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WO2009038166A1 - Composition de résine époxy - Google Patents

Composition de résine époxy Download PDF

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Publication number
WO2009038166A1
WO2009038166A1 PCT/JP2008/066965 JP2008066965W WO2009038166A1 WO 2009038166 A1 WO2009038166 A1 WO 2009038166A1 JP 2008066965 W JP2008066965 W JP 2008066965W WO 2009038166 A1 WO2009038166 A1 WO 2009038166A1
Authority
WO
WIPO (PCT)
Prior art keywords
epoxy resin
resin composition
insulating layer
roughened surface
epoxy
Prior art date
Application number
PCT/JP2008/066965
Other languages
English (en)
Japanese (ja)
Inventor
Shigeo Nakamura
Kenji Kawai
Original Assignee
Ajinomoto Co., Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Co., Inc. filed Critical Ajinomoto Co., Inc.
Priority to JP2009533193A priority Critical patent/JP5446866B2/ja
Priority to KR1020107008608A priority patent/KR101511495B1/ko
Publication of WO2009038166A1 publication Critical patent/WO2009038166A1/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L29/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical; Compositions of hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Compositions of derivatives of such polymers
    • C08L29/14—Homopolymers or copolymers of acetals or ketals obtained by polymerisation of unsaturated acetals or ketals or by after-treatment of polymers of unsaturated alcohols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L31/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid or of a haloformic acid; Compositions of derivatives of such polymers
    • C08L31/02—Homopolymers or copolymers of esters of monocarboxylic acids
    • C08L31/04—Homopolymers or copolymers of vinyl acetate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C08J2363/02—Polyglycidyl ethers of bis-phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Reinforced Plastic Materials (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)

Abstract

L'invention porte sur une composition de résine époxy appropriée pour une couche isolante d'une carte imprimée multicouche. Cette composition de résine époxy permet d'obtenir une couche isolante présentant un excellent retard de flamme, laquelle couche isolante a une surface rugueuse présentant une adhérence élevée à un conducteur plaqué même si le degré de rugosité de la surface rugueuse après traitement de rugosification est relativement faible. De façon spécifique, l'invention porte sur une composition de résine époxy caractérisée par le fait qu'elle contient (A) une résine époxy, (B) un agent de durcissement époxy, (C) une résine phénoxy et/ou une résine acétal de polyvinyle et (D) un composé benzoxazine contenant du phosphore.
PCT/JP2008/066965 2007-09-21 2008-09-19 Composition de résine époxy WO2009038166A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009533193A JP5446866B2 (ja) 2007-09-21 2008-09-19 エポキシ樹脂組成物
KR1020107008608A KR101511495B1 (ko) 2007-09-21 2008-09-19 에폭시 수지 조성물

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-245801 2007-09-21
JP2007245801 2007-09-21

Publications (1)

Publication Number Publication Date
WO2009038166A1 true WO2009038166A1 (fr) 2009-03-26

Family

ID=40467975

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/066965 WO2009038166A1 (fr) 2007-09-21 2008-09-19 Composition de résine époxy

Country Status (4)

Country Link
JP (1) JP5446866B2 (fr)
KR (1) KR101511495B1 (fr)
TW (1) TWI433887B (fr)
WO (1) WO2009038166A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010258419A (ja) * 2009-03-31 2010-11-11 Sumitomo Bakelite Co Ltd 配線板用樹脂組成物、および配線板用樹脂シート
US9120293B2 (en) 2011-03-31 2015-09-01 Seiku Chemical Co., Ltd. Preliminary-cured material, roughened preliminary-cured material, and laminated body
WO2019003820A1 (fr) * 2017-06-28 2019-01-03 Dic株式会社 Composition d'ester actif, et matériau de scellement de semi-conducteur
JP2021084968A (ja) * 2019-11-28 2021-06-03 住友ベークライト株式会社 基材付き樹脂膜、プリント配線基板および電子装置
JP2021119634A (ja) * 2017-02-14 2021-08-12 味の素株式会社 回路基板

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101377312B1 (ko) * 2012-12-26 2014-03-25 주식회사 두산 접착성이 우수한 에폭시 수지 조성물 및 이를 이용한 수지 복합 동박
KR101929588B1 (ko) * 2012-12-31 2018-12-17 도레이첨단소재 주식회사 투명 유연 기판용 플라스틱 필름
KR102338982B1 (ko) 2016-06-27 2021-12-14 코오롱인더스트리 주식회사 열경화성 수지 조성물, 이를 이용한 프리프레그 및 기판
CN106700548B (zh) * 2016-12-30 2019-04-30 广东生益科技股份有限公司 一种含有苯并噁嗪树脂组合物的制备方法及由其制成的预浸料和层压板
JP6870544B2 (ja) * 2017-09-04 2021-05-12 味の素株式会社 樹脂組成物
JP7279319B2 (ja) * 2017-09-04 2023-05-23 味の素株式会社 樹脂組成物

