WO2018184597A1 - Camera module based on infrared absorption structure, and application thereof - Google Patents
Camera module based on infrared absorption structure, and application thereof Download PDFInfo
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- WO2018184597A1 WO2018184597A1 PCT/CN2018/082208 CN2018082208W WO2018184597A1 WO 2018184597 A1 WO2018184597 A1 WO 2018184597A1 CN 2018082208 W CN2018082208 W CN 2018082208W WO 2018184597 A1 WO2018184597 A1 WO 2018184597A1
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Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/22—Absorbing filters
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/02—Bodies
- G03B17/12—Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets
Definitions
- the invention relates to the field of a camera module, in particular to an infrared absorption structure and an imaging module based on an infrared absorption structure and an application thereof, wherein a material having a near infrared absorption characteristic is disposed on a lens, a filter or a photosensitive chip, The camera module is brought to an image color reproduction effect.
- CCD and CMOS are widely used in digital photography, but because CCD and CMOS can sense the characteristics of infrared rays, the image obtained when the infrared cut filter is not used will be greenish, which is very inconsistent with the human eye. Therefore, most of the camera modules pass through the infrared cut filter to achieve image color reproduction, so that the obtained image is consistent with the color observed by the human eye.
- FIG. 1 it is a schematic diagram of a conventional camera module.
- the camera module includes a circuit board assembly 1P, a light sensing chip 2P, a bracket 3P, an infrared cut filter 4P, a motor 5P and a lens 6P.
- the photosensitive chip 2P is mounted to the circuit board assembly 1P
- the infrared cut filter 4P is mounted to the bracket 3P
- the lens 6P is mounted to the motor 5P
- the motor 5P is mounted to the bracket 3P to facilitate the
- the lens 6P is located above the photosensitive chip 2P.
- the sensor chip 2P of the camera module mostly uses a charge coupled device (CCD) and a complementary metal oxide semiconductor (CMOS, Complementary Metal Oxide Semiconductor) sensor.
- CCD charge coupled device
- CMOS complementary metal oxide semiconductor
- the infrared cut filter of the conventional camera module is coated on ordinary glass to achieve the infrared cutoff effect, with the camera.
- the development of the module further replaces the traditional infrared cut filter by coating the blue glass. Since the blue glass substrate itself has near-infrared light absorption characteristics, the absorption effect on the red light is close to the human eye's perception of red light through the reception of the chip.
- the requirements for the thickness of blue glass are getting thinner and thinner, but because of the difficulty in processing and high cost, the size cannot be reduced to less than 0.14 mm, and there is fragile characteristics. There are limitations in everything.
- the infrared cut filter or the blue glass of the conventional camera module limits the development of the camera module to a certain extent to a certain extent. Therefore, the present invention is applied to a camera module through a novel infrared absorbing structure to solve the problem that the blue glass is fragile and cannot be thinned, thereby breaking the limitation of the camera module in the development of thin and light.
- An object of the present invention is to provide a camera module based on an infrared absorption lens structure, wherein a material having a near-infrared absorption characteristic is applied to a lens, and the lens is changed into an infrared absorption lens structure, thereby removing the conventional filter. Or make the filter thinner.
- Another object of the present invention is to provide a camera module based on an infrared absorption lens structure, wherein the lens of the lens is made of an organic material having near-infrared spectroscopy absorption characteristics, and the lens is changed into an infrared absorption lens structure. Thereby removing the conventional filter or making the filter thinner.
- Another object of the present invention is to provide a camera module based on an infrared absorption lens structure, which adopts the infrared absorption lens of the invention, and the imaging module has better imaging effect than the camera module with the traditional infrared filter, and has blue glass.
- the imaging module of the filter has the same imaging effect, so that it can meet the high-pixel image requirements of the camera module of the current electronic device, and at the same time save the production cost and structural thickness of the camera module of the electronic device.
- Another object of the present invention is to provide a camera module based on an infrared absorption lens structure, in which the structure and assembly manner of the camera module are not changed. Therefore, the present invention further achieves the filtering effect and the structure of the thin and light camera module without changing the lens structure.
- Another object of the present invention is to provide a camera module based on an infrared absorption lens structure, wherein the blue glass filter can be eliminated when applied to a high pixel camera module. Therefore, the absorption lens structure is equivalent to moving the optical system of the near-infrared absorbing structure forward, and the thickness of the filter can be reduced to ⁇ 1 mm.
- An object of the present invention is to provide an imaging module based on an infrared absorption structure, wherein an organic material or compound having near-infrared absorption characteristics is applied to a filter or a photosensitive chip, so that the camera module achieves image color reproduction.
- the effect is to meet the requirements of the ultra-thinning trend of the camera module to a certain extent, especially for the camera module of the mobile phone.
- Another object of the present invention is to provide an imaging module based on an infrared absorption structure, wherein an organic material or compound having near-infrared absorption characteristics makes an imaging effect superior to that of a conventional infrared filter, and is equivalent to blue glass imaging. Therefore, it can meet the high-pixel image requirements of the camera module of the current mobile phone, and at the same time save the production cost of the camera module of the mobile phone, effectively occupying the market advantage.
- Another object of the present invention is to provide a camera module based on an infrared absorbing structure, wherein an organic material having a near-infrared spectroscopy absorption property is suitable for a day/night camera module, and the imaging effect during daytime is comparable to that of blue glass. It is superior to the traditional day and night camera module imaging effect.
- the present invention is based on an infrared absorption lens structure camera module, comprising: at least one circuit board, at least one lens, at least one photosensitive chip, wherein the photosensitive chip is electrically connected to the circuit board,
- the lens is located in a photosensitive path of the photosensitive chip, wherein the lens comprises at least one lens and at least one lens barrel, wherein one or more of the at least one lens is an infrared absorption lens and is disposed on the lens barrel,
- the lens is formed into an infrared absorption lens to achieve near-infrared absorption.
- the present invention also provides a lens, wherein the lens comprises at least one lens, wherein one or more of the at least one lens is an infrared absorbing lens to form the lens into an infrared absorbing lens to achieve near infrared spectroscopy Absorption effect.
- the present invention further provides a camera module, including:
- At least one circuit board assembly, at least one lens, and at least one photosensitive chip wherein the photosensitive chip is electrically connected to the circuit board assembly, the lens is located in a photosensitive path of the photosensitive chip, wherein the photosensitive chip includes at least one a chip body and at least one absorption filter layer, wherein the absorption filter layer is located on a photosensitive surface of the chip body, thereby providing the camera module to filter.
- the present invention further provides a camera module comprising: at least one circuit board assembly, at least one lens, at least one photosensitive chip, and at least one filter, wherein the photosensitive chip is electrically connected to the On the circuit board assembly, the lens is located in a photosensitive path of the photosensitive chip, and the filter is disposed on a light path of the lens or a photosensitive path of the photosensitive chip, wherein the filter includes a filter a sheet body and at least one absorbing filter layer, wherein the absorbing filter layer is located on at least one surface of the filter body, and is disposed on the camera module through the filter for filtering.
- Another aspect of the present invention provides a method for manufacturing an infrared absorption structure of a camera module, which includes the following steps:
- Another aspect of the present invention provides a method for manufacturing an infrared absorption structure of another camera module, which includes the following steps:
- FIG. 1 is a cross-sectional view of a conventional camera module.
- FIG. 2A is a cross-sectional view showing the structure of a camera module based on an infrared absorption lens structure according to a first preferred embodiment of the present invention, in which a zoom camera module is illustrated.
- FIG. 2B is a cross-sectional view showing the structure of a camera module based on an infrared absorption lens structure according to a first preferred embodiment of the present invention, in which a fixed focus camera module is illustrated.
- FIG 3 is a cross-sectional view showing the structure of a camera module based on an infrared absorption lens structure according to a first preferred embodiment of the present invention.
- FIG. 4 is a schematic view of a single lens of a camera module based on an infrared absorption lens structure in accordance with a first preferred embodiment of the present invention, wherein an infrared absorbing layer is applied to an outer surface of the lens.
- Figure 5 is a schematic illustration of a wafer level processing lens in accordance with a first preferred embodiment of the present invention, wherein the infrared absorbing layer is illustrated as a liquid material and is spin coated onto the lens by centrifugal force.
- Figure 6 is a cross-sectional view showing the structure of a camera module according to a first modified embodiment of the first preferred embodiment of the present invention.
- Figure 7 is a cross-sectional view showing the structure of a camera module according to a first modified embodiment of the first preferred embodiment of the present invention.
- Figure 8 is a cross-sectional view showing the structure of a camera module according to a first modified embodiment of the first preferred embodiment of the present invention.
- Figure 9 is a cross-sectional view showing the structure of a camera module according to a second modified embodiment of the first preferred embodiment of the present invention.
- Figure 10 is a cross-sectional view showing the structure of a camera module according to a second modified embodiment of the first preferred embodiment of the present invention.
- Figure 11 is a cross-sectional view showing the structure of a camera module according to a third modified embodiment of the first preferred embodiment of the present invention.
- Figure 12 is a cross-sectional view showing the structure of a camera module according to a third modified embodiment of the first preferred embodiment of the present invention.
- Figure 13 is a cross-sectional view showing the structure of a camera module according to a third modified embodiment of the first preferred embodiment of the present invention.
- Figure 14 is a cross-sectional view showing the structure of a camera module according to a third modified embodiment of the first preferred embodiment of the present invention.
- Figure 15 is a cross-sectional view showing the structure of a camera module according to a third modified embodiment of the first preferred embodiment of the present invention.
- Figure 16 is a cross-sectional view showing the structure of a camera module according to a fourth modified embodiment of the first preferred embodiment of the present invention.
- Figure 17 is a cross-sectional view showing the structure of a camera module based on an infrared absorption lens structure in accordance with a second preferred embodiment of the present invention.
- Figure 18 is a cross-sectional view showing the structure of a camera module based on an infrared absorption lens structure in accordance with a second preferred embodiment of the present invention.
- Figure 19 is a cross-sectional view showing the structure of a camera module in accordance with a second preferred embodiment of the present invention.
- a split lens is illustrated that has multiple barrels.
- Figure 20 is a cross-sectional view showing the structure of a camera module according to a first modified embodiment of the second preferred embodiment of the present invention.
- Figure 21 is a cross-sectional view showing the structure of a camera module based on an infrared absorption lens structure in accordance with a third preferred embodiment of the present invention.
- Figure 22 is a cross-sectional view showing the structure of a camera module based on an infrared absorption lens structure in accordance with a third preferred embodiment of the present invention.
- Figure 23 is a cross-sectional view showing the structure of a camera module in accordance with a third preferred embodiment of the present invention.
- Figure 24 is a cross-sectional view showing the structure of a camera module according to a first modified embodiment of the third preferred embodiment of the present invention.
- Figure 25 is a cross-sectional view showing the structure of a camera module according to a second modified embodiment of the third preferred embodiment of the present invention.
- Figure 26 is a cross-sectional view showing the structure of a filter module including an infrared absorbing structure according to a fourth preferred embodiment of the present invention, in which a zoom camera module is illustrated.
- Figure 27 is a cross-sectional view showing the structure of a filter module including an infrared absorbing structure according to a fourth preferred embodiment of the present invention, in which a fixed focus camera module is illustrated.
- Figure 28 is a schematic illustration of an absorbing filter coating process on a filter in accordance with a fourth preferred embodiment of the present invention.
- Figure 29 is a schematic view showing the coating of the absorption filter layer after the filter in accordance with the fourth preferred embodiment of the present invention.
- Figure 30 is a schematic illustration of a wafer level processing filter in accordance with a fourth preferred embodiment of the present invention, wherein the absorptive filter layer is a liquid material and is spin coated onto the filter body by centrifugal force.
- Figure 31 is a cross-sectional view showing the structure of a first modified embodiment of a camera module in accordance with a fourth preferred embodiment of the present invention. It is indicated that the circuit board assembly, the filter and the photosensitive chip are simultaneously molded.
- Figure 32 is a cross-sectional view showing the structure of a first modified embodiment of a camera module in accordance with a fourth preferred embodiment of the present invention. It is indicated that the circuit board assembly and the photosensitive chip are simultaneously molded.
- Figure 33 is a cross-sectional view showing the structure of a second modified embodiment of the camera module in accordance with a fourth preferred embodiment of the present invention.
- the filter is placed in the mounting groove of the molded bracket.
- Figure 34 is a cross-sectional view showing the structure of a third modified embodiment of the camera module in accordance with a fourth preferred embodiment of the present invention. It is stated that the top surface of the molding is an integral planar extension, and the support is located on the top surface to support the filter.
- Figure 35 is a cross-sectional view showing the structure of a fourth modified embodiment of the camera module in accordance with a fourth preferred embodiment of the present invention.
- the support is located on the mounting groove to support the filter.
- Figure 36 is a cross-sectional view showing the structure of a fifth modified embodiment of the camera module in accordance with a fourth preferred embodiment of the present invention.
- the filter device is illustrated at the lower end of the driver.
- Figure 37 is a cross-sectional view showing the structure of a fifth modified embodiment of the camera module in accordance with a fourth preferred embodiment of the present invention.
- the filter device is illustrated at the upper end of the driver.
- Figure 38 is a cross-sectional view showing the structure of a sixth modification of the camera module in accordance with a fourth preferred embodiment of the present invention.
- the filter device is illustrated at the bottom of the lens barrel.
- Figure 39 is a cross-sectional view showing the structure of a sixth modification of the image pickup module according to the fourth preferred embodiment of the present invention.
- the filter device is placed on the top of the lens barrel.
- Figure 40 is a cross-sectional view showing the structure of a seventh modified embodiment of the camera module in accordance with a fourth preferred embodiment of the present invention.
- the photosensitive core is mounted on the circuit board assembly by flip chip FC.
- Figure 41 is a cross-sectional view showing the structure of a photosensitive chip including an infrared absorbing structure of a camera module according to a fifth preferred embodiment of the present invention.
- Figure 42 is a schematic illustration of a wafer level processing photosensitive chip in accordance with a fifth preferred embodiment of the present invention.
- Figure 43 is a schematic illustration of the transmittance spectrum of an absorbing filter layer in accordance with a preferred embodiment of the present invention.
- the term “a” is understood to mean “at least one” or “one or more”, that is, in one embodiment, the number of one component can be one, and in another embodiment, the component The number can be multiple, and the term “a” cannot be construed as limiting the quantity.
- the camera module may be a zoom camera module including a circuit board assembly.
- a lens 20, a driver 30, a filter 40 and a sensor chip 50 The lens 20 is located in the photosensitive path of the photosensitive chip 50, so that when the camera module is used to collect an image of an object, the light reflected by the object can be further subjected to the light sensing after being processed by the lens 20.
- Chip 50 is accepted to be suitable for photoelectric conversion.
- the filter 40 is disposed between the light path of the lens 20 and the photosensitive chip 50, and the photosensitive chip 50 is electrically connected to the circuit board assembly 10.
- the driver 30 is mounted to the circuit board assembly 10, and the lens 20 is mounted to the driver 30 such that the lens 20 is supported above the circuit board assembly 10. It is worth mentioning that the driver 30 can be implemented as a motor, a thermal driver or a micro-brake (MEMS) or the like.
- MEMS micro-brake
- the camera module of the present invention can also be implemented as a fixed focus camera module, and the main difference between the camera module and the focus camera module is that the focus camera module can change the focal length through the focus device. It can be understood that the camera module of the infrared absorption lens structure is not affected by the type of the camera module. Therefore, the camera module regardless of the focus or zoom is not limited by the present invention.
- the camera module based on the infrared absorbing structure of the present invention comprises a circuit board assembly 10, a lens 20, a filter 40, a photosensitive chip 50 and a lens holder 60.
- the lens 20 is located in the photosensitive path of the photosensitive chip 50, so that when the camera module is used to collect an image of an object, the light reflected by the object can be further subjected to the light sensing after being processed by the lens 20.
- Chip 50 is accepted to be suitable for photoelectric conversion.
- the filter 40 is disposed on a light path of the lens 20 or a photosensitive path of the photosensitive chip 50.
- the photosensitive chip 50 is electrically connected to the circuit board assembly 10.
- the lens holder 60 is mounted to the circuit board assembly 10, and the lens 20 is mounted to the lens holder 60 such that the lens 20 is supported above the circuit board assembly 10.
- the circuit board assembly 10 can be coupled to the electronic device for use with the electronic device.
- the circuit board assembly 10 includes a bracket 101 and a circuit board 12 that can be mounted or integrally packaged on the circuit board 12.
- the bracket 101 is molded to form a molded bracket 11 on a wiring board 12.
- the molded bracket 11 is integrally packaged and connected to the circuit board 12.
- the molded bracket 11 can also protect the electronic components located on the circuit board assembly 10.
- a conventional wiring board can be selected as a wiring board main body 121 in which molding is performed on the surface of the wiring board main body 121.
- the circuit board after performing the SMT process may be integrally packaged to form the molded bracket 11 by an injection molding machine using an injection molding machine, or
- the molded holder 11 is formed by a molding process such as molding or molding which is commonly used in semiconductor packaging.
- the circuit board main body 121 may be selected, for example, but not limited to, a soft and hard bonding board, a ceramic substrate (without a soft board), a PCB hard board (without a soft board), and the like.
- the manner in which the molded bracket 11 is formed may be selected, for example, but not limited to, an injection molding process, a molding process, and the like.
- the mold holder 11 can be selected from materials such as, but not limited to, nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene, polypropylene), etc. for the injection molding process, and the molding process can be adopted. Epoxy resin. It should be understood by those skilled in the art that the foregoing alternatives and the materials that can be selected are merely illustrative of the embodiments of the invention and are not intended to be limiting. It is worth mentioning that the molded stent 11 has a film-drawing slope which is inclined on the inner surface of the molding. That is to say, in this manner, after the molded bracket 11 is integrally sealed to the wiring board 12, it is easy to release the mold and prevent stray light.
- the molded bracket 11 of the circuit board assembly 10 can be used to support the driver 30. That is to say, in the assembly process of the conventional camera module using the bracket supporting the driver, the bracket and the circuit board are glued together by the glue, and the present invention is integrally molded on the circuit board assembly 10 by molding.
- the molded bracket 11 supports the driver 30.
- the molded bracket 11 can also be used to support the filter 40.
- the driver 30 and the filter 40 are mounted to the molded bracket 11, and based on the molding process, good surface flatness can be obtained, and thus
- the driver 30 and the filter 40 provide flat mounting conditions and are integrally formed such that the molded bracket 11 is less prone to offset and tilting, so as to facilitate the driver 30 and the filter 40.
- Stable, flat mounting conditions are provided to further reduce the cumulative tolerances of the driver 30 and the filter 40 when installed.
- the top surface 112 of the molded bracket 11 is integrally planarly extended, and the driver 30 and the filter 40 are mounted to the top surface 112 of the molded bracket 11. . That is, the filter 40 and the driver 30 coordinately occupy the top surface 112 of the molded bracket 11.
- the top surface 112 of the molded bracket 11 may also be a stepped structure rather than being integrally extended. That is, the molded bracket 11 has a mounting groove 113 for mounting the filter 40, and can also be used to mount the driver 30 on the step of the top surface 112.
- the lens 20 includes at least one lens 21, at least one infrared absorbing layer 22, and a lens barrel 23, wherein the infrared absorbing layer 22 is applied to the outer surface of the lens 21.
- Each of the lenses 21 is mounted in the lens barrel 23.
- the infrared absorbing layer 22 may be a material having a near-infrared spectral absorption characteristic. Therefore, it can be understood that the infrared absorbing layer 22 blocks the infrared light of the imaging system partially interfering with the imaging quality, so that the image formed by the camera module is more in line with the best feeling of the human eye.
- the infrared absorbing layer 22 may be applied to the surface of the lens 21 according to actual needs. It is worth mentioning that the surface may be the side of the object or the side of the image. That is, the infrared absorbing layer 22 may be applied only to the object side or the image side of the lens 21, or may be applied to both surfaces of the lens 21. In addition, the infrared absorbing layer 22 may also be applied to only one of the lenses 21 or simultaneously to a plurality of the lenses 21, wherein the infrared absorbing layer 22 may alternatively be applied to the mirror. The outermost, middle or innermost lens 21 in the barrel 23 is coated with the infrared absorbing layer 22.
- the lens 20 can be assembled by using one or more of the lenses 21 coated with the infrared absorbing layer 22 according to actual needs. It should be understood by those skilled in the art that the foregoing ⁇ RTIgt; ⁇ / RTI> ⁇ RTIgt; ⁇ / RTI> ⁇ RTIgt; ⁇ / RTI> ⁇ RTIgt;
- the lens 21 is coated with the infrared absorbing layer 22 to form an absorption lens, and then one or more of the absorption lenses are assembled to the lens barrel 23 to form a lens.
- Absorption lens is assembled in the same manner as the conventional camera module.
- the number of the infrared absorbing layers 22 may be two, that is, two infrared absorbing layers 22 are respectively applied to the inner and outer surfaces of the lens 21, and further, the infrared absorbing layer 22 may be coated.
- One or both sides of the lens 21 are disposed, and preferably one side. Those skilled in the art will appreciate that this is not a limitation of the invention.
- the camera module passes through the infrared absorbing layer 22 on the lens 21, so that the camera module can achieve the function of filtering, and adjust the properties of the filter 40.
- the reduced structure makes the overall structure of the camera module thin.
- the blue glass filter can be eliminated, and the filter 40 is implemented as a common glass filter to save The cost and structural thickness of the camera module. Therefore, the absorption lens is equivalent to moving the optical system of the near-infrared absorbing structure forward, and the thickness of the filter 40 can be reduced to ⁇ 0.15 mm by taking the embodiment as an example.
- the lens 21 may be made of a resin, a plastic or a glass material.
- the infrared absorbing layer 22 is a compound or an organic material having an absorbing property, in particular, a characteristic of absorption in a near-infrared spectrum, wherein the near-infrared spectrum is in a wavelength band of 565 nm to 1200 nm.
- the infrared absorbing layer 22 is formed on the lens 21 by coating and baking a liquid material, wherein the coating method can select physical vapor deposition technology such as immersion, centrifugal spin coating or the like. Or chemical vapor deposition techniques, which are not limiting of the invention.
