[go: up one dir, main page]

WO2018168734A1 - Resin structure with built-in electronic component and method for producing same - Google Patents

Resin structure with built-in electronic component and method for producing same Download PDF

Info

Publication number
WO2018168734A1
WO2018168734A1 PCT/JP2018/009409 JP2018009409W WO2018168734A1 WO 2018168734 A1 WO2018168734 A1 WO 2018168734A1 JP 2018009409 W JP2018009409 W JP 2018009409W WO 2018168734 A1 WO2018168734 A1 WO 2018168734A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin
electronic component
main surface
built
resin portion
Prior art date
Application number
PCT/JP2018/009409
Other languages
French (fr)
Japanese (ja)
Inventor
宗彦 郡田
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Publication of WO2018168734A1 publication Critical patent/WO2018168734A1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/568—Temporary substrate used as encapsulation process aid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H01L2224/241—Disposition
    • H01L2224/24151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/24153—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate
    • H01L2224/24195—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate the item being a discrete passive component
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/81001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector involving a temporary auxiliary member not forming part of the bonding apparatus
    • H01L2224/81005—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector involving a temporary auxiliary member not forming part of the bonding apparatus being a temporary or sacrificial substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/96—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19042—Component type being an inductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping

Definitions

  • the present invention relates to a resin structure with a built-in electronic component and a manufacturing method thereof.
  • Patent Document 1 discloses a resin structure that includes a resin molded body and a plurality of electronic components embedded therein, and is thinned and miniaturized.
  • the resin structure has an exposed surface from which an electrode of an electronic component is exposed on the resin formed body, and the bottom surface of the concave portion of the resin formed body is the exposed surface, increasing the degree of freedom in circuit design. .
  • the present invention has been made in view of such circumstances, and an object thereof is to provide an electronic component built-in resin structure capable of achieving both good flexibility and durability.
  • An electronic component built-in resin structure has a first main surface and a second main surface that face each other, and has elasticity in a plane direction parallel to the first main surface.
  • An electronic component built-in resin structure incorporating a component comprising: a first resin portion that covers the first electronic component; and a second resin portion that is adjacent to the first resin portion in the surface direction.
  • the rigidity of the second resin part is higher than that of the second resin part, and the second resin part has higher elasticity than the first resin part.
  • a method for manufacturing an electronic component-embedded resin structure having a first main surface and a second main surface facing each other, and having elasticity in a plane direction parallel to the first main surface.
  • a method of manufacturing an electronic component built-in resin structure incorporating an electronic component the step of installing the electronic component on the support, and the first resin portion provided on the support so as to cover the electronic component
  • providing a wiring portion on the first main surface so as to be electrically connected to the electronic component, wherein the first resin portion is higher in rigidity than the second resin portion, and the second resin portion is The elasticity is higher than that of the first resin portion.
  • a method for manufacturing an electronic component-embedded resin structure having a first main surface and a second main surface facing each other, and having elasticity in a plane direction parallel to the first main surface.
  • a method of manufacturing an electronic component built-in resin structure incorporating an electronic component the step of providing a wiring portion on a support, the step of mounting the electronic component so as to be electrically connected to the wiring portion,
  • the first resin part is provided on the support so as to cover the electronic component, the step of providing the second resin part adjacent to the first resin part in the surface direction, and the support from the first main surface including one surface of the wiring part
  • the first resin part has higher rigidity than the second resin part, and the second resin part has higher stretchability than the first resin part.
  • FIG. 1A is a cross-sectional view schematically showing the structure of the electronic component built-in resin structure according to the first embodiment of the present invention.
  • FIG. 1B is a cross-sectional view schematically showing the structure of an electronic component built-in resin structure according to a modification of the first embodiment.
  • FIG. 2 is a cross-sectional view schematically showing the structure of the electronic component built-in resin structure according to the second embodiment of the present invention.
  • FIG. 3 is a cross-sectional view schematically showing the structure of the electronic component built-in resin structure according to the third embodiment of the present invention.
  • FIG. 4 is a cross-sectional view schematically showing the structure of the electronic component built-in resin structure according to the fourth embodiment of the present invention.
  • FIG. 1A is a cross-sectional view schematically showing the structure of the electronic component built-in resin structure according to the first embodiment of the present invention.
  • FIG. 1B is a cross-sectional view schematically showing the structure of an electronic component built-in resin structure according to
  • FIG. 5 is a cross-sectional view schematically showing the structure of an electronic component built-in resin structure according to a fifth embodiment of the present invention.
  • FIG. 6A is a diagram showing a process of providing an electronic component on a support in the sixth embodiment of the present invention.
  • FIG. 6B is a diagram showing a step of providing a resin composition on a support in the sixth embodiment of the present invention.
  • FIG. 6C is a diagram showing a step of curing the resin composition in the sixth embodiment of the present invention.
  • FIG. 6D is a diagram showing a step of peeling the support from the first main surface in the sixth embodiment of the present invention.
  • FIG. 6E is a diagram showing a step of providing a wiring portion on the first main surface in the sixth embodiment of the present invention.
  • FIG. 6A is a diagram showing a process of providing an electronic component on a support in the sixth embodiment of the present invention.
  • FIG. 6B is a diagram showing a step of providing a resin composition on a support in
  • FIG. 7A is a diagram illustrating a process of providing a wiring portion on a support in the seventh embodiment of the present invention.
  • FIG. 7B is a diagram illustrating a process of providing an electronic component so as to be electrically connected to the wiring portion in the seventh embodiment of the present invention.
  • FIG. 7C is a diagram illustrating a process of providing the first resin portion and the second resin portion in the seventh embodiment of the present invention.
  • FIG. 7D is a diagram showing a step of peeling the support from the first main surface in the seventh embodiment of the present invention.
  • the first direction X, the second direction Y, and the third direction Z are, for example, directions orthogonal to each other, but are not particularly limited as long as they intersect with each other, and angles other than a right angle to each other
  • the crossing direction may be used.
  • the main surface is a surface parallel to a surface specified by the first direction X and the second direction Y (hereinafter referred to as XY surface).
  • the thickness is a thickness along the third direction Z that is a direction orthogonal to the XY plane.
  • FIG. 1A is a cross-sectional view schematically showing the structure of the electronic component built-in resin structure according to the first embodiment of the present invention.
  • FIG. 1B is a cross-sectional view schematically showing the structure of an electronic component built-in resin structure according to a modification of the first embodiment.
  • the electronic component built-in resin structure 100 includes a structure body 101 having a first main surface 101A and a second main surface 101B facing each other, a wiring portion 141 provided on the first main surface 101A of the structure body 101, It has.
  • the structural body 101 includes a first electronic component 111, a second electronic component 112, a first resin portion 121, and a second resin portion 122.
  • the first electronic component 111 and the second electronic component 112 are arranged away from each other in the XY plane direction parallel to the first main surface 101A.
  • an electronic component such as an IC or a SAW device, a chip-shaped electronic component such as a capacitor, a resistor, or a coil can be used.
  • the first electronic component 111 is provided with a terminal electrode 111A on the bottom surface
  • the second electronic component 112 is provided with terminal electrodes 112A on both ends thereof, the one surface of the terminal electrode 111A of the first electronic component 111 and the first surface.
  • One surface of the terminal electrode 112A of the two electronic component 112 is disposed on the same surface as the first main surface 101A.
  • the main body of the first electronic component may have a predetermined space (for example, 50 ⁇ m or more and 100 ⁇ m or less) between the first main surface 101A.
  • one surface of each of the first electronic component 111 and the second electronic component 112 more specifically, one surface of each of the terminal electrode 111A and the terminal electrode 112A is included in the first main surface 101A.
  • the terminal electrodes 111A and 112A and the wiring part 141 are directly connected.
  • a connecting material such as a conductive paste or a low melting point solder is disposed between the terminal electrodes 111A and 112A and the wiring part 141. May be.
  • the first resin part 121 covers the first electronic component 111 and the second electronic component 112. Specifically, the first resin portion 121 is provided so as to surround the first electronic component 111 and the second electronic component 112 in the XY plane direction. The first resin portion 121 covers the second main surface 101B side of the first electronic component 111 and the second electronic component 112, and is not provided on the first main surface 101A side. However, the first resin portion 121 may also be provided in a predetermined space between the main body portion of the first electronic component 111 and the first main surface 101A. One main surface 121A of the first resin portion 121 is included in the first main surface 101A of the structure 101, and the other main surface 121B is included in the second main surface 101B of the structure 101.
  • the first resin portion 121 is a hard resin for protecting the first electronic component 111 and the second electronic component 112 from external stress or the like, and has higher rigidity than the second resin portion 122.
  • the rigidity of the first resin portion 121 is desirably 70 ° or more and 90 ° or less when defined by the Shore hardness.
  • the material of the first resin portion 121 is not particularly limited, and examples thereof include polyethylene terephthalate resin, polyethylene naphthalate resin, polyimide resin, acrylic resin, urethane resin, and polycarbonate resin.
  • the second resin part 122 is adjacent to the first resin part 121 in the XY plane direction. That is, the first electronic component 111 (second electronic component 112), the first resin portion 121, and the second resin portion 122 are arranged in the XY plane direction.
  • One main surface 122A of the second resin portion 122 is included in the first main surface 101A of the structure 101, and the other main surface 122B is included in the second main surface 101B of the structure 101.
  • the second resin portion 122 is a soft resin for imparting flexibility (flexibility or stretchability) to the structure 101, and has lower rigidity and higher stretchability than the first resin portion 121.
  • the second resin portion 122 has a Shore hardness of less than about 20 °.
  • the expansion / contraction rate of the second resin portion 122 is, for example, 5% or more and 50% or less. According to this, even when the electronic component built-in resin structure 100 is used by being attached to a bonding portion where bending and expansion / contraction occurs in a human body or the like, it follows the bending and expansion / contraction of the bonding portion. It can be deformed without being damaged.
  • the material of the second resin part 122 is not particularly limited as long as it has flexibility.
  • the 1st resin part 121 and the 2nd resin part 122 may be comprised with resin of the same system
  • the main surface 122A of the second resin portion 122 is different from the main surface 121A of the first resin portion 121.
  • the main surfaces 121A and 122A are arranged in the same plane (XY plane).
  • One surface of the terminal electrodes 111A and 112A and the main surface 121A are also arranged in the same plane (XY plane). That is, the first main surface 101 ⁇ / b> A of the structure 101 has a planar shape including one surface of each of the first electronic component 111, the second electronic component 112, the first resin portion 121, and the second resin portion 122.
  • 101 A of 1st main surfaces become a curved surface according to a deformation
  • the main surface 122B of the second resin portion 122 has no step between the main surface 121B of the first resin portion 121 and the main surfaces 121B and 122B are arranged in the same plane (XY plane). However, a step may be formed on the main surfaces 121B and 122B.
  • the second resin portion 122 may overlap the end portion of the first resin portion 121 in the third direction Z. Further, as shown in FIG.
  • the second main surface 121 ⁇ / b> B of the first resin portion 121 may be covered with the second resin portion 122. Since the hardness of the first resin portion 121 is high, the main surface 121B may be difficult to be formed flat, but by providing the configuration of FIG. 1B, the surface flatness of the electronic component built-in resin structure 100 can be easily obtained. Can do.
  • the boundary BR in the surface direction between the first resin portion 121 and the second resin portion 122 is clear in the illustrated example, and extends in the third direction Z that is the thickness direction of the structure 101.
  • the boundary BR may be unclear or complicated.
  • the composition and physical properties at the boundary BR may be in a state where the materials of the first resin portion and the second resin portion are mixed with each other. According to this, when the electronic component built-in resin structure 100 is expanded and contracted in the surface direction, peeling that occurs between the first resin portion 121 and the second resin portion 122 at the boundary BR can be suppressed.
  • the wiring part 141 is provided on the first main surface 101A side of the structure 101 so as to be electrically connected to the terminal electrodes 111A and 112A.
  • the wiring part 141 is provided on the first main surface 101 ⁇ / b> A of the structure 101.
  • the wiring part 141 is provided on the main surface 121A of the first resin part 121, and is connected to the first electronic component 111 and the second electronic component 112 so as to have electrical connection as necessary.
  • the wiring part 141 may also be provided on the main surface 122A of the second resin part 122.
  • the wiring part 141 desirably has elasticity, and desirably has higher elasticity than the first resin part 121.
  • the wiring portion 141 desirably has substantially the same elasticity as the second resin portion 122.
  • the wiring part 141 is provided by, for example, a conductive paste, includes a silicone resin as a binder component, and includes silver (Ag) -based particles and copper (Cu) -based particles as conductive components.
  • a conductive paste includes a silicone resin as a binder component, and includes silver (Ag) -based particles and copper (Cu) -based particles as conductive components.
  • the wiring part 141 is arranged almost all over the cross section of the electronic component built-in resin structure 100 for the sake of convenience. Is formed so as to have electrical characteristics as required, and further connected to the first electronic component 111 and the second electronic component 112 so as to have electrical connection as required.
  • FIG. 2 is a cross-sectional view schematically showing the structure of the electronic component built-in resin structure according to the second embodiment of the present invention.
  • FIG. 2 is a cross-sectional view schematically showing the structure of the electronic component built-in resin structure according to the second embodiment of the present invention.
  • the first electronic component 211 is covered by the first resin portion 221
  • the second electronic component 212 is covered by the third resin portion 223. This is different from the electronic component built-in resin structure 100 according to the embodiment.
  • the third resin portion 223 has the same function as the first resin portion 221 and is a hard resin that protects the second electronic component 212.
  • the first resin portion 221 is provided so as to surround the first electronic component 211 in the XY plane direction, and covers the second main surface 201B side of the first electronic component 211.
  • the third resin portion 223 is provided so as to surround the second electronic component 212 in the XY plane direction, and covers the second main surface 201B side of the second electronic component 212.
  • the third resin part 223 is separated from the first resin part 221 in the XY plane direction.
  • the third resin portion 223 has higher rigidity than the second resin portion 222 and has substantially the same rigidity as the first resin portion 221.
  • the third resin part 223 is provided with the same material as the first resin part 221, but is a material different from the first resin part 221 as long as it is a hard resin capable of protecting the second electronic component 212 from external stress or the like. May be provided.
  • the second resin part 222 is adjacent to the first resin part 221 and adjacent to the third resin part 223 in the XY plane direction.
  • the second resin part 222 connects the first resin part 221 and the third resin part 223 in the YX plane direction.
  • the thickness of the second resin part 222 in the third direction Z is smaller than the thickness of the first resin part 221 in the third direction Z.
  • the other main surface 221B of the first resin portion 221 is provided to be discontinuous with the other main surface 222B of the second resin portion 222 in the XY plane direction.
  • the first resin portion 221 protrudes from the second resin portion 222 in the third direction Z on the second main surface 201B side.
  • the thickness of the second resin part 222 in the third direction Z is larger than the thickness of the third resin part 223 in the third direction Z. Accordingly, the second resin portion 222 covers the other main surface 223B of the third resin portion 223, and the other main surface 223B of the third resin portion 223 is not included in the second main surface 222B.
  • the resin portions 221 and 223 (hard resin) covering the electronic components 211 and 212 are disposed on the second main surface 201B side of the structure 201 opposite to the side where the electronic components 211 and 212 are located. It may be buried in 222 (soft resin) or may protrude from the resin portion 222 (soft resin).
  • the first main surface 201A of the structure 201 includes the first electronic component 211 (terminal electrode 211A), the second electronic component 212 (terminal electrode 212A), the first resin portion 221, the second resin portion 222, and the third. Each side of the resin part 223 is included.
  • FIG. 3 is a cross-sectional view schematically showing the structure of the electronic component built-in resin structure according to the third embodiment of the present invention.
  • the electronic component built-in resin structure 300 according to the third embodiment is different from the electronic component built-in resin structure 100 according to the first embodiment in that an adhesive layer 351 is provided.
  • the adhesive layer 351 is provided on the first main surface 301 ⁇ / b> A of the structure 301 so as to cover the wiring part 341.
  • the adhesive layer 351 is a member for attaching the electronic component built-in resin structure 300, and is configured by, for example, an adhesive film, a pressure sensitive adhesive, or the like.
  • the adhesive layer 351 is desirably provided by a material having biocompatibility.
  • the adhesive layer 351 desirably has high stretchability. The stretchability of the adhesive layer 351 is desirably higher than that of the first resin portion 321 and equivalent to that of the second resin portion 322.
  • FIG. 4 is a cross-sectional view schematically showing the structure of the electronic component built-in resin structure according to the fourth embodiment of the present invention.
  • the electronic component built-in resin structure 400 according to the fourth embodiment is different from the electronic component built-in resin structure 100 according to the first embodiment in that an adhesive layer 451 and a protective layer 452 are provided.
  • the adhesive layer 451 is provided on the second main surface 401B of the structure 401, and covers the main surface 421B of the first resin portion 421 and the main surface 422B of the second resin portion 422.
  • the adhesive layer 451 may have the same materials and physical properties as the adhesive layer 351 of the third embodiment.
  • the protective layer 452 is provided on the first main surface 401A of the structure 401 so as to cover the wiring portion 441.
  • the protective layer 452 is a member for protecting the wiring portion 441 from damage due to external stress, deterioration due to oxidation, and the like.
