WO2006001305A1 - Préimprégné pour tableau de connexions imprimé, laminé revêtu de feuille de métal et tableau de connexions imprimé, méthode pour fabriquer un tableau de connexions imprimé multi-couche - Google Patents
Préimprégné pour tableau de connexions imprimé, laminé revêtu de feuille de métal et tableau de connexions imprimé, méthode pour fabriquer un tableau de connexions imprimé multi-couche Download PDFInfo
- Publication number
- WO2006001305A1 WO2006001305A1 PCT/JP2005/011449 JP2005011449W WO2006001305A1 WO 2006001305 A1 WO2006001305 A1 WO 2006001305A1 JP 2005011449 W JP2005011449 W JP 2005011449W WO 2006001305 A1 WO2006001305 A1 WO 2006001305A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- printed wiring
- wiring board
- metal foil
- clad laminate
- producing
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 40
- 229910052751 metal Inorganic materials 0.000 title claims description 155
- 239000002184 metal Substances 0.000 title claims description 155
- 238000004519 manufacturing process Methods 0.000 title claims description 87
- 239000011888 foil Substances 0.000 title claims description 61
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 78
- 239000011342 resin composition Substances 0.000 claims abstract description 67
- 239000000463 material Substances 0.000 claims abstract description 53
- 238000001035 drying Methods 0.000 claims abstract description 21
- 229920005989 resin Polymers 0.000 claims description 102
- 239000011347 resin Substances 0.000 claims description 102
- 239000000758 substrate Substances 0.000 claims description 40
- 238000005452 bending Methods 0.000 claims description 34
- 238000010438 heat treatment Methods 0.000 claims description 34
- 238000012545 processing Methods 0.000 claims description 19
- 244000062645 predators Species 0.000 claims description 17
- 238000003825 pressing Methods 0.000 claims description 11
- 238000002386 leaching Methods 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 75
- 239000000203 mixture Substances 0.000 description 38
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- 239000002966 varnish Substances 0.000 description 27
- 238000012360 testing method Methods 0.000 description 25
- 239000011889 copper foil Substances 0.000 description 24
- 238000009472 formulation Methods 0.000 description 23
- 230000000052 comparative effect Effects 0.000 description 19
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- 229920002312 polyamide-imide Polymers 0.000 description 13
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 12
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- 150000001412 amines Chemical class 0.000 description 6
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 6
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- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 5
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- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 5
- 229920000178 Acrylic resin Polymers 0.000 description 4
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- GLZLLFXFYSNLKA-UHFFFAOYSA-N 4-(4-aminophenoxy)phenol Chemical compound C1=CC(N)=CC=C1OC1=CC=C(O)C=C1 GLZLLFXFYSNLKA-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
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- 239000004744 fabric Substances 0.000 description 3
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- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
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- 150000004984 aromatic diamines Chemical class 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
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- 229930003836 cresol Natural products 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 2
- KZTYYGOKRVBIMI-UHFFFAOYSA-N diphenyl sulfone Chemical compound C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 KZTYYGOKRVBIMI-UHFFFAOYSA-N 0.000 description 2
- 125000001033 ether group Chemical group 0.000 description 2
- 238000007429 general method Methods 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- UHOVQNZJYSORNB-UHFFFAOYSA-N monobenzene Natural products C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 2
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- 238000007747 plating Methods 0.000 description 2
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 2
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- OCIFZAYFRDCERT-UHFFFAOYSA-N 4-(3-aminophenoxy)phenol Chemical compound NC1=CC=CC(OC=2C=CC(O)=CC=2)=C1 OCIFZAYFRDCERT-UHFFFAOYSA-N 0.000 description 1
- VNWNVOBMCHROSI-UHFFFAOYSA-N 4-(4-aminophenoxy)phenol 1,1,1,3,3,3-hexafluoropropane Chemical compound FC(CC(F)(F)F)(F)F.NC1=CC=C(OC2=CC=C(C=C2)O)C=C1 VNWNVOBMCHROSI-UHFFFAOYSA-N 0.000 description 1
- JCRRFJIVUPSNTA-UHFFFAOYSA-N 4-[4-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(N)C=C1 JCRRFJIVUPSNTA-UHFFFAOYSA-N 0.000 description 1
- HYDATEKARGDBKU-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenyl]phenoxy]aniline Chemical group C1=CC(N)=CC=C1OC1=CC=C(C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 HYDATEKARGDBKU-UHFFFAOYSA-N 0.000 description 1
- NVKGJHAQGWCWDI-UHFFFAOYSA-N 4-[4-amino-2-(trifluoromethyl)phenyl]-3-(trifluoromethyl)aniline Chemical compound FC(F)(F)C1=CC(N)=CC=C1C1=CC=C(N)C=C1C(F)(F)F NVKGJHAQGWCWDI-UHFFFAOYSA-N 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- 239000009261 D 400 Substances 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
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- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 235000008429 bread Nutrition 0.000 description 1
- FNXLCIKXHOPCKH-UHFFFAOYSA-N bromamine Chemical compound BrN FNXLCIKXHOPCKH-UHFFFAOYSA-N 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
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- 239000004643 cyanate ester Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- RAABOESOVLLHRU-UHFFFAOYSA-N diazene Chemical compound N=N RAABOESOVLLHRU-UHFFFAOYSA-N 0.000 description 1
- 229910000071 diazene Inorganic materials 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
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- 230000000694 effects Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 150000007529 inorganic bases Chemical class 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 125000006838 isophorone group Chemical group 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- IPLONMMJNGTUAI-UHFFFAOYSA-M lithium;bromide;hydrate Chemical compound [Li+].O.[Br-] IPLONMMJNGTUAI-UHFFFAOYSA-M 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- AJAZMOFONMJGNP-WMZOPIPTSA-N n-[(2s)-4-methyl-1-oxo-1-[[(2s)-3-oxo-4-(pyridin-2-ylsulfonylamino)butan-2-yl]amino]pentan-2-yl]-1-benzofuran-2-carboxamide Chemical compound O=C([C@H](C)NC(=O)[C@@H](NC(=O)C=1OC2=CC=CC=C2C=1)CC(C)C)CNS(=O)(=O)C1=CC=CC=N1 AJAZMOFONMJGNP-WMZOPIPTSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- CLDVQCMGOSGNIW-UHFFFAOYSA-N nickel tin Chemical compound [Ni].[Sn] CLDVQCMGOSGNIW-UHFFFAOYSA-N 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 235000019198 oils Nutrition 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 150000002903 organophosphorus compounds Chemical class 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 239000008159 sesame oil Substances 0.000 description 1
- 235000011803 sesame oil Nutrition 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- 125000005628 tolylene group Chemical group 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B11/00—Making preforms
- B29B11/14—Making preforms characterised by structure or composition
- B29B11/16—Making preforms characterised by structure or composition comprising fillers or reinforcement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/04—Layered products comprising a layer of synthetic resin as impregnant, bonding, or embedding substance
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/06—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts
- B29K2105/08—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts of continuous length, e.g. cords, rovings, mats, fabrics, strands or yarns
- B29K2105/0872—Prepregs
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53796—Puller or pusher means, contained force multiplying operator
- Y10T29/53848—Puller or pusher means, contained force multiplying operator having screw operator
- Y10T29/53857—Central screw, work-engagers around screw
- Y10T29/53878—Tubular or tube segment forms work-engager
- Y10T29/53883—Screw threaded work-engager
Definitions
- Preprinter for printed wiring board metal foil-clad laminate, printed wiring board, and method for producing multilayer printed wiring board
- the present invention relates to a pre-preda used for a printed wiring board, a metal foil-clad laminate, a printed wiring board, and a method for producing a multilayer printed wiring board.
