[go: up one dir, main page]

WO2007038490A3 - Low melting temperature compliant solders - Google Patents

Low melting temperature compliant solders Download PDF

Info

Publication number
WO2007038490A3
WO2007038490A3 PCT/US2006/037441 US2006037441W WO2007038490A3 WO 2007038490 A3 WO2007038490 A3 WO 2007038490A3 US 2006037441 W US2006037441 W US 2006037441W WO 2007038490 A3 WO2007038490 A3 WO 2007038490A3
Authority
WO
WIPO (PCT)
Prior art keywords
melting temperature
low melting
temperature compliant
weight
solders
Prior art date
Application number
PCT/US2006/037441
Other languages
French (fr)
Other versions
WO2007038490A2 (en
WO2007038490A8 (en
Inventor
Benlih Huang
Original Assignee
Indium Corp America
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Indium Corp America filed Critical Indium Corp America
Publication of WO2007038490A2 publication Critical patent/WO2007038490A2/en
Publication of WO2007038490A3 publication Critical patent/WO2007038490A3/en
Publication of WO2007038490A8 publication Critical patent/WO2007038490A8/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Multi-Conductor Connections (AREA)
  • Powder Metallurgy (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Low melting temperature compliant solders are disclosed. In one particular exemplary embodiment, a low melting temperature compliant solder alloy comprises from about 91.5% to about 97.998% by weight tin, from about 0.001% to about 3.5% by weight silver, from about 0.0% to about 1.0% by weight copper, and from about 2.001% to about 4.0% by weight indium.
PCT/US2006/037441 2005-09-26 2006-09-26 Low melting temperature compliant solders WO2007038490A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US72003905P 2005-09-26 2005-09-26
US60/720,039 2005-09-26
US11/422,782 2006-06-07
US11/422,782 US20070071634A1 (en) 2005-09-26 2006-06-07 Low melting temperature compliant solders

Publications (3)

Publication Number Publication Date
WO2007038490A2 WO2007038490A2 (en) 2007-04-05
WO2007038490A3 true WO2007038490A3 (en) 2007-05-31
WO2007038490A8 WO2007038490A8 (en) 2008-06-12

Family

ID=37894223

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/037441 WO2007038490A2 (en) 2005-09-26 2006-09-26 Low melting temperature compliant solders

Country Status (2)

Country Link
US (1) US20070071634A1 (en)
WO (1) WO2007038490A2 (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101265449B1 (en) * 2007-07-13 2013-05-16 센주긴조쿠고교 가부시키가이샤 Lead-free solder for vehicle,and in-vehicle electronic circuit
KR101167549B1 (en) * 2007-07-18 2012-07-20 센주긴조쿠고교 가부시키가이샤 In-containing lead-free solder for on-vehicle electronic circuit
GB2455486A (en) * 2008-03-05 2009-06-17 Quantum Chem Tech Singapore A sputtered film, solder spheres and solder paste formed from an Sn-Ag-Cu-In alloy
JP4787384B1 (en) * 2010-10-29 2011-10-05 ハリマ化成株式会社 Low silver solder alloy and solder paste composition
JP2013252548A (en) * 2012-06-08 2013-12-19 Nihon Almit Co Ltd Solder paste for joining micro component
KR101639220B1 (en) 2012-12-18 2016-07-13 센주긴조쿠고교 가부시키가이샤 Lead-free solder alloy
US10076808B2 (en) * 2013-08-05 2018-09-18 Senju Metal Industry Co., Ltd. Lead-free solder alloy
US11229979B2 (en) * 2015-05-05 2022-01-25 Indium Corporation High reliability lead-free solder alloys for harsh environment electronics applications
CN113146093A (en) * 2015-05-05 2021-07-23 铟泰公司 High reliability lead-free solder alloys for harsh environment electronic device applications
CN106884107B (en) * 2017-03-09 2018-05-22 宁波新瑞清科金属材料有限公司 A kind of liquid metal thermal interface material with anti-molten characteristic and preparation method thereof
CN109082559B (en) * 2018-09-03 2021-09-28 云南锡业锡材有限公司 SnAgCuNiGeCe low-silver high-reliability lead-free solder alloy
TWI820277B (en) * 2018-12-27 2023-11-01 美商阿爾發金屬化工公司 Lead-free solder compositions
CN110303270A (en) * 2019-07-30 2019-10-08 广东省焊接技术研究所（广东省中乌研究院） Lead-free brazing, preparation method, its application, solder profile and electronic component
CN110952017B (en) * 2019-12-27 2020-10-09 华北水利水电大学 A kind of high entropy super silver solder alloy and preparation method thereof
CN114700653A (en) * 2022-04-13 2022-07-05 北京理工大学 A kind of high hardness all intermetallic compound solder joint and preparation method thereof
CN118808991A (en) * 2024-09-14 2024-10-22 同享（苏州）电子材料科技股份有限公司 A method for preparing lead-free solder with antioxidant ability

