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WO2018166160A1 - 封装结构、显示面板及显示装置 - Google Patents

封装结构、显示面板及显示装置 Download PDF

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Publication number
WO2018166160A1
WO2018166160A1 PCT/CN2017/102121 CN2017102121W WO2018166160A1 WO 2018166160 A1 WO2018166160 A1 WO 2018166160A1 CN 2017102121 W CN2017102121 W CN 2017102121W WO 2018166160 A1 WO2018166160 A1 WO 2018166160A1
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WIPO (PCT)
Prior art keywords
barrier layer
layer
package structure
leveling
display device
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Ceased
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PCT/CN2017/102121
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English (en)
French (fr)
Inventor
王大伟
王有为
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BOE Technology Group Co Ltd
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BOE Technology Group Co Ltd
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Priority to US15/767,292 priority Critical patent/US11211583B2/en
Priority to EP17857647.6A priority patent/EP3598502B1/en
Publication of WO2018166160A1 publication Critical patent/WO2018166160A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/351—Thickness

Definitions

  • the present disclosure relates to the field of display technologies, and in particular, to a package structure, a display panel, and a display device.
  • the flexible display device overcomes the limitations of the conventional display device installation, and has the advantages of light weight, thin thickness, flexibility, large viewing angle range, good advertising effect, and the like. Therefore, there are a wide range of applications in people's lives, such as curved screens. In order to ensure the service life of the flexible display device, the packaging technology of the flexible display device is particularly critical.
  • the purpose of the disclosure is to provide a package structure, a display panel and a display device, which improves the light extraction efficiency of the package structure, and ensures that the package structure has strong water and oxygen barrier capability and prolongs the service life of the display device.
  • a package structure including a first barrier layer and a second barrier layer, the first barrier layer being between the packaged object and the second barrier layer; wherein
  • the first barrier layer includes a first leveling layer for improving leveling of the surface of the second barrier layer adjacent to the first barrier layer, and a first moisture barrier layer for improving water oxygen barrier capability,
  • An anti-aqueous oxygen barrier layer is located between the packaged object and the first leveling layer, and the first leveling layer is located between the first moisture barrier layer and the second barrier layer.
  • the package structure further includes a third barrier layer, the third barrier layer being located at the second barrier layer facing away from the first a side of the barrier layer; the third barrier layer includes a third leveling layer for improving leveling of the surface of the second barrier layer adjacent to the third barrier layer, and a third anti-blocking layer for improving water and oxygen barrier ability a water-oxygen barrier layer, the third leveling layer being located between the second barrier layer and the third anti-aqueous oxygen barrier layer.
  • the package structure further includes a third barrier layer, the third barrier layer being located at the second barrier layer facing away from the first barrier layer One side; the third barrier layer is a third leveling layer.
  • the first water-resistant oxygen barrier layer has a thickness of 600 nm to 700 nm, and the first leveling layer has a thickness of 50 nm to 800 nm.
  • the second barrier layer has a thickness of from 3 ⁇ m to 10 ⁇ m.
  • the third leveling layer has a thickness of 600 nm to 800 nm.
  • the first water-resistant oxygen barrier layer has a refractive index n 1
  • the first leveling layer has a refractive index n 2
  • the second barrier layer has a refractive index n 3 and n 1 >n 2 >n 3 .
  • the first water-resistant oxygen barrier layer has a refractive index of 1.85
  • the first flow The flat layer has a refractive index of 1.55
  • the second barrier layer has a refractive index of 1.45 to 1.50.
  • the package structure has a water and oxygen barrier resistance of 10 -5 g/m 2 . Day.
  • a display panel comprising a display substrate and the package structure of the first aspect described above.
  • the display substrate includes a substrate, and a plurality of thin film transistors formed on the surface of the substrate, wherein the thin film transistor array is formed with a plurality of organic a light emitting device, wherein the plurality of thin film transistors are in one-to-one correspondence with the plurality of the organic light emitting devices; wherein a signal output end of each of the thin film transistors is connected to the corresponding light emitting device, and the package structure is formed in a plurality of The light emitting device faces away from the faces of the plurality of thin film transistors.
  • a display device comprising the flexible display surface of the second aspect described above board.
  • FIG. 1 is a first schematic structural diagram of a package structure according to some embodiments of the present disclosure
  • FIG. 2 is a second schematic structural diagram of a package structure according to some embodiments of the present disclosure.
  • FIG. 3 is a third schematic structural diagram of a package structure according to some embodiments of the present disclosure.
