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WO2003030599A1 - Feuille de cuivre avec support et carte de circuits imprimes comprenant cette feuille de cuivre - Google Patents

Feuille de cuivre avec support et carte de circuits imprimes comprenant cette feuille de cuivre Download PDF

Info

Publication number
WO2003030599A1
WO2003030599A1 PCT/JP2002/008358 JP0208358W WO03030599A1 WO 2003030599 A1 WO2003030599 A1 WO 2003030599A1 JP 0208358 W JP0208358 W JP 0208358W WO 03030599 A1 WO03030599 A1 WO 03030599A1
Authority
WO
WIPO (PCT)
Prior art keywords
copper foil
carrier
foil
aluminum
resin
Prior art date
Application number
PCT/JP2002/008358
Other languages
English (en)
Japanese (ja)
Inventor
Atsushi Okuno
Takashi Natsume
Original Assignee
Japan Rec Company, Limited
Nikko Materials Company, Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Rec Company, Limited, Nikko Materials Company, Limited filed Critical Japan Rec Company, Limited
Publication of WO2003030599A1 publication Critical patent/WO2003030599A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin

Definitions

  • a resin layer is provided on the surface of the copper foil to improve the handling property of the copper foil and to prevent the contaminants such as the resin powder from adhering to the surface of the copper foil.
  • the present invention relates to a copper foil with a carrier provided with a resin layer effective for preventing nicks and a substrate using the copper foil.
  • a build-up wire board has a printed wiring board on which a circuit network is formed as an inner layer core material, a copper foil for an outer layer circuit in the form of a collar with resin immersion base or a copper foil with resin After stacking, they are manufactured by forming interlayer connections and networks.
  • the one with an aluminum carrier is generally referred to as a C A (Copper Al umi num) foil.
  • CA foil is laminated with a resin-impregnated base material in the next step, and subjected to heating and pressing processes using a breathing apparatus to form a copper-clad laminate used for printed circuit boards. It is a thing.
  • the aluminum carrier is peeled off to serve as a support and a contaminant protection layer.
  • the present invention has been made in view of the above problems, and the object of the present invention is to prepare a resin layer by screen printing on the copper surface of a copper foil with a carrier cut into a predetermined size. There is no need to cut the resin layer portion, and by suppressing the generation of resin powder, it is possible to prevent the contamination of the process and the product, improve the handling of the copper foil, and further prevent scratches and dents due to foreign matter,
  • the present invention is intended to obtain a copper foil with a carrier provided with a resin layer capable of effectively preventing scratches, wrinkles, breakage and the like during cutting, packing and transportation, and a printed board using the copper foil. From the above, the present invention
  • a copper foil with a carrier comprising a resin layer having an area smaller than the area of the copper foil, leaving a peripheral edge of the copper foil, and a copper foil with a carrier and a printed substrate using the copper foil
  • a copper foil with a carrier according to the above 1 characterized in that the resin layer is an insulating resin layer and a printed circuit board using the copper foil
  • a coated copper foil according to the above 1 or 2 characterized in that a resin layer is applied by printing, and a printed circuit board using the copper foil
  • the copper foil with carrier according to any one of the above 1 to 3 characterized in that the carrier is a metal plate or metal foil or a resin film and a printed circuit board using the copper foil
  • a resin film such as aluminum, copper, copper alloy, stainless steel plate or foil, or PET can be used.
  • a plate or foil of aluminum, copper, a copper alloy, or stainless steel, which has been previously coated with a thermosetting resin and heat-cured may be used.
  • an aluminum foil or sheet is a particularly preferable material as a carrier
  • a normal aluminum rolled foil can be used, and in particular, the thickness (thinness) of aluminum used.
  • the preferred aluminum material for such a carrier is as follows. The soft type has a weak "strain" and needs to be thick, so it is preferable to use the hard type. However, transfer of rolling oil and aluminum powder remaining on the aluminum foil to the copper foil may occur. In order to prevent this, the thermosetting resin can be prevented by coating in advance on an aluminum foil.
  • thermosetting resins such as epoxy resin, polyester resin, acrylic resin and urethane resin can be used.
  • a thermosetting resin has good adhesion to aluminum foil, and after heat curing, it has the property that it does not change its properties even by heat and pressure with a press and laminate, and does not transfer to the other material. .
  • a thinner aluminum foil can be used as a carrier to improve the "strain" of the aluminum foil.
  • epoxy resins are suitable.
  • the thickness of the thermosetting resin coating is not particularly limited, but thin is preferable in terms of cost.
  • thermosetting resin such as epoxy resin, acrylic resin, urethane resin and the like.
  • the covering of aluminum can prevent foreign matter from directly mixing in or adhering to the surface of the copper foil.
  • the aluminum foil is bonded to the copper foil, if the copper foil is a rectangular sheet, it is applied to at least one side edge but may be applied to both side edges or all four side edges of the rectangular sheet.
