WO2006001354A1 - 積層体 - Google Patents
積層体 Download PDFInfo
- Publication number
- WO2006001354A1 WO2006001354A1 PCT/JP2005/011575 JP2005011575W WO2006001354A1 WO 2006001354 A1 WO2006001354 A1 WO 2006001354A1 JP 2005011575 W JP2005011575 W JP 2005011575W WO 2006001354 A1 WO2006001354 A1 WO 2006001354A1
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- WIPO (PCT)
- Prior art keywords
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- coating composition
- carbon atoms
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- mass
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- 239000008199 coating composition Substances 0.000 claims abstract description 98
- 229920005989 resin Polymers 0.000 claims abstract description 57
- 239000011347 resin Substances 0.000 claims abstract description 57
- LJCFOYOSGPHIOO-UHFFFAOYSA-N antimony pentoxide Chemical compound O=[Sb](=O)O[Sb](=O)=O LJCFOYOSGPHIOO-UHFFFAOYSA-N 0.000 claims abstract description 39
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 29
- 150000003377 silicon compounds Chemical class 0.000 claims abstract description 23
- 125000003118 aryl group Chemical group 0.000 claims abstract description 21
- 125000003342 alkenyl group Chemical group 0.000 claims abstract description 19
- 239000004033 plastic Substances 0.000 claims abstract description 15
- 229920003023 plastic Polymers 0.000 claims abstract description 15
- 239000003960 organic solvent Substances 0.000 claims abstract description 14
- 125000000753 cycloalkyl group Chemical group 0.000 claims abstract description 10
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 9
- 239000003822 epoxy resin Substances 0.000 claims abstract description 8
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 8
- 125000004432 carbon atom Chemical group C* 0.000 claims description 40
- 150000001875 compounds Chemical class 0.000 claims description 37
- 239000000758 substrate Substances 0.000 claims description 33
- 239000000463 material Substances 0.000 claims description 25
- -1 acryl Chemical group 0.000 claims description 17
- 125000003700 epoxy group Chemical group 0.000 claims description 10
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 4
- POILWHVDKZOXJZ-ARJAWSKDSA-M (z)-4-oxopent-2-en-2-olate Chemical compound C\C([O-])=C\C(C)=O POILWHVDKZOXJZ-ARJAWSKDSA-M 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 abstract description 22
- 238000000576 coating method Methods 0.000 abstract description 22
- 230000035939 shock Effects 0.000 abstract description 21
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 15
- 239000004925 Acrylic resin Substances 0.000 abstract description 6
- 229920000178 Acrylic resin Polymers 0.000 abstract description 6
- 125000004178 (C1-C4) alkyl group Chemical group 0.000 abstract 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 abstract 1
- 125000005595 acetylacetonate group Chemical group 0.000 abstract 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 abstract 1
- 229910052739 hydrogen Inorganic materials 0.000 abstract 1
- 239000001257 hydrogen Substances 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 65
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 24
- 239000002585 base Substances 0.000 description 22
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 19
- 230000000052 comparative effect Effects 0.000 description 17
- 239000002904 solvent Substances 0.000 description 17
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 14
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 13
- 239000010419 fine particle Substances 0.000 description 13
- 238000003860 storage Methods 0.000 description 13
- 229920003002 synthetic resin Polymers 0.000 description 13
- 239000000057 synthetic resin Substances 0.000 description 13
- 239000004593 Epoxy Substances 0.000 description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 12
- 238000000034 method Methods 0.000 description 11
- 230000000704 physical effect Effects 0.000 description 11
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 10
- 239000000203 mixture Substances 0.000 description 10
- 239000007864 aqueous solution Substances 0.000 description 9
- 230000035945 sensitivity Effects 0.000 description 9
- 238000012360 testing method Methods 0.000 description 9
- 239000002253 acid Substances 0.000 description 8
- 239000002612 dispersion medium Substances 0.000 description 8
- 238000011156 evaluation Methods 0.000 description 8
- 229910044991 metal oxide Inorganic materials 0.000 description 8
- 150000004706 metal oxides Chemical class 0.000 description 8
- 238000002156 mixing Methods 0.000 description 8
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 7
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 7
- 125000001424 substituent group Chemical group 0.000 description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 6
- 239000004417 polycarbonate Substances 0.000 description 6
- 229920005668 polycarbonate resin Polymers 0.000 description 6
- 239000004431 polycarbonate resin Substances 0.000 description 6
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 6
- 239000000377 silicon dioxide Substances 0.000 description 6
- 239000003054 catalyst Substances 0.000 description 5
- 239000002131 composite material Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 4
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 4
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- SJJMMZVIBLQHLI-UHFFFAOYSA-N 11-triethoxysilylundecanal Chemical compound CCO[Si](OCC)(OCC)CCCCCCCCCCC=O SJJMMZVIBLQHLI-UHFFFAOYSA-N 0.000 description 3
- WTYYGFLRBWMFRY-UHFFFAOYSA-N 2-[6-(oxiran-2-ylmethoxy)hexoxymethyl]oxirane Chemical compound C1OC1COCCCCCCOCC1CO1 WTYYGFLRBWMFRY-UHFFFAOYSA-N 0.000 description 3
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 3
- HCGFUIQPSOCUHI-UHFFFAOYSA-N 2-propan-2-yloxyethanol Chemical compound CC(C)OCCO HCGFUIQPSOCUHI-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- XBDQKXXYIPTUBI-UHFFFAOYSA-N Propionic acid Chemical class CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 230000001133 acceleration Effects 0.000 description 3
- 125000000218 acetic acid group Chemical group C(C)(=O)* 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 125000003545 alkoxy group Chemical group 0.000 description 3
- 229910052787 antimony Inorganic materials 0.000 description 3
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- KQAHMVLQCSALSX-UHFFFAOYSA-N decyl(trimethoxy)silane Chemical compound CCCCCCCCCC[Si](OC)(OC)OC KQAHMVLQCSALSX-UHFFFAOYSA-N 0.000 description 3
- GPLRAVKSCUXZTP-UHFFFAOYSA-N diglycerol Chemical compound OCC(O)COCC(O)CO GPLRAVKSCUXZTP-UHFFFAOYSA-N 0.000 description 3
- GOIPELYWYGMEFQ-UHFFFAOYSA-N dimethoxy-methyl-octylsilane Chemical compound CCCCCCCC[Si](C)(OC)OC GOIPELYWYGMEFQ-UHFFFAOYSA-N 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- CZWLNMOIEMTDJY-UHFFFAOYSA-N hexyl(trimethoxy)silane Chemical compound CCCCCC[Si](OC)(OC)OC CZWLNMOIEMTDJY-UHFFFAOYSA-N 0.000 description 3
- 230000007062 hydrolysis Effects 0.000 description 3
- 238000006460 hydrolysis reaction Methods 0.000 description 3
- 230000003301 hydrolyzing effect Effects 0.000 description 3
