[go: up one dir, main page]

WO2006000549A1 - Machine d'usinage au laser pour percer des trous dans une piece, avec un dispositif de deviation optique et une unite de deflexion - Google Patents

Machine d'usinage au laser pour percer des trous dans une piece, avec un dispositif de deviation optique et une unite de deflexion Download PDF

Info

Publication number
WO2006000549A1
WO2006000549A1 PCT/EP2005/052866 EP2005052866W WO2006000549A1 WO 2006000549 A1 WO2006000549 A1 WO 2006000549A1 EP 2005052866 W EP2005052866 W EP 2005052866W WO 2006000549 A1 WO2006000549 A1 WO 2006000549A1
Authority
WO
WIPO (PCT)
Prior art keywords
laser beam
optical element
deflection
rotation
laser
Prior art date
Application number
PCT/EP2005/052866
Other languages
German (de)
English (en)
Other versions
WO2006000549A8 (fr
Inventor
Hans Jürgen Mayer
Uwe Metka
Original Assignee
Hitachi Via Mechanics, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Via Mechanics, Ltd. filed Critical Hitachi Via Mechanics, Ltd.
Publication of WO2006000549A1 publication Critical patent/WO2006000549A1/fr
Publication of WO2006000549A8 publication Critical patent/WO2006000549A8/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation

Definitions

  • the invention relates to a laser processing machine for drilling holes in a workpiece, in particular in electronic circuit substrates, wherein a laser beam generated by a Laserlicht ⁇ source via a deflection and a 10 imaging optics on the respective drilling position of the Workpiece is steered.
  • deflecting units two rotatably mounted mirrors are usually used, which are each pivotable about an axis by means of a so-called galvo drive.
  • the two axes are usually arranged perpendicular to each other.
  • the laser beam can be arbitrarily aligned within a Wegdimensiona ⁇ len edit field.
  • the use of conventional deflection units for traversing a circular movement has the disadvantage that as a result of the inertia of the mechanical system of mirror and galvo motor, the resulting path movement has significant deviations from the ideal circular path, depending on the speed and the radius of the circular motion.
  • the object of the present invention is to provide a laser processing machine for drilling holes in a workpiece, which on the one hand enables a high quality of drilled holes and on the other hand a high drilling performance.
  • the object is achieved by a laser processing device having the features of independent claim 1.
  • the laser processing machine for drilling holes in a workpiece, in particular in an electronic circuit substrate, comprises a laser source configured to emit a laser beam, a deflection unit for directing the laser beam to a particular drilling position (154) on the circuit substrate and imaging optics to Focusing the laser beam on the circuit substrate.
  • the laser processing machine further comprises an optical Aus ⁇ steering device arranged between the laser source and the deflection unit for the periodic two-dimensional deflection of a laser beam having an optical element and a rotary drive.
  • the optical element is rotatably mounted about a rotation axis and has a plane boundary surface whose surface normal is oriented at an angle to the axis of rotation and which is such that it deflects it from its original direction when the laser beam hits it.
  • the rotary drive is set up for continuously rotating the optical element about the axis of rotation.
  • the invention is based on the finding that a circular movement within a working surface can be achieved not only by the combination of two pivoting movements of deflecting mirrors, but that a continuous rotational movement of an optical element can be generated, which is the direction of an input laser beam, for example by Reflection or by refraction in a Aus ⁇ gangslaserstrahl directs. Its variable beam path thus runs on a cone sheath, which is arranged symmetrically about a zero position.
  • the invention has the advantage that only a simple rotational movement is required for beam deflection, so that, when an imbalance of the optical element is avoided, a significantly increased circular velocity of the deflected laser beam is possible in comparison to conventional deflection units.
  • the laser processing machine wherein the imaging optics is an F-theta optic, ensures a direct relationship between the resulting deflection angle and the distance between a respective processing position and the so-called zero beam, which without the influence of inventive device or arrangement would hit the workpiece.
  • the proportionality factor is given by the design of the F-theta optics, ie one in the F Theta optic entering beam with a defined Ein ⁇ case angle corresponds to a position on the finests ⁇ surface, which is spaced correspondingly from the zero position of the F-theta optics.
  • For the proportionality factor between see deflection angle and deflection from the zero position results from a simple rule of three the following relationship:
  • W ⁇ pt is the angular range in which the laser beam strikes F-theta optics and which leads to a field length of F, ie to a maximum distance between the laser beams which impinge perpendicularly on the processing surface.
  • W a is the deflection angle of the Device or arrangement according to the invention, which upon rotation of the optical element leads to a circle radius K.
  • V is the speed at which the machining laser beam is moved on the circular path and B is the length of the circular path.
  • B is the length of the circular path.
  • the deflection of the input laser beam by refraction which takes place as a result of the Brechungsgeset ⁇ zes of Snellius at least one of the two boundary surfaces of the optical element.
  • the interface rotates in an angular position relative to the direction of the incident input laser beam.
  • the input interface of the optical element is arranged perpendicular to the axis of rotation and the Dreh ⁇ axis is aligned parallel to the direction of incidence of the mattersslaser ⁇ beam.
  • the interface is a mirror surface.
  • a reflection geometry has the advantage that the modulating of the circular motion can be combined with a beam deflection, for example by 90 °, so that the specular interface serves both as an inventive optical element and as a reflector for beam deflection within a laser processing machine.
  • the rotary drive can be easily arranged behind the mirror surface, so that a disturbance of the beam path is excluded.
  • the mirror surface can also be arranged on a wedge-shaped optical element, so that the opening angle of the conical surface on which the beam paths of the deflected laser beams are determined only by the corresponding wedge angle.
  • the wedge angle is the angle which is defined by the mirror surface and a plane perpendicular to the axis of rotation.
  • the laser processing machine on two optical deflection devices for the periodic saudimensio ⁇ nal deflection of a laser beam. These are oriented relative to one another in such a way that when a laser beam deflected by the optical element of the deflection device impinges on it, it is again deflected by the further optical element of the further deflection devices.
  • the deflection angle can be adjusted within a relatively wide range by a corresponding series connection of several optical deflection devices in a simple manner.
  • the arrangement according to claim 7 comprises a control device, by means of which the two rotary drives can be controlled in such a way that the optical element and the further optical element rotate at the same rotational speed and thus with a fixed phase position with respect to the rotational movement.