- the lens 21 can coat and bake the infrared absorbing layer 22 by imposition or wafer level work to improve product production efficiency and reduce manufacturing costs.
- the compound is preferably a solvent-soluble pigment compound, and more preferably selected from the group consisting of a phthalocyanine compound, a squaraine lanthanide compound, a naphthalocyanine compound, and a hexavalent porphyrin compound. At least one of the group consisting of a ketone oxime compound and a cyanine compound. Therefore, when the compound is applied to the lens 21 as the infrared absorbing layer 22, it may be applied as a single layer, a double layer or a plurality of layers.
- a group consisting of a phthalocyanine compound, a squarylium ruthenium compound, a naphthalocyanine compound, a hexavalent porphyrin compound, a ketone oxime compound, and a cyanine compound A plurality of coatings are applied to the lens 21, that is, a compound having an absorbing property is applied to the lens 21.
- the compound, Formula I and Formula II represent the squaraine lanthanide compound.
- R a , R b and Y in the formula I satisfy the conditions of the following (a) or (b)
- R a independently representing a hydrogen atom, a halogen atom, a sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a pity acid group, a -L 1 or a -NR e R f group.
- R e and R f each independently represent a hydrogen atom, -L a , -L b , -L c , -L d or -L e .
- the plurality of R b present independently represent a hydrogen atom, a halogen atom sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a pity acid group, a -L 1 or a -NR g R h group.
- R g and R h each independently represent a hydrogen atom, -L a , -L b , -L c , -L d or -L e or -C(O)R i group (R i represents -L a , -L b , -L c , -L d or -L e ).
- R j and R k each independently represent a hydrogen atom, -L a , -L b , -L c , -L d or -L e .
- L 1 is L a , L b , L c , L d , L e , L f , L g or L h .
- the L a to L h represent the following groups:
- L a may have an aliphatic hydrocarbon group having a carbon number of 1 to 12 of the substituent L
- L b may have a substituent L of a halogen-substituted alkyl group having 1 to 12 carbon atoms
- L c may have a substituent L of an alicyclic hydrocarbon group having 3 to 14 carbon atoms
- L d may have an aromatic hydrocarbon group having a substituent L of 6 to 14 carbon atoms
- L e may have a substituent L of a heterocyclic group having 3 to 14 carbon atoms
- L f may have a substituent A having an alkoxy group having 1 to 9 carbon atoms
- L g may have an acyl group having a substituent L of 1 to 9 carbon atoms
- L h may have alkoxycarbonyl group having a substituent of L of 1 to 9 carbon atoms
- the substituent 1 is an aromatic hydrocarbon group selected from the group consisting of an aliphatic hydrocarbon group having 1 to 12 carbon atoms, a halogen-substituted alkyl group having 1 to 12 carbon atoms, an alicyclic hydrocarbon group having 3 to 14 carbon atoms, and an aromatic group having 6 to 14 carbon atoms. At least one of a group consisting of a hydrocarbon group, a heterocyclic group having 3 to 14 carbon atoms, a halogen atom, a sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a pity acid group, and an amino group.
- the total number of carbon atoms including the substituent is preferably 50 or less, more preferably 40 or less, and particularly preferably 30 or less.
- the carbon number is more than the above range, it may be difficult to synthesize a compound, and the absorption intensity per unit weight of light tends to be small.
- At least one of the two R a on one benzene ring is bonded to Y on the same benzene ring to form a hetero ring having at least one nitrogen atom and having 5 or 6 atoms.
- the heterocyclic ring may have a substituent, and R b and R a not participating in the formation of the heterocyclic ring are each independently synonymous with R b and RR a of the condition (a).
- Examples of the aliphatic hydrocarbon group having 1 to 12 carbon atoms in the L a and L include methyl (Me), ethyl (Et), n-propyl (n-Pr), and isopropyl (i).
- -Pr n-butyl (n-Bu), sec-butyl (s-Bu), tert-butyl (t-Bu), pentyl, hexyl, octyl, decyl, decyl and dodecyl Alkyl; vinyl, 1-propenyl, 2-propenyl, butenyl, 1,3-butadienyl, 2-methyl-1-propenyl, 2-pentenyl, hexenyl and octyl
- An alkenyl group such as an alkenyl group
- an alkynyl group such as an ethynyl group, a propynyl group, a butynyl group, a 2-methyl
- Examples of the halogen-substituted alkyl group having 1 to 12 carbon atoms in the L b and L include trichloromethyl, trifluoromethyl, 1,1-dichloroethyl, pentachloroethyl and five. Fluoroethyl, heptachloropropyl and heptafluoropropyl.
- Examples of the alicyclic hydrocarbon group having 3 to 14 carbon atoms in L c and L include a cycloalkyl group such as a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, a cycloheptyl group and a cyclooctyl group; A polycyclic alicyclic group such as an alkyl group or an adamantyl group.
- Examples of the aromatic hydrocarbon group having 6 to 14 carbon atoms in the L d and L include a phenyl group, a tolyl group, a xylyl group, a mesityl group, a cumenyl group, a 1-naphthyl group, and 2 Naphthyl, onion, phenanthryl, anthryl, phenalenyl, tetraamendyl, indanyl and biphenyl.
- heterocyclic group having 3 to 14 carbon atoms of L e and L examples include, for example, furan, porphin, pyrrole, pyrazole, imidazole, triazole, oxazole, oxadiazole, thiazole, and thiadiazole.
- Examples of the alkoxy group having a carbon number of -12 in the L f include a methoxy group, an ethoxy group, a n-propoxy group, an isopropoxy group, a butoxy group, a pentyloxy group, and a hexyloxy group. , octyloxy.
- Examples of the acyl group having 1 to 9 carbon atoms in the L g include an acetyl group, a propionyl group, a butyryl group, an isobutyryl group, a valeryl group, an isovaleryl group, and a benzoyl group.
- alkoxycarbonyl group having 1 to 9 carbon atoms in the L h examples include a methoxycarbonyl group, an ethoxycarbonyl group, a propoxycarbonyl group, an isopropoxycarbonyl group, a butoxycarbonyl group, and a pentyl group.
- Oxycarbonyl, hexyloxycarbonyl and octyloxycarbonyl examples include a methoxycarbonyl group, an ethoxycarbonyl group, a propoxycarbonyl group, an isopropoxycarbonyl group, a butoxycarbonyl group, and a pentyl group.
- L a is preferably methyl, ethyl, n-propyl, isopropyl, n-butyl, sec-butyl, tert-butyl, pentyl, hexyl, octyl, 4-phenylbutyl, 2-
- the cyclohexylethyl group is more preferably a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a n-butyl group, a sec-butyl group or a t-butyl group.
- the L b is preferably trichloromethyl, pentachloroethyl, trifluoromethyl, pentafluoroethyl, 5-cyclohexyl-2,2,3,3-tetrafluoropentyl, more preferably trichloro Methyl, pentachloroethyl, trifluoromethyl, pentafluoroethyl.
- the L c is preferably a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, a 4-ethylcyclohexyl group, a cyclooctyl group or a 4-phenylcycloheptyl group, more preferably a cyclopentyl group, a cyclohexyl group or a 4-ethyl group.
- a phenyl group, a 1-naphthyl group, a 2-naphthyl group, a tolyl group, a xylyl group, a mesityl group, a cumenyl group, a 3,5-di-tert-butylphenyl group, and 4 are preferable.
- the L e is preferably a group containing furan, thiophene, pyrrole, anthracene, porphyrin, pyrene, benzofuran, benzothiophene, morpholine, and more preferably contains furan, thiophene, pyrrole, or a group of porphyrins.
- a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group, a butoxy group, a methoxymethyl group, a methoxyethyl group, a 2-phenylethoxy group, and 3 are preferable.
- the L g is preferably acetyl, propionyl, butyryl, isobutyryl, benzoyl, 4-propylbenzoyl or trifluoromethylcarbonyl, more preferably acetyl, propionyl or benzoyl.
- the L h is preferably a methoxycarbonyl group, an ethoxycarbonyl group, a propoxycarbonyl group, an isopropoxycarbonyl group, a butoxycarbonyl group, a 2-trifluoromethylethoxycarbonyl group, or a 2-phenylethoxy group.
- the carbonyl group is more preferably a methoxycarbonyl group or an ethoxycarbonyl group.
- the L a to L h may further have at least one atom or group selected from the group consisting of a halogen atom, a sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a phosphoric acid group, and an amino group.
- a halogen atom e.g., a fluoride
- a sulfo group e.g., a sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a phosphoric acid group, and an amino group.
- 4-sulfobutyl group, 4-cyanobutyl group, 5-carboxypentyl group, 5-aminopentyl group, 3-hydroxypropyl group, 2-phosphorylethyl group, and 6-amino group are mentioned.
- R a in the condition (a) is preferably a hydrogen atom, a chlorine atom, a fluorine atom, a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a n-butyl group, a sec-butyl group, a t-butyl group or a ring.
- the hexyl group, the phenyl group, the hydroxyl group, the amino group, the dimethylamino group, and the nitro group are more preferably a hydrogen atom, a chlorine atom, a fluorine atom, a methyl group, an ethyl group, a n-propyl group, an isopropyl group or a hydroxyl group.
- R b in the condition (a) is preferably a hydrogen atom, a chlorine atom, a fluorine atom, a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a n-butyl group, a sec-butyl group, a t-butyl group or a ring.
- the Y is preferably an amino group, a methylamino group, a dimethylamino group, a diethylamino group, a di-n-propylamino group, a diisopropylamino group, a di-n-butylamino group or a di-tert-butylamino group.
- the number of constituent atoms including at least one nitrogen atom formed by bonding at least one of two R a on one benzene ring in the condition (b) of the formula I to the Y on the same benzene ring is 5
- the heterocyclic ring of 6 or more include pyrrolidine, pyrrole, imidazole, pyrazole, piperidine, pyridine, piperazine, pyridazine, pyrimidine and pyrazine.
- a heterocyclic ring constituting the heterocyclic ring and constituting one of the carbon atoms of the benzene ring is a nitrogen atom, and more preferably a pyrrolidine.
- X independently represents 0, S, Se, NR c or C(R d R d ), and a plurality of R c independently represent a hydrogen atom, L a , L b , Lc, L d Or L e , a plurality of R d independently represent a hydrogen atom, a halogen atom sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a phosphate group, a -L 1 or a -NR e R f group, and an adjacent R d may be linked to each other to form a ring may have a substituent group, L a ⁇ L e, L 1, L a R e and R f in the formula I as defined in ⁇ L e, L 1, R e , and R f Synonymous.
- a hydrogen atom, a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a n-butyl group, a sec-butyl group, a tert-butyl group, a n-pentyl group, a n-hexyl group, and a ring are preferable.
- R d in the formula II is preferably a hydrogen atom, a chlorine atom, a fluorine atom, a methyl group, an ethyl group, a n-propyl group, an isopropyl butyl group, a sec-butyl group, a t-butyl group, a n-pentyl group or a hexyl group.
- the X is preferably 0, S, Se, N-Me, N-Et, CH 2 , C-Me 2 or C-Et 2 , and more preferably S, C-Me 2 or C-Et 2 .
- adjacent R d are bonded to each other to form a ring.
- a ring include a benzopyridinium ring, an ⁇ -naphthylimidazole ring, a ⁇ -naphthylimidazole ring, an ⁇ -naphthoxazole ring, a ⁇ -naphthoxazole ring, and an ⁇ -naphthyl group.
- the compound, Formula III also represents the squaraine lanthanide compound.
- X independently represents an oxygen atom, a sulfur atom, a selenium atom or -NH-
- R 1 to R 7 each independently represent a hydrogen atom, a halogen atom, a sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, or a phosphoric acid.
- Base -L 1 or -NR g R h group.
- R g and R h each independently represent a hydrogen atom, -L a , -L b , -L c , -L d or -L e or -C(O)R i group (R i represents -L a , -L b , -L c , -L d or -L e ).
- L 1 is L a , L b , L c , L d , L e , L f , L g or L h .
- L a to L h are synonymous with L a to L h as defined in the above formula I.
- a hydrogen atom, a chlorine atom, a fluorine atom, a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a n-butyl group, a sec-butyl group, a t-butyl group, a cyclohexyl group, a phenyl group, a hydroxyl group are preferable.
- the amino group, the dimethylamino group, and the nitro group are more preferably a hydrogen atom, a chlorine atom, a fluorine atom, a methyl group, an ethyl group, a n-propyl group, an isopropyl group or a hydroxyl group.
- a hydrogen atom, a chlorine atom, a fluorine atom, a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a n-butyl group, a sec-butyl group, a t-butyl group, a cyclohexyl group, and a benzene are preferable.
- Base hydroxy, amino, dimethylamino, cyano, nitro, acetylamino, propionylamino, N-methylethylamino, trifluorocarbonylamino, pentafluoroacetylamino, tert-butyrylamino a cyclohexanoylamino group, more preferably a hydrogen atom, a chlorine atom, a fluorine atom, a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a hydroxyl group, a dimethylamino group, a nitro group, an acetylamino group, a propionylamino group, Trifluoroformylamino, pentafluoroacetylamino, tert-butyrylamino, cyclohexanoylamino.
- the X is preferably an oxygen atom or a sulfur atom, and particularly preferably an oxygen atom.
- the compound, Formula IV represents the phthalocyanine-based compound.
- ⁇ represents two hydrogen atoms, two monovalent metal atoms, a divalent metal atom, or a substituted metal atom containing a trivalent or tetravalent metal atom, and a plurality of R a , R b , R c And R d are independently represented by a hydrogen atom, a halogen atom, a hydroxyl group, a carboxyl group, a nitro group, an amino group, an amide group, an imide group, a cyano group, a silane group, -L 1 , -SL 2 , -SS-L.
- R a , R b , R c and R d bonded to the same aromatic ring is not a hydrogen atom.
- the amino group, the amide group, the imide group, and the silane group may have the substituent L defined in the formula I,
- L 2 represents a hydrogen atom or any of L a to L e defined in the formula I,
- L 3 represents a hydroxyl group or any of the above L a to L e ,
- L 4 represents any of the above L a to L e .
- the photosensitive chip 50 is disposed on an upper surface of the wiring board main body 121, and the molded bracket 11 surrounds an outer side of the photosensitive chip 50.
- the photosensitive chip 50 may be first mounted on the circuit board main body 121, and then in the On the outside of the photosensitive chip 50, the molded holder 11 is molded on the wiring board main body 121.
- the molded holder 11 may be molded on the circuit board main body 121, and then the photosensitive chip 50 may be mounted on the circuit board main body 121. Located inside the molded bracket 11.
- the photosensitive chip 50 is connected to the circuit board assembly 10 through a series of leads 53.
- the lead 53 may be implemented as, for example but not limited to, a gold wire, a copper wire, an aluminum wire, a silver wire.
- the series of leads 53 of the photosensitive chip 50 can be attached to the circuit board assembly 10 by conventional COB means, such as, but not limited to, soldering.
- the present invention further provides a near infrared spectroscopy absorption method of a camera module, which includes the following steps:
- the lens comprises at least one lens 21 and at least one infrared absorbing layer 22, wherein the infrared absorbing layer 22 is located on the surface of one or more of the lenses 21 by a coating method. Therefore, it can be understood that, according to the step (a), infrared light is absorbed by the infrared absorbing layer 22 coated on the lens 21. It can be understood that the infrared absorbing layer 22 can also be formed on the surface of the lens 21 by other attachment means.
- the coating method may be a physical vapor deposition technique or a chemical vapor deposition technique using immersion, centrifugal force spin coating.
- the infrared absorbing layer 22 is an organic material or a compound, and has a characteristic of absorption in the near-infrared spectrum, wherein the near-infrared spectrum is in the band of 565 nm to 1200 nm.
- step (a) wherein the infrared absorbing layer 22 is a liquid material prior to coating.
- a first modified embodiment of the camera module according to the first preferred embodiment of the present invention, wherein the molded bracket 11 is described to simultaneously package the circuit board 12 and the photosensitive Chip 50, that is, MOC (molding on chip).
- the filter 40 is directly above the photosensitive chip 50 and integrally molded via the molded bracket 11. That is, the photosensitive chip 50 is attached to the circuit board main body 121 of the circuit board assembly 10, and then the photosensitive chips 50 are electrically connected to the circuit board main body 121, and then the filter is applied. After the light sheet 40 is placed over the photosensitive chip 50, it is integrally packaged, such as a molded package or formed by a molding process commonly used in a semiconductor package.
- the filter 40 is mounted to the top surface 112 of the molded bracket 11.
- the top surface 112 of the molded bracket 11 extends in an integral plane, and the driver 30 can be mounted to the top surface 112 of the molded bracket 11.
- the molded bracket 11 has a mounting groove 113 for mounting the filter. Sheet 40.
- the top surface 112 of the molded bracket 11 has a stepped structure and does not extend integrally. The steps of the top surface 112 can be used to mount the filter 40 and the driver 30. .
- a second modified embodiment of the camera module according to the first preferred embodiment of the present invention, wherein the camera module includes a stand 70 mounted to the die. Bracket 11.
- the holder 70 has a first seating groove 71 and a second seating groove 72.
- the filter 40 is mounted on the first seating groove 71 such that the surface of the filter 40 is not It will protrude from the top end of the holder 70.
- the second seating groove 72 is mounted to the molded bracket 11 such that the molded bracket 11 extends upward along the support 70, and the position of the filter 40 is relatively downward, thereby reducing The back focus of the camera module. As shown in FIG.
- the top surface 112 of the molded bracket 11 extends integrally planarly, and the second seating groove 72 of the holder 70 is mounted to the top surface 112 of the molded bracket 11,
- the driver 30 or the lens 20 is mounted to the holder 70.
- the first seating groove 71 of the support 70 extends toward the inside and the lower side of the camera module, thereby supporting the filter 40 above the photosensitive chip 30, so that the filter 40 It is not installed and does not occupy structural space.
- the molded bracket 11 has a mounting groove 113, wherein the holder 70 is disposed in the mounting groove 113 of the molded bracket 11.
- the filter 40 is mounted to the first seating groove 71 such that the surface of the filter 40 does not protrude from the top end of the holder 70.
- the second seat groove 72 is mounted to the mounting groove 113 such that the molded bracket 11 extends upward along the support 70, and the filter 40 is positioned relatively downward, thereby reducing the position The back focus of the camera module.
- the driver 30 can be mounted to the molded bracket 11.
- the filter 40 is mountable to the driver 30 or the lens 20 .
- the driver 30 includes a lower end portion 31 adapted to mount the filter 40.
- the driver 30D includes an upper end portion 32 that is adapted to mount the filter 40.
- the lens barrel 23 includes a bottom portion 231 for mounting the filter 40.
- the lens barrel 23 includes a top portion 232 for mounting the filter 40.
- the number of the lens barrels 23 may be one or more, and when the number of the lens barrels 23 is two or more, they may be joined to each other, and the filter 40 may be used.
- One of the barrels 23 is attached to achieve a filtering effect.
- the lens barrel 23 includes a first lens barrel 233 and a second lens barrel 234, wherein the second lens barrel 234 is joined to the first lens barrel 233, wherein the joint embodiment can adopt various currently common ones. Bonding techniques, such as a latch assembly, a threaded component, a heat seal, an ultrasonic joint, and the like. Therefore, the engagement embodiment of the first barrel 233 and the second barrel 234 is not a limitation of the present invention. It is to be understood that the number of the lens barrels 23 exemplified above is not a limitation of the present invention.
- a fourth modified embodiment of the camera module according to the first preferred embodiment of the present invention wherein the photosensitive chip 50 is mounted on the circuit board by a flip chip type FC (Flip Chip). Component 10.
- the flip chip type FC (Flip Chip) is mounted on the circuit board assembly 10 from the back side of the circuit board assembly 10, and the photosensitive area of the photosensitive chip 50 faces upward. Mounted to the circuit board assembly 10.
- Such a structure and mounting manner are such that the photosensitive chip 50 and the molded holder 11 are relatively independent, and the mounting of the photosensitive chip 50 is not affected by the molded bracket 11, and the mold of the molded bracket 11 The influence of the molding on the photosensitive chip 50 is also small.
- the circuit board 12 includes a circuit board main body 121 having a passage 1211, and a lower portion of the passage 1211 is adapted to mount the photosensitive chip 30.
- the via 1211 allows the upper and lower sides of the wiring board main body 121 to communicate, so that when the photosensitive chip 50 is mounted on the back surface of the wiring board main body 121 and the photosensitive area is mounted on the wiring board main body 121, The photosensitive area of the photosensitive chip 50 is capable of receiving light entering by the lens 20.
- the circuit board main body 121 has an outer recess 1212, and the outer recess 1212 communicates with the corresponding passage to provide a mounting position of the photosensitive chip 50.
- a camera module based on an infrared absorption lens structure may be a moving focus camera module including a circuit board assembly. 10.
- the lens 20 is located in the photosensitive path of the photosensitive chip 50, so that when the camera module is used to collect an image of an object, the light reflected by the object can be further subjected to the light sensing after being processed by the lens 20.
- Chip 50 is accepted to be suitable for photoelectric conversion.
- the photosensitive chip 50 is electrically connected to the circuit board assembly 10.
- the driver 30 is mounted to the circuit board assembly 10, and the lens 20 is mounted to the driver 30 such that the lens 20 is supported above the circuit board assembly 10.
- the camera module of the present invention can also be implemented as a fixed focus camera module, and the main difference between the camera module and the focus camera module is that the focus camera module can change the focal length through the focus device. It can be understood that the camera module of the infrared absorption lens structure is not affected by the type of the camera module. Therefore, the camera module regardless of the focus or zoom is not limited by the present invention.
- the circuit board assembly 10 is formed by molding a molded bracket 11 and a circuit board 12, wherein the molded bracket 11 is integrally packaged and connected to the circuit board 12.
- the molded bracket 11 can also protect the electronic components located on the circuit board assembly 10.
- a conventional wiring board can be selected as a wiring board main body 121 in which molding is performed on the surface of the wiring board main body 121.
- the circuit board after the SMT process may be integrally packaged by an injection molding machine by an insert molding process, such as molding, to form the
- the molded bracket 11 is molded or formed by a molding process commonly used in a semiconductor package.
