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WO2009022765A1 - Dispositif de distribution de suspension en continu et de manière non interruptible et son procédé - Google Patents

Dispositif de distribution de suspension en continu et de manière non interruptible et son procédé Download PDF

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Publication number
WO2009022765A1
WO2009022765A1 PCT/KR2007/005402 KR2007005402W WO2009022765A1 WO 2009022765 A1 WO2009022765 A1 WO 2009022765A1 KR 2007005402 W KR2007005402 W KR 2007005402W WO 2009022765 A1 WO2009022765 A1 WO 2009022765A1
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WO
WIPO (PCT)
Prior art keywords
slurry
pressure
dispense
dispenseing
open
Prior art date
Application number
PCT/KR2007/005402
Other languages
English (en)
Inventor
Yoon Won Han
Original Assignee
Plus Tech Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Plus Tech Co., Ltd. filed Critical Plus Tech Co., Ltd.
Publication of WO2009022765A1 publication Critical patent/WO2009022765A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof

Definitions

  • the present invention relates to a continuous and uninterruptible slurry dispense device and a method thereof. More particularly, the present invention relates to a continuous and uninterruptible slurry dispense device for setting two out of four pressure vessels as a drive unit and the other two thereof as a standby unit, and preventing slurry dispense interruption and minimizing variation of pressure and stream flow in the dispense pipe, thereby minimizing the influences that may cause a problem on a wafer when the previous unit generates a problem and the system is about to be stopped.
  • a chemical mechanical polishing (CMP) process is used in the semiconductor manufacturing process for planarizing a wafer surface through a chemical and physical reaction, and the CMP process supplies the slurry while the wafer is contacted on the elastic pad surface to thereby chemically react the wafer surface and physically planarize the protrusions and depressions on the wafer surface.
  • CMP chemical mechanical polishing
  • the slurry dispense device for mixing and dispenseing the slurry, de-ionized water (DIW), and chemicals uses a pump method and a nitrogen pressurization method.
  • three pressure tanks are set to be a single unit and dispense the slurry by repeatedly performing the filling, dispenseing, and returning process, and the slurry is no longer dispensed when one of the three processes generates a problem.
  • the reasons that the dispense is stopped include malfunction of valves or sensors and interruption of nitrogen dispense, and in order to process the interruption, two identical systems each having the entire devices, including three pressure tankls, are installed, and the second system is substituted with the first one when the first system causes a problem. In this case, the substitution of the systems is set to be manually performed by an operator.
  • the installation fee is very expensive, the cost for driving the systems and the maintenance fee are increased, and the space for installing the systems is doubled.
  • the present invention has been made in an effort to provide a continuous slurry dispense device for setting two units, each of which has two pressure vessels, substituting a malfunctioning one with a new one to prevent interruption of the slurry dispense, and minimizing variation of pressure and flow to minimize the factors that may cause scratches or process non-uniformity (large or small) on the wafer.
  • the present invention has been made in another effort to provide a uninterruptible slurry dispense device for setting two units (a drive unit and a standby unit), each of which has two pressure vessels, so as to use the same pressure source, dispensing the slurry to one unit in cooperation with each other, sensing the height of the slurry to perform sequential switching between the pressure vessels, sensing the pressure difference of a slurry loop tube to change the drive unit and the standby unit sequentially, and hence, preventing interruption of the slurry dispense and minimizing variation of pressure and flow to minimize the factors that may cause scratches or process non-uniformity (large or small) on the wafer.
