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WO2018168734A1 - Structure de résine à composant électronique intégré et son procédé de production - Google Patents

Structure de résine à composant électronique intégré et son procédé de production Download PDF

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Publication number
WO2018168734A1
WO2018168734A1 PCT/JP2018/009409 JP2018009409W WO2018168734A1 WO 2018168734 A1 WO2018168734 A1 WO 2018168734A1 JP 2018009409 W JP2018009409 W JP 2018009409W WO 2018168734 A1 WO2018168734 A1 WO 2018168734A1
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Prior art keywords
resin
electronic component
main surface
built
resin portion
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Application number
PCT/JP2018/009409
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English (en)
Japanese (ja)
Inventor
宗彦 郡田
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株式会社村田製作所
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Publication of WO2018168734A1 publication Critical patent/WO2018168734A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/568—Temporary substrate used as encapsulation process aid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H01L2224/241—Disposition
    • H01L2224/24151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/24153—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate
    • H01L2224/24195—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate the item being a discrete passive component
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/81001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector involving a temporary auxiliary member not forming part of the bonding apparatus
    • H01L2224/81005—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector involving a temporary auxiliary member not forming part of the bonding apparatus being a temporary or sacrificial substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/96—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19042—Component type being an inductor
    • H—ELECTRICITY
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping

Definitions

  • the present invention relates to a resin structure with a built-in electronic component and a manufacturing method thereof.
  • Patent Document 1 discloses a resin structure that includes a resin molded body and a plurality of electronic components embedded therein, and is thinned and miniaturized.
  • the resin structure has an exposed surface from which an electrode of an electronic component is exposed on the resin formed body, and the bottom surface of the concave portion of the resin formed body is the exposed surface, increasing the degree of freedom in circuit design. .
  • the present invention has been made in view of such circumstances, and an object thereof is to provide an electronic component built-in resin structure capable of achieving both good flexibility and durability.
  • An electronic component built-in resin structure has a first main surface and a second main surface that face each other, and has elasticity in a plane direction parallel to the first main surface.
  • An electronic component built-in resin structure incorporating a component comprising: a first resin portion that covers the first electronic component; and a second resin portion that is adjacent to the first resin portion in the surface direction.
  • the rigidity of the second resin part is higher than that of the second resin part, and the second resin part has higher elasticity than the first resin part.
  • a method for manufacturing an electronic component-embedded resin structure having a first main surface and a second main surface facing each other, and having elasticity in a plane direction parallel to the first main surface.
  • a method of manufacturing an electronic component built-in resin structure incorporating an electronic component the step of installing the electronic component on the support, and the first resin portion provided on the support so as to cover the electronic component
  • providing a wiring portion on the first main surface so as to be electrically connected to the electronic component, wherein the first resin portion is higher in rigidity than the second resin portion, and the second resin portion is The elasticity is higher than that of the first resin portion.
  • a method for manufacturing an electronic component-embedded resin structure having a first main surface and a second main surface facing each other, and having elasticity in a plane direction parallel to the first main surface.
  • a method of manufacturing an electronic component built-in resin structure incorporating an electronic component the step of providing a wiring portion on a support, the step of mounting the electronic component so as to be electrically connected to the wiring portion,
  • the first resin part is provided on the support so as to cover the electronic component, the step of providing the second resin part adjacent to the first resin part in the surface direction, and the support from the first main surface including one surface of the wiring part
  • the first resin part has higher rigidity than the second resin part, and the second resin part has higher stretchability than the first resin part.
  • FIG. 1A is a cross-sectional view schematically showing the structure of the electronic component built-in resin structure according to the first embodiment of the present invention.
  • FIG. 1B is a cross-sectional view schematically showing the structure of an electronic component built-in resin structure according to a modification of the first embodiment.
  • FIG. 2 is a cross-sectional view schematically showing the structure of the electronic component built-in resin structure according to the second embodiment of the present invention.
  • FIG. 3 is a cross-sectional view schematically showing the structure of the electronic component built-in resin structure according to the third embodiment of the present invention.
  • FIG. 4 is a cross-sectional view schematically showing the structure of the electronic component built-in resin structure according to the fourth embodiment of the present invention.
  • FIG. 1A is a cross-sectional view schematically showing the structure of the electronic component built-in resin structure according to the first embodiment of the present invention.
  • FIG. 1B is a cross-sectional view schematically showing the structure of an electronic component built-in resin structure according to
  • FIG. 5 is a cross-sectional view schematically showing the structure of an electronic component built-in resin structure according to a fifth embodiment of the present invention.
  • FIG. 6A is a diagram showing a process of providing an electronic component on a support in the sixth embodiment of the present invention.
  • FIG. 6B is a diagram showing a step of providing a resin composition on a support in the sixth embodiment of the present invention.
  • FIG. 6C is a diagram showing a step of curing the resin composition in the sixth embodiment of the present invention.
  • FIG. 6D is a diagram showing a step of peeling the support from the first main surface in the sixth embodiment of the present invention.