  • the wiring portion 441 desirably has a high gas barrier property against, for example, oxygen and water vapor, and a high durability against chemical substances such as acids, alkalis, and oils and fats. It is desirable that the protective layer 452 has high stretchability.
  • the stretchability of the protective layer 452 is preferably higher than that of the first resin portion 421 and equivalent to the second resin portion 422.
  • FIG. 5 is a cross-sectional view schematically showing the structure of the electronic component built-in resin structure according to the fifth embodiment of the present invention.
  • the electronic component built-in resin structure 500 according to the fifth embodiment is different from the electronic component built-in resin structure 100 according to the first embodiment in that it includes a plurality of structures 501, 502, and 503.
  • the structures 501, 502, and 503 have the same configuration as that of the structure 101 of the first embodiment. That is, the structure 501 includes a first resin part 521 that covers the first electronic component 511 and the second electronic component 512, and a second resin part 522 that is adjacent to the first resin part 521 in the XY plane direction.
  • the structural body 502 includes a fourth resin portion 524 that covers the third electronic component 513 and the fourth electronic component 514, and a fifth resin portion 525 that is adjacent to the fourth resin portion 524 in the XY plane direction.
  • the structure 503 includes a sixth resin part 526 that covers the fifth electronic component 515 and the sixth electronic component 516 and a seventh resin part 527 that is adjacent to the sixth resin part 526 in the XY plane direction.
  • the 1st resin part 521, the 4th resin part 524, and the 6th resin part 526 are comprised with the material similar to the 1st resin part 121 of 1st Embodiment, and have the same physical property.
  • the 2nd resin part 522, the 5th resin part 525, and the 7th resin part 527 are comprised with the material similar to the 2nd resin part 122 of 1st Embodiment, and have the same physical property.
  • a wiring portion 541 is provided on the first main surface 501A of the structure body 501, and a wiring portion 542 is provided on the third main surface 502A of the structure body 502.
  • the fifth main surface 503A of the structure body 503 is provided.
  • a wiring portion 543 is provided above.
  • the structure 501 further includes an interlayer connection terminal 571 provided so as to penetrate the first resin portion 521 in the third direction Z.
  • the structure 502 further includes an interlayer connection terminal 572 provided so as to penetrate the fourth resin portion 524 in the third direction Z.
  • an external electrode 589 for electrically connecting the electronic component built-in resin structure 500 to an external wiring or the like is provided on the fourth main surface 502B of the structure 502.
  • the interlayer connection terminal 571 is electrically connected to the wiring portion 541.
  • the interlayer connection terminal 572 is electrically connected to the wiring portion 542.
  • the structures 501, 502, and 503 are stacked so that their main surfaces face each other. Specifically, the first main surface 501A of the structure body 501 and the third main surface 502A of the structure body 502 are bonded to each other with the adhesive layer 561. A conductive portion 581 is provided in the adhesive layer 561 so as to penetrate in the third direction Z, and the conductive portion 581 electrically connects the wiring portion 541 and the wiring portion 542. In addition, the second main surface 501B of the structure 501 and the fifth main surface 503A of the structure 503 are bonded to each other with an adhesive layer 562.
  • a conductive part 582 is provided in the adhesive layer 562 so as to penetrate in the third direction Z, and the conductive part 582 electrically connects the interlayer connection terminal 571 and the wiring part 543. Therefore, the structure body 501 and the structure body 502 are electrically connected through the conductive portion 581, and the structure body 501 and the structure body 503 are electrically connected through the conductive portion 582.
  • the wiring portion 542 is electrically connected to the external electrode 589 through the interlayer connection terminal 572.
  • the conductive portion 581 includes the first resin portion 521 and the fourth resin portion 524 that are made of hard resin. It is desirable that at least one of the two faces in the third direction Z. Similarly, it is desirable that the conductive portion 582 is opposed to at least one of the first resin portion 521 and the sixth resin portion 526 made of hard resin in the third direction Z. Similarly, it is desirable that the external electrode 589 is opposed to the fourth resin portion 524 made of hard resin in the third direction Z.
  • the adhesive layer 561 and the adhesive layer 562 have high stretchability. Specifically, it is desirable that the stretchability is higher than that of the first resin portion 521, the fourth resin portion 524, and the sixth resin portion 526, and the second resin portion 522, the fifth resin portion 525, and the sixth resin portion. It is desirable to have stretchability equivalent to 526.
  • the adhesive layer 561 and the adhesive layer 562 are made of, for example, a UV curable adhesive or a thermosetting adhesive, but may be made of the same material as the adhesive layer 351 of the third embodiment.
  • FIG. 6A is a figure which shows the process of providing an electronic component on a support body in 6th Embodiment of this invention.
  • FIG. 6B is a diagram showing a step of providing a resin composition on a support in the sixth embodiment of the present invention.
  • FIG. 6C is a diagram showing a step of curing the resin composition in the sixth embodiment of the present invention.
  • FIG. 6D is a diagram showing a step of peeling the support from the first main surface in the sixth embodiment of the present invention.
  • FIG. 6E is a diagram showing a step of providing a wiring portion on the first main surface in the sixth embodiment of the present invention.
  • the support 690 is a heat-foaming pressure-sensitive adhesive sheet whose adhesive strength is reduced by applying heat.
  • the electronic components 611 and 612 are aligned and bonded to the support 690 so that the terminal electrodes 611A and 612A face the adhesive surface side of the support 690.
  • the support 690 is not particularly limited as long as the electronic components 611 and 612 can be temporarily fixed and peeled off.
  • the UV-type pressure-sensitive adhesive sheet whose adhesive strength is reduced by irradiating ultraviolet rays. It may be.
  • a paste-like first resin composition 631 and second resin composition 632 are provided.
  • the first resin composition 631 and the second resin composition 632 include a UV curable resin.
  • the first resin composition 631 is applied onto the support 690 so as to cover the electronic components 611 and 612 using the dispenser 691.
  • the second resin composition 632 is coated on the support 690 so as to be adjacent to the first resin composition 631 using the dispenser 691.
  • the first resin composition 631 and the second resin composition 632 are mixed with each other at the boundary BR.
  • the coating method of the 1st resin composition 631 and the 2nd resin composition 632 is not specifically limited, Screen printing, inkjet printing, gravure printing, flexographic printing, other transfer printing, etc. may be sufficient.
  • the first resin composition 631 and the second resin composition 632 are cured by irradiating ultraviolet rays 692.
  • the first resin portion 621 is provided from the first resin composition 631 and the second resin portion 622 is provided from the second resin composition 632.
  • the structure 601 is completed on the support 690.
  • the boundary BR since the first resin composition 631 and the second resin composition 632 are mixed, the first resin part 621 and the second resin part 622 form a gradation.
  • the ultraviolet rays 692 are irradiated under irradiation conditions that do not damage the support 690, the first resin portion 621, and the second resin portion 622.
  • irradiation conditions are set so that the temperature rise due to the irradiation of the ultraviolet rays 692 does not decrease the adhesive strength.
  • the support 690 is a UV-type pressure-sensitive adhesive sheet, Irradiation conditions are set so that the support 690 does not absorb the ultraviolet light 692 and reduce the adhesive force.
  • the 1st resin part 621 and the 2nd resin part 622 are not limited to UV curable resin, You may contain energy ray curable resins other than a thermosetting resin and an ultraviolet-ray.
  • the peeling temperature at which the adhesive strength of the support 690 decreases is the first resin composition. It is set higher than the curing temperature of the product 631 and the second resin composition 632 and lower than the glass transition temperature (Tg) of the first resin part 621 and the second resin part 622.
  • the first resin portion 621 and the second resin portion 622 are formed by applying both the first resin composition 631 and the second resin composition 632 and then curing them. These may be formed by sequentially curing. For example, the first resin composition 631 may be applied and cured, and then the second resin portion 622 may be applied and cured. According to this, it can suppress that the rigidity of the resin part which covers the electronic components 611 and 612 falls by the excessive mixing of the 1st resin composition 631 and the 2nd resin composition 632. Moreover, you may form the 1st resin part 621 and the 2nd resin part 622 from one type of resin composition.
  • a resin composition can be applied on the support 690, the resin composition can be thermally cured, and ultraviolet rays can be irradiated only around the electronic components 611 and 612 to impart a hardness difference. According to this, it is possible to save labor in the coating process.
  • the support 690 is peeled from the first main surface 601 ⁇ / b> A of the structure 601.
  • the support 690 is heated by hot air 693 to reduce the adhesive force, and then peeled off. Since the terminal electrodes 611A and 612A of the electronic components 611 and 612 are attached to the support 690, the first main surface 601A is exposed by peeling the support 690.
  • the first resin portion 621 and the second resin portion 622 are provided on the support body 690, the main surface 621 ⁇ / b> A of the first resin portion 621 and the second resin portion 622 are separated by peeling the support body 690.
  • Main surface 622A is included in first main surface 601A.
  • a wiring portion 641 is provided on the first main surface 601A of the structure 601.
  • the formation process of the wiring part 641 uses screen printing, and is applied by applying a conductive paste 640 to the mask 694 disposed above the first main surface 601A by using a squeegee 95 and passing through the opening of the mask 694.
  • the conductive paste 640 patterned on the first principal surface 601A is dried with hot air 693.
  • the wiring portion 641 provided by drying the conductive paste 640 has a shape corresponding to the opening of the mask 694.
  • the pattern formation of the electrically conductive paste 640 is not specifically limited, For example, inkjet printing, gravure printing, flexographic printing, other transfer printing, direct drawing with a dispenser, etc. may be sufficient.
  • FIG. 7A is a figure which shows the process of providing a wiring part on a support body in 7th Embodiment of this invention.
  • FIG. 7B is a diagram illustrating a process of providing an electronic component so as to be electrically connected to the wiring portion in the seventh embodiment of the present invention.
  • FIG. 7C is a diagram illustrating a process of providing the first resin portion and the second resin portion in the seventh embodiment of the present invention.
  • FIG. 7D is a diagram showing a step of peeling the support from the first main surface in the seventh embodiment of the present invention. Note that description of the same steps as those in the sixth embodiment is omitted.
  • a wiring portion 741 is formed on the support 790 with a pattern.
  • the support 790 is a metal plate having an easily peelable layer on the surface.
  • the easily peelable layer is weak in chemical / physical bond with the wiring portion 741 and facilitates peeling of the support 790 from the wiring portion 741.
  • a heat-foaming pressure-sensitive adhesive sheet or a UV-type pressure-sensitive adhesive sheet It is.
  • connection material 711 and 712 are mounted on the wiring portion 741.
  • the electronic components 711 and 712 are fixed by connecting materials 711B and 712B so that the terminal electrodes 711A and 712A are electrically connected to the wiring portion 741.
  • the connecting materials 711B and 712B are, for example, solder materials or brazing materials.
  • the connecting material 711B is provided in a bump shape between the terminal electrode 711A and the wiring portion 741.
  • the connecting material 712B is provided in a fillet shape on the side surface of the electronic component 712.
  • the connection material may be a terminal electrode or a fixture such as a pin or a nail as long as it can fix the electronic component.
  • a first resin portion 721 and a second resin portion 722 are provided.
  • the first resin portion 721 is provided on the wiring portion 741 so as to cover the electronic components 711 and 712, and the second resin portion 722 is adjacent to the first resin portion 721 so that the wiring portion 741 and Provided on a support 790.
  • a structure 701 including the wiring portion 741 is completed on the support 790.
  • the first resin portion 721 is also provided on the support 790 through the gap of the wiring portion 741.
  • the first main surface 701A of the completed structure 701 includes one surface of the wiring portion 741, one surface (not shown) of the first resin portion 721, and one surface of the second resin portion 722. That is, one surface of the wiring portion 741 is arranged on the same plane as one surface (not shown) of the first resin portion 721 and one surface of the second resin portion 722.
  • the electronic components 711 and 712 are separated from the first main surface 701A, and a wiring portion 741 is provided between the electronic components 711 and 712 and the first main surface 701A.
  • the first main surface 101A and the second main surface 101B that face each other have elasticity in a plane direction parallel to the first main surface 101A
  • An electronic component built-in resin structure 100 including an electronic component 111, which includes a first resin portion 121 that covers the first electronic component 111 and a second resin portion 122 that is adjacent to the first resin portion 121 in the surface direction.
  • the first resin part 121 has a higher rigidity than the second resin part 122
  • the second resin part 122 is provided with an electronic component built-in resin structure having a higher elasticity than the first resin part 121.
  • the first electronic component is protected by the highly rigid first resin portion, it is possible to reduce damage to the first electronic component.
  • the second resin portion having high stretchability is adjacent to the first resin portion in the surface direction, the stretchability in the surface direction of the electronic component built-in resin structure can be ensured. That is, both the flexibility and durability characteristics of the resin structure with built-in electronic components can be improved.
  • the electronic component built-in resin structure 200 further includes a second electronic component 212 aligned with the first electronic component 211 in the surface direction, and a third higher rigidity than the second resin portion 222 covering the second electronic component 212 in the surface direction.
  • the second resin part 222 may connect the first resin part 221 and the third resin part 223 in the surface direction. According to this, by connecting a plurality of hard resins covering a plurality of electronic components in the surface direction with a highly stretchable soft resin, the electronic component built-in resin structure is an integrated circuit including a plurality of electronic components. Also, sufficient stretchability in the surface direction can be ensured.
  • the electronic component built-in resin structure 200 may further include a wiring portion 241 provided on the first main surface 201A side and having elasticity, and the wiring portion 241 may be electrically connected to the first electronic component 211. According to this, the damage of the wiring part in the expansion / contraction / bending of the resin structure with a built-in electronic component can be suppressed, and the durability can be improved.
  • the first main surface 101 ⁇ / b> A may include one surface of each of the first electronic component 111, the first resin portion 121, and the second resin portion 122, and may be in contact with the wiring portion 141. Further, the first main surface 701A may include one surface of the wiring portion 741.
  • the electronic component built-in resin structure 300 may further include a first adhesive layer 351 on the first main surface 301A. According to this, the electronic component built-in resin structure can be bonded and used at the bonding location where the human body or the like is bent and stretched. Moreover, since the structure is directly bonded to the bonding location with the adhesive layer without providing a substrate extending over the entire surface of the first main surface, the resin structure with a built-in electronic component can be thinned. In addition, since the wiring part is located inside after bonding, the first resin part and the second resin part function as a protective film for the wiring part, and the wiring part due to external stress from the second main surface side Damage can be suppressed.
  • the electronic component built-in resin structure 400 may further include a second adhesive layer 451 provided on the second main surface 401B. According to this, the electronic component built-in resin structure can be bonded and used at the bonding location where the human body or the like is bent and stretched. Moreover, since the structure is directly bonded to the bonding position with the adhesive layer without providing a substrate extending over the entire surface of the second main surface, the resin structure with a built-in electronic component can be thinned.
  • the electronic component built-in resin structure 400 may further include a protective layer 452 having elasticity on the first main surface 401A. According to this, it is possible to suppress damage to the wiring portion without hindering the flexibility of the electronic component built-in resin structure.
  • the electronic component built-in resin structure 500 includes a first electronic component 511, a first resin portion 521, and a second resin portion 522, and includes a first structure 501 having a first main surface 501A and a second main surface 502A, It has a third main surface 502A and a fourth main surface 502B that face each other, has elasticity in a plane direction parallel to the third main surface 502A, incorporates a third electronic component 513, and the main surfaces face each other.
  • the second structure 502 is laminated on the first structure 501 as described above.
  • the second structure 502 includes a fourth resin portion 524 that covers the third electronic component 513 and a fourth resin portion 524 in the surface direction.
  • a fourth resin portion 525, the fourth resin portion 524 has higher rigidity than the fifth resin portion 525, and the fifth resin portion 525 has higher elasticity than the fourth resin portion 524,
  • the first structure 501 and the second structure 502 are electrically connected to each other. It may be connected to.
  • the resin structure with a built-in electronic component can realize a more advanced function by accumulating a plurality of electronic components in the interlayer direction intersecting the surface direction while maintaining the stretchability in the surface direction. it can.
  • the laminated structure is not provided with a substrate extending over the entire main surface.
  • a substrate over the entire main surface is not provided between the stacked structures, and the stacked bodies are directly bonded to each other through an adhesive layer. Thereby, even if it laminates
  • the electronic component 611 includes a first main surface 601A and a second main surface 601B facing each other, and has elasticity in a plane direction parallel to the first main surface 601A.
  • 612 is a method of manufacturing a resin structure 600 with a built-in electronic component, the step of placing the electronic components 611 and 612 on the support 690, and the electronic components 611 and 612 covered on the support 690. The step of providing the first resin portion 621 and providing the second resin portion 622 adjacent to the first resin portion 621 in the surface direction, and the electronic components 611, 612, the first resin portion 621, and the second resin portion 622, respectively.
  • the electronic component is protected by the highly rigid first resin portion, it is possible to reduce damage to the electronic component.
  • the second resin portion having high stretchability is adjacent to the first resin portion in the surface direction, the stretchability in the surface direction of the electronic component built-in resin structure can be ensured. That is, both the flexibility and durability characteristics of the resin structure with built-in electronic components can be improved.
  • the electronic component 711 has a first main surface 701A and a second main surface 701B facing each other, and has elasticity in a plane direction parallel to the first main surface 701A.
  • 712 is a method of manufacturing a resin structure 700 with a built-in electronic component, the step of providing a wiring portion 741 on a support 790, and mounting the electronic components 711 and 712 so as to be electrically connected to the wiring portion 741.
  • the first resin portion 721 has higher rigidity than the second resin portion 722, and the second resin portion 722 includes the first main surface 701A including one surface. More elastic than resin part 721 Is high, a manufacturing method of an electronic component built resin structure, is provided.
  • the electronic component is protected by the highly rigid first resin portion, it is possible to reduce damage to the electronic component.
  • the second resin portion having high stretchability is adjacent to the first resin portion in the surface direction, the stretchability in the surface direction of the electronic component built-in resin structure can be ensured. That is, both the flexibility and durability characteristics of the resin structure with built-in electronic components can be improved.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