- thermoplastic resin film centered on polyimide is mainly used as a foldable printed wiring board material.
- thermoplastic resin such as polyimide has low adhesion to metal foil, and a method of forming multiple resin layers with different physical properties has been adopted.
- a conventional rigid-flex board having a rigid portion and a flexible portion is used as a printed wiring board mounted on an information terminal electronic device.
- Rigid-flexible substrates mainly use conventional laminates for the rigid part and flexible resin films for the flexible part.
- the rigid-flex board has a very complicated multi-layer bonding process (see Patent Document 1), and the time required for commercialization is very long.
- various types of adhesive sheets such as a resin film and a pre-preda containing an inorganic base material are used to bond the rigid portion and the flexible portion.
- a resin film it is common to use a resin composition that is different from the above-mentioned rigid laminated board and flexible resin film. A great deal of restrictions are likely to occur on the press conditions at the time of wearing.
- the metal foil-clad laminate is generally obtained by heating and pressurizing a metal foil on both sides or one side of a pre-preparation obtained by impregnating a glass cloth or glass nonwoven fabric with a thermosetting resin. These materials are alternately stacked with smooth and uniform metal plates (hereinafter referred to as mirror plates) to obtain the required number of sheets.
- the end plate is positioned outside the alternately stacked ones, and cushioning material is placed on the outside as necessary. This is put into a hot plate of a heatable press and heated and pressurized to cure the resin in the pre-preda. Thereafter, the metal foil-clad laminate integrated into a plate shape is separated from the mirror plate.
- a laminated board (hereinafter referred to as an inner layer board) in which circuits are formed on both sides or one side is overlaid on one or more sides or between them.
- Metal foil or single-sided metal foil-clad laminates are stacked on both sides. These are made into a plurality of sheets that need to be stacked alternately with the end plate.
- a metal plate (hereinafter referred to as a multi-layer bonding jig plate) having a smooth and uniform thickness of about 3 to 20 mm is stacked on the outer side of the alternately stacked layers.
- through holes for pinning used for alignment are formed in advance not only on the printed wiring board serving as the inner layer board but also on the pre-preda.
- the surface and edges of the prepredder are cut when cutting to the required size or when drilling to form through holes. Part and processing surface force ⁇ Oil powder is scattered. This greaves powder is likely to scatter when transported and transported, and when combined with metal foil and end plates.
- the scattered greaves powder When the scattered greaves powder is heated and pressed in a state where it is inserted between the metal foil and the mirror plate in the process of combining the metal foil pre-preda and the mirror plate, it may leave a concave shape on the metal foil surface of the laminate. , It melts once by heat and pressure and spreads on the surface of the metal foil, and is cured as it is in the same way as the pre-preda.
- This concave or melted and hardened material is caused by a resin layer in which the metal foil is etched more than necessary or the surface of the metal foil is hardened in the subsequent surface circuit processing step of the laminate. Since it is covered, it will cause unetched force. For printed wiring boards, these cause circuit breaks and short circuits, and are fatal defects.
- Patent Document 1 JP-A-7-45959
- Patent Document 2 JP-A-49-25499
- Patent Document 3 Japanese Patent Application Laid-Open No. 1-245586
- Patent Document 4 JP-A-8-250860
- Patent Document 5 JP-A-5-347461
- Patent Document 6 Japanese Patent Publication No. 6-334
- Patent Document 7 Japanese Unexamined Patent Publication No. 63-158217
- the present invention solves the above-mentioned problems of the prior art, has a small water absorption rate and small dimensional change rate, and exhibits excellent bending characteristics when a printed wiring board is formed, and a printed circuit board pre-preda and metal
- An object of the present invention is to provide a foil-clad laminate and a method for producing a multilayer printed wiring board using these.
- the present invention has a small amount of leaching from the pre-preda to the inner layer board when molding a multilayer printed wiring board with a protruding inner layer board such as a rigid-flex board, and has a good bending property.
- An object of the present invention is to provide a printed wiring board pre-preda, a metal foil-clad laminate board, a printed wiring board, and a method for producing a multilayer printed wiring board using these.
- an object of the present invention is to provide a multilayer printed wiring board that can minimize the processing of the pre-preder and is free from foreign matter and warping.
- the present invention relates to the following printed wiring board pre-preda and metal foil-clad laminate.
- a printed wiring board pre-preder obtained by impregnating and drying a thermosetting resin composition on a base material, wherein the base material is not cracked even when bent at 90 degrees.
- Thickness force of substrate 5 to: LOO / z m
- Preprinter for printed wiring board according to item (1).
- thermosetting resin composition includes one or more resin materials having a weight average molecular weight of 10,000 to 1,500,000.
- thermosetting resin composition includes one or more resin materials having a weight average molecular weight of 10,000 to 1,500,000.
- this invention relates to the manufacturing method of the following multilayer printed wiring boards.
- a method for producing a multilayer printed wiring board comprising: a step of forming a pre-preda or a resin layer comprising: a printed wiring board pre-preda that is bent at 90 degrees; A method for producing a multilayer printed wiring board, which is a pre-preda.
- thermosetting resin composition A process for producing a printed wiring board pre-predator by impregnating and drying a thermosetting resin composition on a substrate, and using a predetermined number of the printed wiring board pre-predators, placing a metal foil on both sides or one side and heating 'Pressure-molding to produce a metal foil-clad laminate, circuit-processing this metal foil-clad laminate to produce a printed wiring board, and the thermosetting resin composition on the surface of the printed wiring board
- a method for producing a multilayer printed wiring board comprising a step of forming a pre-preda or a resin layer comprising: a metal foil-clad laminate in which cracks do not occur even when the metal foil-clad laminate is bent 90 degrees
- thermosetting resin composition comprises one or more resin materials having a weight average molecular weight of 10,000 to 1,500,000. Production method.
- the thickness of the formed resin layer is 5 to: LOO m (8)-(12)
- the present invention also relates to the following printed wiring board pre-preda, metal foil-clad laminate, printed wiring board, and method for producing a multilayer printed wiring board.