  • FIG. 6E is a diagram showing a step of providing a wiring portion on the first main surface in the sixth embodiment of the present invention.
  • FIG. 6A is a diagram showing a process of providing an electronic component on a support in the sixth embodiment of the present invention.
  • FIG. 6B is a diagram showing a step of providing a resin composition on a support in
  • FIG. 7A is a diagram illustrating a process of providing a wiring portion on a support in the seventh embodiment of the present invention.
  • FIG. 7B is a diagram illustrating a process of providing an electronic component so as to be electrically connected to the wiring portion in the seventh embodiment of the present invention.
  • FIG. 7C is a diagram illustrating a process of providing the first resin portion and the second resin portion in the seventh embodiment of the present invention.
  • FIG. 7D is a diagram showing a step of peeling the support from the first main surface in the seventh embodiment of the present invention.
  • the first direction X, the second direction Y, and the third direction Z are, for example, directions orthogonal to each other, but are not particularly limited as long as they intersect with each other, and angles other than a right angle to each other
  • the crossing direction may be used.
  • the main surface is a surface parallel to a surface specified by the first direction X and the second direction Y (hereinafter referred to as XY surface).
  • the thickness is a thickness along the third direction Z that is a direction orthogonal to the XY plane.
  • FIG. 1A is a cross-sectional view schematically showing the structure of the electronic component built-in resin structure according to the first embodiment of the present invention.
  • FIG. 1B is a cross-sectional view schematically showing the structure of an electronic component built-in resin structure according to a modification of the first embodiment.
  • the electronic component built-in resin structure 100 includes a structure body 101 having a first main surface 101A and a second main surface 101B facing each other, a wiring portion 141 provided on the first main surface 101A of the structure body 101, It has.
  • the structural body 101 includes a first electronic component 111, a second electronic component 112, a first resin portion 121, and a second resin portion 122.
  • the first electronic component 111 and the second electronic component 112 are arranged away from each other in the XY plane direction parallel to the first main surface 101A.
  • an electronic component such as an IC or a SAW device, a chip-shaped electronic component such as a capacitor, a resistor, or a coil can be used.
  • the first electronic component 111 is provided with a terminal electrode 111A on the bottom surface
  • the second electronic component 112 is provided with terminal electrodes 112A on both ends thereof, the one surface of the terminal electrode 111A of the first electronic component 111 and the first surface.
  • One surface of the terminal electrode 112A of the two electronic component 112 is disposed on the same surface as the first main surface 101A.
  • the main body of the first electronic component may have a predetermined space (for example, 50 ⁇ m or more and 100 ⁇ m or less) between the first main surface 101A.
  • one surface of each of the first electronic component 111 and the second electronic component 112 more specifically, one surface of each of the terminal electrode 111A and the terminal electrode 112A is included in the first main surface 101A.
  • the terminal electrodes 111A and 112A and the wiring part 141 are directly connected.
  • a connecting material such as a conductive paste or a low melting point solder is disposed between the terminal electrodes 111A and 112A and the wiring part 141. May be.
  • the first resin part 121 covers the first electronic component 111 and the second electronic component 112. Specifically, the first resin portion 121 is provided so as to surround the first electronic component 111 and the second electronic component 112 in the XY plane direction. The first resin portion 121 covers the second main surface 101B side of the first electronic component 111 and the second electronic component 112, and is not provided on the first main surface 101A side. However, the first resin portion 121 may also be provided in a predetermined space between the main body portion of the first electronic component 111 and the first main surface 101A. One main surface 121A of the first resin portion 121 is included in the first main surface 101A of the structure 101, and the other main surface 121B is included in the second main surface 101B of the structure 101.
  • the first resin portion 121 is a hard resin for protecting the first electronic component 111 and the second electronic component 112 from external stress or the like, and has higher rigidity than the second resin portion 122.
  • the rigidity of the first resin portion 121 is desirably 70 ° or more and 90 ° or less when defined by the Shore hardness.
  • the material of the first resin portion 121 is not particularly limited, and examples thereof include polyethylene terephthalate resin, polyethylene naphthalate resin, polyimide resin, acrylic resin, urethane resin, and polycarbonate resin.
  • the second resin part 122 is adjacent to the first resin part 121 in the XY plane direction. That is, the first electronic component 111 (second electronic component 112), the first resin portion 121, and the second resin portion 122 are arranged in the XY plane direction.
  • One main surface 122A of the second resin portion 122 is included in the first main surface 101A of the structure 101, and the other main surface 122B is included in the second main surface 101B of the structure 101.
  • the second resin portion 122 is a soft resin for imparting flexibility (flexibility or stretchability) to the structure 101, and has lower rigidity and higher stretchability than the first resin portion 121.
  • the second resin portion 122 has a Shore hardness of less than about 20 °.
  • the expansion / contraction rate of the second resin portion 122 is, for example, 5% or more and 50% or less. According to this, even when the electronic component built-in resin structure 100 is used by being attached to a bonding portion where bending and expansion / contraction occurs in a human body or the like, it follows the bending and expansion / contraction of the bonding portion. It can be deformed without being damaged.