  • FIG. 4 is a schematic structural diagram of a display panel according to some embodiments of the present disclosure.
  • FIG. 5 is a flowchart of a method for preparing a display panel according to some embodiments of the present disclosure.
  • the package structure generally adopts a package form in which the first barrier layer, the second barrier layer and the third barrier layer are sequentially stacked.
  • the first barrier layer and the third barrier layer may be a silicon nitride film layer or a silicon oxynitride film layer
  • the second barrier layer is an organic material film layer.
  • the package structure can have a strong water-oxygen barrier capability (up to 10 -5 g/m 2 .day order), but the silicon nitride film
  • the contact between the layer and the organic material film layer may cause a problem of poor leveling effect on the surface of the organic material film layer, which may cause undesirable phenomena such as atomization, pores and Newton's rings on the surface of the organic material film layer, thereby affecting light extraction efficiency and reducing
  • the display effect of the flexible display device when the first barrier layer and the third barrier layer are silicon oxynitride film layers, although the planarization effect of the contact surface of the organic material film layer and the silicon oxynitride film layer is improved, due to nitrogen
  • the silicon oxide film layer has a poor water-oxygen barrier effect, which reduces the water-oxygen barrier capability of the package structure.
  • a package structure includes a first barrier layer 1 and a second barrier layer 2 , and a first barrier layer 1 is located between the package 4 and the second barrier layer 2 ;
  • the first barrier layer 1 includes a first leveling layer 12 for improving the leveling of the second barrier layer 2 near the surface of the first barrier layer 1, and a first moisture barrier layer 11 for improving the water and oxygen barrier ability.
  • the first anti-aqueous oxygen barrier layer 11 is located between the package 4 and the first leveling layer 12, and the first leveling layer 12 is located between the first moisture barrier layer 11 and the second barrier layer 2.
  • the package 4 is usually a display device, and the display device may be disposed in direct contact with the first moisture barrier layer 11 in order to further reduce the output of the display device.
  • a flat protective layer may be added between the display device and the first anti-aqueous oxygen barrier layer 11 to improve the first anti-aqueous oxygen barrier layer. 11 The leveling effect with the contact surface of the display device fully ensures the light-emitting efficiency of the outgoing light of the display device through the package structure.
  • the arrangement of the first barrier layer 1 and the second barrier layer 2 can effectively block the outside water vapor and oxygen from entering the package 4 and prevent the package 4 from being blocked. Being oxidized, prolonging the service life of the display device; considering the problem that the contact surface leveling effect caused by the direct contact between the first barrier layer and the second barrier layer 2 is poor, the first barrier layer 1 includes the first water-resistant oxygen
  • the barrier layer 11 and the first leveling layer 12 by providing the first leveling layer 12 between the first moisture barrier layer 11 and the second barrier layer 2, can prevent the second barrier layer 2 from directly blocking the first water and oxygen barrier
  • the contact of the layer 11 causes a problem that the leveling effect of the contact surface is not good, so that the contact surface has better leveling property, thereby improving the light extraction efficiency of the light emitted from the display device through the package structure, and improving the display effect of the display device.
  • the leveling refers to the degree of planarization of the film forming surface
  • the leveling effect in the present embodiment can be understood as the contact of the surface of the second barrier layer 2 with the surface of the first barrier layer 1 after contact.
  • the flattening effect of the surface can be understood as the contact of the surface of the second barrier layer 2 with the surface of the first barrier layer 1 after contact.
  • the first water-resistant oxygen barrier layer 11 is a layer having high water vapor resistance, and may be, for example, an aluminum oxide film layer or a silicon nitride film layer.
  • the first anti-aqueous oxygen barrier layer 11 is a silicon nitride film layer, so that the first anti-aqueous oxygen barrier layer 11 has the characteristics of high hardness and strong resistance to water and oxygen barrier, and the first leveling layer 12 has a better leveling effect.
  • the layer which may be a silicon oxynitride film layer, has the characteristics of good leveling effect and high light transmittance after the second barrier layer 2 is formed.
  • the first water-resistant oxygen barrier layer 11 may have a thickness of 600 nm to 700 nm. In one embodiment, the first water-resistant oxygen barrier layer 11 has a thickness of 600 nm. In another embodiment, the first water-resistant oxygen barrier layer 11 has a thickness of 650 nm. In another embodiment, the first water-resistant oxygen barrier layer 11 has a thickness of 700 nm.