  • a continuous and uninterruptible slurry dispense device includes: four pressure vessels, two of which respectively configure a pair as a drive unit and a standby unit, and in which level sensors are installed in divided areas; a slurry circulating pipe for circulating slurry dispensed by a slurry dispense source to a CMP process and the pressure vessels, and having a flow transducer; four dispense connection pipes for connecting the slurry circulating pipe before the CMP process and the pressure vessels in parallel, and respectively having a dispense open/close valve; four filling connection pipes for connecting the slurry circulating pipe after the CMP process and the pressure vessels in parallel, and respectively having a filling open/close valve; a pressurizing pipe for transmitting the pressure to the pressure vessels from a pressurizing source; four pressurizing connection pipes for connecting the pressurizing pipe and the pressure vessels in parallel, and respectively having a pressurizing open/close valve; and an exhaust connection pipe connected to the pressure vessels
  • the slurry circulating pipe includes a flow transducer.
  • the pressure vessels include a plurality of level sensors for sensing the amount of filled slurry.
  • the open/close value has a dual- type configuration so as to minimize malfunctions.
  • the continuous and uninterruptible slurry dispense device may further include: an exhaust pipe connected to the exhaust connection pipe and including a pressure control valve for controlling the displacement volume of the exhausted pressure; and a pressure sensor installed in the slurry circulating pipe after the CMP process and measuring pressure of the slurry.
  • a continuous and uninterruptible slurry dispense method includes: dispenseing slurry through a slurry circulating pipe from a slurry dispense source to thus perform an initial dispense step; filling slurry that is circulated through the slurry circulating pipe into a first pressure vessel from among pressure vessels of a drive unit to thus perform a filling step; dispenseing slurry of the first pressure vessel to a CMP process, and filling the slurry that is circulated through the slurry circulating pipe into a second pressure vessel from among pressure vessels of the drive unit to thus perform a first dispenseing step; dispenseing the slurry of the second pressure vessel to the CMP process and filling the slurry that is circulated through the slurry circulating pipe into the first pressure vessel when the amount of slurry of the first pressure vessel is insufficient to thus perform a second dispenseing step; repeating the first dispenseing step and the second dispenseing step
  • the filling step and the re-filling step include opening a filling open/close valve and an exhaust open/close valve installed in a filling connection pipe and an exhaust connection pipe connected to the first pressure vessel or the second pressure vessel, and filling the slurry that is circulated in the slurry circulating pipe into the first pressure vessel or the second pressure vessel while closing a dispense open/close valve and a pressurizing open/close valve installed in the dispense connection pipe and the pressurizing connection pipe.
  • the first dispenseing step is performed while opening the first dispense open/close valve installed in the first dispense connection pipe connected to the first pressure vessel and the first pressurizing open/close valve installed in the first pressurizing connection pipe, closing the first filling open/close valve installed in the first filling connection pipe and the first exhaust open/close valve installed in the first exhaust connection pipe, closing the second dispense open/close valve installed in the second dispense connection pipe connected to the second pressure vessel and the second pressurizing open/close valve installed in the second pressurizing connection pipe, opening the second filling open/close valve installed in the second filling connection pipe and the second exhaust open/close valve installed in the second exhaust connection pipe, and closing the open/close valves of the standby unit.
  • the second dispenseing step is performed while opening the second dispense open/ close valve installed in the second dispense connection pipe connected to the second pressure vessel and the second pressurizing open/close valve installed in the second pressurizing connection pipe, closing the second filling open/close valve installed in the second filling connection pipe and the second exhaust open/close valve installed in the second exhaust connection pipe, closing the first dispense open/close valve installed in the first dispense connection pipe connected to the first pressure vessel and the first pressurizing open/close valve installed in the first pressurizing connection pipe, opening the first filling open/close valve installed in the first filling connection pipe and the first exhaust open/close valve installed in the first exhaust connection pipe, and closing the open/close valves of the standby unit. Switching between the first dispenseing step and the second dispenseing step is performed corresponding to a signal sensed by a level sensor installed in the pressure vessel.