- thermosetting resin composition A pre-preda for printed wiring boards in which the product contains one or more types of resin materials with a weight average molecular weight of 10,000 to 1.5 million
- a metal foil-clad laminate obtained by stacking one or more preprinters for printed wiring boards according to item (14), placing metal foil on both sides or one side, and then heating and pressing.
- a printed wiring board pre-predder is placed on the surface of the printed wiring board, and a metal foil or metal foil-clad laminate is placed on the surface of the printed wiring board pre-predator to heat and press-mold the multilayer printed wiring.
- a metal foil or metal foil-clad laminate is placed on the surface of the printed wiring board pre-predator to heat and press-mold the multilayer printed wiring.
- at least one of the printed wiring boards is larger in size than the printed wiring board pre-preda, and the printed wiring board is the printed wiring board described in (16). Manufacturing method.
- a printed wiring board pre-preder including a base material is disposed on the surface of the printed wiring board including the base material, and a metal foil or a metal foil-clad laminate including the base material is disposed on the surface of the printed wiring board pre-preder.
- a method for manufacturing a multilayer printed wiring board that is placed and heated and pressure-molded at least one printed wiring board is larger than the printed wiring board pre-preda and the printed wiring board is bent 90 degrees.
- a method for producing a multilayer printed wiring board which is a printed wiring board in which cracks do not occur in the substrate contained in the printed wiring board.
- Preprinter force for printed wiring board The method for producing a multilayer printed wiring board according to item (20), which is a printed wiring board prepredator that does not generate cracks even when bent at 90 degrees.
- a printed wiring board pre-predder is placed on the surface of the printed wiring board, and a metal foil or metal foil-clad laminate is placed on the surface of the printed wiring board pre-predator, and heating and pressure forming are performed.
- the board manufacturing method at least one printed wiring board is larger in size than the printed wiring board pre-preda, and the pre-predder force for the printed wiring board is 250 ° C or less and heating is under pressure molding conditions of lOMPa or less.
- a printed wiring board pre-preparer is placed on the surface of the printed wiring board, and a metal foil or metal foil-clad laminate is placed on the surface of the printed wiring board pre-preda to heat and press-mold the multilayer printed wiring.
- a metal foil or metal foil-clad laminate is placed on the surface of the printed wiring board pre-preda to heat and press-mold the multilayer printed wiring.
- at least one printed wiring board is larger than the printed wiring board pre-preder and the pre-predder force for the printed wiring board is not broken.
- a multilayer including: a step of bending and arranging the printed wiring board pre-preda so as to sandwich the wire plate; and a step of arranging a metal foil or a metal foil-clad laminate on the outermost layer and heating and pressing in a batch Manufacturing method of printed wiring board.
- the thickness force of the printed wiring board is 10 to 200 m, according to any one of items (25) to (27) The manufacturing method of the multilayer printed wiring board of mounting.
- thermosetting resin composition contains at least one resin material having a weight average molecular weight of 10,000 to 1,500,000. Production method.
- the printed wiring board pre-preda and the metal foil-clad laminate of the present invention can be bent at a water absorption rate or a dimensional change rate force S of 90 degrees, and can be used as a printed wiring board. In addition, excellent bending characteristics can be obtained.
- the amount of leaching from the pre-preda to the inner layer board is small and the bending property is good.
- the metal foil or the metal foil-clad laminate is disposed on the outermost layer, and is collectively heated and pressed. This makes it possible to easily manufacture a multilayer printed wiring board free from defects such as foreign matter and warping.
- FIG. 1 is a partial perspective view showing one embodiment of a printed wiring board pre-preder according to the present invention.
- FIG. 2 is a partial cross-sectional view showing a first embodiment of a metal foil-clad laminate according to the present invention.
- FIG. 3 is a partial sectional view showing a second embodiment of the metal foil-clad laminate according to the present invention.
- FIG. 4 is a partial sectional view showing a third embodiment of a metal foil-clad laminate according to the present invention.
- FIG. 5 is a partial sectional view showing an embodiment of a printed wiring board according to the present invention. Explanation of symbols
- the printed wiring board pre-preda of the present invention is obtained by impregnating a base material with a thermosetting resin composition and then drying, and the metal foil-clad laminate of the present invention is formed on both sides of the printed wiring board pre-preda. ⁇ is obtained by placing a metal foil on one side and then heating and pressing.
- the pre-printer for a printed wiring board and the metal foil-clad laminate of the present invention will be described in detail.
- the substrate used in the present invention is not particularly limited as long as it is a glass woven fabric or a glass nonwoven fabric, but a glass fiber woven fabric is particularly preferably used.
- the thickness of the substrate is not particularly limited, but 5 ⁇ : LOO 111 m, preferably 10-50 m force. It is preferable to use a base material having a thickness of 5 to LOO ⁇ m in terms of improving the bending characteristics of the printed wiring board pre-preder when the printed wiring board pre-preda is disposed in the multilayer forming.
- metal foil-clad laminate a metal foil-clad laminate produced using the same printed wiring board pre-preda as the printed wiring board pre-predator that is folded so as to sandwich the printed wiring board of the present invention is used. In some cases, it is preferable because it improves the folding characteristics of the metal foil-clad laminate.
- thermosetting resin contained in the thermosetting resin composition used in the printed wiring board pre-preder of the present invention is not particularly limited as long as it is thermosetting, and for example, epoxy resin, polyimide resin
- examples of such resins include fat-based, polyamide-imide-based, triazine-based, phenol-based, melamine-based, polyester-based, cyanate ester-based, and modified types of these resins.
- two or more types of these resins may be used in combination, and if necessary, a solvent may be added to form various solvent solutions.
- the solvent may be any of alcohol, ether, ketone, amide, aromatic hydrocarbon, ester, nitrile, etc., and a mixed solvent of several types may be used.
- thermosetting resin composition various conventionally known ones can be used.
- epoxy resin is used as the thermosetting resin
- dicyandiamide Diaminodiphenylmethane, diaminodiphenylsulfone, phthalic anhydride
- polyfunctional phenols such as water pyromellitic acid, phenol novolac and cresol novolac.
- a curing accelerator may be used for the purpose of accelerating the reaction between the thermosetting resin and the curing agent.
- type and amount of the curing accelerator There are no particular limitations on the type and amount of the curing accelerator. For example, imidazole compounds, organophosphorus compounds, tertiary amines, and quaternary ammonium salts are used, and two or more types are used in combination. May be.
- the thermosetting resin composition used in the present invention preferably contains one or more kinds of resin materials having a weight average molecular weight of 10,000 to 1,500,000.
- the weight average molecular weight of the resin material is less than 10,000, the bending characteristics tend to decrease.
- the resin material of 1.5 million or more is used, the impregnation property to the base material decreases. There is concern about deterioration of heat resistance and bending characteristics.