- 239000004615 ingredient Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical class OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000004094 surface-active agent Substances 0.000 description 3
- NMEPHPOFYLLFTK-UHFFFAOYSA-N trimethoxy(octyl)silane Chemical compound CCCCCCCC[Si](OC)(OC)OC NMEPHPOFYLLFTK-UHFFFAOYSA-N 0.000 description 3
- UWFRVQVNYNPBEF-UHFFFAOYSA-N 1-(2,4-dimethylphenyl)propan-1-one Chemical compound CCC(=O)C1=CC=C(C)C=C1C UWFRVQVNYNPBEF-UHFFFAOYSA-N 0.000 description 2
- FENFUOGYJVOCRY-UHFFFAOYSA-N 1-propoxypropan-2-ol Chemical compound CCCOCC(C)O FENFUOGYJVOCRY-UHFFFAOYSA-N 0.000 description 2
- IVIDDMGBRCPGLJ-UHFFFAOYSA-N 2,3-bis(oxiran-2-ylmethoxy)propan-1-ol Chemical compound C1OC1COC(CO)COCC1CO1 IVIDDMGBRCPGLJ-UHFFFAOYSA-N 0.000 description 2
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 2
- BDLXTDLGTWNUFM-UHFFFAOYSA-N 2-[(2-methylpropan-2-yl)oxy]ethanol Chemical compound CC(C)(C)OCCO BDLXTDLGTWNUFM-UHFFFAOYSA-N 0.000 description 2
- SYEWHONLFGZGLK-UHFFFAOYSA-N 2-[1,3-bis(oxiran-2-ylmethoxy)propan-2-yloxymethyl]oxirane Chemical compound C1OC1COCC(OCC1OC1)COCC1CO1 SYEWHONLFGZGLK-UHFFFAOYSA-N 0.000 description 2
- SEFYJVFBMNOLBK-UHFFFAOYSA-N 2-[2-[2-(oxiran-2-ylmethoxy)ethoxy]ethoxymethyl]oxirane Chemical compound C1OC1COCCOCCOCC1CO1 SEFYJVFBMNOLBK-UHFFFAOYSA-N 0.000 description 2
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 2
- MECNWXGGNCJFQJ-UHFFFAOYSA-N 3-piperidin-1-ylpropane-1,2-diol Chemical compound OCC(O)CN1CCCCC1 MECNWXGGNCJFQJ-UHFFFAOYSA-N 0.000 description 2
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 2
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 2
- VTLYFUHAOXGGBS-UHFFFAOYSA-N Fe3+ Chemical compound [Fe+3] VTLYFUHAOXGGBS-UHFFFAOYSA-N 0.000 description 2
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical compound C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 2
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- 241000555745 Sciuridae Species 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 235000011054 acetic acid Nutrition 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 description 2
- 125000003277 amino group Chemical group 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 2
- WGQKYBSKWIADBV-UHFFFAOYSA-N benzylamine Chemical compound NCC1=CC=CC=C1 WGQKYBSKWIADBV-UHFFFAOYSA-N 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- WHGNXNCOTZPEEK-VIFPVBQESA-N dimethoxy-methyl-[3-[[(2r)-oxiran-2-yl]methoxy]propyl]silane Chemical compound CO[Si](C)(OC)CCCOC[C@H]1CO1 WHGNXNCOTZPEEK-VIFPVBQESA-N 0.000 description 2
- WEHWNAOGRSTTBQ-UHFFFAOYSA-N dipropylamine Chemical compound CCCNCCC WEHWNAOGRSTTBQ-UHFFFAOYSA-N 0.000 description 2
- 239000012153 distilled water Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 125000005843 halogen group Chemical group 0.000 description 2
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 238000010884 ion-beam technique Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- YKYONYBAUNKHLG-UHFFFAOYSA-N n-Propyl acetate Natural products CCCOC(C)=O YKYONYBAUNKHLG-UHFFFAOYSA-N 0.000 description 2
- SLYCYWCVSGPDFR-UHFFFAOYSA-N octadecyltrimethoxysilane Chemical compound CCCCCCCCCCCCCCCCCC[Si](OC)(OC)OC SLYCYWCVSGPDFR-UHFFFAOYSA-N 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229940090181 propyl acetate Drugs 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical compound CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000013112 stability test Methods 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 2
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 2
- ASEGJSMHCHEQSA-UHFFFAOYSA-N trimethoxy(undec-10-enyl)silane Chemical compound CO[Si](OC)(OC)CCCCCCCCCC=C ASEGJSMHCHEQSA-UHFFFAOYSA-N 0.000 description 2
- BPSIOYPQMFLKFR-VIFPVBQESA-N trimethoxy-[3-[[(2r)-oxiran-2-yl]methoxy]propyl]silane Chemical compound CO[Si](OC)(OC)CCCOC[C@H]1CO1 BPSIOYPQMFLKFR-VIFPVBQESA-N 0.000 description 2
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 2
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- 230000002087 whitening effect Effects 0.000 description 2
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 2
- QBYIENPQHBMVBV-HFEGYEGKSA-N (2R)-2-hydroxy-2-phenylacetic acid Chemical compound O[C@@H](C(O)=O)c1ccccc1.O[C@@H](C(O)=O)c1ccccc1 QBYIENPQHBMVBV-HFEGYEGKSA-N 0.000 description 1
- LTQBNYCMVZQRSD-UHFFFAOYSA-N (4-ethenylphenyl)-trimethoxysilane Chemical compound CO[Si](OC)(OC)C1=CC=C(C=C)C=C1 LTQBNYCMVZQRSD-UHFFFAOYSA-N 0.000 description 1
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 1
- BPXVHIRIPLPOPT-UHFFFAOYSA-N 1,3,5-tris(2-hydroxyethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound OCCN1C(=O)N(CCO)C(=O)N(CCO)C1=O BPXVHIRIPLPOPT-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- HXKKHQJGJAFBHI-UHFFFAOYSA-N 1-aminopropan-2-ol Chemical compound CC(O)CN HXKKHQJGJAFBHI-UHFFFAOYSA-N 0.000 description 1
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 1
- JOLQKTGDSGKSKJ-UHFFFAOYSA-N 1-ethoxypropan-2-ol Chemical compound CCOCC(C)O JOLQKTGDSGKSKJ-UHFFFAOYSA-N 0.000 description 1
- LIPRQQHINVWJCH-UHFFFAOYSA-N 1-ethoxypropan-2-yl acetate Chemical compound CCOCC(C)OC(C)=O LIPRQQHINVWJCH-UHFFFAOYSA-N 0.000 description 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- JTINZFQXZLCHNS-UHFFFAOYSA-N 2,2-bis(oxiran-2-ylmethoxymethyl)butan-1-ol Chemical compound C1OC1COCC(CO)(CC)COCC1CO1 JTINZFQXZLCHNS-UHFFFAOYSA-N 0.000 description 1
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
- HDPLHDGYGLENEI-UHFFFAOYSA-N 2-[1-(oxiran-2-ylmethoxy)propan-2-yloxymethyl]oxirane Chemical compound C1OC1COC(C)COCC1CO1 HDPLHDGYGLENEI-UHFFFAOYSA-N 0.000 description 1
- RQZUWSJHFBOFPI-UHFFFAOYSA-N 2-[1-[1-(oxiran-2-ylmethoxy)propan-2-yloxy]propan-2-yloxymethyl]oxirane Chemical compound C1OC1COC(C)COC(C)COCC1CO1 RQZUWSJHFBOFPI-UHFFFAOYSA-N 0.000 description 1
- FVCHRIQAIOHAIC-UHFFFAOYSA-N 2-[1-[1-[1-(oxiran-2-ylmethoxy)propan-2-yloxy]propan-2-yloxy]propan-2-yloxymethyl]oxirane Chemical compound C1OC1COC(C)COC(C)COC(C)COCC1CO1 FVCHRIQAIOHAIC-UHFFFAOYSA-N 0.000 description 1
- KQFHZFMPTSHGLV-UHFFFAOYSA-N 2-[1-[1-[1-[1-(oxiran-2-ylmethoxy)propan-2-yloxy]propan-2-yloxy]propan-2-yloxy]propan-2-yloxymethyl]oxirane Chemical compound C1OC1COC(C)COC(C)COC(C)COC(C)COCC1CO1 KQFHZFMPTSHGLV-UHFFFAOYSA-N 0.000 description 1
- VSRMIIBCXRHPCC-UHFFFAOYSA-N 2-[2-[2-[2-[2-(oxiran-2-ylmethoxy)ethoxy]ethoxy]ethoxy]ethoxymethyl]oxirane Chemical compound C1OC1COCCOCCOCCOCCOCC1CO1 VSRMIIBCXRHPCC-UHFFFAOYSA-N 0.000 description 1
- DXVLAUMXGHQKAV-UHFFFAOYSA-N 2-[2-[2-[2-[2-[2-[2-[2-(2-hydroxypropoxy)propoxy]propoxy]propoxy]propoxy]propoxy]propoxy]propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)COC(C)COC(C)COC(C)COC(C)COC(C)COC(C)CO DXVLAUMXGHQKAV-UHFFFAOYSA-N 0.000 description 1
- KUAUJXBLDYVELT-UHFFFAOYSA-N 2-[[2,2-dimethyl-3-(oxiran-2-ylmethoxy)propoxy]methyl]oxirane Chemical compound C1OC1COCC(C)(C)COCC1CO1 KUAUJXBLDYVELT-UHFFFAOYSA-N 0.000 description 1
- AGXAFZNONAXBOS-UHFFFAOYSA-N 2-[[3-(oxiran-2-ylmethyl)phenyl]methyl]oxirane Chemical compound C=1C=CC(CC2OC2)=CC=1CC1CO1 AGXAFZNONAXBOS-UHFFFAOYSA-N 0.000 description 1