  • the change of flow and pressure is minutely maintained when the pressure vessel is switched, and it is possible to minimize the factors that may cause a problem such as a scratch or un-uniform process (large or small) on the wafer.
  • the flow and pressure dispensed through the slurry circulating pipe is allowed since it is possible to maintain the pressure of the pressure vessel by controlling the open degree of the pressure control value that is installed in the exhaust pipe according to the pressure measured by the pressure sensor installed in the slurry circulating pipe after the CMP process.
  • FIG. 1 shows a block diagram of a continuous and uninterruptible slurry dispense device according to an exemplary embodiment of the present invention.
  • FIG. 2 shows a block diagram of a dispense open/close valve based on a dual-type solenoid valve in a continuous and uninterruptible slurry dispense device according to an exemplary embodiment of the present invention.
  • FIG. 3 shows a flowchart for a continuous slurry dispense method according to an exemplary embodiment of the present invention.
  • FIG. 4 shows a flowchart for a continuous slurry dispense method according to an exemplary embodiment of the present invention.
  • FIG. 5 shows a flowchart for a changing method in a continuous slurry dispense method according to an exemplary embodiment of the present invention.
  • FIG. 6 shows a flowchart for another changing method in a continuous slurry dispense method according to an exemplary embodiment of the present invention.
  • FIG. 7 shows a continuous slurry dispense device according to another exemplary embodiment of the present invention.
  • the continuous and uninterruptible slurry dispense device includes four pressure vessels 10, 20, 30, and 40, two of which respectively form a unit, a slurry circulating pipe 50 for receiving slurry from a slurry dispense source 2 and circulating the slurry to a CMP process unit 4 and the pressure vessels 10, 20, 30, and 40, and a pressurizing pipe 70 for transmitting the pressure provided by a pressurizing source 6 to the pressure vessels 10, 20, 30, and 40.
  • the slurry circulating pipe 50 includes flow transducers 54 and 56.
  • the flow transducers 54 and 56 can be respectively installed at a point before the
  • the flow transducers 54 and 56 measure the flow of slurry flowing through the slurry circulating pipe 50, and a flowmeter can also be used.
  • the pressure sensors 55 and 57 are installed prior to the flow transducers 54 and 56 installed in the slurry circulating pipe 50 in the slurry flow direction.
  • the flow transducers 54 and 56 and the pressure sensors 55 and 57 are installed in pairs, it is possible to measure and analyze the flow and pressure at a predetermined point, and hence, it is possible to further accurately determine and process the flow of slurry.
  • the pressure sensors 55 and 57 can be configured by using various pressure m easuring devices, such as a pressure sensor, no detailed description will be provided.
  • the four pressure vessels 10, 20, 30, and 40 are installed in parallel, and the first pressure vessel 10 and the second pressure vessel 20, which form a first unit, configure a drive unit, while the first pressure vessel 30 and the second pressure vessel 40, which form a second unit, configure a standby unit.
  • a plurality of level sensors 91, 92, 93, 94, and 95 for sensing the filled amount of slurry are installed in each pressure vessel 10, 20, 30, and 40.
  • the level sensors 91, 92, 93, 94, are 95 are installed at different locations in each respective pressure vessel 10, 20, 30, and 40 so as to sense the filled amount of the slurry at respective locations.
  • least level sensors 91 are installed at the bottoms of the pressure vessels
  • less level sensors 92 are installed at a higher location compared to the least level sensors 91
  • middle level sensors 93 are installed at middle locations
  • greatest level sensors 95 are installed at the tops of the pressure vessels 10, 20, 30, and 40
  • great level sensors 94 are installed at a lower location compared to the greatest level sensors 95.
  • the level sensors 91, 92, 93, 94, and 95 are configured and installed as described above, sensitivity of the level sensors 91, 92, 93, 94, and 95 is deteriorated, and hence, it is possible to check the case in which a malfunction that cannot transmit an accurate signal is generated. For example, when the less level sensor 92 and the great level sensor 94 sense the signal and the middle level sensor 93 does not sense the signal, the middle level sensor 93 is determined to have malfunctioned.