- the blending amount is preferably 10% by weight to 80% by weight based on the solid content of the thermosetting resin composition. If it is less than 10% by weight, the bending property tends to be lowered, and if it exceeds 80% by weight, the impregnation property may be lowered.
- the resin material having a weight average molecular weight of 10,000 to 1,500,000 is not particularly limited.
- examples thereof include polyamideimide resin and acrylic resin.
- the polyamideimide resin is more preferably a siloxane-modified polyamideimide resin.
- the conversion value obtained for standard polystyrene at 25 ° C using GPC (gel permeation chromatography) is used.
- the polyamide-imide ⁇ , 50 polyamideimide content child containing 10 or more amide groups in one molecule: LOO mol 0/0 preferably be a polyamide-imide ⁇ containing device 70 to: LOO more preferably polyamideimide ⁇ including mole 0/0.
- the number of moles of amide groups contained in polyamideimide (a) g (A) is the chromatogram obtained by GPC using 10 X aZA as the molecular weight (C) of polyamideimide resin containing 10 amide groups in one molecule.
- the region where the number average molecular weight of C is not less than C is defined as 50 to: L00 mol%.
- the amide group can be quantified using NMR, IR, ferrous hydroxamic acid color reaction method, N-bromoamide method or the like.
- the polyamideimide resin used as the resin material of the present invention is a diimide obtained by reacting a mixture of diamine (aromatic diamine) having two or more aromatic rings and siloxane diamine with trimellitic anhydride. It is preferably obtained by reacting a mixture containing a dicarboxylic acid with an aromatic diisocyanate.
- AZb 95Z5 to 30Z70 is more preferred.
- AZb 90ZlO to 40Z60 is even more preferred.
- the glass transition temperature Tg tends to decrease.
- the amount of the prepreg is reduced, the amount of varnish solvent remaining in the resin tends to increase.
- Aromatic diamines include, for example, 2, 2-bis [4- (4-aminophenoxy) phenol] bread (BAPP), bis [4 (3-aminophenoxy) phenol] sulfone, bis [4- (Minophenoxy) phenol] sulfone, 2, 2-bis [4- (4-aminophenoxy) phenol] hexafluoropropane, bis [4- (4-aminophenoxy) phenol- L] methane, 4, 4'-bis (4-aminophenoxy) biphenyl, bis [4- (4-aminophenoxy) phenol] ether, bis [4- (4-aminophenoxy) phenol] ketone, 1 , 3-bis (4-aminophenoxy) benzene, 1,4-bis (4-aminophenoxy) benzene, 2,2,1-dimethylbiphenyl 4,4'-diamin, 2,2'-bis (trifluoromethyl) Biphenyl— 4, 4'
- siloxane diamine examples include those represented by the following general formulas (1) to (4).
- the siloxane diamine represented by the general formula (1) includes X-22-161AS (amine equivalent 450), X-22-161A (amine equivalent 840), X-22-161B. (Amin equivalent 1500) (above, trade name made by Shin-Etsu Chemical Co., Ltd.), BY16—853 (Amin equivalent 650), BY1 6—853B (Amin equivalent 2200), (above, manufactured by Toray Dow Cowing Silicone Co., Ltd.) Product name).
- siloxane diamines represented by the above general formula (4) include X-2 2-9409 (amine equivalent 700), X-22-1660B-3 (amine equivalent 2200) (Shin-Etsu Chemical Co., Ltd.) An example of this is a company product name).
- aliphatic diamines may be used in combination.
- aliphatic diamines As the class, a compound represented by the following general formula (5) can be used.
- X is a methylene group, a sulfol group, an ether group, a carbonyl group or a single bond
- R 1 and R 2 are a hydrogen atom, an alkyl group, a phenyl group or a substituted group, respectively.
- ⁇ represents an integer of 1 to 50.
- R 1 and R 2 a hydrogen atom, an alkyl group having 1 to 3 carbon atoms, a fur group, or a substituted phenyl group may be bonded to a preferred phenyl group.
- substituent include an alkyl group having 1 to 3 carbon atoms and a halogen atom.
- X in the general formula (5) is preferably an ether group from the viewpoint of achieving both low elastic modulus and high Tg.
- Examples of such aliphatic diamines include Jeffamine D-400 (Amine equivalent 400), Jeffamine D-2000 (Amine equivalent 1000) (the trade name of Sun Techno Chemical Co., Ltd.), and the like.
- Examples of the diisocyanate compound used for the production of polyamideimide resin include compounds represented by the following general formula (6).
- D is a divalent organic group having at least one aromatic ring or a divalent aliphatic hydrocarbon group represented by CH 2 -CH 2 CH 1, Tolylene group, naphth
- It is preferably at least one group selected from the group consisting of a tylene group, a hexamethylene group, a 2,2,4 trimethylhexamethylene group and an isophorone group.
- an aliphatic diisocyanate or an aromatic diisocyanate can be used. It is preferable to use an aromatic diisocyanate V. It is especially preferred to use both.
- an aromatic diisocyanate 4, 4, 1-dimethanemethane diisocyanate (MDI), 2, 4-tolylene diisocyanate, 2, 6-tolylene diisocyanate, 1, 1-naphthalene Examples thereof include 5-diisocyanate and 2,4-tolylene dimer, and it is particularly preferable to use MDI.
- MDI 1-dimethanemethane diisocyanate
- Examples of the aliphatic diisocyanate include hexamethylene diisocyanate, 2,2,4-trimethylhexamethylene diisocyanate, and isophorone diisocyanate.
- thermosetting resin composition is preferably used in the state of a varnish to which a solvent is added.
- solvent used evaporates by 80% by weight or more.
- the temperature during drying is 80 ° C to 180 ° C
- the time is not particularly limited in consideration of the gelling time of the varnish.
- the amount of varnish impregnated is preferably 30 to 80% by weight based on the total amount of varnish solids and base.
- the metal foil-clad laminate can be produced, for example, as follows.
- One or more pre-printers for printed wiring boards in the present invention are stacked, and metal foil is stacked on one or both sides, usually 80 ° C. to 230 ° C.
- Metal foil by hot pressing at a temperature of C, preferably in the range of 130 ° C to 200 ° C, and usually in the range of 0.5 to 8.
- OMPa preferably 1.5 to 5.
- a tension laminate can be manufactured.
- the metal foil-clad laminate may have a resin layer formed between the printed wiring board pre-preda and the metal foil (see FIG. 3).
- a strong metal foil-clad laminate can be produced, for example, as follows.
- thermosetting resin composition film is placed between a printed wiring board pre-preda and a metal foil to constitute a laminate.
- the metal foil-clad laminate heats this laminate • Can be manufactured by pressure molding.
- the thermosetting resin composition may be completely cured or semi-cured.