  • the relative phase position between the two optical elements thus determines the effective deflection angle, so that the deflection angle and thus the radius of the resulting circular path of a deflected laser beam can be set in a simple manner by varying the relative phase position.
  • the parallel offset is then determined by the wedge angle and the distance between the two wedge-shaped optical elements, so that the parallel offset of the laser beam can be adjusted by varying the distance between the two optical elements in a simple manner. It should be noted that such a parallel offset can also be achieved with two optical elements in reflection geometry.
  • the two rotary actuators can be controlled such that the optical element and the further optical element rotate at different rotational speeds.
  • This causes a temporally variable phase position with respect to the rotational movement, so that at least when using two identical optical elements, the resulting beam deflection with different deflection angle in the range of 0, ie the second optical element just compensates the beam deflection by the first optical element , up to a maximum beam deflection can take place, in which the second optical element additionally increases the beam deflection caused by the first optical element.
  • the rotational movements of the two optical elements are not synchronized, laser processing takes place within a certain period of time within a planar circular area or at least to the zero position concentric region.
  • FIG. 1 shows a schematic representation of a laser processing machine according to the invention for drilling holes
  • FIG. 2 shows the beam deflection by a rotating wedge-shaped optical element in transmission geometry
  • FIG. 3 shows the beam deflection by a rotating wedge-shaped mirror element in reflection geometry
  • FIG. 4 shows the beam deflection 5 shows the beam deflection through an arrangement of two rotating wedge-shaped mirror elements in reflection geometry
  • FIG. 6 shows the beam deflection through an arrangement of a rotating wedge-shaped optical element in transmission geometry and a rotating wedge-shaped Mirror element in reflection geometry.
  • the laser processing machine 100 shown in FIG. 1 comprises a laser source 110 which emits an input laser beam 111 which enters a deflection device 120.
  • the deflection device 120 comprises a device or arrangement according to the invention for the periodic two-dimensional deflection of a laser beam, which is described below will be explained with reference to Figures 2 to 6.
  • the Auslenkein ⁇ direction 120 generates an output laser beam 121 which has a beam path which is periodically moved about the axis of the so-called. Null beam, which extends on an extension of the input laser beam 111 on the lateral surface of a cone.
  • the output laser beam 121 strikes a conventional deflection unit 130, which can be constructed in a conventional manner with galvo mirrors, and is subsequently directed onto the substrate 150 to be processed as processing laser beam 141 by way of imaging optics 140, for example an F-theta optic.
  • the substrate 150 consists of a dielectric layer 151, which is covered by a metallic layer 152 on the upper side and underside, respectively.
  • the metallic layers 152 are structured in a manner not shown to form interconnects.
  • microholes 153 are drilled, the walls of which are subsequently metallized in a known manner.
  • the processing laser beam 141 is centered in each case by means of a jump movement 155 on a drilling position 154 and then moved in a circular motion with a focus variable F set via the imaging optics 140 in the region of the drilling position 154 so that a microhole is generated in each case becomes.
  • the processing laser beam 141 is thereby moved in one revolution or in several successive revolutions.
  • the so-called trephining is frequently used. In this case, the laser beam 141 is guided only along the edge of the hole and the inner core is cut out. In the production of microholes, it may also be necessary to perform several rotations of the laser beam 141 with different radii.
  • the conventional deflection unit 130 only has the jump movement 155 of the bearing. processing laser beam 141 with the respective setting to a drilling position 154, while the required circular motion is modulated by the deflection device 120, which is the deflection unit 130 upstream.
  • the laser source 110 is preferably switched off during jump movement 155 and switched on again after reaching the new drilling position 154.
  • FIG. 2 shows a deflection device 220, by means of which an input laser beam 211 in transmission geometry as a result of refraction through a wedge-shaped optical element 260 is deflected by a deflection angle ⁇ into an output laser beam 221.
  • the wedge-shaped optical element 260 is rotatable about an axis of rotation 261, so that the beam path of the output laser beam 221 moves on the lateral surface of a cone and describes a circular movement on a processing field, not shown, which is perpendicular to the axis of rotation 261.
  • the wedge-shaped optical element has an input interface 262 which, according to the exemplary embodiment illustrated here, is arranged perpendicular to the beam path of the input laser beam 211.
  • the input interface 262 is perpendicular to the input laser beam 211 in each phase of rotation of the wedge-shaped optical element 260. Thus, no change in direction takes place when the input laser beam 211 enters the input interface 262.
  • the laser beam exits through the opposite output interface 263, which differs by a defined wedge angle a. is inclined to the entrance boundary surface 262, a change in direction of the laser beam due to Snell's law of refraction occurs, so that the output laser beam 221 is inclined by a deflection angle ⁇ with respect to the direction of the input laser beam 211.
  • the change in direction is dependent on the wedge angle a and the refractive index of the optically transparent material from which the wedge-shaped optical element 260 is made.
  • a circular movement is thus modulated onto the laser beam at the resulting angle ⁇ .
  • the deflection device 220 can be combined with an F-theta optics, not shown, which deflects the output laser beam 221 into a machining position dependent on the deflection angle ⁇ on the machining surface of a workpiece not shown, the respective machining position being at a distance of the zero position of the laser beam, which depends on the design of the F-theta optics.
  • different wedge-shaped optical elements 260 are selected with different wedge angles ⁇ .
  • the speed at which a circular path on the workpiece is traversed is determined by the radius of the circular path and by the rotational frequency xs of the optical element 260.
