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WO1998037575A1 - Procede et appareil de traitement de surface - Google Patents

Procede et appareil de traitement de surface Download PDF

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Publication number
WO1998037575A1
WO1998037575A1 PCT/JP1998/000629 JP9800629W WO9837575A1 WO 1998037575 A1 WO1998037575 A1 WO 1998037575A1 JP 9800629 W JP9800629 W JP 9800629W WO 9837575 A1 WO9837575 A1 WO 9837575A1
Authority
WO
WIPO (PCT)
Prior art keywords
surface treatment
treatment
treated
liquid
treatment liquid
Prior art date
Application number
PCT/JP1998/000629
Other languages
English (en)
Japanese (ja)
Inventor
Shoichi Terada
Yoshiaki Mori
Takuya Miyakawa
Original Assignee
Seiko Epson Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corporation filed Critical Seiko Epson Corporation
Priority to JP53648098A priority Critical patent/JP3653735B2/ja
Publication of WO1998037575A1 publication Critical patent/WO1998037575A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30604—Chemical etching
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors

Definitions

  • the present invention relates to a surface treatment technique for removing inorganic or organic substances by etching and removing the surface of a material to be treated or improving the wettability by modifying the surface.
  • Japanese Patent Application Laid-Open Nos. Hei 2-2-271834, Hei 3-2-36475, Japanese Patent Laid-open Hei 5-23979, Hei 5-2795 As disclosed in, for example, Japanese Patent Publication No. 190, a plasma is generated by performing glow discharge under a pressure near the atmospheric pressure to uniformly or locally treat a large area of a material to be treated. Methods for performing surface modification such as etching, asshing, thin film formation, and hydrophilization are known. This In this case, although a vacuum device is not required, there is a problem in that discharge control for generating stable plasma and an electrode device are complicated.
  • the present invention has been made to solve the above-described conventional problems, and the object thereof is to eliminate the need for an additional step for rinsing and drying the wet method, Also, it does not require expensive and large-scale equipment for vacuum and decompression, allows simple configuration and miniaturization of the equipment, and makes surface modification such as wettability improvement, asshing and etching relatively easy.
  • Another object of the present invention is to provide a novel surface treatment method that can be performed at low cost.
  • Another object of the present invention is to provide a novel apparatus for realizing such a surface treatment method. Disclosure of the invention
  • a surface treatment method characterized in that a treatment liquid is heated to generate steam, and the surface of the heated object is exposed to the steam.
  • the surface of the object to be treated is dry treated with the vapor of the treatment liquid, so that the wettability is improved by appropriately selecting the liquid to be used, without being limited by the shape or material of the object to be treated.
  • Various types of surface modification, etching, asshing, and dry cleaning can be performed effectively in a wide range of fields. Also, it does not require any additional steps after processing such as rinsing and drying, which are necessary for ordinary wet processing, and does not require large vacuum equipment in conventional dry processing.
  • the handling and processing operations are relatively simple, and the equipment and facilities for this can be simply configured, miniaturized, and processing costs can be significantly reduced. In addition, in-line processing can be performed easily.
  • the object to be treated is heated so that its surface temperature is equal to or higher than the boiling point of the treatment liquid, there is no possibility that the treatment liquid will be cooled and liquefied on the surface of the object to be treated, so that the surface treatment can be performed effectively. It is convenient.
  • the entire surface of the object to be treated By heating the entire surface of the object to be treated, the entire surface can be treated, or only a desired portion can be selectively treated by heating only a part of the surface. .
  • the surface By arranging the object to be treated in an atmosphere containing the vapor of the treatment liquid, the surface can be easily exposed to the vapor and a desired surface treatment can be performed.
  • pure water, acidic water or alkaline water is used as the treatment liquid, and by exposing the treatment liquid to the vapor, the surface of the treatment object is modified to improve its wettability, or The surface can be ashed.
  • the surface of the workpiece can be etched by using an acid for the treatment liquid and exposing the treatment liquid to the vapor.
  • the wettability of the surface of the object to be treated can be improved by using an organic solvent for the treatment liquid.
  • an oxidizing liquid may be used as the processing liquid to ashes the surface of the workpiece.
  • the auxiliary gas can be mixed with the vapor of the processing liquid, and the surface of the heated object can be exposed to the mixed gas, whereby the desired surface treatment can be performed more effectively. be able to.
  • pure water, acidic water, or alkaline water is used as the processing liquid, and an oxidizing gas is used as the auxiliary gas, and the processing liquid is exposed to a mixed gas of the vapor of the processing liquid and the oxidizing gas.
  • the surface of the processing object is oxidized, or the wettability of the processing object surface is improved. Can be done.
  • the wettability of the surface of the object to be processed can be improved by using an organic solvent as the processing liquid and using a non-oxidizing gas as the auxiliary gas.
  • the method comprises at least two asshing steps, at least the last of which is a step of heating the treatment liquid to generate steam, A step of exposing the surface of the object to be treated to the vapor provides a surface treatment method.
  • the surface of the non-processed material is first treated using a method having a high absorption rate, and then the organic residue remaining on the surface is subjected to a dry treatment using the vapor of a treatment liquid appropriately selected.
  • the apparatus comprises: a steam generator that heats a processing liquid to generate steam; and a heating device that heats an object to be processed, wherein the surface of the object to be heated is converted to the steam.
  • a surface treatment apparatus characterized by being exposed. Thereby, the surface treatment method of the present invention can be easily realized.
  • the surface treatment device further includes a housing that defines an atmosphere containing the vapor of the treatment liquid, and that the surface of the object is easily exposed to the vapor when the object is disposed in the housing. .
  • a heating plate on which the object is placed can be used to directly heat the object.
  • a hot air blower for sending hot air to the surface of the object to be processed can be used as a heating device, whereby a large number of objects to be processed are heated substantially uniformly and the surface is simultaneously treated. be able to.
  • the heating device can be provided with a device K for irradiating infrared rays or ultraviolet rays, and further, by providing a mask for partially irradiating infrared rays or ultraviolet rays on the surface of the workpiece, A desired portion can be selectively and locally surface-treated.
  • a gas supply device for supplying an auxiliary gas mixed with the vapor of the treatment liquid.
  • FIG. 1 is a schematic sectional view showing a configuration of a first embodiment of a surface treatment apparatus to which the present invention is applied.
  • FIG. 2 is a sectional view showing a modification of the first embodiment.
  • FIG. 3 is a sectional view showing another modification of the first embodiment.
  • FIG. 4 is a schematic sectional view showing the configuration of a second embodiment of the surface treatment apparatus to which the present invention is applied.
  • FIG. 5 is a schematic sectional view showing the configuration of a third embodiment of the surface treatment apparatus to which the present invention is applied.
  • FIG. 1 schematically shows the structure of a first embodiment of a preferred apparatus for performing the surface treatment method according to the present invention.
  • the surface treatment apparatus includes a housing 2 defining a processing chamber 1 therein, in which a heating plate 4 set on a transfer table 3 is disposed, and a workpiece 5 is placed thereon. To be placed.