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- YEYKMVJDLWJFOA-UHFFFAOYSA-N 2-propoxyethanol Chemical compound CCCOCCO YEYKMVJDLWJFOA-UHFFFAOYSA-N 0.000 description 1
- MZWXWSVCNSPBLH-UHFFFAOYSA-N 3-(3-aminopropyl-methoxy-methylsilyl)oxypropan-1-amine Chemical compound NCCC[Si](C)(OC)OCCCN MZWXWSVCNSPBLH-UHFFFAOYSA-N 0.000 description 1
- HNNQYHFROJDYHQ-UHFFFAOYSA-N 3-(4-ethylcyclohexyl)propanoic acid 3-(3-ethylcyclopentyl)propanoic acid Chemical compound CCC1CCC(CCC(O)=O)C1.CCC1CCC(CCC(O)=O)CC1 HNNQYHFROJDYHQ-UHFFFAOYSA-N 0.000 description 1
- GDDNTTHUKVNJRA-UHFFFAOYSA-N 3-bromo-3,3-difluoroprop-1-ene Chemical compound FC(F)(Br)C=C GDDNTTHUKVNJRA-UHFFFAOYSA-N 0.000 description 1
- WGKYSFRFMQHMOF-UHFFFAOYSA-N 3-bromo-5-methylpyridine-2-carbonitrile Chemical compound CC1=CN=C(C#N)C(Br)=C1 WGKYSFRFMQHMOF-UHFFFAOYSA-N 0.000 description 1
- LVNLBBGBASVLLI-UHFFFAOYSA-N 3-triethoxysilylpropylurea Chemical compound CCO[Si](OCC)(OCC)CCCNC(N)=O LVNLBBGBASVLLI-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- LIUIFYDTKWOAES-WSZWBAFRSA-N C(OC([C@@H](N)C(C)C)=O)(OC([C@@H](N)C(C)C)=O)=O.C(COCCO)O Chemical compound C(OC([C@@H](N)C(C)C)=O)(OC([C@@H](N)C(C)C)=O)=O.C(COCCO)O LIUIFYDTKWOAES-WSZWBAFRSA-N 0.000 description 1
- 101100203596 Caenorhabditis elegans sol-1 gene Proteins 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 235000010650 Hyssopus officinalis Nutrition 0.000 description 1
- 240000001812 Hyssopus officinalis Species 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- MPCRDALPQLDDFX-UHFFFAOYSA-L Magnesium perchlorate Chemical compound [Mg+2].[O-]Cl(=O)(=O)=O.[O-]Cl(=O)(=O)=O MPCRDALPQLDDFX-UHFFFAOYSA-L 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- WRQNANDWMGAFTP-UHFFFAOYSA-N Methylacetoacetic acid Chemical compound COC(=O)CC(C)=O WRQNANDWMGAFTP-UHFFFAOYSA-N 0.000 description 1
- 241000013355 Mycteroperca interstitialis Species 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- IWYDHOAUDWTVEP-UHFFFAOYSA-N R-2-phenyl-2-hydroxyacetic acid Natural products OC(=O)C(O)C1=CC=CC=C1 IWYDHOAUDWTVEP-UHFFFAOYSA-N 0.000 description 1
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- 229910021627 Tin(IV) chloride Inorganic materials 0.000 description 1
- UMILHIMHKXVDGH-UHFFFAOYSA-N Triethylene glycol diglycidyl ether Chemical compound C1OC1COCCOCCOCCOCC1CO1 UMILHIMHKXVDGH-UHFFFAOYSA-N 0.000 description 1
- PTFCDOFLOPIGGS-UHFFFAOYSA-N Zinc dication Chemical compound [Zn+2] PTFCDOFLOPIGGS-UHFFFAOYSA-N 0.000 description 1
- SHPBBNULESVQRH-UHFFFAOYSA-N [O-2].[O-2].[Ti+4].[Zr+4] Chemical compound [O-2].[O-2].[Ti+4].[Zr+4] SHPBBNULESVQRH-UHFFFAOYSA-N 0.000 description 1
- RMKZLFMHXZAGTM-UHFFFAOYSA-N [dimethoxy(propyl)silyl]oxymethyl prop-2-enoate Chemical compound CCC[Si](OC)(OC)OCOC(=O)C=C RMKZLFMHXZAGTM-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 1
- 238000010306 acid treatment Methods 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000003172 aldehyde group Chemical group 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 125000005370 alkoxysilyl group Chemical group 0.000 description 1
- 125000005210 alkyl ammonium group Chemical group 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- ZRGUXTGDSGGHLR-UHFFFAOYSA-K aluminum;triperchlorate Chemical compound [Al+3].[O-]Cl(=O)(=O)=O.[O-]Cl(=O)(=O)=O.[O-]Cl(=O)(=O)=O ZRGUXTGDSGGHLR-UHFFFAOYSA-K 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- FAPDDOBMIUGHIN-UHFFFAOYSA-K antimony trichloride Chemical compound Cl[Sb](Cl)Cl FAPDDOBMIUGHIN-UHFFFAOYSA-K 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 239000011260 aqueous acid Substances 0.000 description 1
- 150000003974 aralkylamines Chemical class 0.000 description 1
- 125000004104 aryloxy group Chemical group 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- JRPRCOLKIYRSNH-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) benzene-1,2-dicarboxylate Chemical compound C=1C=CC=C(C(=O)OCC2OC2)C=1C(=O)OCC1CO1 JRPRCOLKIYRSNH-UHFFFAOYSA-N 0.000 description 1
- XUCHXOAWJMEFLF-UHFFFAOYSA-N bisphenol F diglycidyl ether Chemical compound C1OC1COC(C=C1)=CC=C1CC(C=C1)=CC=C1OCC1CO1 XUCHXOAWJMEFLF-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 125000005998 bromoethyl group Chemical group 0.000 description 1
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 1
- SXPLZNMUBFBFIA-UHFFFAOYSA-N butyl(trimethoxy)silane Chemical compound CCCC[Si](OC)(OC)OC SXPLZNMUBFBFIA-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 125000001309 chloro group Chemical group Cl* 0.000 description 1
- 125000004218 chloromethyl group Chemical group [H]C([H])(Cl)* 0.000 description 1
- 238000001246 colloidal dispersion Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 125000001995 cyclobutyl group Chemical group [H]C1([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- XRLIOAUFFCHSIC-UHFFFAOYSA-N cyclohexylmethyl(dimethoxy)silane Chemical compound CO[SiH](OC)CC1CCCCC1 XRLIOAUFFCHSIC-UHFFFAOYSA-N 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 125000001559 cyclopropyl group Chemical group [H]C1([H])C([H])([H])C1([H])* 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- BAAAEEDPKUHLID-UHFFFAOYSA-N decyl(triethoxy)silane Chemical compound CCCCCCCCCC[Si](OCC)(OCC)OCC BAAAEEDPKUHLID-UHFFFAOYSA-N 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 1
- AHUXYBVKTIBBJW-UHFFFAOYSA-N dimethoxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](OC)(OC)C1=CC=CC=C1 AHUXYBVKTIBBJW-UHFFFAOYSA-N 0.000 description 1
- UBCPEZPOCJYHPM-UHFFFAOYSA-N dimethoxy-methyl-octadecylsilane Chemical compound CCCCCCCCCCCCCCCCCC[Si](C)(OC)OC UBCPEZPOCJYHPM-UHFFFAOYSA-N 0.000 description 1
- XYYQWMDBQFSCPB-UHFFFAOYSA-N dimethoxymethylsilane Chemical compound COC([SiH3])OC XYYQWMDBQFSCPB-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000000986 disperse dye Substances 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- YGUFXEJWPRRAEK-UHFFFAOYSA-N dodecyl(triethoxy)silane Chemical compound CCCCCCCCCCCC[Si](OCC)(OCC)OCC YGUFXEJWPRRAEK-UHFFFAOYSA-N 0.000 description 1
- SCPWMSBAGXEGPW-UHFFFAOYSA-N dodecyl(trimethoxy)silane Chemical compound CCCCCCCCCCCC[Si](OC)(OC)OC SCPWMSBAGXEGPW-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- XYIBRDXRRQCHLP-UHFFFAOYSA-N ethyl acetoacetate Chemical compound CCOC(=O)CC(C)=O XYIBRDXRRQCHLP-UHFFFAOYSA-N 0.000 description 1
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 1
- 229960005237 etoglucid Drugs 0.000 description 1
- 239000007850 fluorescent dye Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 150000008282 halocarbons Chemical class 0.000 description 1
- RSKGMYDENCAJEN-UHFFFAOYSA-N hexadecyl(trimethoxy)silane Chemical compound CCCCCCCCCCCCCCCC[Si](OC)(OC)OC RSKGMYDENCAJEN-UHFFFAOYSA-N 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- APQKDJQPCPXLQL-UHFFFAOYSA-N hexyl-dimethoxy-methylsilane Chemical compound CCCCCC[Si](C)(OC)OC APQKDJQPCPXLQL-UHFFFAOYSA-N 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052809 inorganic oxide Inorganic materials 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 229940102253 isopropanolamine Drugs 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- JJWLVOIRVHMVIS-UHFFFAOYSA-N isopropylamine Chemical compound CC(C)N JJWLVOIRVHMVIS-UHFFFAOYSA-N 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 239000001630 malic acid Substances 0.000 description 1
