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WO2008108174A1 - 照明装置並びにそれを用いた欠陥検査装置及びその方法並びに高さ計測装置及びその方法 - Google Patents

照明装置並びにそれを用いた欠陥検査装置及びその方法並びに高さ計測装置及びその方法 Download PDF

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Publication number
WO2008108174A1
WO2008108174A1 PCT/JP2008/052855 JP2008052855W WO2008108174A1 WO 2008108174 A1 WO2008108174 A1 WO 2008108174A1 JP 2008052855 W JP2008052855 W JP 2008052855W WO 2008108174 A1 WO2008108174 A1 WO 2008108174A1
Authority
WO
WIPO (PCT)
Prior art keywords
laser beam
defect inspecting
height metering
illuminating device
inspecting apparatus
Prior art date
Application number
PCT/JP2008/052855
Other languages
English (en)
French (fr)
Inventor
Keiko Oka
Yasuhiro Yoshitake
Original Assignee
Hitachi, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi, Ltd. filed Critical Hitachi, Ltd.
Publication of WO2008108174A1 publication Critical patent/WO2008108174A1/ja

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

　検査装置または高さ計測装置において、レーザビームを試料上に回折光学素子を介して直線状に照射することによって、照射領域の全領域に渡って均一なレーザビーム強度を得る。これによって、レーザビームを斜め方向から入射しても、また、低いレーザパワーでも試料表面を正確に測定することが出来る。
PCT/JP2008/052855 2007-03-08 2008-02-20 照明装置並びにそれを用いた欠陥検査装置及びその方法並びに高さ計測装置及びその方法 WO2008108174A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007057975A JP5581563B2 (ja) 2007-03-08 2007-03-08 照明装置並びにそれを用いた欠陥検査装置及びその方法並びに高さ計測装置及びその方法
JP2007-057975 2007-03-08

Publications (1)

Publication Number Publication Date
WO2008108174A1 true WO2008108174A1 (ja) 2008-09-12

Family

ID=39738071

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/052855 WO2008108174A1 (ja) 2007-03-08 2008-02-20 照明装置並びにそれを用いた欠陥検査装置及びその方法並びに高さ計測装置及びその方法

Country Status (2)

Country Link
JP (1) JP5581563B2 (ja)
WO (1) WO2008108174A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012014358A1 (ja) * 2010-07-30 2012-02-02 株式会社日立ハイテクノロジーズ 欠陥検査装置および欠陥検査方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104136881B (zh) * 2012-02-03 2017-08-29 独立行政法人产业技术综合研究所 计测物品表面上的突起或突条的高度的方法及用于该方法的装置
US9255891B2 (en) * 2012-11-20 2016-02-09 Kla-Tencor Corporation Inspection beam shaping for improved detection sensitivity
JP2015096837A (ja) * 2013-11-15 2015-05-21 株式会社島津製作所 表面形状計測装置
US9947118B2 (en) 2014-05-28 2018-04-17 Indian Institute Of Technology Delhi Non-interferometric phase measurement
EP3929529B1 (en) * 2019-02-21 2024-09-25 Nikon Corporation Surface position detection device, exposure apparatus, substrate-processing system, and device-manufacturing method
JP7693132B2 (ja) * 2023-06-01 2025-06-16 三菱電機株式会社 生体成分測定装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6357731B2 (ja) * 1980-05-16 1988-11-14 Hitachi Seisakusho Kk
JPH0319528B2 (ja) * 1984-12-25 1991-03-15 Fujitsu Ltd
JPH0339604B2 (ja) * 1985-12-18 1991-06-14 Fujitsu Ltd
JP2843308B2 (ja) * 1996-08-16 1999-01-06 株式会社川口光学産業 レーザー十字スリット発生装置
JPH11183154A (ja) * 1997-12-19 1999-07-09 Hitachi Ltd 電子線式検査または測定装置およびその方法並びに光学的高さ検出装置
JP2000105203A (ja) * 1998-07-28 2000-04-11 Hitachi Ltd 欠陥検査装置およびその方法
JP3051609B2 (ja) * 1993-09-01 2000-06-12 三菱重工業株式会社 燃料集合体の外観検査装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4183492B2 (ja) * 2002-11-27 2008-11-19 株式会社日立製作所 欠陥検査装置および欠陥検査方法
JP4171399B2 (ja) * 2003-10-30 2008-10-22 住友重機械工業株式会社 レーザ照射装置
JP4567984B2 (ja) * 2004-01-30 2010-10-27 株式会社 日立ディスプレイズ 平面表示装置の製造装置
JP5072197B2 (ja) * 2004-06-18 2012-11-14 株式会社半導体エネルギー研究所 レーザ照射装置およびレーザ照射方法
JP2006162500A (ja) * 2004-12-09 2006-06-22 Hitachi High-Technologies Corp 欠陥検査装置
CN101175986B (zh) * 2005-04-06 2010-10-13 康宁股份有限公司 玻璃检测系统及其使用方法
JP4988223B2 (ja) * 2005-06-22 2012-08-01 株式会社日立ハイテクノロジーズ 欠陥検査装置およびその方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6357731B2 (ja) * 1980-05-16 1988-11-14 Hitachi Seisakusho Kk
JPH0319528B2 (ja) * 1984-12-25 1991-03-15 Fujitsu Ltd
JPH0339604B2 (ja) * 1985-12-18 1991-06-14 Fujitsu Ltd
JP3051609B2 (ja) * 1993-09-01 2000-06-12 三菱重工業株式会社 燃料集合体の外観検査装置
JP2843308B2 (ja) * 1996-08-16 1999-01-06 株式会社川口光学産業 レーザー十字スリット発生装置
JPH11183154A (ja) * 1997-12-19 1999-07-09 Hitachi Ltd 電子線式検査または測定装置およびその方法並びに光学的高さ検出装置
JP2000105203A (ja) * 1998-07-28 2000-04-11 Hitachi Ltd 欠陥検査装置およびその方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012014358A1 (ja) * 2010-07-30 2012-02-02 株式会社日立ハイテクノロジーズ 欠陥検査装置および欠陥検査方法
JP2012032252A (ja) * 2010-07-30 2012-02-16 Hitachi High-Technologies Corp 欠陥検査装置および欠陥検査方法
US8804110B2 (en) 2010-07-30 2014-08-12 Hitachi High-Technologies Corporation Fault inspection device and fault inspection method

Also Published As

Publication number Publication date
JP2008216219A (ja) 2008-09-18
JP5581563B2 (ja) 2014-09-03

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