  • the material of the second resin part 122 is not particularly limited as long as it has flexibility.
  • the 1st resin part 121 and the 2nd resin part 122 may be comprised with resin of the same system
  • the main surface 122A of the second resin portion 122 is different from the main surface 121A of the first resin portion 121.
  • the main surfaces 121A and 122A are arranged in the same plane (XY plane).
  • One surface of the terminal electrodes 111A and 112A and the main surface 121A are also arranged in the same plane (XY plane). That is, the first main surface 101 ⁇ / b> A of the structure 101 has a planar shape including one surface of each of the first electronic component 111, the second electronic component 112, the first resin portion 121, and the second resin portion 122.
  • 101 A of 1st main surfaces become a curved surface according to a deformation
  • the main surface 122B of the second resin portion 122 has no step between the main surface 121B of the first resin portion 121 and the main surfaces 121B and 122B are arranged in the same plane (XY plane). However, a step may be formed on the main surfaces 121B and 122B.
  • the second resin portion 122 may overlap the end portion of the first resin portion 121 in the third direction Z. Further, as shown in FIG.
  • the second main surface 121 ⁇ / b> B of the first resin portion 121 may be covered with the second resin portion 122. Since the hardness of the first resin portion 121 is high, the main surface 121B may be difficult to be formed flat, but by providing the configuration of FIG. 1B, the surface flatness of the electronic component built-in resin structure 100 can be easily obtained. Can do.
  • the boundary BR in the surface direction between the first resin portion 121 and the second resin portion 122 is clear in the illustrated example, and extends in the third direction Z that is the thickness direction of the structure 101.
  • the boundary BR may be unclear or complicated.
  • the composition and physical properties at the boundary BR may be in a state where the materials of the first resin portion and the second resin portion are mixed with each other. According to this, when the electronic component built-in resin structure 100 is expanded and contracted in the surface direction, peeling that occurs between the first resin portion 121 and the second resin portion 122 at the boundary BR can be suppressed.
  • the wiring part 141 is provided on the first main surface 101A side of the structure 101 so as to be electrically connected to the terminal electrodes 111A and 112A.
  • the wiring part 141 is provided on the first main surface 101 ⁇ / b> A of the structure 101.
  • the wiring part 141 is provided on the main surface 121A of the first resin part 121, and is connected to the first electronic component 111 and the second electronic component 112 so as to have electrical connection as necessary.
  • the wiring part 141 may also be provided on the main surface 122A of the second resin part 122.
  • the wiring part 141 desirably has elasticity, and desirably has higher elasticity than the first resin part 121.
  • the wiring portion 141 desirably has substantially the same elasticity as the second resin portion 122.
  • the wiring part 141 is provided by, for example, a conductive paste, includes a silicone resin as a binder component, and includes silver (Ag) -based particles and copper (Cu) -based particles as conductive components.
  • a conductive paste includes a silicone resin as a binder component, and includes silver (Ag) -based particles and copper (Cu) -based particles as conductive components.
  • the wiring part 141 is arranged almost all over the cross section of the electronic component built-in resin structure 100 for the sake of convenience. Is formed so as to have electrical characteristics as required, and further connected to the first electronic component 111 and the second electronic component 112 so as to have electrical connection as required.
  • FIG. 2 is a cross-sectional view schematically showing the structure of the electronic component built-in resin structure according to the second embodiment of the present invention.
  • FIG. 2 is a cross-sectional view schematically showing the structure of the electronic component built-in resin structure according to the second embodiment of the present invention.
  • the first electronic component 211 is covered by the first resin portion 221
  • the second electronic component 212 is covered by the third resin portion 223. This is different from the electronic component built-in resin structure 100 according to the embodiment.
  • the third resin portion 223 has the same function as the first resin portion 221 and is a hard resin that protects the second electronic component 212.
  • the first resin portion 221 is provided so as to surround the first electronic component 211 in the XY plane direction, and covers the second main surface 201B side of the first electronic component 211.
  • the third resin portion 223 is provided so as to surround the second electronic component 212 in the XY plane direction, and covers the second main surface 201B side of the second electronic component 212.
  • the third resin part 223 is separated from the first resin part 221 in the XY plane direction.
  • the third resin portion 223 has higher rigidity than the second resin portion 222 and has substantially the same rigidity as the first resin portion 221.
  • the third resin part 223 is provided with the same material as the first resin part 221, but is a material different from the first resin part 221 as long as it is a hard resin capable of protecting the second electronic component 212 from external stress or the like. May be provided.
  • the second resin part 222 is adjacent to the first resin part 221 and adjacent to the third resin part 223 in the XY plane direction.
  • the second resin part 222 connects the first resin part 221 and the third resin part 223 in the YX plane direction.
  • the thickness of the second resin part 222 in the third direction Z is smaller than the thickness of the first resin part 221 in the third direction Z.