- the circuit board main body 121 may be selected, for example, but not limited to, a soft and hard bonding board, a ceramic substrate (without a soft board), a PCB hard board (without a soft board), and the like.
- the manner in which the molded bracket 11 is formed may be selected, for example, but not limited to, an injection molding process, a molding process, and the like.
- the mold holder 11 can be selected from materials such as, but not limited to, nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene, polypropylene), etc. for the injection molding process, and the molding process can be adopted. Epoxy resin. It should be understood by those skilled in the art that the foregoing alternatives and the materials that can be selected are merely illustrative of the embodiments of the invention and are not intended to be limiting.
- the molded bracket 11 of the circuit board assembly 10 can be used to support the driver 30. That is to say, in the assembly process of the conventional camera module using the bracket supporting the driver, the bracket and the circuit board are glued together by the glue, and the present invention is integrally molded on the circuit board assembly 10 by molding.
- the molded bracket 11 supports the driver 30.
- the top surface 112 of the molded bracket 11 is integrally planarly extended, wherein a good surface flatness can be obtained based on the molding process, so that the molded bracket 11 is less likely to be displaced or tilted.
- a phenomenon is provided to provide stable, flat mounting conditions for the driver 30.
- the photosensitive chip 50 is disposed on the upper surface of the wiring board main body 121, and the molded bracket 11 surrounds the outer side of the photosensitive chip 50.
- the wiring board 12 and the photosensitive chip 50 can be simultaneously packaged in the molded holder 11. Accordingly, it will be appreciated that the process and package components of the molded stent 11 are not a limitation of the present invention.
- the lens 20 comprises at least one lens 21, at least one infrared absorbing layer 22 and a lens barrel 23, wherein the infrared absorbing layer 22 is applied to one or more of the lenses 21.
- the surface may be the side of the object or the side of the image. That is, the infrared absorbing layer 22 may be applied only to the object side or the image side of the lens 21, or may be applied to both surfaces of the lens 21.
- each of the lenses 21 is mounted in the lens barrel 23.
- the infrared absorbing layer 22 is an organic material or compound having characteristics of absorption in the near infrared spectrum. Therefore, it can be understood that the infrared absorbing layer 22 blocks the infrared light of the imaging system partially interfering with the imaging quality, so that the image formed by the camera module is more in line with the best feeling of the human eye.
- the infrared absorbing layer 22 may be applied to the outer surface of the lens 21 according to actual needs. That is, the infrared absorbing layer 22 may be applied to only one of the lenses 21 or simultaneously to a plurality of the lenses 21, wherein the infrared absorbing layer 22 is also optionally coated on the device.
- the outermost, middle or innermost lens 21 in the lens barrel 23 is coated with the infrared absorbing layer 22.
- the lens 20 can be assembled by using one or more of the lenses 21 coated with the infrared absorbing layer 22 according to actual needs. It should be understood by those skilled in the art that the foregoing ⁇ RTIgt; ⁇ / RTI> ⁇ RTIgt; ⁇ / RTI> ⁇ RTIgt; ⁇ / RTI> ⁇ RTIgt;
- the lens 21 is coated with the infrared absorbing layer 22 to form an absorption lens, and one or more of the absorption lenses are assembled to the lens barrel 23 to form an absorption.
- the absorption lens is assembled in the same manner as the conventional camera module.
- the number of the infrared absorbing layers 22 may be two, that is, two infrared absorbing layers 22 are respectively applied to the inner and outer surfaces of the lens 21, and further, the infrared absorbing layer 22 may be coated.
- One or both sides of the lens 21 are disposed, and preferably one side. Those skilled in the art will appreciate that this is not a limitation of the invention.
- the number of the lens barrels 23 may be one or more, and when the number of the lens barrels 23 is two or more, they may be joined to each other, and the filter 40 may be used.
- One of the barrels 23 is attached to achieve a filtering effect.
- the lens barrel 23 includes a first lens barrel 233 and a second lens barrel 234, wherein the second lens barrel 234 is joined to the first lens barrel 233, wherein the joint embodiment can adopt various currently common ones. Bonding techniques, such as a latch assembly, a threaded component, a heat seal, an ultrasonic joint, and the like. Therefore, the joint embodiment of the first barrel 233 and the second barrel 234 is not a limitation of the present invention.
- the number of the lens barrels 23 exemplified above is not a limitation of the present invention.
- the number of lenses in the lens barrel 23 is not limited by the present invention according to actual imaging requirements. That is, the first barrel 233 can be equipped with one or more of the lenses 21.
- the second barrel 234 can also be equipped with one or more of the lenses 21. Further by way of example, the first barrel 233 can be equipped with two of the lenses 21. The second barrel 234 can be equipped with three of the lenses 21.
- the camera module can pass the infrared absorbing layer 22 on the lens 21, so that the camera module can achieve the function of filtering. Therefore, it can be understood that the embodiment does not need to pass.
- the filter 40 is filtered.
- the lens 21 may be made of a resin, a plastic or a glass material.
- the infrared absorbing layer 22 is a compound or an organic material having an absorbing property, in particular, a characteristic of absorption in a near-infrared spectrum, wherein the near-infrared spectrum is in a wavelength band of 565 nm to 1200 nm.
- the infrared absorbing layer 22 is formed on the lens 21 by coating and baking a liquid material, wherein the coating method can select physical vapor deposition technology such as immersion, centrifugal spin coating or the like. Or chemical vapor deposition techniques, which are a limitation of the invention.
- the lens 21 can coat and bake the infrared absorbing layer 22 by imposition or wafer level work to improve product production efficiency and reduce manufacturing costs.
- the compound is preferably a solvent-soluble pigment compound, and more preferably selected from the group consisting of a phthalocyanine compound, a squaraine lanthanide compound, a naphthalocyanine compound, and a hexavalent porphyrin compound. At least one of the group consisting of a ketone oxime compound and a cyanine compound. Therefore, when the compound is applied to the lens 21 as the infrared absorbing layer 22, it may be applied as a single layer, a double layer or a plurality of layers.
- a group consisting of a phthalocyanine compound, a squarylium ruthenium compound, a naphthalocyanine compound, a hexavalent porphyrin compound, a ketone oxime compound, and a cyanine compound A plurality of coatings are applied to the lens 21, that is, a compound having an absorbing property is applied to the lens 21.
- the photosensitive chip 50 is disposed on an upper surface of the wiring board main body 121, wherein when manufacturing the circuit board assembly 10, different manufacturing sequences may be selected, for example, but not limited to,
- the photosensitive chip 50 may be first mounted on the wiring board main body 121, and then the molded bracket 11 is molded on the wiring board main body 121 outside the photosensitive chip 50.
- the molded holder 11 may be molded on the circuit board main body 121, and then the photosensitive chip 50 may be mounted on the circuit board main body 121. Located inside the molded bracket 11.
- the photosensitive chip 50 is connected to the circuit board assembly 10 through a series of leads 53.
- the lead 53 may be implemented as, for example but not limited to, a gold wire, a copper wire, an aluminum wire, a silver wire.
- the series of leads 53 of the photosensitive chip 50 can be attached to the circuit board assembly 10 by conventional COB means, such as, but not limited to, soldering.
- FIG. 20 it is a first modified embodiment of the camera module according to the second preferred embodiment of the present invention, wherein the photosensitive chip 50 is mounted on the circuit board by using a flip chip FC (Flip Chip).
- FC flip Chip
- Component 10 The flip chip type FC (Flip Chip) is mounted on the circuit board assembly 10 from the back side of the circuit board assembly 10, and the photosensitive area of the photosensitive chip 50 faces upward. Mounted to the circuit board assembly 10.
- FC Flip Chip
- Such a structure and mounting manner are such that the photosensitive chip 50 and the molded holder 11 are relatively independent, and the mounting of the photosensitive chip 50 is not affected by the molded bracket 11, and the mold of the molded bracket 11 The influence of the molding on the photosensitive chip 50 is also small.
- the circuit board 12 includes a circuit board main body 121 having a passage 1211, and a lower portion of the passage 1211 is adapted to mount the photosensitive chip 30.
- the via 1211 allows the upper and lower sides of the wiring board main body 121 to communicate, so that when the photosensitive chip 50 is mounted on the back surface of the wiring board main body 121 and the photosensitive area is mounted on the wiring board main body 121, The photosensitive area of the photosensitive chip 50 is capable of receiving light entering by the lens 20.
- the circuit board main body 121 has an outer recess 1212, and the outer recess 1212 communicates with the corresponding passage to provide a mounting position of the photosensitive chip 50.
- the present invention further provides a near infrared spectroscopy absorption method of a camera module, which includes the following steps:
- the lens comprises at least one lens 21 and at least one infrared absorbing layer 22, wherein the infrared absorbing layer 22 is located on the surface of the lens 21 by a coating method.
- the coating method adopts physical vapor deposition technology or chemical vapor deposition technology of immersion, centrifugal force spin coating.
- the infrared absorbing layer 22 is an organic material and has a characteristic of absorption in the near-infrared spectrum, wherein the near-infrared spectrum is in the band of 565 nm to 1200 nm.
- step (a) wherein the infrared absorbing layer 22 is a liquid material prior to coating.
- the camera module may be a dynamic focus camera module including a circuit board assembly.
- a lens 20, a driver 30, and a sensor chip 50 The lens 20 is located in the photosensitive path of the photosensitive chip 50, so that when the camera module is used to collect an image of an object, the light reflected by the object can be further subjected to the light sensing after being processed by the lens 20.
- Chip 50 is accepted to be suitable for photoelectric conversion.
- the photosensitive chip 50 is electrically connected to the circuit board assembly 10.
- the driver 30 is mounted to the circuit board assembly 10, and the lens 20 is mounted to the driver 30 such that the lens 20 is supported above the circuit board assembly 10.
- the camera module of the present invention can also be implemented as a fixed focus camera module, and the main difference between the camera module and the focus camera module is that the focus camera module can change the focal length through the focus device. It can be understood that the camera module of the infrared absorption lens structure is not affected by the type of the camera module. Therefore, the camera module regardless of the focus or zoom is not limited by the present invention.
- the circuit board assembly 10 is formed by molding a molded bracket 11 and a circuit board 12, wherein the molded bracket 11 is integrally packaged and connected to the circuit board 12.
- the molded bracket 11 can also protect the electronic components located on the circuit board assembly 10.
- a conventional wiring board can be selected as a wiring board main body 121 in which molding is performed on the surface of the wiring board main body 121.
- the circuit board after the SMT process may be integrally packaged by an injection molding machine by an insert molding process, such as molding, to form the
- the molded bracket 11 is molded or formed by a molding process commonly used in a semiconductor package.
- the circuit board main body 121 may be selected, for example, but not limited to, a soft and hard bonding board, a ceramic substrate (without a soft board), a PCB hard board (without a soft board), and the like.
- the manner in which the molded bracket 11 is formed may be selected, for example, but not limited to, an injection molding process, a molding process, and the like.
- the mold holder 11 can be selected from materials such as, but not limited to, nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene, polypropylene), etc. for the injection molding process, and the molding process can be adopted. Epoxy resin. It should be understood by those skilled in the art that the foregoing alternatives and the materials that can be selected are merely illustrative of the embodiments of the invention and are not intended to be limiting.
- the molded bracket 11 of the circuit board assembly 10 can be used to support the driver 30. That is to say, in the assembly process of the conventional camera module using the bracket supporting the driver, the bracket and the circuit board are glued together by the glue, and the present invention is integrally molded on the circuit board assembly 10 by molding.
- the molded bracket 11 supports the driver 30.
- the top surface 112 of the molded bracket 11 is integrally planarly extended, wherein a good surface flatness can be obtained based on the molding process, so that the molded bracket 11 is less likely to be displaced or tilted.
- a phenomenon is provided to provide stable, flat mounting conditions for the driver 30.
- the photosensitive chip 50 is disposed on the upper surface of the wiring board main body 121, and the molded bracket 11 surrounds the outer side of the photosensitive chip 50.
- the wiring board 12 and the photosensitive chip 50 can be simultaneously packaged in the mold holder 11. Accordingly, it will be appreciated that the process and package components of the molded stent 11 are not a limitation of the present invention.
- the lens 20 comprises at least one lens 21 and at least one lens barrel 23, wherein the lens 21 is made of an organic material or a compound, wherein the lens 21 has a characteristic of absorption in the near infrared spectrum and is installed in the device. Inside the lens barrel 23. In particular, the near-infrared spectrum is in the 565 nm to 1200 nm band. Further, the lens 21 is made of an absorbent lens by the organic material or compound. It will be appreciated that the lens 20 can be assembled from one or more absorbent lenses. That is, one or more of the absorption lenses are assembled to form an absorption lens. It is worth mentioning that the absorption lens is assembled in the same manner as the conventional camera module.
- the number of the lens barrels 23 may be one or more, and when the number of the lens barrels 23 is two or more, they may be joined to each other, and the filter 40 may be used.
- One of the barrels 23 is attached to achieve a filtering effect.
- the lens barrel 23 includes a first lens barrel 233 and a second lens barrel 234, wherein the second lens barrel 234 is joined to the first lens barrel 233, wherein the joint embodiment can adopt various currently common ones. Bonding techniques, such as a latch assembly, a threaded component, a heat seal, an ultrasonic joint, and the like. Therefore, the joint embodiment of the first barrel 233 and the second barrel 234 is not a limitation of the present invention.
- the number of the lens barrels 23 exemplified above is not a limitation of the present invention.
- the number of lenses in the lens barrel 23 is not limited by the present invention according to actual imaging requirements. That is, the first barrel 233 can be equipped with one or more of the lenses 21.
- the second barrel 234 can also be equipped with one or more of the lenses 21. Further by way of example, the first barrel 233 can be equipped with two of the lenses 21. The second barrel 234 can be equipped with three of the lenses 21.
- the compound is preferably a solvent-soluble pigment compound, and more preferably selected from the group consisting of a phthalocyanine compound, a squaraine lanthanide compound, a naphthalocyanine compound, and a hexavalent porphyrin compound. At least one of the group consisting of a ketone oxime compound and a cyanine compound. Therefore, when the lens 21 is made of the compound.
- the lens 21 is made of one or more such that the lens has an absorbing property.
- the infrared absorption structure of the camera module is formed by the characteristics of the material of the lens 21 itself, and it is further understood that the lens 21 has the characteristics of absorption near the infrared spectrum.
- the camera module can achieve both the filtering function and the reduced structure, thereby making the overall structure of the camera module thin. That is to say, the lens 21 replaces a general filter, thereby making the structure of the camera module thin.
- the absorption lens can be obtained by aspherical blue glass aspherical surface forming.
- the photosensitive chip 50 is attached to the wiring board assembly 10 through a series of leads 53.
- the lead 53 may be implemented as, for example but not limited to, a gold wire, a copper wire, an aluminum wire, a silver wire.
- the series of leads 53 of the photosensitive chip 50 can be attached to the circuit board assembly 10 by conventional COB means, such as, but not limited to, soldering. It should be noted that when the photosensitive chip 50 is mounted on the circuit board assembly 10, neither the chip-on-board package (COB) nor the chip flipping method (Flip Chip) is limited by the present invention.
- FIG. 24 it is a first modified embodiment of the camera module according to the third preferred embodiment of the present invention, in which a different chip mounting method, that is, a flip chip FC (Flip Chip) is used.
- the conventional chip mounting method is to package the photosensitive chip 50 above the circuit board assembly 10.
- the flip chip type FC (Flip Chip) is mounted on the circuit board assembly 10 from the back side of the circuit board assembly 10, and the photosensitive area of the photosensitive chip 50 faces upward. Mounted to the circuit board assembly 10.
- Such a structure and mounting manner are such that the photosensitive chip 50 and the molded holder 11 are relatively independent, and the mounting of the photosensitive chip 50 is not affected by the molded bracket 11, and the mold of the molded bracket 11 The influence of the molding on the photosensitive chip 50 is also small.
- the manner in which the photosensitive chip 50 is mounted is not a limitation of the present invention.
- a second modified embodiment of the camera module according to the third preferred embodiment of the present invention wherein the camera module can add a filter 40 disposed on the lens 20
- the light travels through the path.
- the filter 40 is implemented as a common glass filter to save cost and structural thickness of the camera module.
- the thickness of the filter 40 is reduced to ⁇ 0.15 mm.
- the present invention further provides a near infrared spectroscopy absorption method of a camera module, which includes the following steps:
- the lens 21 is made of an organic material in which there is a characteristic of absorption in the near infrared spectrum.
- the near-infrared spectrum is in the range of 565 nm to 1200 nm.
- the camera module As shown in FIG. 26 to FIG. 30, it is a camera module according to a fourth preferred embodiment of the present invention, which is an imaging module based on an infrared absorption structure.
- the camera module can be implemented as a zoom camera module or a fixed focus camera module, wherein the main difference is that the focus camera module can change the focal length through the focus device.
- the camera module based on the infrared absorption structure of the present invention includes a circuit board assembly 10, a lens 20, a driver 30, a filter 40 and a Photosensitive chip 50.
- the lens 20 is located in the photosensitive path of the photosensitive chip 50, so that when the camera module is used to collect an image of an object, the light reflected by the object can be further subjected to the light sensing after being processed by the lens 20.
- Chip 50 is accepted to be suitable for photoelectric conversion.
- the filter 40 is disposed on a light path of the lens 20 or a photosensitive path of the photosensitive chip 50.
- the photosensitive chip 50 is electrically connected to the circuit board assembly 10.
- the driver 30 is mounted to the circuit board assembly 10, and the lens 20 is mounted to the driver 30 such that the lens 20 is supported above the circuit board assembly 10.
- the circuit board assembly 10 can be coupled to the electronic device for use with the electronic device.
- the driver 30 can be implemented as a motor, a thermal driver or a microactuator (MEMS) or the like.
- the camera module based on the infrared absorption structure of the present invention includes a circuit board assembly 10, a lens 20, a filter 40, a sensor chip 50, and A lens holder 60.
- the lens 20 is located in the photosensitive path of the photosensitive chip 50, so that when the camera module is used to collect an image of an object, the light reflected by the object can be further subjected to the light sensing after being processed by the lens 20.
- Chip 50 is accepted to be suitable for photoelectric conversion.
- the filter 40 is disposed on a light path of the lens 20 or a photosensitive path of the photosensitive chip 50.
- the photosensitive chip 50 is electrically connected to the circuit board assembly 10.
- the lens holder 60 is mounted to the circuit board assembly 10, and the lens 20 is mounted to the lens holder 60 such that the lens 20 is supported above the circuit board assembly 10.
- the circuit board assembly 10 can be coupled to the electronic device for use with the electronic device.
- the filter 40 comprises a filter body 41, at least one absorption filter layer 42, and a two-coat layer 43, wherein the absorption filter layer 42 is located by a coating method.
- a surface of the filter body 41 is described.
- the coating layer 43 is on the other surface of the filter body 41 and the surface of the absorption filter layer 42, respectively.
- the filter body 41, the absorbing filter layer 42, and the two coating layers 43 form a sandwich structure, wherein the absorbing filter layer 42 is located at the filter body 41.
- the upper surface, the two coating layers 43 are respectively located on the upper surface of the absorption filter layer 42 and the lower surface of the filter body 41.
- the absorption filter layer 42 can also be two layers, that is, respectively located on the upper and lower surfaces of the filter body 41. Therefore, the two coating layers 43 are respectively located on the two absorption filter layers 42.
- the absorption filter layer 42 may be located on a lower surface of the filter body 41, and the coating layer 43 is respectively located on a lower surface of the absorption filter layer 42 and the filter body.
- the group achieves both the function of filtering and the thinning of the overall structure.
- the filter body 41 may be made of a resin, a plastic or a glass material.
- the absorption filter layer 42 is a compound having an absorption property, particularly a characteristic of absorption in the near-infrared spectrum, wherein the near-infrared spectrum is in the range of 565 nm to 1200 nm.
- the absorption filter layer 42 is formed by coating and baking a liquid material on the filter body 41, wherein the coating method can be selected by immersion or centrifugal spin coating. Such as physical vapor deposition techniques or chemical vapor deposition techniques, this is not a limitation of the present invention.
- the filter 40 can be processed by coating or baking by imposition or wafer level work to improve product production efficiency and reduce manufacturing cost.
- the absorptive filter layer 42 may be coated as a single layer, a double layer or a plurality of layers, which is not limited by the invention. More specifically, the filter module 40 is added to the imaging system of the camera module to block the infrared light of the imaging system partially interfering with the imaging quality by using the absorption filter layer 42 to make the camera module The resulting image is more in line with the best feeling of the human eye.
- the compound may be the same as the infrared absorbing layer 22 in the above embodiment, which is preferably a solvent-soluble pigment compound, more preferably selected from the group consisting of a phthalocyanine compound, a squaraine lanthanide compound, and naphthoquinone. At least one of the group consisting of a cyanine compound, a hexavalent porphyrin compound, a ketone oxime compound, and a cyanine compound. Therefore, when the compound is applied to the filter body 41 as the absorption filter layer 42, it may be applied as a single layer, a double layer or a plurality of layers.
- a solvent-soluble pigment compound more preferably selected from the group consisting of a phthalocyanine compound, a squaraine lanthanide compound, and naphthoquinone.
- a phthalocyanine-based compound a squaraine-based ruthenium-based compound, a naphthalocyanine-based compound, a hexa-valent porphyrin-based compound, a ketone oxime-based compound, and a cyanine compound
- One or more kinds are applied to the filter body 41, that is, a compound having an absorbing property is applied to the filter body 41.
- R a , R b and Y in the formula I satisfy the conditions of the following (a) or (b)
- R a independently representing a hydrogen atom, a halogen atom, a sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a pity acid group, a -L 1 or a -NR e R f group.
- R e and R f each independently represent a hydrogen atom, -L a , -L b , -L c , -L d or -L e .
- the plurality of R b present independently represent a hydrogen atom, a halogen atom sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a pity acid group, a -L 1 or a -NR g R h group.
- R g and R h each independently represent a hydrogen atom, -L a , -L b , -L c , -L d or -L e or -C(O)R i group (R i represents -L a , -L b , -L c , -L d or -L e ).
- R j and R k each independently represent a hydrogen atom, -L a , -L b , -L c , -L d or -L e .
- L 1 is L a , L b , L c , L d , L e , L f , L g or L h .
