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WO2018180734A1 - Dispositif de fixation de substrat et procédé de fabrication de dispositif à semi-conducteur à l'aide de celui-ci - Google Patents

Dispositif de fixation de substrat et procédé de fabrication de dispositif à semi-conducteur à l'aide de celui-ci Download PDF

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Publication number
WO2018180734A1
WO2018180734A1 PCT/JP2018/010916 JP2018010916W WO2018180734A1 WO 2018180734 A1 WO2018180734 A1 WO 2018180734A1 JP 2018010916 W JP2018010916 W JP 2018010916W WO 2018180734 A1 WO2018180734 A1 WO 2018180734A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
semiconductor device
sealing material
printing
support plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2018/010916
Other languages
English (en)
Japanese (ja)
Inventor
知範 河村
寺田　勝美
英三 大木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Engineering Co Ltd
Original Assignee
Toray Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Engineering Co Ltd filed Critical Toray Engineering Co Ltd
Priority to KR1020197027790A priority Critical patent/KR20190133004A/ko
Priority to CN201880021114.0A priority patent/CN110476234A/zh
Publication of WO2018180734A1 publication Critical patent/WO2018180734A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/08—Machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/16—Printing tables
    • B41F15/18—Supports for workpieces
    • B41F15/26—Supports for workpieces for articles with flat surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Definitions

