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WO2006000549A8 - Machine d'usinage au laser pour percer des trous dans une piece, avec un dispositif de deviation optique et une unite de deflexion - Google Patents

Machine d'usinage au laser pour percer des trous dans une piece, avec un dispositif de deviation optique et une unite de deflexion

Info

Publication number
WO2006000549A8
WO2006000549A8 PCT/EP2005/052866 EP2005052866W WO2006000549A8 WO 2006000549 A8 WO2006000549 A8 WO 2006000549A8 EP 2005052866 W EP2005052866 W EP 2005052866W WO 2006000549 A8 WO2006000549 A8 WO 2006000549A8
Authority
WO
WIPO (PCT)
Prior art keywords
laser beam
laser
workpiece
diverting unit
rotation axis
Prior art date
Application number
PCT/EP2005/052866
Other languages
German (de)
English (en)
Other versions
WO2006000549A1 (fr
Inventor
Hans Juergen Mayer
Uwe Metka
Original Assignee
Hitachi Via Mechanics Ltd
Hans Juergen Mayer
Uwe Metka
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Via Mechanics Ltd, Hans Juergen Mayer, Uwe Metka filed Critical Hitachi Via Mechanics Ltd
Publication of WO2006000549A1 publication Critical patent/WO2006000549A1/fr
Publication of WO2006000549A8 publication Critical patent/WO2006000549A8/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

L'invention concerne une machine d'usinage au laser (100) utilisée pour percer des trous dans une pièce, notamment dans un substrat de circuit électronique (150), qui comprend une source laser (110), aménagée pour émettre un faisceau laser (111), une unité de déflexion (130) pour dévier le faisceau laser (121) en position de perçage (154) déterminée sur le substrat du circuit (150) et un système optique de reproduction (140) pour focaliser le faisceau laser (141) sur le substrat de circuit (150). La machine d'usinage au laser comprend en outre un dispositif de déflexion (120) pour dévier périodiquement en deux dimensions un faisceau laser, qui présente un élément optique et un mécanisme d'entraînement en rotation. L'élément optique est monté de manière à tourner autour d'un axe de rotation et comporte une interface plane dont la verticale superficielle est orientée en angle par rapport à l'axe de rotation et se présente de manière à dévier le faisceau laser hors de son sens initial, en cas d'incidence dudit faisceau laser. Le mécanisme de rotation est aménagé de sorte à faire tourner l'élément optique autour de l'axe de rotation.
PCT/EP2005/052866 2004-06-29 2005-06-21 Machine d'usinage au laser pour percer des trous dans une piece, avec un dispositif de deviation optique et une unite de deflexion WO2006000549A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102004031405 2004-06-29
DE102004031405.5 2004-06-29

Publications (2)

Publication Number Publication Date
WO2006000549A1 WO2006000549A1 (fr) 2006-01-05
WO2006000549A8 true WO2006000549A8 (fr) 2006-03-09

Family

ID=35159905

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2005/052866 WO2006000549A1 (fr) 2004-06-29 2005-06-21 Machine d'usinage au laser pour percer des trous dans une piece, avec un dispositif de deviation optique et une unite de deflexion

Country Status (1)

Country Link
WO (1) WO2006000549A1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006053268B4 (de) * 2006-11-06 2023-07-06 Universität Stuttgart Vorrichtung zur Erzeugung eines Laserstrahlungsfeldes mit einem um eine Achse rotierenden Intensitätsprofil
CN101856772A (zh) * 2010-05-27 2010-10-13 张立国 一种光束旋转振镜扫描聚焦加工系统
CN102773605B (zh) * 2012-08-11 2016-02-03 张立国 一种旋转光束模块组激光运动轨迹控制系统
CN203265914U (zh) * 2012-10-12 2013-11-06 张立国 一种大幅面微孔高速钻孔系统
CN103706946B (zh) * 2013-12-03 2016-09-07 张立国 一种激光分束振镜扫描加工装置
CN103658975B (zh) * 2013-12-03 2017-02-15 张立国 一种激光分束加工装置
CN110977159A (zh) * 2019-09-17 2020-04-10 苏州肯美特设备集成有限公司 一种形成环形光斑的激光光路组件

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4725709A (en) * 1984-09-25 1988-02-16 Siemens Aktiengesellschaft Apparatus having a sweep arrangement for non-contacting modification of an article
JP2588281Y2 (ja) * 1992-11-25 1999-01-06 株式会社小松製作所 レーザマーキング装置
US5593606A (en) * 1994-07-18 1997-01-14 Electro Scientific Industries, Inc. Ultraviolet laser system and method for forming vias in multi-layered targets
US6804269B2 (en) * 2001-06-19 2004-10-12 Hitachi Via Mechanics, Ltd. Laser beam delivery system with trepanning module
DE10317363B3 (de) * 2003-04-15 2004-08-26 Siemens Ag Verfahren und Vorrichtung zum Bohren von Löchern in einem elektrischen Schaltungssubstrat

Also Published As

Publication number Publication date
WO2006000549A1 (fr) 2006-01-05

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