  • the slurry mixed by the slurry dispense source 2 is applied to the slurry circulating pipe 50.
  • the slurry dispense source 2 can fill the mixed slurry into the pressure vessels 10, 20, 30, and 40 and pressurize the same by using a pressurizing source 6, such as nitrogen gas, so that the slurry may be dispensed to the slurry circulating pipe 50.
  • a pressurizing source 6 such as nitrogen gas
  • the slurry circulating pipe 50 configures a main loop through which the slurry moves and circulates.
  • the CMP process unit 4 is configured to receive and use the slurry that is circulated through the slurry circulating pipe 50.
  • the slurry circulating pipe 50 and the pressure vessels 10, 20, 30, and 40 are coupled in parallel through four dispense connection pipes 12, 22, 32, and 42.
  • Dispense open/close valves 13, 23, 33, and 43 are installed in the dispense connection pipes 12, 22, 32, and 42.
  • the dispense open/close valves 13, 23, 33, and 43 are dual-types so as to minimize a malfunction, as shown in FIG. 2. That is, the dispense open/close valves 13, 23, 33, and 43 are respectively configured by using a dual-type solenoid valve.
  • air with a predetermined pressure is applied to both solenoid valves 62 and 64, pressure sensors
  • Pressurizing open/close valves 17, 27, 37, and 47 are installed in the respective pressurizing connection pipes 16, 26, 36, and 46.
  • the respective pressure vessels 10, 20, 30, and 40 are connected to exhaust connection pipes 18, 28, 38, and 48 for exhausting the pressure.
  • Exhaust open/close valves 19, 29, 39, and 49 are installed in the respective exhaust connection pipes 18, 28, 38, and 48.
  • the exhaust connection pipe 38 connected to the first pressure vessel 30 and the exhaust connection pipe 48 connected to the second pressure vessel 40 forming the standby unit are combined to exhaust the pressure through another exhaust pipe 80.
  • the continuous slurry dispense method includes an initial dispense step (SlO) for dispenseing slurry from the slurry dispense source 2 through the slurry circulating pipe 50, a filling step (S20) for filling the slurry that is circulated through the slurry circulating pipe 50 into the first pressure vessel 10 of the drive unit, a first dispenseing step (S30) for filling the slurry that is circulated through the slurry circulating pipe 50 into the second pressure vessel 20 while dispenseing the slurry of the first pressure vessel 10, and a second dispenseing step (S40) for filling the slurry that is circulated through the slurry circulating pipe 50 into the first pressure vessel 10 while dispenseing the slurry of the second pressure vessel 20.
  • SlO initial dispense step
  • S20 filling step
  • S30 for filling the slurry that is circulated through the slurry circulating pipe 50 into the second pressure vessel 20 while dispenseing the slurry of
  • the filling step (S20) includes opening the first filling open/close valve 15 and the first exhaust open/close valve 19 respectively connected to the first filling connection pipe 14 and the first exhaust connection pipe 18 connected to the first pressure vessel 10, and filling the slurry that circulates in the slurry circulating pipe 50 into the first pressure vessel 10 while closing the first dispense open/close valve 13 and the first pressurizing open/close valve 17 respectively installed in the first dispense connection pipe 12 and the first pressurizing connection pipe 16.
  • the first dispenseing step (S30) includes opening the first dispense open/close valve
  • the first dispenseing step (S30) includes closing the second dispense open/close valve 23 installed in the second dispense connection pipe 22 connected to the second pressure vessel 20 and the second pressurizing open/close valve 27 installed in the second pressurizing connection pipe 26, and opening the second filling open/close valve 25 installed in the second filling connection pipe 24 and the second exhaust open/close valve 29 installed in the second exhaust connection pipe 28.
  • the first dispenseing step (S30) is performed while the first pressure vessel 30 of the standby unit and all the open/close valves 33, 35, 37, 39, 43, 45, 47, and 49 of the second pressure vessel 40 are closed.