A resin structure (100) with a built-in electronic component, which internally contains a first electronic component (111), while having a first main surface (101A) and a second main surface (101B) that face each other, and which is stretchable in a plane direction that is parallel to the first main surface (101A). This resin structure (100) comprises a first resin part (121) which covers the first electronic component (111) and a second resin part (122) which is adjacent to the first resin part (121) in the plane direction. The first resin part (121) has a higher stiffness than the second resin part (122), while the second resin part (122) has a higher stretchability than the first resin part (121).

Description

電子部品内蔵樹脂構造体及びその製造方法Electronic component built-in resin structure and manufacturing method thereof
　本発明は、電子部品内蔵樹脂構造体及びその製造方法に関する。 The present invention relates to a resin structure with a built-in electronic component and a manufacturing method thereof.
　近年、携帯電話やモバイルパソコン等の携帯用電子機器、及び電子体温計や血圧計に代表される健康機器、等の民生用電子機器において、ウェアラブルな製品を提供するため、電子部品を搭載した基板として、可撓性を有する電子部品内蔵樹脂構造体が求められている。当該電子部品内蔵樹脂構造体は、屈曲性及び伸縮性が要求され、さらに薄型、軽量、小型、高耐久、且つ安価であることが求められる。 In recent years, in order to provide wearable products in portable electronic devices such as mobile phones and mobile personal computers, and consumer electronic devices such as electronic thermometers and sphygmomanometers, as substrates equipped with electronic components There is a demand for a resin structure with a flexible electronic component. The electronic component-embedded resin structure is required to be flexible and stretchable, and further required to be thin, lightweight, small, highly durable, and inexpensive.
　特許文献１には、樹脂成形体と、その中に埋設された複数の電子部品と、を備え、薄型化・小型化した樹脂構造体が開示されている。当該樹脂構造体は、樹脂形成体に電子部品の電極が露出する露出面を有し、樹脂形成体の凹部の底面が当該露出面であることを特徴とし、回路設計の自由度を高めている。 Patent Document 1 discloses a resin structure that includes a resin molded body and a plurality of electronic components embedded therein, and is thinned and miniaturized. The resin structure has an exposed surface from which an electrode of an electronic component is exposed on the resin formed body, and the bottom surface of the concave portion of the resin formed body is the exposed surface, increasing the degree of freedom in circuit design. .
特開２０１５－２０７７０３号公報JP2015-207703A
　しかしながら、特許文献１に記載の樹脂構造体において樹脂成形体が高い剛性を有するときは屈曲や伸縮等の変形が生じる場所には当該樹脂構造体を適用できない恐れがあり、樹脂成形体が高い伸縮性を有するときは外部応力が電子部品に及ぶことによって破損し樹脂構造体の機能が損なわれる恐れがある。 However, in the resin structure described in Patent Document 1, when the resin molded body has high rigidity, there is a possibility that the resin structure cannot be applied to a place where deformation such as bending or expansion / contraction occurs. When it has the property, it may be damaged by external stress reaching the electronic component and the function of the resin structure may be impaired.
　本発明はこのような事情に鑑みてなされたものであり、良好な可撓性及び耐久性の両立を図ることができる電子部品内蔵樹脂構造体を提供することを目的とする。 The present invention has been made in view of such circumstances, and an object thereof is to provide an electronic component built-in resin structure capable of achieving both good flexibility and durability.
　本発明の一側面に係る電子部品内蔵樹脂構造体は、互いに対向する第１主面及び第２主面を有し、第１主面と平行な面方向に伸縮性を有し、第１電子部品を内蔵する電子部品内蔵樹脂構造体であって、第１電子部品を覆う第１樹脂部と、面方向において第１樹脂部に隣接する第２樹脂部と、を備え、第１樹脂部は、第２樹脂部よりも剛性が高く、第２樹脂部は、第１樹脂部よりも伸縮性が高い。 An electronic component built-in resin structure according to one aspect of the present invention has a first main surface and a second main surface that face each other, and has elasticity in a plane direction parallel to the first main surface. An electronic component built-in resin structure incorporating a component, comprising: a first resin portion that covers the first electronic component; and a second resin portion that is adjacent to the first resin portion in the surface direction. The rigidity of the second resin part is higher than that of the second resin part, and the second resin part has higher elasticity than the first resin part.
　本発明の他の一側面に係る電子部品内蔵樹脂構造体の製造方法は、互いに対向する第１主面及び第２主面を有し、第１主面と平行な面方向に伸縮性を有し、電子部品を内蔵する電子部品内蔵樹脂構造体の製造方法であって、支持体の上に電子部品を設置する工程と、支持体の上に電子部品を覆うように第１樹脂部を設け、面方向において第１樹脂部に隣接する第２樹脂部を設ける工程と、電子部品、第１樹脂部、及び第２樹脂部のそれぞれの一面を含む第１主面から支持体を剥離する工程と、電子部品に電気的に接続するように第１主面の上に配線部を設ける工程と、を含み、第１樹脂部は、第２樹脂部よりも剛性が高く、第２樹脂部は、第１樹脂部よりも伸縮性が高い。 According to another aspect of the present invention, there is provided a method for manufacturing an electronic component-embedded resin structure having a first main surface and a second main surface facing each other, and having elasticity in a plane direction parallel to the first main surface. A method of manufacturing an electronic component built-in resin structure incorporating an electronic component, the step of installing the electronic component on the support, and the first resin portion provided on the support so as to cover the electronic component A step of providing a second resin portion adjacent to the first resin portion in the surface direction, and a step of peeling the support from the first main surface including one surface of each of the electronic component, the first resin portion, and the second resin portion. And providing a wiring portion on the first main surface so as to be electrically connected to the electronic component, wherein the first resin portion is higher in rigidity than the second resin portion, and the second resin portion is The elasticity is higher than that of the first resin portion.
　本発明の他の一側面に係る電子部品内蔵樹脂構造体の製造方法は、互いに対向する第１主面及び第２主面を有し、第１主面と平行な面方向に伸縮性を有し、電子部品を内蔵する電子部品内蔵樹脂構造体の製造方法であって、支持体の上に配線部を設ける工程と、配線部に電気的に接続するように電子部品を実装する工程と、支持体の上に電子部品を覆うように第１樹脂部を設け、面方向において第１樹脂部に隣接する第２樹脂部を設ける工程と、配線部の一面を含む第１主面から支持体を剥離する工程と、を含み、第１樹脂部は、第２樹脂部よりも剛性が高く、第２樹脂部は、第１樹脂部よりも伸縮性が高い。 According to another aspect of the present invention, there is provided a method for manufacturing an electronic component-embedded resin structure having a first main surface and a second main surface facing each other, and having elasticity in a plane direction parallel to the first main surface. And a method of manufacturing an electronic component built-in resin structure incorporating an electronic component, the step of providing a wiring portion on a support, the step of mounting the electronic component so as to be electrically connected to the wiring portion, The first resin part is provided on the support so as to cover the electronic component, the step of providing the second resin part adjacent to the first resin part in the surface direction, and the support from the first main surface including one surface of the wiring part The first resin part has higher rigidity than the second resin part, and the second resin part has higher stretchability than the first resin part.
　本発明によれば、良好な可撓性及び耐久性の両立を図ることができる電子部品内蔵樹脂構造体を提供することが可能となる。 According to the present invention, it is possible to provide an electronic component built-in resin structure capable of achieving both good flexibility and durability.
図１Ａは、本発明の第１実施形態に係る電子部品内蔵樹脂構造体の構造を概略的に示す断面図である。FIG. 1A is a cross-sectional view schematically showing the structure of the electronic component built-in resin structure according to the first embodiment of the present invention. 図１Ｂは、第１実施形態の変形例に係る電子部品内蔵樹脂構造体の構造を概略的に示す断面図である。FIG. 1B is a cross-sectional view schematically showing the structure of an electronic component built-in resin structure according to a modification of the first embodiment. 図２は、本発明の第２実施形態に係る電子部品内蔵樹脂構造体の構造を概略的に示す断面図である。FIG. 2 is a cross-sectional view schematically showing the structure of the electronic component built-in resin structure according to the second embodiment of the present invention. 図３は、本発明の第３実施形態に係る電子部品内蔵樹脂構造体の構造を概略的に示す断面図である。FIG. 3 is a cross-sectional view schematically showing the structure of the electronic component built-in resin structure according to the third embodiment of the present invention. 図４は、本発明の第４実施形態に係る電子部品内蔵樹脂構造体の構造を概略的に示す断面図である。FIG. 4 is a cross-sectional view schematically showing the structure of the electronic component built-in resin structure according to the fourth embodiment of the present invention. 図５は、本発明の第５実施形態に係る電子部品内蔵樹脂構造体の構造を概略的に示す断面図である。FIG. 5 is a cross-sectional view schematically showing the structure of an electronic component built-in resin structure according to a fifth embodiment of the present invention. 図６Ａは、本発明の第６実施形態において、支持体の上に電子部品を設ける工程を示す図である。FIG. 6A is a diagram showing a process of providing an electronic component on a support in the sixth embodiment of the present invention. 図６Ｂは、本発明の第６実施形態において、支持体の上に樹脂組成物を設ける工程を示す図である。FIG. 6B is a diagram showing a step of providing a resin composition on a support in the sixth embodiment of the present invention. 図６Ｃは、本発明の第６実施形態において、樹脂組成物を硬化させる工程を示す図である。FIG. 6C is a diagram showing a step of curing the resin composition in the sixth embodiment of the present invention. 図６Ｄは、本発明の第６実施形態において、第１主面から支持体を剥離する工程を示す図である。FIG. 6D is a diagram showing a step of peeling the support from the first main surface in the sixth embodiment of the present invention. 図６Ｅは、本発明の第６実施形態において、第１主面の上に配線部を設ける工程を示す図である。FIG. 6E is a diagram showing a step of providing a wiring portion on the first main surface in the sixth embodiment of the present invention. 図７Ａは、本発明の第７実施形態において、支持体の上に配線部を設ける工程を示す図である。FIG. 7A is a diagram illustrating a process of providing a wiring portion on a support in the seventh embodiment of the present invention. 図７Ｂは、本発明の第７実施形態において、配線部に電気的に接続するように電子部品を設ける工程を示す図である。FIG. 7B is a diagram illustrating a process of providing an electronic component so as to be electrically connected to the wiring portion in the seventh embodiment of the present invention. 図７Ｃは、本発明の第７実施形態において、第１樹脂部及び第２樹脂部を設ける工程を示す図である。FIG. 7C is a diagram illustrating a process of providing the first resin portion and the second resin portion in the seventh embodiment of the present invention. 図７Ｄは、本発明の第７実施形態において、第１主面から支持体を剥離する工程を示す図である。FIG. 7D is a diagram showing a step of peeling the support from the first main surface in the seventh embodiment of the present invention.
　以下に本発明の実施形態を説明する。以下の図面の記載において、同一又は類似の構成要素は同一又は類似の符号で表している。図面は例示であり、各部の寸法や形状は模式的なものであり、本願発明の技術的範囲を当該実施形態に限定して解するべきではない。 Embodiments of the present invention will be described below. In the following description of the drawings, the same or similar components are denoted by the same or similar reference numerals. The drawings are exemplary, the dimensions and shapes of each part are schematic, and the technical scope of the present invention should not be limited to the embodiment.
　以下の説明において、第１方向Ｘ、第２方向Ｙ、及び第３方向Ｚは例えば互いに直交する方向であるが、互いに交差する方向であれば特に限定されるものではなく、互いに直角以外の角度で交差する方向であってもよい。なお、本願明細書において、主面とは、第１方向Ｘ及び第２方向Ｙによって特定される面（以下、ＸＹ面と呼ぶ。）と平行な面であるものとする。また、厚さとは、ＸＹ面と直交する方向である第３方向Ｚに沿った厚さであるものとする。 In the following description, the first direction X, the second direction Y, and the third direction Z are, for example, directions orthogonal to each other, but are not particularly limited as long as they intersect with each other, and angles other than a right angle to each other The crossing direction may be used. In the present specification, the main surface is a surface parallel to a surface specified by the first direction X and the second direction Y (hereinafter referred to as XY surface). The thickness is a thickness along the third direction Z that is a direction orthogonal to the XY plane.
　＜第１実施形態＞
　図１Ａ及び図１Ｂを参照しつつ、本発明の第１実施形態に係る電子部品内蔵樹脂構造体１００の構成について説明する。このとき、図１Ａは、本発明の第１実施形態に係る電子部品内蔵樹脂構造体の構造を概略的に示す断面図である。図１Ｂは、第１実施形態の変形例に係る電子部品内蔵樹脂構造体の構造を概略的に示す断面図である。 <First Embodiment>
The configuration of the electronic component built-in resin structure 100 according to the first embodiment of the present invention will be described with reference to FIGS. 1A and 1B. At this time, FIG. 1A is a cross-sectional view schematically showing the structure of the electronic component built-in resin structure according to the first embodiment of the present invention. FIG. 1B is a cross-sectional view schematically showing the structure of an electronic component built-in resin structure according to a modification of the first embodiment.
　電子部品内蔵樹脂構造体１００は、互いに対向する第１主面１０１Ａ及び第２主面１０１Ｂを有する構造体１０１と、構造体１０１の第１主面１０１Ａの上に設けられた配線部１４１と、を備えている。 The electronic component built-in resin structure 100 includes a structure body 101 having a first main surface 101A and a second main surface 101B facing each other, a wiring portion 141 provided on the first main surface 101A of the structure body 101, It has.
　構造体１０１は、第１電子部品１１１、第２電子部品１１２、第１樹脂部１２１、及び第２樹脂部１２２を備えている。第１電子部品１１１及び第２電子部品１１２は、第１主面１０１Ａと平行なＸＹ面方向に離れて並んでいる。なお、電子部品は、ＩＣやＳＡＷデバイスなどの電子部品、コンデンサ、抵抗、コイルなどのチップ状の電子部品などを用いることができる。図示した例では、第１電子部品１１１はその底面に端子電極１１１Ａを備え、第２電子部品１１２はその両端に端子電極１１２Ａを備えており、第１電子部品１１１の端子電極１１１Ａの一面及び第２電子部品１１２の端子電極１１２Ａの一面は第１主面１０１Ａと同一面上に配置されている。なお、第１の電子部品の本体部は、第１主面１０１Ａとの間に所定の空間（例えば、５０μｍ以上１００μｍ以下）を有していてもよい。このように、第１電子部品１１１及び第２電子部品１１２のそれぞれの一面、より具体的には端子電極１１１Ａ及び端子電極１１２Ａのそれぞれの一面が、第１主面１０１Ａに含まれている。なお、図１Ａにおいては端子電極１１１Ａ、１１２Ａと配線部１４１とは直接接続されているが、端子電極１１１Ａ、１１２Ａと配線部１４１との間に導電性ペーストや低融点はんだ等の接続材を配置してもよい。 The structural body 101 includes a first electronic component 111, a second electronic component 112, a first resin portion 121, and a second resin portion 122. The first electronic component 111 and the second electronic component 112 are arranged away from each other in the XY plane direction parallel to the first main surface 101A. As the electronic component, an electronic component such as an IC or a SAW device, a chip-shaped electronic component such as a capacitor, a resistor, or a coil can be used. In the illustrated example, the first electronic component 111 is provided with a terminal electrode 111A on the bottom surface, the second electronic component 112 is provided with terminal electrodes 112A on both ends thereof, the one surface of the terminal electrode 111A of the first electronic component 111 and the first surface. One surface of the terminal electrode 112A of the two electronic component 112 is disposed on the same surface as the first main surface 101A. Note that the main body of the first electronic component may have a predetermined space (for example, 50 μm or more and 100 μm or less) between the first main surface 101A. As described above, one surface of each of the first electronic component 111 and the second electronic component 112, more specifically, one surface of each of the terminal electrode 111A and the terminal electrode 112A is included in the first main surface 101A. In FIG. 1A, the terminal electrodes 111A and 112A and the wiring part 141 are directly connected. However, a connecting material such as a conductive paste or a low melting point solder is disposed between the terminal electrodes 111A and 112A and the wiring part 141. May be.
　第１樹脂部１２１は、第１電子部品１１１及び第２電子部品１１２を覆っている。具体的には、第１樹脂部１２１は、ＸＹ面方向において、第１電子部品１１１及び第２電子部品１１２を囲むように設けられている。また、第１樹脂部１２１は、第１電子部品１１１及び第２電子部品１１２の第２主面１０１Ｂ側を覆っており、第１主面１０１Ａ側には設けられていない。但し、第１樹脂部１２１は、第１電子部品１１１の本体部と第１主面１０１Ａとの間の所定の空間にも設けられていてもよい。第１樹脂部１２１の一方の主面１２１Ａは構造体１０１の第１主面１０１Ａに含まれ、他方の主面１２１Ｂは構造体１０１の第２主面１０１Ｂに含まれている。 The first resin part 121 covers the first electronic component 111 and the second electronic component 112. Specifically, the first resin portion 121 is provided so as to surround the first electronic component 111 and the second electronic component 112 in the XY plane direction. The first resin portion 121 covers the second main surface 101B side of the first electronic component 111 and the second electronic component 112, and is not provided on the first main surface 101A side. However, the first resin portion 121 may also be provided in a predetermined space between the main body portion of the first electronic component 111 and the first main surface 101A. One main surface 121A of the first resin portion 121 is included in the first main surface 101A of the structure 101, and the other main surface 121B is included in the second main surface 101B of the structure 101.
　第１樹脂部１２１は、第１電子部品１１１及び第２電子部品１１２を外部応力等から保護するための硬質樹脂であり、第２樹脂部１２２よりも剛性が高い。第１樹脂部１２１の剛性は、ショア硬度によって規定すると、７０°以上９０°以下であることが望ましい。第１樹脂部１２１の材料は特に限定されず、例えば、ポリエチレンテレフタレート系樹脂、ポリエチレンナフタレート系樹脂、ポリイミド系樹脂、アクリル系樹脂、ウレタン系樹脂、ポリカーボネート系樹脂、等が挙げられる。 The first resin portion 121 is a hard resin for protecting the first electronic component 111 and the second electronic component 112 from external stress or the like, and has higher rigidity than the second resin portion 122. The rigidity of the first resin portion 121 is desirably 70 ° or more and 90 ° or less when defined by the Shore hardness. The material of the first resin portion 121 is not particularly limited, and examples thereof include polyethylene terephthalate resin, polyethylene naphthalate resin, polyimide resin, acrylic resin, urethane resin, and polycarbonate resin.
　第２樹脂部１２２は、ＸＹ面方向において、第１樹脂部１２１に隣接している。つまり、第１電子部品１１１（第２電子部品１１２）、第１樹脂部１２１、及び第２樹脂部１２２は、ＸＹ面方向で並んでいる。第２樹脂部１２２の一方の主面１２２Ａは構造体１０１の第１主面１０１Ａに含まれ、他方の主面１２２Ｂは構造体１０１の第２主面１０１Ｂに含まれている。 The second resin part 122 is adjacent to the first resin part 121 in the XY plane direction. That is, the first electronic component 111 (second electronic component 112), the first resin portion 121, and the second resin portion 122 are arranged in the XY plane direction. One main surface 122A of the second resin portion 122 is included in the first main surface 101A of the structure 101, and the other main surface 122B is included in the second main surface 101B of the structure 101.