- 235000011090 malic acid Nutrition 0.000 description 1
- 229960002510 mandelic acid Drugs 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000113 methacrylic resin Substances 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- POPACFLNWGUDSR-UHFFFAOYSA-N methoxy(trimethyl)silane Chemical compound CO[Si](C)(C)C POPACFLNWGUDSR-UHFFFAOYSA-N 0.000 description 1
- BAXHQTUUOKMMGV-UHFFFAOYSA-N methoxy-dimethyl-octylsilane Chemical compound CCCCCCCC[Si](C)(C)OC BAXHQTUUOKMMGV-UHFFFAOYSA-N 0.000 description 1
- BOGIUAUFJCYBEU-UHFFFAOYSA-N methoxyperoxysilane Chemical compound COOO[SiH3] BOGIUAUFJCYBEU-UHFFFAOYSA-N 0.000 description 1
- DRXHEPWCWBIQFJ-UHFFFAOYSA-N methyl(triphenoxy)silane Chemical compound C=1C=CC=CC=1O[Si](OC=1C=CC=CC=1)(C)OC1=CC=CC=C1 DRXHEPWCWBIQFJ-UHFFFAOYSA-N 0.000 description 1
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- INJVFBCDVXYHGQ-UHFFFAOYSA-N n'-(3-triethoxysilylpropyl)ethane-1,2-diamine Chemical compound CCO[Si](OCC)(OCC)CCCNCCN INJVFBCDVXYHGQ-UHFFFAOYSA-N 0.000 description 1
- GFSIOLUHNUKCKI-UHFFFAOYSA-N n-(3-triethoxysilylpropyl)pentan-2-imine Chemical compound CCCC(C)=NCCC[Si](OCC)(OCC)OCC GFSIOLUHNUKCKI-UHFFFAOYSA-N 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 229920000847 nonoxynol Polymers 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- FRSRLRSJUAHFRG-UHFFFAOYSA-N octadecoxyperoxysilane Chemical compound C(CCCCCCCCCCCCCCCCC)OOO[SiH3] FRSRLRSJUAHFRG-UHFFFAOYSA-N 0.000 description 1
- 125000004365 octenyl group Chemical group C(=CCCCCCC)* 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 150000003961 organosilicon compounds Chemical class 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 239000006187 pill Substances 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000002685 polymerization catalyst Substances 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 125000004368 propenyl group Chemical group C(=CC)* 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- 125000002572 propoxy group Chemical group [*]OC([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 230000003678 scratch resistant effect Effects 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 125000003808 silyl group Chemical group [H][Si]([H])([H])[*] 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000001632 sodium acetate Substances 0.000 description 1
- 235000017281 sodium acetate Nutrition 0.000 description 1
- WSFQLUVWDKCYSW-UHFFFAOYSA-M sodium;2-hydroxy-3-morpholin-4-ylpropane-1-sulfonate Chemical compound [Na+].[O-]S(=O)(=O)CC(O)CN1CCOCC1 WSFQLUVWDKCYSW-UHFFFAOYSA-M 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- NQRYJNQNLNOLGT-UHFFFAOYSA-N tetrahydropyridine hydrochloride Natural products C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- XJDNKRIXUMDJCW-UHFFFAOYSA-J titanium tetrachloride Chemical compound Cl[Ti](Cl)(Cl)Cl XJDNKRIXUMDJCW-UHFFFAOYSA-J 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- OYGYKEULCAINCL-UHFFFAOYSA-N triethoxy(hexadecyl)silane Chemical compound CCCCCCCCCCCCCCCC[Si](OCC)(OCC)OCC OYGYKEULCAINCL-UHFFFAOYSA-N 0.000 description 1
- WUMSTCDLAYQDNO-UHFFFAOYSA-N triethoxy(hexyl)silane Chemical compound CCCCCC[Si](OCC)(OCC)OCC WUMSTCDLAYQDNO-UHFFFAOYSA-N 0.000 description 1
- FZMJEGJVKFTGMU-UHFFFAOYSA-N triethoxy(octadecyl)silane Chemical compound CCCCCCCCCCCCCCCCCC[Si](OCC)(OCC)OCC FZMJEGJVKFTGMU-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-LBPRGKRZSA-N triethoxy-[3-[[(2r)-oxiran-2-yl]methoxy]propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOC[C@H]1CO1 JXUKBNICSRJFAP-LBPRGKRZSA-N 0.000 description 1
- QQQSFSZALRVCSZ-UHFFFAOYSA-N triethoxysilane Chemical compound CCO[SiH](OCC)OCC QQQSFSZALRVCSZ-UHFFFAOYSA-N 0.000 description 1
- UWSYCPWEBZRZNJ-UHFFFAOYSA-N trimethoxy(2,4,4-trimethylpentyl)silane Chemical compound CO[Si](OC)(OC)CC(C)CC(C)(C)C UWSYCPWEBZRZNJ-UHFFFAOYSA-N 0.000 description 1
- RKLXSINPXIQKIB-UHFFFAOYSA-N trimethoxy(oct-7-enyl)silane Chemical compound CO[Si](OC)(OC)CCCCCCC=C RKLXSINPXIQKIB-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- 125000003258 trimethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
- 210000002268 wool Anatomy 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
- RXBXBWBHKPGHIB-UHFFFAOYSA-L zinc;diperchlorate Chemical compound [Zn+2].[O-]Cl(=O)(=O)=O.[O-]Cl(=O)(=O)=O RXBXBWBHKPGHIB-UHFFFAOYSA-L 0.000 description 1
- CHJMFFKHPHCQIJ-UHFFFAOYSA-L zinc;octanoate Chemical compound [Zn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O CHJMFFKHPHCQIJ-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/14—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
- G02B1/14—Protective coatings, e.g. hard coatings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
Definitions
- the present invention relates to a laminate in which a cured product layer of a coating composition is formed on the surface of a resin substrate made of a specific synthetic resin, and the cured product layer has adhesion, scratch resistance, and chemical resistance.
- the present invention relates to a laminate having excellent durability such as heat resistance, hot water resistance, heat resistance, and weather resistance, and in which interference fringes are hardly generated between a resin substrate and a cured product layer.
- Synthetic resin lenses have characteristics that are not found in glass lenses, such as lightness, safety, ease of processing, and fashionability, and have been rapidly spreading in recent years.
- synthetic resin lenses those made of diethylene glycol bisvalyl carbonate resin have been widely used.
- the refractive index is 1.50 or more, which is lower than that of glass, and the outer periphery of the lens is thick. There are drawbacks. For this reason, recently, the thickness of the lens has been reduced by increasing the refractive index of the synthetic resin lens.
- a silicone-based coating film is applied to the surface of the synthetic resin lens.
- This silicone-based coating film is obtained by, for example, applying a coating composition mainly composed of silica fine particles, a polymerizable organic silane compound, a polymerization catalyst, an acid aqueous solution, and a solvent to the surface of a synthetic resin lens and heating.
- a coating composition mainly composed of silica fine particles, a polymerizable organic silane compound, a polymerization catalyst, an acid aqueous solution, and a solvent
- Coating composition in which fine particles of metal oxide or composite oxide containing at least one metal selected from Al, Sn, Sb, Ta or Ce are used in place of silli force fine particles (Japanese Patent Laid-Open No. 8-31 1 408)
- a metal oxide or composite metal oxide fine particle containing at least one metal selected from Ti, Sb, Ce, Sn, W or Fe is used instead of silica fine particles. Iting composition (Patent No. 28821 8 1)
- a coating composition using a metal oxide having a refractive index higher than that of silica fine particles alone is referred to as a high refractive index coating composition.
