.
  • the first protective cover 37 covers the periphery of the heater 32 and is provided between the first protective cover 37 and the heat retaining member 33.
  • a predetermined gap for example, a gap of l mm is extended to the front end side, and the front end is opened to surround the front end of the heat retaining member 33, thereby forming a high temperature gas flow generation chamber 38.
  • inert gas purging equipment of this example when soldering with a soldering port bot and an automatic soldering machine, high-temperature inert gas is blown to the soldering area to protect the soldering area from the atmosphere. Ideal for preheating as well as for heating.
  • FIG. 12 is a modification of the embodiment shown in FIG. 7, in which a cover 37 is attached to an existing soldering iron so as to cover a portion of the heating heater 33, and a gas is attached to the cover 37.
  • the supply hose 62 is connected to achieve the same operation and effect as in FIG.
  • the inner gas flow is heated within a predetermined clearance, and the expansion is used to reduce the outer gas flow. Since the gas flow is generated, the gas flow can be heated to a predetermined temperature without increasing the temperature of the heating means, so that not only continuous soldering but also intermittent soldering can be performed in a short time.
  • soldering was performed with the inner main heating gas flow in the atmosphere surrounded by the outer preheating gas flow, so that the The heat of the main heated gas stream is not scattered to the surroundings. In addition, it can be efficiently transmitted to the soldering part of the work, and can be soldered in a short time without contact, that is, without using a tip chip.
  • the molten solder since the soldering can be performed in an atmosphere in which the molten solder is slowly cooled, the molten solder has a preferable surface tension and exhibits a substantially hemispherical shape in a raised state. In addition, immediately before the start of solidification of the molten solder, it is rapidly cooled in an atmosphere at room temperature or lower, and it is possible to give the molten solder a directional solidification in which the distance between its liquidus and solidus is substantially reduced. This allows the solder to have a finely solidified structure.
  • soldering can be performed.
  • a preheating gas flow is injected around the tip tip, a low-temperature gas flow is injected as necessary around the tip, and the soldering portion is preheated with the preheating gas flow. Since the tip is used for soldering, there is little change in temperature of the tip due to contact with the soldered part, and the tip is heated by the preheating gas flow, resulting in almost all thermal stress on the tip Without this, the life of the tip can be greatly improved.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Lorsque l'on exécute une soudure à l'aide d'un fer à souder, en soufflant un courant gazeux haute température en direction d'une portion à souder d'une pièce, on projette à partir de l'extrémité distale du fer à souder un courant principal gazeux de chauffage possédant une température suffisamment élevée pour faire fondre et amollir la soudure, un courant gazeux de préchauffage étant produit et projeté à partir d'une portion du courant principal gazeux de chauffage, par utilisation de la pression de retour provenant de l'élévation en température et de l'expansion du courant gazeux principal de chauffage, de manière que le courant de préchauffage enferme le courant de chauffage. Après avoir soufflé le courant gazeux de préchauffage en direction de la portion à souder de la pièce, aux fins de préchauffage de cette pièce, on souffle le courant gazeux principal de chauffage en direction de la portion à souder de la pièce ainsi préchauffée, et on exécute la soudure dans l'atmosphère constituée du courant gazeux de chauffage enfermé dans le courant gazeux de préchauffage.
PCT/JP1998/000021 1997-01-07 1998-01-07 Fer a souder du type sans contact et pouvant effectuer une soudure discontinue WO1998030352A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP53073998A JP3345722B2 (ja) 1997-01-07 1998-01-07 間欠的半田付けが可能な非接触型半田ごて

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP9/13122 1997-01-07
JP1312297A JP2000000657A (ja) 1997-01-07 1997-01-07 非接触による半田付け方法及びその半田ごて
JPPCT/JP97/01528 1997-05-06

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WO1998030352A1 true WO1998030352A1 (fr) 1998-07-16

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PCT/JP1997/001528 WO1998030351A1 (fr) 1997-01-07 1997-05-06 Procede de soudage et fer a souder
PCT/JP1998/000021 WO1998030352A1 (fr) 1997-01-07 1998-01-07 Fer a souder du type sans contact et pouvant effectuer une soudure discontinue