  • the present invention relates to a substrate fixing jig used when stencil printing a region where a semiconductor chip is arranged in a substrate on which a plurality of semiconductor chips are arranged, and a method of manufacturing a semiconductor device using the same.
  • FIGS. 5 and 6 show an example in which a seal R is printed around each semiconductor chip C arranged on the substrate W.
  • the forward squeegee 4 and the backward squeegee 5 are used in the hole 6H of the stencil 6. Then, the printing material R is filled.
  • FIG. 5A shows a state before the start of printing after supplying the sealing material R onto the stencil 6, and FIGS. 5B to 5D show the state of primary printing. Performed under P1 vacuum.
  • the forward squeegee 4 moves the sealing material R supplied onto the stencil 6 to the hole side (FIG. 5B), and pushes the sealing material R into the hole 6H (FIG. 5C )), And the sealing material R is filled in all the holes 6H (FIG. 5D).
  • a void V may occur in the printing material R in the hole 6H.
  • the primary printing is performed under a vacuum of the pressure P1, by setting the surroundings to a pressure P higher than the pressure P1, the void is reduced by an amount corresponding to the ratio of P1 and P, and the flow is caused by the flow.
  • a void may be emitted from the sealing material R.
  • the pressure P2 at the time of performing the secondary printing needs to be 10 times or more higher than P1, but is performed under a reduced pressure of less than atmospheric pressure.
  • the secondary printing is performed using the return pass squeegee 5 (FIG. 6F), and after the secondary printing (FIG. 6G), the semiconductor chip C has few voids and the surface flatness. It is covered with an excellent sealing material R.
  • the substrate W is separated from the hole plate 6 (normally, the table 8 supporting the substrate W is lowered) (FIG. 6 (h)), and the sealing material R printed on the substrate W is cured. Thus, resin sealing of the semiconductor chip C is completed.
  • the wafer level package (hereinafter referred to as WLP) technology has been mounted on a wafer substrate at high density.
  • WLP wafer level package
  • FIG. 7 As shown in FIG. 7 (FIG. 7 (a) is a top view and FIG. 7 (b) is a cross-sectional view taken along line AA), many semiconductor chips on the wafer substrate are collectively mounted on a substrate W made of a wafer.
  • the semiconductor chip C is collectively sealed with a sealing material R as shown in FIG. 8 (FIG. 8A is a top view and FIG. 8B is an AA cross-sectional view).
  • the substrate W that has been collectively sealed is cut (diced) in a lattice shape so as to avoid the mounting position of the semiconductor chip C as shown in FIG.
  • the semiconductor chip (FIG. 9B) is singulated into a semiconductor device CD as shown in FIG. 9C.
  • bump electrodes may be formed on the semiconductor device CD.
  • FIG. 10 shows a state in which the sealing material R is printed by differential pressure filling by stencil printing on a substrate W on which a large number of semiconductor chips C are mounted (consisting of a wafer). 10 (a)), printing is completed (FIG. 10 (b)), and the table 8 supporting the substrate W is lowered (FIG. 10 (c)), but sealing is performed at the peripheral edge of the hole 6H of the stencil 6 Due to the stickiness of the material, it is difficult to separate the stencil, and the substrate W may be curved as shown in FIG. Such bending can be suppressed by holding the substrate W by suction by the table 8, but since the differential pressure filling is performed in a vacuum atmosphere, it is difficult to hold the substrate W by vacuum suction, and the plate is separated. It was difficult to suppress at the time.
  • the uncured sealing material R has a viscosity. Therefore, the thickness of the sealing material R varies depending on the position of the substrate W. That is, when the substrate W is curved, the semiconductor device CD obtained by curing and dicing the sealing material R also causes quality variations due to sealing thickness variations.
  • the present invention has been made in view of the above problems, and when a semiconductor device is obtained by performing stencil printing on a region where a semiconductor chip is arranged at once on a substrate on which a plurality of semiconductor chips are arranged and performing sealing. Furthermore, the present invention provides a substrate fixing jig that reduces voids and suppresses variation in quality, and a method of manufacturing a semiconductor device using the same.
  • a substrate fixing jig for fixing a substrate on which a plurality of semiconductor chips are arranged The substrate is supported from a surface on which the semiconductor chip is not disposed, a support plate disposed on a table of a stencil printing apparatus when performing stencil printing on the substrate, and detachable from the support plate,
  • a presser having a function of pressing the substrate against the support plate The presser is a substrate fixing jig that also functions as a stencil when stencil printing a sealing material on the substrate.
  • the invention according to claim 2 is a printing step in which stencil printing of a sealing material is collectively performed on a region of the substrate on which the semiconductor chip is mounted using the substrate fixing jig according to claim 1, and the printing step.
  • a method of manufacturing a semiconductor device comprising: a curing step of heating the subsequent substrate to cure the sealing material; and a dicing step of dividing the substrate after the sealing material is cured.
  • Invention of Claim 3 is a manufacturing method of the semiconductor device of Claim 2, Comprising: A method of manufacturing a semiconductor device, wherein the printing step is performed in a vacuum atmosphere.
  • Invention of Claim 4 is a manufacturing method of the semiconductor device of Claim 2 or Claim 3, Comprising: A method of manufacturing a semiconductor device, wherein ceramics are used as a squeegee material used for the stencil printing.
  • Invention of Claim 5 is a manufacturing method of the semiconductor device in any one of Claims 2-4, Comprising: Up to the curing step, the substrate is fixed to the substrate fixing jig.
  • the present invention when a semiconductor device is obtained by performing stencil printing of a region where a semiconductor chip is arranged at once on a substrate on which a plurality of semiconductor chips are arranged, and performing sealing, the voids are reduced and quality variation is also reduced. It becomes possible to suppress.
  • FIG. 4 is a diagram showing a state after completion of the return pass printing in the same differential pressure filling
  • FIG. 3B is a cross-sectional view of the wafer substrate.
  • FIG. 3 is a diagram showing a semiconductor device cut along the cutting line and separated into pieces.
  • A It is a figure which shows the state before printing at the time of performing batch sealing of the wafer substrate in which many semiconductor chips are mounted using stencil printing.
  • B It is a figure which shows the state immediately after implementation of the stencil printing.
  • C It is a figure which shows the state which has lowered
  • FIG. 1 shows an embodiment of a substrate fixing jig 1 according to the present invention.
  • FIG. 1 (a) is a top view and FIG. It is.
  • the substrate fixing jig 1 fixes the substrate W on which the semiconductor chip C is mounted.
  • the substrate W on which the semiconductor chip C is mounted may be a wiring substrate made of an insulating material such as an epoxy resin, but in this embodiment, a semiconductor wafer used for WLP is illustrated. In the so-called fan-out WLP, the carrier to which the adhesive film is attached becomes the substrate W. Further, as the sealing material R, an epoxy resin or silicon resin that has an uncured viscosity of 10 to 2000 Pa ⁇ S is used.
  • the substrate fixing jig 1 is for fixing the substrate W (FIG. 2) disposed on the support plate 10 by pressing it with the presser 11.
  • the parallelism between the support plate 10 and the presser 11 is as follows. In order to ensure this, it is desirable to use a spacer 12 having the same thickness as the substrate W. However, when the substrate W is extremely thin, the spacer 12 may not be provided.
  • the spacer 12 may have a form independent of the support plate 10 and the presser 11, but may be formed on either the support plate 10 or the presser 11.
  • the support plate 10 has a flat surface that supports the entire surface of the substrate W. If the thickness of the support plate 10 is too thin, there is a concern that the support plate 10 may be bent with the substrate W, which is not preferable. On the other hand, if it is too thick, the heat capacity becomes large, and in the curing step described later, it takes time to cure the sealing material, and it also takes time to cool from the high temperature state, which is not preferable from the viewpoint of production efficiency. Specifically, the thickness of the support plate 10 is preferably in the range of 2 mm to 10 mm. Further, if the thermal expansion coefficient of the support plate 10 is different from that of the presser 11, the substrate fixing jig 1 may be deformed in the thermosetting process.
  • the support plate 10 and the presser 11 are made of the same material.
  • the specific material is preferably stainless steel or aluminum in consideration of ease of flat processing, lightness, rigidity, and the like.
  • the presser 11 includes a substrate W arranged on the surface of the support plate 10 (FIG. 2A is a top view, and FIG. 2B is a cross-sectional view taken along line AA in FIG. 2A). ) Is pressed against the support plate 10, but the region where the semiconductor chip C is mounted is an opening 11H. For this reason, the presser 11 holds the vicinity of the peripheral edge of the substrate W.
  • the presser 11 is configured to have the opening 11H in the region where the semiconductor chip is mounted while pressing the vicinity of the peripheral edge of the substrate W. Therefore, the stencil when sealing the semiconductor chip C on the substrate W is used. It can also be used as a stencil for printing. That is, the presser 11 in FIG. 1 can function as the stencil 6 in FIG. 10, and the thickness of the presser 11 when used as a stencil needs to be the printing thickness of the sealing material.
  • stainless steel, aluminum, or the like is suitable for the material of the presser 11 as in the case of the support plate 10. However, if a material having magnetism such as SUS410 or SUS430 is used, it is suppressed to the support plate 10 using magnetic force. It is also possible to fix the tool 11.
  • FIG. 3A shows a state before the substrate W on which the semiconductor chip C is mounted is set in the stencil printing apparatus and stencil printing is started.
  • the substrate fixing jig 1 has the lower surface of the support plate 10 disposed on the table 8 of the stencil printing apparatus, and the sealing material R is supplied onto the presser 11 by the printing material supply means 3. Has been.
  • the presser 11 serves as a stencil, and the sealing material R is printed by the forward squeegee 4 and the backward squeegee 5 so as to fill the opening 11H.
  • the upper surface height of the presser 11 is pushed while pushing a large amount of the sealing material R into the opening 11H.
  • the upper surface of the sealing material R and the upper surface of the presser 11 are aligned by performing an operation of scraping off the sealing material R exceeding.
  • a material having high rigidity is suitable as the material of the outward squeegee 4 and the returning squeegee, and if the rigidity is high, resin is used.
  • a ceramic such as alumina may be more preferable.
  • each part constituting the stencil printing apparatus shown in FIG. 3A is accommodated in a vacuum chamber so that stencil printing can be performed in a vacuum (under reduced pressure). For this reason, since it is difficult for the table 8 to vacuum-suck the substrate fixing jig 1, the substrate fixing jig 1 is fixed to the table 8 using the holder 80.
  • FIG. 3B shows a state after the return pass printing is performed, and the sealing material R is printed with the thickness of the presser 11 in the opening 11H.
  • the forward printing and the backward printing are performed under a vacuum, and a pressure difference is given between the forward path and the backward path (vacuum differential pressure filling), so the void in the sealing material R printed in the opening 11H is miniaturized. ing.
  • vacuum differential pressure filling it is assumed that vacuum differential pressure filling is performed.
  • only one printing may be performed in a vacuum atmosphere. That is, the return squeegee 5 may be unnecessary.
  • the substrate fixing jig 1 can be removed from the table 8 by releasing the holder 80. That is, the lower surface of the support plate 10 can be separated from the table 8 with the substrate fixing jig 1 fixing the substrate W. At this time, since the support plate 10 has rigidity and is difficult to bend, the substrate W can be taken out from the stencil printing apparatus without being bent.
  • the stencil plate 6 in which a large number of fine holes 6H exist as used when individually sealing the semiconductor chips C it is used when sealing a large number of semiconductor chips at once.
  • the stencil does not require complicated processing and can be manufactured in large quantities at low cost. That is, the presser 11 can be manufactured in large quantities at a low cost.
  • the substrate W on which the sealing material is printed in the region where the semiconductor chip C is mounted can be handled in a state of being sandwiched between the support plate 10 and the presser 11. That is, in the curing step for curing the sealing material R, the substrate W on which the sealing material is printed in the region where the semiconductor chip C is mounted is used with the support plate 10 and the presser 11 as shown in FIG. It can be performed in a state of being sandwiched. In the curing step, the substrate W for thermally curing the sealing material R is heated, but the substrate W is fixed by the substrate fixing jig 1 as shown in FIG.
  • the substrate fixing jig 1 itself is hardly deformed, and the curvature of the substrate W accompanying the heat deformation of the sealing material R can be suppressed.
  • the curving of the substrate W can be suppressed and the curing can be completed in a state where the change in the thickness of the sealing material R is suppressed.
  • the substrate W is removed from the substrate fixing jig 1. That is, the holding of the substrate W by the presser 11 and the support plate 10 is released (FIGS. 4B and 4C).
  • the substrate W after the sealing material R is cured is divided into individual pieces for each semiconductor chip C (dicing step), and the semiconductor device CD is obtained.
  • a step of forming bump electrodes on the substrate W (the side on which the semiconductor chip C is not mounted) may be provided before dicing into the semiconductor device CD.
  • the sealing material R printed on the substrate W has a small void and a uniform thickness, and the substrate W is not curved in the process and handling after printing. This reduces the variation in sealing thickness. That is, according to the present invention, it is possible to provide a semiconductor device with less quality variation.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Screen Printers (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

