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WO2009038190A1 - Adhesive composition and bonded body - Google Patents

Adhesive composition and bonded body Download PDF

Info

Publication number
WO2009038190A1
WO2009038190A1 PCT/JP2008/067017 JP2008067017W WO2009038190A1 WO 2009038190 A1 WO2009038190 A1 WO 2009038190A1 JP 2008067017 W JP2008067017 W JP 2008067017W WO 2009038190 A1 WO2009038190 A1 WO 2009038190A1
Authority
WO
WIPO (PCT)
Prior art keywords
adhesive composition
bonded body
adhesive
melting point
disclosed
Prior art date
Application number
PCT/JP2008/067017
Other languages
French (fr)
Japanese (ja)
Inventor
Hiroyuki Izawa
Shigeki Katogi
Sunao Kudou
Tomoyasu Honda
Original Assignee
Hitachi Chemical Company, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Company, Ltd. filed Critical Hitachi Chemical Company, Ltd.
Priority to CN200880107505.0A priority Critical patent/CN101802118B/en
Priority to KR1020097017752A priority patent/KR101240009B1/en
Priority to JP2009533204A priority patent/JP5349316B2/en
Publication of WO2009038190A1 publication Critical patent/WO2009038190A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G2650/28—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type
    • C08G2650/56—Polyhydroxyethers, e.g. phenoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Combinations Of Printed Boards (AREA)
  • Wire Bonding (AREA)

Abstract

Disclosed is an adhesive composition containing a crystalline resin (a) having a melting point of 40-80˚C, a radically polymerizable compound (b) and a radical polymerization initiator (c). This adhesive composition is excellent in adhesive strength and handling property, while exhibiting stable performance after a reliability test.
PCT/JP2008/067017 2007-09-19 2008-09-19 Adhesive composition and bonded body WO2009038190A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN200880107505.0A CN101802118B (en) 2007-09-19 2008-09-19 Adhesive composition and bonded body
KR1020097017752A KR101240009B1 (en) 2007-09-19 2008-09-19 Adhesive composition and bonded body
JP2009533204A JP5349316B2 (en) 2007-09-19 2008-09-19 Adhesive composition and joined body

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007242217 2007-09-19
JP2007-242217 2007-09-19
JP2008071763 2008-03-19
JP2008-071763 2008-03-19

Publications (1)

Publication Number Publication Date
WO2009038190A1 true WO2009038190A1 (en) 2009-03-26

Family

ID=40467999

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/067017 WO2009038190A1 (en) 2007-09-19 2008-09-19 Adhesive composition and bonded body

Country Status (4)

Country Link
JP (2) JP5349316B2 (en)
KR (1) KR101240009B1 (en)
CN (1) CN101802118B (en)
WO (1) WO2009038190A1 (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012067281A (en) * 2010-08-24 2012-04-05 Hitachi Chemical Co Ltd Circuit connecting material, method for connecting circuit members using the same, circuit connection structure, and method for manufacturing circuit connection structure
WO2014045931A1 (en) * 2012-09-18 2014-03-27 デクセリアルズ株式会社 Anisotropic conductive film, connection method, and assembly
KR20140064651A (en) * 2012-11-19 2014-05-28 데쿠세리아루즈 가부시키가이샤 Anisotropic conductive film, connecting method, and joined structure
JP2015147832A (en) * 2014-02-05 2015-08-20 デクセリアルズ株式会社 Anisotropic conductive film, method for producing the same, connection method and joined body
CN106104929A (en) * 2014-03-11 2016-11-09 迪睿合株式会社 Anisotropic conductive film and method of attachment and conjugant
JP2016201365A (en) * 2016-06-29 2016-12-01 デクセリアルズ株式会社 Anisotropic conductive film, connection method, and joined body
JP2017117794A (en) * 2017-01-11 2017-06-29 デクセリアルズ株式会社 Anisotropic conductive film, connection method, and assembly
JP2018125291A (en) * 2018-02-14 2018-08-09 デクセリアルズ株式会社 Anisotropic conductive film, as well as, connection method and conjugate
KR20200111667A (en) 2018-01-30 2020-09-29 타츠타 전선 주식회사 Conductive adhesive composition
KR20210133949A (en) 2019-03-04 2021-11-08 타츠타 전선 주식회사 conductive adhesive composition
EP4163347A4 (en) * 2020-06-05 2024-06-12 Dexerials Corporation Method for producing bonded body, bonded body, and hot melt adhesive sheet containing electroconductive particles

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104169389B (en) * 2012-04-25 2018-07-13 日立化成株式会社 Circuit connection material, circuit connection structure, adhesive film and coiling body
JP6123547B2 (en) * 2013-07-26 2017-05-10 日立化成株式会社 Circuit connection material, circuit connection structure, method for manufacturing circuit connection structure, adhesive composition, and adhesive sheet
CN103774440A (en) * 2014-01-20 2014-05-07 南通全技纺织涂层有限公司 Light elastic wear-resistant nylon fabric
CN104916346A (en) * 2015-01-05 2015-09-16 深圳市思迈科新材料有限公司 Low-temperature curing photosensitive conductive silver slurry composition
JP2018044117A (en) * 2016-09-16 2018-03-22 日本合成化学工業株式会社 Thermosetting resin composition, thermosetting adhesive composition, and thermosetting adhesive sheet and diaphragm for thin flat-plate speakers prepared therewith
WO2025142949A1 (en) * 2023-12-25 2025-07-03 セメダイン株式会社 Radical polymerizable adhesive