- the present invention is a laminate in which a cured product layer of a coating composition is formed on the surface of a resin base material such as a synthetic resin lens, and the cured product layer (coat film) is whitened by the influence of moisture. Is effectively suppressed, and even when heat shock is applied, the cured product layer does not crack, and furthermore, it has excellent weather resistance, and even when kept under light irradiation for a long time, the cured product layer And the resin substrate are maintained at a high level as in the initial stage.
- An object of the present invention is to provide a laminated body. The present inventors have intensively studied to solve the above problems.
- an antimony pentoxide sol a silicon compound having a specific structure or a hydrolyzate thereof, an epoxy group-containing silicon compound or a hydrolyzate thereof, an organic solvent and a coating composition containing an acetylylacetonate complex are used.
- the cured product layer of the coating composition is formed on the surface of the substrate made of a specific synthetic resin, whitening of the cured product layer due to the influence of moisture is effectively suppressed (sensitivity to moisture) is transparent.
- the coating composition contains the following components (A) to (E):
- R 1 is an alkyl group having 6 to 30 carbon atoms or an alkenyl group having 6 to 30 carbon atoms
- R 2 is an alkyl group having 5 or less carbon atoms, a cycloalkyl group having 5 or less carbon atoms, an alkenyl group having 5 or less carbon atoms, or an aryl group
- R 3 is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms.
- A is an integer from 0 to 2
- R 5 is an alkyl group having 5 or less carbon atoms, a cycloalkyl group having 5 or less carbon atoms, an alkenyl group having 5 or less carbon atoms, or an aryl group
- R 6 is a hydrogen atom or an alkyl having 1 to 4 carbon atoms.
- X is a divalent organic residue or oxygen atom
- b is an integer from 0 to 2
- the resin base material is made of (meth) acrylic resin, aryl resin or epoxy resin.
- the laminate of the present invention is a substrate in which the hardened layer of the coating composition containing the above components (A) to (E) is made of a specific resin (that is, (meth) acrylic resin, aryl resin or epoxy resin). Since it is formed on the surface, it has the characteristics of low sensitivity to moisture and excellent weather resistance. For example, even when the coating composition is applied under high humidity or when the coating composition is applied to the surface of the resin substrate in a water-absorbed state, a transparent cured product layer without cloudiness can be obtained. In addition, as shown in the examples described later, even after a long time (20 hours) deterioration promotion test, the adhesion between the cured product layer and the resin base material does not decrease, and is high. Adhesion is maintained. Thus, the laminate of the present invention is extremely excellent in terms of both moisture sensitivity and weather resistance.
- a specific resin that is, (meth) acrylic resin, aryl resin or epoxy resin
- the presence or absence of cloudiness (or whitening) of the laminate is visually observed by irradiating the laminate with light along the layer direction of the cured product layer.
- the cloudy layer is very thin. This is because the light path of the light passing through the cloudy layer is extremely short, and the cloudiness is hardly observable with the sun.
- the laminate of the present invention is excellent in both moisture sensitivity and weather resistance, and excellent properties such as transparency, adhesion, and scratch resistance are maintained over a long period of time.
- As a lens its industrial value is high.
- the coating composition used for producing the laminate of the present invention contains the following components (A) to (E).
- the component (A) in the coating composition used in the present invention is an antimony pentoxide sol. This component is usually used in a colloidal dispersion with water, alcohol or other organic solvent as a dispersion medium.
- alcohol-based organic solvents such as methanol, ethanol, n-propanol, isopropanol, t-butyl alcohol, and n-butyl alcohol are preferable, and methanol and 2-propanol are particularly preferable.
- the ratio of the antimony pentoxide sol in the dispersion medium at this time increases the refractive index of the cured layer (coat film) of the coating composition, so that the antimony pentoxide sol is not contained in the dispersion medium.
- 10 to 50% by mass is preferable.
- the surface of the antimony pentoxide sol is made of an amine compound and a phosphonic acid or carboxylic acid. It is also possible to use the processed one.
- amine compounds examples include ethylamine, ⁇ ethylamine, isopropylamine, n-propylamine, dimethylamine, jetylamine, dipropylamine, alkylpropylamine such as dipropylamine, and alkylammonium; aralkylamine such as benzylamine; morpholine, piperidine Alicyclic amines such as monoethanolamine, diethanolamine, trietanoh Alkanolamines such as luamine and isopropanolamine;
- carboxylic acid examples include acetic acid, oxalic acid, lactic acid, malic acid, citrate, tartaric acid, salicylic acid, glycolic acid, benzoic acid, phthalic acid, malonic acid, and mandelic acid. These amine compounds and carboxylic acids can be added in an amount of about 0.01 to 5% by mass relative to the antimony pentoxide sol.
- the particle diameter of the antimony pentoxide sol to be used is not particularly limited, but the average particle diameter is preferably 1 to 300 nm in order not to impair the transparency of the resulting cured product layer.
- the pH of the dispersion is preferably 4.0 to 9.5.
- the blending amount of the antimony pentoxide sol in the coating composition used in the present invention may be appropriately determined according to the desired physical properties depending on the purpose of the finally obtained cured product layer (coat film), which will be described later (B).
- the total amount of the component and the (C) component is preferably 25 to 2500 parts by mass, more preferably 40 to 200 parts by mass, with respect to 100 parts by mass.
- the blending amount of the antimony pentoxide sol based on the above standard is less than 25 parts by mass, the cured product layer is scratch-resistant, or adheres to the inorganic vapor deposition film formed on the cured product layer as necessary, and is cured.
- the refractive index of the physical layer becomes insufficient, and if it exceeds 250 parts by mass, the cured product layer tends to crack.
- R 1 is an alkyl group having 6 to 30 carbon atoms or an alkenyl group having 6 to 30 carbon atoms
- R 2 is an alkyl group having 5 or less carbon atoms, a cycloalkyl group having 5 or less carbon atoms, an alkenyl group having 5 or less carbon atoms, or an aryl group,
- R 3 is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, a is an integer from 0 to 2,
- R 5 is an alkyl group having 1 to 5 carbon atoms, a cycloalkyl group having 1 to 5 carbon atoms, an alkenyl group having 1 to 5 carbon atoms, or an aryl group,
- R 6 is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms
- X is a divalent organic residue or oxygen atom
- b is an integer from 0 to 2
- At least one kind of silicon compound selected from the group consisting of hydrolysates thereof and the following compounds:
- the group R 1 in the general formula (′ 1) is an alkyl group having 6 to 30 carbon atoms or an alkenyl group having 6 to 30 carbon atoms.
- the alkyl group a hexyl group, heptyl Group, octyl group, decyl group, dodecyl group, octadecyl group and the like
- examples of the alkenyl group include octenyl group, docosenyl group and the like.
- These alkyl groups and alkenyl groups may have a substituent.
- substituents include halogen atoms such as chlorine, bromine and fluorine; acryloyloxy group, methacryloyloxy group , Aryl group, aryloxy group, aldehyde group, amino group and the like.
- halogen atoms such as chlorine, bromine and fluorine
- acryloyloxy group methacryloyloxy group
- Aryl group aryloxy group
- aldehyde group amino group and the like.
- the number of carbon atoms must be within the range (6 to 30) including the substituent (illustrated below). The same applies to the groups that do).
- the group R 2 in the general formula (1) is an alkyl group having 5 or less carbon atoms, a cycloalkyl group having 5 or less carbon atoms, an alkenyl group having 5 or less carbon atoms, or an aryl group.
- alkyl groups such as a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, and a heptyl group; a cycloalkyl group such as a cyclopropyl group, a cyclobutyl group, and a cyclopentyl group; a propenyl group, 1
- An alkenyl group such as a butenyl group; an aryl group such as a benzyl group or a naphthyl group;
- these groups may have a substituent, and examples thereof include halogenated alkyl groups such as chloromethyl group, bromoethyl group, and dichloropropyl group.
- the group R 3 in the general formula (1) is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms.
- Specific examples of the alkyl group include a methyl group, an ethyl group, a propyl group, an isop A mouth pill group, a butyl group, etc. can be mentioned, These alkyl groups may also have the substituent mentioned above.
- a in the general formula (1) is an integer of 0 to 2, and is preferably 0 or 1 from the viewpoint of obtaining a highly hard film (cured product layer).
- silicon compound represented by the above general formula (1) examples include n-hexyltrimethoxysilane, n-hexyltriethoxysilane, n-hexylmethyl dimethoxysilane, n-octyltrimethoxysilane, n-octyl.