  • the deflection device 320 shown in FIG. 3 differs from the deflection device 220 in that the deflection device 320 is operated in reflection geometry.
  • the optical element 360 is rotatable about a rotation axis 361 at a rotational speed ⁇ by means of a rotary drive 361a.
  • the wedge-shaped optical element 360 has a mirror surface 364, which is inclined by a wedge angle a relative to a plane oriented perpendicular to the axis of rotation 361.
  • the input laser beam 311 is reflected at the mirror surface 364, the reflected output laser beam 321 being deflected by an angle ⁇ with respect to a null beam which would be generated by reflection at a mirror surface perpendicular to the rotation axis 361.
  • FIG. 4 shows a deflection arrangement 420, in which two wedge-shaped optical elements, a first optical element 460 and a second optical element 465, both of which are operated in transmission geometry, are connected in series.
  • the first wedge-shaped optical element 460 leads, as in FIG
  • the first optical element 460 has an input interface 462 and an output interface 463 inclined by a wedge angle a ⁇ with respect to the input interface 462.
  • the input interface 462 is aligned perpendicular to the axis of rotation 461, which is arranged parallel to the incident etcsla ⁇ serstrahl 411.
  • the output laser beam 421 describes a circular movement 422.
  • the output laser beam 421 impinges as input laser beam 421 on the second wedge-shaped optical element, which has an input interface 467 and an output interface 468.
  • the second wedge-shaped optical element 465 is likewise rotatable about a rotation axis 466 by means of a rotary drive, not shown, wherein the rotation axis 466 runs parallel to the rotation axis 461.
  • the output interface 468 is oriented perpendicular to the axis of rotation 466, the input interface 467 is a wedge angle ⁇ ? inclined to the output interface 468.
  • the input laser beam 421 experiences a further deflection both at the input interface 467 and at the output interface 468 as a result of the optical refraction, so that the output laser beam 469 generated thereby is altogether deflected at an angle ⁇ with respect to the input laser beam 411.
  • the second wedge-shaped optical element 465 With a speed of rotation ee> 2 , which equals the rotational speed ⁇ > i This results in a resulting circular motion 472 of the output laser beam on a correspondingly arranged processing surface (not shown).
  • the resulting deflection angle ⁇ can thus be adjusted precisely by selecting the relative phase position of both rotational movements such that the machining laser beam is circular on a workpiece, not shown departs with a fixed vorgege ⁇ circle diameter.
  • the two optical elements 460 and 465 can also be arranged rotated by 180 ° from the point of view of the incident input laser beam 411, ie that the laser beam 411 is initially an inclined interface and / or the output laser beam 421 is initially perpendicular penetrates to the axis of rotation 466 arranged interface. It is further pointed out that the two wedge-shaped optical elements 460 and 465 can also be operated with different rotational speeds »i and ⁇ 2 . In the case of an unsynchronized rotary movement, a material processing thus results within a processing range concentric about the zero beam in the course of a certain processing time.
  • FIG. 5 shows a deflection arrangement 520, by means of which an input laser beam 511 is reflected by a reflection at two wedge-shaped optical elements 560 and 565 into an output laser beam 569.
  • the deflection arrangement 520 differs from the deflection arrangement 420 in that the beam deflection does not take place in transmission geometry but in reflection geometry.
  • the principles of the two two-stage beam deflections are therefore identical except for the difference that the beam deflection by means of refraction takes place in the deflection arrangement 420 and the beam deflection by reflection takes place in the deflection arrangement 520.
  • the first wedge-shaped optical element 560 is rotatable around a rotation axis 561 by means of a rotary drive (not shown).
  • the first optical element 560 has a mirror surface 564, which is inclined by a wedge angle a. ⁇ with respect to a base surface of the first optical element that is perpendicular to the axis of rotation 561.
  • the input laser beam 511 is thus reflected at the mirror surface 564, so that the resulting output laser beam 521 experiences a deflection from a null beam, which would be generated in the case of reflection at a mirror surface perpendicular to the axis of rotation 561.
  • Upon rotation of the first optical element with the rotational speed O 1 describes the output laser beam 521 a circular motion on a cone sheath.
  • the output laser beam 521 strikes the second wedge-shaped optical element 565 which has a mirror surface 564a which, with a plane perpendicular to the axis of rotation 566, has a wedge angle ⁇ ? includes.
  • the second wedge-shaped optical element 565 is rotated about the axis of rotation 566 at the speed of rotation ⁇ Ü 2 .
  • the reflection at the mirror surface 564a leads to a further beam deflection, so that the output laser beam 569 is deflected overall by an angle ⁇ with respect to the input laser beam 511.
  • G h (O 2 is described by the time-varying beam path of the output laser beam 569, with a Paral ⁇ lelversatz parallel to the beam path of the workedslaser ⁇
  • FIG. 6 shows a deflection arrangement 620 in which an input laser beam 611 is deflected into an output laser beam 669 by means of a two-stage deflection process.
  • the first stage of the beam deflection takes place by means of a first wedge-shaped optical element 660 in transmission geometry.
  • the optical element 660 which has an input boundary surface 662 and an output boundary surface 663, which are opposite to one another. is tilted about the input interface 662 by a wedge angle ⁇ i is rotatable about a rotational axis 661 by means of a rotary drive, not shown, with a rotational speed ooi.
  • a rotation of the first wedge-shaped optical element 660 generates a time-variable optical path of the output laser beam 621 lying on a conical surface.
  • the output laser beam 621 serves as an input laser beam 621 for the second wedge-shaped optical element 665 which is rotatable about an axis of rotation 666 by means of a rotary drive, not shown, and has a mirror surface 664a which is inclined relative to a surface perpendicular to the axis of rotation 666 by a wedge angle a ⁇ is.