　第２樹脂部１２２は、構造体１０１に可撓性（屈曲性や伸縮性）を付与するための軟質樹脂であり、第１樹脂部１２１よりも剛性が低く、伸縮性が高い。例えば、第２樹脂部１２２は、ショア硬度にして２０°未満程度であることが望ましい。第２樹脂部１２２の伸縮率は、例えば５％以上５０％以下である。これによれば、電子部品内蔵樹脂構造体１００は、人体等の屈曲及び伸縮が生じる貼合箇所に貼り付けて使用される場合であっても、当該貼合箇所の屈曲及び伸縮に追従して損傷することなく変形することができる。第２樹脂部１２２の材料は柔軟性を有していれば特に限定されるものではなく、例えば、シリコーン系樹脂、ウレタン系樹脂、アクリル系樹脂、フッ素系樹脂、ポリテトラフルオロエチレン系樹脂、等が挙げられる。第１樹脂部１２１及び第２樹脂部１２２は、同系統の樹脂によって構成されてもよく、これによれば、互いのＸＹ面方向における剥離強度を向上させることができる。 The second resin portion 122 is a soft resin for imparting flexibility (flexibility or stretchability) to the structure 101, and has lower rigidity and higher stretchability than the first resin portion 121. For example, it is desirable that the second resin portion 122 has a Shore hardness of less than about 20 °. The expansion / contraction rate of the second resin portion 122 is, for example, 5% or more and 50% or less. According to this, even when the electronic component built-in resin structure 100 is used by being attached to a bonding portion where bending and expansion / contraction occurs in a human body or the like, it follows the bending and expansion / contraction of the bonding portion. It can be deformed without being damaged. The material of the second resin part 122 is not particularly limited as long as it has flexibility. For example, a silicone resin, a urethane resin, an acrylic resin, a fluorine resin, a polytetrafluoroethylene resin, etc. Is mentioned. The 1st resin part 121 and the 2nd resin part 122 may be comprised with resin of the same system | strain, and according to this, the peeling strength in a mutual XY plane direction can be improved.
　図１Ａに示したように、ＸＹ面方向に伸びない程度にテンションをかけて構造体１０１を張った状態では、第２樹脂部１２２の主面１２２Ａは、第１樹脂部１２１の主面１２１Ａとの間に段差がなく、主面１２１Ａ及び１２２Ａが同一平面（ＸＹ平面）において並んでいる。なお、端子電極１１１Ａ，１１２Ａの一面及び主面１２１Ａも同一平面（ＸＹ平面）において並んでいる。つまり、構造体１０１の第１主面１０１Ａは、第１電子部品１１１、第２電子部品１１２、第１樹脂部１２１、及び第２樹脂部１２２のそれぞれの一面を含んだ平面状である。但し、第１主面１０１Ａは、電子部品内蔵樹脂構造体１００を伸縮・屈曲させた場合には、電子部品内蔵樹脂構造体１００の変形に応じた曲面となる。同様に、第２樹脂部１２２の主面１２２Ｂは、第１樹脂部１２１の主面１２１Ｂとの間に段差がなく、主面１２１Ｂ及び１２２Ｂが同一平面（ＸＹ平面）において並んでいる。但し、主面１２１Ｂ及び１２２Ｂには段差が形成されてもよく、例えば、第１樹脂部１２１の端部に第２樹脂部１２２が第３方向Ｚで重なっていてもよい。さらに、図１Ｂに示すように、第１樹脂部１２１の第２主面１２１Ｂが第２樹脂部１２２に覆われた構造であってもよい。第１樹脂部１２１の硬度は高いので主面１２１Ｂは平坦性に形成しにくいことがあるが、図１Ｂの構成を備えることにより電子部品内蔵樹脂構造体１００の表面の平坦性を容易に得ることができる。 As shown in FIG. 1A, in a state where the structure 101 is stretched with tension that does not extend in the XY plane direction, the main surface 122A of the second resin portion 122 is different from the main surface 121A of the first resin portion 121. The main surfaces 121A and 122A are arranged in the same plane (XY plane). One surface of the terminal electrodes 111A and 112A and the main surface 121A are also arranged in the same plane (XY plane). That is, the first main surface 101 </ b> A of the structure 101 has a planar shape including one surface of each of the first electronic component 111, the second electronic component 112, the first resin portion 121, and the second resin portion 122. However, 101 A of 1st main surfaces become a curved surface according to a deformation | transformation of the resin structure 100 with a built-in electronic component, when the resin structure 100 with a built-in electronic component is expanded-contracted and bent. Similarly, the main surface 122B of the second resin portion 122 has no step between the main surface 121B of the first resin portion 121 and the main surfaces 121B and 122B are arranged in the same plane (XY plane). However, a step may be formed on the main surfaces 121B and 122B. For example, the second resin portion 122 may overlap the end portion of the first resin portion 121 in the third direction Z. Further, as shown in FIG. 1B, the second main surface 121 </ b> B of the first resin portion 121 may be covered with the second resin portion 122. Since the hardness of the first resin portion 121 is high, the main surface 121B may be difficult to be formed flat, but by providing the configuration of FIG. 1B, the surface flatness of the electronic component built-in resin structure 100 can be easily obtained. Can do.
　第１樹脂部１２１と第２樹脂部１２２との面方向における境界ＢＲは、図示した例では明瞭であり、構造体１０１の厚さ方向である第３方向Ｚに延在しているが、実際には、境界ＢＲは不明瞭、又は入り組んでいてもよい。このとき、境界ＢＲにおける組成や物性は、第１の樹脂部と第２の樹脂部の材料が互いに混合した状態であってもよい。これによれば、電子部品内蔵樹脂構造体１００を面方向に伸縮させた場合に、境界ＢＲにおいて第１樹脂部１２１と第２樹脂部１２２との間で生じる剥離を抑制することができる。 The boundary BR in the surface direction between the first resin portion 121 and the second resin portion 122 is clear in the illustrated example, and extends in the third direction Z that is the thickness direction of the structure 101. The boundary BR may be unclear or complicated. At this time, the composition and physical properties at the boundary BR may be in a state where the materials of the first resin portion and the second resin portion are mixed with each other. According to this, when the electronic component built-in resin structure 100 is expanded and contracted in the surface direction, peeling that occurs between the first resin portion 121 and the second resin portion 122 at the boundary BR can be suppressed.
　配線部１４１は、端子電極１１１Ａ及び１１２Ａに電気的に接続されるように、構造体１０１の第１主面１０１Ａ側に設けられる。図１Ａにおいては、配線部１４１は構造体１０１の第１の主面１０１Ａの上に設けられる。このとき、配線部１４１は、第１樹脂部１２１の主面１２１Ａの上に設けられ、必要に応じた電気的接続を備えるように第１電子部品１１１や第２電子部品１１２と接続される。配線部１４１は、第２樹脂部１２２の主面１２２Ａの上にも設けられてもよい。配線部１４１は、伸縮性を有していることが望ましく、第１樹脂部１２１よりも伸縮性が高いことが望ましい。電子部品内蔵樹脂構造体１００の変形に際して配線部１４１の破断を防止する観点から、配線部１４１は、第２樹脂部１２２と略同等の伸縮性を有していることが望ましい。配線部１４１は、例えば、導電ペースト等によって設けられ、バインダ成分としてシリコーン系樹脂を含み、導電成分として銀（Ａｇ）系粒子や銅（Ｃｕ）系粒子を含んでいる。なお、図１Ａにおいては配線部１４１の配置位置を説明するために、便宜的に電子部品内蔵樹脂構造体１００の断面においてほぼ全域に配線部１４１を配置しているが、実際には配線部１４１は必要に応じた電気特性を備えるように形成され、さらに必要に応じた電気的接続を備えるように第１電子部品１１１や第２電子部品１１２と接続される。 The wiring part 141 is provided on the first main surface 101A side of the structure 101 so as to be electrically connected to the terminal electrodes 111A and 112A. In FIG. 1A, the wiring part 141 is provided on the first main surface 101 </ b> A of the structure 101. At this time, the wiring part 141 is provided on the main surface 121A of the first resin part 121, and is connected to the first electronic component 111 and the second electronic component 112 so as to have electrical connection as necessary. The wiring part 141 may also be provided on the main surface 122A of the second resin part 122. The wiring part 141 desirably has elasticity, and desirably has higher elasticity than the first resin part 121. From the viewpoint of preventing breakage of the wiring portion 141 when the electronic component built-in resin structure 100 is deformed, the wiring portion 141 desirably has substantially the same elasticity as the second resin portion 122. The wiring part 141 is provided by, for example, a conductive paste, includes a silicone resin as a binder component, and includes silver (Ag) -based particles and copper (Cu) -based particles as conductive components. In FIG. 1A, in order to explain the arrangement position of the wiring part 141, the wiring part 141 is arranged almost all over the cross section of the electronic component built-in resin structure 100 for the sake of convenience. Is formed so as to have electrical characteristics as required, and further connected to the first electronic component 111 and the second electronic component 112 so as to have electrical connection as required.
　＜第２実施形態＞
　次に、図２を参照しつつ、本発明の第２実施形態に係る電子部品内蔵樹脂構造体２００について説明する。このとき、図２は、本発明の第２実施形態に係る電子部品内蔵樹脂構造体の構造を概略的に示す断面図である。なお、以下のそれぞれの実施形態において、第１実施形態と同様の構成及び効果については詳細な説明を省略する。 Second Embodiment
Next, an electronic component built-in resin structure 200 according to a second embodiment of the present invention will be described with reference to FIG. FIG. 2 is a cross-sectional view schematically showing the structure of the electronic component built-in resin structure according to the second embodiment of the present invention. In each of the following embodiments, detailed description of the same configurations and effects as those of the first embodiment will be omitted.
　第２実施形態に係る電子部品内蔵樹脂構造体２００は、第１電子部品２１１が第１樹脂部２２１によって覆われ、第２電子部品２１２が第３樹脂部２２３によって覆われている点で、第１実施形態に係る電子部品内蔵樹脂構造体１００と相違している。第３樹脂部２２３は、第１樹脂部２２１と同様の機能を有するものであり、第２電子部品２１２を保護する硬質樹脂である。 In the electronic component built-in resin structure 200 according to the second embodiment, the first electronic component 211 is covered by the first resin portion 221, and the second electronic component 212 is covered by the third resin portion 223. This is different from the electronic component built-in resin structure 100 according to the embodiment. The third resin portion 223 has the same function as the first resin portion 221 and is a hard resin that protects the second electronic component 212.
　第１樹脂部２２１は、ＸＹ面方向において第１電子部品２１１を囲むように設けられ、第１電子部品２１１の第２主面２０１Ｂ側を覆っている。第３樹脂部２２３は、ＸＹ面方向において第２電子部品２１２を囲むように設けられ、第２電子部品２１２の第２主面２０１Ｂ側を覆っている。第３樹脂部２２３は、ＸＹ面方向において、第１樹脂部２２１から離れている。第３樹脂部２２３は、第２樹脂部２２２よりも剛性が高く、第１樹脂部２２１と略同等の剛性を有する。第３樹脂部２２３は、第１樹脂部２２１と同様の材料によって設けられるが、第２電子部品２１２を外部応力等から保護することができる硬質樹脂であれば、第１樹脂部２２１と異なる材料によって設けられてもよい。 The first resin portion 221 is provided so as to surround the first electronic component 211 in the XY plane direction, and covers the second main surface 201B side of the first electronic component 211. The third resin portion 223 is provided so as to surround the second electronic component 212 in the XY plane direction, and covers the second main surface 201B side of the second electronic component 212. The third resin part 223 is separated from the first resin part 221 in the XY plane direction. The third resin portion 223 has higher rigidity than the second resin portion 222 and has substantially the same rigidity as the first resin portion 221. The third resin part 223 is provided with the same material as the first resin part 221, but is a material different from the first resin part 221 as long as it is a hard resin capable of protecting the second electronic component 212 from external stress or the like. May be provided.
　第２樹脂部２２２は、ＸＹ面方向において、第１樹脂部２２１に隣接し、第３樹脂部２２３に隣接している。第２樹脂部２２２は、第１樹脂部２２１及び第３樹脂部２２３をＹＸ面方向に繋いでいる。第２樹脂部２２２の第３方向Ｚにおける厚さは、第１樹脂部２２１の第３方向Ｚにおける厚さよりも小さい。これにより、第１樹脂部２２１の他方の主面２２１Ｂは、第２樹脂部２２２の他方の主面２２２ＢとＸＹ面方向で不連続となるように設けられている。言い換えると、第１樹脂部２２１は、第２主面２０１Ｂ側において、第２樹脂部２２２から第３方向Ｚに突出している。第２樹脂部２２２の第３方向Ｚにおける厚さは、第３樹脂部２２３の第３方向Ｚにおける厚さよりも大きい。これにより、第２樹脂部２２２は、第３樹脂部２２３の他方の主面２２３Ｂを覆っており、第３樹脂部２２３の他方の主面２２３Ｂは、第２主面２２２Ｂに含まれていない。このように、電子部品２１１，２１２を覆う樹脂部２２１，２２３（硬質樹脂）は、構造体２０１における電子部品２１１，２１２が位置する側とは反対側の第２主面２０１Ｂ側において、樹脂部２２２（軟質樹脂）に埋没していてもよく、樹脂部２２２（軟質樹脂）から突出していてもよい。但し、構造体２０１の第１主面２０１Ａは、第１電子部品２１１（端子電極２１１Ａ）、第２電子部品２１２（端子電極２１２Ａ）、第１樹脂部２２１、第２樹脂部２２２、及び第３樹脂部２２３の、それぞれの一面を含んでいる。 The second resin part 222 is adjacent to the first resin part 221 and adjacent to the third resin part 223 in the XY plane direction. The second resin part 222 connects the first resin part 221 and the third resin part 223 in the YX plane direction. The thickness of the second resin part 222 in the third direction Z is smaller than the thickness of the first resin part 221 in the third direction Z. Thereby, the other main surface 221B of the first resin portion 221 is provided to be discontinuous with the other main surface 222B of the second resin portion 222 in the XY plane direction. In other words, the first resin portion 221 protrudes from the second resin portion 222 in the third direction Z on the second main surface 201B side. The thickness of the second resin part 222 in the third direction Z is larger than the thickness of the third resin part 223 in the third direction Z. Accordingly, the second resin portion 222 covers the other main surface 223B of the third resin portion 223, and the other main surface 223B of the third resin portion 223 is not included in the second main surface 222B. Thus, the resin portions 221 and 223 (hard resin) covering the electronic components 211 and 212 are disposed on the second main surface 201B side of the structure 201 opposite to the side where the electronic components 211 and 212 are located. It may be buried in 222 (soft resin) or may protrude from the resin portion 222 (soft resin). However, the first main surface 201A of the structure 201 includes the first electronic component 211 (terminal electrode 211A), the second electronic component 212 (terminal electrode 212A), the first resin portion 221, the second resin portion 222, and the third. Each side of the resin part 223 is included.
　＜第３実施形態＞
　次に、図３を参照しつつ、本発明の第３実施形態に係る電子部品内蔵樹脂構造体３００について説明する。このとき、図３は、本発明の第３実施形態に係る電子部品内蔵樹脂構造体の構造を概略的に示す断面図である。 <Third Embodiment>
Next, an electronic component built-in resin structure 300 according to a third embodiment of the present invention will be described with reference to FIG. FIG. 3 is a cross-sectional view schematically showing the structure of the electronic component built-in resin structure according to the third embodiment of the present invention.
　第３実施形態に係る電子部品内蔵樹脂構造体３００は、粘着層３５１を備えている点で、第１実施形態に係る電子部品内蔵樹脂構造体１００と相違している。粘着層３５１は、配線部３４１を覆うように、構造体３０１の第１主面３０１Ａの上に設けられている。粘着層３５１は、電子部品内蔵樹脂構造体３００を貼り付けるための部材であり、例えば、粘着性を有するフィルムや、感圧接着剤等によって構成されている。電子部品内蔵樹脂構造体３００を人体等に貼合しての使用を考慮した場合、粘着層３５１は、生体適合性を有する材料によって設けられることが望ましい。粘着層３５１は、高い伸縮性を有していることが望ましい。粘着層３５１の伸縮性は、第１樹脂部３２１よりも高く、第２樹脂部３２２と同等であることが望ましい。 The electronic component built-in resin structure 300 according to the third embodiment is different from the electronic component built-in resin structure 100 according to the first embodiment in that an adhesive layer 351 is provided. The adhesive layer 351 is provided on the first main surface 301 </ b> A of the structure 301 so as to cover the wiring part 341. The adhesive layer 351 is a member for attaching the electronic component built-in resin structure 300, and is configured by, for example, an adhesive film, a pressure sensitive adhesive, or the like. In consideration of use of the electronic component built-in resin structure 300 bonded to a human body or the like, the adhesive layer 351 is desirably provided by a material having biocompatibility. The adhesive layer 351 desirably has high stretchability. The stretchability of the adhesive layer 351 is desirably higher than that of the first resin portion 321 and equivalent to that of the second resin portion 322.
　＜第４実施形態＞
　次に、図４を参照しつつ、本発明の第４実施形態に係る電子部品内蔵樹脂構造体４００について説明する。このとき、図４は、本発明の第４実施形態に係る電子部品内蔵樹脂構造体の構造を概略的に示す断面図である。 <Fourth embodiment>
Next, an electronic component built-in resin structure 400 according to a fourth embodiment of the present invention will be described with reference to FIG. FIG. 4 is a cross-sectional view schematically showing the structure of the electronic component built-in resin structure according to the fourth embodiment of the present invention.
　第４実施形態に係る電子部品内蔵樹脂構造体４００は、粘着層４５１及び保護層４５２を備えている点で、第１実施形態に係る電子部品内蔵樹脂構造体１００と相違している。粘着層４５１は、構造体４０１の第２主面４０１Ｂの上に設けられ、第１樹脂部４２１の主面４２１Ｂ、及び第２樹脂部４２２の主面４２２Ｂを覆っている。粘着層４５１は、第３実施形態の粘着層３５１と同様の材料・物性を有するものであってもよい。 The electronic component built-in resin structure 400 according to the fourth embodiment is different from the electronic component built-in resin structure 100 according to the first embodiment in that an adhesive layer 451 and a protective layer 452 are provided. The adhesive layer 451 is provided on the second main surface 401B of the structure 401, and covers the main surface 421B of the first resin portion 421 and the main surface 422B of the second resin portion 422. The adhesive layer 451 may have the same materials and physical properties as the adhesive layer 351 of the third embodiment.
　保護層４５２は、配線部４４１を覆うように、構造体４０１の第１主面４０１Ａの上に設けられている。保護層４５２は、配線部４４１を外部応力による破損や、酸化による劣化、等から保護するための部材である。配線部４４１は、例えば、酸素や水蒸気等に対する高いガスバリア性や、酸、アルカリ、油脂等の化学物質に対する高い耐久性を有していることが望ましい。保護層４５２は、高い伸縮性を有していることが望ましい。保護層４５２の伸縮性は、第１樹脂部４２１よりも高く、第２樹脂部４２２と同等であることが望ましい。 The protective layer 452 is provided on the first main surface 401A of the structure 401 so as to cover the wiring portion 441. The protective layer 452 is a member for protecting the wiring portion 441 from damage due to external stress, deterioration due to oxidation, and the like. The wiring portion 441 desirably has a high gas barrier property against, for example, oxygen and water vapor, and a high durability against chemical substances such as acids, alkalis, and oils and fats. It is desirable that the protective layer 452 has high stretchability. The stretchability of the protective layer 452 is preferably higher than that of the first resin portion 421 and equivalent to the second resin portion 422.
　＜第５実施形態＞
　次に、図５を参照しつつ、本発明の第５実施形態に係る電子部品内蔵樹脂構造体５００について説明する。このとき、図５は、本発明の第５実施形態に係る電子部品内蔵樹脂構造体の構造を概略的に示す断面図である。 <Fifth Embodiment>
Next, an electronic component built-in resin structure 500 according to a fifth embodiment of the present invention will be described with reference to FIG. FIG. 5 is a cross-sectional view schematically showing the structure of the electronic component built-in resin structure according to the fifth embodiment of the present invention.
　第５実施形態に係る電子部品内蔵樹脂構造体５００は、複数の構造体５０１，５０２，５０３を備えている点で、第１実施形態に係る電子部品内蔵樹脂構造体１００と相違している。構造体５０１，５０２，５０３は、それぞれ、第１実施形態の構造体１０１と同様の構成である。つまり、構造体５０１は、第１電子部品５１１及び第２電子部品５１２を覆う第１樹脂部５２１と、ＸＹ面方向で第１樹脂部５２１に隣接する第２樹脂部５２２と、を備える。また、構造体５０２は、第３電子部品５１３及び第４電子部品５１４を覆う第４樹脂部５２４と、ＸＹ面方向で第４樹脂部５２４に隣接する第５樹脂部５２５を、備える。また、構造体５０３は、第５電子部品５１５及び第６電子部品５１６を覆う第６樹脂部５２６と、ＸＹ面方向で第６樹脂部５２６に隣接する第７樹脂部５２７を備える。第１樹脂部５２１、第４樹脂部５２４、及び第６樹脂部５２６は、第１実施形態の第１樹脂部１２１と同様の材料で構成され、同様の物性を有している。第２樹脂部５２２、第５樹脂部５２５、及び第７樹脂部５２７は、第１実施形態の第２樹脂部１２２と同様の材料で構成され、同様の物性を有している。 The electronic component built-in resin structure 500 according to the fifth embodiment is different from the electronic component built-in resin structure 100 according to the first embodiment in that it includes a plurality of structures 501, 502, and 503. The structures 501, 502, and 503 have the same configuration as that of the structure 101 of the first embodiment. That is, the structure 501 includes a first resin part 521 that covers the first electronic component 511 and the second electronic component 512, and a second resin part 522 that is adjacent to the first resin part 521 in the XY plane direction. The structural body 502 includes a fourth resin portion 524 that covers the third electronic component 513 and the fourth electronic component 514, and a fifth resin portion 525 that is adjacent to the fourth resin portion 524 in the XY plane direction. The structure 503 includes a sixth resin part 526 that covers the fifth electronic component 515 and the sixth electronic component 516 and a seventh resin part 527 that is adjacent to the sixth resin part 526 in the XY plane direction. The 1st resin part 521, the 4th resin part 524, and the 6th resin part 526 are comprised with the material similar to the 1st resin part 121 of 1st Embodiment, and have the same physical property. The 2nd resin part 522, the 5th resin part 525, and the 7th resin part 527 are comprised with the material similar to the 2nd resin part 122 of 1st Embodiment, and have the same physical property.