- the group R 5 in the general formula (2) is an alkyl group, a cycloalkyl group, an alkenyl group (all having 5 or less carbon atoms), or an aryl group, and the group R 2 in the general formula (1) It is synonymous.
- the group R 6 in the general formula (2) is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and has the same meaning as the group R 3 in the general formula (1).
- X in the general formula (2) is a divalent organic residue or an oxygen atom.
- the structure of the organic residue is not particularly limited as long as it is a group capable of bonding two Ge atoms having one or more alkoxy groups.
- the structure includes an ether bond, Steal bond, amide bond, amino bond, urethane bond, thioether bond, It may have a bond other than a carbon-carbon bond such as a phonyl bond, and may further contain an oxa group (ketone carbon).
- a divalent organic residue X include an alkylene group having 1 to 15 carbon atoms such as a methylene group, an ethylene group, a propylene group, a trimethylene group, a butylene group; or a group represented by the following formula: And a halogen atom such as a fluorine atom, a chlorine atom or a bromine atom; an alkyl group such as a methyl group or an ethyl group; an alkoxy group such as a methoxy group, an ethoxy group or a propoxy group; a hydroxyl group And groups in which an amino group, a mercapto group or the like is bonded as a substituent.
- m, n and I in the following formula are each an integer of 0 to 10)
- the compound represented by the above general formula (1) or (2) is used as the component (B) in the form of a hydrolyzate or a combination of two or more, respectively.
- the hydrolyzate is partially hydrolyzed, or The whole may be hydrolyzed, or may have progressed from hydrolysis to partial condensation.
- the blending amount of the component (B) in the coating composition used in the present invention may be appropriately determined according to the desired physical properties depending on the purpose of the finally obtained cured product layer (coat film), and finally formed.
- Cured product layer (coat film) 1 to 30 parts by mass, preferably 5 to 20 parts by mass, relative to 100 parts by mass.
- the mass of the cured product layer (coat film) to be finally formed is (A) component, (B) component, (C) component described later, and further blended as necessary (A),
- (B) and a solid component other than (C) for example, a polymer and a condensate of an organic silicon compound or an epoxy compound other than (B) and (C)
- a coating Organic solvent such as methanol added to the composition (described later)
- (D) component is volatilized during the formation of the cured product layer, and is not left in the finally obtained cured product layer, so it is not included in the mass of the cured product layer (coat film).
- the component (C) in the present invention in the coating composition is an epoxy group-containing silicon compound, and any known silicon compound or hydrolyzate thereof may be used without any limitation as long as it contains an epoxy group. be able to. Specific examples thereof include: r-glycidoxypropyl trimethoxysilane, r-glycidoxypropylmethyldimethoxysilane, r-glycidoxypropylmethyljetoxysilane, r-glycidoxypropyl triethoxysilane, (3,4-epoxycyclohexyl) etyltrimethoxysilane and hydrolysates thereof.
- the hydrolyzate may be partially hydrolyzed or fully hydrolyzed, or may be one that has progressed from hydrolysis to partial condensation.
- r-glycidoxypropyl trimethoxysilane,: -glycidoxypropylmethyldimethoxysilane, and a hydrolyzate thereof are preferable.
- the epoxy group-containing silicon compound may be used alone or in combination of two or more.
- the blending amount of the component (C) in the coating composition is appropriately determined according to the desired physical properties depending on the purpose of the finally obtained cured product layer (coat film).
- the component (B) it is preferably 29 to 79 parts by mass, more preferably 30 to 65 parts by mass with respect to 100 parts by mass of the finally formed cured product layer. .
- the blending amount of the component (C) is less than 29 parts by mass, cracks tend to occur in the cured product layer (coat film) when the heat shock test is carried out, and when it exceeds 79 parts by mass, scratch resistance and curing are achieved. There is a tendency that the adhesion between the physical layer and, if necessary, the inorganic vapor-deposited film formed on the cured product layer, the refractive index of the cured product layer, and the like are insufficient.
- the component (B) described above is used.
- the component (C) in such an amount that the mass ratio (B Z C) is in the range of 0.01 to 1, particularly 0.02 to 0.5.
- the component (D) is an organic solvent, and the organic components other than the components (B) and (C) and the components (B) and (C) which are blended as necessary
- organic solvents examples include alcohols such as methanol, ethanol, n-propanol, isopropanol, n-butanol, t-butanol, and n-pentanol; methyl acetate, ethyl acetate, propyl acetate, propionate Esters such as ethylene, methyl acetoacetate, ethyl acetoacetate, and ethyl acetate; ethylene glycol monoisopropyl ether, ethylene glycol monoethyl ether, ethylene glycol mono-n-propyl ether, ethylene glycol mono-n-butyl ether , Ethylene glycol mono-t-butyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol mono-n-propyl ether, propylene glycol mono-n Ethers such as butyl ether, propylene glycol monomethyl ether
- the component (B), the component (C), and the acid used for the purpose of hydrolyzing the organic silicon compound other than the component (B) and the component (C) Methanol isopropanol, t-butanol, acetylacetone, diacetone from the viewpoints of solubility in aqueous solution, easy volatility when forming a cured product layer (coat film), and smoothness when forming a cured product layer
- alcohol ethylene glycol monoisopropyl ether, or the like.
- the amount of such an organic solvent used is not particularly limited, but is usually 100-2500 parts by mass, particularly 140-1500 parts by mass with respect to 100 parts by mass of the total amount of the component (B) and the component (C). A range of parts is preferably used.
- alcohol or the like is used as a dispersion medium for the antimony pentoxide sol as the component (A) described above, the amount of such a dispersion medium is also included in the amount of the organic solvent.
- the component (E) in the coating composition is an acetylylacetonate complex and is used as a curing catalyst for the coating composition.
- Such an acetylenic toner complex is known if it is appropriately selected in consideration of physical properties such as solubility in other components, storage stability of the coating composition, and hardness of the resulting cured product layer (coat film).
- the compound can be used without any limitation. Specific examples include Li (I), Cu (II), Zn (II), Co (II), Ni (II), Be (II), Ce (III), Ta (III) , T i (III), Mr. (Ill), L a (III), C r (III),
- An acetylethylacetonate complex having V (IV) or the like as a central metal atom can be mentioned.
- Particularly preferable examples include acetyl acetyltonate complexes having A I (III), Fe (III), and Li (I) as a central metal. Also, these acetyl acetyltonate complexes have no problem whether used alone or in combination of two or more.
- the addition amount of the above acetyl acetyltonate complex is not particularly limited.
- the total amount of the component and the component (C) is preferably 0.1 to 15 parts by mass, more preferably 0.2 to 10 parts by mass with respect to 100 parts by mass.
- an organic silicon compound not corresponding to any of the component (B) and the component (C) can be added.
- organic silicon compounds include tetraethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, vinyltrimethoxysilane, methyltrimethoxysilane, methyltriethoxysilane, methyltriphenoxysilane, dimethyldimethoxysilane, trimethylmethoxysilane, Phenyltrimethoxysilane, diphenyldimethoxysilane, cyclohexylmethyldimethyloxysilane, n-propyl trimethoxysilane, n-propyltrimethoxysilane, isoptyltrimethoxysilane, isoptyltrioxysilane, isoptyltrioxysilane,
- organic silicon compounds include tetraethoxysilane, methyltrimethoxysilane, methyltriethoxysilane, and the like from the viewpoint of improving the scratch resistance of the resulting cured layer.
- the blending amount of such other organic silicon compound is preferably 100 parts by mass or less with respect to 100 parts by mass of the total amount of the component (B) and the component (C).
- the coating composition used in the present invention contains an aqueous acid solution for the purpose of hydrolyzing the above-mentioned (B) component and (C) component, and the above-mentioned other organic silicon compounds.
- an acid aqueous solution a known acid aqueous solution can be used without any limitation as long as it is an acid aqueous solution having a function of hydrolyzing and condensing an alkoxysilyl group in the above compound.
- examples of such acids include inorganic acids such as hydrochloric acid, sulfuric acid, nitric acid and phosphoric acid, and organic acids such as acetic acid and propionic acid.
- hydrochloric acid is preferably used from the viewpoints of hydrolyzability and storage stability of the coating composition.
- the concentration of the acid aqueous solution is preferably from 0.01 N to 5 N.