- the L a to L h represent the following groups:
- L a may have an aliphatic hydrocarbon group having a carbon number of 1 to 12 of the substituent L
- L b may have a substituent L of a halogen-substituted alkyl group having 1 to 12 carbon atoms
- L c may have a substituent L of an alicyclic hydrocarbon group having 3 to 14 carbon atoms
- L d may have an aromatic hydrocarbon group having a substituent L of 6 to 14 carbon atoms
- L e may have a substituent L of a heterocyclic group having 3 to 14 carbon atoms
- L f may have a substituent A having an alkoxy group having 1 to 9 carbon atoms
- L g may have an acyl group having a substituent L of 1 to 9 carbon atoms
- L h L may have a substituent group having a carbon number of alkoxycarbonyl group having 1 to 9
- the substituent 1 is an aromatic hydrocarbon group selected from the group consisting of an aliphatic hydrocarbon group having 1 to 12 carbon atoms, a halogen-substituted alkyl group having 1 to 12 carbon atoms, an alicyclic hydrocarbon group having 3 to 14 carbon atoms, and an aromatic group having 6 to 14 carbon atoms. At least one of a group consisting of a hydrocarbon group, a heterocyclic group having 3 to 14 carbon atoms, a halogen atom, a sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a pity acid group, and an amino group.
- the total number of carbon atoms including the substituent is preferably 50 or less, more preferably 40 or less, and particularly preferably 30 or less.
- the carbon number is more than the above range, it may be difficult to synthesize a compound, and the absorption intensity per unit weight of light tends to be small.
- At least one of the two R a on one benzene ring is bonded to Y on the same benzene ring to form a hetero ring having at least one nitrogen atom and having 5 or 6 atoms.
- the heterocyclic ring may have a substituent, and R b and R a not participating in the formation of the heterocyclic ring are each independently synonymous with R b and RR a of the condition (a).
- Examples of the aliphatic hydrocarbon group having 1 to 12 carbon atoms in the L a and L include methyl (Me), ethyl (Et), n-propyl (n-Pr), and isopropyl (i).
- -Pr n-butyl (n-Bu), sec-butyl (s-Bu), tert-butyl (t-Bu), pentyl, hexyl, octyl, decyl, decyl and dodecyl Alkyl; vinyl, 1-propenyl, 2-propenyl, butenyl, 1,3-butadienyl, 2-methyl-1-propenyl, 2-pentenyl, hexenyl and octyl
- An alkenyl group such as an alkenyl group
- an alkynyl group such as an ethynyl group, a propynyl group, a butynyl group, a 2-methyl
- Examples of the halogen-substituted alkyl group having 1 to 12 carbon atoms in the L b and L include trichloromethyl, trifluoromethyl, 1,1-dichloroethyl, pentachloroethyl and five. Fluoroethyl, heptachloropropyl and heptafluoropropyl.
- Examples of the alicyclic hydrocarbon group having 3 to 14 carbon atoms in L c and L include a cycloalkyl group such as a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, a cycloheptyl group and a cyclooctyl group; A polycyclic alicyclic group such as an alkyl group or an adamantyl group.
- Examples of the aromatic hydrocarbon group having 6 to 14 carbon atoms in the L d and L include a phenyl group, a tolyl group, a xylyl group, a mesityl group, a cumenyl group, a 1-naphthyl group, and 2 Naphthyl, onion, phenanthryl, anthryl, phenalenyl, tetraamendyl, indanyl and biphenyl.
- heterocyclic group having 3 to 14 carbon atoms of L e and L examples include, for example, furan, porphin, pyrrole, pyrazole, imidazole, triazole, oxazole, oxadiazole, thiazole, and thiadiazole.
- Examples of the alkoxy group having a carbon number of -12 in the L f include a methoxy group, an ethoxy group, a n-propoxy group, an isopropoxy group, a butoxy group, a pentyloxy group, and a hexyloxy group. , octyloxy.
- Examples of the acyl group having 1 to 9 carbon atoms in the L g include an acetyl group, a propionyl group, a butyryl group, an isobutyryl group, a valeryl group, an isovaleryl group, and a benzoyl group.
- alkoxycarbonyl group having 1 to 9 carbon atoms in the L h examples include a methoxycarbonyl group, an ethoxycarbonyl group, a propoxycarbonyl group, an isopropoxycarbonyl group, a butoxycarbonyl group, and a pentyl group.
- Oxycarbonyl, hexyloxycarbonyl and octyloxycarbonyl examples include a methoxycarbonyl group, an ethoxycarbonyl group, a propoxycarbonyl group, an isopropoxycarbonyl group, a butoxycarbonyl group, and a pentyl group.
- L a is preferably methyl, ethyl, n-propyl, isopropyl, n-butyl, sec-butyl, tert-butyl, pentyl, hexyl, octyl, 4-phenylbutyl, 2-
- the cyclohexylethyl group is more preferably a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a n-butyl group, a sec-butyl group or a t-butyl group.
- the L b is preferably trichloromethyl, pentachloroethyl, trifluoromethyl, pentafluoroethyl, 5-cyclohexyl-2,2,3,3-tetrafluoropentyl, more preferably trichloro Methyl, pentachloroethyl, trifluoromethyl, pentafluoroethyl.
- the L c is preferably a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, a 4-ethylcyclohexyl group, a cyclooctyl group or a 4-phenylcycloheptyl group, more preferably a cyclopentyl group, a cyclohexyl group or a 4-ethyl group.
- a phenyl group, a 1-naphthyl group, a 2-naphthyl group, a tolyl group, a xylyl group, a mesityl group, a cumenyl group, a 3,5-di-tert-butylphenyl group, and 4 are preferable.
- the L e is preferably a group containing furan, thiophene, pyrrole, anthracene, porphyrin, pyrene, benzofuran, benzothiophene, morpholine, and more preferably contains furan, thiophene, pyrrole, or a group of porphyrins.
- a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group, a butoxy group, a methoxymethyl group, a methoxyethyl group, a 2-phenylethoxy group, and 3 are preferable.
- the L g is preferably acetyl, propionyl, butyryl, isobutyryl, benzoyl, 4-propylbenzoyl or trifluoromethylcarbonyl, more preferably acetyl, propionyl or benzoyl.
- the L h is preferably a methoxycarbonyl group, an ethoxycarbonyl group, a propoxycarbonyl group, an isopropoxycarbonyl group, a butoxycarbonyl group, a 2-trifluoromethylethoxycarbonyl group, or a 2-phenylethoxy group.
- the carbonyl group is more preferably a methoxycarbonyl group or an ethoxycarbonyl group.
- the L a to L h may further have at least one atom or group selected from the group consisting of a halogen atom, a sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a phosphoric acid group, and an amino group.
- a halogen atom e.g., a fluoride
- a sulfo group e.g., a sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a phosphoric acid group, and an amino group.
- 4-sulfobutyl group, 4-cyanobutyl group, 5-carboxypentyl group, 5-aminopentyl group, 3-hydroxypropyl group, 2-phosphorylethyl group, and 6-amino group are mentioned.
- R a in the condition (a) is preferably a hydrogen atom, a chlorine atom, a fluorine atom, a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a n-butyl group, a sec-butyl group, a t-butyl group or a ring.
- the hexyl group, the phenyl group, the hydroxyl group, the amino group, the dimethylamino group, and the nitro group are more preferably a hydrogen atom, a chlorine atom, a fluorine atom, a methyl group, an ethyl group, a n-propyl group, an isopropyl group or a hydroxyl group.
- R b in the condition (a) is preferably a hydrogen atom, a chlorine atom, a fluorine atom, a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a n-butyl group, a sec-butyl group, a t-butyl group or a ring.
- the Y is preferably an amino group, a methylamino group, a dimethylamino group, a diethylamino group, a di-n-propylamino group, a diisopropylamino group, a di-n-butylamino group or a di-tert-butylamino group.
- the number of constituent atoms including at least one nitrogen atom formed by bonding at least one of two R a on one benzene ring in the condition (b) of the formula I to the Y on the same benzene ring is 5
- the heterocyclic ring of 6 or more include pyrrolidine, pyrrole, imidazole, pyrazole, piperidine, pyridine, piperazine, pyridazine, pyrimidine and pyrazine.
- a heterocyclic ring constituting the heterocyclic ring and constituting one of the carbon atoms of the benzene ring is a nitrogen atom, and more preferably a pyrrolidine.
- X independently represents 0, S, Se, NR c or C(R d R d ), and a plurality of R c independently represent a hydrogen atom, L a , L b , Lc, L d Or L e , a plurality of R d independently represent a hydrogen atom, a halogen atom sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a phosphate group, a -L 1 or a -NR e R f group, and an adjacent R d may be linked to each other to form a ring may have a substituent group, L a ⁇ L e, L 1, L a R e and R f in the formula I as defined in ⁇ L e, L 1, R e , and R f Synonymous.
- a hydrogen atom, a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a n-butyl group, a sec-butyl group, a tert-butyl group, a n-pentyl group, a n-hexyl group, and a ring are preferable.
- a hydrogen atom, a chlorine atom, a fluorine atom, a methyl group, an ethyl group, a n-propyl group, an isopropyl butyl group, a sec-butyl group, a t-butyl group, a n-pentyl group or a n-hexyl group are preferable.
- cyclohexyl phenyl, methoxy, trifluoromethyl, pentafluoroethyl, 4-aminocyclohexyl, more preferably hydrogen, chlorine, fluorine, methyl, ethyl, n-propyl, iso Propyltrifluoromethyl, pentafluoroethyl.
- the X is preferably 0, S, Se, N-Me, N-Et, CH 2 , C-Me 2 or C-Et 2 , and more preferably S, C-Me 2 or C-Et 2 .
- adjacent R d are bonded to each other to form a ring.
- a ring include a benzopyridinium ring, an ⁇ -naphthylimidazole ring, a ⁇ -naphthylimidazole ring, an ⁇ -naphthoxazole ring, a ⁇ -naphthoxazole ring, and an ⁇ -naphthyl group.
- the compound, Formula III represents the phthalocyanine-based compound.
- ⁇ represents two hydrogen atoms, two monovalent metal atoms, a divalent metal atom, or a substituted metal atom containing a trivalent or tetravalent metal atom, and a plurality of R a , R b , R c are present.
- R d are independently represented by a hydrogen atom, a halogen atom, a hydroxyl group, a carboxyl group, a nitro group, an amino group, an amide group, an imide group, a cyano group, a silane group, -L 1 , -SL 2 , -SS-L.
- R a , R b , R c and R d bonded to the same aromatic ring is not a hydrogen atom.
- the amino group, the amide group, the imide group, and the silane group may have the substituent L defined in the formula I,
- L 2 represents a hydrogen atom or any of L a to L e defined in the formula I,
- L 3 represents a hydroxyl group or any of the above L a to L e ,
- L 4 represents any of the above L a to L e .
- the circuit board assembly 10 includes a bracket 101 and a circuit board 12 that is mounted or integrally sealed to the circuit board 12, such as in this embodiment of the invention,
- the bracket 101 is implemented as a molded bracket 11 .
- the circuit board assembly 10 includes a molded bracket 11 and a circuit board 12 , and the molded bracket 11 is integrally packaged and connected to the circuit board 12 . It is molded to the circuit board 12 as molded. More specifically, the molded holder 11 is molded and attached to the wiring board 12 by molding in a mold (Molding On Board, MOB), and the molding process may be a process such as injection molding or molding.
- MOB Manufacturing On Board
- the molded stent 11 has a film-drawing slope which is inclined on the inner surface of the molding. That is to say, in this manner, after the molded bracket 11 is integrally sealed to the wiring board 12, it is easy to release the mold and prevent stray light.
- the molded bracket 11 of the circuit board assembly 10 can be used to support the driver 30. That is to say, in the assembly process of the conventional camera module using the bracket supporting the driver, the bracket and the circuit board are glued together by the glue, and the present invention is integrally molded on the circuit board assembly 10 by molding.
- the molded bracket 11 supports the driver 30.
- the molded bracket 11 can also be used to support the filter 40.
- the circuit board 12 includes a circuit board main body 121, and the molded bracket 11 is integrally connected to the circuit board main body 121.
- the molded bracket 11 forms a through hole 111 such that the molded bracket 11 surrounds the outside of the photosensitive chip 30 and provides a light path of the lens 20 and the photosensitive chip 50.
- the photosensitive chip 50 is disposed on the circuit board main body 121 at a position corresponding to the through hole 111.
- the molded bracket 11 is convexly surrounding the outer side of the photosensitive chip 50, in particular, the molded bracket 11 is integrally closed and connected, so that it has a good sealing property, so that when When the lens 20 is mounted on the photosensitive path of the photosensitive chip 50, the photosensitive chip 50 is sealed inside to form a corresponding closed inner space.
- a conventional wiring board can be selected as the wiring board main body 121, and molding is performed on the surface of the wiring board main body 121.
- the circuit board after performing the SMT process may be integrally packaged to form the molded bracket 11 by an injection molding machine using an injection molding machine, or The molded bracket 11 is formed by a molding process such as molding or transfer molding which is commonly used in a semiconductor package.
- SMT process Surface Mount Technology surface mount process
- the molded bracket 11 is formed by a molding process such as molding or transfer molding which is commonly used in a semiconductor package.
- each of the photosensitive chips 50 is attached to the wiring board main body 121, and then the photosensitive chips 50 are electrically connected to the wiring board main body 121, for example, by a gold wire.
- the circuit board main body 121 may be selected, for example, but not limited to, a soft and hard bonding board, a ceramic substrate (without a soft board), a PCB hard board (without a soft board), an FPCB flexible wiring board, and the like.
- the manner in which the molded bracket 11 is formed may be selected, for example, but not limited to, an injection molding process, a molding process, and the like.
- the mold holder 11 can be selected from materials such as, but not limited to, nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene, polypropylene), etc. for the injection molding process, and the molding process can be adopted. Epoxy resin. It should be understood by those skilled in the art that the foregoing alternatives and the materials that can be selected are merely illustrative of the embodiments of the invention and are not intended to be limiting.
- the process of manufacturing the circuit board assembly 10 may be performed by performing an SMT process on the circuit board main body 121, and then mounting the photosensitive chip 50 on the circuit board main body 121. And electrically connecting the photosensitive chip 50 to the circuit board main body 121, such as a gold wire electrical connection, and then integrally packaging the circuit board main body 121, such as a molded package, by insert molding.
- the molded bracket 11 is formed by the molding bracket 11, or by a molding process commonly used in a semiconductor package. It will be understood by those skilled in the art that the order of manufacture of the circuit board assembly 10 is not a limitation of the present invention.
- the photosensitive chip 50 is attached to the wiring board 12 of the wiring board assembly 10 through a series of leads 53.
- the lead 53 may be implemented as, for example but not limited to, a gold wire, a copper wire, an aluminum wire, a silver wire.
- the photosensitive chip 50 and the circuit board 12 may also be in other manners, such as soldering, conductive adhesive bonding, and the like.
- the filter 40 is mounted to the molded support 11, and based on the molding process, good surface flatness can be obtained, and thus the filter 40 can be provided
- the flat mounting condition and the integrally formed manner make the molding bracket 11 less prone to offset and tilting, so as to provide stable and flat mounting conditions for the filter 40, thereby reducing the filtering.
- the top surface 112 of the molded stent 11 extends integrally planarly, and the filter 40 is mounted to the top surface 112 of the molded stent 11.
- the filter 40 may be attached to the top surface 112 of the molded stent 11 by bonding.
- the driver 30 is mounted to the molded bracket 11 of the circuit board assembly 10. Further, the driver 30 is mounted to the top surface 112 of the molded bracket 11, that is, the filter 40 and the driver 30 coordinate with each other to occupy the molded bracket 11 The top surface 112 is described.
- the photosensitive chip 50 is disposed on an upper surface of the wiring board main body 121, and the molded bracket 11 surrounds an outer side of the photosensitive chip 50.
- the photosensitive chip 50 may be first mounted on the circuit board main body 121, and then in the On the outside of the photosensitive chip 50, the molded holder 11 is molded on the wiring board main body 121.
- the molded holder 11 may be molded on the circuit board main body 121, and then the photosensitive chip 50 may be mounted on the circuit board main body 121. Located inside the molded bracket 11.
- the present invention further provides an infrared absorption structure processing method for a camera module, which includes the following steps:
- the coating method is a physical vapor deposition technique such as immersion or centrifugal spin coating or a chemical vapor deposition technique.
- the filter body 41 is made of a resin material.
- the absorption filter layer 42 is an organic material and has a characteristic of absorption in the near-infrared spectrum, wherein the near-infrared spectrum is in the band of 565 nm to 1200 nm.
- step (a) wherein the absorptive filter layer 42 is a liquid material.
- 31 and 32 are a first modified embodiment of a camera module according to a fourth preferred embodiment of the present invention, wherein the molded bracket 11 is illustrated to simultaneously package the circuit board 12 and the photosensitive Chip 50, that is, MOC (molding on chip).
- the filter 40 is directly above the photosensitive chip 50 and integrally molded via the molded bracket 11. That is, the photosensitive chip 50 is attached to the circuit board main body 121 of the circuit board assembly 10, and then the photosensitive chips 50 are electrically connected to the circuit board main body 121, and then the filter is applied. After the light sheet 40 is placed over the photosensitive chip 50, it is integrally packaged, such as a molded package or formed by a molding process commonly used in a semiconductor package.
- the filter 40 is mounted to the top surface 112 of the molded bracket 11.
- the filter 40 may be attached to the top surface 112 of the molded stent 11 by bonding.
- the molded stent 11 has a film-drawing slope which is inclined on the inner surface of the molding. That is to say, in this manner, after the molded bracket 11 is integrally sealed to the wiring board 12, it is easy to release the mold and prevent stray light.
- the molded bracket 11 has a mounting groove 113A that communicates with the through hole 111 to provide a sufficient installation space for the filter 40. That is, the top surface 112A of the molded bracket 11 has a stepped structure, and does not extend integrally. The steps of the top surface 112A can be used to mount the filter 40 and the lens 20 . Or the driver 30.
- the mounting slot 113A can be used to mount the filter 40, and in other implementations of the invention, the mounting slot 113A can be used to mount the driver 30 of the camera module or the lens 20 and the like, it will be understood by those skilled in the art that the use of the mounting groove 113A is not a limitation of the present invention.
- the height of the mounting groove 113A is greater than the thickness of the filter 40, so that when the filter 40 is mounted on the mounting groove 113A, the filter 40 does not protrude from the The top end of the bracket 11 is molded.
- the filter 40 has a square shape
- the shape of the mounting groove 113A is adapted to the shape of the filter 40. That is, the mounting groove 113A has a square ring shape and communicates with the through hole 111.
- the moving focus module is taken as an example in the drawing, and in other embodiments of the present invention, the camera module may be a certain focus module, which should be understood by those skilled in the art. Yes, the type of camera module is not a limitation of the present invention.
- the camera module includes a seat 70B for mounting the filter 40.
- the holder 70B is mounted to the molded bracket 11, and the driver 30 or the lens 20 is mounted to the holder 70B.
- the holder 70B has a first seating groove 71B and a second seating groove 72B, and the filter 40 is mounted to the first seating groove 71B so that The bottom surface of the filter 40 is lower than the top end of the holder 70B.
- the second seating groove 72B is mounted to the molded bracket 11 such that the molded bracket 11 extends upward along the holder 70B, and the position of the filter 40 is relatively downward, thereby reducing The back focus of the camera module.
- the holder 70B extends into the through hole 111 and extends downward to support the filter 40 above the photosensitive chip 30, effectively utilizing the space in the through hole 111.
- the filter 40 When the filter 40 is stably mounted, the filter 40 does not occupy an external space.
- the inwardly extending position of the holder 70B is outside the photosensitive route of the photosensitive chip 30, that is, the holder 70B does not block the photosensitive area of the photosensitive chip 30.
- the size of the holder 70B can be specifically designed.
- a moving focus module is described as an example.
- the lens 20 is mounted to the driver 30, and the driver 30 is mounted to the holder 70B. That is, the holder 70B provides a mounting position for the filter 40 and the driver 30.
- the camera module may also be a fixed focus module.
- the lens 20 is mounted to the holder 70B, that is, the holder 70B provides a mounting position for the filter 40 and the lens 20, as will be understood by those skilled in the art.
- the specific structure of the holder 70B and the type of the camera module are not limitations of the present invention.
- FIG. 35 it is a fourth modified embodiment of the camera module according to the fourth preferred embodiment of the present invention, in which the arrangement position of the filter 40 is explained.
- the molded bracket 11 has a mounting groove 113C, and the mounting groove 113C communicates with the through hole 111. That is, the top surface 112C of the molded bracket 11 has a stepped structure and does not extend integrally.
- the camera module includes a seat 70C for mounting the filter 40.
- the holder 70C is mounted to the molded bracket 11, and the driver 30 or the lens 20 is mounted to the molded bracket 11.
- the holder 70C is mounted to the mounting groove 113C of the molded bracket 11, and the height of the mounting groove 113C is greater than the mounting height of the holder 70C, so that the holder 70C does not Projecting from the end of the molded bracket 11.
- the holder 70C has a first seating groove 71C and a second seating groove 72C.
- the filter 40 is mounted to the first holder groove 71C such that the surface of the filter 40 does not protrude from the top end of the holder 70C.
- the second seating groove 72C is mounted to the mounting groove 113C such that the molded bracket 11 extends upward along the support 70C, and the position of the filter 40 is relatively downward, thereby reducing the position The back focus of the camera module.
- the support 70C may not have the second seat groove 72C, and the flat bottom surface of the support 72C is directly attached to the molded bracket 11.
- the inwardly extending position of the holder 70C is outside the photosensitive route of the photosensitive chip 50, that is, the holder 70C does not block the photosensitive chip 50 to avoid affecting the object.
- the photosensitive process of the photosensitive chip 50, the size of the support 70C can be designed according to specific needs.
- the second seating groove 71C and the mounting groove 113C of the package cooperate with each other to form a matching snap-fit structure, so that the support 70C is stably mounted on the support 70C.
- the filter 40 in this embodiment is smaller than the photosensitive chip 50, and the camera module having a smaller back focus can be obtained.
- a moving focus module is described as an example.
