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WO2003008140A3 - Appareil de traitement de pièce à travailler - Google Patents

Appareil de traitement de pièce à travailler Download PDF

Info

Publication number
WO2003008140A3
WO2003008140A3 PCT/US2002/023297 US0223297W WO03008140A3 WO 2003008140 A3 WO2003008140 A3 WO 2003008140A3 US 0223297 W US0223297 W US 0223297W WO 03008140 A3 WO03008140 A3 WO 03008140A3
Authority
WO
WIPO (PCT)
Prior art keywords
workpiece
head
liquid
processing
rotors
Prior art date
Application number
PCT/US2002/023297
Other languages
English (en)
Other versions
WO2003008140A2 (fr
Inventor
Steven L Peace
Paul Z Wirth
Erik Lund
Original Assignee
Semitool Inc
Steven L Peace
Paul Z Wirth
Erik Lund
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/907,552 external-priority patent/US6492284B2/en
Priority claimed from US09/907,522 external-priority patent/US6680253B2/en
Application filed by Semitool Inc, Steven L Peace, Paul Z Wirth, Erik Lund filed Critical Semitool Inc
Priority to AU2002322587A priority Critical patent/AU2002322587A1/en
Publication of WO2003008140A2 publication Critical patent/WO2003008140A2/fr
Publication of WO2003008140A3 publication Critical patent/WO2003008140A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

L'invention concerne un système de traitement de pièces à travailler comprenant une base dotée d'une cuve ou d'un évidement destiné à retenir un liquide. Un réacteur ou une tête de traitement retient une pièce à travailler entre un rotor supérieur et un rotor inférieur. Un dispositif de levage abaisse la tête retenant la pièce à travailler en contact avec le liquide. La tête fait tourner la pièce à travailler pendant ou après le contact avec le liquide. Les rotors supérieurs et inférieur présentent des ouvertures latérales pour charger et décharger une pièce à travailler au niveau de la tête. Les rotors, qui se déplacent de manière axiale, permettent d'aligner les ouvertures latérales.
PCT/US2002/023297 2001-07-16 2002-07-10 Appareil de traitement de pièce à travailler WO2003008140A2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2002322587A AU2002322587A1 (en) 2001-07-16 2002-07-10 Apparatus for processing a workpiece

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US09/907,552 US6492284B2 (en) 1999-01-22 2001-07-16 Reactor for processing a workpiece using sonic energy
US09/907,522 US6680253B2 (en) 1999-01-22 2001-07-16 Apparatus for processing a workpiece
US09/907,522 2001-07-16
US09/907,552 2001-07-16

Publications (2)

Publication Number Publication Date
WO2003008140A2 WO2003008140A2 (fr) 2003-01-30
WO2003008140A3 true WO2003008140A3 (fr) 2003-11-06

Family

ID=27129490

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/023297 WO2003008140A2 (fr) 2001-07-16 2002-07-10 Appareil de traitement de pièce à travailler

Country Status (3)

Country Link
AU (1) AU2002322587A1 (fr)
TW (1) TW559571B (fr)
WO (1) WO2003008140A2 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8500968B2 (en) * 2010-08-13 2013-08-06 Applied Materials, Inc. Deplating contacts in an electrochemical plating apparatus

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3727620A (en) * 1970-03-18 1973-04-17 Fluoroware Of California Inc Rinsing and drying device
US4132567A (en) * 1977-10-13 1979-01-02 Fsi Corporation Apparatus for and method of cleaning and removing static charges from substrates
JPS59208831A (ja) * 1983-05-13 1984-11-27 Hitachi Tokyo Electronics Co Ltd 塗布装置
US4750505A (en) * 1985-04-26 1988-06-14 Dainippon Screen Mfg. Co., Ltd. Apparatus for processing wafers and the like
JPS63185029A (ja) * 1987-01-28 1988-07-30 Hitachi Ltd ウエハ処理装置
US4903717A (en) * 1987-11-09 1990-02-27 Sez Semiconductor-Equipment Zubehoer Fuer die Halbleiterfertigung Gesellschaft m.b.H Support for slice-shaped articles and device for etching silicon wafers with such a support
US5168886A (en) * 1988-05-25 1992-12-08 Semitool, Inc. Single wafer processor
US5222310A (en) * 1990-05-18 1993-06-29 Semitool, Inc. Single wafer processor with a frame
US5591262A (en) * 1994-03-24 1997-01-07 Tazmo Co., Ltd. Rotary chemical treater having stationary cleaning fluid nozzle

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3727620A (en) * 1970-03-18 1973-04-17 Fluoroware Of California Inc Rinsing and drying device
US4132567A (en) * 1977-10-13 1979-01-02 Fsi Corporation Apparatus for and method of cleaning and removing static charges from substrates
JPS59208831A (ja) * 1983-05-13 1984-11-27 Hitachi Tokyo Electronics Co Ltd 塗布装置
US4750505A (en) * 1985-04-26 1988-06-14 Dainippon Screen Mfg. Co., Ltd. Apparatus for processing wafers and the like
JPS63185029A (ja) * 1987-01-28 1988-07-30 Hitachi Ltd ウエハ処理装置
US4903717A (en) * 1987-11-09 1990-02-27 Sez Semiconductor-Equipment Zubehoer Fuer die Halbleiterfertigung Gesellschaft m.b.H Support for slice-shaped articles and device for etching silicon wafers with such a support
US5168886A (en) * 1988-05-25 1992-12-08 Semitool, Inc. Single wafer processor
US5222310A (en) * 1990-05-18 1993-06-29 Semitool, Inc. Single wafer processor with a frame
US5445172A (en) * 1990-05-18 1995-08-29 Semitool, Inc. Wafer holder with flexibly mounted gripping fingers
US5591262A (en) * 1994-03-24 1997-01-07 Tazmo Co., Ltd. Rotary chemical treater having stationary cleaning fluid nozzle

Also Published As

Publication number Publication date
TW559571B (en) 2003-11-01
WO2003008140A2 (fr) 2003-01-30
AU2002322587A1 (en) 2003-03-03

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