  • the housing 2 is connected to a steam generator comprising a container 7 containing a processing liquid 6 and a heater 8 for heating the container.
  • the upper part in the container 7 communicates with the inside of the processing chamber 1 via a pipe 10 provided with an introduction valve 9. Further, the housing communicates with the outside via an exhaust valve 11.
  • Various liquid types such as water (including pure water and tap water), acidic water, alkaline water, oxidizing liquid, organic solvent, and acid can be used for the treatment liquid 6 according to the desired surface treatment. It can. Specifically, considering the ease of handling and the impact on the environment, water is most preferred as the treatment liquid, but other than that, hydrogen peroxide, ethyl alcohol, hydrogen fluoride, etc. are used .
  • the processing liquid 6 inside the container 7 is heated and evaporated by the heater 8, and the vapor is fed into the processing chamber 1 via the pipe 10.
  • the object 5 in the processing chamber 1 is heated to an appropriate temperature by the heating plate 4.
  • the object to be treated is subjected to a desired surface treatment by exposing the exposed surface to the vapor of the treatment liquid 6 introduced into the treatment chamber 1.
  • the processed object 5 is taken out of the processing chamber 1 by driving the transfer table 3, and then a new object is carried in, and the above-mentioned surface treatment step is repeated.
  • the amount of steam inside the processing chamber 1 is determined by the volume of the processing chamber, the method of setting the workpiece, the type and speed of surface treatment, and the amount of supply by the introduction valve 9 and the amount of discharge by the exhaust valve 11 And is controlled by adjusting
  • the temperature of the heating plate is adjusted so that the vapor of the processing liquid 6 does not liquefy on the surface of the workpiece 5.
  • the vapor in the processing chamber 1 maintain a vapor phase at least during the surface treatment, and that the inside of the housing 2 be cooled so as not to be liquefied. Therefore, separate heating means is provided, or the heating plate or heater is used to If the ring 2 itself is also configured to be heated, the efficiency of the surface treatment increases, which is advantageous.
  • the housing 2 in order to efficiently perform the surface treatment of the present invention, it is effective to make the housing 2 as small as possible to reduce the volume of the processing chamber 1 or to increase the arrangement of objects to be processed in the processing chamber.
  • Pure water was used as the processing liquid 6, and steam was generated and introduced into the processing chamber 1.
  • a thin plate of aluminum oxide was placed on the heating plate 4 as the treatment object 5, and the thin plate was treated for 5 minutes at a surface temperature of about 200 ⁇ .
  • the contact angle was 64 ° before the treatment, but was 6 ° after the treatment, and the wettability to water could be improved.
  • Example 2 In the same manner as in Example 1, pure water was used as the processing liquid 6, and steam was generated and introduced into the processing chamber 1. A silicon plate coated with an organic resist was placed on the heating plate 4 as the object 5 to be treated, and the resist plate was treated at a surface temperature of about 200 ° for 10 minutes. As a result, the resist could be removed from the silicon plate surface.
  • Hydrogen fluoride was used as the processing liquid 6, and its vapor was generated and introduced into the processing chamber 1.
  • a quartz plate was placed on the heating table 4 as the object 5 to be treated, and the surface temperature was set to 100 ° C. and the treatment was performed for 60 minutes. As a result, the surface of the quartz plate could be etched.
  • FIG. 2 schematically shows the structure of a modification of the surface treatment apparatus of FIG.
  • a warm air blower 12 is provided in place of a heating plate so as to blow warm air downward to an upper portion of the chamber 1 to be processed.
  • a plurality of plate-like workpieces 5 are vertically arranged on the mounting table 13 on the transfer table 3 so that the hot air can be easily hit.
  • FIG. 3 schematically shows the structure of another modification of the surface treatment apparatus of FIG.
  • an infrared irradiation device such as an infrared lamp with a reflecting plate is provided instead of a heating plate and provided downward on the upper part of the processing chamber 1.
  • a mask 15 provided with an opening corresponding to a desired processing portion of the workpiece is arranged.
  • the steam of the processing liquid 6 is introduced into the processing chamber 1 from the steam generator while irradiating infrared rays so that only the desired processing portion is heated.
  • the entire surface of the object 5 to be exposed is exposed to the vapor, but a desired surface treatment is locally performed only on the heated processing portion.
  • the infrared irradiation device 14 instead of the infrared irradiation device 14, another heat radiation device such as an ultraviolet irradiation device can be used.
  • the UV irradiation device has a feature that the temperature difference between the irradiated portion and the non-irradiated portion is larger than that of the infrared irradiation device, so that the local surface treatment can be performed more precisely.
  • FIG. 4 schematically shows the structure of a second embodiment of the surface treatment apparatus according to the present invention.
  • This surface treatment device is provided with a gas inlet port 16 that branches off into a pipeline 10.
  • a valve 17 By adjusting a valve 17, an auxiliary gas supplied from outside can be supplied.
  • it differs from the apparatus of the first embodiment shown in FIG. 1 in that it can be mixed with the vapor of the processing liquid 6 and introduced into the processing chamber 1.
  • a desired surface treatment can be more effectively performed by appropriately combining the treatment liquid 6 and the auxiliary gas and exposing the heated object to the mixed gas.
  • Various kinds of liquids described in the first embodiment can be used as the treatment liquid.
  • An oxidizing gas or a non-oxidizing gas can be selected as the auxiliary gas depending on the purpose of the treatment.
  • wettability can be improved by a combination of water or hydrogen peroxide and oxygen gas, or a combination of hydrogen peroxide or ethyl alcohol and nitrogen gas.
  • asshing can be performed by a combination of a hydrogen peroxide solution and an oxygen gas or a nitrogen gas.
  • ozone as an auxiliary gas, the effect of assuring can be enhanced.
  • Pure water was used as the processing liquid 6, and oxygen gas was used as the auxiliary gas, and the mixed gas was introduced into the processing chamber 1.
  • a thin plate of aluminum oxide was placed on the heating plate 4 as the object to be treated 5 and exposed to the mixed gas to perform a surface treatment. Thereby, the wettability of the aluminum oxide thin plate surface could be improved.
  • FIG. 5 schematically shows the structure of a third embodiment of the surface treatment apparatus according to the present invention.
  • a container 7 containing a treatment liquid 6 is arranged on a heating plate 4 in a treatment chamber 1 and a gas inlet 16 for supplementarily supplying a gas selected from the outside is provided.
  • the vapor of the processing liquid 6 is generated directly in the processing chamber 1 with the above configuration, so that the vapor flows through the pipeline 10 as in the first and second embodiments. Since there is no danger of cooling during the passage, more efficient surface treatment is possible.
  • the present invention provides a relatively simple process and apparatus by evaporating a treatment liquid and exposing the vapor to a heated object.
  • the purpose of the present invention is to perform the intended surface treatment by using the method described above.
  • various changes and modifications can be made thereto.
  • a desired portion of the processing target can be locally surface-treated.
  • the heating apparatus shown in FIG. 2 or FIG. 3 can be used in place of the heating plate 5 in the surface treatment apparatus of the second or third embodiment.
  • the at least two asshing steps are performed.
  • most of the organic substances are removed in a short time by using a method with a high association in the first assuring step, and at least the surface treatment method of the present invention described above in the last asssing step is used.
  • the organic residues that could not be completely removed can be completely removed from the surface of the workpiece. As a result, it is possible to relatively and efficiently completely flush the surface of the object to be treated.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