- the lens 20 is mounted to the driver 30, and the driver 30 is mounted to the molded bracket 11. That is, the holder 70C provides a mounting position for the filter 40, and the molded bracket 11 provides a mounting position for the driver 30.
- the camera module may also be a fixed focus module.
- the lens 20 is mounted to the molded bracket 11, that is, the mount 70C provides a mounting position for the filter 40, and the molded bracket 11 provides a mounting position for the driver 30. It will be understood by those skilled in the art that the specific structure of the holder 70C and the molded bracket 11 and the type of the camera module are not limited by the present invention.
- the filter 40 is mounted to the driver 30D such that when the driver 30D is mounted to the molded bracket 11, it provides a flat mounting condition for the driver 30D, And the driver 30D is mounted to support the filter 40 such that the camera module does not need to provide additional components to mount the filter 40.
- the driver 30D includes a lower end portion 31D that is adapted to be mounted to the filter 40. That is, the lens 20 is attached to the upper end of the driver 30D, and the filter 40 is attached to the lower end portion 31D of the driver 30D, below the lens 50.
- the driver 30D includes an upper end portion 32D that is adapted to be mounted to the filter 40. That is, the lens 20 is mounted to the lower end of the driver 30D, and the filter 40 is mounted to the upper end portion 32D of the driver 30D, above the lens 50. In particular, the filter 40 is located in front of the lens 20 of the camera module for incident filtering.
- the filter 40 is mounted to the lens 20E, wherein the lens 20E includes at least one lens barrel 923E and at least one lens 921E, and each of the lenses 921E is mounted on the lens Inside the lens barrel 923E, the filter 40 is press-fitted into the lens barrel 923E of the lens 20E.
- the lens barrel 923E includes a bottom portion 9231E for mounting the color filter 40.
- the bottom portion 9231E of the lens barrel 923E is adapted to the shape of the filter 40 to facilitate mounting the filter 40 therein.
- the upper portion of the lens barrel 923E is used to mount the lens 921E, and the shape of the lens 921E is adapted, and the lower portion is used to mount the filter 40, and is adapted to the shape of the filter 40.
- the driver 30 is mounted to the molded bracket 11, and the filter 40 is mounted to the barrel 923E, so that no additional components need to be provided to mount the filter 40.
- the lens barrel 923E includes a top portion 9232E for mounting the color filter 40.
- the top portion 9232E of the lens barrel 923E is adapted to the shape of the filter 40 to facilitate mounting the filter 40 therein.
- the lower portion of the lens barrel 923E is used to mount the lens 921E, and the shape of the lens 921E is adapted, and the upper portion is used to mount the filter 40, and is adapted to the shape of the filter 40.
- the driver 30 is mounted to the molded bracket 11, and the filter 40 is mounted to the barrel 923E, so that no additional components need to be provided to mount the filter 40.
- the filter 40 can be placed in front of the lens 20 of the camera module for incident filtering.
- the lens 20E includes two lens barrels 923E that are engaged with each other and that the filter 40 is attached to one of the lens barrels 923E to achieve a filtering effect.
- a seventh modified embodiment of the image pickup module according to the fourth preferred embodiment of the present invention in which the mounting manner of the photosensitive chip 50 and the installation position of the filter 40 are explained.
- the photosensitive chip 50 is mounted on the circuit board assembly 10 by a flip chip type FC (Flip Chip).
- the circuit board 12 includes a circuit board main body 121F having a passage 1211F, and a lower portion of the passage 1211F is adapted to mount the photosensitive chip 30.
- the via 1211F causes the upper and lower sides of the wiring board main body 121F to communicate, so that when the photosensitive chip 50 is mounted on the back surface of the wiring board main body 121F and the photosensitive area is mounted upward on the wiring board main body 121F,
- the photosensitive area of the photosensitive chip 50 is capable of receiving light entering by the lens 20.
- this embodiment adopts a chip mounting method different from the conventional one, that is, a flip chip type FC (Flip Chip).
- the conventional chip mounting method is to mount the photosensitive chip 50 above the circuit board assembly 10.
- the Flip Chip is mounted on the circuit board assembly 10 from the back side of the circuit board assembly 10, and the photosensitive area of the photosensitive chip 50 is mounted upward.
- the structure and the mounting manner of the embodiment are such that the photosensitive chip 50 and the molded bracket 11 are relatively independent, and the mounting of the photosensitive chip 50 is not affected by the molded bracket 11, and the molded bracket 11 is The influence of the molding on the photosensitive chip 50 is also small.
- the manner in which the photosensitive chip 50 is mounted is not a limitation of the present invention.
- the circuit board main body 121F has an outer recess 1212F, and the outer recess 1212F communicates with the corresponding passage to provide a mounting position of the photosensitive chip 50.
- the outer surface of the photosensitive chip 50 is not higher than the outer surface of the wiring board main body 121F, thereby securing the circuit board assembly 10 Surface flatness.
- the filter 40 is mounted on the upper end of the passage 1211F, that is, the filter 40 covers the passage 1211F of the circuit board main body 121F, and does not need to be
- the filter 40 is mounted on the molded bracket 11 to greatly reduce the back focus of the camera module and reduce the height of the camera module. That is, the filter 40 is mounted to the wiring board main body 121F without providing additional components.
- a camera module is an imaging module based on an infrared absorption structure.
- the camera module can be implemented as a dynamic focus camera module or a fixed focus camera module, wherein the main difference is that the focus camera module can change the focal length through the focus device. This embodiment is described with a moving focus camera module.
- the camera module based on the infrared absorbing structure in the present invention comprises a circuit board assembly 10, a lens 20, a driver 30, and a sensor chip 50.
- the lens 20 is located in the photosensitive path of the photosensitive chip 50, so that when the camera module is used to collect an image of an object, the light reflected by the object can be further processed by the photosensitive chip after being processed by the lens 10. 50 accepted to be suitable for photoelectric conversion.
- the circuit board assembly 10 includes a circuit board and a bracket that can be mounted or integrally packaged on the circuit board.
- the circuit board assembly 10 includes a molded bracket 11 And a circuit board 12, the photosensitive chip 50 is electrically connected to the circuit board 12.
- the driver 30 is mounted to the circuit board assembly 10, and the lens 20 is mounted to the driver 30 such that the lens 20 is supported above the circuit board assembly 10.
- the circuit board assembly 10 can form the molded bracket 11 by molding for supporting the driver 30. That is to say, in the assembly process of the conventional camera module using the bracket supporting the driver, the bracket and the circuit board are glued together by the glue, and the present invention is integrally molded on the circuit board assembly 10 by molding.
- the molded bracket 11 can also cover and protect the electronic components located on the circuit board 12.
- the molding method is divided into MOB (molding on board) and MOC (molding on chip), wherein MOB (molding on board) is integrally formed on the circuit board 12, and MOMC (molding on chip) is integrally formed in the The circuit board 12 and the photosensitive chip 50 are mounted.
- the photosensitive chip 50 may also be mounted on the circuit board assembly 10 and integrally formed by the molded bracket 11. Therefore, the molding method is not limited by the invention.
- the photosensitive chip 50 comprises at least one chip body 51 and an absorption filter layer 42 , wherein the absorption filter layer 42 is located on the outer surface of the chip body 51 , that is, the photosensitive surface.
- the chip absorption filter layer 42 is a compound having an absorption property, particularly a characteristic of absorption in a near-infrared spectrum, wherein the near-infrared spectrum is in the range of 565 nm to 1200 nm.
- the absorption filter layer 42 is formed by coating and baking a liquid material on the chip body 51, wherein the coating method can select immersion, centrifugal force spin coating and the like. Vapor deposition techniques or chemical vapor deposition techniques are also limitations of the invention.
- the infrared absorption structure of the camera module is formed by the absorption filter layer 42 of the photosensitive chip 50, and the conventional filter can be further saved, so that the camera can be made.
- the module not only achieves the function of filtering but also reduces the structure to make the overall structure of the camera module thin.
- the photosensitive chip 50 can coat and bake the absorption filter layer 42 by imposition or wafer level work to improve product production efficiency and reduce manufacturing cost.
- the compound is preferably a solvent-soluble pigment compound, and more preferably selected from the group consisting of a phthalocyanine compound, a squaraine lanthanide compound, a naphthalocyanine compound, a hexavalent porphyrin compound, and a ketone. At least one of the group consisting of a lanthanide compound and a cyanine compound. Therefore, when the compound is applied to the chip body 51 as the absorption filter layer 42, it may be applied as a single layer, a double layer or a plurality of layers.
- a phthalocyanine-based compound a squaraine-based ruthenium-based compound, a naphthalocyanine-based compound, a hexa-valent porphyrin-based compound, a ketone oxime-based compound, and a cyanine compound
- One or more kinds are applied to the chip body 51, that is, a compound having an absorbing property is applied to the chip body 51.
- R a , R b and Y in the formula I satisfy the conditions of the following (a) or (b)
- R a independently representing a hydrogen atom, a halogen atom, a sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a pity acid group, a -L 1 or a -NR e R f group.
- R e and R f each independently represent a hydrogen atom, -L a , -L b , -L c , -L d or -L e .
- the plurality of R b present independently represent a hydrogen atom, a halogen atom sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a pity acid group, a -L 1 or a -NR g R h group.
- R g and R h each independently represent a hydrogen atom, -L a , -L b , -L c , -L d or -L e or -C(O)R i group (R i represents -L a , -L b , -L c , -L d or -L e ).
- R j and R k each independently represent a hydrogen atom, -L a , -L b , -L c , -L d or -L e .
- L 1 is L a , L b , L c , L d , L e , L f , L g or L h .
- the L a to L h represent the following groups:
- L a may have an aliphatic hydrocarbon group having a carbon number of 1 to 12 of the substituent L
- L b may have a substituent L of a halogen-substituted alkyl group having 1 to 12 carbon atoms
- L c may have a substituent L of an alicyclic hydrocarbon group having 3 to 14 carbon atoms
- L d may have an aromatic hydrocarbon group having a substituent L of 6 to 14 carbon atoms
- L e may have a substituent L of a heterocyclic group having 3 to 14 carbon atoms
- L f may have a substituent A having an alkoxy group having 1 to 9 carbon atoms
- L g may have an acyl group having a substituent L of 1 to 9 carbon atoms
- L h may have alkoxycarbonyl group having a substituent of L of 1 to 9 carbon atoms
- the substituent 1 is an aromatic hydrocarbon group selected from the group consisting of an aliphatic hydrocarbon group having 1 to 12 carbon atoms, a halogen-substituted alkyl group having 1 to 12 carbon atoms, an alicyclic hydrocarbon group having 3 to 14 carbon atoms, and an aromatic group having 6 to 14 carbon atoms. At least one of a group consisting of a hydrocarbon group, a heterocyclic group having 3 to 14 carbon atoms, a halogen atom, a sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a pity acid group, and an amino group.
- the total number of carbon atoms including the substituent is preferably 50 or less, more preferably 40 or less, and particularly preferably 30 or less.
- the carbon number is more than the above range, it may be difficult to synthesize a compound, and the absorption intensity per unit weight of light tends to be small.
- At least one of the two R a on one benzene ring is bonded to Y on the same benzene ring to form a hetero ring having at least one nitrogen atom and having 5 or 6 atoms.
- the heterocyclic ring may have a substituent, and R b and R a not participating in the formation of the heterocyclic ring are each independently synonymous with R b and RR a of the condition (a).
- X independently represents 0, S, Se, NR c or C(R d R d ), and a plurality of R c independently represent a hydrogen atom, L a , L b , L c , L d or L e , a plurality of R d independently represent a hydrogen atom, a halogen atom sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a phosphate group, a -L 1 or a -NR e R f group, adjacent R d may be bonded to each other to form a ring which may have a substituent, and L a to L e , L 1 , R e and R f and L a to L e , L 1 , R e and R as defined in the above formula I f is synonymous.
- the compound, Formula III represents the phthalocyanine-based compound.
- ⁇ represents two hydrogen atoms, two monovalent metal atoms, a divalent metal atom, or a substituted metal atom containing a trivalent or tetravalent metal atom, and a plurality of R a , R b , R c are present.
- R d are independently represented by a hydrogen atom, a halogen atom, a hydroxyl group, a carboxyl group, a nitro group, an amino group, an amide group, an imide group, a cyano group, a silane group, -L 1 , -SL 2 , -SS-L.
- R a , R b , R c and R d bonded to the same aromatic ring is not a hydrogen atom.
- the amino group, the amide group, the imide group, and the silane group may have the substituent L defined in the formula I,
- L 2 represents a hydrogen atom or any of L a to L e defined in the formula I,
- L 3 represents a hydroxyl group or any of the above L a to L e ,
- L 4 represents any of the above L a to L e .
- a conventional chip mounting method may be adopted, or a chip mounting method different from the conventional chip mounting method, that is, a Flip Chip.
- the conventional chip mounting method is to mount the photosensitive chip 50 above the circuit board assembly 10.
- the flip chip type FC (Flip Chip) is mounted on the circuit board assembly 10 from the back side of the circuit board assembly 10, and the photosensitive area of the photosensitive chip 50 faces upward. Mounted to the circuit board assembly 10.
- Such a structure and mounting manner are such that the photosensitive chip 50 and the molded holder 11 are relatively independent, and the mounting of the photosensitive chip 50 is not affected by the molded bracket 11, and the mold of the molded bracket 11 The influence of the molding on the photosensitive chip 50 is also small.
- the manner in which the photosensitive chip 50 is mounted is not a limitation of the present invention.
- the present invention further provides a method for manufacturing an infrared absorption structure of a camera module, which comprises the following steps:
- the coating method is a physical vapor deposition technique such as immersion or centrifugal spin coating or a chemical vapor deposition technique.
- the absorption filter layer 42 is an organic material and has a characteristic of absorption in the near-infrared spectrum, wherein the near-infrared spectrum is in the band of 565 nm to 1200 nm.
- step (a) wherein the absorptive filter layer 42 is a liquid material prior to coating.
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Abstract
Provided is a camera module based on an infrared absorption structure, comprising: a circuit board, a lens head, and a photosensitive chip; said photosensitive chip is electrically connected to said circuit board; said lens head is located on the photosensitive path of the photosensitive chip; the lens head comprises at least one lens, and one or a plurality of lenses of said at least one lens is an infrared absorption lens and is arranged in the lens tube such that the lens head forms an infrared-absorbing lens head, thereby achieving near-infrared spectral absorption performance.
Description
本发明涉及一摄像模组领域，尤其涉及一红外吸收结构和基于红外吸收结构的摄像模组及其应用，其中将具有近红外光谱吸收特性的材料设于镜片、滤光片或感光芯片，以使所述摄像模组达到图像色彩还原的效果。The invention relates to the field of a camera module, in particular to an infrared absorption structure and an imaging module based on an infrared absorption structure and an application thereof, wherein a material having a near infrared absorption characteristic is disposed on a lens, a filter or a photosensitive chip, The camera module is brought to an image color reproduction effect.
CCD和CMOS广泛应用在数位摄影，但是由于CCD和CMOS本身能够感应红外线的特性，使得在不搭配使用红外截止滤光片时所获得的图像会偏绿，与人眼观察到的非常不一致。因此，在摄像模组中大部份都通过所述红外截止滤光片来达到图像色彩还原的效果，使得获得的图像与人眼观察到的色彩一致。CCD and CMOS are widely used in digital photography, but because CCD and CMOS can sense the characteristics of infrared rays, the image obtained when the infrared cut filter is not used will be greenish, which is very inconsistent with the human eye. Therefore, most of the camera modules pass through the infrared cut filter to achieve image color reproduction, so that the obtained image is consistent with the color observed by the human eye.
如图1所示，是传统一摄像模组示意图。该摄像模组包括一线路板组件1P、一感光芯片2P、一支架3P、一红外截止滤光片4P、一马达5P和一镜头6P。该感光芯片2P被安装于该线路板组件1P，该红外截止滤光片4P被安装于该支架3P，该镜头6P被安装于该马达5P，该马达5P被安装于该支架3P，以便于该镜头6P位于该感光芯片2P上方。另外，该摄像模组的该感光芯片2P大多采用电荷耦合组件(CCD，Charge Couple Device)和互补式金属氧化半导体(CMOS，Complementary Metal Oxide Semiconductor)的感测器。As shown in FIG. 1 , it is a schematic diagram of a conventional camera module. The camera module includes a circuit board assembly 1P, a light sensing chip 2P, a bracket 3P, an infrared cut filter 4P, a motor 5P and a lens 6P. The photosensitive chip 2P is mounted to the circuit board assembly 1P, the infrared cut filter 4P is mounted to the bracket 3P, the lens 6P is mounted to the motor 5P, and the motor 5P is mounted to the bracket 3P to facilitate the The lens 6P is located above the photosensitive chip 2P. In addition, the sensor chip 2P of the camera module mostly uses a charge coupled device (CCD) and a complementary metal oxide semiconductor (CMOS, Complementary Metal Oxide Semiconductor) sensor.
但是，随着现今许多科技产品微型化的发展，更多的终端产品更要求轻薄化，然而传统摄像模组的红外截止滤光片为在普通玻璃上镀膜以达到红外截止的效果，随着摄像模组的发展，进一步地通过将蓝玻璃上镀膜来代替传统红外截止滤光片。由于蓝玻璃基材本身有近红外光吸收特性，从而通过芯片的接收，在红光上的吸收效果接近人眼对红光的感知。随着高像素超薄模组的发展，相对于蓝玻璃厚度的要求越来越薄，但是由于其加工工艺难度较大、成本高，且尺寸无法减薄到0.14mm以下，并且有易碎特性等均存在着局限。因此，传统摄像模组的红外截止滤光片或蓝玻璃作为的光片在一定程度上限制了摄像模组向轻薄化的发展。所以本发明通过新型红外吸收结构，应用于摄像模组中，以解决蓝玻璃易碎、 不能减薄的问题，从而突破摄像模组在轻薄化发展中的限制。However, with the development of many miniaturization of technology products today, more end products are required to be lighter and thinner. However, the infrared cut filter of the conventional camera module is coated on ordinary glass to achieve the infrared cutoff effect, with the camera. The development of the module further replaces the traditional infrared cut filter by coating the blue glass. Since the blue glass substrate itself has near-infrared light absorption characteristics, the absorption effect on the red light is close to the human eye's perception of red light through the reception of the chip. With the development of high-pixel ultra-thin modules, the requirements for the thickness of blue glass are getting thinner and thinner, but because of the difficulty in processing and high cost, the size cannot be reduced to less than 0.14 mm, and there is fragile characteristics. There are limitations in everything. Therefore, the infrared cut filter or the blue glass of the conventional camera module limits the development of the camera module to a certain extent to a certain extent. Therefore, the present invention is applied to a camera module through a novel infrared absorbing structure to solve the problem that the blue glass is fragile and cannot be thinned, thereby breaking the limitation of the camera module in the development of thin and light.
发明内容Summary of the invention
本发明的一个目的在于提供一基于红外吸收镜头结构的摄像模组，其中将具有近红外光谱吸收特性的材料涂于镜片上，使其镜头变成红外吸收镜头结构，从而去除传统的滤光片或使滤光片可以更薄。An object of the present invention is to provide a camera module based on an infrared absorption lens structure, wherein a material having a near-infrared absorption characteristic is applied to a lens, and the lens is changed into an infrared absorption lens structure, thereby removing the conventional filter. Or make the filter thinner.
本发明的另一目的在于提供一基于红外吸收镜头结构的摄像模组，其中通过具有近红外光谱吸收特性的有机材料制成所述镜头的所述镜片，使其镜头变成红外吸收镜头结构，从而去除传统的滤光片或使滤光片可以更薄。Another object of the present invention is to provide a camera module based on an infrared absorption lens structure, wherein the lens of the lens is made of an organic material having near-infrared spectroscopy absorption characteristics, and the lens is changed into an infrared absorption lens structure. Thereby removing the conventional filter or making the filter thinner.
本发明的另一目的在于提供一基于红外吸收镜头结构的摄像模组，采用本发明的红外吸收镜头，摄像模组成像效果优于具有传统红外滤光片的摄像模组，并和具有蓝玻璃滤光片的摄像模组的成像效果相当，故可满足现电子设备的摄像模组高像素的影像要求，同时相对节省电子设备的摄像模组的生产成本，和结构厚度。Another object of the present invention is to provide a camera module based on an infrared absorption lens structure, which adopts the infrared absorption lens of the invention, and the imaging module has better imaging effect than the camera module with the traditional infrared filter, and has blue glass. The imaging module of the filter has the same imaging effect, so that it can meet the high-pixel image requirements of the camera module of the current electronic device, and at the same time save the production cost and structural thickness of the camera module of the electronic device.
本发明的另一目的在于提供一基于红外吸收镜头结构的摄像模组，其中并无改变摄像模组的结构和组装方式。因此，本发明在不改变镜头结构下，进一步地达到滤光效果和轻薄化摄像模组的结构。Another object of the present invention is to provide a camera module based on an infrared absorption lens structure, in which the structure and assembly manner of the camera module are not changed. Therefore, the present invention further achieves the filtering effect and the structure of the thin and light camera module without changing the lens structure.
本发明的另一目的在于提供一基于红外吸收镜头结构的摄像模组，其中应用于高像素摄像模组时可取消蓝玻璃滤光片。因此，吸收式镜头结构，相当于使近红外吸收结构的光学系统前移，可将滤光片厚度减薄至<1mm。Another object of the present invention is to provide a camera module based on an infrared absorption lens structure, wherein the blue glass filter can be eliminated when applied to a high pixel camera module. Therefore, the absorption lens structure is equivalent to moving the optical system of the near-infrared absorbing structure forward, and the thickness of the filter can be reduced to <1 mm.
本发明的一个目的在于提供一基于红外吸收结构的摄像模组，其中将具有近红外光谱吸收特性的有机材料或化合物涂于滤光片或感光芯片，以使所述摄像模组达到图像色彩还原的效果，从而在一定程度上满足所述摄像模组超薄化趋势要求，特别是针对于手机的摄像模组。An object of the present invention is to provide an imaging module based on an infrared absorption structure, wherein an organic material or compound having near-infrared absorption characteristics is applied to a filter or a photosensitive chip, so that the camera module achieves image color reproduction. The effect is to meet the requirements of the ultra-thinning trend of the camera module to a certain extent, especially for the camera module of the mobile phone.