  • the first dispenseing step (S30) is configured to be continued when the slurry remaining in the first pressure vessel 10 is greater than the less amount. That is, the first dispenseing step (S30) is configured to be progressed from the time when the amount of slurry is sensed by the less level sensor 92 to the time when the same is not sensed thereby while the amount of slurry is sensed by the least level sensor 91 of the first pressure vessel 10 and is not sensed by the middle level sensor 93 and the great level sensor 94.
  • the second dispenseing step (S40) includes, when the amount of slurry filled in the first pressure vessel 10 is insufficient, filling the slurry that is circulated from the CMP process unit 4 through the slurry circulating pipe 50 into the first pressure vessel 10 through the first filling connection pipe 14 while dispenseing the slurry of the second pressure vessel 20 to the CMP process unit 4 through the second dispense connection pipe 22 and the slurry circulating pipe 50.
  • the second dispenseing step (S40) includes opening the second dispense open/close valve 23 installed in the second dispense connection pipe 22 connected to the second pressure vessel 20 and the second pressurizing open/close valve 27 installed in the second pressurizing connection pipe 26, and closing the second filling open/close valve 25 installed in the second filling connection pipe 24 and the second exhaust open/close valve 29 installed in the second exhaust connection pipe 28.
  • the second dispenseing step (S40) includes closing the first dispense open/close valve 13 installed in the first dispense connection pipe 12 connected to the first pressure vessel 10 and the first pressurizing open/close valve 17 installed in the first pressurizing connection pipe 16, and opening the first filling open/close valve 15 installed in the first filling connection pipe 14 and the first exhaust open/close valve 19 installed in the first exhaust connection pipe 18.
  • the second dispenseing step (S40) is performed while the first pressure vessel 30 of the standby unit and all the open/close valves 33, 35, 37, 39, 43, 45, 47, and 49 of the second pressure vessel 40 are closed.
  • the second dispenseing step (S40) is configured to be progressed when the amount of slurry remaining in the second pressure vessel 20 is greater than the less amount of slurry. That is, the second dispenseing step (S40) is configured to be progressed from the time when the amount of slurry is sensed by the less level sensor 92 to the time when the same is not sensed thereby while the amount of slurry is sensed by the least level sensor 91 of the second pressure vessel 20 and is not sensed by the middle level sensor 93 and the great level sensor 94.
  • the first dispenseing step (S30) and the second dispenseing step (S40) are configured to be repeated.
  • (S40) is performed corresponding to a signal sensed by the level sensors 91, 92, 93, 94, and 95 installed in the first pressure vessel 10 and the second pressure vessel 20.
  • the step is configured to be switched to the second dispenseing step
  • the step is configured to be switched to the first dispenseing step (S30) when the slurry of the second pressure vessel 20 is sensed to remain lower than the location of the less level sensor 92 in the second dispenseing step (S40).
  • the continuous slurry dispense method further includes a re-filling step (S50) for filling the second pressure vessel 20 or the first pressure vessel 10 while dispenseing and circulating the slurry through the slurry circulating pipe 50 from the slurry dispense source 2 when the amount of slurry filled in the second pressure vessel 20 in the first dispenseing step (S30) is insufficient or the amount of slurry filled in the first pressure vessel 10 in the second dispenseing step (S40) is insufficient.
  • S50 re-filling step for filling the second pressure vessel 20 or the first pressure vessel 10 while dispenseing and circulating the slurry through the slurry circulating pipe 50 from the slurry dispense source 2 when the amount of slurry filled in the second pressure vessel 20 in the first dispenseing step (S30) is insufficient or the amount of slurry filled in the first pressure vessel 10 in the second dispenseing step (S40) is insufficient.
  • the re-filling step (S50) is configured so as to continuously fill the circulated slurry into the second pressure vessel 20 while dispenseing the slurry from the slurry dispense source 2 through the slurry circulating pipe 50.
  • the re-filling step (S50) includes opening the second filling open/close valve 25 and the second exhaust open/close valve 29 installed in the second filling connection pipe 24 and the second exhaust connection pipe 28 connected to the second pressure vessel 20, and filling the slurry that is circulated in the slurry circulating pipe 50 into the second pressure vessel 20 while closing the second dispense open/close valve 23 and the second pressurizing open/close valve 27 installed in the second dispense connection pipe 22 and the second pressurizing connection pipe 26.