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001181375A (ja) * 1999-10-13 2001-07-03 Ajinomoto Co Inc エポキシ樹脂組成物並びに該組成物を用いた接着フィルム及びプリプレグ、及びこれらを用いた多層プリント配線板及びその製造法
JP2003012894A (ja) * 2001-07-03 2003-01-15 Hitachi Chem Co Ltd エポキシ樹脂組成物、それを用いた絶縁樹脂シート及びプリント配線板
JP2003011269A (ja) * 2001-06-28 2003-01-15 Hitachi Chem Co Ltd 銅箔付き絶縁材の製造方法
JP2004528285A (ja) * 2001-01-22 2004-09-16 バンティコ　アクチエンゲゼルシャフト 防炎加工剤
JP2005272722A (ja) * 2004-03-25 2005-10-06 Tamura Kaken Co Ltd 熱硬化性樹脂組成物、樹脂フィルムおよび製品
WO2008010429A1 (fr) * 2006-07-20 2008-01-24 Showa Highpolymer Co., Ltd. Composé de benzoxazine contenant du phosphore, son procédé de fabrication, composition de résine durcissable, article durci et plaque stratifiée
JP2008037957A (ja) * 2006-08-03 2008-02-21 Tamura Kaken Co Ltd 熱硬化性樹脂組成物、ｂステージ化した樹脂フィルムおよび多層ビルドアップ基板

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001181375A (ja) * 1999-10-13 2001-07-03 Ajinomoto Co Inc エポキシ樹脂組成物並びに該組成物を用いた接着フィルム及びプリプレグ、及びこれらを用いた多層プリント配線板及びその製造法
JP2004528285A (ja) * 2001-01-22 2004-09-16 バンティコ　アクチエンゲゼルシャフト 防炎加工剤
JP2003011269A (ja) * 2001-06-28 2003-01-15 Hitachi Chem Co Ltd 銅箔付き絶縁材の製造方法
JP2003012894A (ja) * 2001-07-03 2003-01-15 Hitachi Chem Co Ltd エポキシ樹脂組成物、それを用いた絶縁樹脂シート及びプリント配線板
JP2005272722A (ja) * 2004-03-25 2005-10-06 Tamura Kaken Co Ltd 熱硬化性樹脂組成物、樹脂フィルムおよび製品
WO2008010429A1 (fr) * 2006-07-20 2008-01-24 Showa Highpolymer Co., Ltd. Composé de benzoxazine contenant du phosphore, son procédé de fabrication, composition de résine durcissable, article durci et plaque stratifiée
JP2008037957A (ja) * 2006-08-03 2008-02-21 Tamura Kaken Co Ltd 熱硬化性樹脂組成物、ｂステージ化した樹脂フィルムおよび多層ビルドアップ基板

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010258419A (ja) * 2009-03-31 2010-11-11 Sumitomo Bakelite Co Ltd 配線板用樹脂組成物、および配線板用樹脂シート
US9120293B2 (en) 2011-03-31 2015-09-01 Seiku Chemical Co., Ltd. Preliminary-cured material, roughened preliminary-cured material, and laminated body
JP2021119634A (ja) * 2017-02-14 2021-08-12 味の素株式会社 回路基板
JP7259889B2 (ja) 2017-02-14 2023-04-18 味の素株式会社 回路基板
WO2019003820A1 (fr) * 2017-06-28 2019-01-03 Dic株式会社 Composition d'ester actif, et matériau de scellement de semi-conducteur
CN110785399A (zh) * 2017-06-28 2020-02-11 Dic株式会社 活性酯组合物和半导体密封材料
JPWO2019003820A1 (ja) * 2017-06-28 2020-04-30 Dic株式会社 活性エステル組成物及び半導体封止材料
JP7276665B2 (ja) 2017-06-28 2023-05-18 Dic株式会社 活性エステル組成物及び半導体封止材料
JP2021084968A (ja) * 2019-11-28 2021-06-03 住友ベークライト株式会社 基材付き樹脂膜、プリント配線基板および電子装置
JP7562944B2 (ja) 2019-11-28 2024-10-08 住友ベークライト株式会社 基材付き樹脂膜、プリント配線基板および電子装置

Also Published As

Publication number Publication date
KR20100065385A (ko) 2010-06-16
KR101511495B1 (ko) 2015-04-13
TW200923007A (en) 2009-06-01
TWI433887B (zh) 2014-04-11
JPWO2009038166A1 (ja) 2011-01-06
JP5446866B2 (ja) 2014-03-19

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