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

L'invention concerne une machine d'usinage au laser (100) utilisée pour percer des trous dans une pièce, notamment dans un substrat de circuit électronique (150), qui comprend une source laser (110), aménagée pour émettre un faisceau laser (111), une unité de déflexion (130) pour dévier le faisceau laser (121) en position de perçage (154) déterminée sur le substrat du circuit (150) et un système optique de reproduction (140) pour focaliser le faisceau laser (141) sur le substrat de circuit (150). La machine d'usinage au laser comprend en outre un dispositif de déflexion (120) pour dévier périodiquement en deux dimensions un faisceau laser, qui présente un élément optique et un mécanisme d'entraînement en rotation. L'élément optique est monté de manière à tourner autour d'un axe de rotation et comporte une interface plane dont la verticale superficielle est orientée en angle par rapport à l'axe de rotation et se présente de manière à dévier le faisceau laser hors de son sens initial, en cas d'incidence dudit faisceau laser. Le mécanisme de rotation est aménagé de sorte à faire tourner l'élément optique autour de l'axe de rotation.
PCT/EP2005/052866 2004-06-29 2005-06-21 Machine d'usinage au laser pour percer des trous dans une piece, avec un dispositif de deviation optique et une unite de deflexion WO2006000549A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102004031405 2004-06-29
DE102004031405.5 2004-06-29

Publications (2)

Publication Number Publication Date
WO2006000549A1 true WO2006000549A1 (fr) 2006-01-05
WO2006000549A8 WO2006000549A8 (fr) 2006-03-09

Family

ID=35159905

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2005/052866 WO2006000549A1 (fr) 2004-06-29 2005-06-21 Machine d'usinage au laser pour percer des trous dans une piece, avec un dispositif de deviation optique et une unite de deflexion

Country Status (1)