- the thermosetting resin composition used for the resin layer is not particularly limited as long as it is thermosetting, and the same thermosetting resin composition used for the printed circuit board pre-preda is used. it can.
- the metal foil used in the present invention is generally a copper foil or an aluminum foil, and has a force of 3 to 35 ⁇ m, which can be used with a thickness of 5 to 200 ⁇ m which is usually used for a laminate. Is preferred.
- the metal foil is preferably a copper foil. Nickel, nickel-phosphorus, nickel-tin alloy, nickel-iron alloy, lead, lead-tin alloy, etc. are used as intermediate layers, and a copper layer of 0.5 to 15 m and 10 to 300 ⁇ m on both sides. A three-layer composite foil with m copper layers or a two-layer composite foil with aluminum and copper foil can be used.
- a printed wiring board obtained by circuit processing of a metal foil-clad laminate the circuit processing is performed in a general wiring board manufacturing process, and a method can be applied.
- the multilayer bonding condition is that the size of at least one printed wiring board (inner layer board) is a pre-printer for a printed wiring board. There is no particular restriction except that the size is larger. It is also possible to arrange a plurality of printed wiring boards (inner layer boards) at the same time in the same plane during heating and pressure press molding. In general, after forming a plurality of circuits on a metal foil-clad laminate that will be used as a printed wiring board (inner layer board), each circuit is pre-processed to some extent by punching, etc.
- the protruding printed wiring board (inner layer board) is preferably protected with a coverlay or a solder resist that is generally used as required.
- a pre-predder for printed wiring board with a pre-predder force of 3 mm or less under the heating and pressure forming conditions of 250 ° C or less and lOMPa or less, 250 ° C or less Heating and pressure press conditions of 10 MPa or less.
- the printed wiring board pre-preda, the metal foil-clad laminate and the printed wiring board of the present invention are suitable for the above-described method for producing a multilayer printed wiring board.
- the present invention also includes a step of producing a printed wiring board prepreg by impregnating and drying a thermosetting resin composition on a substrate, and using a predetermined number of printed wiring board prepregs on both sides or After placing the metal foil on one side, heating and pressure forming to manufacture a metal foil-clad laminate, processing the metal foil-clad laminate to produce a printed wiring board, and thermosetting the surface of the printed wiring board
- the present invention relates to a method for producing a multilayer printed wiring board including a step of forming a resin layer comprising a curable resin composition.
- the resin layer formed on both sides or one side of the printed wiring board is used for a printed circuit board pre-preda. It is the same as the fat composition. If necessary, the thermosetting resin composition may be applied to various films or metal foils, semi-cured, and then heat-pressed on the surface of the printed wiring board to form a resin layer. There are no particular restrictions on the heating and pressurizing conditions at that time, but it is usually preferable to conform to the molding conditions of the pre-preda for printed wiring boards.
- the resin layer may be formed by a printed wiring board pre-preda.
- the thickness of the resin layer formed on the surface of the printed wiring board is not particularly limited, but 5 to: LOO m force S is preferable, and 7 to 60 m is more preferable.
- Two or more arbitrary layers can be formed as the resin layer, and a printed wiring board pre-preder can be arranged on this layer to further increase the number of layers (see FIG. 4). Further, the size of the resin layer can be made smaller than that of the printed wiring board serving as the inner layer board, and the resin layer may be formed only on a part of the surface of the printed wiring board.
- a pre-preda for a printed wiring board to be used in a method for producing a multilayer printed wiring board including the above steps is produced by impregnating and drying a thermosetting resin composition on a base material, and is folded 90 degrees. It is a printed wiring board pre-preder that does not crack when bent.
- a metal foil-clad laminate is manufactured by placing a metal foil on both sides or one side using a predetermined number of printed wiring board pre-predas, followed by heating and pressure forming, and is a metal foil that does not crack when bent 90 degrees. It is a tension laminate.
- the present invention provides a process for producing a printed wiring board prepreg by impregnating and drying a thermosetting resin composition on a substrate, and producing a printed wiring board by processing a metal foil-clad laminate.
- a method for manufacturing a multilayer printed wiring board including the above steps is characterized in that a printed wiring board pre-preda is bent and arranged so as to sandwich the printed wiring board.
- the printed wiring board pre-predder may be bent once, and one printed wiring board may be sandwiched between the folded printed wiring board pre-predators, or the printed wiring board pre-predder may be bent twice.
- the two printed wiring boards may be sandwiched between the bent portions.
- a plurality of printed wiring boards may be sandwiched by bending multiple times.
- the number of folding of the printed wiring board pre-preda and the number of the printed wiring board pre-predators are arbitrary. The number of folding is preferably 1 to 60.
- the number of folding is preferably 1 to 3. It is desirable to select the number of times of folding and the number of overlapped layers so that the resin of the printed circuit board pre-predure does not peel off or fall off due to bending.
- the printed wiring board pre-preda used in the present invention is not particularly limited as long as the resin of the printed wiring board pre-preder does not peel off or fall off due to bending.
- the printed wiring board pre-predder used in this method is preferably a printed wiring board pre-predder that does not generate cracks even when bent at 90 degrees. Cracks do not occur even if it is bent 90 degrees! If it is a printed wiring board pre-preda, the resin of the printed wiring board pre-preda does not peel off or fall off even if it is bent and the printed wiring board is sandwiched.
- the metal foil-clad laminate used here is a metal foil-clad laminate manufactured using the same printed wiring board pre-preda as the printed wiring board pre-predator that is bent so as to sandwich the printed wiring board of the present invention. A plate may be used.
- the printed wiring board to be used may be a printed wiring board obtained by circuit processing of the metal foil-clad laminate.
- one width of the printed wiring board that is the inner layer board of the multilayer printed wiring board is larger than at least one of the widths of the printed wiring board pre-preder disposed so as to sandwich the printed wiring board. It is preferable. That is, in this case, since the printed wiring board pre-preder sandwiches the printed wiring board, one width of the printed wiring board pre-preder is smaller than the width of one of the printed wiring boards and the other of the printed wiring board pre-preda One width is preferably larger than the width of at least one of the printed wiring boards.
- the angle or the curve of the pre-printer for a printed wiring board may be arbitrary as long as it is preferable that the bent portion is free from peeling or dropping of the resin.
- the R during bending is preferably 0.01 to 10 mm.
- the thickness force of the printed wiring board is preferably 10 to 200 / ⁇ ⁇ .
- Substrate used in the method for producing a multilayer printed wiring board, composition and properties of a thermosetting resin composition, a method for producing a pre-preda for a printed wiring board, a method for producing a metal foil-clad laminate, and The metal foil used can be the same as described above.
- FIG. 1 is a partial perspective view showing one embodiment of a printed wiring board pre-preder according to the present invention.
- a prepreader 100 shown in FIG. 1 is a sheet-shaped prepreader composed of a base material and a resin composition impregnated therein.