L'invention concerne un dispositif de fixation de substrat et un procédé de fabrication d'un dispositif à semi-conducteur à l'aide de celui-ci, avec lequel toute variance de la qualité est réduite tandis que des vides sont également réduits, quand un dispositif à semi-conducteur est obtenu par scellement de régions qui sont sur un substrat sur lequel une pluralité de puces à semi-conducteur sont disposées et qui sont là où les puces à semi-conducteur sont disposées, l'étanchéité étant réalisée par une opération d'impression par stencil par lots. Plus spécifiquement, l'invention concerne un dispositif de fixation de substrat comprenant : une plaque de support qui supporte un substrat à partir d'une surface où des puces à semi-conducteur ne sont pas disposées, et qui est disposée sur une table d'un dispositif d'impression par stencil quand une opération d'impression par stencil est effectuée sur le substrat ; et un outil de compression qui peut être attaché sur la plaque de support/détaché de celle-ci, et qui a pour fonction de comprimer le substrat contre la plaque de support, l'outil de compression ayant aussi pour fonction de tenir lieu de stencil pour l'opération d'impression par stencil d'un matériau d'étanchéité sur le substrat. L'invention concerne également un procédé de fabrication d'un dispositif à semi-conducteur à l'aide du dispositif de fixation de substrat.
PCT/JP2018/010916 2017-03-29 2018-03-20 Dispositif de fixation de substrat et procédé de fabrication de dispositif à semi-conducteur à l'aide de celui-ci Ceased WO2018180734A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020197027790A KR20190133004A (ko) 2017-03-29 2018-03-20 기판 고정 지그 및 이것을 사용한 반도체 장치의 제조 방법
CN201880021114.0A CN110476234A (zh) 2017-03-29 2018-03-20 基板固定治具和使用基板固定治具的半导体装置的制造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-064693 2017-03-29
JP2017064693A JP2018170316A (ja) 2017-03-29 2017-03-29 基板固定治具およびこれを用いた半導体装置の製造方法