  • the first leveling layer 12 has a thickness of 50 nm to 800 nm. In one embodiment, the first leveling layer 12 has a thickness of 50 nm. In another embodiment, the first leveling layer 12 has a thickness of 200 nm. In another embodiment, the first leveling layer 12 has a thickness of 800 nm.
  • the thickness of the second barrier layer 2 is from 3 ⁇ m to 10 ⁇ m. In one embodiment, the second barrier layer 2 has a thickness of 3 ⁇ m. In another embodiment, the second barrier layer 2 has a thickness of 5 ⁇ m. In another In one embodiment, the second barrier layer 2 has a thickness of 10 ⁇ m.
  • the thickness of the first leveling layer 12 may be from 100 nm to 200 nm, so that the first leveling layer 12 can satisfy the leveling effect required by the second barrier layer 2 while having good light transmittance.
  • the first leveling layer 12 has a thickness of 100 nm.
  • the first leveling layer 12 has a thickness of 150 nm.
  • the first leveling layer 12 has a thickness of 200 nm.
  • the second barrier layer 2 can be formed by inkjet printing.
  • the second barrier layer 2 has a water and oxygen barrier capability, and may have a function of stress release and planarization, and may be, for example, an organic material layer, which may be an acrylate film layer or an epoxy film layer.
  • the silicon oxide film layer obtained by the plasma chemical vapor deposition method has an anti-water and oxygen barrier capability of 10 -5 g/m 2 .day, which can effectively prevent water vapor and oxygen from immersing in the display device;
  • the silicon oxynitride film layer obtained by the plasma chemical vapor deposition method can improve the leveling of the organic material layer into the smooth surface when forming a film on the contact surface with the organic material layer, and can be seen through the silicon nitride film layer and the silicon oxynitride film layer.
  • the setting not only satisfies the requirements of the package structure to have high resistance to water and oxygen barrier, but also optimizes the planarization when the organic material layer and the silicon oxynitride film layer are formed into a film.
  • the package structure in the embodiment of the present disclosure may further include a third barrier layer 3, and the third barrier layer 3 is located on a side of the second barrier layer 2 facing away from the first barrier layer 1;
  • the structure of the third barrier layer 3 is various, and two specific structural forms are exemplarily given below with reference to the accompanying drawings:
  • the third barrier layer 3 includes a third leveling layer 31 for improving the leveling of the second barrier layer 2 near the surface of the third barrier layer 3 and for improving water oxygen
  • a third anti-aqueous oxygen barrier layer 32 having a barrier property the third leveling layer 31 is located between the second barrier layer 2 and the third anti-aqueous oxygen barrier layer 32.
  • the third barrier layer 3 Based on the structure of the third barrier layer 3, it can be found that by providing the third leveling layer 31 on the surface of the second barrier layer 2 close to the third barrier layer 3, the contact surface of the second barrier layer 2 and the third barrier layer 3 can be improved.
  • the leveling property further improves the light-emitting efficiency of the light emitted from the display device through the package structure, and the sealing of the third water-resistant oxygen barrier layer 32 can improve the sealing property of the package structure and prevent the package structure from contacting the air. Water vapor and oxygen are immersed in the display device.
  • the third barrier layer 3 is located on a side of the second barrier layer 2 facing away from the first barrier layer 1; the third barrier layer 3 is a third leveling layer 31 or a third moisture barrier. Layer 32.
  • the third barrier layer 3 may be a silicon oxynitride film layer, and when the third barrier layer 3 is the third water-resistant oxygen barrier layer 32, the third barrier layer Layer 3 can It is a silicon nitride film layer.
  • the third barrier layer 3 generally selects the second structure, and in order to ensure good light extraction efficiency of the package structure, the third barrier layer 3 may be the third leveling layer 31, ie,
  • the third barrier layer 3 is a silicon oxynitride film layer.
  • the third leveling layer 31 has a thickness of 600 nm to 800 nm. In one embodiment, the third leveling layer 31 has a thickness of 600 nm. In another embodiment, the third leveling layer 31 has a thickness of 700 nm. In another embodiment, the third leveling layer 31 has a thickness of 800 nm.
  • the third anti-aqueous oxygen barrier layer 32 is not disposed in the third barrier layer 3 of the structural form, the thickness of the package structure is further reduced, and the water-oxygen barrier capability of the package structure in the embodiment can be used. It reaches 10 -5 g/m 2 .day. Therefore, the display device using the above package structure can not only meet the requirements of the water vapor barrier capability of the display device, but also make the display device thinner and lighter.
