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WO1999002996A3 - Scanneur a positionnement multiple - Google Patents

Scanneur a positionnement multiple Download PDF

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Publication number
WO1999002996A3
WO1999002996A3 PCT/US1998/012239 US9812239W WO9902996A3 WO 1999002996 A3 WO1999002996 A3 WO 1999002996A3 US 9812239 W US9812239 W US 9812239W WO 9902996 A3 WO9902996 A3 WO 9902996A3
Authority
WO
WIPO (PCT)
Prior art keywords
scanning
multiple point
scanning system
end effector
point position
Prior art date
Application number
PCT/US1998/012239
Other languages
English (en)
Other versions
WO1999002996A2 (fr
Inventor
Genco Genov
Alexander Todorov
Entcho Ivanov
Roumen Botev
Vladimir Michaylov
Lubo Kostov
Zlatko Sotirov
Eugene Bonev
Original Assignee
Genmark Automation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Genmark Automation filed Critical Genmark Automation
Priority to EP98931251A priority Critical patent/EP0996963A4/fr
Priority to JP2000502425A priority patent/JP2001509643A/ja
Publication of WO1999002996A2 publication Critical patent/WO1999002996A2/fr
Publication of WO1999002996A3 publication Critical patent/WO1999002996A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/16—Programme controls
    • B25J9/1694—Programme controls characterised by use of sensors other than normal servo-feedback from position, speed or acceleration sensors, perception control, multi-sensor controlled systems, sensor fusion
    • B25J9/1697—Vision controlled systems
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/401—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by control arrangements for measuring, e.g. calibration and initialisation, measuring workpiece for machining purposes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/37—Measurements
    • G05B2219/37061—Use matrix of optical sensors to detect form, edges of object
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/37—Measurements
    • G05B2219/37608—Center and diameter of hole, wafer, object
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/39—Robotics, robotics to robotics hand
    • G05B2219/39012—Calibrate arm during scanning operation for identification of object
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/40—Robotics, robotics mapping to robotics vision
    • G05B2219/40564—Recognize shape, contour of object, extract position and orientation
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/41—Servomotor, servo controller till figures
    • G05B2219/41111—Vertical position and orientation with respect to vertical
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/49—Nc machine tool, till multiple
    • G05B2219/49143—Obstacle, collision avoiding control, move so that no collision occurs

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Automation & Control Theory (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

On décrit un scanneur à positionnement multiple qui convient pour déterminer l'orientation dans l'espace d'un substrat tel qu'un écran d'affichage plat ou une plaquette à semi-conducteurs. Ledit écran ou plaquette à semi-conducteurs peut être positionné dans le support de plaquette, et le sytème de l'invention peut déterminer la position du support pour étalonner un robot ou autre mécanisme de positionnement et lui indiquer la position du support. En s'aidant de détecteurs à balayage supérieurs, on peut déterminer les coordonnées XY de la plaquette ou du substrat et calculer la position réelle de la plaquette. Le système inclut un terminal de balayage (100, 102) qui peut être utilisé avec une structure de terminal de balayage, laquelle comporte une première extrémité et une deuxième extrémité, la première extrémité incluant un détecteur à balayage avant (FS) et la deuxième extrémité incluant des détecteurs à balayage supérieurs (TS). Le terminal de balayage peut pivoter autour d'un axe Z traversant un bras manipulateur, tel qu'un bras de positionnement global pour positionner le terminal de balayage par rapport tant au support de plaquette qu'aux substrats. Le système peut également inclure un détecteur à balayage arrière (424) couplé à un cadre du détecteur (450). Le cadre du détecteur peut être positionné le long de l'axe Z lorsqu'un terminal de balayage s'engage dans le cadre de balayage et déplace celui le long de l'axe Z simultanément au mouvement de balayage du terminal de balayage. Dans une autre forme de réalisation, les détecteurs sont situés dans une chambre ou installés en position frontale à trois différents emplacements, sur un plan XY, pour détecter les coordonnées de l'axe Z d'un substrat ou d'une plaquette dans un ordinateur de gestion de lignes pouvant être positionné sur un élévateur ou élévateur d'alignement global. Le système peut être utilisé en combinaison avec un bras manipulateur ou un robot de positionnement global équipé d'un ou plusieurs capteurs de détection verticaux.
PCT/US1998/012239 1997-07-11 1998-06-18 Scanneur a positionnement multiple WO1999002996A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP98931251A EP0996963A4 (fr) 1997-07-11 1998-06-18 Scanneur a positionnement multiple
JP2000502425A JP2001509643A (ja) 1997-07-11 1998-06-18 複数ポイント位置走査システム

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US89081697A 1997-07-11 1997-07-11
US08/890,816 1997-07-11

Publications (2)

Publication Number Publication Date
WO1999002996A2 WO1999002996A2 (fr) 1999-01-21
WO1999002996A3 true WO1999002996A3 (fr) 1999-04-29

Family

ID=25397178

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1998/012239 WO1999002996A2 (fr) 1997-07-11 1998-06-18 Scanneur a positionnement multiple

Country Status (3)