  • the aluminum foil and the copper foil can be laminated continuously at both side edges of the sleeve. Peeling is easier as there are fewer points to be joined, but it is necessary to increase the joining points and area in order to achieve effective joining.
  • the form of bonding can be appropriately selected according to the purpose of use.
  • the copper foil with carrier such as aluminum is extremely good in handling property, the occurrence of wrinkles and breakage can be effectively prevented, and the covering of aluminum or the like can prevent the foreign matter from directly adhering to the surface of the copper foil.
  • carriers such as aluminum are peeled off, and a circuit network is formed by a process such as etching.
  • copper-clad laminates are protected by carriers such as aluminum until just before circuit formation. It is effective in preventing scratches and dents caused by foreign substances, and also effectively prevents scratches, wrinkles and breakage during cutting, packing and transportation.
  • the copper foil surface to be bonded to aluminum foil etc. should be provided on the shiny side (S 1) side, but it may be provided on other side, ie the roughened side (M side). Also, it may be applied to the glossy surface (S surface) which has been subjected to surface treatment such as plating. It can select suitably according to a use.
  • a resin layer having an area smaller than that of the copper foil is formed on the surface opposite to the bonding surface with the carrier, leaving the peripheral edge of the copper foil.
  • the resin layer on the surface of the copper foil with carrier can be formed by screen printing on the copper surface of the copper foil with carrier cut into a predetermined size.
  • a resin-coated copper foil is applied to a copper foil with a carrier and the resin layer is cut simultaneously with the copper foil with a carrier, there is a risk that resin fragments may adhere to the copper foil. Such fragments are undesirable as contamination in the next step. Therefore, a resin layer having an area smaller than that of the copper foil is formed by screen printing on the copper surface of the copper foil with a caliper cut into a predetermined size as described above. The width of the peripheral edge of the copper foil can be arbitrarily set according to the inner layer core material size. Next, the copper foil with carrier on which the resin layer is formed and the inner layer core material on which the circuit is formed are laminated to form a copper-clad laminate.
  • heating and pressure are applied, for example, at a press pressure of about 10 to 3 kgz cm 2 and a press temperature of about 170 ° C. for 60 to 100 minutes. Stack.
  • the copper foil with carrier on which the resin layer is formed and the inner layer core material can be sufficiently joined.
  • the copper foil with carrier has extremely good handleability, and no wrinkles or breakages occur. W
  • the handling property is significantly improved. Furthermore, there is an effect that no damage occurs during normal cutting, packing, and transportation, as well as the above-described pressing process, and foreign matter is not mixed in, wrinkles, and breakage occur. As a result, cutting and shorting of printed circuit boards can be reduced, defects in electronic devices can be suppressed, and product yield can be improved.
  • the carrier such as aluminum can be peeled off and removed.
  • Aluminum foil or sheet for carriers can be recycled.
  • this aluminum carrier copper foil is cut to a length of 500 mm, and then the insulating resin is applied by screen printing to a square of 400 mm on a side and dried. An insulating layer of zm was formed.
  • the edge (peripheral edge) of the copper foil without resin is 5 mm.
  • the press pressure is 20 kgz cm 2 .
  • the aluminum foil was peeled for 1 hour at a pressing temperature of 170 ° C., and the copper foil surface from which the aluminum foil was peeled was observed with an optical microscope.
  • the handling property was good, no occurrence of wrinkles, and no deposit residue after pressing was observed at all.
  • Example 2 By the same process as in Example 1, a copper foil with an aluminum carrier having a width of 500 mm was obtained. Next, an insulating resin was applied continuously to a width of 400 mm on the copper foil with an aluminum carrier and dried to form an insulating layer with a coating thickness of 40 / im.
  • Example 2 After cutting this aluminum carrier attached copper foil to a length of 500 mm, the conditions similar to those of Example 1 are used to see how foreign matter adheres to the copper foil after the copper foil lamination step. After laminating the aluminum and peeling off the aluminum, the copper foil surface was observed with an optical microscope.
  • Insulating resin was continuously applied and dried to a width of 40 0 mm on a 9 m thick electrolytic copper foil roll (width 50 0 mm) to form an insulating layer with a coating thickness of 40 / im. .
  • a copper foil with an aluminum carrier having a width of 500 mm was obtained.
  • An insulating resin is applied continuously to a width of 400 mm on a 9 m thick electrolytic copper foil (width 500 mm) and an insulating layer with a thickness of 40 m is applied. It formed.
  • lamination was performed under the same conditions as in Example 1. The copper foil surface was observed with an optical microscope. As a result, it was confirmed that some wrinkles occurred.
  • a part of the resin layer was peeled off, and a deposit residue on the copper foil was recognized.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