  • the third barrier layer can also be obtained by plasma chemical vapor deposition.
  • the refractive index of the first anti-aqueous oxygen barrier layer 11 is n 1
  • the refractive index of the first leveling layer 12 is n 2
  • the refractive index of the second barrier layer 2 is n 3
  • n 1 >n 2 >n 3 The display device emitted light through a first refractive index n 1 water resistant oxygen barrier layer 11, the first flow through a refractive index n 2 of the flat layer 12, and finally through a refractive index n 3 of the second barrier layer 2, since the n
  • the refractive indices of 1 , 2, and n 3 are in a decreasing relationship.
  • the light emitted by the display device passes through the first barrier layer directly after passing through the first water-resistant barrier layer 11. 2, effectively reducing the total reflection loss of light, thereby improving the light extraction efficiency of the light emitted by the display device through the package structure.
  • the first water-resistant oxygen barrier layer 11 has a refractive index of 1.85
  • the first leveling layer 12 has a refractive index of 1.55
  • the second barrier layer 2 has a refractive index of 1.45 - 1.50.
  • the second barrier layer 2 has a refractive index of 1.45.
  • the second barrier layer 2 has a refractive index of 1.47.
  • the second barrier layer 2 has a refractive index of 1.50. Based on such an arrangement, the package structure can have a strong water-oxygen barrier capability, and the package structure has a better light transmittance.
  • the embodiment provides a display panel including a display substrate and the package structure mentioned in the first embodiment.
  • the display panel may be a flexible display panel.
  • the display panel provided by the embodiment of the present disclosure has the same beneficial effects as the package structure provided in the second embodiment, and details are not described herein.
  • the display substrate includes a first display film layer 41, and the first display film layer 41 includes a base.
  • a plate a vapor barrier layer, a buffer layer, a semiconductor layer, a gate insulating layer, a gate layer, an interlayer insulating layer, a source/drain layer, a passivation layer, an organic flat layer, an anode layer, a pixel defining layer, and the like.