本发明的另一目的在于提供一基于红外吸收结构的摄像模组，其中通过具有近红外光谱吸收特性的有机材料或化合物，使得成像效果优于传统红外滤光片，并和蓝玻璃成像效果相当，故可满足现手机的摄像模组高像素的影像要求，同时相对节省手机的摄像模组的生产成本，有效占据市场优势。Another object of the present invention is to provide an imaging module based on an infrared absorption structure, wherein an organic material or compound having near-infrared absorption characteristics makes an imaging effect superior to that of a conventional infrared filter, and is equivalent to blue glass imaging. Therefore, it can meet the high-pixel image requirements of the camera module of the current mobile phone, and at the same time save the production cost of the camera module of the mobile phone, effectively occupying the market advantage.
本发明的另一目的在于提供一基于红外吸收结构的摄像模组，其中通过具有近红外光谱吸收特性的有机材料，使适用于日夜两用型摄像模组，并且在白天成 像效果和蓝玻璃相当，优于传统的日夜两用型摄像模组成像效果。Another object of the present invention is to provide a camera module based on an infrared absorbing structure, wherein an organic material having a near-infrared spectroscopy absorption property is suitable for a day/night camera module, and the imaging effect during daytime is comparable to that of blue glass. It is superior to the traditional day and night camera module imaging effect.
为达到以上至少一个目的，本发明基于红外吸收镜头结构的摄像模组，其包括：至少一线路板，至少一镜头，至少一感光芯片，其中所述感光芯片电连接于所述线路板，所述镜头位于所述感光芯片的感光路径，其中所述镜头包括至少一镜片和至少一镜筒，其中所述至少一镜片中的一个或多个镜片为红外吸收镜片并设置于所述镜筒，以使所述镜头形成一红外吸收式镜头，从而达到近红外光谱吸收效果。In order to achieve the above at least one object, the present invention is based on an infrared absorption lens structure camera module, comprising: at least one circuit board, at least one lens, at least one photosensitive chip, wherein the photosensitive chip is electrically connected to the circuit board, The lens is located in a photosensitive path of the photosensitive chip, wherein the lens comprises at least one lens and at least one lens barrel, wherein one or more of the at least one lens is an infrared absorption lens and is disposed on the lens barrel, The lens is formed into an infrared absorption lens to achieve near-infrared absorption.
本发明还提供一镜头，其中所述镜头包括至少一镜片，其中所述至少一镜片中的一个或多个镜片为红外吸收镜片以使所述镜头形成一红外吸收式镜头，从而达到近红外光谱吸收效果。The present invention also provides a lens, wherein the lens comprises at least one lens, wherein one or more of the at least one lens is an infrared absorbing lens to form the lens into an infrared absorbing lens to achieve near infrared spectroscopy Absorption effect.
为达到以上至少一个目的，本发明还提供一摄像模组，包括：In order to achieve the above at least one object, the present invention further provides a camera module, including:
至少一线路板组件，至少一镜头，和至少一感光芯片，其中所述感光芯片电连接于所述线路板组件，所述镜头位于所述感光芯片的感光路径，其中所述感光芯片包括至少一芯片本体和至少一吸收式滤光层，其中所述吸收式滤光层位于所述芯片本体的感光面，从而提供所述摄像模组进行滤光。At least one circuit board assembly, at least one lens, and at least one photosensitive chip, wherein the photosensitive chip is electrically connected to the circuit board assembly, the lens is located in a photosensitive path of the photosensitive chip, wherein the photosensitive chip includes at least one a chip body and at least one absorption filter layer, wherein the absorption filter layer is located on a photosensitive surface of the chip body, thereby providing the camera module to filter.
为达到以上至少一个目的，本发明还提供一摄像模组，包括：至少一线路板组件，至少一镜头，至少一感光芯片，以及至少一滤光片，其中所述感光芯片电连接于所述线路板组件上，所述镜头位于所述感光芯片的感光路径，所述滤光片设置于所述镜头的光行经路径或所述感光芯片的感光路径，其中所述滤光片包括一滤光片本体和至少一吸收式滤光层，其中所述吸收式滤光层位于所述滤光片本体的至少一表面，从而通过所述滤光片设置于所述摄像模组以进行滤光。In order to achieve the above at least one object, the present invention further provides a camera module comprising: at least one circuit board assembly, at least one lens, at least one photosensitive chip, and at least one filter, wherein the photosensitive chip is electrically connected to the On the circuit board assembly, the lens is located in a photosensitive path of the photosensitive chip, and the filter is disposed on a light path of the lens or a photosensitive path of the photosensitive chip, wherein the filter includes a filter a sheet body and at least one absorbing filter layer, wherein the absorbing filter layer is located on at least one surface of the filter body, and is disposed on the camera module through the filter for filtering.
本发明的另一方面提供一摄像模组的红外吸收结构制程方法，其中包括如下步骤：Another aspect of the present invention provides a method for manufacturing an infrared absorption structure of a camera module, which includes the following steps:
(a)涂覆吸收式滤光层于镜片；以及(a) applying an absorbing filter layer to the lens;
(b)烘烤所述吸收式滤光层于所述镜片。(b) baking the absorptive filter layer to the lens.
本发明的另一方面还提供另一摄像模组的红外吸收结构制程方法，其中包括如下步骤：Another aspect of the present invention provides a method for manufacturing an infrared absorption structure of another camera module, which includes the following steps:
(a)涂覆吸收式滤光层于芯片本体；以及(a) coating an absorptive filter layer on the chip body;
(b)烘烤所述吸收式滤光层于所述芯片本体。(b) baking the absorptive filter layer on the chip body.
图1是传统摄像模组剖视图。1 is a cross-sectional view of a conventional camera module.
图2A是根据本发明的第一个优选实施例的基于红外吸收镜头结构的摄像模组的结构剖视图，其中说明变焦摄像模组。2A is a cross-sectional view showing the structure of a camera module based on an infrared absorption lens structure according to a first preferred embodiment of the present invention, in which a zoom camera module is illustrated.
图2B是根据本发明的第一个优选实施例的基于红外吸收镜头结构的摄像模组的结构剖视图，其中说明定焦摄像模组。2B is a cross-sectional view showing the structure of a camera module based on an infrared absorption lens structure according to a first preferred embodiment of the present invention, in which a fixed focus camera module is illustrated.
图3是根据本发明的第一个优选实施例的基于红外吸收镜头结构的摄像模组的结构剖视图。3 is a cross-sectional view showing the structure of a camera module based on an infrared absorption lens structure according to a first preferred embodiment of the present invention.
图4是根据本发明的第一个优选实施例的基于红外吸收镜头结构的摄像模组的单一镜片示意图，其中说明红外吸收层涂覆于所述镜片的外表面。4 is a schematic view of a single lens of a camera module based on an infrared absorption lens structure in accordance with a first preferred embodiment of the present invention, wherein an infrared absorbing layer is applied to an outer surface of the lens.
图5是根据本发明的第一个优选实施例中wafer level加工镜片的示意图，其中说明所述红外吸收层为液体材料，且通过离心力旋涂于镜片。Figure 5 is a schematic illustration of a wafer level processing lens in accordance with a first preferred embodiment of the present invention, wherein the infrared absorbing layer is illustrated as a liquid material and is spin coated onto the lens by centrifugal force.
图6是根据本发明的第一个优选实施例的第一变形实施例的摄像模组的结构剖视图。Figure 6 is a cross-sectional view showing the structure of a camera module according to a first modified embodiment of the first preferred embodiment of the present invention.
图7是根据本发明的第一个优选实施例的第一变形实施例的摄像模组的结构剖视图。Figure 7 is a cross-sectional view showing the structure of a camera module according to a first modified embodiment of the first preferred embodiment of the present invention.
图8是根据本发明的第一个优选实施例的第一变形实施例的摄像模组的结构剖视图。Figure 8 is a cross-sectional view showing the structure of a camera module according to a first modified embodiment of the first preferred embodiment of the present invention.
图9是根据本发明的第一个优选实施例的第二变形实施例的摄像模组的结构剖视图。Figure 9 is a cross-sectional view showing the structure of a camera module according to a second modified embodiment of the first preferred embodiment of the present invention.
图10是根据本发明的第一个优选实施例的第二变形实施例的摄像模组的结构剖视图。Figure 10 is a cross-sectional view showing the structure of a camera module according to a second modified embodiment of the first preferred embodiment of the present invention.
图11是根据本发明的第一个优选实施例的第三变形实施例的摄像模组的结构剖视图。Figure 11 is a cross-sectional view showing the structure of a camera module according to a third modified embodiment of the first preferred embodiment of the present invention.
图12是根据本发明的第一个优选实施例的第三变形实施例的摄像模组的结构剖视图。Figure 12 is a cross-sectional view showing the structure of a camera module according to a third modified embodiment of the first preferred embodiment of the present invention.
图13是根据本发明的第一个优选实施例的第三变形实施例的摄像模组的结构剖视图。Figure 13 is a cross-sectional view showing the structure of a camera module according to a third modified embodiment of the first preferred embodiment of the present invention.
图14是根据本发明的第一个优选实施例的第三变形实施例的的摄像模组的结构剖视图。Figure 14 is a cross-sectional view showing the structure of a camera module according to a third modified embodiment of the first preferred embodiment of the present invention.
图15是根据本发明的第一个优选实施例的第三变形实施例的摄像模组的结构剖视图。Figure 15 is a cross-sectional view showing the structure of a camera module according to a third modified embodiment of the first preferred embodiment of the present invention.
图16是根据本发明的第一个优选实施例的第四变形实施例的摄像模组的结构剖视图。Figure 16 is a cross-sectional view showing the structure of a camera module according to a fourth modified embodiment of the first preferred embodiment of the present invention.
图17是根据本发明的第二个优选实施例的基于红外吸收镜头结构的摄像模组的结构剖视图。Figure 17 is a cross-sectional view showing the structure of a camera module based on an infrared absorption lens structure in accordance with a second preferred embodiment of the present invention.
图18是根据本发明的第二个优选实施例的基于红外吸收镜头结构的摄像模组的结构剖视图。Figure 18 is a cross-sectional view showing the structure of a camera module based on an infrared absorption lens structure in accordance with a second preferred embodiment of the present invention.
图19是根据本发明的第二个优选实施例的的摄像模组的结构剖视图。阐明分体式镜头，其具有多个镜筒。Figure 19 is a cross-sectional view showing the structure of a camera module in accordance with a second preferred embodiment of the present invention. A split lens is illustrated that has multiple barrels.
图20是根据本发明的第二个优选实施例的第一变形实施例的摄像模组的结构剖视图。Figure 20 is a cross-sectional view showing the structure of a camera module according to a first modified embodiment of the second preferred embodiment of the present invention.
图21是根据本发明的第三个优选实施例的基于红外吸收镜头结构的摄像模组的结构剖视图。Figure 21 is a cross-sectional view showing the structure of a camera module based on an infrared absorption lens structure in accordance with a third preferred embodiment of the present invention.
图22是根据本发明的第三个优选实施例的基于红外吸收镜头结构的摄像模组的结构剖视图。Figure 22 is a cross-sectional view showing the structure of a camera module based on an infrared absorption lens structure in accordance with a third preferred embodiment of the present invention.
图23是根据本发明的第三个优选实施例的的摄像模组的结构剖视图。Figure 23 is a cross-sectional view showing the structure of a camera module in accordance with a third preferred embodiment of the present invention.
图24是根据本发明的第三个优选实施例的第一变形实施例的的摄像模组的结构剖视图。Figure 24 is a cross-sectional view showing the structure of a camera module according to a first modified embodiment of the third preferred embodiment of the present invention.
图25是根据本发明的第三个优选实施例的第二变形实施例的的摄像模组的结构剖视图。Figure 25 is a cross-sectional view showing the structure of a camera module according to a second modified embodiment of the third preferred embodiment of the present invention.
图26是根据本发明的第四个优选实施例的摄像模组含有红外吸收结构的滤光片的结构剖视图，其中说明变焦摄像模组。Figure 26 is a cross-sectional view showing the structure of a filter module including an infrared absorbing structure according to a fourth preferred embodiment of the present invention, in which a zoom camera module is illustrated.
图27是根据本发明的第四个优选实施例的摄像模组含有红外吸收结构的滤光片的结构剖视图，其中说明定焦摄像模组。Figure 27 is a cross-sectional view showing the structure of a filter module including an infrared absorbing structure according to a fourth preferred embodiment of the present invention, in which a fixed focus camera module is illustrated.
图28是根据本发明的第四个优选实施例中吸收式滤光层涂布加工在滤光片上的示意图。Figure 28 is a schematic illustration of an absorbing filter coating process on a filter in accordance with a fourth preferred embodiment of the present invention.
图29是根据本发明的第四个优选实施例中吸收式滤光层涂布加工在滤光片后镀膜的示意图。Figure 29 is a schematic view showing the coating of the absorption filter layer after the filter in accordance with the fourth preferred embodiment of the present invention.
图30是根据本发明的第四个优选实施例中wafer level加工滤光片的示意 图，其中说明所述吸收式滤光层为液体材料，且通过离心力旋涂于滤光片本体。Figure 30 is a schematic illustration of a wafer level processing filter in accordance with a fourth preferred embodiment of the present invention, wherein the absorptive filter layer is a liquid material and is spin coated onto the filter body by centrifugal force.
图31是根据本发明的第四个优选实施例的摄像模组的第一变形实施例的结构剖视图。说明线路板组件、滤光片和感光芯片被同时塑模。Figure 31 is a cross-sectional view showing the structure of a first modified embodiment of a camera module in accordance with a fourth preferred embodiment of the present invention. It is indicated that the circuit board assembly, the filter and the photosensitive chip are simultaneously molded.
图32是根据本发明的第四个优选实施例的摄像模组的第一变形实施例的结构剖视图。说明线路板组件和感光芯片被同时塑模。Figure 32 is a cross-sectional view showing the structure of a first modified embodiment of a camera module in accordance with a fourth preferred embodiment of the present invention. It is indicated that the circuit board assembly and the photosensitive chip are simultaneously molded.
图33是根据本发明的第四个优选实施例的摄像模组的第二变形实施例的结构剖视图。说明滤光片放置于模制支架的安装槽。Figure 33 is a cross-sectional view showing the structure of a second modified embodiment of the camera module in accordance with a fourth preferred embodiment of the present invention. The filter is placed in the mounting groove of the molded bracket.
图34是根据本发明的第四个优选实施例的摄像模组的第三变形实施例的结构剖视图。说明模塑的顶表面为一体平面的延伸，且支座位于所述顶表面上支撑滤光片。Figure 34 is a cross-sectional view showing the structure of a third modified embodiment of the camera module in accordance with a fourth preferred embodiment of the present invention. It is stated that the top surface of the molding is an integral planar extension, and the support is located on the top surface to support the filter.
图35是根据本发明的第四个优选实施例的摄像模组的第四变形实施例的结构剖视图。说明支座位于安装槽上支撑滤光片。Figure 35 is a cross-sectional view showing the structure of a fourth modified embodiment of the camera module in accordance with a fourth preferred embodiment of the present invention. The support is located on the mounting groove to support the filter.
图36是根据本发明的第四个优选实施例的摄像模组的第五变形实施例的结构剖视图。说明滤光片装置于驱动器的下端部。Figure 36 is a cross-sectional view showing the structure of a fifth modified embodiment of the camera module in accordance with a fourth preferred embodiment of the present invention. The filter device is illustrated at the lower end of the driver.
图37是根据本发明的第四个优选实施例的摄像模组的第五变形实施例的结构剖视图。说明滤光片装置于驱动器的上端部。Figure 37 is a cross-sectional view showing the structure of a fifth modified embodiment of the camera module in accordance with a fourth preferred embodiment of the present invention. The filter device is illustrated at the upper end of the driver.
图38是根据本发明的第四个优选实施例的摄像模组的第六变形实施例的结构剖视图。说明滤光片装置于镜筒的底部部。Figure 38 is a cross-sectional view showing the structure of a sixth modification of the camera module in accordance with a fourth preferred embodiment of the present invention. The filter device is illustrated at the bottom of the lens barrel.
图39是根据本发明的第四个优选实施例的摄像模组的第六变形实施例的结构剖视图。说明滤光片装置于镜筒的顶部。Figure 39 is a cross-sectional view showing the structure of a sixth modification of the image pickup module according to the fourth preferred embodiment of the present invention. The filter device is placed on the top of the lens barrel.
图40是根据本发明的第四个优选实施例的摄像模组的第七变形实施例的结构剖视图。说明感光芯采用芯片倒装方式FC安装于线路板组件。Figure 40 is a cross-sectional view showing the structure of a seventh modified embodiment of the camera module in accordance with a fourth preferred embodiment of the present invention. The photosensitive core is mounted on the circuit board assembly by flip chip FC.
图41是根据本发明的第五个优选实施例的摄像模组含有红外吸收结构的感光芯片的结构剖视图。Figure 41 is a cross-sectional view showing the structure of a photosensitive chip including an infrared absorbing structure of a camera module according to a fifth preferred embodiment of the present invention.
图42是根据本发明的第五个优选实施例中wafer level加工感光芯片的示意图。Figure 42 is a schematic illustration of a wafer level processing photosensitive chip in accordance with a fifth preferred embodiment of the present invention.
图43是根据发明的优选实施例的吸收式滤光层的透过率光谱示意图。Figure 43 is a schematic illustration of the transmittance spectrum of an absorbing filter layer in accordance with a preferred embodiment of the present invention.
以下描述用于揭露本发明以使本领域技术人员能够实现本发明。以下描述中 的优选实施例只作为举例，本领域技术人员可以想到其他显而易见的变型。在以下描述中界定的本发明的基本原理可以应用于其他实施方案、变形方案、改进方案、等同方案以及没有背离本发明的精神和范围的其他技术方案。The following description is presented to disclose the invention to enable those skilled in the art to practice the invention. The preferred embodiments in the following description are by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention as defined in the following description may be applied to other embodiments, modifications, improvements, equivalents, and other embodiments without departing from the spirit and scope of the invention.
本领域技术人员应理解的是，在本发明的揭露中，术语“纵向”、“横向”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”等指示的方位或位置关系是基于附图所示的方位或位置关系，其仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或组件必须具有特定的方位、以特定的方位构造和操作，因此上述术语不能理解为对本发明的限制。It should be understood by those skilled in the art that in the disclosure of the present invention, the terms "longitudinal", "transverse", "upper", "lower", "front", "back", "left", "right", " The orientation or positional relationship of the indications of "upright", "horizontal", "top", "bottom", "inside", "outside", etc. is based on the orientation or positional relationship shown in the drawings, which is merely for convenience of description of the present invention and The above description of the present invention is not to be construed as a limitation of the invention.
可以理解的是，术语“一”应理解为“至少一”或“一个或多个”，即在一个实施例中，一个组件的数量可以为一个，而在另外的实施例中，该组件的数量可以为多个，术语“一”不能理解为对数量的限制。It will be understood that the term "a" is understood to mean "at least one" or "one or more", that is, in one embodiment, the number of one component can be one, and in another embodiment, the component The number can be multiple, and the term "a" cannot be construed as limiting the quantity.
如图2A至图5所示，是根据本发明的第一个优选实施例的基于红外吸收镜头结构的摄像模组，所述摄像模组可以是一变焦摄像模组，其中包括一线路板组件10，一镜头20、一驱动器30，一滤光片40和一感光芯片50。所述镜头20位于所述感光芯片50的感光路径，从而在所述摄像模组用于采集物体的影像时，被物体反射的光线能够在藉由所述镜头20的处理之后进一步被所述感光芯片50接受以适于进行光电转化。所述滤光片40设置于所述镜头20的光行经路径和所述感光芯片50之间，并且所述感光芯片50电连接于所述线路板组件10上。所述驱动器30被安装于所述线路板组件10，所述镜头20被安装于所述驱动器30，以使得所述镜头20被支撑于所述线路板组件10上方。值得一提的是，所述驱动器30可实施为马达、热驱动器或微制动器(MEMS)等。As shown in FIG. 2A to FIG. 5, a camera module based on an infrared absorption lens structure according to a first preferred embodiment of the present invention, the camera module may be a zoom camera module including a circuit board assembly. 10. A lens 20, a driver 30, a filter 40 and a sensor chip 50. The lens 20 is located in the photosensitive path of the photosensitive chip 50, so that when the camera module is used to collect an image of an object, the light reflected by the object can be further subjected to the light sensing after being processed by the lens 20. Chip 50 is accepted to be suitable for photoelectric conversion. The filter 40 is disposed between the light path of the lens 20 and the photosensitive chip 50, and the photosensitive chip 50 is electrically connected to the circuit board assembly 10. The driver 30 is mounted to the circuit board assembly 10, and the lens 20 is mounted to the driver 30 such that the lens 20 is supported above the circuit board assembly 10. It is worth mentioning that the driver 30 can be implemented as a motor, a thermal driver or a micro-brake (MEMS) or the like.
值得一提的，本发明的所述摄像模组亦可实施为一定焦摄像模组，其与所述动焦摄像模组的主要差异在于所述动焦摄像模组通过对焦装置可改变焦距。可以理解的，所述红外吸收镜头结构的所述摄像模组并不因所述摄像模组的类型而受影响，因此，不管是定焦或变焦的摄像模组并不为本发明的限制。如图2B所示，本发明中基于红外吸收结构的所述摄像模组包括一线路板组件10，一镜头20，一滤光片40，一感光芯片50和一镜头支架60。所述镜头20位于所述感光芯片50的感光路径，从而在所述摄像模组用于采集物体的影像时，被物体反射的光线能够在藉由所述镜头20的处理之后进一步被所述感光芯片50接受以适于进行光电转化。所述滤光片40设置于所述镜头20的光行经路径或所述感光芯片50 的感光路径。所述感光芯片50电连接于所述线路板组件10上。所述镜头支架60被安装于所述线路板组件10，所述镜头20被安装于所述镜头支架60，以使得所述镜头20被支撑于所述线路板组件10上方。所述线路板组件10可以被耦接至所述电子设备，从而与所述电子设备配合使用。It is worth mentioning that the camera module of the present invention can also be implemented as a fixed focus camera module, and the main difference between the camera module and the focus camera module is that the focus camera module can change the focal length through the focus device. It can be understood that the camera module of the infrared absorption lens structure is not affected by the type of the camera module. Therefore, the camera module regardless of the focus or zoom is not limited by the present invention. As shown in FIG. 2B, the camera module based on the infrared absorbing structure of the present invention comprises a circuit board assembly 10, a lens 20, a filter 40, a photosensitive chip 50 and a lens holder 60. The lens 20 is located in the photosensitive path of the photosensitive chip 50, so that when the camera module is used to collect an image of an object, the light reflected by the object can be further subjected to the light sensing after being processed by the lens 20. Chip 50 is accepted to be suitable for photoelectric conversion. The filter 40 is disposed on a light path of the lens 20 or a photosensitive path of the photosensitive chip 50. The photosensitive chip 50 is electrically connected to the circuit board assembly 10. The lens holder 60 is mounted to the circuit board assembly 10, and the lens 20 is mounted to the lens holder 60 such that the lens 20 is supported above the circuit board assembly 10. The circuit board assembly 10 can be coupled to the electronic device for use with the electronic device.