L'invention concerne une feuille de cuivre avec un support, caractérisée en ce qu'elle comprend une couche de résine possédant une surface inférieure à celle de la feuille de cuivre de manière que la périphérie de la feuille de cuivre soit dépourvue de la couche de résine. L'invention concerne également une carte de circuits imprimés utilisant une telle feuille de cuivre. La couche de résine possédant une surface inférieure à celle de la feuille de cuivre est formée sur la feuille de cuivre par sérigraphie. La manutention de cette feuille de cuivre est améliorée. Des contaminants tels que de la poudre de résine n'adhèrent pas à la feuille de cuivre durant le découpage. En outre, les griffures de matériaux étrangers, les enfoncements, les dommages, les marques, et les ruptures durant le découpage, l'emballage et le transport sont efficacement évités.
PCT/JP2002/008358 2001-09-26 2002-08-20 Feuille de cuivre avec support et carte de circuits imprimes comprenant cette feuille de cuivre WO2003030599A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001292768A JP2003101189A (ja) 2001-09-26 2001-09-26 キャリア付銅箔及び該銅箔を使用したプリント基板
JP2001-292768 2001-09-26

Publications (1)

Publication Number Publication Date
WO2003030599A1 true WO2003030599A1 (fr) 2003-04-10

Family

ID=19114669

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/008358 WO2003030599A1 (fr) 2001-09-26 2002-08-20 Feuille de cuivre avec support et carte de circuits imprimes comprenant cette feuille de cuivre

Country Status (3)

Country Link
JP (1) JP2003101189A (fr)
TW (1) TW558915B (fr)
WO (1) WO2003030599A1 (fr)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998051485A1 (fr) * 1997-05-14 1998-11-19 Alliedsignal, Inc. Couches conductrices ultra minces pour cartes imprimees
EP0960725A2 (fr) * 1998-05-29 1999-12-01 Mitsui Mining & Smelting Co., Ltd. Feuille composite enduite d'une résine, sa production et son utilisation

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998051485A1 (fr) * 1997-05-14 1998-11-19 Alliedsignal, Inc. Couches conductrices ultra minces pour cartes imprimees
EP0960725A2 (fr) * 1998-05-29 1999-12-01 Mitsui Mining & Smelting Co., Ltd. Feuille composite enduite d'une résine, sa production et son utilisation

Also Published As

Publication number Publication date
JP2003101189A (ja) 2003-04-04
TW558915B (en) 2003-10-21

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