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WO1999002996A3 - Multiple point position scanning system - Google Patents

Multiple point position scanning system Download PDF

Info

Publication number
WO1999002996A3
WO1999002996A3 PCT/US1998/012239 US9812239W WO9902996A3 WO 1999002996 A3 WO1999002996 A3 WO 1999002996A3 US 9812239 W US9812239 W US 9812239W WO 9902996 A3 WO9902996 A3 WO 9902996A3
Authority
WO
WIPO (PCT)
Prior art keywords
scanning
multiple point
scanning system
end effector
point position
Prior art date
Application number
PCT/US1998/012239
Other languages
French (fr)
Other versions
WO1999002996A2 (en
Inventor
Genco Genov
Alexander Todorov
Entcho Ivanov
Roumen Botev
Vladimir Michaylov
Lubo Kostov
Zlatko Sotirov
Eugene Bonev
Original Assignee
Genmark Automation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Genmark Automation filed Critical Genmark Automation
Priority to EP98931251A priority Critical patent/EP0996963A4/en
Priority to JP2000502425A priority patent/JP2001509643A/en
Publication of WO1999002996A2 publication Critical patent/WO1999002996A2/en
Publication of WO1999002996A3 publication Critical patent/WO1999002996A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/16—Programme controls
    • B25J9/1694—Programme controls characterised by use of sensors other than normal servo-feedback from position, speed or acceleration sensors, perception control, multi-sensor controlled systems, sensor fusion
    • B25J9/1697—Vision controlled systems
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/401—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by control arrangements for measuring, e.g. calibration and initialisation, measuring workpiece for machining purposes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/37—Measurements
    • G05B2219/37061—Use matrix of optical sensors to detect form, edges of object
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/37—Measurements
    • G05B2219/37608—Center and diameter of hole, wafer, object
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/39—Robotics, robotics to robotics hand
    • G05B2219/39012—Calibrate arm during scanning operation for identification of object
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/40—Robotics, robotics mapping to robotics vision
    • G05B2219/40564—Recognize shape, contour of object, extract position and orientation
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/41—Servomotor, servo controller till figures
    • G05B2219/41111—Vertical position and orientation with respect to vertical
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/49—Nc machine tool, till multiple
    • G05B2219/49143—Obstacle, collision avoiding control, move so that no collision occurs

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Automation & Control Theory (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

A multiple point scanning system is suitable for determining the orientation in space of a substrate such as a flat panel display or semiconductor wafer. The system includes a scanning end effector (100, 102) which may be utilized with an end effector structure, the end effector structure having a first end and a second end, the first end including a forward scanning sensor (FS) and the second end including top scanning sensors (TS). The system may also include a rear scanning sensor (424) coupled to a sensor frame (450). In yet another embodiment of the present invention, three sensors are located in a front end setup at three different locations in an X-Y plane, to sense the Z-axis coordinates of a substrate or wafer in a front end processor which is positionable on an elevator.
PCT/US1998/012239 1997-07-11 1998-06-18 Multiple point position scanning system WO1999002996A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP98931251A EP0996963A4 (en) 1997-07-11 1998-06-18 Multiple point position scanning system
JP2000502425A JP2001509643A (en) 1997-07-11 1998-06-18 Multi-point position scanning system

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US89081697A 1997-07-11 1997-07-11
US08/890,816 1997-07-11

Publications (2)

Publication Number Publication Date
WO1999002996A2 WO1999002996A2 (en) 1999-01-21
WO1999002996A3 true WO1999002996A3 (en) 1999-04-29

Family

ID=25397178

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1998/012239 WO1999002996A2 (en) 1997-07-11 1998-06-18 Multiple point position scanning system

Country Status (3)