根据本发明的实施例，所述线路板组件10包括一支架101和一线路板12，所述支架101可以贴装或一体封装于所述线路板12。如这个实施例中，所述支架101通过模塑方式形成一模制支架11于一线路板12上。进一步地说，所述模制支架11一体地封装连接于所述线路板12。特别地，所述模制支架11亦可将位于所述线路板组件10上的电子组件包覆保护之。具体地，在制造所述线路板组件10时，可以选择一传统的线路板作为一线路板主体121，其中在所述线路板主体121表面进行模塑。比如，在一实施例中，可以用注塑机，通过嵌入成型(Insert Molding)工艺将进行SMT工艺(Surface Mount Technology表面贴装工艺)后的线路板进行一体封装形成所述模制支架11，或通过半导体封装中常用的模压或模塑等模制工艺形成所述模制支架11。所述线路板主体121可以选择为，举例地但不限于，软硬结合板、陶瓷基板(不带软板)、PCB硬板(不带软板)等。所述模制支架11形成的方式可以选择为，举例地但不限于，注塑工艺、模压工艺等。所述模制支架11可以选择的材料为，举例地但不限于，注塑工艺可以选择尼龙、LCP(Liquid Crystal Polymer，液晶高分子聚合物)、PP(Polypropylene，聚丙烯)等，模压工艺可以采用环氧树脂。本领域技术人员应当理解的是，前述可以选择的制造方式以及可以选择的材料，仅作为举例说明本发明的可以实施的方式，并不是本发明的限制。值得一提的，所述模制支架11具有一拔膜斜度，其在模塑内表面呈倾斜的。也就是说，这样方式，使所述模制支架11一体封于所述线路板12后，容易脱模制造和防止杂散光。According to an embodiment of the invention, the circuit board assembly 10 includes a bracket 101 and a circuit board 12 that can be mounted or integrally packaged on the circuit board 12. As in this embodiment, the bracket 101 is molded to form a molded bracket 11 on a wiring board 12. Further, the molded bracket 11 is integrally packaged and connected to the circuit board 12. In particular, the molded bracket 11 can also protect the electronic components located on the circuit board assembly 10. Specifically, in manufacturing the circuit board assembly 10, a conventional wiring board can be selected as a wiring board main body 121 in which molding is performed on the surface of the wiring board main body 121. For example, in an embodiment, the circuit board after performing the SMT process (Surface Mount Technology surface mount process) may be integrally packaged to form the molded bracket 11 by an injection molding machine using an injection molding machine, or The molded holder 11 is formed by a molding process such as molding or molding which is commonly used in semiconductor packaging. The circuit board main body 121 may be selected, for example, but not limited to, a soft and hard bonding board, a ceramic substrate (without a soft board), a PCB hard board (without a soft board), and the like. The manner in which the molded bracket 11 is formed may be selected, for example, but not limited to, an injection molding process, a molding process, and the like. The mold holder 11 can be selected from materials such as, but not limited to, nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene, polypropylene), etc. for the injection molding process, and the molding process can be adopted. Epoxy resin. It should be understood by those skilled in the art that the foregoing alternatives and the materials that can be selected are merely illustrative of the embodiments of the invention and are not intended to be limiting. It is worth mentioning that the molded stent 11 has a film-drawing slope which is inclined on the inner surface of the molding. That is to say, in this manner, after the molded bracket 11 is integrally sealed to the wiring board 12, it is easy to release the mold and prevent stray light.
根据本发明的这个实施例，所述线路板组件10的所述模制支架11可用于支撑所述驱动器30。也就是说，相对传统摄像模组利用支架支撑驱动器的组装制程中，还需通过胶水贴合支架和线路板的方式，本发明则是通过模塑方式一体成型于所述线路板组件10的所述模制支架11支撑所述驱动器30。另外，所述模制支架11亦可用于支撑所述滤光片40。According to this embodiment of the invention, the molded bracket 11 of the circuit board assembly 10 can be used to support the driver 30. That is to say, in the assembly process of the conventional camera module using the bracket supporting the driver, the bracket and the circuit board are glued together by the glue, and the present invention is integrally molded on the circuit board assembly 10 by molding. The molded bracket 11 supports the driver 30. In addition, the molded bracket 11 can also be used to support the filter 40.
在本发明的这个优选实施例中，所述驱动器30和所述滤光片40被安装于所述模制支架11，并且基于模塑工艺，能够得到良好的表面平整性，因此能够为 所述驱动器30和所述滤光片40提供平整的安装条件，且一体成型的方式，使得所述模制支架11不易出现偏移、倾斜现象，以便于为所述驱动器30和所述滤光片40提供稳定、平整的安装条件，进而减小所述驱动器30和所述滤光片40安装时的累积公差。进一步地说，如图2A所示，所述模制支架11的顶表面112一体平面延伸，所述驱动器30和所述滤光片40被安装于所述模制支架11的所述顶表面112。也就是说，所述滤光片40和所述驱动器30相互协调占用所述模制支架11的所述顶表面112。另外，如图3所示，所述模制支架11的所述顶表面112还可以是呈台阶状结构，而并不是一体延伸。也就是说，所述模制支架11具有一安装槽113，其供安装所述滤光片40，并且在所述顶表面112的台阶上还可用于安装所述驱动器30。In this preferred embodiment of the invention, the driver 30 and the filter 40 are mounted to the molded bracket 11, and based on the molding process, good surface flatness can be obtained, and thus The driver 30 and the filter 40 provide flat mounting conditions and are integrally formed such that the molded bracket 11 is less prone to offset and tilting, so as to facilitate the driver 30 and the filter 40. Stable, flat mounting conditions are provided to further reduce the cumulative tolerances of the driver 30 and the filter 40 when installed. Further, as shown in FIG. 2A, the top surface 112 of the molded bracket 11 is integrally planarly extended, and the driver 30 and the filter 40 are mounted to the top surface 112 of the molded bracket 11. . That is, the filter 40 and the driver 30 coordinately occupy the top surface 112 of the molded bracket 11. In addition, as shown in FIG. 3, the top surface 112 of the molded bracket 11 may also be a stepped structure rather than being integrally extended. That is, the molded bracket 11 has a mounting groove 113 for mounting the filter 40, and can also be used to mount the driver 30 on the step of the top surface 112.
根据本发明的这个实施例，所述镜头20包括至少一镜片21，至少一红外吸收层22以及一镜筒23，其中所述红外吸收层22涂覆于所述镜片21的外表面。各所述镜片21被安装于所述镜筒23内。所述红外吸收层22可以为具有存在近红外光谱吸收特性的材料。因此，可以理解的，通过所述红外吸收层22阻挡成像系统部分干扰成像质量的红外光，使得所述摄像模组所成影像更加符合人眼的最佳感觉。According to this embodiment of the invention, the lens 20 includes at least one lens 21, at least one infrared absorbing layer 22, and a lens barrel 23, wherein the infrared absorbing layer 22 is applied to the outer surface of the lens 21. Each of the lenses 21 is mounted in the lens barrel 23. The infrared absorbing layer 22 may be a material having a near-infrared spectral absorption characteristic. Therefore, it can be understood that the infrared absorbing layer 22 blocks the infrared light of the imaging system partially interfering with the imaging quality, so that the image formed by the camera module is more in line with the best feeling of the human eye.
特别地，当所述镜头20包括多个镜片21时，所述红外吸收层22可根据实际需求涂覆于所述镜片21的表面。值得一提的是，所述表面可以是物侧面或像侧面。也就是说，所述红外吸收层22可以只涂覆于所述镜片21的物侧面或像侧面，或者可以涂覆于所述镜片21的两个表面。另外，所述红外吸收层22亦可以只涂覆于一个所述镜片21或同时涂覆于多个所述镜片21，其中所述红外吸收层22亦可选则涂覆于装置于所述镜筒23内的最外、中间或最内的所述镜片21涂覆所述红外吸收层22。换言之，所述镜头20可以采用一枚或多枚涂覆有所述红外吸收层22的所述镜片21，依实际需求进行组装而成。本领域技术人员应当理解的是，前述可以选择的制造或组装方式，仅作为举例说明本发明的可以实施的方式，并不是本发明的限制。In particular, when the lens 20 includes a plurality of lenses 21, the infrared absorbing layer 22 may be applied to the surface of the lens 21 according to actual needs. It is worth mentioning that the surface may be the side of the object or the side of the image. That is, the infrared absorbing layer 22 may be applied only to the object side or the image side of the lens 21, or may be applied to both surfaces of the lens 21. In addition, the infrared absorbing layer 22 may also be applied to only one of the lenses 21 or simultaneously to a plurality of the lenses 21, wherein the infrared absorbing layer 22 may alternatively be applied to the mirror. The outermost, middle or innermost lens 21 in the barrel 23 is coated with the infrared absorbing layer 22. In other words, the lens 20 can be assembled by using one or more of the lenses 21 coated with the infrared absorbing layer 22 according to actual needs. It should be understood by those skilled in the art that the foregoing <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt;
因此，可以理解的，将所述镜片21涂覆所述红外吸收层22后形成吸收式镜片，进而再将一枚或多枚的所述吸收式镜片组装于所述镜筒23后以形成一吸收式镜头。值得一提的，所述吸收式镜头的组装方式和常规摄像模组镜头组装方式相同。另外，所述红外吸收层22的数量可以为2，也就是说，二个所述红外吸 收层22分别涂覆于所述镜片21的内外表面，进一步地说，所述红外吸收层22可涂布于所述镜片21的一面或双面，其中优选为1面。本领域技术人员应当理解的是，这并不为本发明的限制。Therefore, it can be understood that the lens 21 is coated with the infrared absorbing layer 22 to form an absorption lens, and then one or more of the absorption lenses are assembled to the lens barrel 23 to form a lens. Absorption lens. It is worth mentioning that the absorption lens is assembled in the same manner as the conventional camera module. In addition, the number of the infrared absorbing layers 22 may be two, that is, two infrared absorbing layers 22 are respectively applied to the inner and outer surfaces of the lens 21, and further, the infrared absorbing layer 22 may be coated. One or both sides of the lens 21 are disposed, and preferably one side. Those skilled in the art will appreciate that this is not a limitation of the invention.
值得一提的，所述摄像模组通过所述镜片21上的所述红外吸收层22，从而可使所述摄像模组既达到滤光的功能，同时调整所述滤光片40的性质以减化结构使得所述摄像模组的整体结构变薄。It is worth mentioning that the camera module passes through the infrared absorbing layer 22 on the lens 21, so that the camera module can achieve the function of filtering, and adjust the properties of the filter 40. The reduced structure makes the overall structure of the camera module thin.
根据本发明的实施例，其中应用于所述摄像模组实施为高像素摄像模组时可取消蓝玻璃滤光片，将所述滤光片40实施为一普通玻璃滤光片，以节省所述摄像模组的成本和结构厚度。因此，所述吸收式镜头，相当于使近红外吸收结构的光学系统前移，以本实施例为例可将所述滤光片40的厚度减薄至<0.15mm。According to an embodiment of the present invention, when the camera module is implemented as a high-pixel camera module, the blue glass filter can be eliminated, and the filter 40 is implemented as a common glass filter to save The cost and structural thickness of the camera module. Therefore, the absorption lens is equivalent to moving the optical system of the near-infrared absorbing structure forward, and the thickness of the filter 40 can be reduced to <0.15 mm by taking the embodiment as an example.
另外，所述镜片21可由树脂、塑料或玻璃材质所制。所述红外吸收层22为具有吸收性质的化合物或有机材料，特别是存在近红外光谱吸收的特性，其中所述近红外光谱为565nm～1200nm波段。另外，值得一提的是，所述红外吸收层22为液体材料经过涂布、烘烤方式加工形成于所述镜片21，其中所述涂布方式可选择浸泡、离心力旋涂等物理气相沉积技术或化学气相沉积技术，这并不为本发明的限制。另外，如图5所示，所述镜片21可以通过拼版或晶圆级(wafer level)作业进行涂布和烘烤所述红外吸收层22，以提高产品生产效率，减少制作成本。Further, the lens 21 may be made of a resin, a plastic or a glass material. The infrared absorbing layer 22 is a compound or an organic material having an absorbing property, in particular, a characteristic of absorption in a near-infrared spectrum, wherein the near-infrared spectrum is in a wavelength band of 565 nm to 1200 nm. In addition, it is worth mentioning that the infrared absorbing layer 22 is formed on the lens 21 by coating and baking a liquid material, wherein the coating method can select physical vapor deposition technology such as immersion, centrifugal spin coating or the like. Or chemical vapor deposition techniques, which are not limiting of the invention. In addition, as shown in FIG. 5, the lens 21 can coat and bake the infrared absorbing layer 22 by imposition or wafer level work to improve product production efficiency and reduce manufacturing costs.
值得一提的，所述化合物，其优选为溶剂可溶型色素化合物，更优选地为系选自由酞菁系化合物、方酸内鎓系化合物、萘酞菁系化合物、六元卟啉系化合物、克酮鎓系化合物以及花青系化合物所组成的群组中的至少一种。因此，当所述化合物作为所述红外吸收层22涂布于所述镜片21时，可以涂布为单层、双层或多层。可以理解的，即将酞菁系化合物、方酸内鎓系化合物、萘酞菁系化合物、六元卟啉系化合物、克酮鎓系化合物以及花青系化合物所组成的群组中的至少一种或多种涂布于所述镜片21，也就是说将具有吸收性质的化合物涂布于所述镜片21。It is to be noted that the compound is preferably a solvent-soluble pigment compound, and more preferably selected from the group consisting of a phthalocyanine compound, a squaraine lanthanide compound, a naphthalocyanine compound, and a hexavalent porphyrin compound. At least one of the group consisting of a ketone oxime compound and a cyanine compound. Therefore, when the compound is applied to the lens 21 as the infrared absorbing layer 22, it may be applied as a single layer, a double layer or a plurality of layers. It is understood that at least one of a group consisting of a phthalocyanine compound, a squarylium ruthenium compound, a naphthalocyanine compound, a hexavalent porphyrin compound, a ketone oxime compound, and a cyanine compound A plurality of coatings are applied to the lens 21, that is, a compound having an absorbing property is applied to the lens 21.
进一步地，所述化合物，式Ⅰ和式Ⅱ表示所述方酸内鎓系化合物。Further, the compound, Formula I and Formula II represent the squaraine lanthanide compound.
其中，式Ⅰ中R
a、R
b及Y满足下述(a)或(b)的条件
Wherein, R a , R b and Y in the formula I satisfy the conditions of the following (a) or (b)
条件(a)Condition (a)
存在多个的R
a分别独立表示氢原子、卤素原子、磺基、羟基、氰基、硝基、羧基、怜酸基、-L
1或-NR
eR
f基。R
e及R
f分别独立地表示氢原子、-L
a、-L
b、-L
c、-L
d或-L
e。
There are a plurality of R a independently representing a hydrogen atom, a halogen atom, a sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a pity acid group, a -L 1 or a -NR e R f group. R e and R f each independently represent a hydrogen atom, -L a , -L b , -L c , -L d or -L e .
存在多个的R
b分别独立表示氢原子、卤素原子磺基、羟基、氰基、硝基、羧基、怜酸基、-L
1或-NR
gR
h基。R
g及R
h分别独立地表示氢原子、-L
a、-L
b、-L
c、-L
d或-L
e或-C(O)R
i基(R
i表示-L
a、-L
b、-L
c、-L
d或-L
e)。
The plurality of R b present independently represent a hydrogen atom, a halogen atom sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a pity acid group, a -L 1 or a -NR g R h group. R g and R h each independently represent a hydrogen atom, -L a , -L b , -L c , -L d or -L e or -C(O)R i group (R i represents -L a , -L b , -L c , -L d or -L e ).
存在多个的Y分别独立表示-NR
jR
k基。R
j及R
k分别独立地表示氢原子、-L
a、-L
b、-L
c、-L
d或-L
e。
There are a plurality of Ys respectively representing the -NR j R k basis. R j and R k each independently represent a hydrogen atom, -L a , -L b , -L c , -L d or -L e .
L
1为L
a、L
b、L
c、L
d、L
e、L
f、L
g或L
h。
L 1 is L a , L b , L c , L d , L e , L f , L g or L h .
所述L
a～L
h表示以下的基团：
The L a to L h represent the following groups:
L
a可具有取代基L的碳数为1～12的脂肪族烃基
L a may have an aliphatic hydrocarbon group having a carbon number of 1 to 12 of the substituent L
L
b可具有取代基L的碳数为1～12的卤素取代烷基
L b may have a substituent L of a halogen-substituted alkyl group having 1 to 12 carbon atoms
L
c可具有取代基L的碳数为3～14的脂环式烃基
L c may have a substituent L of an alicyclic hydrocarbon group having 3 to 14 carbon atoms
L
d可具有取代基L的碳数为6～14的芳香族烃基
L d may have an aromatic hydrocarbon group having a substituent L of 6 to 14 carbon atoms
L
e可具有取代基L的碳数为3～14的杂环基
L e may have a substituent L of a heterocyclic group having 3 to 14 carbon atoms
L
f可具有取代基L的碳数为1～9的烷氧基
L f may have a substituent A having an alkoxy group having 1 to 9 carbon atoms
L
g可具有取代基L的碳数为1～9的酰基
L g may have an acyl group having a substituent L of 1 to 9 carbon atoms
L
h可具有取代基L的碳数为1～9的烷氧基羰基
L h may have alkoxycarbonyl group having a substituent of L of 1 to 9 carbon atoms
取代基l为选自由碳数为1～12的脂肪族烃基、碳数为1～12的卤素取代烷基、碳数为3～14的脂环式烃基、碳数为6～14的芳香族烃基、碳数为3～14的杂环基、卤素原子、磺基、羟基、氰基、硝基、羧基、怜酸基及氨基所组成的群 组的至少一种。The substituent 1 is an aromatic hydrocarbon group selected from the group consisting of an aliphatic hydrocarbon group having 1 to 12 carbon atoms, a halogen-substituted alkyl group having 1 to 12 carbon atoms, an alicyclic hydrocarbon group having 3 to 14 carbon atoms, and an aromatic group having 6 to 14 carbon atoms. At least one of a group consisting of a hydrocarbon group, a heterocyclic group having 3 to 14 carbon atoms, a halogen atom, a sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a pity acid group, and an amino group.
所述L
a～L
h中，包括取代基的碳数的合计优选为分别为50以下，更优选为碳数为40以下，特别优选为碳数为30以下。若碳数多于所述范围，则有难以合成化合物的情况，并且有每单位重量的光的吸收强度变小的倾向。
In the above-mentioned L a to L h , the total number of carbon atoms including the substituent is preferably 50 or less, more preferably 40 or less, and particularly preferably 30 or less. When the carbon number is more than the above range, it may be difficult to synthesize a compound, and the absorption intensity per unit weight of light tends to be small.
条件(b)Condition (b)
1个苯环上的2个R
a中的至少一个与同一苯环上的Y相互键结，形成包含至少一个氮原子的构成原子数为5或6的杂环。所述杂环可具有取代基，R
b及未参与所述杂环的形成的R
a分别独立地与所述条件(a)的R
b及RR
a同义。
At least one of the two R a on one benzene ring is bonded to Y on the same benzene ring to form a hetero ring having at least one nitrogen atom and having 5 or 6 atoms. The heterocyclic ring may have a substituent, and R b and R a not participating in the formation of the heterocyclic ring are each independently synonymous with R b and RR a of the condition (a).
各基团的具体例Specific examples of each group
作为所述L
a及L中的碳数为1～12的脂肪族烃基，例如可列举：甲基(Me)、乙基(Et)、正丙基(n-Pr)、异丙基(i-Pr)、正丁基(n-Bu)、仲丁基(s-Bu)、叔丁基(t-Bu)、戊基、己基、辛基、壬基、癸基及十二烷基等烷基；乙烯基、1-丙烯基、2-丙烯基、丁烯基、1,3-丁二烯基、2-甲基-1-丙烯基、2-戊烯基、己烯基及辛烯基等烯基；以及乙炔基、丙炔基、丁炔基、2-甲基-1-丙炔基、己炔基及辛炔基等炔基。
Examples of the aliphatic hydrocarbon group having 1 to 12 carbon atoms in the L a and L include methyl (Me), ethyl (Et), n-propyl (n-Pr), and isopropyl (i). -Pr), n-butyl (n-Bu), sec-butyl (s-Bu), tert-butyl (t-Bu), pentyl, hexyl, octyl, decyl, decyl and dodecyl Alkyl; vinyl, 1-propenyl, 2-propenyl, butenyl, 1,3-butadienyl, 2-methyl-1-propenyl, 2-pentenyl, hexenyl and octyl An alkenyl group such as an alkenyl group; and an alkynyl group such as an ethynyl group, a propynyl group, a butynyl group, a 2-methyl-1-propynyl group, a hexynyl group, and an octynyl group.
作为所述L
b及L中的碳数为1～12的卤素取代烷基，例如可列举：三氯甲基、三氟甲基、1,1-二氯乙基、五氯乙基、五氟乙基、七氯丙基及七氟丙基。
Examples of the halogen-substituted alkyl group having 1 to 12 carbon atoms in the L b and L include trichloromethyl, trifluoromethyl, 1,1-dichloroethyl, pentachloroethyl and five. Fluoroethyl, heptachloropropyl and heptafluoropropyl.
