[go: up one dir, main page]

WO2003017365A3 - Thermal transfer devices using heat pipes - Google Patents

Thermal transfer devices using heat pipes Download PDF

Info

Publication number
WO2003017365A3
WO2003017365A3 PCT/US2001/025769 US0125769W WO03017365A3 WO 2003017365 A3 WO2003017365 A3 WO 2003017365A3 US 0125769 W US0125769 W US 0125769W WO 03017365 A3 WO03017365 A3 WO 03017365A3
Authority
WO
WIPO (PCT)
Prior art keywords
thermal transfer
housing
heat pipes
transfer devices
chamber
Prior art date
Application number
PCT/US2001/025769
Other languages
French (fr)
Other versions
WO2003017365B1 (en
WO2003017365A2 (en
Inventor
James Patrick Flint
Nancy F Dean
Original Assignee
Honeywell Int Inc
James Patrick Flint
Nancy F Dean
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell Int Inc, James Patrick Flint, Nancy F Dean filed Critical Honeywell Int Inc
Priority to PCT/US2001/025769 priority Critical patent/WO2003017365A2/en
Priority to AU2001285013A priority patent/AU2001285013A1/en
Priority to TW090125549A priority patent/TW502102B/en
Publication of WO2003017365A2 publication Critical patent/WO2003017365A2/en
Publication of WO2003017365A3 publication Critical patent/WO2003017365A3/en
Publication of WO2003017365B1 publication Critical patent/WO2003017365B1/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/06—Constructions of heat-exchange apparatus characterised by the selection of particular materials of plastics material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

The invention includes a thermal transfer device. The device includes a housing which defines at least part of chamber sealed from the atmosphere, and a working fluid contained within the chamber. The housing can be formed of a composition which includes a polymer base matrix having a thermally conductive filler material dispersed therein. The housing can have a thermal conductivity of at least about 10 W/mK. The device can include a wick comprising woven carbon fibers.
PCT/US2001/025769 2001-08-17 2001-08-17 Thermal transfer devices using heat pipes WO2003017365A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
PCT/US2001/025769 WO2003017365A2 (en) 2001-08-17 2001-08-17 Thermal transfer devices using heat pipes
AU2001285013A AU2001285013A1 (en) 2001-08-17 2001-08-17 Thermal transfer devices using heat pipes
TW090125549A TW502102B (en) 2001-08-17 2001-10-16 Thermal transfer devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2001/025769 WO2003017365A2 (en) 2001-08-17 2001-08-17 Thermal transfer devices using heat pipes

Publications (3)

Publication Number Publication Date
WO2003017365A2 WO2003017365A2 (en) 2003-02-27
WO2003017365A3 true WO2003017365A3 (en) 2003-09-04
WO2003017365B1 WO2003017365B1 (en) 2004-04-22

Family

ID=21742783

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/025769 WO2003017365A2 (en) 2001-08-17 2001-08-17 Thermal transfer devices using heat pipes

Country Status (3)

Country Link
AU (1) AU2001285013A1 (en)
TW (1) TW502102B (en)
WO (1) WO2003017365A2 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7027304B2 (en) * 2001-02-15 2006-04-11 Integral Technologies, Inc. Low cost thermal management device or heat sink manufactured from conductive loaded resin-based materials
US7591302B1 (en) 2003-07-23 2009-09-22 Cooligy Inc. Pump and fan control concepts in a cooling system
FR2860368B1 (en) * 2003-09-25 2007-07-27 Omwave Sas CENTRAL AUDIO, VIDEO, AND PC FUNCTION MANAGEMENT APPARATUS
US7913719B2 (en) 2006-01-30 2011-03-29 Cooligy Inc. Tape-wrapped multilayer tubing and methods for making the same
WO2007120530A2 (en) 2006-03-30 2007-10-25 Cooligy, Inc. Integrated liquid to air conduction module
TW200934352A (en) 2007-08-07 2009-08-01 Cooligy Inc Internal access mechanism for a server rack
US20090225514A1 (en) 2008-03-10 2009-09-10 Adrian Correa Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
US9297571B1 (en) 2008-03-10 2016-03-29 Liebert Corporation Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
TWI548852B (en) * 2012-01-19 2016-09-11 建準電機工業股份有限公司 Heat transfer device made of conductive plastic and manufacturing method thereof
CN103292629A (en) * 2012-03-01 2013-09-11 欧司朗股份有限公司 Heat pipe and manufacturing method thereof
EP2713132A1 (en) * 2012-09-26 2014-04-02 Alcatel Lucent A vapor-based heat transfer apparatus
CN106793670A (en) * 2015-11-24 2017-05-31 吴江市旭威电子科技有限公司 Heat radiator of electronic element
EP4114159A1 (en) * 2021-06-29 2023-01-04 Siemens Aktiengesellschaft Device for heat dissipation from microelectronic components arranged in an electronics enclosure