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4929423A (en) * 1988-03-31 1990-05-29 Cookson Group Plc Low toxicity alloy compositions for joining and sealing
US6428911B2 (en) * 2000-04-17 2002-08-06 Fujitsu Limited Soldering method and soldered joint
US6457632B1 (en) * 1997-04-25 2002-10-01 Kabushiki Kaisha Toshiba Solder alloy and bonding method of substrate and electric or electronic parts with solder alloy
US6559262B1 (en) * 1997-06-14 2003-05-06 The Board Of Trustees Of The Leland Stanford Jr. University High melting thermoplastic elastomeric alpha-olefin polymers (PRE/EPE effect) and catalysts therefor
US20050184369A1 (en) * 2002-07-25 2005-08-25 Sinryo Electronics Co., Ltd. Tin-silver-copper plating solution, plating film containing the same, and method for forming the plating film

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5256370B1 (en) * 1992-05-04 1996-09-03 Indium Corp America Lead-free alloy containing tin silver and indium
US5405577A (en) * 1993-04-29 1995-04-11 Seelig; Karl F. Lead-free and bismuth-free tin alloy solder composition
US5527628A (en) * 1993-07-20 1996-06-18 Iowa State University Research Foudation, Inc. Pb-free Sn-Ag-Cu ternary eutectic solder
US5435857A (en) * 1994-01-06 1995-07-25 Qualitek International, Inc. Soldering composition
US5520752A (en) * 1994-06-20 1996-05-28 The United States Of America As Represented By The Secretary Of The Army Composite solders
JPH10146690A (en) * 1996-11-14 1998-06-02 Senju Metal Ind Co Ltd Solder paste for soldering chip part
US5985212A (en) * 1996-12-12 1999-11-16 H-Technologies Group, Incorporated High strength lead-free solder materials
US5863493A (en) * 1996-12-16 1999-01-26 Ford Motor Company Lead-free solder compositions
KR19980068127A (en) * 1997-02-15 1998-10-15 김광호 Lead-Free Alloys for Soldering
US5833921A (en) * 1997-09-26 1998-11-10 Ford Motor Company Lead-free, low-temperature solder compositions
JP2000094181A (en) * 1998-09-24 2000-04-04 Sony Corp Solder alloy composition
US6176947B1 (en) * 1998-12-31 2001-01-23 H-Technologies Group, Incorporated Lead-free solders
US6365097B1 (en) * 1999-01-29 2002-04-02 Fuji Electric Co., Ltd. Solder alloy
JP3074649B1 (en) * 1999-02-23 2000-08-07 インターナショナル・ビジネス・マシーンズ・コーポレ−ション Lead-free solder powder, lead-free solder paste, and methods for producing them
JP3753168B2 (en) * 1999-08-20 2006-03-08 千住金属工業株式会社 Solder paste for joining microchip components
US6306516B1 (en) * 1999-12-17 2001-10-23 Agere Systems Guardian Corp. Article comprising oxide-bondable solder
US6896172B2 (en) * 2000-08-22 2005-05-24 Senju Metal Industry Co., Ltd. Lead-free solder paste for reflow soldering
JP4438974B2 (en) * 2000-10-05 2010-03-24 千住金属工業株式会社 Solder paste
US6783057B2 (en) * 2000-10-18 2004-08-31 Indium Corporation Of America Anti-tombstoning solder alloys for surface mount applications
US6928433B2 (en) * 2001-01-05 2005-08-09 Creative Technology Ltd Automatic hierarchical categorization of music by metadata
US6689488B2 (en) * 2001-02-09 2004-02-10 Taiho Kogyo Co., Ltd. Lead-free solder and solder joint
CN100444365C (en) * 2001-05-24 2008-12-17 弗莱氏金属公司 thermal interface material
SG139507A1 (en) * 2001-07-09 2008-02-29 Quantum Chem Tech Singapore Improvements in or relating to solders
JP3734731B2 (en) * 2001-09-06 2006-01-11 株式会社ノリタケカンパニーリミテド Ceramic electronic component and method for manufacturing the same
US6805974B2 (en) * 2002-02-15 2004-10-19 International Business Machines Corporation Lead-free tin-silver-copper alloy solder composition
US20040187976A1 (en) * 2003-03-31 2004-09-30 Fay Hua Phase change lead-free super plastic solders
US7111771B2 (en) * 2003-03-31 2006-09-26 Intel Corporation Solders with surfactant-refined grain sizes, solder bumps made thereof, and methods of making same
TWI222910B (en) * 2003-08-04 2004-11-01 Univ Nat Central Constituents of solder
US20050100474A1 (en) * 2003-11-06 2005-05-12 Benlih Huang Anti-tombstoning lead free alloys for surface mount reflow soldering
JP4770733B2 (en) * 2004-04-21 2011-09-14 日本電気株式会社 Solder and mounted products using it
US7749336B2 (en) * 2005-08-30 2010-07-06 Indium Corporation Of America Technique for increasing the compliance of tin-indium solders
US9260768B2 (en) * 2005-12-13 2016-02-16 Indium Corporation Lead-free solder alloys and solder joints thereof with improved drop impact resistance

