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WO2003038158A3 - Electroplating device and electroplating system for coating already conductive structures - Google Patents

Electroplating device and electroplating system for coating already conductive structures Download PDF

Info

Publication number
WO2003038158A3
WO2003038158A3 PCT/DE2002/003916 DE0203916W WO03038158A3 WO 2003038158 A3 WO2003038158 A3 WO 2003038158A3 DE 0203916 W DE0203916 W DE 0203916W WO 03038158 A3 WO03038158 A3 WO 03038158A3
Authority
WO
WIPO (PCT)
Prior art keywords
electroplating
conductive structures
coating already
already conductive
electroplating device
Prior art date
Application number
PCT/DE2002/003916
Other languages
German (de)
French (fr)
Other versions
WO2003038158A2 (en
Inventor
Andreas Mueller-Hipper
Ewald Simmerlein-Erlbacher
Andreas Karl
Original Assignee
Infineon Technologies Ag
Andreas Mueller-Hipper
Ewald Simmerlein-Erlbacher
Andreas Karl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE10234705A external-priority patent/DE10234705B4/en
Application filed by Infineon Technologies Ag, Andreas Mueller-Hipper, Ewald Simmerlein-Erlbacher, Andreas Karl filed Critical Infineon Technologies Ag
Publication of WO2003038158A2 publication Critical patent/WO2003038158A2/en
Priority to US10/916,308 priority Critical patent/US20050061661A1/en
Publication of WO2003038158A3 publication Critical patent/WO2003038158A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0657—Conducting rolls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrolytic Production Of Metals (AREA)

Abstract

The invention relates to an electroplating device (10) for electrodepositing an electroconductive layer onto a substrate (12). Said device comprises an electrolyte bath (14) in which an anode device (30) and at least one contacting unit (16) are disposed. Every contacting unit (16) has a plurality of electroconductive areas (20) of which at least one is connected to the cathode or the anode.
PCT/DE2002/003916 2001-10-25 2002-10-16 Electroplating device and electroplating system for coating already conductive structures WO2003038158A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US10/916,308 US20050061661A1 (en) 2001-10-25 2004-08-11 Electrodeposition device and electrodeposition system for coating structures which have already been made conductive

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE10153056.0 2001-10-25
DE10153056 2001-10-25
DE10234705.0 2002-07-30
DE10234705A DE10234705B4 (en) 2001-10-25 2002-07-30 Electroplating and electroplating system for coating already conductive structures

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US10/916,308 Continuation US20050061661A1 (en) 2001-10-25 2004-08-11 Electrodeposition device and electrodeposition system for coating structures which have already been made conductive

Publications (2)

Publication Number Publication Date
WO2003038158A2 WO2003038158A2 (en) 2003-05-08
WO2003038158A3 true WO2003038158A3 (en) 2004-09-16

Family

ID=26010464

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2002/003916 WO2003038158A2 (en) 2001-10-25 2002-10-16 Electroplating device and electroplating system for coating already conductive structures

Country Status (3)