Un liquide de traitement (6) dans un récipient (7) chauffé par un dispositif de chauffage (8) en vue de son évaporation, et la vapeur résultante est régulée par une soupape (9) et introduite dans une chambre de traitement (1) par l'intermédiaire d'une conduite (10). Dans la chambre de traitement (1), des articles (5) en cours de traitement sont placés sur une plaque chauffante (4) fixée sur une table de transport (3). Ces articles en cours de traitement sont chauffés par la plaque chauffante de sorte qu'une température de surface des articles traités s'élève par exemple au-dessus du point d'ebullition du liquide de traitement. Les surfaces des articles traités sont exposés à la vapeur du liquide de traitement introduit dans la chambre de traitement, de sorte que les finitions de surface telles que l'amélioration de la mouillabilité et les traitements de surface tels que le polissage, le décapage et le nettoyage à sec sont réalisés en fonction du type du liquide de traitement. Les effets du traitement de surface peuvent être renforcés par mélange d'un gaz auxiliaire dans la vapeur du liquide de traitement et exposition des surfaces des articles traités au gaz mélangé. Les articles ayant été soumis au traitement sont retirés de la chambre de traitement par actionnement de la table de transport (3), de nouveaux articles sont ensuite introduits et le mode opératoire de traitement de surface est répété.
PCT/JP1998/000629 1997-02-24 1998-02-16 Procede et appareil de traitement de surface WO1998037575A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP53648098A JP3653735B2 (ja) 1997-02-24 1998-02-16 表面処理方法及びその装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP9/39579 1997-02-24
JP3957997 1997-02-24