- FIG. 2 is a partial cross-sectional view showing a first embodiment of a metal foil-clad laminate according to the present invention.
- the metal foil-clad laminate 200 is composed of a pre-preda 100 and two metal foils 10 laminated on both sides of the pre-preda 100, respectively.
- FIG. 3 is a partial cross-sectional view showing a second embodiment of the metal foil-clad laminate according to the present invention.
- the metal foil-clad laminate 210 is composed of a pre-predder 100, two resin layers 20 laminated on both sides of the pre-predder 100, and two metal foils 10 laminated outside the resin layer 20, respectively. Configured.
- FIG. 4 is a partial cross-sectional view showing a third embodiment of the metal foil-clad laminate according to the present invention.
- the metal foil-clad laminate 220 is composed of a printed wiring board 100a obtained by pasting and curing metal foil on both sides of the pre-preda to form a circuit 30a, and two pre-predas 100 laminated on both sides of the printed wiring board 100a. Furthermore, it is composed of two metal foils 10 laminated on the outside of the pre-preda 100.
- the printed wiring board 100a may have a circuit 30a formed on only one side.
- the metal foil-clad laminate 220 may include a laminate in which one or more sets of printed wiring boards and pre-predas are alternately laminated between the pre-preda 100 and the printed wiring board 100a.
- the metal foil 10 may be a metal foil with a resin layer provided with a resin layer on the surface facing the pre-preda 100.
- a resin layer having the same material strength as the resin layer 20 may be used instead of the pre-preder 100.
- the metal foil-clad laminate may be obtained by further heating and pressing the above-mentioned one.
- FIG. 5 is a partial cross-sectional view showing an embodiment of a printed wiring board according to the present invention.
- a printed wiring board 300 shown in FIG. 5 is mainly composed of a pre-preda 100 and two metal foils 10 laminated on both sides of the pre-preda 100. A part of the metal foil 10 is removed to form a wiring pattern. Further, a plurality of through holes 70 are formed through the printed wiring board 300 in a direction substantially orthogonal to the main surface thereof, and a metal plating layer 60 is provided on the hole wall of the through hole 70.
- the printed wiring board 300 is obtained by forming a circuit on the metal foil-clad laminate 200 described above. Circuit formation (circuit processing) can be performed by a conventionally known method such as a subtractive method. In addition, a predetermined circuit component (not shown) is usually mounted on the printed circuit board 300.
- thermosetting resin composition varnish The resin material shown below was diluted with methyl ethyl ketone to a resin solid content of 30% by weight to prepare a thermosetting resin composition varnish.
- 'Acrylic resin composition (trade name: HTR-860P3, manufactured by Nagase ChemteX Corporation): 80 parts by weight
- thermosetting resin composition varnish The resin material shown below was diluted with methyl ethyl ketone to a resin solid content of 30% by weight to prepare a thermosetting resin composition varnish.
- 'Acrylic resin composition (trade name: HTR-860P3, manufactured by Nagase ChemteX Corporation): 250 'Epoxy resin (trade name: Epicoat 828, manufactured by Japan Epoxy Resin Co., Ltd.): 40 parts by weight
- thermosetting resin composition varnish The resin material shown below was diluted with methyl ethyl ketone to a resin solid content of 30% by weight to prepare a thermosetting resin composition varnish.
- 'Acrylic resin composition (trade name: HTR-860P3, manufactured by Nagase ChemteX Corporation): 20 parts by weight
- thermosetting resin composition varnish The materials shown below were diluted with methyl ethyl ketone and propylene glycol monomethyl ether to a solid content of 70% by weight to prepare a thermosetting resin composition varnish.
- thermosetting resin composition varnish of Formulation Example 1 After impregnating glass fiber woven fabric with a thickness of 20 m using the thermosetting resin composition varnish of Formulation Example 1, heat drying at 140 ° C for 5-10 minutes, A pre-preda for printed wiring boards was obtained. Furthermore, a copper foil with a thickness of 18 m was layered on both sides of this printed wiring board pre-preda, and a double-sided copper-clad laminate was produced under the press conditions of 170 ° C, 90 minutes, 4. OMPa.
- thermosetting varnish composition varnish of Formulation Example 1 instead of the thermosetting varnish composition varnish of Formulation Examples 2 to 5 and Comparative Formulation Example 1 except that the thermosetting varnish composition varnish of Formulation Examples 2 to 5 and Comparative Formulation Example 1 were used, the same as in Example 1, Preprinters for printed wiring boards and double-sided copper-clad laminates of Examples 2 to 5 and Comparative Example 1 were produced.
- a polyimide film with 18 m copper foil (trade name: AX182518, manufactured by Nippon Steel Chemical Co., Ltd.) was prepared.
- Bendability evaluation is based on B-stage printed wiring board pre-preda, laminated board, 18 / zm Cut polyimide film with copper foil, double-sided copper-clad laminate with copper foil etched all over and polyimide film into 10mm width and 100mm length, and 5mm thick aluminum plate perpendicular to the length direction on the sample The state of the sample after installation and bending at 90 degrees was observed. The bending characteristics were evaluated based on the following criteria!
- the rate of dimensional change was determined by attaching a fixed point to the edge of a 250 mm square double-sided copper-clad laminate and a polyimide film with 18 m copper foil and before and after etching the copper foil.
- the etched samples were left in a 40 ° C 90% RH atmosphere for 96 hours, and the water absorption and dimensional change after moisture absorption were measured. The measurement results are shown in Table 1.
- Example 1 to 5 were all better in bending properties than Comparative Example 1 in the printed wiring board pre-preda, the double-sided copper clad laminated board, and the laminated board (etched product) obtained by etching the entire surface of the copper foil. is there.
- the samples of Examples 1 to 5 contain the base material, it is understood that the water absorption rate and the dimensional change rate are smaller than those of Comparative Examples 1 and 2.
- Comparative Example 2 is a polyimide film, the bending characteristics are good, but since it does not contain a base material, the water absorption rate and the dimensional change rate are large.
- thermosetting rosin composition varnish of Formulation Example 1 After impregnating the 20m thick glass fiber woven fabric with the thermosetting rosin composition varnish of Formulation Example 1. , And dried by heating at 140 ° C. for 5 to 10 minutes to obtain a pre-preda for printed wiring board having a solid content of 65% by weight of the resin solid. A copper foil with a thickness of 18 m was layered on both sides of this printed wiring board pre-preda, and a double-sided copper-clad laminate was produced under the OMPa press conditions at 170 ° C for 90 minutes.
