WO2009038190A1 - Composition adhésive et corps lié - Google Patents
Composition adhésive et corps lié Download PDFInfo
- Publication number
- WO2009038190A1 WO2009038190A1 PCT/JP2008/067017 JP2008067017W WO2009038190A1 WO 2009038190 A1 WO2009038190 A1 WO 2009038190A1 JP 2008067017 W JP2008067017 W JP 2008067017W WO 2009038190 A1 WO2009038190 A1 WO 2009038190A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- adhesive composition
- bonded body
- adhesive
- melting point
- disclosed
- Prior art date
Links
- 239000000853 adhesive Substances 0.000 title abstract 4
- 230000001070 adhesive effect Effects 0.000 title abstract 4
- 150000001875 compounds Chemical class 0.000 abstract 1
- 229920006038 crystalline resin Polymers 0.000 abstract 1
- 230000001747 exhibiting effect Effects 0.000 abstract 1
- 230000008018 melting Effects 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
- 239000007870 radical polymerization initiator Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G2650/28—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type
- C08G2650/56—Polyhydroxyethers, e.g. phenoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Combinations Of Printed Boards (AREA)
- Wire Bonding (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200880107505.0A CN101802118B (zh) | 2007-09-19 | 2008-09-19 | 粘接剂组合物和连接体 |
KR1020097017752A KR101240009B1 (ko) | 2007-09-19 | 2008-09-19 | 접착제 조성물 및 접합체 |
JP2009533204A JP5349316B2 (ja) | 2007-09-19 | 2008-09-19 | 接着剤組成物及び接合体 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007242217 | 2007-09-19 | ||
JP2007-242217 | 2007-09-19 | ||
JP2008071763 | 2008-03-19 | ||
JP2008-071763 | 2008-03-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009038190A1 true WO2009038190A1 (fr) | 2009-03-26 |
Family
ID=40467999
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/067017 WO2009038190A1 (fr) | 2007-09-19 | 2008-09-19 | Composition adhésive et corps lié |
Country Status (4)
Country | Link |
---|---|
JP (2) | JP5349316B2 (fr) |
KR (1) | KR101240009B1 (fr) |
CN (1) | CN101802118B (fr) |
WO (1) | WO2009038190A1 (fr) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012067281A (ja) * | 2010-08-24 | 2012-04-05 | Hitachi Chemical Co Ltd | 回路接続材料、これを用いた回路部材の接続方法、回路接続構造体、及び、回路接続構造体の製造方法 |
WO2014045931A1 (fr) * | 2012-09-18 | 2014-03-27 | デクセリアルズ株式会社 | Film conducteur anisotrope, procédé de connexion, et corps de liaison |
KR20140064651A (ko) * | 2012-11-19 | 2014-05-28 | 데쿠세리아루즈 가부시키가이샤 | 이방성 도전 필름, 접속 방법, 및 접합체 |
JP2015147832A (ja) * | 2014-02-05 | 2015-08-20 | デクセリアルズ株式会社 | 異方性導電フィルム及びその製造方法、並びに、接続方法及び接合体 |
CN106104929A (zh) * | 2014-03-11 | 2016-11-09 | 迪睿合株式会社 | 各向异性导电膜、以及连接方法及接合体 |
JP2016201365A (ja) * | 2016-06-29 | 2016-12-01 | デクセリアルズ株式会社 | 異方性導電フィルム、接続方法、及び接合体 |