- Such an acid aqueous solution has a coating composition so that the amount of water is 0.1 to 3 times the total number of moles corresponding to the alkoxy group to be hydrolyzed contained in the polymerizable silicon compound. It is suitable to mix in the product.
- an epoxy compound that does not correspond to the component (C) described above may be added to the coating composition in order to adjust the physical properties of the cured layer of the coating composition.
- Such an epoxy compound (hereinafter referred to as another epoxy compound) has an epoxy group, but unlike the component (C), it does not have a silyl group.
- 1,6-hexanediol diglycidyl ether 1,6-hexanediol diglycidyl ether, ethylene glycol diglycidyl ether, diethylene glycol diglycidyl ether, triethylene glycol diglycidyl ether, tetraethylene glycol diglycidyl ether, nonaethylene glycol diglycidyl ether, Propylene glycol diglycidyl ether, dipropylene glycol diglycidyl ether, tripropylene glycol diglycidyl ether, tetrapropylene glycol diglycidyl ether, nonapropylene glycol diglycidyl ether, Neopentyl glycol diglycidyl ether, neopentyl glycol hydroxyhybalate diglycidyl ether, trimethyl Roll propane diglycidyl ether, trimethylol propane triglycidyl ether, glycerol diglycidyl ether, g
- Alicyclic epoxy compounds resorcin diglycidyl ether, bisphenol A diglycidyl ether, bisphenol F diglycidyl ether, bisphenol S diglycidyl ether, ol Phthalic acid diglycidyl ester, phenol novolak polyglycidyl ether, aromatic epoxy compounds such as cresol Pollack polyglycidyl ether; and the like.
- epoxy compounds examples include 1,6-hexanediol diglycidyl ether, diethylene glycol diglycidyl ether, trimethylolpropane diglycidyl ether, trimethylolpropane triglycidyl ether, glycerol diglycidyl ether Particularly preferred is glycerol triglycidyl ether.
- These other epoxy compounds may be used in combination of two or more.
- the blending amount of the other epoxy compound in the coating composition used in the present invention is 100 parts by mass or less with respect to 100 parts by mass of the total amount of the component (B) and the component (C) (B). Is preferred.
- a curing catalyst other than the aforementioned acetylylacetonate complex (hereinafter referred to as other curing catalyst) can be used in combination.
- other curing catalysts include perchloric acids such as perchloric acid, magnesium perchlorate, aluminum perchlorate, zinc perchlorate, and ammonium perchlorate: sodium acetate, zinc naphthenate, and naphthenic acid.
- Organic metal salts such as balt and zinc octylate; stannic chloride, aluminum chloride, chloride Lewis acids such as ferric iron, titanium chloride, zinc chloride, and antimony chloride;
- stannic chloride aluminum chloride
- chloride Lewis acids such as ferric iron, titanium chloride, zinc chloride, and antimony chloride
- These other curing catalysts can be generally used in an amount of 100 parts by mass or less per 100 parts by mass of the acetylyl senanate complex ((E) component).
- additives can be blended as necessary.
- additives include surfactants, antistatic agents, ultraviolet absorbers, antioxidants, disperse dyes, oil-soluble dyes, fluorescent dyes, materials, photochromic compounds, hindered amines, hindered phenols, and the like. These additives can be used alone or in admixture of two or more.
- a resin base material composed of these resins is selectively used, and a cured product layer is formed on the surface of the resin base material using the coating composition containing the components (A) to (E) described above.
- a laminate having low transparency effectively suppressing white turbidity due to the influence of moisture, and having excellent transparency, and the laminate.
- the reason why the laminate having the excellent characteristics as described above can be obtained by selecting the above-mentioned specific resin base material has not been clearly elucidated, but is probably the coating composition described above. However, it forms a chemical or physical cross-linking bond with the surface of the (meth) acrylic resin base material, the aryl resin base material or the epoxy resin base material, and thus the adhesion between the cured product layer and the resin base material surface.
- the cross-linking bond and the composite metal oxide in the coating composition are improved by light and water. This is probably because the cross-linking bond is stably formed even when kept in a poor environment for a long time.
- these resin substrates used in the present invention preferably have a refractive index of 1.55 or more in order to prevent generation of interference fringes due to a difference in refractive index from the coating composition.
- the (meth) acrylic resin used as a resin base material is a polymer obtained by polymerization of a monomer having a (meth) acrylic group such as (meth) acrylic acid or (meth) acrylic acid ester
- the aryl resin is a polymer obtained by polymerization of a monomer containing an aryl group such as aryl diglycol power, ponate, diaryl isophthalate and its oligomer, diaryl terephthalate and its oligomer.
- the epoxy resin is a polymer obtained by polymerization of a monomer containing an epoxy group such as 1,6-hexanediol diglycidyl ether, ethylene glycol diglycidyl ether, bisphenol A diglycidyl ether or the like.
- the above resin base material is a blend or co-polymer of the above-mentioned various resins and other resins (for example, vinyl resins) as long as the excellent characteristics due to the formation of the cured product layer of the coating composition described above are not impaired. It may be made of a polymer. For example, in the range of 30% by mass or less, other resin components or polymerized units that become other resin components can be contained.
- the laminate of the present invention is produced by applying the coating composition to the surface of the resin substrate described above and curing the composition to form a cured product layer.
- the substrate surface is treated beforehand with alkali treatment, acid treatment, surfactant treatment, UV ozone treatment, inorganic or organic fine particles. It is effective to perform polishing or plasma or corona discharge treatment.
- the coating composition can be applied by a dipping method, a spin coating method, a spray method, a flow method, or the like. Particularly for eyeglass lens applications, the dating method is preferably used in order to efficiently coat both surfaces of many substrates.
- Curing after application is usually performed by heat treatment after drying in dry air or air. Is done by doing.
- the heating temperature is generally 80 ° C. or higher, particularly 100 ° C. or higher, and a temperature at which the resin base material does not deform, generally 150 ° C. or lower is preferable.
- the curing time is about 2 hours at 1300C and about 2 to 5 hours at 100 to 120 ° C.
- the cured product layer formed by curing can have a thickness of about 0.1 to 50 / m. However, when this laminate is used for an eyeglass lens, the thickness of the cured product layer is 1 A range of ⁇ 10 m is particularly suitable.
- an antireflection film made of an inorganic material can be formed on the surface of the cured product layer.
- film forming means include vacuum vapor deposition, ion Examples thereof include a plating method and a sputtering method. In the vacuum deposition method, an ion beam assisted method of simultaneously irradiating an ion beam during deposition may be used.
- Such an antireflection film may be either a single layer or a multilayer structure.
- the inorganic material forming the antireflection film include S i O, S i O, Z r 0 2 , T i 0 2 , T i O, and T i. 0. , T i. 0 5 ,
- Oxides such as W0 3 and the like. These inorganic oxides may be used alone or in combination of two or more.
- T i — Z r — S i sol (comparative example): Methanol-dispersed titanium oxide Zirconium monoxide Ge monoxide composite metal oxide sol
- ODS n-year-old octylmethyldimethoxysilane
- ODT ES n-year-old kutadecyltriethoxysilane
- UDTS 1 0—Undecenyl trimethoxysilane
- EGEE Ethylene glycol monoethyl ether
- BTMS n-butyltrimethoxysilane
- AP TES T-acryloxyprovir triethoxysilane
- P C Polycarbonate (refractive index 1.59)
- the characteristics of the lenses (laminates) obtained in the examples and comparative examples were evaluated by the following methods.
- the transparency of the coat film (cured product layer) was observed by visual inspection. That is, the sample lens is arranged in the light beam so that the optical axis of the sample lens is perpendicular to the direction of the light beam from the light source (Cabin Industry Co., Ltd. colorCABIN 111), and is visually observed from the optical axis direction of the lens. By observing, the transparency of the cured product layer was evaluated based on the degree of cloudiness. The evaluation criteria are as follows.
- Each sample lens (laminated body) was impregnated with methanol, isopropyl alcohol, toluene, acetone, or 0.4 mass% aqueous NaOH solution for 24 hours, and the surface state change was examined.
- the evaluation criteria are as follows.
- the adhesion between the coating film and the lens was determined by a cross-cut tape test according to JISD-02020.
- a cellophane adhesive tape manufactured by Nichiban Co., Ltd. was affixed strongly on it, and was then pulled away from the surface in a 90 ° direction at once, and then the cells with the remaining coating film were measured.
- the evaluation results are expressed as (number of remaining cells) Z 1 0 0.
