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WO1999003128A3 - Singulation system for chip-scale packages - Google Patents

Singulation system for chip-scale packages Download PDF

Info

Publication number
WO1999003128A3
WO1999003128A3 PCT/US1998/014078 US9814078W WO9903128A3 WO 1999003128 A3 WO1999003128 A3 WO 1999003128A3 US 9814078 W US9814078 W US 9814078W WO 9903128 A3 WO9903128 A3 WO 9903128A3
Authority
WO
WIPO (PCT)
Prior art keywords
cutting assembly
tape
longitudinally
chip
cuts
Prior art date
Application number
PCT/US1998/014078
Other languages
French (fr)
Other versions
WO1999003128A2 (en
Inventor
Phillip E Koerper
Merlin E Behnke
Albert J Chanasyk
Original Assignee
Systemation Engineered Product
Phillip E Koerper
Merlin E Behnke
Albert J Chanasyk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Systemation Engineered Product, Phillip E Koerper, Merlin E Behnke, Albert J Chanasyk filed Critical Systemation Engineered Product
Publication of WO1999003128A2 publication Critical patent/WO1999003128A2/en
Publication of WO1999003128A3 publication Critical patent/WO1999003128A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Dicing (AREA)

Abstract

A singulation system and method for singulating a plurality of chip-scale packages (62) fabricated on a carrier tape (58) is disclosed. The packages (62) are arranged in an array having at least one row and a plurality of columns extending longitudinally. The system includes a first cutting assembly (32) for making first cuts transversely through the tape (58) of the package (62). A first positioning mechanism (36) positions longitudinally the first cutting assembly (32) with respect to the selected column. Drive rollers (18, 20, 22, 24, 26) advance the tape (58) longitudinally from the first cutting assembly (32) to a second cutting assembly (34). The second cutting assembly (34) makes second cuts longitudinally through the tape (58) which intersect the first cuts. A second positioning mechanism (38) positions the second cutting assembly (34) transversely with respect to the selected column.
PCT/US1998/014078 1997-07-09 1998-07-07 Singulation system for chip-scale packages WO1999003128A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US5198597P 1997-07-09 1997-07-09
US60/051,985 1997-07-09
US7394498P 1998-02-06 1998-02-06
US60/073,944 1998-02-06

Publications (2)

Publication Number Publication Date
WO1999003128A2 WO1999003128A2 (en) 1999-01-21
WO1999003128A3 true WO1999003128A3 (en) 1999-07-29

Family

ID=26730038

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1998/014078 WO1999003128A2 (en) 1997-07-09 1998-07-07 Singulation system for chip-scale packages

Country Status (1)

Country Link
WO (1) WO1999003128A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IE20000618A1 (en) 1999-08-03 2001-03-07 Xsil Technology Ltd A circuit singulation system and method
NL2000028C2 (en) * 2006-03-16 2007-09-18 Fico Bv Device for automated laser cutting of a flat carrier provided with encapsulated electronic components.
JP2017177261A (en) * 2016-03-29 2017-10-05 株式会社ディスコ Cutting apparatus
JP7398724B2 (en) * 2019-05-15 2023-12-15 パナソニックＩｐマネジメント株式会社 Component mounting device and component mounting method

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4621552A (en) * 1985-01-04 1986-11-11 Cencorp Method and apparatus for separating printed-circuit boards from multi-board panels
US4683789A (en) * 1985-01-04 1987-08-04 Cencorp Method and apparatus for separating printed circuit boards from multi-board panels
US4791721A (en) * 1987-02-19 1988-12-20 Wand Tool Company Singulation system for printed circuit boards
US4972572A (en) * 1985-11-13 1990-11-27 Fujitsu Limited IC sheet cutting press and IC sheet processing apparatus using the same
US5483857A (en) * 1993-09-20 1996-01-16 Bi-Link Metal Specialties Workpiece finishing and presentation machine

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4621552A (en) * 1985-01-04 1986-11-11 Cencorp Method and apparatus for separating printed-circuit boards from multi-board panels
US4683789A (en) * 1985-01-04 1987-08-04 Cencorp Method and apparatus for separating printed circuit boards from multi-board panels
US4972572A (en) * 1985-11-13 1990-11-27 Fujitsu Limited IC sheet cutting press and IC sheet processing apparatus using the same
US4791721A (en) * 1987-02-19 1988-12-20 Wand Tool Company Singulation system for printed circuit boards
US5483857A (en) * 1993-09-20 1996-01-16 Bi-Link Metal Specialties Workpiece finishing and presentation machine

Also Published As

Publication number Publication date
WO1999003128A2 (en) 1999-01-21

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