Country Link
US (1) US20050061661A1 (en)
TW (1) TW574437B (en)
WO (1) WO2003038158A2 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10323660A1 (en) * 2003-05-15 2004-12-02 Gebr. Schmid Gmbh & Co. Device for treating objects, in particular electroplating for printed circuit boards
DE10342512B3 (en) * 2003-09-12 2004-10-28 Atotech Deutschland Gmbh Device for the electrolytic treatment of electrically conducting structures on strip-like material used in chip cards, price signs or ID cards comprises an arrangement consisting of contact electrodes and an electrolysis region
NL1025446C2 (en) * 2004-02-09 2005-08-10 Besi Plating B V Method and device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric support as well as dielectric support.
DE102004029894B3 (en) * 2004-06-17 2005-12-22 Atotech Deutschland Gmbh Apparatus and method for the electrolytic treatment of electrically mutually insulated, electrically conductive structures on surfaces of flat material to be treated
WO2006098336A1 (en) 2005-03-15 2006-09-21 Fujifilm Corporation Plating method, light-transmitting conductive film and electromagnetic shielding film
KR20080110658A (en) * 2006-04-18 2008-12-18 바스프 에스이 Electroplating Apparatus and Method
BRPI0710241A2 (en) * 2006-04-18 2011-08-09 Basf Se device and method for electrolytically coating at least one substrate, and, device use
EP1865094B1 (en) * 2006-06-08 2009-10-21 BCT Coating Technologies AG Apparatus for electrochemical deposition on surfaces and electrochemical system
KR101414105B1 (en) * 2007-03-28 2014-07-01 도레이 카부시키가이샤 Web pressure welding, pressure welding method, power supply method, power supply device, continuous electrolyte plating device, and method for manufacturing plate film-equipped web
DE102008004592A1 (en) * 2008-01-16 2009-07-23 Danziger, Manfred, Dr. Belt electroplating plant for the electrochemical reinforcement of an electrically conductive outer layer of a strip
US9725817B2 (en) * 2011-12-30 2017-08-08 Ashworth Bros., Inc. System and method for electropolishing or electroplating conveyor belts
EP4010517A1 (en) * 2019-08-05 2022-06-15 SMS Group GmbH Method and system for electroytically coating a steel strip by means of pulse technology
CN112663119B (en) * 2020-12-04 2022-05-31 重庆金美新材料科技有限公司 Device and method for preventing conductive roller from being plated with copper
CN114790565B (en) * 2022-05-26 2024-06-18 江苏启威星装备科技有限公司 Conductive device and horizontal electroplating equipment

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3909387A (en) * 1971-04-01 1975-09-30 Sigmund Bereday Apparatus for producing polymer-coated aluminum products
DE3325316A1 (en) * 1983-07-13 1985-01-31 Maschinenfabrik Kaspar Walter GmbH & Co KG, 8000 München Metal-coating process and device, in particular for copper-plating cylindrical bodies
EP0677599A1 (en) * 1994-04-15 1995-10-18 Gebr. Schmid GmbH & Co. Apparatus for treatment of articles particularly for electroplating of circuit boards
WO2001061079A1 (en) * 2000-02-18 2001-08-23 Enthone Inc. Process for electroplating a work piece coated with an electrically conducting polymer

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5135636A (en) * 1990-10-12 1992-08-04 Microelectronics And Computer Technology Corporation Electroplating method
DE4229403C2 (en) * 1992-09-03 1995-04-13 Hoellmueller Maschbau H Device for electroplating thin plastic films provided with a conductive coating on one or both sides
DE4344387C2 (en) * 1993-12-24 1996-09-05 Atotech Deutschland Gmbh Process for the electrolytic deposition of copper and arrangement for carrying out the process
US6471848B1 (en) * 1998-02-17 2002-10-29 Canon Kabushiki Kaisha Electrodeposition method of forming an oxide film
US6294060B1 (en) * 1999-10-21 2001-09-25 Ati Properties, Inc. Conveyorized electroplating device
DE10013339C1 (en) * 2000-03-17 2001-06-13 Atotech Deutschland Gmbh Process for regulating the concentration of metal ions in an electrolyte liquid comprises feeding part of the liquid through an auxiliary cell consisting of an insoluble auxiliary anode and an auxiliary cathode

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3909387A (en) * 1971-04-01 1975-09-30 Sigmund Bereday Apparatus for producing polymer-coated aluminum products
DE3325316A1 (en) * 1983-07-13 1985-01-31 Maschinenfabrik Kaspar Walter GmbH & Co KG, 8000 München Metal-coating process and device, in particular for copper-plating cylindrical bodies
EP0677599A1 (en) * 1994-04-15 1995-10-18 Gebr. Schmid GmbH & Co. Apparatus for treatment of articles particularly for electroplating of circuit boards
WO2001061079A1 (en) * 2000-02-18 2001-08-23 Enthone Inc. Process for electroplating a work piece coated with an electrically conducting polymer

Also Published As

Publication number Publication date
WO2003038158A2 (en) 2003-05-08
TW574437B (en) 2004-02-01
US20050061661A1 (en) 2005-03-24

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