　構造体５０１の第１主面５０１Ａの上には配線部５４１が設けられ、構造体５０２の第３主面５０２Ａの上には配線部５４２が設けられ、構造体５０３の第５主面５０３Ａの上には配線部５４３が設けられている。なお、構造体５０１は、さらに、第１樹脂部５２１を第３方向Ｚに貫通するように設けられた層間接続端子５７１を備えている。また、構造体５０２も、さらに、第４樹脂部５２４を第３方向Ｚに貫通するように設けられた層間接続端子５７２を備えている。構造体５０２の第４主面５０２Ｂの上には、電子部品内蔵樹脂構造体５００を外部の配線等に電気的に接続するための外部電極５８９が設けられている。層間接続端子５７１は、配線部５４１に電気的に接続されている。層間接続端子５７２は、配線部５４２に電気的に接続されている。 A wiring portion 541 is provided on the first main surface 501A of the structure body 501, and a wiring portion 542 is provided on the third main surface 502A of the structure body 502. The fifth main surface 503A of the structure body 503 is provided. A wiring portion 543 is provided above. The structure 501 further includes an interlayer connection terminal 571 provided so as to penetrate the first resin portion 521 in the third direction Z. Further, the structure 502 further includes an interlayer connection terminal 572 provided so as to penetrate the fourth resin portion 524 in the third direction Z. On the fourth main surface 502B of the structure 502, an external electrode 589 for electrically connecting the electronic component built-in resin structure 500 to an external wiring or the like is provided. The interlayer connection terminal 571 is electrically connected to the wiring portion 541. The interlayer connection terminal 572 is electrically connected to the wiring portion 542.
　構造体５０１，５０２，５０３は、それぞれの主面同士が対向するように積層されている。具体的には、構造体５０１の第１主面５０１Ａと、構造体５０２の第３主面５０２Ａと、が接着層５６１によって貼り合わされている。接着層５６１には第３方向Ｚに貫通するように導電部５８１が設けられており、導電部５８１は、配線部５４１と配線部５４２と、を電気的に接続している。また、構造体５０１の第２主面５０１Ｂと、構造体５０３の第５主面５０３Ａと、が接着層５６２によって貼り合わされている。接着層５６２には第３方向Ｚに貫通するように導電部５８２が設けられており、導電部５８２は、層間接続端子５７１と配線部５４３と、を電気的に接続している。従って、構造体５０１と構造体５０２とは導電部５８１を介して電気的に接続され、また、構造体５０１と構造体５０３とは導電部５８２を介して電気的に接続される。また、配線部５４２は、層間接続端子５７２を通して外部電極５８９に電気的に接続される。 The structures 501, 502, and 503 are stacked so that their main surfaces face each other. Specifically, the first main surface 501A of the structure body 501 and the third main surface 502A of the structure body 502 are bonded to each other with the adhesive layer 561. A conductive portion 581 is provided in the adhesive layer 561 so as to penetrate in the third direction Z, and the conductive portion 581 electrically connects the wiring portion 541 and the wiring portion 542. In addition, the second main surface 501B of the structure 501 and the fifth main surface 503A of the structure 503 are bonded to each other with an adhesive layer 562. A conductive part 582 is provided in the adhesive layer 562 so as to penetrate in the third direction Z, and the conductive part 582 electrically connects the interlayer connection terminal 571 and the wiring part 543. Therefore, the structure body 501 and the structure body 502 are electrically connected through the conductive portion 581, and the structure body 501 and the structure body 503 are electrically connected through the conductive portion 582. The wiring portion 542 is electrically connected to the external electrode 589 through the interlayer connection terminal 572.
　なお、電子部品内蔵樹脂構造体５００を変形させたときに導電部５８１の破損や剥離を抑制する観点から、導電部５８１は、硬質樹脂によって構成される第１樹脂部５２１及び第４樹脂部５２４の少なくとも一方と第３方向Ｚで対向していることが望ましい。同様に、導電部５８２は、硬質樹脂によって構成される第１樹脂部５２１及び第６樹脂部５２６の少なくとも一方と第３方向Ｚで対向していることが望ましい。同様に、外部電極５８９は、硬質樹脂によって構成される第４樹脂部５２４と第３方向Ｚで対向していることが望ましい。 From the viewpoint of suppressing breakage and peeling of the conductive portion 581 when the electronic component built-in resin structure 500 is deformed, the conductive portion 581 includes the first resin portion 521 and the fourth resin portion 524 that are made of hard resin. It is desirable that at least one of the two faces in the third direction Z. Similarly, it is desirable that the conductive portion 582 is opposed to at least one of the first resin portion 521 and the sixth resin portion 526 made of hard resin in the third direction Z. Similarly, it is desirable that the external electrode 589 is opposed to the fourth resin portion 524 made of hard resin in the third direction Z.
　また、電子部品内蔵樹脂構造体５００を変形させたときに構造体５０１，５０２，５０３同士の剥離を抑制する観点から、接着層５６１及び接着層５６２は、高い伸縮性を有することが望ましい。具体的には、第１樹脂部５２１、第４樹脂部５２４、及び第６樹脂部５２６よりも伸縮性が高いことが望ましく、第２樹脂部５２２、第５樹脂部５２５、及び第６樹脂部５２６と同等の伸縮性を有することが望ましい。なお、接着層５６１及び接着層５６２は、例えばＵＶ硬化接着剤や熱硬化接着剤によって構成されるが、第３実施形態の粘着層３５１と同様の材料で構成されてもよい。 Further, from the viewpoint of suppressing peeling between the structural bodies 501, 502, and 503 when the electronic component built-in resin structure 500 is deformed, it is desirable that the adhesive layer 561 and the adhesive layer 562 have high stretchability. Specifically, it is desirable that the stretchability is higher than that of the first resin portion 521, the fourth resin portion 524, and the sixth resin portion 526, and the second resin portion 522, the fifth resin portion 525, and the sixth resin portion. It is desirable to have stretchability equivalent to 526. The adhesive layer 561 and the adhesive layer 562 are made of, for example, a UV curable adhesive or a thermosetting adhesive, but may be made of the same material as the adhesive layer 351 of the third embodiment.
　＜第６実施形態＞
　次に、図６Ａ～６Ｅを参照しつつ、本発明の第６実施形態に係る電子部品内蔵樹脂構造体６００の製造方法について説明する。このとき、図６Ａは、本発明の第６実施形態において、支持体の上に電子部品を設ける工程を示す図である。図６Ｂは、本発明の第６実施形態において、支持体の上に樹脂組成物を設ける工程を示す図である。図６Ｃは、本発明の第６実施形態において、樹脂組成物を硬化させる工程を示す図である。図６Ｄは、本発明の第６実施形態において、第１主面から支持体を剥離する工程を示す図である。図６Ｅは、本発明の第６実施形態において、第１主面の上に配線部を設ける工程を示す図である。 <Sixth Embodiment>
Next, a method for manufacturing the electronic component built-in resin structure 600 according to the sixth embodiment of the present invention will be described with reference to FIGS. 6A to 6E. At this time, FIG. 6A is a figure which shows the process of providing an electronic component on a support body in 6th Embodiment of this invention. FIG. 6B is a diagram showing a step of providing a resin composition on a support in the sixth embodiment of the present invention. FIG. 6C is a diagram showing a step of curing the resin composition in the sixth embodiment of the present invention. FIG. 6D is a diagram showing a step of peeling the support from the first main surface in the sixth embodiment of the present invention. FIG. 6E is a diagram showing a step of providing a wiring portion on the first main surface in the sixth embodiment of the present invention.
　まず、図６Ａに示すように、支持体６９０の上に電子部品６１１，６１２を配置する。支持体６９０は、熱を加えることで粘着力が低下する熱発泡型粘着シートである。この支持体６９０の粘着面側に端子電極６１１Ａ，６１２Ａが向くように、電子部品６１１，６１２を並べて支持体６９０に貼合する。なお、支持体６９０は、電子部品６１１，６１２を一時的に固定可能且つ剥離可能なものであれば特に限定されるものではなく、例えば紫外線を照射することで粘着力が低下するＵＶ型粘着シートであってもよい。 First, as shown in FIG. 6A, electronic components 611 and 612 are arranged on a support 690. The support 690 is a heat-foaming pressure-sensitive adhesive sheet whose adhesive strength is reduced by applying heat. The electronic components 611 and 612 are aligned and bonded to the support 690 so that the terminal electrodes 611A and 612A face the adhesive surface side of the support 690. The support 690 is not particularly limited as long as the electronic components 611 and 612 can be temporarily fixed and peeled off. For example, the UV-type pressure-sensitive adhesive sheet whose adhesive strength is reduced by irradiating ultraviolet rays. It may be.
　次に、図６Ｂに示すように、ペースト状の第１樹脂組成物６３１及び第２樹脂組成物６３２を設ける。第１樹脂組成物６３１及び第２樹脂組成物６３２は、ＵＶ硬化樹脂を含んでいる。第１樹脂組成物６３１は、ディスペンサ６９１を用いて、電子部品６１１，６１２を覆うように、支持体６９０の上に塗工される。また、第２樹脂組成物６３２は、ディスペンサ６９１を用いて、第１樹脂組成物６３１に隣接するように、支持体６９０の上に塗工される。このとき、第１樹脂組成物６３１と第２樹脂組成物６３２とは、境界ＢＲで互いに混じり合う。なお、第１樹脂組成物６３１及び第２樹脂組成物６３２の塗工方法は特に限定されるものではなく、スクリーン印刷、インクジェット印刷、グラビア印刷、フレキソ印刷、その他転写印刷等であってもよい。 Next, as shown in FIG. 6B, a paste-like first resin composition 631 and second resin composition 632 are provided. The first resin composition 631 and the second resin composition 632 include a UV curable resin. The first resin composition 631 is applied onto the support 690 so as to cover the electronic components 611 and 612 using the dispenser 691. The second resin composition 632 is coated on the support 690 so as to be adjacent to the first resin composition 631 using the dispenser 691. At this time, the first resin composition 631 and the second resin composition 632 are mixed with each other at the boundary BR. In addition, the coating method of the 1st resin composition 631 and the 2nd resin composition 632 is not specifically limited, Screen printing, inkjet printing, gravure printing, flexographic printing, other transfer printing, etc. may be sufficient.
　次に、図６Ｃに示すように、紫外線６９２を照射して第１樹脂組成物６３１及び第２樹脂組成物６３２を硬化させる。これにより、第１樹脂組成物６３１から第１樹脂部６２１を設け、第２樹脂組成物６３２から第２樹脂部６２２を設ける。これによって、支持体６９０の上に、構造体６０１が出来上がる。なお、境界ＢＲでは、第１樹脂組成物６３１と第２樹脂組成物６３２とが混じり合うため、第１樹脂部６２１と第２樹脂部６２２とがグラデーションを形成している。 Next, as shown in FIG. 6C, the first resin composition 631 and the second resin composition 632 are cured by irradiating ultraviolet rays 692. Thus, the first resin portion 621 is provided from the first resin composition 631 and the second resin portion 622 is provided from the second resin composition 632. As a result, the structure 601 is completed on the support 690. In the boundary BR, since the first resin composition 631 and the second resin composition 632 are mixed, the first resin part 621 and the second resin part 622 form a gradation.
　紫外線６９２は、支持体６９０、第１樹脂部６２１、及び第２樹脂部６２２にダメージを与えない照射条件で照射される。例えば、支持体６９０が熱発泡型粘着シートであれば、紫外線６９２を照射することによる温度上昇が粘着力を低下させないように照射条件を設定し、支持体６９０がＵＶ型粘着シートであれば、支持体６９０が紫外線６９２を吸収して粘着力を低下させないように照射条件を設定する。なお、第１樹脂部６２１及び第２樹脂部６２２は、ＵＶ硬化樹脂に限定されるものではなく、熱硬化樹脂や紫外線以外のエネルギー線硬化樹脂を含んでいてもよい。例えば、第１樹脂部６２１及び第２樹脂部６２２が熱硬化樹脂を含み、支持体６９０が熱発泡型粘着シートである場合、支持体６９０の粘着力が低下する剥離温度を、第１樹脂組成物６３１及び第２樹脂組成物６３２の硬化温度よりも高く、第１樹脂部６２１及び第２樹脂部６２２のガラス転移温度（Ｔｇ）よりも低く設定する。 The ultraviolet rays 692 are irradiated under irradiation conditions that do not damage the support 690, the first resin portion 621, and the second resin portion 622. For example, if the support 690 is a heat-foaming pressure-sensitive adhesive sheet, the irradiation conditions are set so that the temperature rise due to the irradiation of the ultraviolet rays 692 does not decrease the adhesive strength. If the support 690 is a UV-type pressure-sensitive adhesive sheet, Irradiation conditions are set so that the support 690 does not absorb the ultraviolet light 692 and reduce the adhesive force. In addition, the 1st resin part 621 and the 2nd resin part 622 are not limited to UV curable resin, You may contain energy ray curable resins other than a thermosetting resin and an ultraviolet-ray. For example, when the first resin part 621 and the second resin part 622 contain a thermosetting resin and the support 690 is a heat-foaming pressure-sensitive adhesive sheet, the peeling temperature at which the adhesive strength of the support 690 decreases is the first resin composition. It is set higher than the curing temperature of the product 631 and the second resin composition 632 and lower than the glass transition temperature (Tg) of the first resin part 621 and the second resin part 622.
　本実施形態においては、第１樹脂部６２１及び第２樹脂部６２２は、第１樹脂組成物６３１及び第２樹脂組成物６３２の両方を塗工した後、これらを硬化させて形成しているが、順次硬化させて形成してもよい。例えば、第１樹脂組成物６３１を塗工・硬化し、次いで第２樹脂部６２２を塗工・硬化してもよい。これによれば、第１樹脂組成物６３１及び第２樹脂組成物６３２の過剰な混じり合いにより、電子部品６１１，６１２を覆う樹脂部の剛性が低下することを抑制することができる。また、第１樹脂部６２１及び第２樹脂部６２２を一種類の樹脂組成物から形成してもよい。例えば、支持体６９０の上に樹脂組成物を塗工し、当該樹脂組成物を熱硬化し、電子部品６１１，６１２の周りにだけ紫外線を照射し硬度差を付与することができる。これによれば、塗工工程を省力化することができる。 In the present embodiment, the first resin portion 621 and the second resin portion 622 are formed by applying both the first resin composition 631 and the second resin composition 632 and then curing them. These may be formed by sequentially curing. For example, the first resin composition 631 may be applied and cured, and then the second resin portion 622 may be applied and cured. According to this, it can suppress that the rigidity of the resin part which covers the electronic components 611 and 612 falls by the excessive mixing of the 1st resin composition 631 and the 2nd resin composition 632. Moreover, you may form the 1st resin part 621 and the 2nd resin part 622 from one type of resin composition. For example, a resin composition can be applied on the support 690, the resin composition can be thermally cured, and ultraviolet rays can be irradiated only around the electronic components 611 and 612 to impart a hardness difference. According to this, it is possible to save labor in the coating process.
　次に、図６Ｄに示すように、支持体６９０を構造体６０１の第１主面６０１Ａから剥離する。支持体６９０は、熱風６９３によって加熱されて、粘着力を低下させた後、剥離される。電子部品６１１，６１２の端子電極６１１Ａ，６１２Ａは、支持体６９０に貼り付いていたため、支持体６９０を剥離することで、第１主面６０１Ａにおいて露出する。また、第１樹脂部６２１及び第２樹脂部６２２は支持体６９０の上に設けられたので、支持体６９０を剥離することで、第１樹脂部６２１の主面６２１Ａ及び第２樹脂部６２２の主面６２２Ａが第１主面６０１Ａに含まれる。 Next, as shown in FIG. 6D, the support 690 is peeled from the first main surface 601 </ b> A of the structure 601. The support 690 is heated by hot air 693 to reduce the adhesive force, and then peeled off. Since the terminal electrodes 611A and 612A of the electronic components 611 and 612 are attached to the support 690, the first main surface 601A is exposed by peeling the support 690. In addition, since the first resin portion 621 and the second resin portion 622 are provided on the support body 690, the main surface 621 </ b> A of the first resin portion 621 and the second resin portion 622 are separated by peeling the support body 690. Main surface 622A is included in first main surface 601A.
　次に、図６Ｅに示すように、構造体６０１の第１主面６０１Ａの上に配線部６４１を設ける。配線部６４１の形成工程はスクリーン印刷を利用しており、第１主面６０１Ａの上方に配置したマスク６９４にスキージ９５を用いて導電ペースト６４０を押し込むように塗り付け、マスク６９４の開口部を通して第１主面６０１Ａの上にパターン形成された導電ペースト６４０を熱風６９３によって乾燥させる。導電ペースト６４０が乾燥して設けられた配線部６４１は、マスク６９４の開口部に対応した形状となる。なお、導電ペースト６４０のパターン形成は特に限定されるものではなく、例えば、インクジェット印刷、グラビア印刷、フレキソ印刷、その他転写印刷やディスペンサによる直接描画等であってもよい。 Next, as shown in FIG. 6E, a wiring portion 641 is provided on the first main surface 601A of the structure 601. The formation process of the wiring part 641 uses screen printing, and is applied by applying a conductive paste 640 to the mask 694 disposed above the first main surface 601A by using a squeegee 95 and passing through the opening of the mask 694. The conductive paste 640 patterned on the first principal surface 601A is dried with hot air 693. The wiring portion 641 provided by drying the conductive paste 640 has a shape corresponding to the opening of the mask 694. In addition, the pattern formation of the electrically conductive paste 640 is not specifically limited, For example, inkjet printing, gravure printing, flexographic printing, other transfer printing, direct drawing with a dispenser, etc. may be sufficient.
　＜第７実施形態＞
　次に、図７Ａ～７Ｄを参照しつつ、本発明の第７実施形態に係る電子部品内蔵樹脂構造体７００の製造方法について説明する。このとき、図７Ａは、本発明の第７実施形態において、支持体の上に配線部を設ける工程を示す図である。図７Ｂは、本発明の第７実施形態において、配線部に電気的に接続するように電子部品を設ける工程を示す図である。図７Ｃは、本発明の第７実施形態において、第１樹脂部及び第２樹脂部を設ける工程を示す図である。図７Ｄは、本発明の第７実施形態において、第１主面から支持体を剥離する工程を示す図である。なお、第６実施形態と同様の工程については説明を省略する。 <Seventh embodiment>
Next, a manufacturing method of the electronic component built-in resin structure 700 according to the seventh embodiment of the present invention will be described with reference to FIGS. 7A to 7D. At this time, FIG. 7A is a figure which shows the process of providing a wiring part on a support body in 7th Embodiment of this invention. FIG. 7B is a diagram illustrating a process of providing an electronic component so as to be electrically connected to the wiring portion in the seventh embodiment of the present invention. FIG. 7C is a diagram illustrating a process of providing the first resin portion and the second resin portion in the seventh embodiment of the present invention. FIG. 7D is a diagram showing a step of peeling the support from the first main surface in the seventh embodiment of the present invention. Note that description of the same steps as those in the sixth embodiment is omitted.
　まず、図７Ａに示すように、支持体７９０の上に配線部７４１をパターン形成する。支持体７９０は、表面に易剥離層を有する金属板である。易剥離層とは、配線部７４１との化学的・物理的結合が弱く、配線部７４１からの支持体７９０の剥離を容易にするものであり、例えば、熱発泡型粘着シートやＵＶ型粘着シートである。 First, as shown in FIG. 7A, a wiring portion 741 is formed on the support 790 with a pattern. The support 790 is a metal plate having an easily peelable layer on the surface. The easily peelable layer is weak in chemical / physical bond with the wiring portion 741 and facilitates peeling of the support 790 from the wiring portion 741. For example, a heat-foaming pressure-sensitive adhesive sheet or a UV-type pressure-sensitive adhesive sheet It is.
　次に、図７Ｂに示すように、電子部品７１１，７１２を配線部７４１の上に実装する。電子部品７１１，７１２は、端子電極７１１Ａ，７１２Ａが配線部７４１に電気的に接続されるように、接続材７１１Ｂ，７１２Ｂによって固定される。接続材７１１Ｂ，７１２Ｂは、例えば、はんだ材や、ろう材である。接続材７１１Ｂは、端子電極７１１Ａと配線部７４１との間にバンプ状に設けられる。接続材７１２Ｂは、電子部品７１２の側面にフィレット状に設けられる。このように、接続材は電子部品を固定できるものであれば、端子電極であってもよく、ピンや爪等の固定具であってもよい。 Next, as shown in FIG. 7B, electronic components 711 and 712 are mounted on the wiring portion 741. The electronic components 711 and 712 are fixed by connecting materials 711B and 712B so that the terminal electrodes 711A and 712A are electrically connected to the wiring portion 741. The connecting materials 711B and 712B are, for example, solder materials or brazing materials. The connecting material 711B is provided in a bump shape between the terminal electrode 711A and the wiring portion 741. The connecting material 712B is provided in a fillet shape on the side surface of the electronic component 712. As described above, the connection material may be a terminal electrode or a fixture such as a pin or a nail as long as it can fix the electronic component.
