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WO2009038166A1 - Epoxy resin composition - Google Patents

Epoxy resin composition Download PDF

Info

Publication number
WO2009038166A1
WO2009038166A1 PCT/JP2008/066965 JP2008066965W WO2009038166A1 WO 2009038166 A1 WO2009038166 A1 WO 2009038166A1 JP 2008066965 W JP2008066965 W JP 2008066965W WO 2009038166 A1 WO2009038166 A1 WO 2009038166A1
Authority
WO
WIPO (PCT)
Prior art keywords
epoxy resin
resin composition
insulating layer
roughened surface
epoxy
Prior art date
Application number
PCT/JP2008/066965
Other languages
French (fr)
Japanese (ja)
Inventor
Shigeo Nakamura
Kenji Kawai
Original Assignee
Ajinomoto Co., Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Co., Inc. filed Critical Ajinomoto Co., Inc.
Priority to JP2009533193A priority Critical patent/JP5446866B2/en
Priority to KR1020107008608A priority patent/KR101511495B1/en
Publication of WO2009038166A1 publication Critical patent/WO2009038166A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L29/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical; Compositions of hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Compositions of derivatives of such polymers
    • C08L29/14—Homopolymers or copolymers of acetals or ketals obtained by polymerisation of unsaturated acetals or ketals or by after-treatment of polymers of unsaturated alcohols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L31/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid or of a haloformic acid; Compositions of derivatives of such polymers
    • C08L31/02—Homopolymers or copolymers of esters of monocarboxylic acids
    • C08L31/04—Homopolymers or copolymers of vinyl acetate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C08J2363/02—Polyglycidyl ethers of bis-phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Reinforced Plastic Materials (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)

Abstract

Disclosed is an epoxy resin composition suitable for an insulating layer of a multilayer printed wiring board. This epoxy resin composition enables to obtain an insulating layer with excellent flame retardance, which insulating layer has a roughened surface exhibiting high adhesion to a plated conductor even though the roughness degree of the roughened surface after roughening treatment is relatively low. Specifically disclosed is an epoxy resin composition characterized by containing (A) an epoxy resin, (B) an epoxy curing agent, (C) a phenoxy resin and/or a polyvinyl acetal resin, and (D) a phosphorus-containing benzoxazine compound.
PCT/JP2008/066965 2007-09-21 2008-09-19 Epoxy resin composition WO2009038166A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009533193A JP5446866B2 (en) 2007-09-21 2008-09-19 Epoxy resin composition
KR1020107008608A KR101511495B1 (en) 2007-09-21 2008-09-19 Epoxy resin composition

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-245801 2007-09-21
JP2007245801 2007-09-21

Publications (1)

Publication Number Publication Date
WO2009038166A1 true WO2009038166A1 (en) 2009-03-26

Family

ID=40467975

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/066965 WO2009038166A1 (en) 2007-09-21 2008-09-19 Epoxy resin composition

Country Status (4)

Country Link
JP (1) JP5446866B2 (en)
KR (1) KR101511495B1 (en)
TW (1) TWI433887B (en)
WO (1) WO2009038166A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010258419A (en) * 2009-03-31 2010-11-11 Sumitomo Bakelite Co Ltd Resin composition for wiring board, and resin sheet for wiring board
US9120293B2 (en) 2011-03-31 2015-09-01 Seiku Chemical Co., Ltd. Preliminary-cured material, roughened preliminary-cured material, and laminated body
WO2019003820A1 (en) * 2017-06-28 2019-01-03 Dic株式会社 Active ester composition and semiconductor sealing material
JP2021084968A (en) * 2019-11-28 2021-06-03 住友ベークライト株式会社 Resin membrane with substrate, printed wiring board and electronic device
JP2021119634A (en) * 2017-02-14 2021-08-12 味の素株式会社 Circuit board

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101377312B1 (en) * 2012-12-26 2014-03-25 주식회사 두산 Epoxy resin composition having an excellent adhesive property and copper foil with resin
KR101929588B1 (en) * 2012-12-31 2018-12-17 도레이첨단소재 주식회사 Plastic Films for Transparent Flexible Substrates
KR102338982B1 (en) 2016-06-27 2021-12-14 코오롱인더스트리 주식회사 Curable resin composition, prepreg and substrate using the same
CN106700548B (en) * 2016-12-30 2019-04-30 广东生益科技股份有限公司 A kind of preparation method containing benzoxazine resin composition and the prepreg and laminate being made from it
JP6870544B2 (en) * 2017-09-04 2021-05-12 味の素株式会社 Resin composition
JP7279319B2 (en) * 2017-09-04 2023-05-23 味の素株式会社 resin composition