  • a second display film layer 42 is formed on the first display film layer 41, which includes an organic light-emitting layer and a cathode layer.
  • the plurality of thin film transistors of the first display film layer 41 are in one-to-one correspondence with the plurality of organic light emitting devices of the second display film layer 42; wherein the signal output end of each thin film transistor is connected to the corresponding light emitting device, and the package structure is formed in multiple The light emitting device faces away from the face of the plurality of thin film transistors.
  • the thin film transistor comprises a gate on the substrate, a gate insulating layer covering the substrate and the gate, and an active layer, a source and a drain above the gate insulating layer, wherein the source and the drain Very similar layers are set and not connected. This embodiment does not describe the specific structure of the display substrate.
  • the embodiment further provides a method for preparing the display panel, which is specifically as follows:
  • An embodiment of the present disclosure provides a display device including the display panel mentioned in Embodiment 2.
  • the display device provided by the embodiment of the present disclosure has the same beneficial effects as the display panel provided in the second embodiment, and details are not described herein.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

提供一种封装结构、显示面板及显示装置，涉及显示技术领域，通过改善封装结构中第一阻隔层(1)与第二阻隔层(2)之间的流平效果，使得封装结构的出光效率得以提升，同时保证了封装结构具有较强的水氧阻隔能力，延长显示器件的使用寿命。该封装结构包括第一阻隔层(1)和第二阻隔层(2)，第一阻隔层(1)位于被封装物(4)和第二阻隔层(2)之间；该显示面板包括上述技术方案所提的封装结构。该显示装置包括上述技术方案所提的显示面板，提供的封装结构、显示面板及显示装置用于柔性显示设备。

Description

封装结构、显示面板及显示装置
本公开要求于2017年3月14日提交中国专利局、申请号为201720247904.3、申请名称为“一种封装结构、显示面板及显示装置”的中国专利申请的优先权，其全部内容通过引用结合在本公开中。
技术领域
本公开涉及显示技术领域，尤其涉及一种封装结构、显示面板及显示装置。
背景技术
随着显示技术的不断发展，用户对显示装置的需求不断增加，柔性显示装置克服了传统显示装置安装的局限性，其具有重量轻、厚度薄、可弯曲、视角范围大、广告效果好等优点，因此，在人们生活中有了广泛的应用，例如曲面屏幕等。为了保证柔性显示装置的使用寿命，柔性显示装置的封装技术尤为关键。
现有技术中的柔性显示装置的封装结构，通常会出现由于流平效果不佳而影响出光效率的问题，此外，水氧阻隔效果较差也是通常会出现的问题。
发明内容
本公开的目的在于提供一种封装结构、显示面板及显示装置，提高了封装结构的出光效率，同时保证了封装结构具有较强的水氧阻隔能力，延长显示器件的使用寿命。