Publications (1)

Publication Number Publication Date
WO1998037575A1 true WO1998037575A1 (fr) 1998-08-27

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PCT/JP1998/000629 WO1998037575A1 (fr) 1997-02-24 1998-02-16 Procede et appareil de traitement de surface

Country Status (2)

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JP (1) JP3653735B2 (fr)
WO (1) WO1998037575A1 (fr)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001250773A (ja) * 1999-08-12 2001-09-14 Uct Kk レジスト膜除去装置及びレジスト膜除去方法
EP1288284A4 (fr) * 2000-06-01 2004-11-24 Asahi Chemical Ind Agent, procede et appareil de nettoyage
WO2004109779A1 (fr) * 2003-06-06 2004-12-16 Tokyo Electron Limited Procede permettant d'ameliorer la rugosite superficielle de la pellicule d'un substrat ayant subi un traitement, et appareil servant a traiter un substrat
WO2005104194A1 (fr) * 2004-04-20 2005-11-03 Tokyo Electron Limited Procede de traitement de substrat et appareil de traitement de substrat
JP2007180554A (ja) * 2006-12-25 2007-07-12 Tokyo Electron Ltd 基板処理装置
JP2007266636A (ja) * 2007-07-09 2007-10-11 Tokyo Electron Ltd 基板処理装置
JP2010118681A (ja) * 1999-08-12 2010-05-27 Aqua Science Kk レジスト膜除去装置及びレジスト膜除去方法
WO2021078564A1 (fr) * 2019-10-25 2021-04-29 Robert Bosch Gmbh Procédé de création de surfaces hydrophiles ou de régions de surface sur un substrat