JP2017117794A (ja) * | 2017-01-11 | 2017-06-29 | デクセリアルズ株式会社 | 異方性導電フィルム、接続方法、及び接合体 |
JP2018125291A (ja) * | 2018-02-14 | 2018-08-09 | デクセリアルズ株式会社 | 異方性導電フィルム、並びに、接続方法及び接合体 |
KR20200111667A (ko) | 2018-01-30 | 2020-09-29 | 타츠타 전선 주식회사 | 도전성 접착제 조성물 |
KR20210133949A (ko) | 2019-03-04 | 2021-11-08 | 타츠타 전선 주식회사 | 도전성 접착제 조성물 |
EP4163347A4 (fr) * | 2020-06-05 | 2024-06-12 | Dexerials Corporation | Procédé de production d'un corps lié, corps lié et feuille adhésive thermofusible contenant des particules électroconductrices |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104169389B (zh) * | 2012-04-25 | 2018-07-13 | 日立化成株式会社 | 电路连接材料、电路连接结构体、粘接膜以及卷绕体 |
JP6123547B2 (ja) * | 2013-07-26 | 2017-05-10 | 日立化成株式会社 | 回路接続材料、回路接続構造体、回路接続構造体の製造方法、接着剤組成物、及び接着剤シート |
CN103774440A (zh) * | 2014-01-20 | 2014-05-07 | 南通全技纺织涂层有限公司 | 一种轻质弹性耐磨尼龙面料 |
CN104916346A (zh) * | 2015-01-05 | 2015-09-16 | 深圳市思迈科新材料有限公司 | 一种低温固化感光性导电银浆组合物 |
JP2018044117A (ja) * | 2016-09-16 | 2018-03-22 | 日本合成化学工業株式会社 | 熱硬化性樹脂組成物、熱硬化性接着剤組成物、それを用いた熱硬化性接着シート及び薄型平板スピーカー用振動板 |
WO2025142949A1 (fr) * | 2023-12-25 | 2025-07-03 | セメダイン株式会社 | Adhésif polymérisable par voie radicalaire |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6069180A (ja) * | 1983-09-27 | 1985-04-19 | Nitto Electric Ind Co Ltd | 光硬化性接着テ−プもしくはシ−ト |
JPH08277818A (ja) * | 1994-10-28 | 1996-10-22 | Basf Ag | 化学的固定技術のための自立性埋め込み材料、その製造法およびその使用法 |
JP2002518576A (ja) * | 1998-06-19 | 2002-06-25 | ヘンケル・コマンディットゲゼルシャフト・アウフ・アクチエン | 数段階で硬化する接着剤 |
WO2004031296A1 (fr) * | 2002-10-01 | 2004-04-15 | Ube Industries, Ltd. | Melange de polyols, composition thermofusible reactive produite a partir de ce melange, et article moule forme avec cette composition |
JP2006161016A (ja) * | 2004-12-08 | 2006-06-22 | Lg Cable Ltd | Ptc特性を有する異方導電性接着剤 |
JP2006257208A (ja) * | 2005-03-16 | 2006-09-28 | Hitachi Chem Co Ltd | 接着剤、回路接続用接着剤、接続体及び半導体装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5889118A (en) * | 1996-06-03 | 1999-03-30 | Minnesota Mining And Manufacturing Company | Thermomorphic "smart" pressure sensitive adhesives |
JP2004010731A (ja) * | 2002-06-05 | 2004-01-15 | Kao Corp | リグノセルロース用接着剤 |
CN101369098B (zh) * | 2003-06-04 | 2012-01-04 | 积水化学工业株式会社 | 固化性树脂组合物、液晶显示元件用密封剂和液晶显示元件 |
-
2008
- 2008-09-19 CN CN200880107505.0A patent/CN101802118B/zh not_active Expired - Fee Related
- 2008-09-19 WO PCT/JP2008/067017 patent/WO2009038190A1/fr active Application Filing
- 2008-09-19 JP JP2009533204A patent/JP5349316B2/ja not_active Expired - Fee Related
- 2008-09-19 KR KR1020097017752A patent/KR101240009B1/ko not_active Expired - Fee Related
-
2012
- 2012-09-04 JP JP2012194008A patent/JP2013007048A/ja not_active Withdrawn
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6069180A (ja) * | 1983-09-27 | 1985-04-19 | Nitto Electric Ind Co Ltd | 光硬化性接着テ−プもしくはシ−ト |