为了实现上述目的，本公开提供如下技术方案：
第一方面，提供了一种封装结构，所述封装结构包括第一阻隔层和第二阻隔层，所述第一阻隔层位于被封装物和所述第二阻隔层之间；其中，所述第一阻隔层包括用于提高所述第二阻隔层靠近第一阻隔层的面的流平性的第一流平层和用于提高水氧阻隔能力的第一抗水氧阻隔层，所述第一抗水氧阻隔层位于所述被封装物与所述第一流平层之间，所述第一流平层位于所述第一抗水氧阻隔层与所述第二阻隔层之间。
结合第一方面，在第一方面的第一种可能的实现方式中，所述封装结构还包括第三阻隔层，所述第三阻隔层位于所述第二阻隔层背离所述第一 阻隔层的一面；所述第三阻隔层包括用于提高所述第二阻隔层靠近第三阻隔层的面的流平性的第三流平层以及用于提高水氧阻隔能力的第三抗水氧阻隔层，所述第三流平层位于所述第二阻隔层与所述第三抗水氧阻隔层之间。
结合第一方面，在第一方面的第二种可能的实现方式中，所述封装结构还包括第三阻隔层，所述第三阻隔层位于所述第二阻隔层背离所述第一阻隔层的一面；所述第三阻隔层为第三流平层。
结合第一方面，在第一方面的第三种可能的实现方式中，所述第一抗水氧阻隔层的厚度为600nm-700nm，所述第一流平层的厚度为50nm-800nm。
结合第一方面，在第一方面的第四种可能的实现方式中，所述第二阻隔层的厚度为3μm-10μm。
结合第一方面的第一种或第二种可能的实现方式，在第一方面的第五种可能的实现方式中，所述第三流平层的厚度为600nm-800nm。
结合第一方面，在第一方面的第六种可能的实现方式中，所述第一抗水氧阻隔层的折射率为n1、所述第一流平层的折射率为n2、所述第二阻隔层的折射率n3，且n1＞n2＞n3。
结合第一方面或第一方面的第六种可能的实现方式，在第一方面的第七种可能的实现方式中，所述第一抗水氧阻隔层的折射率为1.85，所述第一流平层的折射率为1.55，所述第二阻隔层的折射率为1.45-1.50。
结合第一方面或第一方面的以上各种可能的实现方式，在第一方面的第八种可能的实现方式中，所述封装结构的抗水氧阻隔能力为10-5g/m2.day。
第二方面，提供一种显示面板，包括显示基板和上述第一方面所述的封装结构。
结合第二方面，在第二方面的第一种可能的实现方式中，所述显示基板包括基板，以及形成在所述基板表面的多个薄膜晶体管，所述薄膜晶体管阵列上形成有多个有机发光器件，多个所述薄膜晶体管与多个所述有机发光器件一一对应；其中，每个所述薄膜晶体管的信号输出端与对应所述发光器件连接，所述封装结构形成在多个所述发光器件背离多个所述薄膜晶体管的面。
第三方面，提供一种显示装置，包括上述第二方面所述的柔性显示面 板。
附图说明
此处所说明的附图用来提供对本公开的进一步理解，构成本公开的一部分，本公开的示意性实施例及其说明用于解释本公开，并不构成对本公开的不当限定。在附图中：
图1为本公开一些实施例提供的封装结构的第一种结构示意图；
图2为本公开一些实施例提供的封装结构的第二种结构示意图；
图3为本公开一些实施例提供的封装结构的第三种结构示意图；
图4为本公开一些实施例提供的显示面板的一种结构示意图；
图5为本公开一些实施例提供的显示面板制备方法的流程图。
具体实施方式
为了进一步说明本公开实施例提供的封装结构、显示面板及显示装置，下面结合说明书附图进行详细描述。
封装结构通常采用第一阻隔层、第二阻隔层和第三阻隔层依次堆叠的封装形式，例如：第一阻隔层和第三阻隔层可以为氮化硅膜层或氮氧化硅膜层、第二阻隔层为有机材料膜层。当第一阻隔层和第三阻隔层为氮化硅膜层时，能够使封装结构具有较强的水氧阻隔能力(达到10-5g/m2.day数量级)，但是，氮化硅膜层与有机材料膜层接触会造成有机材料膜层表面流平效果不佳的问题，从而可能使有机材料膜层表面形成雾化、孔洞和牛顿环等不良现象，进而会影响出光效率，降低了柔性显示装置的显示效果，当第一阻隔层和第三阻隔层为氮氧化硅膜层时，尽管提升了有机材料膜层与氮氧化硅膜层接触表面较佳的流平效果，但是由于氮氧化硅膜层的水氧阻隔效果较差，降低了封装结构的水氧阻隔能力。
实施例一
请参阅图1，本公开实施例提供的封装结构，该封装结构包括第一阻隔层1和第二阻隔层2，第一阻隔层1位于被封装物4和第二阻隔层2之间；其中，第一阻隔层1包括用于提高第二阻隔层2靠近第一阻隔层1的面的流平性的第一流平层12和用于提高水氧阻隔能力的第一抗水氧阻隔层11，第一抗水氧阻隔层11位于被封装物4与第一流平层12之间，第一流平层12位于第一抗水氧阻隔层11与第二阻隔层2之间。
在具体实施的过程中，被封装物4通常为显示器件，该显示器件可以设置成与第一抗水氧阻隔层11直接接触，而为了进一步降低显示器件的出 射光线通过第一抗水氧阻隔层11造成的光损耗，本实施例还可在显示器件与第一抗水氧阻隔层11之间增设一平坦保护层，以提高第一抗水氧阻隔层11与显示器件接触面的流平效果，充分保证了显示器件的出射光通过封装结构的出光效率。
