WO1999030352A2 - Procede pour la production d'une matrice de transistors a couche mince avec des capacites de memoire - Google Patents
Procede pour la production d'une matrice de transistors a couche mince avec des capacites de memoire Download PDFInfo
- Publication number
- WO1999030352A2 WO1999030352A2 PCT/EP1998/007361 EP9807361W WO9930352A2 WO 1999030352 A2 WO1999030352 A2 WO 1999030352A2 EP 9807361 W EP9807361 W EP 9807361W WO 9930352 A2 WO9930352 A2 WO 9930352A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- matrix
- thin
- applying
- photosensitive
- structuring
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 239000011159 matrix material Substances 0.000 title claims abstract description 14
- 238000003860 storage Methods 0.000 title claims abstract description 14
- 239000010409 thin film Substances 0.000 title claims abstract description 14
- 238000000034 method Methods 0.000 claims abstract description 20
- 239000004973 liquid crystal related substance Substances 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims abstract description 5
- 239000004065 semiconductor Substances 0.000 claims description 16
- 229920000642 polymer Polymers 0.000 claims description 13
- 239000003990 capacitor Substances 0.000 claims description 8
- 238000002161 passivation Methods 0.000 claims description 7
- 229920001940 conductive polymer Polymers 0.000 claims description 6
- 239000012212 insulator Substances 0.000 claims description 6
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 4
- 239000012780 transparent material Substances 0.000 claims description 4
- 239000011810 insulating material Substances 0.000 claims description 2
- 238000005530 etching Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 230000018109 developmental process Effects 0.000 description 3
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 241001239379 Calophysus macropterus Species 0.000 description 1
- 229910016024 MoTa Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1343—Electrodes
- G02F1/13439—Electrodes characterised by their electrical, optical, physical properties; materials therefor; method of making
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133345—Insulating layers
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136213—Storage capacitors associated with the pixel electrode
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/1368—Active matrix addressed cells in which the switching element is a three-electrode device
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133357—Planarisation layers
Definitions
- the invention is based on a method for producing a matrix of thin-film transistors with storage capacities, in particular for liquid crystal screens according to the type of the independent claim.
- the inventive method with the characterizing features of the independent claim has the advantage over the known methods that fewer coating and etching steps and steps for photoresist removal are necessary.
- photostructurable materials are used for the passivation of the matrix and for the production of the pixel electrodes.
- one coating step namely a PECVD method for SiN x and one sputtering of ITO
- etching step namely dry etching of SiN x and wet etching from ITO
- a photosensitive, transparent and highly insulating polymer can be used for the passivation and an electrically conductive polymer for the production of the pixel electrodes.
- a mechanical rubbing treatment of the conductive polymer can also be used to orient the liquid crystal, so that the application of an additional orientation layer, for example a polymer, can be completely dispensed with.
- an additional orientation layer for example a polymer
- a-Si: H can be used as the semiconductor and SiN x as the gate insulator.
- Figure 1 shows a cross section through a pixel of a liquid crystal screen in various stages of manufacture.
- a first metallization layer 11 for example 200 nm MoTa
- a layer sequence consisting of a gate insulator 12, for example 350 nm SiN x , an intrinsic semiconductor 13, for example 150 nm ia-Si, and a highly doped semiconductor 14, for example 50 nm n + -a-Si, and a cover metallization , for example 200 nm Mo, applied.
- 1 b shows the structure after etching the cover metal layer 15 and the doped semiconductor layer 14 as a column line, drain / source contacts D, S and as a cover electrode of the storage capacitor C.
- the semiconductor layer 13 and the gate dielectric 12 are shown in a single plasma etching step for separating the individual thin-film transistors of the pixels and for exposing the connection areas of the gate lines and storage capacitor lines.
- a photosensitive, transparent and highly insulating polymer 16 was spun onto the structure, exposed, developed and annealed.
- a so-called Photo-BCB can be used as the polymer.
- the task of the polymer is to passivate and planarize the structure.
- the top electrode of the storage capacitor C which here also represents the drain contact of the thin-film transistor, and the connection regions of the column and row lines are decoated again by the polymer in the exposure and development step.
- a conductive, photosensitive, transparent polymer 17 is then spun on as a pixel electrode.
- a polymer called Bayer PEDT / PSS can be used for this purpose. Exposing the areas between the pixel electrodes with UV light through a photo mask causes the conductive polymer to be converted into an insulation layer. The insulating regions of the polymer are shown in dotted lines in FIG. 1e). If a photosensitive conductive polymer is used, the areas between the pixel electrodes can also be removed by means of a developer step. The individual pixel electrodes are thus effectively electrically separated from one another. After one step of the polymer PEDT / PSS at approx.
- the unexposed areas of the pixel electrodes have a sheet-related sheet resistance of 200 - 1000 ⁇ and a transparency of) 70% in the visible area, based on a dry film thickness of 900 nm.
- the transmission can be increased by reducing the dry layer thickness.
- the layer 17 can then be rubbed mechanically so that it can bring about an orientation of the liquid crystal. As a result, the application of an additional orientation layer can also be dispensed with.