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001181375A (en) * 1999-10-13 2001-07-03 Ajinomoto Co Inc Epoxy resin composition, adhesive film and pre-preg thereby, multilayer printed circuit board using same and its producing method
JP2003012894A (en) * 2001-07-03 2003-01-15 Hitachi Chem Co Ltd Epoxy resin composition, and insulation resin sheet and printed wiring board using the same
JP2003011269A (en) * 2001-06-28 2003-01-15 Hitachi Chem Co Ltd Manufacturing method of insulating material with copper leaf
JP2004528285A (en) * 2001-01-22 2004-09-16 バンティコ　アクチエンゲゼルシャフト Flame retardant
JP2005272722A (en) * 2004-03-25 2005-10-06 Tamura Kaken Co Ltd Thermosetting resin composition, resin film and product
WO2008010429A1 (en) * 2006-07-20 2008-01-24 Showa Highpolymer Co., Ltd. Phosphorus-containing benzoxazine compound, process for production thereof, curable resin composition, cured article, and laminate plate
JP2008037957A (en) * 2006-08-03 2008-02-21 Tamura Kaken Co Ltd Thermosetting resin composition, b-stage resin film and multilayer build-up substrate

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001181375A (en) * 1999-10-13 2001-07-03 Ajinomoto Co Inc Epoxy resin composition, adhesive film and pre-preg thereby, multilayer printed circuit board using same and its producing method
JP2004528285A (en) * 2001-01-22 2004-09-16 バンティコ　アクチエンゲゼルシャフト Flame retardant
JP2003011269A (en) * 2001-06-28 2003-01-15 Hitachi Chem Co Ltd Manufacturing method of insulating material with copper leaf
JP2003012894A (en) * 2001-07-03 2003-01-15 Hitachi Chem Co Ltd Epoxy resin composition, and insulation resin sheet and printed wiring board using the same
JP2005272722A (en) * 2004-03-25 2005-10-06 Tamura Kaken Co Ltd Thermosetting resin composition, resin film and product
WO2008010429A1 (en) * 2006-07-20 2008-01-24 Showa Highpolymer Co., Ltd. Phosphorus-containing benzoxazine compound, process for production thereof, curable resin composition, cured article, and laminate plate
JP2008037957A (en) * 2006-08-03 2008-02-21 Tamura Kaken Co Ltd Thermosetting resin composition, b-stage resin film and multilayer build-up substrate

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010258419A (en) * 2009-03-31 2010-11-11 Sumitomo Bakelite Co Ltd Resin composition for wiring board, and resin sheet for wiring board
US9120293B2 (en) 2011-03-31 2015-09-01 Seiku Chemical Co., Ltd. Preliminary-cured material, roughened preliminary-cured material, and laminated body
JP2021119634A (en) * 2017-02-14 2021-08-12 味の素株式会社 Circuit board
JP7259889B2 (en) 2017-02-14 2023-04-18 味の素株式会社 circuit board
WO2019003820A1 (en) * 2017-06-28 2019-01-03 Dic株式会社 Active ester composition and semiconductor sealing material
CN110785399A (en) * 2017-06-28 2020-02-11 Dic株式会社 Active ester composition and semiconductor sealing material
JPWO2019003820A1 (en) * 2017-06-28 2020-04-30 Dic株式会社 Active ester composition and semiconductor sealing material
JP7276665B2 (en) 2017-06-28 2023-05-18 Dic株式会社 Active ester composition and semiconductor encapsulation material
JP2021084968A (en) * 2019-11-28 2021-06-03 住友ベークライト株式会社 Resin membrane with substrate, printed wiring board and electronic device
JP7562944B2 (en) 2019-11-28 2024-10-08 住友ベークライト株式会社 Resin film with substrate, printed wiring board and electronic device

Also Published As

Publication number Publication date
KR20100065385A (en) 2010-06-16
KR101511495B1 (en) 2015-04-13
TW200923007A (en) 2009-06-01
TWI433887B (en) 2014-04-11
JPWO2009038166A1 (en) 2011-01-06
JP5446866B2 (en) 2014-03-19

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