通过上述具体实施过程可知，本公开实施例提供的封装结构中，通过第一阻隔层1与第二阻隔层2的设置，能够有效阻隔外界水汽和氧气进入被封装物4，防止被封装物4被氧化，延长了显示装置的使用寿命；考虑到第一阻隔层与第二阻隔层2直接接触造成的接触面流平效果不佳的问题，因此，第一阻隔层1包括第一抗水氧阻隔层11和第一流平层12，通过在第一抗水氧阻隔层11与第二阻隔层2之间设置第一流平层12，能够避免第二阻隔层2直接与第一抗水氧阻隔层11接触造成接触面流平效果不佳的问题，使得上述接触面具有较好的流平性，进而能够提高显示器件的出射光通过封装结构的出光效率，提升显示装置的显示效果。
可以理解的是，所述流平是指成膜表面的平坦化程度，在本实施例中的流平效果可以理解为第二阻隔层2的表面与第一阻隔层1的表面接触后，接触面的平坦化效果。
示例性的，第一抗水氧阻隔层11为抗水氧能力较强的层，例如可以为氧化铝膜层或者氮化硅膜层。第一抗水氧阻隔层11为氮化硅膜层，使得第一抗水氧阻隔层11具有硬度高、抗水氧阻隔能力强的特点，而第一流平层12为流平效果较好的层，其可以为氮氧化硅膜层，使得第二阻隔层2成膜后具有流平效果佳、透光率高的特点，可见，通过氮化硅膜层和氮氧化硅膜层的设置，既能够满足封装结构的抗水氧阻隔能力，又可以保证显示器件的出射光通过封装结构的出光效率。
另外，第一抗水氧阻隔层11的厚度可以为600nm-700nm。在一个实施例中，第一抗水氧阻隔层11的厚度为600nm。在另一个实施例中，第一抗水氧阻隔层11的厚度为650nm。在另一个实施例中，第一抗水氧阻隔层11的厚度为700nm。
第一流平层12的厚度为50nm-800nm。在一个实施例中，第一流平层12的厚度为50nm。在另一个实施例中，第一流平层12的厚度为200nm。在另一个实施例中，第一流平层12的厚度为800nm。
第二阻隔层2的厚度为3μm-10μm。在一个实施例中，第二阻隔层2的厚度为3μm。在另一个实施例中，第二阻隔层2的厚度为5μm。在另一 个实施例中，第二阻隔层2的厚度为10μm。
第一流平层12的厚度可以为100nm-200nm，使得第一流平层12既能够满足第二阻隔层2所需的流平效果，同时又能够具有良好的光线透过率。在一个实施例中，第一流平层12的厚度为100nm。在另一个实施例中，第一流平层12的厚度为150nm。在另一个实施例中，第一流平层12的厚度为200nm。其中，第二阻隔层2可以采用喷墨打印的方式形成。
需要说明的是，第二阻隔层2具有水氧阻隔能力，并且可以具有应力释放和平坦化的作用，例如可以为有机材料层，该有机材料层可以为丙烯酸酯膜层或环氧膜层。具体的，采用等离子体化学气相沉积的方法得到的氮化硅膜层的抗水氧阻隔能力能够达到10-5g/m2.day数量级，可有效的防止水汽和氧气浸入显示器件；而采用等离子体化学气相沉积法得到的氮氧化硅膜层在与有机材料层接触面成膜时能够提高有机材料层入光面流平性，可见，通过氮化硅膜层和氮氧化硅膜层的设置，不仅满足了封装结构具有较高的抗水氧阻隔能力的要求，同时使有机材料层与氮氧化硅膜层接触面成膜时的平坦化得到了优化。
为了进一步提高封装结构的抗水氧阻隔能力，本公开实施例中的封装结构还可以包括第三阻隔层3，第三阻隔层3位于第二阻隔层2背离第一阻隔层1的一面；其中，第三阻隔层3的结构形式多种多样，下面结合附图示例性的给出两种具体的结构形式：
第一种结构形式：请参阅图2，第三阻隔层3包括用于提高第二阻隔层2靠近第三阻隔层3的面的流平性的第三流平层31以及用于提高水氧阻隔能力的第三抗水氧阻隔层32，第三流平层31位于第二阻隔层2与第三抗水氧阻隔层32之间。
基于第三阻隔层3的结构可以发现，通过在第二阻隔层2靠近第三阻隔层3的面设置第三流平层31，能够提高第二阻隔层2与第三阻隔层3接触面的流平性，这样，进一步提高了显示器件的出射光通过封装结构的出光效率，而通过第三抗水氧阻隔层32的设置，能够提高封装结构的密封性，防止封装结构与空气接触面的水汽和氧气浸入显示器件。
第二种结构形式：请参阅图3，第三阻隔层3位于第二阻隔层2背离第一阻隔层1的一面；第三阻隔层3为第三流平层31或第三抗水氧阻隔层32。其中，当第三阻隔层3为第三流平层31时，第三阻隔层3可以为氮氧化硅膜层，当第三阻隔层3为第三抗水氧阻隔层32时，第三阻隔层3可以 为氮化硅膜层。
需要说明的是，在实际生产过程中，第三阻隔层3通常选择第二种结构形式，而为了保证封装结构良好的出光效率，第三阻隔层3可以为第三流平层31，即，第三阻隔层3为氮氧化硅膜层，此时，第三流平层31的厚度为600nm-800nm。在一个实施例中，第三流平层31的厚度为600nm。在另一个实施例中，第三流平层31的厚度为700nm。在另一个实施例中，第三流平层31的厚度为800nm。可见，由于该种结构形式的第三阻隔层3中未设置第三抗水氧阻隔层32，这样，进一步减少了封装结构的厚度，并且采用本实施例中的封装结构的水氧阻隔能力能够达到10-5g/m2.day，因此，采用上述封装结构的显示装置，不仅能够满足显示装置较强水氧阻隔能力的要求，而且使得显示装置更加轻薄。第三阻隔层同样可以采用等离子体化学气相沉积的方法得到。
需要补充的是，第一抗水氧阻隔层11的折射率为n1、第一流平层12的折射率为n2、第二阻隔层2的折射率为n3，且n1＞n2＞n3。显示器件发出的光经过折射率为n1的第一抗水氧阻隔层11，经过折射率为n2的第一流平层12，最后经过折射率为n3的第二阻隔层2，由于n1、n2和n3的折射率为递减关系，相比较于封装结构中未设置第一流平层12，当显示器件发出的光通过第一抗水氧阻隔层11后直接通过第二阻隔层2，有效的降低了光的全反射损耗，从而提高了显示器件的出射光通过封装结构的出光效率。
