WO2018141544A1 - Transducteur planar dynamique - Google Patents
Transducteur planar dynamique Download PDFInfo
- Publication number
- WO2018141544A1 WO2018141544A1 PCT/EP2018/051059 EP2018051059W WO2018141544A1 WO 2018141544 A1 WO2018141544 A1 WO 2018141544A1 EP 2018051059 W EP2018051059 W EP 2018051059W WO 2018141544 A1 WO2018141544 A1 WO 2018141544A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- membrane
- support frame
- contacting surface
- coating
- contacting
- Prior art date
Links
- 239000004020 conductor Substances 0.000 claims abstract description 53
- 238000000576 coating method Methods 0.000 claims abstract description 40
- 239000011248 coating agent Substances 0.000 claims abstract description 36
- 239000012528 membrane Substances 0.000 claims description 78
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
- 230000007704 transition Effects 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 22
- 229910000679 solder Inorganic materials 0.000 description 10
- 239000011888 foil Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000004026 adhesive bonding Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000000443 aerosol Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000005253 cladding Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000007641 inkjet printing Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- -1 laser transfer Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000011345 viscous material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/02—Details
- H04R9/04—Construction, mounting, or centering of coil
- H04R9/046—Construction
- H04R9/047—Construction in which the windings of the moving coil lay in the same plane
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R7/00—Diaphragms for electromechanical transducers; Cones
- H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
- H04R7/04—Plane diaphragms
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R7/00—Diaphragms for electromechanical transducers; Cones
- H04R7/16—Mounting or tensioning of diaphragms or cones
- H04R7/18—Mounting or tensioning of diaphragms or cones at the periphery
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/02—Details
- H04R9/025—Magnetic circuit
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/06—Loudspeakers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/06—Arranging circuit leads; Relieving strain on circuit leads
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2209/00—Details of transducers of the moving-coil, moving-strip, or moving-wire type covered by H04R9/00 but not provided for in any of its subgroups
- H04R2209/024—Manufacturing aspects of the magnetic circuit of loudspeaker or microphone transducers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2400/00—Loudspeakers
- H04R2400/11—Aspects regarding the frame of loudspeaker transducers
Definitions
- a membrane arrangement according to the invention for piano dynamic transducers is specified in claim 1.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
- Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
Abstract
La présente invention concerne un transducteur planar dynamique comprenant : un ensemble aimant, qui est constitué, par exemple, de barreaux aimantés et d'un cadre de support ; et un ensemble membrane. L'ensemble membrane comprend un film à membrane (abrégé par membrane) tendu, un dispositif de tension pour ladite membrane et une structure conductrice appliquée à la membrane. Lorsque la structure conductrice est pourvue, de manière conventionnelle, de connexions électriques, il s'agit souvent des raccordements mécaniquement sensibles et/ou d'une résistance de transition élevée. Un ensemble membrane amélioré pour un transducteur planar dynamique comporte un cadre de support (130), doté d'au moins une surface de contact (200) et une membrane tendue sur le cadre de support (110), à laquelle au moins une piste conductrice (120) électro-conductrice est appliquée par revêtement. Au moins une extrémité de la piste conductrice appliquée par revêtement s'étend ainsi sur la surface de contact (200) du cadre de support. La ligne de connexion (170) peut être ainsi reliée à la surface de contact (200) du cadre de support par l'intermédiaire d'une liaison soudée (160).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US16/483,802 US10820109B2 (en) | 2017-02-06 | 2018-01-17 | Diaphragm arrangement for a planar dynamic sound transducer, and methods to produce therefor |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102017102219.8A DE102017102219A1 (de) | 2017-02-06 | 2017-02-06 | Planardynamischer Wandler |