JPH08277818A (ja) * | 1994-10-28 | 1996-10-22 | Basf Ag | 化学的固定技術のための自立性埋め込み材料、その製造法およびその使用法 |
JP2002518576A (ja) * | 1998-06-19 | 2002-06-25 | ヘンケル・コマンディットゲゼルシャフト・アウフ・アクチエン | 数段階で硬化する接着剤 |
WO2004031296A1 (fr) * | 2002-10-01 | 2004-04-15 | Ube Industries, Ltd. | Melange de polyols, composition thermofusible reactive produite a partir de ce melange, et article moule forme avec cette composition |
JP2006161016A (ja) * | 2004-12-08 | 2006-06-22 | Lg Cable Ltd | Ptc特性を有する異方導電性接着剤 |
JP2006257208A (ja) * | 2005-03-16 | 2006-09-28 | Hitachi Chem Co Ltd | 接着剤、回路接続用接着剤、接続体及び半導体装置 |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012067281A (ja) * | 2010-08-24 | 2012-04-05 | Hitachi Chemical Co Ltd | 回路接続材料、これを用いた回路部材の接続方法、回路接続構造体、及び、回路接続構造体の製造方法 |
US9723715B2 (en) | 2012-09-18 | 2017-08-01 | Dexerials Corporation | Anisotropic conductive film, connection method, and assembly |
WO2014045931A1 (fr) * | 2012-09-18 | 2014-03-27 | デクセリアルズ株式会社 | Film conducteur anisotrope, procédé de connexion, et corps de liaison |
JP2014060025A (ja) * | 2012-09-18 | 2014-04-03 | Dexerials Corp | 異方性導電フィルム、接続方法、及び接合体 |
KR20140064651A (ko) * | 2012-11-19 | 2014-05-28 | 데쿠세리아루즈 가부시키가이샤 | 이방성 도전 필름, 접속 방법, 및 접합체 |
JP2014102943A (ja) * | 2012-11-19 | 2014-06-05 | Dexerials Corp | 異方性導電フィルム、接続方法、及び接合体 |
KR102161430B1 (ko) * | 2012-11-19 | 2020-10-05 | 데쿠세리아루즈 가부시키가이샤 | 이방성 도전 필름, 접속 방법, 및 접합체 |
JP2015147832A (ja) * | 2014-02-05 | 2015-08-20 | デクセリアルズ株式会社 | 異方性導電フィルム及びその製造方法、並びに、接続方法及び接合体 |
US10202524B2 (en) | 2014-03-11 | 2019-02-12 | Dexerials Corporation | Anisotropic conductive film, connection method, and joined body |
EP3118934A4 (fr) * | 2014-03-11 | 2017-11-08 | Dexerials Corporation | Film conducteur anisotrope, méthode de connexion, et corps assemblé |
CN106104929A (zh) * | 2014-03-11 | 2016-11-09 | 迪睿合株式会社 | 各向异性导电膜、以及连接方法及接合体 |
JP2016201365A (ja) * | 2016-06-29 | 2016-12-01 | デクセリアルズ株式会社 | 異方性導電フィルム、接続方法、及び接合体 |
JP2017117794A (ja) * | 2017-01-11 | 2017-06-29 | デクセリアルズ株式会社 | 異方性導電フィルム、接続方法、及び接合体 |
KR20200111667A (ko) | 2018-01-30 | 2020-09-29 | 타츠타 전선 주식회사 | 도전성 접착제 조성물 |
JP2018125291A (ja) * | 2018-02-14 | 2018-08-09 | デクセリアルズ株式会社 | 異方性導電フィルム、並びに、接続方法及び接合体 |
KR20210133949A (ko) | 2019-03-04 | 2021-11-08 | 타츠타 전선 주식회사 | 도전성 접착제 조성물 |
EP4163347A4 (fr) * | 2020-06-05 | 2024-06-12 | Dexerials Corporation | Procédé de production d'un corps lié, corps lié et feuille adhésive thermofusible contenant des particules électroconductrices |
Also Published As
Publication number | Publication date |
---|---|
JPWO2009038190A1 (ja) | 2011-01-13 |
JP5349316B2 (ja) | 2013-11-20 |
KR101240009B1 (ko) | 2013-03-06 |
CN101802118B (zh) | 2014-05-28 |
CN101802118A (zh) | 2010-08-11 |
KR20100009528A (ko) | 2010-01-27 |
JP2013007048A (ja) | 2013-01-10 |
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