  • the other main surface 221B of the first resin portion 221 is provided to be discontinuous with the other main surface 222B of the second resin portion 222 in the XY plane direction.
  • the first resin portion 221 protrudes from the second resin portion 222 in the third direction Z on the second main surface 201B side.
  • the thickness of the second resin part 222 in the third direction Z is larger than the thickness of the third resin part 223 in the third direction Z. Accordingly, the second resin portion 222 covers the other main surface 223B of the third resin portion 223, and the other main surface 223B of the third resin portion 223 is not included in the second main surface 222B.
  • the resin portions 221 and 223 (hard resin) covering the electronic components 211 and 212 are disposed on the second main surface 201B side of the structure 201 opposite to the side where the electronic components 211 and 212 are located. It may be buried in 222 (soft resin) or may protrude from the resin portion 222 (soft resin).
  • the first main surface 201A of the structure 201 includes the first electronic component 211 (terminal electrode 211A), the second electronic component 212 (terminal electrode 212A), the first resin portion 221, the second resin portion 222, and the third. Each side of the resin part 223 is included.
  • FIG. 3 is a cross-sectional view schematically showing the structure of the electronic component built-in resin structure according to the third embodiment of the present invention.
  • the electronic component built-in resin structure 300 according to the third embodiment is different from the electronic component built-in resin structure 100 according to the first embodiment in that an adhesive layer 351 is provided.
  • the adhesive layer 351 is provided on the first main surface 301 ⁇ / b> A of the structure 301 so as to cover the wiring part 341.
  • the adhesive layer 351 is a member for attaching the electronic component built-in resin structure 300, and is configured by, for example, an adhesive film, a pressure sensitive adhesive, or the like.
  • the adhesive layer 351 is desirably provided by a material having biocompatibility.
  • the adhesive layer 351 desirably has high stretchability. The stretchability of the adhesive layer 351 is desirably higher than that of the first resin portion 321 and equivalent to that of the second resin portion 322.
  • FIG. 4 is a cross-sectional view schematically showing the structure of the electronic component built-in resin structure according to the fourth embodiment of the present invention.
  • the electronic component built-in resin structure 400 according to the fourth embodiment is different from the electronic component built-in resin structure 100 according to the first embodiment in that an adhesive layer 451 and a protective layer 452 are provided.
  • the adhesive layer 451 is provided on the second main surface 401B of the structure 401, and covers the main surface 421B of the first resin portion 421 and the main surface 422B of the second resin portion 422.
  • the adhesive layer 451 may have the same materials and physical properties as the adhesive layer 351 of the third embodiment.
  • the protective layer 452 is provided on the first main surface 401A of the structure 401 so as to cover the wiring portion 441.
  • the protective layer 452 is a member for protecting the wiring portion 441 from damage due to external stress, deterioration due to oxidation, and the like.
  • the wiring portion 441 desirably has a high gas barrier property against, for example, oxygen and water vapor, and a high durability against chemical substances such as acids, alkalis, and oils and fats. It is desirable that the protective layer 452 has high stretchability.
  • the stretchability of the protective layer 452 is preferably higher than that of the first resin portion 421 and equivalent to the second resin portion 422.
  • FIG. 5 is a cross-sectional view schematically showing the structure of the electronic component built-in resin structure according to the fifth embodiment of the present invention.
  • the electronic component built-in resin structure 500 according to the fifth embodiment is different from the electronic component built-in resin structure 100 according to the first embodiment in that it includes a plurality of structures 501, 502, and 503.
  • the structures 501, 502, and 503 have the same configuration as that of the structure 101 of the first embodiment. That is, the structure 501 includes a first resin part 521 that covers the first electronic component 511 and the second electronic component 512, and a second resin part 522 that is adjacent to the first resin part 521 in the XY plane direction.
  • the structural body 502 includes a fourth resin portion 524 that covers the third electronic component 513 and the fourth electronic component 514, and a fifth resin portion 525 that is adjacent to the fourth resin portion 524 in the XY plane direction.
  • the structure 503 includes a sixth resin part 526 that covers the fifth electronic component 515 and the sixth electronic component 516 and a seventh resin part 527 that is adjacent to the sixth resin part 526 in the XY plane direction.
  • the 1st resin part 521, the 4th resin part 524, and the 6th resin part 526 are comprised with the material similar to the 1st resin part 121 of 1st Embodiment, and have the same physical property.
  • the 2nd resin part 522, the 5th resin part 525, and the 7th resin part 527 are comprised with the material similar to the 2nd resin part 122 of 1st Embodiment, and have the same physical property.
  • a wiring portion 541 is provided on the first main surface 501A of the structure body 501, and a wiring portion 542 is provided on the third main surface 502A of the structure body 502.
  • the fifth main surface 503A of the structure body 503 is provided.
  • a wiring portion 543 is provided above.
  • the structure 501 further includes an interlayer connection terminal 571 provided so as to penetrate the first resin portion 521 in the third direction Z.