  • the second dispenseing step (S40) cannot be switched to the first dispenseing step (S30) when the amount of slurry filled in the first pressure vessel 10 is not greater than the less amount (i.e., is less than the less amount) while the amount of slurry remaining in the second pressure vessel 20 is less than the less amount in the second dispenseing step (S40), the re-filling step (S50) is configured so as to continuously fill the circulated slurry into the first pressure vessel 10 while dispenseing the slurry from the slurry dispense source 2 through the slurry circulating pipe 50. In this case, the re-filling step (S50) is performed with the same condition as that of the filling step (S20).
  • the re-filling step (S50) is configured to be progressed when the less level sensor 92 fails to sense the amount of slurry while the greatest level sensors 91 installed in the first pressure vessel 10 and the second pressure vessel 20 sense the amount of slurry and the middle level sensors 93 and the great level sensors 94 do not sense the amount of slurry.
  • the uninterruptible slurry dispense method further includes a switching step (S60) for stopping the dispense of slurry from the drive unit when the drive unit generates a problem, dispenseing the slurry from the slurry dispense source 2 through the slurry circulating pipe 50, and starting the standby unit.
  • the switching step (S60) can be configured to perform the filling step (SlO) for the first pressure vessel 30 of the standby unit without performing the refilling step (S50) when the amounts of slurry in the first pressure vessel 10 and the second pressure vessel 20 of the drive unit are insufficient. Also, when the amounts of slurry filled in the first pressure vessel 30 and the second pressure vessel 40 are insufficient while the first dispenseing step (S30) and the second dispenseing step (S40) of the standby unit are repeated, it is possible to perform the filling step (SlO) for the first pressure vessel 10 for the drive unit.
  • the re-filling step (S50) of FIG. 4 is not performed, and the switching step (S60) for dispenseing the slurry to the slurry circulating pipe 50 from the slurry dispense source 2, stopping the drive unit, and operating the standby unit is performed.
  • the unit can be switched to the other unit (from the drive unit to the standby unit or from the standby unit to the drive unit).
  • the switching step (S60) it is possible to perform the switching step (S60) and operate the standby unit when the slurry remaining in the first pressure vessel 10 or the second pressure vessel 20 is greater than the less level sensor 92, a problem occurs, and the flows of the dispensed amount and the circulated amount sensed by the flow transducers 54 and 56 are less than a predetermined value while the filling step (S20), first dispenseing step (S30), second dispenseing step (S40), and the re-filling step (S50) of the drive unit are performed.
  • the switching step (S60) it is possible to perform the switching step (S60) and operate the drive unit when the slurry remaining in the first pressure vessel 30 or the second pressure vessel 40 is greater than the less level sensor 92, a problem occurs, and the flows of the dispensed amount and the circulated amount sensed by the flow transducers 54 and 56 are less than a predetermined value while the filling step (S20), first dispenseing step (S30), second dispenseing step (S40), and the re-filling step (S50) of the standby unit are performed.
  • the switching step (S60) is configured so that the drive unit may be automatically switched to the standby unit or the standby unit may be automatically switched to the drive unit (S60).
  • a continuous slurry dispense device installs a pressure control valve 82 for controlling the displacement volume exhausted to the exhaust pipe 80.
  • differential pressure exhaust valves 84 for quickly forming a differential pressure between the pressure control valves 82 and the first pressure vessels 10 and 30 and the second pressure vessels 20 and 40 in parallel are installed at the exhaust pipes
  • a pressure sensor 58 electrically connected to the pressure control valves 82 is installed after the CMP process unit 4 of the slurry circulating pipe 50.
  • Pressure indicating controllers 86 and electro pneumatic valves 88 are installed in series between the pressure control valves 82 and the pressure sensor 58.
