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WO2003017365A3 - Dispositifs de transfert thermique - Google Patents

Dispositifs de transfert thermique Download PDF

Info

Publication number
WO2003017365A3
WO2003017365A3 PCT/US2001/025769 US0125769W WO03017365A3 WO 2003017365 A3 WO2003017365 A3 WO 2003017365A3 US 0125769 W US0125769 W US 0125769W WO 03017365 A3 WO03017365 A3 WO 03017365A3
Authority
WO
WIPO (PCT)
Prior art keywords
thermal transfer
housing
heat pipes
transfer devices
chamber
Prior art date
Application number
PCT/US2001/025769
Other languages
English (en)
Other versions
WO2003017365B1 (fr
WO2003017365A2 (fr
Inventor
James Patrick Flint
Nancy F Dean
Original Assignee
Honeywell Int Inc
James Patrick Flint
Nancy F Dean
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell Int Inc, James Patrick Flint, Nancy F Dean filed Critical Honeywell Int Inc
Priority to PCT/US2001/025769 priority Critical patent/WO2003017365A2/fr
Priority to AU2001285013A priority patent/AU2001285013A1/en
Priority to TW090125549A priority patent/TW502102B/zh
Publication of WO2003017365A2 publication Critical patent/WO2003017365A2/fr
Publication of WO2003017365A3 publication Critical patent/WO2003017365A3/fr
Publication of WO2003017365B1 publication Critical patent/WO2003017365B1/fr

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/06—Constructions of heat-exchange apparatus characterised by the selection of particular materials of plastics material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

L'invention porte sur un dispositif de transfert thermique comportant un boîtier comportant au moins une partie de chambre isolée de l'atmosphère, et remplie d'un fluide de travail. Le boîtier peut être fait d'une composition comprenant une matrice à base de polymère dans laquelle est dispersée une charge thermoconductrice qui confère au boîtier une conductivité thermique d'au moins environ 10 W/mK. Le dispositif peur comporter une mèche de fibres tissées de carbone.
PCT/US2001/025769 2001-08-17 2001-08-17 Dispositifs de transfert thermique WO2003017365A2 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
PCT/US2001/025769 WO2003017365A2 (fr) 2001-08-17 2001-08-17 Dispositifs de transfert thermique
AU2001285013A AU2001285013A1 (en) 2001-08-17 2001-08-17 Thermal transfer devices using heat pipes
TW090125549A TW502102B (en) 2001-08-17 2001-10-16 Thermal transfer devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2001/025769 WO2003017365A2 (fr) 2001-08-17 2001-08-17 Dispositifs de transfert thermique

Publications (3)

Publication Number Publication Date
WO2003017365A2 WO2003017365A2 (fr) 2003-02-27
WO2003017365A3 true WO2003017365A3 (fr) 2003-09-04
WO2003017365B1 WO2003017365B1 (fr) 2004-04-22

Family

ID=21742783

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/025769 WO2003017365A2 (fr) 2001-08-17 2001-08-17 Dispositifs de transfert thermique

Country Status (3)

Country Link
AU (1) AU2001285013A1 (fr)
TW (1) TW502102B (fr)
WO (1) WO2003017365A2 (fr)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7027304B2 (en) * 2001-02-15 2006-04-11 Integral Technologies, Inc. Low cost thermal management device or heat sink manufactured from conductive loaded resin-based materials
US7591302B1 (en) 2003-07-23 2009-09-22 Cooligy Inc. Pump and fan control concepts in a cooling system
FR2860368B1 (fr) * 2003-09-25 2007-07-27 Omwave Sas Appareil central de gestion de fonctions audio, video, et pc
US7913719B2 (en) 2006-01-30 2011-03-29 Cooligy Inc. Tape-wrapped multilayer tubing and methods for making the same
WO2007120530A2 (fr) 2006-03-30 2007-10-25 Cooligy, Inc. Liquide integre dans un module d'amenee d'air
TW200934352A (en) 2007-08-07 2009-08-01 Cooligy Inc Internal access mechanism for a server rack
US20090225514A1 (en) 2008-03-10 2009-09-10 Adrian Correa Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
US9297571B1 (en) 2008-03-10 2016-03-29 Liebert Corporation Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
TWI548852B (zh) * 2012-01-19 2016-09-11 建準電機工業股份有限公司 導熱塑膠所製成的散熱裝置與其製造方法
CN103292629A (zh) * 2012-03-01 2013-09-11 欧司朗股份有限公司 热管及其制造方法
EP2713132A1 (fr) * 2012-09-26 2014-04-02 Alcatel Lucent Appareil de transfert de chaleur par évaporation
CN106793670A (zh) * 2015-11-24 2017-05-31 吴江市旭威电子科技有限公司 电子元件散热装置
EP4114159A1 (fr) * 2021-06-29 2023-01-04 Siemens Aktiengesellschaft Dispositif de dissipation thermique des composants microélectroniques disposés dans un boîtier électronique

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1986004982A1 (fr) * 1985-02-21 1986-08-28 Fujikura Ltd. Conduite thermique
JPS63254755A (ja) * 1987-04-10 1988-10-21 Mitsubishi Electric Corp 電子素子体の冷却装置の製造方法
EP0295916A2 (fr) * 1987-06-16 1988-12-21 Takemoto Yushi Kabushiki Kaisha Agent d'apprêtage pour fibres de carbone
US5076352A (en) * 1991-02-08 1991-12-31 Thermacore, Inc. High permeability heat pipe wick structure
WO1999026286A1 (fr) * 1997-11-13 1999-05-27 Bp Amoco Corporation Appareil de gestion thermique a caloduc

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1986004982A1 (fr) * 1985-02-21 1986-08-28 Fujikura Ltd. Conduite thermique
JPS63254755A (ja) * 1987-04-10 1988-10-21 Mitsubishi Electric Corp 電子素子体の冷却装置の製造方法
EP0295916A2 (fr) * 1987-06-16 1988-12-21 Takemoto Yushi Kabushiki Kaisha Agent d'apprêtage pour fibres de carbone
US5076352A (en) * 1991-02-08 1991-12-31 Thermacore, Inc. High permeability heat pipe wick structure
WO1999026286A1 (fr) * 1997-11-13 1999-05-27 Bp Amoco Corporation Appareil de gestion thermique a caloduc

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 013, no. 068 (E - 716) 16 February 1989 (1989-02-16) *

Also Published As

Publication number Publication date
WO2003017365B1 (fr) 2004-04-22
AU2001285013A1 (en) 2003-03-03
TW502102B (en) 2002-09-11
WO2003017365A2 (fr) 2003-02-27

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