  • the structure 502 further includes an interlayer connection terminal 572 provided so as to penetrate the fourth resin portion 524 in the third direction Z.
  • an external electrode 589 for electrically connecting the electronic component built-in resin structure 500 to an external wiring or the like is provided on the fourth main surface 502B of the structure 502.
  • the interlayer connection terminal 571 is electrically connected to the wiring portion 541.
  • the interlayer connection terminal 572 is electrically connected to the wiring portion 542.
  • the structures 501, 502, and 503 are stacked so that their main surfaces face each other. Specifically, the first main surface 501A of the structure body 501 and the third main surface 502A of the structure body 502 are bonded to each other with the adhesive layer 561. A conductive portion 581 is provided in the adhesive layer 561 so as to penetrate in the third direction Z, and the conductive portion 581 electrically connects the wiring portion 541 and the wiring portion 542. In addition, the second main surface 501B of the structure 501 and the fifth main surface 503A of the structure 503 are bonded to each other with an adhesive layer 562.
  • a conductive part 582 is provided in the adhesive layer 562 so as to penetrate in the third direction Z, and the conductive part 582 electrically connects the interlayer connection terminal 571 and the wiring part 543. Therefore, the structure body 501 and the structure body 502 are electrically connected through the conductive portion 581, and the structure body 501 and the structure body 503 are electrically connected through the conductive portion 582.
  • the wiring portion 542 is electrically connected to the external electrode 589 through the interlayer connection terminal 572.
  • the conductive portion 581 includes the first resin portion 521 and the fourth resin portion 524 that are made of hard resin. It is desirable that at least one of the two faces in the third direction Z. Similarly, it is desirable that the conductive portion 582 is opposed to at least one of the first resin portion 521 and the sixth resin portion 526 made of hard resin in the third direction Z. Similarly, it is desirable that the external electrode 589 is opposed to the fourth resin portion 524 made of hard resin in the third direction Z.
  • the adhesive layer 561 and the adhesive layer 562 have high stretchability. Specifically, it is desirable that the stretchability is higher than that of the first resin portion 521, the fourth resin portion 524, and the sixth resin portion 526, and the second resin portion 522, the fifth resin portion 525, and the sixth resin portion. It is desirable to have stretchability equivalent to 526.
  • the adhesive layer 561 and the adhesive layer 562 are made of, for example, a UV curable adhesive or a thermosetting adhesive, but may be made of the same material as the adhesive layer 351 of the third embodiment.
  • FIG. 6A is a figure which shows the process of providing an electronic component on a support body in 6th Embodiment of this invention.
  • FIG. 6B is a diagram showing a step of providing a resin composition on a support in the sixth embodiment of the present invention.
  • FIG. 6C is a diagram showing a step of curing the resin composition in the sixth embodiment of the present invention.
  • FIG. 6D is a diagram showing a step of peeling the support from the first main surface in the sixth embodiment of the present invention.
  • FIG. 6E is a diagram showing a step of providing a wiring portion on the first main surface in the sixth embodiment of the present invention.
  • the support 690 is a heat-foaming pressure-sensitive adhesive sheet whose adhesive strength is reduced by applying heat.
  • the electronic components 611 and 612 are aligned and bonded to the support 690 so that the terminal electrodes 611A and 612A face the adhesive surface side of the support 690.
  • the support 690 is not particularly limited as long as the electronic components 611 and 612 can be temporarily fixed and peeled off.
  • the UV-type pressure-sensitive adhesive sheet whose adhesive strength is reduced by irradiating ultraviolet rays. It may be.
  • a paste-like first resin composition 631 and second resin composition 632 are provided.
  • the first resin composition 631 and the second resin composition 632 include a UV curable resin.
  • the first resin composition 631 is applied onto the support 690 so as to cover the electronic components 611 and 612 using the dispenser 691.
  • the second resin composition 632 is coated on the support 690 so as to be adjacent to the first resin composition 631 using the dispenser 691.
  • the first resin composition 631 and the second resin composition 632 are mixed with each other at the boundary BR.
  • the coating method of the 1st resin composition 631 and the 2nd resin composition 632 is not specifically limited, Screen printing, inkjet printing, gravure printing, flexographic printing, other transfer printing, etc. may be sufficient.
  • the first resin composition 631 and the second resin composition 632 are cured by irradiating ultraviolet rays 692.
  • the first resin portion 621 is provided from the first resin composition 631 and the second resin portion 622 is provided from the second resin composition 632.
  • the structure 601 is completed on the support 690.
  • the boundary BR since the first resin composition 631 and the second resin composition 632 are mixed, the first resin part 621 and the second resin part 622 form a gradation.
  • the ultraviolet rays 692 are irradiated under irradiation conditions that do not damage the support 690, the first resin portion 621, and the second resin portion 622.
  • irradiation conditions are set so that the temperature rise due to the irradiation of the ultraviolet rays 692 does not decrease the adhesive strength.