| DE102017102219.8 | 2017-02-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2018141544A1 true WO2018141544A1 (fr) | 2018-08-09 |
Family
ID=61005826
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/EP2018/051059 WO2018141544A1 (fr) | 2017-02-06 | 2018-01-17 | Transducteur planar dynamique |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US10820109B2 (fr) |
| DE (1) | DE102017102219A1 (fr) |
| WO (1) | WO2018141544A1 (fr) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10321235B2 (en) * | 2016-09-23 | 2019-06-11 | Apple Inc. | Transducer having a conductive suspension member |
| US11151975B2 (en) * | 2018-01-31 | 2021-10-19 | Zerosound Systems Inc. | Apparatus and method for sound wave generation |
| NL2023714B1 (en) * | 2019-08-27 | 2021-04-13 | If Adamas B V | Speaker-element and speaker comprising such a speaker-element |
| CN114025299B (zh) * | 2021-11-10 | 2022-08-02 | 常州星启电子科技有限公司 | 包含导电涂层的振膜及其在制备声学器件中的应用 |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1184803B (de) | 1961-02-20 | 1965-01-07 | Yeda Res & Dev | Elektro-akustischer Wandler |
| DE1234266B (de) | 1963-03-13 | 1967-02-16 | Akustische | Elektrodynamischer Kopfhoerer |
| US3674946A (en) | 1970-12-23 | 1972-07-04 | Magnepan Inc | Electromagnetic transducer |
| US4281223A (en) | 1978-08-18 | 1981-07-28 | Sony Corporation | Electro-acoustic transducer |
| US5095357A (en) | 1989-08-18 | 1992-03-10 | Mitsubishi Denki Kabushiki Kaisha | Inductive structures for semiconductor integrated circuits |
| US6097830A (en) | 1997-11-17 | 2000-08-01 | Sonigistix Corporation | Transducer diaphragm with thermal strain relief |
| US6137891A (en) * | 1993-10-06 | 2000-10-24 | Chain Reactions, Inc. | Variable geometry electromagnetic transducer |
| US6201286B1 (en) | 1997-08-05 | 2001-03-13 | Denso Corporation | Multilayer wiring substrate for hybrid integrated circuit and method for manufacturing the same |
| US20040009716A1 (en) * | 2002-05-02 | 2004-01-15 | Steere John F. | Electrical connectors for electro-dynamic loudspeakers |
| US20150021758A1 (en) | 2013-07-16 | 2015-01-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | Mechanisms for forming bump structures over wide metal pad |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4281233A (en) | 1977-05-03 | 1981-07-28 | Ceskoslovenska Akademie Ved | Hydrophilic macroporous three dimensional copolymers of hydroxyalkyl acrylates or methacrylates with crosslinking agents and the method of their manufacturing |
| US20030174856A1 (en) * | 2002-01-25 | 2003-09-18 | Leif Johannsen | Flexible diaphragm with integrated coil |
| US20040008858A1 (en) * | 2002-05-02 | 2004-01-15 | Steere John F. | Acoustically enhanced electro-dynamic loudspeakers |
| CN1830226B (zh) * | 2003-08-06 | 2010-07-28 | 株式会社村田制作所 | 带嵌入端子的盒子、使用这种盒子的压电电声传感器以及用于生产带嵌入端子的盒子的过程 |
-
2017
- 2017-02-06 DE DE102017102219.8A patent/DE102017102219A1/de active Pending
-
2018
- 2018-01-17 WO PCT/EP2018/051059 patent/WO2018141544A1/fr active Application Filing
- 2018-01-17 US US16/483,802 patent/US10820109B2/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1184803B (de) | 1961-02-20 | 1965-01-07 | Yeda Res & Dev | Elektro-akustischer Wandler |
| DE1234266B (de) | 1963-03-13 | 1967-02-16 | Akustische | Elektrodynamischer Kopfhoerer |
| US3674946A (en) | 1970-12-23 | 1972-07-04 | Magnepan Inc | Electromagnetic transducer |
| US4281223A (en) | 1978-08-18 | 1981-07-28 | Sony Corporation | Electro-acoustic transducer |
| US5095357A (en) | 1989-08-18 | 1992-03-10 | Mitsubishi Denki Kabushiki Kaisha | Inductive structures for semiconductor integrated circuits |
| US6137891A (en) * | 1993-10-06 | 2000-10-24 | Chain Reactions, Inc. | Variable geometry electromagnetic transducer |
| US6201286B1 (en) | 1997-08-05 | 2001-03-13 | Denso Corporation | Multilayer wiring substrate for hybrid integrated circuit and method for manufacturing the same |
| US6097830A (en) | 1997-11-17 | 2000-08-01 | Sonigistix Corporation | Transducer diaphragm with thermal strain relief |
| US20040009716A1 (en) * | 2002-05-02 | 2004-01-15 | Steere John F. | Electrical connectors for electro-dynamic loudspeakers |
| US20150021758A1 (en) | 2013-07-16 | 2015-01-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | Mechanisms for forming bump structures over wide metal pad |
Also Published As
| Publication number | Publication date |
|---|---|
| US10820109B2 (en) | 2020-10-27 |
| US20200053473A1 (en) | 2020-02-13 |
| DE102017102219A1 (de) | 2018-08-09 |
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