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6069180A (en) * 1983-09-27 1985-04-19 Nitto Electric Ind Co Ltd Light-curable adhesive tape or sheet
JPH08277818A (en) * 1994-10-28 1996-10-22 Basf Ag Self-supporting buried material for chemical fixing technique,manufacture thereof and usage thereof
JP2002518576A (en) * 1998-06-19 2002-06-25 ヘンケル・コマンディットゲゼルシャフト・アウフ・アクチエン An adhesive that cures in several stages
WO2004031296A1 (en) * 2002-10-01 2004-04-15 Ube Industries, Ltd. Polyol mixture, reactive hot-melt composition obtained from the mixture, and molded article obtained with the composition
JP2006161016A (en) * 2004-12-08 2006-06-22 Lg Cable Ltd Anisotropic conductive adhesive with PTC characteristics
JP2006257208A (en) * 2005-03-16 2006-09-28 Hitachi Chem Co Ltd Adhesive, adhesive for circuit connection, connector and semiconductor device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5889118A (en) * 1996-06-03 1999-03-30 Minnesota Mining And Manufacturing Company Thermomorphic "smart" pressure sensitive adhesives
JP2004010731A (en) * 2002-06-05 2004-01-15 Kao Corp Adhesive for lignocellulose
CN101369098B (en) * 2003-06-04 2012-01-04 积水化学工业株式会社 Curing resin composition, sealing material for liquid crystal display device and liquid crystal display device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6069180A (en) * 1983-09-27 1985-04-19 Nitto Electric Ind Co Ltd Light-curable adhesive tape or sheet
JPH08277818A (en) * 1994-10-28 1996-10-22 Basf Ag Self-supporting buried material for chemical fixing technique,manufacture thereof and usage thereof
JP2002518576A (en) * 1998-06-19 2002-06-25 ヘンケル・コマンディットゲゼルシャフト・アウフ・アクチエン An adhesive that cures in several stages
WO2004031296A1 (en) * 2002-10-01 2004-04-15 Ube Industries, Ltd. Polyol mixture, reactive hot-melt composition obtained from the mixture, and molded article obtained with the composition
JP2006161016A (en) * 2004-12-08 2006-06-22 Lg Cable Ltd Anisotropic conductive adhesive with PTC characteristics
JP2006257208A (en) * 2005-03-16 2006-09-28 Hitachi Chem Co Ltd Adhesive, adhesive for circuit connection, connector and semiconductor device

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012067281A (en) * 2010-08-24 2012-04-05 Hitachi Chemical Co Ltd Circuit connecting material, method for connecting circuit members using the same, circuit connection structure, and method for manufacturing circuit connection structure
US9723715B2 (en) 2012-09-18 2017-08-01 Dexerials Corporation Anisotropic conductive film, connection method, and assembly
WO2014045931A1 (en) * 2012-09-18 2014-03-27 デクセリアルズ株式会社 Anisotropic conductive film, connection method, and assembly
JP2014060025A (en) * 2012-09-18 2014-04-03 Dexerials Corp Anisotropic conductive film, connection method and joined body
KR20140064651A (en) * 2012-11-19 2014-05-28 데쿠세리아루즈 가부시키가이샤 Anisotropic conductive film, connecting method, and joined structure
JP2014102943A (en) * 2012-11-19 2014-06-05 Dexerials Corp Anisotropic conductive film, connection method and joined body
KR102161430B1 (en) * 2012-11-19 2020-10-05 데쿠세리아루즈 가부시키가이샤 Anisotropic conductive film, connecting method, and joined structure
JP2015147832A (en) * 2014-02-05 2015-08-20 デクセリアルズ株式会社 Anisotropic conductive film, method for producing the same, connection method and joined body
US10202524B2 (en) 2014-03-11 2019-02-12 Dexerials Corporation Anisotropic conductive film, connection method, and joined body
EP3118934A4 (en) * 2014-03-11 2017-11-08 Dexerials Corporation Anisotropic conductive film, connection method, and joined body
CN106104929A (en) * 2014-03-11 2016-11-09 迪睿合株式会社 Anisotropic conductive film and method of attachment and conjugant
JP2016201365A (en) * 2016-06-29 2016-12-01 デクセリアルズ株式会社 Anisotropic conductive film, connection method, and joined body
JP2017117794A (en) * 2017-01-11 2017-06-29 デクセリアルズ株式会社 Anisotropic conductive film, connection method, and assembly
KR20200111667A (en) 2018-01-30 2020-09-29 타츠타 전선 주식회사 Conductive adhesive composition
JP2018125291A (en) * 2018-02-14 2018-08-09 デクセリアルズ株式会社 Anisotropic conductive film, as well as, connection method and conjugate
KR20210133949A (en) 2019-03-04 2021-11-08 타츠타 전선 주식회사 conductive adhesive composition
EP4163347A4 (en) * 2020-06-05 2024-06-12 Dexerials Corporation Method for producing bonded body, bonded body, and hot melt adhesive sheet containing electroconductive particles

Also Published As

Publication number Publication date
JPWO2009038190A1 (en) 2011-01-13
JP5349316B2 (en) 2013-11-20
KR101240009B1 (en) 2013-03-06
CN101802118B (en) 2014-05-28
CN101802118A (en) 2010-08-11
KR20100009528A (en) 2010-01-27
JP2013007048A (en) 2013-01-10

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