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Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000208918A (ja) * 1999-01-18 2000-07-28 Ueda Japan Radio Co Ltd プリント配線基板へのパタ―ン状のはんだバンプの形成方法
JP2000263223A (ja) * 1999-03-18 2000-09-26 Japan Unix Co Ltd ガス噴射式はんだ付け方法
JP2000334563A (ja) * 1999-05-26 2000-12-05 Yoshimasa Matsubara 半田ごて
JP2003251460A (ja) * 2002-03-06 2003-09-09 Nakajima Doukou Kk 半田ごて
US7060937B2 (en) * 2003-04-04 2006-06-13 Hakko Corporation Cartridge-type soldering iron with inert gas emitted near the tip
US7126086B2 (en) 2003-04-04 2006-10-24 Hakko Corporation Cartridge-type soldering iron
JP2006334598A (ja) * 2005-05-31 2006-12-14 Mitsubishi Electric Corp ガス噴射式はんだ鏝
JP2007294954A (ja) * 2006-04-21 2007-11-08 Internatl Business Mach Corp <Ibm> 導電性結合材の充填技術
JP2008279473A (ja) * 2007-05-09 2008-11-20 Kazuto Fujimoto 半田ごて
JP2018061978A (ja) * 2016-10-13 2018-04-19 株式会社パラット 半田付けシステム、半田付け製品製造方法、半田付け方法、及び半田

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CN1273256C (zh) * 2003-04-04 2006-09-06 白光株式会社 电连接器构造体及具有该电连接器构造体的钎焊烙铁手柄或钎焊烙铁
CN100363138C (zh) * 2004-01-27 2008-01-23 白光株式会社 电烙铁
JP4533077B2 (ja) * 2004-10-04 2010-08-25 白光株式会社 はんだごて、その組立て方法及びそのヒータカートリッジの交換方法
CN114769785B (zh) * 2022-04-18 2023-10-20 翼龙半导体设备(无锡)有限公司 高压气自冷热锡喷头

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JPH0783940B2 (ja) * 1987-12-25 1995-09-13 松下電器産業株式会社 熱風リフロー半田付装置

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Publication number Priority date Publication date Assignee Title
JPH07132369A (ja) * 1993-06-17 1995-05-23 Noriyuki Yoshida 半田ごて

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0783940B2 (ja) * 1987-12-25 1995-09-13 松下電器産業株式会社 熱風リフロー半田付装置

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000208918A (ja) * 1999-01-18 2000-07-28 Ueda Japan Radio Co Ltd プリント配線基板へのパタ―ン状のはんだバンプの形成方法
JP2000263223A (ja) * 1999-03-18 2000-09-26 Japan Unix Co Ltd ガス噴射式はんだ付け方法
JP2000334563A (ja) * 1999-05-26 2000-12-05 Yoshimasa Matsubara 半田ごて
US6633021B2 (en) 1999-05-26 2003-10-14 Kensei Matubara Soldering iron with heated gas flow
JP2003251460A (ja) * 2002-03-06 2003-09-09 Nakajima Doukou Kk 半田ごて
US7060937B2 (en) * 2003-04-04 2006-06-13 Hakko Corporation Cartridge-type soldering iron with inert gas emitted near the tip
US7126086B2 (en) 2003-04-04 2006-10-24 Hakko Corporation Cartridge-type soldering iron
JP2006334598A (ja) * 2005-05-31 2006-12-14 Mitsubishi Electric Corp ガス噴射式はんだ鏝
JP2007294954A (ja) * 2006-04-21 2007-11-08 Internatl Business Mach Corp <Ibm> 導電性結合材の充填技術
JP2008279473A (ja) * 2007-05-09 2008-11-20 Kazuto Fujimoto 半田ごて
JP2018061978A (ja) * 2016-10-13 2018-04-19 株式会社パラット 半田付けシステム、半田付け製品製造方法、半田付け方法、及び半田

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WO1998030351A1 (fr) 1998-07-16

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