  • the support 690 is a UV-type pressure-sensitive adhesive sheet, Irradiation conditions are set so that the support 690 does not absorb the ultraviolet light 692 and reduce the adhesive force.
  • the 1st resin part 621 and the 2nd resin part 622 are not limited to UV curable resin, You may contain energy ray curable resins other than a thermosetting resin and an ultraviolet-ray.
  • the peeling temperature at which the adhesive strength of the support 690 decreases is the first resin composition. It is set higher than the curing temperature of the product 631 and the second resin composition 632 and lower than the glass transition temperature (Tg) of the first resin part 621 and the second resin part 622.
  • the first resin portion 621 and the second resin portion 622 are formed by applying both the first resin composition 631 and the second resin composition 632 and then curing them. These may be formed by sequentially curing. For example, the first resin composition 631 may be applied and cured, and then the second resin portion 622 may be applied and cured. According to this, it can suppress that the rigidity of the resin part which covers the electronic components 611 and 612 falls by the excessive mixing of the 1st resin composition 631 and the 2nd resin composition 632. Moreover, you may form the 1st resin part 621 and the 2nd resin part 622 from one type of resin composition.
  • a resin composition can be applied on the support 690, the resin composition can be thermally cured, and ultraviolet rays can be irradiated only around the electronic components 611 and 612 to impart a hardness difference. According to this, it is possible to save labor in the coating process.
  • the support 690 is peeled from the first main surface 601 ⁇ / b> A of the structure 601.
  • the support 690 is heated by hot air 693 to reduce the adhesive force, and then peeled off. Since the terminal electrodes 611A and 612A of the electronic components 611 and 612 are attached to the support 690, the first main surface 601A is exposed by peeling the support 690.
  • the first resin portion 621 and the second resin portion 622 are provided on the support body 690, the main surface 621 ⁇ / b> A of the first resin portion 621 and the second resin portion 622 are separated by peeling the support body 690.
  • Main surface 622A is included in first main surface 601A.
  • a wiring portion 641 is provided on the first main surface 601A of the structure 601.
  • the formation process of the wiring part 641 uses screen printing, and is applied by applying a conductive paste 640 to the mask 694 disposed above the first main surface 601A by using a squeegee 95 and passing through the opening of the mask 694.
  • the conductive paste 640 patterned on the first principal surface 601A is dried with hot air 693.
  • the wiring portion 641 provided by drying the conductive paste 640 has a shape corresponding to the opening of the mask 694.
  • the pattern formation of the electrically conductive paste 640 is not specifically limited, For example, inkjet printing, gravure printing, flexographic printing, other transfer printing, direct drawing with a dispenser, etc. may be sufficient.
  • FIG. 7A is a figure which shows the process of providing a wiring part on a support body in 7th Embodiment of this invention.
  • FIG. 7B is a diagram illustrating a process of providing an electronic component so as to be electrically connected to the wiring portion in the seventh embodiment of the present invention.
  • FIG. 7C is a diagram illustrating a process of providing the first resin portion and the second resin portion in the seventh embodiment of the present invention.
  • FIG. 7D is a diagram showing a step of peeling the support from the first main surface in the seventh embodiment of the present invention. Note that description of the same steps as those in the sixth embodiment is omitted.
  • a wiring portion 741 is formed on the support 790 with a pattern.
  • the support 790 is a metal plate having an easily peelable layer on the surface.
  • the easily peelable layer is weak in chemical / physical bond with the wiring portion 741 and facilitates peeling of the support 790 from the wiring portion 741.
  • a heat-foaming pressure-sensitive adhesive sheet or a UV-type pressure-sensitive adhesive sheet It is.
  • connection material 711 and 712 are mounted on the wiring portion 741.
  • the electronic components 711 and 712 are fixed by connecting materials 711B and 712B so that the terminal electrodes 711A and 712A are electrically connected to the wiring portion 741.
  • the connecting materials 711B and 712B are, for example, solder materials or brazing materials.
  • the connecting material 711B is provided in a bump shape between the terminal electrode 711A and the wiring portion 741.
  • the connecting material 712B is provided in a fillet shape on the side surface of the electronic component 712.
  • the connection material may be a terminal electrode or a fixture such as a pin or a nail as long as it can fix the electronic component.
  • a first resin portion 721 and a second resin portion 722 are provided.
  • the first resin portion 721 is provided on the wiring portion 741 so as to cover the electronic components 711 and 712, and the second resin portion 722 is adjacent to the first resin portion 721 so that the wiring portion 741 and Provided on a support 790.
  • a structure 701 including the wiring portion 741 is completed on the support 790.
  • the first resin portion 721 is also provided on the support 790 through the gap of the wiring portion 741.
  • the first main surface 701A of the completed structure 701 includes one surface of the wiring portion 741, one surface (not shown) of the first resin portion 721, and one surface of the second resin portion 722. That is, one surface of the wiring portion 741 is arranged on the same plane as one surface (not shown) of the first resin portion 721 and one surface of the second resin portion 722.