  • the pressure indicating controllers 86 compare a predetermined value and the pressure measured by the pressure sensor 58 to determine a control output, and the electro pneumatic valves 88 convert the control output determined by the pressure indicating controllers 86 into air pressure and transmit the air pressure to the pressure control valves 82.
  • the pressure control valves 82 are configured to open or close the hydraulic line by the air pressure applied through the electro pneumatic valves 88.
  • the pressure is temporarily changed when the slurry dispense and filling (recovering) functions are switched between the first pressure vessels 10 and 30 and the second pressure vessels 20 and 40.
  • pressure is changed in the slurry circulating pipe 50 depending on whether the slurry is used in the CMP process unit 4, the pressure passing through the slurry circulating pipe 50 is measured by the pressure sensor 58 that is installed the point after the CMP process unit 4 (the point where the CMP process finishes), the measured pressure is transmitted to the pressure indicating controllers 86, the pressure indicating controllers 86 compare the predetermined pressure value and the measured pressure value to determine the control output amount and transmit the control output amount to the electro pneumatic valves 88, the electro pneumatic valves 88 convert the control output amount into corresponding air pressure and transmit the air pressure to the pressure control valves 82, and the pressure control valves 82 open or close (control the opened degree) the hydraulic lines corresponding to the applied air pressure.
  • the hydraulic lines of the pressure control valves 82 are reduced to control the pressure that is exhausted through the exhaust pipes 80 to be less.
  • the displacement volume is reduced and the internal pressure of a predetermined pressure vessel to which the slurry is recovered and filled is increased (the amount of filled slurry is reduced), the increased pressure is transmitted to the slurry circulating pipe 50 to increase the inner pressure of the slurry circulating pipe 50, a further amount of slurry can be dispensed to the CMP process unit 4, and the pressure of the slurry circulating pipe 50 is maintained.
  • the hydraulic lines of the pressure control valves 82 are increased to maintain the pressure that is exhausted through the exhaust pipes 80. Accordingly, the displacement volume is increased and the internal pressure of a predetermined pressure vessel to which the slurry is recovered and filled is decreased (the amount of filled slurry is increased), the decreased pressure is transmitted to the slurry circulating pipe 50 to decrease the inner pressure of the slurry circulating pipe 50, and the pressure of the slurry circulating pipe 50 is maintained when the CMP process unit 4 uses a smaller amount of slurry.
  • the pressure vessel for dispenseing the slurry e.g., the first pressure vessels 10 and 30
  • the slurry circulating pipe 50, and the pressure vessel (e.g., the second pressure vessels 20 and 40) for recovering (filling) the slurry have the same pressure and the flow reaches almost 0 (the pressure measured by the pressure sensor 58 is the same as the predetermined value and the flow measured by the flow transducer 56 is 0), the flow transducer 56 senses the flow, opens the differential pressure exhaust valves 84 for a predetermined time when there is no flow for a predetermined time, and thereby forms the differential pressure between the pressure vessel to which the slurry is dispensed and the pressure vessel in which the slurry is recovered (filled).
  • the differential pressure exhaust valves 84 are configured to be closed after they iare opened for a predetermined time, and the pressure control valves 82 are configured then to be operated and control the displacement volume through the exhaust pipes 80.
  • the differential pressure exhaust valves 84 are configured to be opened when it is required to quickly perform an exhaust process for a safety purpose. That is, the differential pressure exhaust valves 84 are configured to function as safety valves.
  • the continuous slurry dispense device can include the manual dispense valves 113, 123, 133, and 143 and the manual filling valves 115, 125, 135, and 145 in series to the dispense open/close valves 13, 23, 33, and 43 and the filling open/close valves 15, 25, 35, and 45.
  • the manual dispense valves 113, 123, 133, and 143 and manual filling valves 115, 125, 135, and 145 are applicable to the continuous and uninterruptible slurry dispense device according to the exemplary embodiment of the present invention.