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04370931A (ja) * 1991-06-19 1992-12-24 Hitachi Zosen Corp 基板洗浄方法
JPH05206088A (ja) * 1992-01-29 1993-08-13 Fujikura Ltd 半導体の加工方法
JPH05335293A (ja) * 1992-06-03 1993-12-17 Nippon Steel Corp 半導体素子の製造方法およびその装置
JPH06306660A (ja) * 1993-04-26 1994-11-01 Sumitomo Metal Ind Ltd 試料の洗浄方法
JPH07142443A (ja) * 1993-06-09 1995-06-02 Texas Instr Inc <Ti> ハードトレンチマスクの除去方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04370931A (ja) * 1991-06-19 1992-12-24 Hitachi Zosen Corp 基板洗浄方法
JPH05206088A (ja) * 1992-01-29 1993-08-13 Fujikura Ltd 半導体の加工方法
JPH05335293A (ja) * 1992-06-03 1993-12-17 Nippon Steel Corp 半導体素子の製造方法およびその装置
JPH06306660A (ja) * 1993-04-26 1994-11-01 Sumitomo Metal Ind Ltd 試料の洗浄方法
JPH07142443A (ja) * 1993-06-09 1995-06-02 Texas Instr Inc <Ti> ハードトレンチマスクの除去方法

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001250773A (ja) * 1999-08-12 2001-09-14 Uct Kk レジスト膜除去装置及びレジスト膜除去方法
JP2010118681A (ja) * 1999-08-12 2010-05-27 Aqua Science Kk レジスト膜除去装置及びレジスト膜除去方法
EP1288284A4 (fr) * 2000-06-01 2004-11-24 Asahi Chemical Ind Agent, procede et appareil de nettoyage
US8529703B2 (en) 2000-06-01 2013-09-10 Asahi Kasei Kabushiki Kaisha Cleaning agent, cleaning method and cleaning apparatus
KR100892199B1 (ko) * 2000-06-01 2009-04-07 아사히 가세이 가부시키가이샤 세정제, 세정 방법 및 세정 장치
US7531495B2 (en) 2000-06-01 2009-05-12 Asahi Kasei Kabushiki Kaisha Cleaning agent, cleaning method and cleaning apparatus
US7875420B2 (en) 2003-06-06 2011-01-25 Tokyo Electron Limited Method for improving surface roughness of processed film of substrate and apparatus for processing substrate
WO2004109779A1 (fr) * 2003-06-06 2004-12-16 Tokyo Electron Limited Procede permettant d'ameliorer la rugosite superficielle de la pellicule d'un substrat ayant subi un traitement, et appareil servant a traiter un substrat
US8646403B2 (en) 2003-06-06 2014-02-11 Tokyo Electron Limited Method for improving surface roughness of processed film of substrate and apparatus for processing substrate
CN100424822C (zh) * 2003-06-06 2008-10-08 东京毅力科创株式会社 基板的处理膜表面粗糙度的改善方法及基板的处理装置
US7989156B2 (en) 2004-04-20 2011-08-02 Tokyo Electron Limited Substrate treatment method and substrate treatment apparatus
US7819076B2 (en) 2004-04-20 2010-10-26 Tokyo Electron Limited Substrate treatment method and substrate treatment apparatus
WO2005104194A1 (fr) * 2004-04-20 2005-11-03 Tokyo Electron Limited Procede de traitement de substrat et appareil de traitement de substrat
JP2007180554A (ja) * 2006-12-25 2007-07-12 Tokyo Electron Ltd 基板処理装置
JP2007266636A (ja) * 2007-07-09 2007-10-11 Tokyo Electron Ltd 基板処理装置
WO2021078564A1 (fr) * 2019-10-25 2021-04-29 Robert Bosch Gmbh Procédé de création de surfaces hydrophiles ou de régions de surface sur un substrat
CN114555514A (zh) * 2019-10-25 2022-05-27 罗伯特·博世有限公司 在载体上形成亲水表面或表面区域的方法

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