Country Link
WO (1) WO2006000549A1 (fr)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006053268A1 (de) * 2006-11-06 2008-05-08 Forschungsgesellschaft für Strahlwerkzeuge -FGSW- mbH Vorrichtung zur Erzeugung eines Laserstrahlungsfeldes mit einem um eine Achse rotierenden Intensitätsprofil
CN101856772A (zh) * 2010-05-27 2010-10-13 张立国 一种光束旋转振镜扫描聚焦加工系统
CN102773605A (zh) * 2012-08-11 2012-11-14 张立国 一种旋转光束模块组激光运动轨迹控制系统
CN103203552A (zh) * 2012-10-12 2013-07-17 张立国 一种大幅面微孔高速钻孔系统
CN103658975A (zh) * 2013-12-03 2014-03-26 张立国 一种激光分束加工装置
CN103706946A (zh) * 2013-12-03 2014-04-09 张立国 一种激光分束振镜扫描加工装置
CN110977159A (zh) * 2019-09-17 2020-04-10 苏州肯美特设备集成有限公司 一种形成环形光斑的激光光路组件

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4725709A (en) * 1984-09-25 1988-02-16 Siemens Aktiengesellschaft Apparatus having a sweep arrangement for non-contacting modification of an article
US5587094A (en) * 1992-11-25 1996-12-24 Kabushiki Kaisha Komatsu Seisakusho Laser marking apparatus
US5593606A (en) * 1994-07-18 1997-01-14 Electro Scientific Industries, Inc. Ultraviolet laser system and method for forming vias in multi-layered targets
US20020196534A1 (en) * 2001-06-19 2002-12-26 Lizotte Todd E. Laser beam delivery system with trepanning module
WO2004091845A1 (fr) * 2003-04-15 2004-10-28 Hitachi Via Mechanics, Ltd. Procede et dispositif pour percer des trous dans un substrat de circuit electrique

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4725709A (en) * 1984-09-25 1988-02-16 Siemens Aktiengesellschaft Apparatus having a sweep arrangement for non-contacting modification of an article
US5587094A (en) * 1992-11-25 1996-12-24 Kabushiki Kaisha Komatsu Seisakusho Laser marking apparatus
US5593606A (en) * 1994-07-18 1997-01-14 Electro Scientific Industries, Inc. Ultraviolet laser system and method for forming vias in multi-layered targets
US20020196534A1 (en) * 2001-06-19 2002-12-26 Lizotte Todd E. Laser beam delivery system with trepanning module
WO2004091845A1 (fr) * 2003-04-15 2004-10-28 Hitachi Via Mechanics, Ltd. Procede et dispositif pour percer des trous dans un substrat de circuit electrique

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006053268A1 (de) * 2006-11-06 2008-05-08 Forschungsgesellschaft für Strahlwerkzeuge -FGSW- mbH Vorrichtung zur Erzeugung eines Laserstrahlungsfeldes mit einem um eine Achse rotierenden Intensitätsprofil
DE102006053268B4 (de) 2006-11-06 2023-07-06 Universität Stuttgart Vorrichtung zur Erzeugung eines Laserstrahlungsfeldes mit einem um eine Achse rotierenden Intensitätsprofil
CN101856772A (zh) * 2010-05-27 2010-10-13 张立国 一种光束旋转振镜扫描聚焦加工系统
CN102773605A (zh) * 2012-08-11 2012-11-14 张立国 一种旋转光束模块组激光运动轨迹控制系统
CN103203552A (zh) * 2012-10-12 2013-07-17 张立国 一种大幅面微孔高速钻孔系统
CN103203552B (zh) * 2012-10-12 2015-10-07 张立国 一种大幅面微孔高速钻孔系统
CN103658975A (zh) * 2013-12-03 2014-03-26 张立国 一种激光分束加工装置
CN103706946A (zh) * 2013-12-03 2014-04-09 张立国 一种激光分束振镜扫描加工装置
CN110977159A (zh) * 2019-09-17 2020-04-10 苏州肯美特设备集成有限公司 一种形成环形光斑的激光光路组件