Publications (1)

Publication Number Publication Date
WO2018180734A1 true WO2018180734A1 (fr) 2018-10-04

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PCT/JP2018/010916 Ceased WO2018180734A1 (fr) 2017-03-29 2018-03-20 Dispositif de fixation de substrat et procédé de fabrication de dispositif à semi-conducteur à l'aide de celui-ci

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JP (1) JP2018170316A (fr)
KR (1) KR20190133004A (fr)
CN (1) CN110476234A (fr)
WO (1) WO2018180734A1 (fr)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI861179B (zh) 2019-08-23 2024-11-11 日商長瀨化成股份有限公司 密封結構體之製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06316055A (ja) * 1993-05-07 1994-11-15 Matsushita Electric Ind Co Ltd スキージ装置
JP2005019503A (ja) * 2003-06-24 2005-01-20 Matsushita Electric Ind Co Ltd 回路基板の封止装置及びその封止方法
JP2006007480A (ja) * 2004-06-23 2006-01-12 Mitsumi Electric Co Ltd 合成樹脂印刷装置
JP2010016239A (ja) * 2008-07-04 2010-01-21 Nec Electronics Corp 半導体装置の製造方法
JP2011212863A (ja) * 2010-03-31 2011-10-27 Kyocera Corp 印刷用摺動部材および印刷装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3145959B2 (ja) 1997-07-18 2001-03-12 東レエンジニアリング株式会社 電子部品の樹脂封止方法
TW591770B (en) * 2003-03-14 2004-06-11 Ind Tech Res Inst Packaging method for semiconductor device
JP2005051150A (ja) * 2003-07-31 2005-02-24 Seiko Epson Corp 半導体装置及びその製造方法、回路基板並びに電子機器

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06316055A (ja) * 1993-05-07 1994-11-15 Matsushita Electric Ind Co Ltd スキージ装置
JP2005019503A (ja) * 2003-06-24 2005-01-20 Matsushita Electric Ind Co Ltd 回路基板の封止装置及びその封止方法
JP2006007480A (ja) * 2004-06-23 2006-01-12 Mitsumi Electric Co Ltd 合成樹脂印刷装置
JP2010016239A (ja) * 2008-07-04 2010-01-21 Nec Electronics Corp 半導体装置の製造方法
JP2011212863A (ja) * 2010-03-31 2011-10-27 Kyocera Corp 印刷用摺動部材および印刷装置

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CN110476234A (zh) 2019-11-19
KR20190133004A (ko) 2019-11-29
JP2018170316A (ja) 2018-11-01

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