Country Link
EP (1) EP0996963A4 (fr)
JP (1) JP2001509643A (fr)
WO (1) WO1999002996A2 (fr)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6323616B1 (en) * 1999-03-15 2001-11-27 Berkeley Process Control, Inc. Self teaching robotic wafer handling system
US6388436B1 (en) 1999-08-06 2002-05-14 International Business Machines Corporation Apparatus for calibrating the alignment of a wafer cassette holder to a robot blade
US6577923B1 (en) * 1999-12-23 2003-06-10 Applied Materials, Inc. Apparatus and method for robotic alignment of substrates
US6822413B2 (en) 2002-03-20 2004-11-23 Fsi International, Inc. Systems and methods incorporating an end effector with a rotatable and/or pivotable body and/or an optical sensor having a light path that extends along a length of the end effector
JP4260423B2 (ja) 2002-05-30 2009-04-30 ローツェ株式会社 円盤状物の基準位置教示方法、位置決め方法および搬送方法並びに、それらの方法を使用する円盤状物の基準位置教示装置、位置決め装置、搬送装置および半導体製造設備
JP4028814B2 (ja) * 2003-04-21 2007-12-26 川崎重工業株式会社 マッピング装置
US20050086024A1 (en) * 2003-09-19 2005-04-21 Cyberoptics Semiconductor Inc. Semiconductor wafer location sensing via non contact methods
JP4047826B2 (ja) 2004-03-25 2008-02-13 東京エレクトロン株式会社 縦型熱処理装置及び移載機構の自動教示方法
US9269529B2 (en) 2007-12-27 2016-02-23 Lam Research Corporation Systems and methods for dynamic alignment beam calibration
JP5417343B2 (ja) 2007-12-27 2014-02-12 ラム リサーチ コーポレーション 少なくとも１つの光源を使用してエンドエフェクタ・アラインメントを校正するためのシステムおよび方法
JP5409649B2 (ja) 2007-12-27 2014-02-05 ラム リサーチ コーポレーション 位置およびオフセットを決定するためのシステムおよび方法
SG187402A1 (en) 2007-12-27 2013-02-28 Lam Res Corp Systems and methods for calibrating end effector alignment in a plasma processing system
CH699754B1 (de) * 2008-10-20 2020-11-13 Tec Sem Ag Speichervorrichtung für eine Zwischenlagerung von Objekten für die Produktion von Halbleiterbauelementen
CN107112266B (zh) 2014-11-10 2020-12-08 布鲁克斯自动化公司 工具自动教导方法和设备
US9966290B2 (en) 2015-07-30 2018-05-08 Lam Research Corporation System and method for wafer alignment and centering with CCD camera and robot
ES2994421T3 (en) 2019-02-08 2025-01-23 Yaskawa America Inc Through-beam auto teaching
CN114496845B (zh) * 2021-12-30 2025-09-02 上海至纯洁净系统科技股份有限公司 自适应可变间距晶圆扫描系统及方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5626456A (en) * 1993-03-18 1997-05-06 Tokyo Electron Limited Transfer device
US5783834A (en) * 1997-02-20 1998-07-21 Modular Process Technology Method and process for automatic training of precise spatial locations to a robot
US5833288A (en) * 1996-07-16 1998-11-10 Nec Corporation Vacuum suction forceps

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Publication number Priority date Publication date Assignee Title
US4770590A (en) * 1986-05-16 1988-09-13 Silicon Valley Group, Inc. Method and apparatus for transferring wafers between cassettes and a boat
US4819167A (en) * 1987-04-20 1989-04-04 Applied Materials, Inc. System and method for detecting the center of an integrated circuit wafer
US5409348A (en) * 1992-05-15 1995-04-25 Tokyo Electron Limited Substrate transfer method
DE69329269T2 (de) * 1992-11-12 2000-12-28 Applied Materials, Inc. System und Verfahren für automatische Positionierung eines Substrats in einem Prozessraum
JP2683208B2 (ja) * 1993-01-28 1997-11-26 アプライド マテリアルズ インコーポレイテッド ロボット機構を用いた搬入および搬出のためのワークピース位置合わせ方法および装置
JP3247495B2 (ja) * 1993-06-25 2002-01-15 株式会社日立国際電気 基板処理装置、基板移載機の位置設定方法、及びボートの状態検出方法
JPH0936201A (ja) * 1995-05-18 1997-02-07 Toshiba Electron Eng Corp 基板移載方法および基板移載装置
JPH0982776A (ja) * 1995-09-14 1997-03-28 Toshiba Corp ワーク搬送装置

Patent Citations (3)

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Publication number Priority date Publication date Assignee Title
US5626456A (en) * 1993-03-18 1997-05-06 Tokyo Electron Limited Transfer device
US5833288A (en) * 1996-07-16 1998-11-10 Nec Corporation Vacuum suction forceps
US5783834A (en) * 1997-02-20 1998-07-21 Modular Process Technology Method and process for automatic training of precise spatial locations to a robot

Non-Patent Citations (1)

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Title
See also references of EP0996963A4 *

Also Published As

Publication number Publication date
EP0996963A4 (fr) 2006-01-18
WO1999002996A2 (fr) 1999-01-21
EP0996963A1 (fr) 2000-05-03
JP2001509643A (ja) 2001-07-24

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