　次に、図７Ｃに示すように、第１樹脂部７２１及び第２樹脂部７２２を設ける。このとき、第１樹脂部７２１は、電子部品７１１，７１２を覆うように配線部７４１の上に設けられ、第２樹脂部７２２は、第１樹脂部７２１に隣接するように、配線部７４１及び支持体７９０の上に設けられる。これによって、支持体７９０の上に、配線部７４１を含む構造体７０１が出来上がる。なお、図示はされていないが、第１樹脂部７２１は、配線部７４１の隙間を通して、支持体７９０の上にも設けられる。 Next, as shown in FIG. 7C, a first resin portion 721 and a second resin portion 722 are provided. At this time, the first resin portion 721 is provided on the wiring portion 741 so as to cover the electronic components 711 and 712, and the second resin portion 722 is adjacent to the first resin portion 721 so that the wiring portion 741 and Provided on a support 790. As a result, a structure 701 including the wiring portion 741 is completed on the support 790. Although not shown, the first resin portion 721 is also provided on the support 790 through the gap of the wiring portion 741.
　次に、図７Ｄに示すように、構造体７０１の第１主面７０１Ａから支持体７９０を剥離する。完成した構造体７０１の第１主面７０１Ａは、配線部７４１の一面、第１樹脂部７２１の一面（図示しない）、及び第２樹脂部７２２の一面を含んでいる。すなわち、配線部７４１の一面が第１樹脂部７２１の一面（図示しない）と第２樹脂部７２２の一面と同一平面に配置された構成となる。また、構造体７０１は、電子部品７１１，７１２が第１主面７０１Ａから離れており、電子部品７１１，７１２と第１主面７０１Ａとの間に配線部７４１を備えている。 Next, as shown in FIG. 7D, the support 790 is peeled from the first main surface 701A of the structure 701. The first main surface 701A of the completed structure 701 includes one surface of the wiring portion 741, one surface (not shown) of the first resin portion 721, and one surface of the second resin portion 722. That is, one surface of the wiring portion 741 is arranged on the same plane as one surface (not shown) of the first resin portion 721 and one surface of the second resin portion 722. In the structure 701, the electronic components 711 and 712 are separated from the first main surface 701A, and a wiring portion 741 is provided between the electronic components 711 and 712 and the first main surface 701A.
　以上のとおり、本発明の一態様によれば、互いに対向する第１主面１０１Ａ及び第２主面１０１Ｂを有し、第１主面１０１Ａと平行な面方向に伸縮性を有し、第１電子部品１１１を内蔵する電子部品内蔵樹脂構造体１００であって、第１電子部品１１１を覆う第１樹脂部１２１と、面方向において第１樹脂部１２１に隣接する第２樹脂部１２２と、を備え、第１樹脂部１２１は、第２樹脂部１２２よりも剛性が高く、第２樹脂部１２２は、第１樹脂部１２１よりも伸縮性が高い、電子部品内蔵樹脂構造体、が提供される。 As described above, according to one aspect of the present invention, the first main surface 101A and the second main surface 101B that face each other have elasticity in a plane direction parallel to the first main surface 101A, An electronic component built-in resin structure 100 including an electronic component 111, which includes a first resin portion 121 that covers the first electronic component 111 and a second resin portion 122 that is adjacent to the first resin portion 121 in the surface direction. The first resin part 121 has a higher rigidity than the second resin part 122, and the second resin part 122 is provided with an electronic component built-in resin structure having a higher elasticity than the first resin part 121. .
　上記態様によれば、第１電子部品は剛性の高い第１樹脂部で保護されているため、第１電子部品の損傷を低減することができる。また、伸縮性が高い第２樹脂部が面方向において第１樹脂部に隣接していることで、電子部品内蔵樹脂構造体の面方向における伸縮性を確保することができる。すなわち、電子部品内蔵樹脂構造体の可撓性及び耐久性の両特性を向上させることができる。 According to the above aspect, since the first electronic component is protected by the highly rigid first resin portion, it is possible to reduce damage to the first electronic component. In addition, since the second resin portion having high stretchability is adjacent to the first resin portion in the surface direction, the stretchability in the surface direction of the electronic component built-in resin structure can be ensured. That is, both the flexibility and durability characteristics of the resin structure with built-in electronic components can be improved.
　電子部品内蔵樹脂構造体２００は、さらに、面方向において第１電子部品２１１と並ぶ第２電子部品２１２と、面方向において第２電子部品２１２を覆い第２樹脂部２２２よりも剛性が高い第３樹脂部２２３と、を備え、第２樹脂部２２２は、第１樹脂部２２１と第３樹脂部２２３とを面方向において繋いでいてもよい。これによれば、複数の電子部品を覆う複数の硬質樹脂を、伸縮性が高い軟質樹脂で面方向に繋ぐことにより、電子部品内蔵樹脂構造体が複数の電子部品を備えた集積回路であっても、面方向における充分な伸縮性を確保することができる。 The electronic component built-in resin structure 200 further includes a second electronic component 212 aligned with the first electronic component 211 in the surface direction, and a third higher rigidity than the second resin portion 222 covering the second electronic component 212 in the surface direction. The second resin part 222 may connect the first resin part 221 and the third resin part 223 in the surface direction. According to this, by connecting a plurality of hard resins covering a plurality of electronic components in the surface direction with a highly stretchable soft resin, the electronic component built-in resin structure is an integrated circuit including a plurality of electronic components. Also, sufficient stretchability in the surface direction can be ensured.
　電子部品内蔵樹脂構造体２００は、さらに、第１主面２０１Ａ側に設けられ伸縮性を有する配線部２４１を備え、配線部２４１は、第１電子部品２１１に電気的に接続されてもよい。これによれば、電子部品内蔵樹脂構造体の伸縮・屈曲における配線部の損傷を抑制することができ、耐久性を向上させることができる。 The electronic component built-in resin structure 200 may further include a wiring portion 241 provided on the first main surface 201A side and having elasticity, and the wiring portion 241 may be electrically connected to the first electronic component 211. According to this, the damage of the wiring part in the expansion / contraction / bending of the resin structure with a built-in electronic component can be suppressed, and the durability can be improved.
　なお、第１主面１０１Ａは、第１電子部品１１１、第１樹脂部１２１、及び第２樹脂部１２２のそれぞれの一面を含み、配線部１４１に接していてもよい。また、第１主面７０１Ａは、配線部７４１の一面を含んでいてもよい。 The first main surface 101 </ b> A may include one surface of each of the first electronic component 111, the first resin portion 121, and the second resin portion 122, and may be in contact with the wiring portion 141. Further, the first main surface 701A may include one surface of the wiring portion 741.
　電子部品内蔵樹脂構造体３００は、さらに、第１主面３０１Ａ上に第１粘着層３５１を備えていてもよい。これによれば、人体等の屈曲・伸縮する貼合箇所に電子部品内蔵樹脂構造体を貼合して使用することができる。また、第１主面の全面に亘る基板を備えることなく、構造体を粘着層で直接に貼合箇所に貼合するため、電子部品内蔵樹脂構造体を薄肉化することができる。また、貼合した後は配線部が内側に位置することとなるため、第１樹脂部及び第２樹脂部が配線部に対する保護膜として機能し、第２主面側からの外部応力による配線部の損傷を抑制することができる。 The electronic component built-in resin structure 300 may further include a first adhesive layer 351 on the first main surface 301A. According to this, the electronic component built-in resin structure can be bonded and used at the bonding location where the human body or the like is bent and stretched. Moreover, since the structure is directly bonded to the bonding location with the adhesive layer without providing a substrate extending over the entire surface of the first main surface, the resin structure with a built-in electronic component can be thinned. In addition, since the wiring part is located inside after bonding, the first resin part and the second resin part function as a protective film for the wiring part, and the wiring part due to external stress from the second main surface side Damage can be suppressed.
　電子部品内蔵樹脂構造体４００は、さらに、第２主面４０１Ｂの上に設けられた第２粘着層４５１を備えていてもよい。これによれば、人体等の屈曲・伸縮する貼合箇所に電子部品内蔵樹脂構造体を貼合して使用することができる。また、第２主面の全面に亘る基板を備えることなく、構造体を粘着層で直接に貼合箇所に貼合するため、電子部品内蔵樹脂構造体を薄肉化することができる。 The electronic component built-in resin structure 400 may further include a second adhesive layer 451 provided on the second main surface 401B. According to this, the electronic component built-in resin structure can be bonded and used at the bonding location where the human body or the like is bent and stretched. Moreover, since the structure is directly bonded to the bonding position with the adhesive layer without providing a substrate extending over the entire surface of the second main surface, the resin structure with a built-in electronic component can be thinned.
　電子部品内蔵樹脂構造体４００は、さらに、第１主面４０１Ａ上に伸縮性を有する保護層４５２を備えていてもよい。これによれば、電子部品内蔵樹脂構造体の可撓性を阻害することなく、配線部の損傷を抑制することができる。 The electronic component built-in resin structure 400 may further include a protective layer 452 having elasticity on the first main surface 401A. According to this, it is possible to suppress damage to the wiring portion without hindering the flexibility of the electronic component built-in resin structure.
　電子部品内蔵樹脂構造体５００は、第１電子部品５１１、第１樹脂部５２１、及び第２樹脂部５２２を含み、第１主面５０１Ａ及び第２主面５０２Ａを有する第１構造体５０１と、互いに対向する第３主面５０２Ａ及び第４主面５０２Ｂを有し、第３主面５０２Ａと平行な面方向に伸縮性を有し、第３電子部品５１３を内蔵し、主面同士が対向するように第１構造体５０１に積層された第２構造体５０２と、を備え、第２構造体５０２は、第３電子部品５１３を覆う第４樹脂部５２４と、面方向において第４樹脂部５２４に隣接する第５樹脂部５２５と、を備え、第４樹脂部５２４は、第５樹脂部５２５よりも剛性が高く、第５樹脂部５２５は、第４樹脂部５２４よりも伸縮性が高く、第１構造体５０１と第２構造体５０２とは互いに電気的に接続されていてもよい。これによれば、電子部品内蔵樹脂構造体は、面方向の伸縮性を維持したまま、面方向と交差する層間方向に複数の電子部品を集積することで、より高度な機能を実現することができる。また、積層される構造体には、主面の全面に亘る基板が備えられていない。また、積層される構造体の間にも、主面の全面に亘る基板が備えられておらず、積層体は接着層を介して互いに直接接着されている。これにより、構造体を複数積層したとしても、電子部品内蔵樹脂構造体を薄肉化することができる。 The electronic component built-in resin structure 500 includes a first electronic component 511, a first resin portion 521, and a second resin portion 522, and includes a first structure 501 having a first main surface 501A and a second main surface 502A, It has a third main surface 502A and a fourth main surface 502B that face each other, has elasticity in a plane direction parallel to the third main surface 502A, incorporates a third electronic component 513, and the main surfaces face each other. The second structure 502 is laminated on the first structure 501 as described above. The second structure 502 includes a fourth resin portion 524 that covers the third electronic component 513 and a fourth resin portion 524 in the surface direction. A fourth resin portion 525, the fourth resin portion 524 has higher rigidity than the fifth resin portion 525, and the fifth resin portion 525 has higher elasticity than the fourth resin portion 524, The first structure 501 and the second structure 502 are electrically connected to each other. It may be connected to. According to this, the resin structure with a built-in electronic component can realize a more advanced function by accumulating a plurality of electronic components in the interlayer direction intersecting the surface direction while maintaining the stretchability in the surface direction. it can. Further, the laminated structure is not provided with a substrate extending over the entire main surface. In addition, a substrate over the entire main surface is not provided between the stacked structures, and the stacked bodies are directly bonded to each other through an adhesive layer. Thereby, even if it laminates | stacks two or more structures, the electronic component built-in resin structure can be thinned.
　本発明の他の一態様によれば、互いに対向する第１主面６０１Ａ及び第２主面６０１Ｂを有し、第１主面６０１Ａと平行な面方向に伸縮性を有し、電子部品６１１，６１２を内蔵する電子部品内蔵樹脂構造体６００の製造方法であって、支持体６９０の上に電子部品６１１，６１２を配置する工程と、支持体６９０の上に電子部品６１１，６１２を覆うように第１樹脂部を６２１設け、面方向において第１樹脂部６２１に隣接する第２樹脂部６２２を設ける工程と、電子部品６１１，６１２、第１樹脂部６２１、及び第２樹脂部６２２のそれぞれの一面を含む第１主面６０１Ａから支持体６９０を剥離する工程と、電子部品６１１，６１２に電気的に接続するように第１主面の上に配線部６４１を設ける工程と、を含み、第１樹脂部６２１は、第２樹脂部６２２よりも剛性が高く、第２樹脂部６２２は、第１樹脂部６２１よりも伸縮性が高い、電子部品内蔵樹脂構造体の製造方法、が提供される。 According to another aspect of the present invention, the electronic component 611 includes a first main surface 601A and a second main surface 601B facing each other, and has elasticity in a plane direction parallel to the first main surface 601A. 612 is a method of manufacturing a resin structure 600 with a built-in electronic component, the step of placing the electronic components 611 and 612 on the support 690, and the electronic components 611 and 612 covered on the support 690. The step of providing the first resin portion 621 and providing the second resin portion 622 adjacent to the first resin portion 621 in the surface direction, and the electronic components 611, 612, the first resin portion 621, and the second resin portion 622, respectively. Separating the support 690 from the first main surface 601A including one surface, and providing a wiring part 641 on the first main surface so as to be electrically connected to the electronic components 611 and 612, and 1 resin part 621 Higher rigidity than the second resin portion 622, the second resin portion 622, stretchability than the first resin portion 621 is high, a manufacturing method of an electronic component built resin structure, is provided.
　上記態様によれば、電子部品は剛性の高い第１樹脂部で保護されているため、電子部品の損傷を低減することができる。また、伸縮性が高い第２樹脂部が面方向において第１樹脂部に隣接していることで、電子部品内蔵樹脂構造体の面方向における伸縮性を確保することができる。すなわち、電子部品内蔵樹脂構造体の可撓性及び耐久性の両特性を向上させることができる。 According to the above aspect, since the electronic component is protected by the highly rigid first resin portion, it is possible to reduce damage to the electronic component. In addition, since the second resin portion having high stretchability is adjacent to the first resin portion in the surface direction, the stretchability in the surface direction of the electronic component built-in resin structure can be ensured. That is, both the flexibility and durability characteristics of the resin structure with built-in electronic components can be improved.
　本発明の他の一態様によれば、互いに対向する第１主面７０１Ａ及び第２主面７０１Ｂを有し、第１主面７０１Ａと平行な面方向に伸縮性を有し、電子部品７１１，７１２を内蔵する電子部品内蔵樹脂構造体７００の製造方法であって、支持体７９０の上に配線部７４１を設ける工程と、配線部７４１に電気的に接続するように電子部品７１１，７１２を実装する工程と、支持体７９０の上に電子部品７１１，７１２を覆うように第１樹脂部７２１を設け、面方向において第１樹脂部７２１に隣接する第２樹脂部７２２を設ける工程と、配線部７４１の一面を含む第１主面７０１Ａから支持体７９０を剥離する工程と、を含み、第１樹脂部７２１は、第２樹脂部７２２よりも剛性が高く、第２樹脂部７２２は、第１樹脂部７２１よりも伸縮性が高い、電子部品内蔵樹脂構造体の製造方法、が提供される。 According to another aspect of the present invention, the electronic component 711 has a first main surface 701A and a second main surface 701B facing each other, and has elasticity in a plane direction parallel to the first main surface 701A. 712 is a method of manufacturing a resin structure 700 with a built-in electronic component, the step of providing a wiring portion 741 on a support 790, and mounting the electronic components 711 and 712 so as to be electrically connected to the wiring portion 741. A step of providing a first resin portion 721 on the support 790 so as to cover the electronic components 711 and 712, a step of providing a second resin portion 722 adjacent to the first resin portion 721 in the surface direction, and a wiring portion The first resin portion 721 has higher rigidity than the second resin portion 722, and the second resin portion 722 includes the first main surface 701A including one surface. More elastic than resin part 721 Is high, a manufacturing method of an electronic component built resin structure, is provided.
　上記態様によれば、電子部品は剛性の高い第１樹脂部で保護されているため、電子部品の損傷を低減することができる。また、伸縮性が高い第２樹脂部が面方向において第１樹脂部に隣接していることで、電子部品内蔵樹脂構造体の面方向における伸縮性を確保することができる。すなわち、電子部品内蔵樹脂構造体の可撓性及び耐久性の両特性を向上させることができる。 According to the above aspect, since the electronic component is protected by the highly rigid first resin portion, it is possible to reduce damage to the electronic component. In addition, since the second resin portion having high stretchability is adjacent to the first resin portion in the surface direction, the stretchability in the surface direction of the electronic component built-in resin structure can be ensured. That is, both the flexibility and durability characteristics of the resin structure with built-in electronic components can be improved.
　以上説明したように、本発明の一態様によれば、良好な可撓性及び耐久性の両立を図ることができる電子部品内蔵樹脂構造体を提供することが可能となる。 As described above, according to one aspect of the present invention, it is possible to provide an electronic component built-in resin structure capable of achieving both good flexibility and durability.
　なお、以上説明した実施形態は、本発明の理解を容易にするためのものであり、本発明を限定して解釈するためのものではない。本発明は、その趣旨を逸脱することなく、変更／改良され得るととともに、本発明にはその等価物も含まれる。即ち、各実施形態に当業者が適宜設計変更を加えたものも、本発明の特徴を備えている限り、本発明の範囲に包含される。例えば、各実施形態が備える各要素及びその配置、材料、条件、形状、サイズなどは、例示したものに限定されるわけではなく適宜変更することができる。また、各実施形態が備える各要素は、技術的に可能な限りにおいて組み合わせることができ、これらを組み合わせたものも本発明の特徴を含む限り本発明の範囲に包含される。 The embodiment described above is for facilitating understanding of the present invention, and is not intended to limit the present invention. The present invention can be changed / improved without departing from the spirit thereof, and the present invention includes equivalents thereof. In other words, those obtained by appropriately modifying the design of each embodiment by those skilled in the art are also included in the scope of the present invention as long as they include the features of the present invention. For example, each element included in each embodiment and its arrangement, material, condition, shape, size, and the like are not limited to those illustrated, and can be changed as appropriate. In addition, each element included in each embodiment can be combined as much as technically possible, and combinations thereof are included in the scope of the present invention as long as they include the features of the present invention.
　１００，２００，３００，４００，５００，６００，７００…電子部品内蔵樹脂構造体
　１０１，２０１，３０１，４０１，５０１，５０２，５０３，６０１，７０１…構造体
　１０１Ａ，２０１Ａ，３０１Ａ，４０１Ａ，５０１Ａ，６０１Ａ，７０１Ａ…第１主面
　１０１Ｂ，２０１Ｂ，３０１Ｂ，４０１Ｂ，５０１Ｂ，６０１Ｂ，７０１Ｂ…第２主面
　５０２Ａ…第３主面　５０２Ｂ…第４主面　５０３Ａ…第５主面　５０３Ｂ…第６主面
　１１１，２１１，３１１，４１１，５１１…第１電子部品
　１１２，２１２，３１２，４１２，５１２…第２電子部品
　５１３…第３電子部品　５１４…第４電子部品
　５１５…第５電子部品　５１６…第６電子部品
　６１１，６１２，７１１，７１２…電子部品
　１２１，２２１，３２１，４２１，５２１，６２１，７２１…第１樹脂部
　１２２，２２２，３２２，４２２，５２２，６２２，７２２…第２樹脂部
　２２３…第３樹脂部　５２４…第４樹脂部　５２５…第５樹脂部
　５２６…第６樹脂部　５２７…第７樹脂部
　１４１，２４１，３４１，４４１，５４１，５４２，６４１，７４１…配線部
　３５１，４５１…粘着層　４５２…保護層　５６１，５６２…接着層
　５７１，５７２…層間接続端子　５８１，５８２…導電部　６９０，７９０…支持体　
　６３１，７３１…第１樹脂組成物　６３２，７３２…第２樹脂組成物 100, 200, 300, 400, 500, 600, 700 ... Electronic component built-in resin structure 101, 201, 301, 401, 501, 502, 503, 601, 701 ... Structure 101A, 201A, 301A, 401A, 501A, 601A, 701A ... 1st main surface 101B, 201B, 301B, 401B, 501B, 601B, 701B ... 2nd main surface 502A ... 3rd main surface 502B ... 4th main surface 503A ... 5th main surface 503B ... 6th main surface 111, 211, 311, 411, 511 ... 1st electronic component 112, 212, 312, 412, 512 ... 2nd electronic component 513 ... 3rd electronic component 514 ... 4th electronic component 515 ... 5th electronic component 516 ... 6th Electronic parts 611, 612, 711, 712 ... Electronic parts 121, 221, 321, 421, 521, 621 21 ... 1st resin part 122,222,322,422,522,622,722 ... 2nd resin part 223 ... 3rd resin part 524 ... 4th resin part 525 ... 5th resin part 526 ... 6th resin part 527 ... 7th resin part 141,241,341,441,541,542,641,741 ... wiring part 351,451 ... adhesive layer 452 ... protective layer 561,562 ... adhesion layer 571,572 ... interlayer connection terminal 581,582 ... conductivity 690, 790 ... support
631,731 ... 1st resin composition 632,732 ... 2nd resin composition