- the following deterioration acceleration test was conducted. That is, the lens having the obtained coating film was accelerated and deteriorated for 20 hours using a Xenon Weather Meter X 2 5 manufactured by Suga Test Instruments Co., Ltd. Thereafter, adhesion was evaluated by the same method as in (4) above.
- the sample lens (laminated body) was immersed in boiling water for 1 hour, and then immersed in cold water adjusted to 5 ° C or lower for 1 minute, and the degree of occurrence of cracks in the coating film was visually evaluated in three stages.
- the evaluation criteria are as follows.
- Example 1 After preparing the coating composition, after storing it at 20 ° C for 3 weeks and 5 weeks, use each coating composition to form a coating film on the surface of the plastic lens substrate by the method shown in each example and comparative example. The appearance, solvent resistance, and abrasion resistance of the resulting coating film Scratch, adhesion, weather resistance and heat shock resistance were evaluated by the methods described above.
- Example 1 After preparing the coating composition, after storing it at 20 ° C for 3 weeks and 5 weeks, use each coating composition to form a coating film on the surface of the plastic lens substrate by the method shown in each example and comparative example. The appearance, solvent resistance, and abrasion resistance of the resulting coating film Scratch, adhesion, weather resistance and heat shock resistance were evaluated by the methods described above.
- Example 1 Example 1
- GTS r-Glycidoxypropyl trimethysilane
- B 1 gay compound
- TES tetraethoxysilane
- Silicone surfactant (made by Nippon Tunica Co., Ltd., trade name “Shiichi 7001”)
- a coating composition (a ′) The mixture was stirred for 5 hours and then aged overnight to obtain a coating composition (a). Further, a part of the coating composition (a) was subdivided, and distilled water was added thereto so that the content was 10% by mass, followed by stirring for about 1 hour. This coating composition to which water was added was designated as a coating composition (a ′).
- the coating composition (a) and (a ′) obtained above were dipped on a plastic lens substrate (T KA) that had been immersed in a 10% aqueous solution of 10% NaOH at 40 ° C for 5 minutes.
- the coating composition was applied to the surface of the lens substrate (TKA) with a pulling speed of 30 cmZ. Datebing was performed under three conditions: relative humidity 30% RH, 50% RH, and 70% RH (all at a temperature of about 23 ° C).
- the film was dried at 70 ° C. for 20 minutes, and then cured by holding at 120 ° C. for 4 hours to form a coating film to obtain a laminate (sample lens).
- the coating film of the obtained laminate was a colorless and transparent film having a thickness of about 2 microns and a refractive index of 1.58.
- Table 1 shows the composition of the coating composition used to form the coating film and the type of plastic lens substrate (resin substrate).
- the coating compositions (a) and (a ′) devised under 3 Oo / oRH conditions are as described in (1) Appearance, (2) Solvent resistance, (3 ) Scratch resistance, (4) Adhesion, (5) Weather resistance, and (6) Heat resistance Shock resistance is evaluated.
- Table 2 shows the composition of the coating composition used to form the coating film and the type of plastic lens substrate (resin substrate).
- Coating compositions (b) to (o) were obtained in the same manner as in Example 1 except that the components shown in Table 1 were used. Further, a part of each coating composition was subdivided, and distilled water was added thereto so that the content became 10% by mass, followed by stirring for about 1 hour. The coating compositions to which water was added were designated as coating compositions (b ′;) to ( ⁇ ′). Using the above coating composition, a coat film was formed on the surface of the plastic lens substrate (resin substrate) shown in Table 1 in the same manner as in Example 1 to obtain a laminate (sample lens). It was.
- Coating compositions ( ⁇ ), ( ⁇ ′), (q) and (q ′) were obtained in the same manner as in Examples 1 to 15 except that the components shown in Table 1 were used.
- Example lens Using the above coating composition, a coat film was formed on the surface of the plastic lens substrate (resin substrate) shown in Table 1 in the same manner as in Example 1 to obtain a laminate (sample lens). It was.
- Example lens in the same manner as in Example 1 except that TKA (aryl resin plastic lens) with a refractive index of 1.60 used in Example 1 was replaced with PC (polycarbonate resin lens) with a refractive index of 1.59. ) And the physical properties were evaluated. These results are shown in Table 2, Table 3 and Table 4.
- Example 1 ⁇ ⁇ ⁇ o A 100/100 100/100 A a TKA ⁇ ⁇ ⁇ o A 100/100 100/100 A
- Example 1 1 ⁇ ⁇ ⁇ o A 100/100 100/100 A
- Example 1 7 ⁇ ⁇ ⁇ ⁇ A 100/100 100/100 A
- Example 1 ⁇ ⁇ ⁇ o A 100/100 100/100 A a, TKA ⁇ ⁇ ⁇ o A 100/100 100/100 A
- Example 2 a SE ⁇ ⁇ ⁇ o A 100/100 100/100 A a, SE ⁇ ⁇ O o A 100/100 100/100 A
- Example 1 7 ⁇ ⁇ ⁇ ⁇ A 100/100 100/100 A
- Comparative Example 1 As shown in Tables 2 to 4, the initial appearance, solvent resistance, scratch resistance, adhesion, and weather resistance are good, but the heat shock resistance is poor. It turns out that it is enough.
- the storage stability is the same as the initial preparation of the coating composition after 3 weeks and 5 weeks of storage, and the physical properties such as appearance, solvent resistance, scratch resistance, adhesion, and weather resistance are good.
- the heat shock resistance was insufficient.
- Comparative Example 2 the initial appearance, solvent resistance, scratch resistance, adhesion, heat shock resistance and the like were good, but the weather resistance was insufficient.
- Comparative Example 3 physical properties such as solvent resistance, scratch resistance, and adhesion were insufficient even when the initial and storage stability tests were performed, because a poly force-ponate was used for the base material. .
- Comparative Example 3 since the physical properties were insufficient from the beginning, weather resistance and heat shock resistance were not evaluated. Further, as for the appearance, the polycarbonate resin lens surface was clouded by contact with the epoxy group-containing silicon compound. '
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Abstract
Description
Claims
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004-188869 | 2004-06-25 | ||
| JP2004188869A JP2006008869A (ja) | 2004-06-25 | 2004-06-25 | コーティング組成物及びその積層体 |
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| Publication Number | Publication Date |
|---|---|
| WO2006001354A1 true WO2006001354A1 (ja) | 2006-01-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2005/011575 WO2006001354A1 (ja) | 2004-06-25 | 2005-06-17 | 積層体 |
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| Country | Link |
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| JP (1) | JP2006008869A (ja) |
| WO (1) | WO2006001354A1 (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014119736A1 (ja) * | 2013-01-31 | 2014-08-07 | ホーヤ レンズ マニュファクチャリング フィリピン インク | コーティング組成物および光学物品の製造方法 |
| CN112094546A (zh) * | 2020-09-15 | 2020-12-18 | 河南省阳光防腐涂装有限公司 | 一种快干道路标线漆及其制备方法 |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7778465B2 (en) | 2007-02-14 | 2010-08-17 | Kabushiki Kaisha Toshiba | Image forming apparatus with a plurality of functions |
| JP2010270191A (ja) * | 2009-05-20 | 2010-12-02 | Tokuyama Corp | コーティング組成物および光学物品 |
| JP5678901B2 (ja) * | 2012-01-25 | 2015-03-04 | 信越化学工業株式会社 | 硬化性樹脂組成物並びにその硬化成形品及び硬化皮膜を有する物品 |
| JP6263154B2 (ja) * | 2015-07-29 | 2018-01-17 | 株式会社Kri | 可溶性塗膜用塗布液 |
| JP2021080396A (ja) * | 2019-11-21 | 2021-05-27 | 東洋インキScホールディングス株式会社 | 高い透明性を有する無機酸化物分散体 |
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- 2004-06-25 JP JP2004188869A patent/JP2006008869A/ja not_active Withdrawn
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2014119736A1 (ja) * | 2013-01-31 | 2014-08-07 | ホーヤ レンズ マニュファクチャリング フィリピン インク | コーティング組成物および光学物品の製造方法 |
| JPWO2014119736A1 (ja) * | 2013-01-31 | 2017-01-26 | イーエイチエス レンズ フィリピン インク | コーティング組成物および光学物品の製造方法 |
| CN112094546A (zh) * | 2020-09-15 | 2020-12-18 | 河南省阳光防腐涂装有限公司 | 一种快干道路标线漆及其制备方法 |
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