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  • Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)

Abstract

L'invention concerne un dispositif de distribution d'une suspension de façon continue et non interruptible qui comprend : quatre cuves sous pression (10, 20, 30, 40) dont deux configurent respectivement une paire, sous la forme d'une unité d'entraînement et d'une unité d'attente et dans lesquelles des capteurs de niveau (91, 92, 93, 94) sont installés dans des zones séparées; un tuyau de mise en circulation de suspension (50) pour mettre en circulation la suspension distribuée par une source de distribution de suspension (2) jusqu'à un traitement de polissage chimico-mécanique PCM (4) et la cuve sous pression (10, 20, 30, 40), et ayant un transducteur d'écoulement (54, 56); quatre tuyaux de raccordement de distribution (12, 22, 32, 42) pour raccorder le tuyau de mise en circulation de suspension avant le traitement PCM (4) et les cuves sous pression (10, 20, 30, 40) en parallèle, et ayant respectivement une soupape d'ouverture/fermeture de distribution (13, 23, 33, 43); quatre tuyaux de raccordement de remplissage (14, 24, 34, 44) pour raccorder le tuyau de mise en circulation de suspension (50) après le traitement PCM (4) et les cuves sous pression (10, 20, 30, 40) en parallèle, ayant respectivement une soupape d'ouverture/fermeture de remplissage (15, 25, 35; 45); un tuyau de mise sous pression (70) pour transmettre la pression aux cuves sous pression (10, 20, 30, 40) à partir d'une source de mise sous pression (6); quatre tuyaux de raccordement de mise sous pression (16, 26, 36, 46) pour raccorder le tuyau de mise sous pression (70) et les cuves sous pression (10, 20, 30, 40) en parallèle, ayant respectivement une soupape d'ouverture/fermeture de mise sous pression (17, 27, 37, 47); et un tuyau de raccordement d'échappement (80) raccordé aux cuves sous pression (10, 20, 30, 40) pour aspirer la pression et ayant une soupape d'ouverture/fermeture d'échappement (19, 29, 39, 49).
PCT/KR2007/005402 2007-08-13 2007-10-30 Dispositif de distribution de suspension en continu et de manière non interruptible et son procédé WO2009022765A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2007-0081215 2007-08-13
KR1020070081215A KR100893109B1 (ko) 2007-08-13 2007-08-13 슬러리 연속 공급장치 및 그 방법

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WO2009022765A1 true WO2009022765A1 (fr) 2009-02-19

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PCT/KR2007/005402 WO2009022765A1 (fr) 2007-08-13 2007-10-30 Dispositif de distribution de suspension en continu et de manière non interruptible et son procédé

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KR (1) KR100893109B1 (fr)
TW (1) TWI340062B (fr)
WO (1) WO2009022765A1 (fr)

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CN110173626A (zh) * 2019-06-28 2019-08-27 恒力石化（大连）有限公司 一种pta精制装置浆料系统联运和互供控制系统

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US20060199480A1 (en) * 1998-11-24 2006-09-07 Matsushita Electric Industrial Co., Ltd. Apparatus and method for feeding slurry

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JP3382138B2 (ja) * 1997-08-21 2003-03-04 富士通株式会社 薬液供給装置及び薬液供給方法
JP3774688B2 (ja) 2002-09-03 2006-05-17 エム・エフエスアイ株式会社 スラリー供給方法及びスラリー供給装置
KR100692910B1 (ko) * 2005-07-26 2007-03-12 비아이 이엠티 주식회사 슬러리 공급장치를 위한 보완 장치 및 방법
KR20080011910A (ko) * 2006-08-01 2008-02-11 세메스 주식회사 약액 혼합 장치 및 방법

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Publication number Priority date Publication date Assignee Title
US20060199480A1 (en) * 1998-11-24 2006-09-07 Matsushita Electric Industrial Co., Ltd. Apparatus and method for feeding slurry

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110173626A (zh) * 2019-06-28 2019-08-27 恒力石化（大连）有限公司 一种pta精制装置浆料系统联运和互供控制系统
CN110173626B (zh) * 2019-06-28 2024-02-13 恒力石化（大连）有限公司 一种pta精制装置浆料系统联运和互供控制系统

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KR100893109B1 (ko) 2009-04-10
TW200906551A (en) 2009-02-16
TWI340062B (en) 2011-04-11
KR20090016895A (ko) 2009-02-18

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