Claims (11)

  1. 　互いに対向する第１主面及び第２主面を有し、前記第１主面と平行な面方向に伸縮性を有し、第１電子部品を内蔵する電子部品内蔵樹脂構造体であって、
    　前記第１電子部品を覆う第１樹脂部と、前記面方向において前記第１樹脂部に隣接する第２樹脂部と、を備え、
    　前記第１樹脂部は、前記第２樹脂部よりも剛性が高く、
    　前記第２樹脂部は、前記第１樹脂部よりも伸縮性が高い、電子部品内蔵樹脂構造体。     An electronic component built-in resin structure having a first main surface and a second main surface facing each other, having elasticity in a plane direction parallel to the first main surface, and incorporating the first electronic component,
    A first resin part covering the first electronic component; and a second resin part adjacent to the first resin part in the surface direction;
    The first resin portion has higher rigidity than the second resin portion,
    The second resin part is a resin structure with a built-in electronic component that has higher elasticity than the first resin part.
  2. 　さらに、前記面方向において前記第１電子部品と並ぶ第２電子部品と、
    　前記面方向において前記第２電子部品を覆い前記第２樹脂部よりも剛性が高い第３樹脂部と、を備え、
    　前記第２樹脂部は、前記第１樹脂部と前記第３樹脂部とを前記面方向において繋いでいる、
    　請求項１に記載の電子部品内蔵樹脂構造体。     Furthermore, a second electronic component aligned with the first electronic component in the surface direction;
    A third resin part that covers the second electronic component in the surface direction and has higher rigidity than the second resin part,
    The second resin portion connects the first resin portion and the third resin portion in the surface direction.
    The resin structure with a built-in electronic component according to claim 1.
  3. 　さらに、前記第１主面側に設けられ伸縮性を有する配線部を備え、
    　前記配線部は、前記第１電子部品に電気的に接続される、
    　請求項１又は２に記載の電子部品内蔵樹脂構造体。     Furthermore, provided with a wiring portion provided on the first main surface side and having elasticity,
    The wiring portion is electrically connected to the first electronic component.
    The resin structure with a built-in electronic component according to claim 1 or 2.
  4. 　前記第１主面は、前記第１電子部品、前記第１樹脂部、及び前記第２樹脂部のそれぞれの一面を含み、前記配線部に接している、
    　請求項３に記載の電子部品内蔵樹脂構造体。     The first main surface includes one surface of each of the first electronic component, the first resin portion, and the second resin portion, and is in contact with the wiring portion.
    The resin structure with a built-in electronic component according to claim 3.
  5. 　前記第１主面は、前記配線部の一面を含んでいる、
    　請求項３に記載の電子部品内蔵樹脂構造体。     The first main surface includes one surface of the wiring portion;
    The resin structure with a built-in electronic component according to claim 3.
  6. 　さらに、前記第１主面上に第１粘着層を備えている、
    　請求項３から５のいずれか１項に記載の電子部品内蔵樹脂構造体。     Furthermore, the first adhesive layer is provided on the first main surface,
    The resin structure with a built-in electronic component according to any one of claims 3 to 5.
  7. 　さらに、前記第２主面の上に設けられた第２粘着層を備えている、
    　請求項３から５のいずれか１項に記載の電子部品内蔵樹脂構造体。     Furthermore, it comprises a second adhesive layer provided on the second main surface,
    The resin structure with a built-in electronic component according to any one of claims 3 to 5.
  8. 　さらに、前記第１主面上に伸縮性を有する保護層を備えている、
    　請求項７に記載の電子部品内蔵樹脂構造体。     Furthermore, it has a protective layer having elasticity on the first main surface,
    The resin structure with a built-in electronic component according to claim 7.
  9. 　前記第１電子部品、前記第１樹脂部、及び前記第２樹脂部を含み、前記第１主面及び前記第２主面を有する第１構造体と、
    　互いに対向する第３主面及び第４主面を有し、前記第３主面と平行な面方向に伸縮性を有し、第３電子部品を内蔵し、主面同士が対向するように前記第１構造体に積層された第２構造体と、を備え、
    　前記第２構造体は、前記第３電子部品を覆う第４樹脂部と、前記面方向において前記第４樹脂部に隣接する第５樹脂部と、を備え、
    　前記第４樹脂部は、前記第５樹脂部よりも剛性が高く、
    　前記第５樹脂部は、前記第４樹脂部よりも伸縮性が高く、
    　前記第１構造体と前記第２構造体とは互いに電気的に接続されている、
    　請求項１から８のいずれか１項に記載の電子部品内蔵樹脂構造体。     A first structure including the first electronic component, the first resin portion, and the second resin portion, and having the first main surface and the second main surface;
    The third main surface and the fourth main surface that face each other, have elasticity in a plane direction parallel to the third main surface, incorporate a third electronic component, and the main surfaces face each other. A second structure laminated on the first structure,
    The second structure includes a fourth resin portion that covers the third electronic component, and a fifth resin portion that is adjacent to the fourth resin portion in the surface direction,
    The fourth resin portion has higher rigidity than the fifth resin portion,
    The fifth resin part has higher elasticity than the fourth resin part,
    The first structure and the second structure are electrically connected to each other;
    The resin structure with a built-in electronic component according to any one of claims 1 to 8.
  10. 　互いに対向する第１主面及び第２主面を有し、前記第１主面と平行な面方向に伸縮性を有し、電子部品を内蔵する電子部品内蔵樹脂構造体の製造方法であって、
    　支持体の上に前記電子部品を配置する工程と、
    　前記支持体の上に前記電子部品を覆うように第１樹脂部を設け、前記面方向において前記第１樹脂部に隣接する第２樹脂部を設ける工程と、
    　前記電子部品、前記第１樹脂部、及び第２樹脂部のそれぞれの一面を含む前記第１主面から前記支持体を剥離する工程と、
    　前記電子部品に電気的に接続するように前記第１主面の上に配線部を設ける工程と、を含み、
    　前記第１樹脂部は、前記第２樹脂部よりも剛性が高く、
    　前記第２樹脂部は、前記第１樹脂部よりも伸縮性が高い、
    　電子部品内蔵樹脂構造体の製造方法。     An electronic component built-in resin structure having a first main surface and a second main surface facing each other, stretchable in a plane direction parallel to the first main surface, and incorporating an electronic component. ,
    Placing the electronic component on a support;
    Providing a first resin part on the support so as to cover the electronic component, and providing a second resin part adjacent to the first resin part in the surface direction;
    Peeling the support from the first main surface including one surface of each of the electronic component, the first resin portion, and the second resin portion;
    Providing a wiring portion on the first main surface so as to be electrically connected to the electronic component,
    The first resin portion has higher rigidity than the second resin portion,
    The second resin part has higher elasticity than the first resin part.
    Manufacturing method of resin structure with built-in electronic components.
  11. 　互いに対向する第１主面及び第２主面を有し、前記第１主面と平行な面方向に伸縮性を有し、電子部品を内蔵する電子部品内蔵樹脂構造体の製造方法であって、
    　支持体の上に配線部を設ける工程と、
    　前記配線部に電気的に接続するように前記電子部品を実装する工程と、
    　前記支持体の上に前記電子部品を覆うように第１樹脂部を設け、前記面方向において前記第１樹脂部に隣接する第２樹脂部を設ける工程と、
    　前記配線部の一面を含む前記第１主面から前記支持体を剥離する工程と、を含み、
    　前記第１樹脂部は、前記第２樹脂部よりも剛性が高く、
    　前記第２樹脂部は、前記第１樹脂部よりも伸縮性が高い、電子部品内蔵樹脂構造体の製造方法。     An electronic component built-in resin structure having a first main surface and a second main surface facing each other, stretchable in a plane direction parallel to the first main surface, and incorporating an electronic component. ,
    Providing a wiring portion on a support;
    Mounting the electronic component to be electrically connected to the wiring portion;
    Providing a first resin part on the support so as to cover the electronic component, and providing a second resin part adjacent to the first resin part in the surface direction;
    Peeling the support from the first main surface including one surface of the wiring part,
    The first resin portion has higher rigidity than the second resin portion,
    The second resin part is a method for manufacturing an electronic component built-in resin structure, which is higher in elasticity than the first resin part.
PCT/JP2018/009409 2017-03-13 2018-03-12 Resin structure with built-in electronic component and method for producing same WO2018168734A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017047273 2017-03-13
JP2017-047273 2017-03-13