Country Link
EP (1) EP0996963A4 (en)
JP (1) JP2001509643A (en)
WO (1) WO1999002996A2 (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6323616B1 (en) * 1999-03-15 2001-11-27 Berkeley Process Control, Inc. Self teaching robotic wafer handling system
US6388436B1 (en) 1999-08-06 2002-05-14 International Business Machines Corporation Apparatus for calibrating the alignment of a wafer cassette holder to a robot blade
US6577923B1 (en) * 1999-12-23 2003-06-10 Applied Materials, Inc. Apparatus and method for robotic alignment of substrates
US6822413B2 (en) 2002-03-20 2004-11-23 Fsi International, Inc. Systems and methods incorporating an end effector with a rotatable and/or pivotable body and/or an optical sensor having a light path that extends along a length of the end effector
JP4260423B2 (en) 2002-05-30 2009-04-30 ローツェ株式会社 Disc-shaped object reference position teaching method, positioning method, and transport method, and disc-shaped reference position teaching apparatus, positioning apparatus, transport apparatus, and semiconductor manufacturing equipment using these methods
JP4028814B2 (en) * 2003-04-21 2007-12-26 川崎重工業株式会社 Mapping device
US20050086024A1 (en) * 2003-09-19 2005-04-21 Cyberoptics Semiconductor Inc. Semiconductor wafer location sensing via non contact methods
JP4047826B2 (en) 2004-03-25 2008-02-13 東京エレクトロン株式会社 Vertical heat treatment apparatus and automatic teaching method for transfer mechanism
US9269529B2 (en) 2007-12-27 2016-02-23 Lam Research Corporation Systems and methods for dynamic alignment beam calibration
JP5417343B2 (en) 2007-12-27 2014-02-12 ラム リサーチ コーポレーション System and method for calibrating an end effector alignment using at least one light source
JP5409649B2 (en) 2007-12-27 2014-02-05 ラム リサーチ コーポレーション System and method for determining position and offset
SG187402A1 (en) 2007-12-27 2013-02-28 Lam Res Corp Systems and methods for calibrating end effector alignment in a plasma processing system
CH699754B1 (en) * 2008-10-20 2020-11-13 Tec Sem Ag Storage device for temporary storage of objects for the production of semiconductor components
CN107112266B (en) 2014-11-10 2020-12-08 布鲁克斯自动化公司 Tool automatic teaching method and device
US9966290B2 (en) 2015-07-30 2018-05-08 Lam Research Corporation System and method for wafer alignment and centering with CCD camera and robot
ES2994421T3 (en) 2019-02-08 2025-01-23 Yaskawa America Inc Through-beam auto teaching
CN114496845B (en) * 2021-12-30 2025-09-02 上海至纯洁净系统科技股份有限公司 Adaptive variable-pitch wafer scanning system and method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5626456A (en) * 1993-03-18 1997-05-06 Tokyo Electron Limited Transfer device
US5783834A (en) * 1997-02-20 1998-07-21 Modular Process Technology Method and process for automatic training of precise spatial locations to a robot
US5833288A (en) * 1996-07-16 1998-11-10 Nec Corporation Vacuum suction forceps

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4770590A (en) * 1986-05-16 1988-09-13 Silicon Valley Group, Inc. Method and apparatus for transferring wafers between cassettes and a boat
US4819167A (en) * 1987-04-20 1989-04-04 Applied Materials, Inc. System and method for detecting the center of an integrated circuit wafer
US5409348A (en) * 1992-05-15 1995-04-25 Tokyo Electron Limited Substrate transfer method
DE69329269T2 (en) * 1992-11-12 2000-12-28 Applied Materials, Inc. System and method for automatic positioning of a substrate in a process room
JP2683208B2 (en) * 1993-01-28 1997-11-26 アプライド マテリアルズ インコーポレイテッド Workpiece alignment method and apparatus for loading and unloading using robot mechanism
JP3247495B2 (en) * 1993-06-25 2002-01-15 株式会社日立国際電気 Substrate processing apparatus, position setting method of substrate transfer machine, and boat state detection method
JPH0936201A (en) * 1995-05-18 1997-02-07 Toshiba Electron Eng Corp Substrate transfer method and substrate transfer apparatus
JPH0982776A (en) * 1995-09-14 1997-03-28 Toshiba Corp Work transfer device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5626456A (en) * 1993-03-18 1997-05-06 Tokyo Electron Limited Transfer device
US5833288A (en) * 1996-07-16 1998-11-10 Nec Corporation Vacuum suction forceps
US5783834A (en) * 1997-02-20 1998-07-21 Modular Process Technology Method and process for automatic training of precise spatial locations to a robot

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP0996963A4 *

Also Published As

Publication number Publication date
EP0996963A4 (en) 2006-01-18
WO1999002996A2 (en) 1999-01-21
EP0996963A1 (en) 2000-05-03
JP2001509643A (en) 2001-07-24

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