- thermosetting resin composition varnish of Formulation Example 1 After applying the thermosetting resin composition varnish of Formulation Example 1 to a PET film having a thickness of 20 ⁇ m, it was dried by heating at 140 ° C for 5 to 10 minutes in the same manner as the pre-preda for printed wiring boards. A resin film with a semi-cured thermosetting resin composition having a resin layer thickness of 35 ⁇ m was prepared. After forming a circuit including a pad serving as a reference point at the end of the obtained double-sided copper-clad laminate, the above-mentioned resin film is in contact with both sides, and the thermosetting resin composition surface is in contact with the double-sided copper-clad laminate The test substrate was prepared under the press conditions of 170 ° C, 90 minutes, 4. OMPa.
- thermosetting rosin composition varnish of Formulation Example 1 instead of the thermosetting rosin composition varnish of Formulation Example 1, in the same manner as in Example 6 except that each of the thermosetting varnish composition varnishes of Formulation Examples 2 to 5 and Comparative Formulation Example 1 was used, Preprinters for printed wiring boards, double-sided copper-clad laminates, and test boards of Examples 7 to 10 and Comparative Example 3 were prepared.
- Evaluation of foldability is as follows: B-stage printed circuit board pre-preda, double-sided copper-clad laminate and polyimide film with 18 m copper foil, and laminate and polyimide film (etched product) obtained by etching these copper foils all over, test substrate The sample was cut into a width of 10 mm and a length of 100 mm, a 5 mm thick aluminum plate was placed on the sample at a right angle to the length direction, and the sample was bent at 90 degrees. The condition of the charge was observed. The bending characteristics were evaluated based on the following criteria.
- a reference point pad is attached to the edge of a 250 mm square double-sided copper-clad laminate and a polyimide film with 18 ⁇ m copper foil by circuit formation, and the resin layer is bonded together to produce a test substrate in the same manner as above.
- the dimensional change rate of the test substrate after layer lamination was measured.
- the test substrate was left in a 40 ° C 90% RH atmosphere for 96 hours, and the water absorption and dimensional change rate after moisture absorption treatment were measured. The measurement results are shown in Table 2.
- Examples 6 to 6 were prepared in a printed wiring board pre-preda, a double-sided copper-clad laminate, a laminate obtained by etching these copper foils (etched product), and a state in which a resin layer was laminated (test substrate).
- the LO sample has better bending properties than Comparative Example 3.
- Comparative Example 3 has lower water absorption and smaller dimensional change ratios than Comparative Examples 3 and 4 because the samples of LO are included. Since Comparative Example 4 is a polyimide film, the bending characteristics are good, but the base material is included! /, So the water absorption rate and the dimensional change rate are large.
- thermosetting resin composition varnish of Formulation Example 1 After impregnating the thermosetting resin composition varnish of Formulation Example 1 into a 20 m thick glass fiber woven fabric, it is heated and dried at 140 ° C for 5 to 10 minutes to obtain a printed wiring board having a solid content of 65% by weight.
- Prepreda for Got. A copper foil with a thickness of 18 m was layered on both sides of this printed wiring board pre-preda, and a double-sided copper-clad laminate was produced under the OMPa press conditions at 170 ° C for 90 minutes.
- the model circuit (straight line) was processed by a general method to produce a printed wiring board.
- the printed wiring board protrudes 100 mm on the surface of the printed wiring board described above, with one printed wiring board pre-prepar made of the same thermosetting resin composition as the printed wiring board previously cut to 150 mm ⁇ 350 mm. Furthermore, a test board was prepared by placing a 150mm x 350mm 18 / zm copper foil on the surface so as to cover the printed circuit board pre-preda and making it multilayer. The multilayer bonding conditions were 90 minutes at a molding temperature of 170 ° C and a pressure of 2. OM Pa.
- thermosetting rosin composition varnish of Formulation Example 4 and Comparative Formulation Example 1 was used instead of the thermosetting rosin composition varnish of Formulation Example 1, respectively.
- 12 and Comparative Example 5 printed wiring board pre-preda, printed wiring board, and test board were prepared.
- Bendability was evaluated by cutting a B-stage printed wiring board pre-prepared, double-sided copper-clad laminate, and a laminate (etched product) with copper foil etched to a width of 10 mm and a length of 100 mm, and a thickness of 5 mm.
- the aluminum plate was placed on the sample at a right angle to the length direction, and the state of the sample after bending at 90 degrees was observed.
- the bending characteristics were evaluated based on the following criteria.
- the amount of grease exuded from the printed circuit board pre-preda was determined by measuring the length of the resin exuded on the protruding printed wiring board surface of the test board. The measurement results are shown in Table 3.
- the copper residue was evaluated by measuring the number of copper parts left unetched after etching the copper on the surface of the test substrate and then melting the resin powder and attaching it to the copper foil surface. The measurement result was set to.
- Examples 11 and 12 have better folding characteristics than Comparative Example 5, have a small amount of exudation of grease on the surface of the printed wiring board, and have no copper portion left unetched. The fact that there is no scattering of the resin powder of the pre-predder power of the wiring board is also a force.
- the printed wiring board After impregnating a 20 ⁇ m thick glass fiber woven fabric with the thermosetting resin composition varnish of Formulation Example 1 and drying by heating at 140 ° C for 5-10 minutes, the printed wiring board has a solid content of 65% by weight. A pre-preda was obtained. The printed wiring board pre-preder thus obtained was cut into a width of 225 mm and a length of 1200 mm.
- a copper foil with a thickness of 18 m is stacked on both sides of one printed wiring board pre-prepared in the same manner as the printed wiring board pre-preder described above, and 170 ° C, 90 minutes, 4. Double-sided copper under OMPa pressing conditions. A tension laminate was produced. After cutting this double-sided copper-clad laminate to a width of 250 mm and a length of 350 mm, the model circuit (straight line) is processed by a general method to produce a printed wiring board (inside Layer board).
- a printed circuit board preprinter with a width of 225 mm and a length of 1200 mm was folded twice every 40 Omm in the length direction, and a printed wiring board with a thickness of 60 / ⁇ ⁇ , a width of 250 mm and a length of 350 mm (inner layer)
- Each plate was sandwiched one by one, and 18 ⁇ m copper foil was placed on the outside and multilayered and bonded to produce a test multilayer plate.
- the printed wiring board is placed so that the length direction of the printed wiring board and the length direction of the printed wiring board pre-preda are parallel. OMPa.
- the process of removing the grease powder scattered from the used pre-preda surface for printed wiring boards and the edge part was omitted.
- thermosetting resin composition varnish of Formulation Example 4 was used instead of the thermosetting resin composition varnish of Formulation Example 1.
- a pre-predator and a test multilayer board were prepared.
- a test multilayer board was prepared in the same manner as in Example 13 except that a printed wiring board prepreg was prepared in the same manner as in Example 13, and this printed wiring board prepreg was cut instead of being folded.
- the printed wiring board pre-preda is cut into a width of 225 mm and a length of 325 mm, and each one of the printed wiring board pre-predas is placed between and outside the two printed wiring boards (inner layer boards).