示例性的，第一抗水氧阻隔层11的折射率为1.85，第一流平层12的折射率为1.55，第二阻隔层2的折射率为1.45-1.50。在一个实施例中，第二阻隔层2的折射率为1.45。在另一个实施例中，第二阻隔层2的折射率为1.47。在另一个实施例中，第二阻隔层2的折射率为1.50。基于这样的设置，既能够使封装结构具有较强的水氧阻隔能力，又保证了封装结构具有较佳的光线透过率。
实施例二
本实施例提供了一种显示面板，该显示面板包括显示基板和实施例一提到的封装结构，显示面板可以为柔性显示面板。
与现有技术相比，本公开实施例提供的显示面板与上述实施例二提供的封装结构有益效果相同，在此不做赘述。
请参阅图4，显示基板包括第一显示膜层41，第一显示膜层41包括基 板、水汽阻隔层、缓冲层、半导体层、栅极绝缘层、栅极层、层间绝缘层、源漏极层、钝化层、有机平坦层、阳极层和像素定义层等。在第一显示膜层41上形成有第二显示膜层42，其包含有机发光层和阴极层。第一显示膜层41的多个薄膜晶体管与第二显示膜层42的多个有机发光器件一一对应；其中，每个薄膜晶体管的信号输出端与对应发光器件连接，封装结构形成在多个发光器件背离多个薄膜晶体管的面。其中，上述的薄膜晶体管包括位于基板上的栅极，覆盖在基板和栅极上的栅极绝缘层，以及位于栅极绝缘层上方的有源层、源极和漏极，其中源极和漏极同层设置且不相连。本实施例不再对显示基板的具体结构进行赘述。
另外，请参阅图5，本实施例还提供了该显示面板的制备方法，具体如下：
S1：在基板上制备第一显示膜层；
S2：在第一显示膜层上制备第二显示膜层；
S3：在第二显示膜层上制备第一抗水氧阻隔层；
S4：在第一抗水氧阻隔层上制备第一流平层；
S5：在第一流平层上制备第二阻隔层；
S6：在第二阻隔层上制备第三抗水氧阻隔层。
实施例三
本公开实施例提供了一种显示装置，该显示装置包括实施例二提到的显示面板。
与现有技术相比，本公开实施例提供的显示装置与上述实施例二提供的显示面板有益效果相同，在此不做赘述。
在上述实施方式的描述中，具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。
以上，仅为本公开的具体实施方式，但本公开的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本公开揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本公开的保护范围之内。因此，本公开的保护范围应以权利要求的保护范围为准。

Claims (12)

  1. 一种封装结构，所述封装结构包括第一阻隔层和第二阻隔层，所述第一阻隔层位于被封装物和所述第二阻隔层之间，其中，
    所述第一阻隔层包括第一流平层和第一抗水氧阻隔层，所述第一抗水氧阻隔层位于所述被封装物与所述第一流平层之间，所述第一流平层位于所述第一抗水氧阻隔层与所述第二阻隔层之间。
  2. 根据权利要求1所述的封装结构，其中，所述封装结构还包括第三阻隔层，所述第三阻隔层位于所述第二阻隔层背离所述第一阻隔层的一面；
    所述第三阻隔层包括第三流平层以及第三抗水氧阻隔层，所述第三流平层位于所述第二阻隔层与所述第三抗水氧阻隔层之间。
  3. 根据权利要求1所述的封装结构，其中，所述封装结构还包括第三阻隔层，所述第三阻隔层位于所述第二阻隔层背离所述第一阻隔层的一面；所述第三阻隔层为第三流平层。
  4. 根据权利要求1所述的封装结构，其中，所述第一抗水氧阻隔层的厚度为600nm-700nm，所述第一流平层的厚度为50nm-800nm。
  5. 根据权利要求1所述的封装结构，其中，所述第二阻隔层的厚度为3μm-10μm。
  6. 根据权利要求2或3所述的封装结构，其中，所述第三流平层的厚度为600nm-800nm。
  7. 根据权利要求1所述的封装结构，其中，所述第一抗水氧阻隔层的折射率为n1、所述第一流平层的折射率为n2、所述第二阻隔层的折射率n3，且n1＞n2＞n3。
  8. 根据权利要求1或7所述的封装结构，其中，所述第一抗水氧阻隔层的折射率为1.85，所述第一流平层的折射率为1.55，所述第二阻隔层的折射率为1.45-1.50。
  9. 根据权利要求1-8任一项所述的封装结构，其中，所述封装结构的抗水氧阻隔能力为10-5g/m2.day。
  10. 一种显示面板，包括显示基板和权利要求1～9任一项所述封装结构。
  11. 根据权利要求10所述的显示面板，其中，所述显示基板包括基板，以及形成在所述基板表面的多个薄膜晶体管，所述薄膜晶体管阵列上形成有多个有机发光器件，多个所述薄膜晶体管与多个所述有机发光器件一一 对应；其中，
    每个所述薄膜晶体管的信号输出端与对应所述发光器件连接，所述封装结构形成在多个所述发光器件背离多个所述薄膜晶体管的面。
  12. 一种显示装置，包括权利要求10或11所述的显示面板。
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