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1986004982A1 (en) * 1985-02-21 1986-08-28 Fujikura Ltd. Heat pipe
JPS63254755A (en) * 1987-04-10 1988-10-21 Mitsubishi Electric Corp Method for manufacturing a cooling device for an electronic element body
EP0295916A2 (en) * 1987-06-16 1988-12-21 Takemoto Yushi Kabushiki Kaisha Sizing agents for carbon fibers
US5076352A (en) * 1991-02-08 1991-12-31 Thermacore, Inc. High permeability heat pipe wick structure
WO1999026286A1 (en) * 1997-11-13 1999-05-27 Bp Amoco Corporation Heat pipe thermal management apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1986004982A1 (en) * 1985-02-21 1986-08-28 Fujikura Ltd. Heat pipe
JPS63254755A (en) * 1987-04-10 1988-10-21 Mitsubishi Electric Corp Method for manufacturing a cooling device for an electronic element body
EP0295916A2 (en) * 1987-06-16 1988-12-21 Takemoto Yushi Kabushiki Kaisha Sizing agents for carbon fibers
US5076352A (en) * 1991-02-08 1991-12-31 Thermacore, Inc. High permeability heat pipe wick structure
WO1999026286A1 (en) * 1997-11-13 1999-05-27 Bp Amoco Corporation Heat pipe thermal management apparatus

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 013, no. 068 (E - 716) 16 February 1989 (1989-02-16) *

Also Published As

Publication number Publication date
WO2003017365B1 (en) 2004-04-22
AU2001285013A1 (en) 2003-03-03
TW502102B (en) 2002-09-11
WO2003017365A2 (en) 2003-02-27

Similar Documents

Publication Publication Date Title
WO2003017365A3 (en) Thermal transfer devices using heat pipes
US6381845B2 (en) Method of manufacturing plate type heat pipe
WO2003051971A3 (en) Heat-conducting thermoplastic compounds and uses thereof
WO2004003713A3 (en) Cooling unit for cooling heat generating component
KR940006251A (en) Cooling device for electronic device
CA2586289A1 (en) Lamp thermal management system
WO2004003974A3 (en) Composite heat sink with metal base and graphite fins
TW200508845A (en) Heat pipe, cooling unit having the heat pipe, and electronic apparatus having the cooling unit
DE60123825D1 (en) HEAT-RELATED MATERIAL
EP1229571A4 (en) Hot plate
KR102020794B1 (en) Flame Retardant Cable Tray for Fire Spreading Prevention
WO2008105428A1 (en) Light-emitting device
CA2482483A1 (en) Use of graphite foam materials in pumped liquid, two phase cooling, cold plates
PT1139713E (en) DEVICE FOR SOIL DISINFECTION
DE60014940D1 (en) DEVICE FOR HEAT EXCHANGE BETWEEN TWO WALLS
WO2008072031A3 (en) Apparatus for cooling
TW201006367A (en) Heat-dissipating device and heat-dissipating method
MY125953A (en) Silent heat exchanger and fan assembly
CA2469648A1 (en) Method and plate apparatus for dew point evaporative cooler
TW200633171A (en) Nanotube-based fluid interface material and approach
DE60325734D1 (en) SUPPORTED DEVICE
US6201221B1 (en) Method and apparatus for heat regulating electronics products
US20040130871A1 (en) Cooling device for an electrical or electronic unit
EP0942640A3 (en) Advanced liquid cooling apparatus
EP1293597A3 (en) Flat heating element for the direct heating of a medium

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BY BZ CA CH CN CO CR CU CZ DE DM DZ EC EE ES FI GB GD GE GH HR HU ID IL IN IS JP KE KG KP KR LC LK LR LS LT LU LV MA MD MG MN MW MX MZ NO NZ PH PL PT RO SD SE SG SI SK SL TJ TM TR TT TZ UG US UZ VN YU ZA

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ PH PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG US UZ VN YU ZA ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW MZ SD SL SZ UG ZW AM AZ BY KG KZ MD TJ TM AT BE CH CY DE DK ES FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GQ GW MR NE SN TD TG US

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
B Later publication of amended claims

Effective date: 20030423

122 Ep: pct application non-entry in european phase
NENP Non-entry into the national phase

Ref country code: JP