  • the electronic components 711 and 712 are separated from the first main surface 701A, and a wiring portion 741 is provided between the electronic components 711 and 712 and the first main surface 701A.
  • the first main surface 101A and the second main surface 101B that face each other have elasticity in a plane direction parallel to the first main surface 101A
  • An electronic component built-in resin structure 100 including an electronic component 111, which includes a first resin portion 121 that covers the first electronic component 111 and a second resin portion 122 that is adjacent to the first resin portion 121 in the surface direction.
  • the first resin part 121 has a higher rigidity than the second resin part 122
  • the second resin part 122 is provided with an electronic component built-in resin structure having a higher elasticity than the first resin part 121.
  • the first electronic component is protected by the highly rigid first resin portion, it is possible to reduce damage to the first electronic component.
  • the second resin portion having high stretchability is adjacent to the first resin portion in the surface direction, the stretchability in the surface direction of the electronic component built-in resin structure can be ensured. That is, both the flexibility and durability characteristics of the resin structure with built-in electronic components can be improved.
  • the electronic component built-in resin structure 200 further includes a second electronic component 212 aligned with the first electronic component 211 in the surface direction, and a third higher rigidity than the second resin portion 222 covering the second electronic component 212 in the surface direction.
  • the second resin part 222 may connect the first resin part 221 and the third resin part 223 in the surface direction. According to this, by connecting a plurality of hard resins covering a plurality of electronic components in the surface direction with a highly stretchable soft resin, the electronic component built-in resin structure is an integrated circuit including a plurality of electronic components. Also, sufficient stretchability in the surface direction can be ensured.
  • the electronic component built-in resin structure 200 may further include a wiring portion 241 provided on the first main surface 201A side and having elasticity, and the wiring portion 241 may be electrically connected to the first electronic component 211. According to this, the damage of the wiring part in the expansion / contraction / bending of the resin structure with a built-in electronic component can be suppressed, and the durability can be improved.
  • the first main surface 101 ⁇ / b> A may include one surface of each of the first electronic component 111, the first resin portion 121, and the second resin portion 122, and may be in contact with the wiring portion 141. Further, the first main surface 701A may include one surface of the wiring portion 741.
  • the electronic component built-in resin structure 300 may further include a first adhesive layer 351 on the first main surface 301A. According to this, the electronic component built-in resin structure can be bonded and used at the bonding location where the human body or the like is bent and stretched. Moreover, since the structure is directly bonded to the bonding location with the adhesive layer without providing a substrate extending over the entire surface of the first main surface, the resin structure with a built-in electronic component can be thinned. In addition, since the wiring part is located inside after bonding, the first resin part and the second resin part function as a protective film for the wiring part, and the wiring part due to external stress from the second main surface side Damage can be suppressed.
  • the electronic component built-in resin structure 400 may further include a second adhesive layer 451 provided on the second main surface 401B. According to this, the electronic component built-in resin structure can be bonded and used at the bonding location where the human body or the like is bent and stretched. Moreover, since the structure is directly bonded to the bonding position with the adhesive layer without providing a substrate extending over the entire surface of the second main surface, the resin structure with a built-in electronic component can be thinned.
  • the electronic component built-in resin structure 400 may further include a protective layer 452 having elasticity on the first main surface 401A. According to this, it is possible to suppress damage to the wiring portion without hindering the flexibility of the electronic component built-in resin structure.
  • the electronic component built-in resin structure 500 includes a first electronic component 511, a first resin portion 521, and a second resin portion 522, and includes a first structure 501 having a first main surface 501A and a second main surface 502A, It has a third main surface 502A and a fourth main surface 502B that face each other, has elasticity in a plane direction parallel to the third main surface 502A, incorporates a third electronic component 513, and the main surfaces face each other.
  • the second structure 502 is laminated on the first structure 501 as described above.
  • the second structure 502 includes a fourth resin portion 524 that covers the third electronic component 513 and a fourth resin portion 524 in the surface direction.
  • a fourth resin portion 525, the fourth resin portion 524 has higher rigidity than the fifth resin portion 525, and the fifth resin portion 525 has higher elasticity than the fourth resin portion 524,
  • the first structure 501 and the second structure 502 are electrically connected to each other. It may be connected to.
  • the resin structure with a built-in electronic component can realize a more advanced function by accumulating a plurality of electronic components in the interlayer direction intersecting the surface direction while maintaining the stretchability in the surface direction. it can.
  • the laminated structure is not provided with a substrate extending over the entire main surface.
  • a substrate over the entire main surface is not provided between the stacked structures, and the stacked bodies are directly bonded to each other through an adhesive layer. Thereby, even if it laminates
  • the electronic component 611 includes a first main surface 601A and a second main surface 601B facing each other, and has elasticity in a plane direction parallel to the first main surface 601A.
  • 612 is a method of manufacturing a resin structure 600 with a built-in electronic component, the step of placing the electronic components 611 and 612 on the support 690, and the electronic components 611 and 612 covered on the support 690. The step of providing the first resin portion 621 and providing the second resin portion 622 adjacent to the first resin portion 621 in the surface direction, and the electronic components 611, 612, the first resin portion 621, and the second resin portion 622, respectively.