- the structuring of the gate dielectric 12 can - as shown - be carried out together with the structuring of the undoped semiconductor 13 or also with the passivation 16 as masking in an additional plasma etching process.
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Liquid Crystal (AREA)
- Power Engineering (AREA)
- Thin Film Transistor (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP98966240A EP1038320A2 (fr) | 1997-12-10 | 1998-11-17 | Procede pour la production d'une matrice de transistors a couche mince avec des capacites de memoire |
JP2000524811A JP2001526412A (ja) | 1997-12-10 | 1998-11-17 | 記憶コンデンサを伴う薄膜トランジスタからなるマトリクスの製法 |
KR1020007006284A KR20010032940A (ko) | 1997-12-10 | 1998-11-17 | 스토리지 용량을 가지는 박막 트랜지스터로부터매트릭스의 제조 방법 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19754784A DE19754784B4 (de) | 1997-12-10 | 1997-12-10 | Verfahren zur Herstellung einer Matrix aus Dünnschichttransistoren mit Speicherkapazitäten |
DE19754784.2 | 1997-12-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO1999030352A2 true WO1999030352A2 (fr) | 1999-06-17 |
WO1999030352A3 WO1999030352A3 (fr) | 1999-12-09 |
Family
ID=7851371
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP1998/007361 WO1999030352A2 (fr) | 1997-12-10 | 1998-11-17 | Procede pour la production d'une matrice de transistors a couche mince avec des capacites de memoire |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP1038320A2 (fr) |
JP (1) | JP2001526412A (fr) |
KR (1) | KR20010032940A (fr) |
DE (1) | DE19754784B4 (fr) |
TW (1) | TW432707B (fr) |
WO (1) | WO1999030352A2 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6830814B1 (en) * | 1999-07-20 | 2004-12-14 | Robert Bosch Gmbh | Layer containing an electroconductive transparent material, method for producing same and uses thereof |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100485625B1 (ko) * | 2001-12-20 | 2005-04-27 | 엘지.필립스 엘시디 주식회사 | 액정표시소자 및 그 제조방법 |
KR101023292B1 (ko) * | 2003-10-28 | 2011-03-18 | 엘지디스플레이 주식회사 | 액정표시장치 제조방법 |
CN103700673B (zh) * | 2013-12-24 | 2017-07-04 | 京东方科技集团股份有限公司 | 一种显示装置、阵列基板及其制作方法 |
US11676855B2 (en) * | 2020-02-26 | 2023-06-13 | Taiwan Semiconductor Manufacturing Co., Ltd. | Patterning interconnects and other structures by photo-sensitizing method |
DE102020130905A1 (de) * | 2020-02-26 | 2021-08-26 | Taiwan Semiconductor Manufacturing Co., Ltd. | Strukturieren von Interconnects und anderer Aufbauten durch Photosensibilisierungsverfahren |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61292183A (ja) * | 1985-05-25 | 1986-12-22 | 旭硝子株式会社 | エレクトロクロミツク表示素子 |
DE4310640C1 (de) * | 1993-03-31 | 1994-05-11 | Lueder Ernst | Verfahren zur Herstellung einer Matrix aus a-Si:H-Dünnschichttransistoren |
ATE287929T1 (de) * | 1994-05-06 | 2005-02-15 | Bayer Ag | Leitfähige beschichtungen hergestellt aus mischungen enthaltend polythiophen und lösemittel |
KR970011972A (ko) * | 1995-08-11 | 1997-03-29 | 쯔지 하루오 | 투과형 액정 표시 장치 및 그 제조 방법 |
JPH0990421A (ja) * | 1995-09-27 | 1997-04-04 | Sharp Corp | 液晶表示装置およびその製造方法 |
DE69633523T2 (de) * | 1995-11-22 | 2006-02-16 | The Government Of The United States Of America, As Represented By The Secretary Of The Navy Naval Research Laboratory | Leitende gemusterte polymeroberfläche, verfahren zu ihrer herstellung und diese enthaltende anordnungen |
-
1997
- 1997-12-10 DE DE19754784A patent/DE19754784B4/de not_active Expired - Fee Related
-
1998
- 1998-11-17 KR KR1020007006284A patent/KR20010032940A/ko not_active Ceased
- 1998-11-17 WO PCT/EP1998/007361 patent/WO1999030352A2/fr not_active Application Discontinuation
- 1998-11-17 EP EP98966240A patent/EP1038320A2/fr not_active Ceased
- 1998-11-17 JP JP2000524811A patent/JP2001526412A/ja active Pending
- 1998-12-07 TW TW087120245A patent/TW432707B/zh active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6830814B1 (en) * | 1999-07-20 | 2004-12-14 | Robert Bosch Gmbh | Layer containing an electroconductive transparent material, method for producing same and uses thereof |
Also Published As
Publication number | Publication date |
---|---|
JP2001526412A (ja) | 2001-12-18 |
EP1038320A2 (fr) | 2000-09-27 |
KR20010032940A (ko) | 2001-04-25 |
DE19754784B4 (de) | 2004-02-12 |
DE19754784A1 (de) | 1999-06-24 |
TW432707B (en) | 2001-05-01 |
WO1999030352A3 (fr) | 1999-12-09 |
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