Also Published As

Publication number Publication date
WO2006000549A8 (fr) 2006-03-09

Similar Documents

Publication Publication Date Title
DE10193737B4 (de) Laserbearbeitungsvorrichtung
DE602004002775T2 (de) Vorrichtung zur Erzeugung eines rotierenden Laserstrahls mit einer neigbaren Linse
EP1907163B1 (fr) Dispositif de perçage et d'enlevement de matiere a l'aide d'un faisceau laser
DE10018253C2 (de) Laser-Mikro-Dissektionsgerät
EP2142333B1 (fr) Dispositif de traitement d'une surface d'une pièce au moyen d'un rayonnement laser
DE202008017745U1 (de) Vorrichtung zum Führen eines Lichtstrahls
DE102013110523B4 (de) Vorrichtung und Verfahren zum Fügen von Werkstücken mittels Laserstrahls
DE2719275A1 (de) Verfahren und vorrichtung fuer die materialabtragende bearbeitung von getrennten, in einem vorgegebenen muster angeordneten flaechen auf einem sich kontinuierlich bewegenden gegenstand
EP2978588A1 (fr) Procédé et dispositif de soudage par laser de deux éléments à assembler composés de matériaux thermoplastiques, le long d'un joint soudé
DE10317363B3 (de) Verfahren und Vorrichtung zum Bohren von Löchern in einem elektrischen Schaltungssubstrat
DE19745280A1 (de) Verfahren zur Fein- und Mikrobearbeitung von Werkstücken mittels Laserstrahlen und Vorrichtung zur Durchführung des Verfahrens
EP3932609B1 (fr) Dispositif d'usinage laser des matériaux avec deux unitées de décalage parallèle du faisceau laser
EP3938137B1 (fr) Optique de formation de faisceau et de déflexion pour un dispositif de traitement laser et procédé d'usinage d'une pièce à l'aide d'un faisceau laser
DE10392185T5 (de) Verfahren zur Laserbearbeitung eines Werkstücks mit Laserpunktvergrösserung
DE102010026107B4 (de) Vorrichtung und Verfahren zum prozessgasbegleiteten Bearbeiten von Werkstücken mit energetischer Strahlung
WO2018130448A1 (fr) Dispositif et procédé pour usiner des éléments en verre ou en vitrocéramique au moyen d'un laser
WO1999054082A1 (fr) Procede permettant de devier un faisceau laser
WO2006000549A1 (fr) Machine d'usinage au laser pour percer des trous dans une piece, avec un dispositif de deviation optique et une unite de deflexion
DE2922823A1 (de) Lichtstrahlen-abtasteinrichtung
DE102004008256B3 (de) Verfahren zum Formen eines Laserstrahls, Laserbearbeitungsverfahren
DE10251480B4 (de) Verfahren zum Bohren von Löchern mittels eines Laserstrahls in einem elektrischen Schaltungssubstrat
EP4096860B1 (fr) Ensemble de traitement de matériau à l'aide d'un faisceau laser, notamment destiné au perçage par laser
DE102014012456A1 (de) Optische Strahlführungseinheit und Materialbearbeitungsvorrichtung mit einer optischen Strahlführungseinheit
DE10237893B3 (de) Verfahren und Vorrichtung zur punktuellen Bearbeitung eines Werkstücks mittels Laserstrahlung
DE19804305C1 (de) Verfahren und Vorrichtung zum Ablenken eines Laserstrahls

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KM KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NG NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SM SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

CFP Corrected version of a pamphlet front page
CR1 Correction of entry in section i

Free format text: IN PCT GAZETTE 01/2006 UNDER (71) DELETE "SIEMENS AKTIENGESELLSCHAFT [DE/DE]; WITTELSBACHERPLATZ 2, 80333 MUENCHEN (DE)"; UNDER (71) ADD "HITACHI VIA MECHANICS, LTD. [JP/JP]; 2100, KAMI-IMAIZUMI, EBINA-SHI KANAGAWA 243- 0488 (JP) "

121 Ep: the epo has been informed by wipo that ep was designated in this application
NENP Non-entry into the national phase

Ref country code: DE

WWW Wipo information: withdrawn in national office

Ref document number: DE

122 Ep: pct application non-entry in european phase