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4929423A (en) * 1988-03-31 1990-05-29 Cookson Group Plc Low toxicity alloy compositions for joining and sealing
US6457632B1 (en) * 1997-04-25 2002-10-01 Kabushiki Kaisha Toshiba Solder alloy and bonding method of substrate and electric or electronic parts with solder alloy
US6559262B1 (en) * 1997-06-14 2003-05-06 The Board Of Trustees Of The Leland Stanford Jr. University High melting thermoplastic elastomeric alpha-olefin polymers (PRE/EPE effect) and catalysts therefor
US6428911B2 (en) * 2000-04-17 2002-08-06 Fujitsu Limited Soldering method and soldered joint
US20050184369A1 (en) * 2002-07-25 2005-08-25 Sinryo Electronics Co., Ltd. Tin-silver-copper plating solution, plating film containing the same, and method for forming the plating film

Also Published As

Publication number Publication date
US20070071634A1 (en) 2007-03-29
WO2007038490A2 (en) 2007-04-05
WO2007038490A8 (en) 2008-06-12

Similar Documents

Publication Publication Date Title
WO2007038490A3 (en) Low melting temperature compliant solders
AU2003209129A1 (en) Lead-free tin-silver-copper alloy solder composition
WO2007027428A3 (en) Technique for increasing the compliance of tin-indium solders
GB2421030B (en) Solder alloy
IL180932A0 (en) Improvements in or relating to solders
WO2007050571A3 (en) Technique for increasing the compliance of lead-free solders containing silver
WO2009011392A1 (en) In-containing lead-free solder for on-vehicle electronic circuit
WO2005048303A3 (en) Anti-tombstoning lead free alloys for surface mount reflow soldering
WO2007070548A3 (en) Lead-free solder alloys and solder joints thereof with improved drop impact resistance
EP1772225A4 (en) Lead-free solder alloy
WO2007081775A3 (en) Lead-free solder with low copper dissolution
GB0422997D0 (en) Solder alloy
WO2007001598A3 (en) Lead-free semiconductor package
WO2008033828A8 (en) Modified solder alloys for electrical interconnects, methods of production and uses thereof
EP2101951A4 (en) Pb-free solder alloy
WO2011068357A3 (en) Brazing alloy
AU2003291473A1 (en) Lead-free copper alloys
DE60300669D1 (en) Lead-free soldering alloy
HK1082372A2 (en) Pb-free solder alloy compositions comprising essentially tin(sn), silver(ag), copper(cu), and phosphorus(p)
EP1980355A4 (en) Lead-free solder alloy
WO2007045191A3 (en) Lead-free solder alloy
EP1908853A4 (en) METHOD OF DEPOSITING COPPER IN LEAD-FREE SOLDER, METHOD OF GRANULATING (CuX)6Sn5 COMPOUND AND METHOD OF SEPARATING THE SAME, AND METHOD OF RECOVERING TIN
AU2002317451A1 (en) Lead-free solder alloy
WO2006023914A3 (en) Thermal fatigue resistant tin-lead-silver solder
WO2002025698A3 (en) Cooling body, especially for cooling electronic components

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200680032609.0

Country of ref document: CN

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 06804161

Country of ref document: EP

Kind code of ref document: A2