- a test multilayer board was prepared.
- thermosetting resin composition varnish of Formulation Example 4 was used instead of the thermosetting resin composition varnish of Formulation Example 1.
- a multilayer board was made.
- the copper residue was evaluated by measuring the number of copper parts left unetched because the resin powder melted and adhered to the copper foil surface after etching the copper on the surface of the test multilayer board. Table 4 shows the measurement results.
- the pre-preda for printed wiring board and the metal foil-clad laminate of the present invention can be bent at 90 ° in terms of water absorption rate and dimensional change rate, and can be used as a printed wiring board. Excellent bending characteristics can be obtained.
- the amount of the sachet oozing from the pre-preda to the inner layer board is small and the bending characteristics are reduced. It is possible to provide a method for producing a printed wiring board pre-preda, a metal foil-clad laminate, a printed wiring board, and a multilayer printed wiring board that are excellent in that the prepreg strength does not cause scattering of the grease powder. In addition, it is possible to easily manufacture a multilayer printed wiring board free from defects such as foreign matter and warping.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laminated Bodies (AREA)
- Reinforced Plastic Materials (AREA)
Abstract
Ce préimprégné pour un tableau de connexion imprimé est obtenu par une méthode passant par l'imprégnation d'un matériau de base avec une composition de résine thermodurcissable, puis par son séchage ; il est caractérisé par le fait qu'aucune craquelure n'apparaît sur le matériau de base, même lorsqu'il est plié à un angle de 90 degrés.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/630,651 US7947332B2 (en) | 2004-06-23 | 2005-06-22 | Prepreg for printed wiring board, metal foil clad laminate and printed wiring board, and, method for manufacturing multi-layer printed wiring board |
| JP2006528562A JPWO2006001305A1 (ja) | 2004-06-23 | 2005-06-22 | 印刷配線板用プリプレグ、金属箔張積層板、及び印刷配線板、並びに、多層印刷配線板の製造方法 |
| EP05765134.1A EP1768471B1 (fr) | 2004-06-23 | 2005-06-22 | Préimprégné pour tableau de connexions imprimé, laminé revêtu de feuille de métal et tableau de connexions imprimé, méthode pour fabriquer un tableau de connexions imprimé multi-couche |
Applications Claiming Priority (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004184857 | 2004-06-23 | ||
| JP2004-184858 | 2004-06-23 | ||
| JP2004184858 | 2004-06-23 | ||
| JP2004-184856 | 2004-06-23 | ||
| JP2004184856 | 2004-06-23 | ||
| JP2004-184857 | 2004-06-23 | ||
| JP2004-189607 | 2004-06-28 | ||
| JP2004189607 | 2004-06-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2006001305A1 true WO2006001305A1 (fr) | 2006-01-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2005/011449 WO2006001305A1 (fr) | 2004-06-23 | 2005-06-22 | Préimprégné pour tableau de connexions imprimé, laminé revêtu de feuille de métal et tableau de connexions imprimé, méthode pour fabriquer un tableau de connexions imprimé multi-couche |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7947332B2 (fr) |
| EP (1) | EP1768471B1 (fr) |
| JP (4) | JPWO2006001305A1 (fr) |
| KR (4) | KR20080066882A (fr) |
| CN (3) | CN101711100B (fr) |
| TW (2) | TW201215257A (fr) |
| WO (1) | WO2006001305A1 (fr) |
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| JP2008141182A (ja) * | 2006-11-02 | 2008-06-19 | Hitachi Chem Co Ltd | 金属箔張積層板及び多層印刷配線板 |
| JP2018532676A (ja) * | 2015-09-30 | 2018-11-08 | コーニング インコーポレイテッド | ハロゲン化ポリイミドシロキサン化学組成物およびハロゲン化ポリイミドシロキサン低摩擦コーティングを有するガラス物品 |
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- 2005-06-22 CN CN2009102072709A patent/CN101711100B/zh not_active Expired - Lifetime
- 2005-06-22 EP EP05765134.1A patent/EP1768471B1/fr not_active Expired - Lifetime
- 2005-06-22 KR KR1020097025696A patent/KR100971865B1/ko not_active Expired - Lifetime
- 2005-06-22 JP JP2006528562A patent/JPWO2006001305A1/ja active Pending
- 2005-06-22 CN CN2009102072696A patent/CN101883470B/zh not_active Expired - Lifetime
- 2005-06-22 KR KR1020077001494A patent/KR100979860B1/ko not_active Expired - Lifetime
- 2005-06-22 KR KR1020097014942A patent/KR20090090396A/ko not_active Ceased
- 2005-06-22 CN CN2009102072681A patent/CN101711099B/zh not_active Expired - Lifetime
- 2005-06-22 US US11/630,651 patent/US7947332B2/en not_active Expired - Fee Related
- 2005-06-23 TW TW100144565A patent/TW201215257A/zh unknown
- 2005-06-23 TW TW094121034A patent/TW200606194A/zh not_active IP Right Cessation
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2011
- 2011-01-07 JP JP2011002262A patent/JP2011103480A/ja active Pending
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008141182A (ja) * | 2006-11-02 | 2008-06-19 | Hitachi Chem Co Ltd | 金属箔張積層板及び多層印刷配線板 |
| JP2018532676A (ja) * | 2015-09-30 | 2018-11-08 | コーニング インコーポレイテッド | ハロゲン化ポリイミドシロキサン化学組成物およびハロゲン化ポリイミドシロキサン低摩擦コーティングを有するガラス物品 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101883470B (zh) | 2012-09-05 |
| US7947332B2 (en) | 2011-05-24 |
| CN101711100B (zh) | 2012-03-28 |
| EP1768471B1 (fr) | 2013-05-29 |
| TW201215257A (en) | 2012-04-01 |
| EP1768471A1 (fr) | 2007-03-28 |
| KR20090130348A (ko) | 2009-12-22 |
| JP2011103480A (ja) | 2011-05-26 |
| CN101883470A (zh) | 2010-11-10 |
| TWI365205B (fr) | 2012-06-01 |
| CN101711099B (zh) | 2012-03-21 |
| US20070277375A1 (en) | 2007-12-06 |
| JP2011109122A (ja) | 2011-06-02 |
| KR20080066882A (ko) | 2008-07-16 |
| CN101711099A (zh) | 2010-05-19 |
| JPWO2006001305A1 (ja) | 2008-04-17 |
| KR100979860B1 (ko) | 2010-09-02 |
| EP1768471A4 (fr) | 2007-08-08 |
| CN101711100A (zh) | 2010-05-19 |
| KR20070027725A (ko) | 2007-03-09 |
| KR20090090396A (ko) | 2009-08-25 |
| JP2013012779A (ja) | 2013-01-17 |
| TW200606194A (en) | 2006-02-16 |
| KR100971865B1 (ko) | 2010-07-22 |
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