  • the electronic component is protected by the highly rigid first resin portion, it is possible to reduce damage to the electronic component.
  • the second resin portion having high stretchability is adjacent to the first resin portion in the surface direction, the stretchability in the surface direction of the electronic component built-in resin structure can be ensured. That is, both the flexibility and durability characteristics of the resin structure with built-in electronic components can be improved.
  • the electronic component 711 has a first main surface 701A and a second main surface 701B facing each other, and has elasticity in a plane direction parallel to the first main surface 701A.
  • 712 is a method of manufacturing a resin structure 700 with a built-in electronic component, the step of providing a wiring portion 741 on a support 790, and mounting the electronic components 711 and 712 so as to be electrically connected to the wiring portion 741.
  • the first resin portion 721 has higher rigidity than the second resin portion 722, and the second resin portion 722 includes the first main surface 701A including one surface. More elastic than resin part 721 Is high, a manufacturing method of an electronic component built resin structure, is provided.
  • the electronic component is protected by the highly rigid first resin portion, it is possible to reduce damage to the electronic component.
  • the second resin portion having high stretchability is adjacent to the first resin portion in the surface direction, the stretchability in the surface direction of the electronic component built-in resin structure can be ensured. That is, both the flexibility and durability characteristics of the resin structure with built-in electronic components can be improved.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

La présente invention concerne une structure de résine (100) comportant un composant électronique intégré, qui contient en son sein un premier composant électronique (111), tout en ayant une première surface principale (101A) et une seconde surface principale (101B) qui se font face, et qui est extensible dans une direction du plan qui est parallèle à la première surface principale (101A). Cette structure de résine (100) comprend une première partie de résine (121) qui recouvre le premier composant électronique (111) et une seconde partie de résine (122) qui est adjacente à la première partie de résine (121) dans la direction du plan. La première partie de résine (121) présente une rigidité supérieure à celle de la seconde partie de résine (122), tandis que la seconde partie de résine (122) présente une extensibilité supérieure à celle de la première partie de résine (121).
PCT/JP2018/009409 2017-03-13 2018-03-12 Structure de résine à composant électronique intégré et son procédé de production WO2018168734A1 (fr)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210043604A1 (en) * 2019-08-06 2021-02-11 Advanced Semiconductor Engineering, Inc. Semiconductor package structure and method of manufacturing the same
CN112470554A (zh) * 2018-10-22 2021-03-09 东洋纺株式会社 器件连接体的制造方法及器件连接体
WO2025105149A1 (fr) * 2023-11-13 2025-05-22 株式会社村田製作所 Dispositif étirable
WO2025173538A1 (fr) * 2024-02-13 2025-08-21 株式会社村田製作所 Dispositif élastique

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JPS61156792A (ja) * 1984-12-28 1986-07-16 株式会社東芝 回路モジユ−ルの製造方法
JP2004273853A (ja) * 2003-03-10 2004-09-30 Matsushita Electric Ind Co Ltd 樹脂層付チップ部品とそれを用いた部品内蔵モジュール及びそれらの製造方法
US20080257589A1 (en) * 2006-11-21 2008-10-23 Andreas Ostmann Method for the production of expandable circuit carrier and expandable circuit carrier
JP2014021894A (ja) * 2012-07-23 2014-02-03 Fujitsu Ltd Ｒｆｉｄタグ

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Publication number Priority date Publication date Assignee Title
JPS61156792A (ja) * 1984-12-28 1986-07-16 株式会社東芝 回路モジユ−ルの製造方法
JP2004273853A (ja) * 2003-03-10 2004-09-30 Matsushita Electric Ind Co Ltd 樹脂層付チップ部品とそれを用いた部品内蔵モジュール及びそれらの製造方法
US20080257589A1 (en) * 2006-11-21 2008-10-23 Andreas Ostmann Method for the production of expandable circuit carrier and expandable circuit carrier
JP2014021894A (ja) * 2012-07-23 2014-02-03 Fujitsu Ltd Ｒｆｉｄタグ

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112470554A (zh) * 2018-10-22 2021-03-09 东洋纺株式会社 器件连接体的制造方法及器件连接体
CN112470554B (zh) * 2018-10-22 2024-03-22 东洋纺株式会社 器件连接体的制造方法及器件连接体
US20210043604A1 (en) * 2019-08-06 2021-02-11 Advanced Semiconductor Engineering, Inc. Semiconductor package structure and method of manufacturing the same
US11139268B2 (en) * 2019-08-06 2021-10-05 Advanced Semiconductor Engineering, Inc. Semiconductor package structure and method of manufacturing the same
WO2025105149A1 (fr) * 2023-11-13 2025-05-22 株式会社村田製作所 Dispositif étirable
WO2025173538A1 (fr) * 2024-02-13 2025-08-21 株式会社村田製作所 Dispositif élastique

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