Publications (1)

Publication Number Publication Date
WO2018168734A1 true WO2018168734A1 (en) 2018-09-20

Family

ID=63523466

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2018/009409 WO2018168734A1 (en) 2017-03-13 2018-03-12 Resin structure with built-in electronic component and method for producing same

Country Status (1)

Country Link
WO (1) WO2018168734A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210043604A1 (en) * 2019-08-06 2021-02-11 Advanced Semiconductor Engineering, Inc. Semiconductor package structure and method of manufacturing the same
CN112470554A (en) * 2018-10-22 2021-03-09 东洋纺株式会社 Method for manufacturing device connection body and device connection body
WO2025105149A1 (en) * 2023-11-13 2025-05-22 株式会社村田製作所 Stretchable device
WO2025173538A1 (en) * 2024-02-13 2025-08-21 株式会社村田製作所 Elastic device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61156792A (en) * 1984-12-28 1986-07-16 株式会社東芝 Manufacture of circuit module
JP2004273853A (en) * 2003-03-10 2004-09-30 Matsushita Electric Ind Co Ltd Chip component with resin layer, component built-in module using the same, and manufacturing method thereof
US20080257589A1 (en) * 2006-11-21 2008-10-23 Andreas Ostmann Method for the production of expandable circuit carrier and expandable circuit carrier
JP2014021894A (en) * 2012-07-23 2014-02-03 Fujitsu Ltd Rfid tag

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61156792A (en) * 1984-12-28 1986-07-16 株式会社東芝 Manufacture of circuit module
JP2004273853A (en) * 2003-03-10 2004-09-30 Matsushita Electric Ind Co Ltd Chip component with resin layer, component built-in module using the same, and manufacturing method thereof
US20080257589A1 (en) * 2006-11-21 2008-10-23 Andreas Ostmann Method for the production of expandable circuit carrier and expandable circuit carrier
JP2014021894A (en) * 2012-07-23 2014-02-03 Fujitsu Ltd Rfid tag

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112470554A (en) * 2018-10-22 2021-03-09 东洋纺株式会社 Method for manufacturing device connection body and device connection body
CN112470554B (en) * 2018-10-22 2024-03-22 东洋纺株式会社 Method for manufacturing device connector and device connector
US20210043604A1 (en) * 2019-08-06 2021-02-11 Advanced Semiconductor Engineering, Inc. Semiconductor package structure and method of manufacturing the same
US11139268B2 (en) * 2019-08-06 2021-10-05 Advanced Semiconductor Engineering, Inc. Semiconductor package structure and method of manufacturing the same
WO2025105149A1 (en) * 2023-11-13 2025-05-22 株式会社村田製作所 Stretchable device
WO2025173538A1 (en) * 2024-02-13 2025-08-21 株式会社村田製作所 Elastic device

Similar Documents

Publication Publication Date Title
WO2018168734A1 (en) Resin structure with built-in electronic component and method for producing same
EP3120381B1 (en) Flexible electronics apparatus and associated methods
CN107211534B (en) stretchable circuit board
TWI388258B (en) Flexible printed circuit board and method for manufacturing the same
US7728232B2 (en) Printed circuit board assembly having adhesive layer
US20140131897A1 (en) Warpage Control for Flexible Substrates
JP2015192146A (en) Flexible electronic system including wire bond
JP2017525299A (en) RFID tag on flexible substrate
US8026603B2 (en) Interconnect structure of an integrated circuit and manufacturing method thereof
JP6416491B2 (en) Contact smart card
US7581960B2 (en) Camera module and assembling process thereof
KR101846853B1 (en) Flexible circuit board having rigid dummy
JP7223506B2 (en) IC tag
JP2009182274A (en) Device packaging board and method for manufacturing same, semiconductor module and method for manufacturing same, and portable device
WO2018038134A1 (en) Circuit module
WO2023105873A1 (en) Expansion device
US20210104563A1 (en) Ultra-thin package structure for integrated circuit having sensing function and method forming the same
US9881890B2 (en) Semiconductor module, bonding jig, and manufacturing method of semiconductor module
US10426029B1 (en) Micro-pad array to thread flexible attachment
CN101820721B (en) Substrate for circuit board, circuit board and method for manufacturing circuit board
WO2017066896A1 (en) Electrical connection structure between the front and rear of a chip, and manufacturing method therefor
CN112447688A (en) Light emitting device and method for manufacturing light emitting device
KR101616272B1 (en) Semiconductor package manufacturing method
JP2000174169A (en) Semiconductor device
KR101486201B1 (en) A flexible integrated circuit device and method of manufacturing the same

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18767392

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 18767392

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: JP