作为所述L
c及L中的碳数为3～14的脂环式烃基，例如可列举:环丁基、环戊基、环己基、环庚基及环辛基等环烷基；降冰片烷基及金刚烷基等多环脂环式基。
Examples of the alicyclic hydrocarbon group having 3 to 14 carbon atoms in L c and L include a cycloalkyl group such as a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, a cycloheptyl group and a cyclooctyl group; A polycyclic alicyclic group such as an alkyl group or an adamantyl group.
作为所述L
d及L中的碳数为6～14的芳香族烃基，例如可列举:苯基、甲苯基、二甲苯基、均三甲苯基、枯烯基、1-萘基、2-萘基、葱基、菲基、苊基、丙烯合萘基(phenalenyl)、四氨萘基、二氢茚基及联苯基。
Examples of the aromatic hydrocarbon group having 6 to 14 carbon atoms in the L d and L include a phenyl group, a tolyl group, a xylyl group, a mesityl group, a cumenyl group, a 1-naphthyl group, and 2 Naphthyl, onion, phenanthryl, anthryl, phenalenyl, tetraamendyl, indanyl and biphenyl.
作为所述L
e及L的碳数为3～14的杂环基，例如可列举:包含呋喃、嚷吩、吡咯、吡唑、咪唑、三唑、恶唑、恶二唑、噻唑、噻二唑、吲哚、吲哚啉、假吲哚、苯并呋喃、苯并噻吩、咔唑、二苯并呋喃、二苯并噻吩、吡啶、嘧啶、吡嗪、哒嗪、喹啉、异喹啉、吖啶、吗啉及吩嗪嗦等杂环的基团。
Examples of the heterocyclic group having 3 to 14 carbon atoms of L e and L include, for example, furan, porphin, pyrrole, pyrazole, imidazole, triazole, oxazole, oxadiazole, thiazole, and thiadiazole. Oxazole, anthracene, porphyrin, pseudoanthracene, benzofuran, benzothiophene, carbazole, dibenzofuran, dibenzothiophene, pyridine, pyrimidine, pyrazine, pyridazine, quinoline, isoquinoline a heterocyclic group such as acridine, morpholine or phenazine.
作为所述L
f中的碳数为～12的烷氧基，例如可列举：甲氧基、乙氧基、正丙氧基、异丙氧基、丁氧基、戊氧基、己氧基、辛氧基。
Examples of the alkoxy group having a carbon number of -12 in the L f include a methoxy group, an ethoxy group, a n-propoxy group, an isopropoxy group, a butoxy group, a pentyloxy group, and a hexyloxy group. , octyloxy.
作为所述L
g中的碳数1～9的酰基，例如可列举：乙酰基、丙酰基、丁酰基、异丁酰基、戊酰基、异戊酰基及苯甲酰基。
Examples of the acyl group having 1 to 9 carbon atoms in the L g include an acetyl group, a propionyl group, a butyryl group, an isobutyryl group, a valeryl group, an isovaleryl group, and a benzoyl group.
作为所述L
h中的碳数1～9的烷氧基羰基，例如可列举：甲氧基羰基、乙氧基羰基、丙氧基几羰基、异丙氧基羰基、丁氧基羰基、戊氧基羰基、己氧基羰基及辛氧基羰基。
Examples of the alkoxycarbonyl group having 1 to 9 carbon atoms in the L h include a methoxycarbonyl group, an ethoxycarbonyl group, a propoxycarbonyl group, an isopropoxycarbonyl group, a butoxycarbonyl group, and a pentyl group. Oxycarbonyl, hexyloxycarbonyl and octyloxycarbonyl.
作为所述L
a优选为甲基、乙基、正丙基、异丙基、正丁基、仲丁基、叔丁基、戊基、己基、辛基、4-苯基丁基、2-环己基乙基，更优选为甲基、乙基、正丙基、异丙基、正丁基、仲丁基、叔丁基。
As the L a is preferably methyl, ethyl, n-propyl, isopropyl, n-butyl, sec-butyl, tert-butyl, pentyl, hexyl, octyl, 4-phenylbutyl, 2- The cyclohexylethyl group is more preferably a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a n-butyl group, a sec-butyl group or a t-butyl group.
作为所述L
b优选为三氯甲基、五氯乙基、三氟甲基、五氟乙基、5-环己基-2,2,3,3-四氟戊基，更优选为三氯甲基、五氯乙基、三氟甲基、五氟乙基。
The L b is preferably trichloromethyl, pentachloroethyl, trifluoromethyl, pentafluoroethyl, 5-cyclohexyl-2,2,3,3-tetrafluoropentyl, more preferably trichloro Methyl, pentachloroethyl, trifluoromethyl, pentafluoroethyl.
作为所述L
c优选为环丁基、环戊基、环己基、4-乙基环己基、环辛基、4-苯基环庚基，更优选为环戊基、环己基、4-乙基环己基。
The L c is preferably a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, a 4-ethylcyclohexyl group, a cyclooctyl group or a 4-phenylcycloheptyl group, more preferably a cyclopentyl group, a cyclohexyl group or a 4-ethyl group. Base ring hexyl.
作为所述L
d，优选为苯基、1-萘基、2-萘基、甲苯基、二甲苯基、均三甲苯基、枯烯基、3，5-二-叔丁基苯基、4-环戊基苯基、2，3，6-三苯基苯基、2，3，4，5，6-五苯基苯基，更优选为苯基、甲苯基、二甲苯基、均三甲苯基、枯烯基、2,3,4,5,6-五苯基苯基。
As the L d , a phenyl group, a 1-naphthyl group, a 2-naphthyl group, a tolyl group, a xylyl group, a mesityl group, a cumenyl group, a 3,5-di-tert-butylphenyl group, and 4 are preferable. - cyclopentylphenyl, 2,3,6-triphenylphenyl, 2,3,4,5,6-pentaphenylphenyl, more preferably phenyl, tolyl, xylyl, homogenous Tolyl, cumenyl, 2,3,4,5,6-pentaphenylphenyl.
作为所述L
e优选为包含呋喃、噻吩、吡咯、吲哚、吲哚啉、假吲哚、苯并呋喃、苯并噻吩、吗啉的基团，更优选为包含呋喃、噻吩、吡咯、吗啉的基团。
The L e is preferably a group containing furan, thiophene, pyrrole, anthracene, porphyrin, pyrene, benzofuran, benzothiophene, morpholine, and more preferably contains furan, thiophene, pyrrole, or a group of porphyrins.
作为所述L
f，优选为甲氧基、乙氧基、丙氧基、异丙氧基、丁氧基、甲氧基甲基、甲氧基乙基、2-苯基乙氧基、3-环己基丙氧基、戊氧基、己氧基、辛氧基，更优选为甲氧基、乙氧基、丙氧基、异丙氧基、丁氧基。
As the L f , a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group, a butoxy group, a methoxymethyl group, a methoxyethyl group, a 2-phenylethoxy group, and 3 are preferable. a cyclohexylpropoxy group, a pentyloxy group, a hexyloxy group or an octyloxy group, more preferably a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group or a butoxy group.
作为所述L
g优选为乙酰基、丙酰基、丁酰基、异丁酰基、苯甲酰基、4-丙基苯甲酰基、三氟甲基羰基，更优选为乙酰基、丙酰基、苯甲酰基。
The L g is preferably acetyl, propionyl, butyryl, isobutyryl, benzoyl, 4-propylbenzoyl or trifluoromethylcarbonyl, more preferably acetyl, propionyl or benzoyl. .
作为所述L
h优选为甲氧基羰基、乙氧基羰基、丙氧基羰基、异丙氧基羰基、丁氧基羰基、2-三氟甲基乙氧基羰基、2-苯基乙氧基羰基，更优选为甲氧基羰基、乙氧基羰基。
The L h is preferably a methoxycarbonyl group, an ethoxycarbonyl group, a propoxycarbonyl group, an isopropoxycarbonyl group, a butoxycarbonyl group, a 2-trifluoromethylethoxycarbonyl group, or a 2-phenylethoxy group. The carbonyl group is more preferably a methoxycarbonyl group or an ethoxycarbonyl group.
所述L
a～L
h可进一步具有选自由卤素原子、磺基、羟基、氰基、硝基、羧基、磷酸基及氨基所组成的组群的至少一种原子或基团。作为此种例子，可列举:4-磺基丁基、4-氰基丁基、5-羧基戊基、5-氨基戊基、3-羟基丙基、2-磷酰基乙基、6-氨基-2，2-二氯己基、2-氯-4-羟基丁基、2-氰基环丁基、3-羟基环戊基、3-羧基环戊基、4-氨基环己基、4-羟基环己基、4-羟基苯基、五氟苯基、2-羟基萘基、4-氨基苯基、4-硝基苯基、包含3-甲基吡咯的基团、2-羟基乙氧基、3-氰 基丙氧基、4-氟苯甲酰基、2-羟基乙氧基羰基、4-氰基丁氧基羰基。
The L a to L h may further have at least one atom or group selected from the group consisting of a halogen atom, a sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a phosphoric acid group, and an amino group. As such an example, 4-sulfobutyl group, 4-cyanobutyl group, 5-carboxypentyl group, 5-aminopentyl group, 3-hydroxypropyl group, 2-phosphorylethyl group, and 6-amino group are mentioned. -2,2-dichlorohexyl, 2-chloro-4-hydroxybutyl, 2-cyanocyclobutyl, 3-hydroxycyclopentyl, 3-carboxycyclopentyl, 4-aminocyclohexyl, 4-hydroxyl Cyclohexyl, 4-hydroxyphenyl, pentafluorophenyl, 2-hydroxynaphthyl, 4-aminophenyl, 4-nitrophenyl, a group containing 3-methylpyrrole, 2-hydroxyethoxy, 3-cyanopropoxy, 4-fluorobenzoyl, 2-hydroxyethoxycarbonyl, 4-cyanobutoxycarbonyl.
作为所述条件(a)中的R
a,优选为氢原子、氯原子、氟原子、甲基、乙基、正丙基、异丙基、正丁基、仲丁基、叔丁基、环己基、苯基、羟基、氨基、二甲基氨基、硝基，更优选为氢原子、氯原子、氟原子、甲基、乙基、正丙基、异丙基、羟基。
R a in the condition (a) is preferably a hydrogen atom, a chlorine atom, a fluorine atom, a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a n-butyl group, a sec-butyl group, a t-butyl group or a ring. The hexyl group, the phenyl group, the hydroxyl group, the amino group, the dimethylamino group, and the nitro group are more preferably a hydrogen atom, a chlorine atom, a fluorine atom, a methyl group, an ethyl group, a n-propyl group, an isopropyl group or a hydroxyl group.
作为所述条件(a)中的R
b，优选为氢原子、氯原子、氟原子、甲基、乙基、正丙基、异丙基、正丁基、仲丁基、叔丁基、环己基、苯基、羟基、氨基、二甲基氨基、氰基、硝基、乙酰基氨基、丙酰基氨基、N-甲基乙酷基氨基、三氟甲酰基氨基、五氟乙酰基氨基、叔丁酰基氨基、环己酰基氨基，更优选为氢原子、氯原子、氟原子、甲基、乙基、正丙基、异丙基、羟基、二甲基氨基、硝基、乙酰基氨基、丙酰基氨基、三氟甲酰基氨基、五氟乙酰基氨基、叔丁酰基氨基、环己酰基氨基。
R b in the condition (a) is preferably a hydrogen atom, a chlorine atom, a fluorine atom, a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a n-butyl group, a sec-butyl group, a t-butyl group or a ring. Hexyl, phenyl, hydroxy, amino, dimethylamino, cyano, nitro, acetylamino, propionylamino, N-methylethylamino, trifluorocarbonylamino, pentafluoroacetylamino, uncle Butyrylamino, cyclohexanoylamino, more preferably hydrogen, chlorine, fluorine, methyl, ethyl, n-propyl, isopropyl, hydroxy, dimethylamino, nitro, acetylamino, propyl An acylamino group, a trifluoroformylamino group, a pentafluoroacetylamino group, a tert-butyrylamino group, a cyclohexanoylamino group.
作为所述Y，优选为氨基、甲基氨基、二甲基氨基、二乙基氨基、二-正丙基氨基、二异丙基氨基、二-正丁基氨基、二-叔丁基氨基、N-乙基-N-甲基氨基、N-环己基-N-甲基氨基，更优选为二甲基氨基、二乙基氨基、二-正丙基氨基、二异丙基氨基、二-正丁基氨基、二-叔丁基氨基。The Y is preferably an amino group, a methylamino group, a dimethylamino group, a diethylamino group, a di-n-propylamino group, a diisopropylamino group, a di-n-butylamino group or a di-tert-butylamino group. N-ethyl-N-methylamino, N-cyclohexyl-N-methylamino, more preferably dimethylamino, diethylamino, di-n-propylamino, diisopropylamino, di- n-Butylamino, di-tert-butylamino.
作为所述式I的条件(b)中的1个苯环上的2个R
a中的至少一个与同一苯环上的Y相互键结而形成的包含至少一个氮原子的构成原子数为5或6的杂环，例如可列举:吡咯啶、吡咯、咪唑、吡唑、哌啶、吡啶、哌嗪、哒嗪、嘧啶及吡嗪等。所述杂环中，优选为构成所述杂环、且构成所述苯环的碳原子的邻近的1个原子为氮原子的杂环，更优选为吡咯啶。
The number of constituent atoms including at least one nitrogen atom formed by bonding at least one of two R a on one benzene ring in the condition (b) of the formula I to the Y on the same benzene ring is 5 Examples of the heterocyclic ring of 6 or more include pyrrolidine, pyrrole, imidazole, pyrazole, piperidine, pyridine, piperazine, pyridazine, pyrimidine and pyrazine. Among the heterocyclic rings, a heterocyclic ring constituting the heterocyclic ring and constituting one of the carbon atoms of the benzene ring is a nitrogen atom, and more preferably a pyrrolidine.
其中，式Ⅱ中，X独立地表示0、S、Se、N-R
c或C(R
dR
d)，存在多个的R
c分别独立地表示氢原子、L
a、L
b、Lc、L
d或L
e，存在多个的R
d分别独立地表示氢原子、卤素原子磺基、羟基、氰基、硝基、羧基、磷酸基、-L
1或-NR
eR
f基，相邻的R
d彼此可连结而形成可具有取代基的环，L
a～L
e、L
1、R
e及R
f与所述式I中所定义的L
a～L
e、L
1、R
e及R
f同义。
Wherein, in Formula II, X independently represents 0, S, Se, NR c or C(R d R d ), and a plurality of R c independently represent a hydrogen atom, L a , L b , Lc, L d Or L e , a plurality of R d independently represent a hydrogen atom, a halogen atom sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a phosphate group, a -L 1 or a -NR e R f group, and an adjacent R d may be linked to each other to form a ring may have a substituent group, L a ~ L e, L 1, L a R e and R f in the formula I as defined in ~ L e, L 1, R e , and R f Synonymous.
作为所述式Ⅱ中的R
c，优选为氢原子、甲基、乙基、正丙基、异丙基、正丁基、仲丁基、叔下丁基、正戊基、正己基、环己基、苯基、三氟甲基、五氟乙基，更优选为氢原子、甲基、乙基、正丙基、异丙基。
As R c in the formula II, a hydrogen atom, a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a n-butyl group, a sec-butyl group, a tert-butyl group, a n-pentyl group, a n-hexyl group, and a ring are preferable. Hexyl, phenyl, trifluoromethyl, pentafluoroethyl, more preferably a hydrogen atom, a methyl group, an ethyl group, a n-propyl group or an isopropyl group.
作为所述式Ⅱ中的R
d，优选为氢原子、氯原子、氟原子、甲基、乙基、正丙 基、异丙基丁基、仲丁基、叔丁基、正戊基、正己基、环己基、苯基、甲氧基、三氟甲基、五氟乙基、4-氨基环己基，更优选为氢原子、氯原子、氟原子、甲基、乙基、正丙基、异丙基三氟甲基、五氟乙基。
R d in the formula II is preferably a hydrogen atom, a chlorine atom, a fluorine atom, a methyl group, an ethyl group, a n-propyl group, an isopropyl butyl group, a sec-butyl group, a t-butyl group, a n-pentyl group or a hexyl group. a group, a cyclohexyl group, a phenyl group, a methoxy group, a trifluoromethyl group, a pentafluoroethyl group, a 4-aminocyclohexyl group, more preferably a hydrogen atom, a chlorine atom, a fluorine atom, a methyl group, an ethyl group, a n-propyl group, Isopropyl trifluoromethyl, pentafluoroethyl.
作为所述X，优选为0、S、Se、N-Me、N-Et、CH
2、C-Me
2、C-Et
2，更优选为S、C-Me
2、C-Et
2。
The X is preferably 0, S, Se, N-Me, N-Et, CH 2 , C-Me 2 or C-Et 2 , and more preferably S, C-Me 2 or C-Et 2 .
在所述式Ⅱ中，相邻的R
d彼此连结可形成环。作为此种环，例如可列举:苯并假吲哚环、α-萘并咪唑环、β-萘并咪唑环、α-萘并恶唑环、β-萘并恶唑环、α-萘并噻唑环、β-萘并噻唑环、α-萘并唒唑环、β-萘并唒唑环。
In the formula II, adjacent R d are bonded to each other to form a ring. Examples of such a ring include a benzopyridinium ring, an α-naphthylimidazole ring, a β-naphthylimidazole ring, an α-naphthoxazole ring, a β-naphthoxazole ring, and an α-naphthyl group. Thiazole ring, β-naphthylthiazole ring, α-naphthoxazole ring, β-naphthoxazole ring.
另外，所述化合物，式Ⅲ亦表示所述方酸内鎓系化合物。Further, the compound, Formula III, also represents the squaraine lanthanide compound.
式Ⅲ中，X独立地表示氧原子、硫原子、硒原子或-NH-，R
1～R
7分别独立地表示氢原子、卤素原子、磺基、羟基、氰基、硝基、羧基、磷酸基、-L
1或-NR
gR
h基。R
g及R
h分别独立地表示氢原子、-L
a、-L
b、-L
c、-L
d或-L
e或-C(O)R
i基(R
i表示-L
a、-L
b、-L
c、-L
d或-L
e)。
In the formula III, X independently represents an oxygen atom, a sulfur atom, a selenium atom or -NH-, and R 1 to R 7 each independently represent a hydrogen atom, a halogen atom, a sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, or a phosphoric acid. Base, -L 1 or -NR g R h group. R g and R h each independently represent a hydrogen atom, -L a , -L b , -L c , -L d or -L e or -C(O)R i group (R i represents -L a , -L b , -L c , -L d or -L e ).
L
1为L
a、L
b、L
c、L
d、L
e、L
f、L
g或L
h。
L 1 is L a , L b , L c , L d , L e , L f , L g or L h .
L
a～L
h与所述式Ⅰ中所定义的L
a～L
h同义。
L a to L h are synonymous with L a to L h as defined in the above formula I.
作为所述R
1，优选为氢原子、氯原子、氟原子、甲基、乙基、正丙基、异丙基、正丁基、仲丁基、叔丁基、环己基、苯基、羟基、氨基、二甲基氨基、硝基，更优选为氢原子、氯原子、氟原子、甲基、乙基、正丙基、异丙基、羟基。
As the R 1 , a hydrogen atom, a chlorine atom, a fluorine atom, a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a n-butyl group, a sec-butyl group, a t-butyl group, a cyclohexyl group, a phenyl group, a hydroxyl group are preferable. The amino group, the dimethylamino group, and the nitro group are more preferably a hydrogen atom, a chlorine atom, a fluorine atom, a methyl group, an ethyl group, a n-propyl group, an isopropyl group or a hydroxyl group.
作为所述R
2～R
7,优选为氢原子、氯原子、氟原子、甲基、乙基、正丙基、异丙基、正丁基、仲丁基、叔丁基、环己基、苯基、羟基、氨基、二甲基氨基、氰基、硝基、乙酰基氨基、丙酰基氨基、N-甲基乙酷基氨基、三氟甲酰基氨基、五氟乙酰基氨基、叔丁酰基氨基、环己酰基氨基，更优选为氢原子、氯原子、氟原子、甲基、乙基、正丙基、异丙基、羟基、二甲基氨基、硝基、乙酰基氨基、丙酰基氨基、三氟甲酰基氨基、五氟乙酰基氨基、叔丁酰基氨基、环己酰基氨基。
As the R 2 to R 7 , a hydrogen atom, a chlorine atom, a fluorine atom, a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a n-butyl group, a sec-butyl group, a t-butyl group, a cyclohexyl group, and a benzene are preferable. Base, hydroxy, amino, dimethylamino, cyano, nitro, acetylamino, propionylamino, N-methylethylamino, trifluorocarbonylamino, pentafluoroacetylamino, tert-butyrylamino a cyclohexanoylamino group, more preferably a hydrogen atom, a chlorine atom, a fluorine atom, a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a hydroxyl group, a dimethylamino group, a nitro group, an acetylamino group, a propionylamino group, Trifluoroformylamino, pentafluoroacetylamino, tert-butyrylamino, cyclohexanoylamino.
作为所述X，优选为氧原子、硫原子，特别优选为氧原子。The X is preferably an oxygen atom or a sulfur atom, and particularly preferably an oxygen atom.
另外，所述化合物，式Ⅳ表示所述酞菁系化合物。Further, the compound, Formula IV, represents the phthalocyanine-based compound.
其中式Ⅳ中，Μ表示2个氢原子、2个1价金属原子、2价金属原子、或包含3价或4价金属原子的取代金属原子，存在多个的R
a、R
b、R
c及R
d分别独立地表示选自由氢原子、卤素原子、羟基、羧基、硝基、氨基、酰胺基、酰亚胺基、氰基、硅烷基、-L
1、-S-L
2、-SS-L
2、-S0
2-L
3、-N＝N-L
4、或与Ra与R
b、R
b与R
c、及R
c与R
d中至少一个组合键结。其中，键结于同一芳香环的R
a、R
b、R
c及R
d中至少一个不为氢原子。
In the formula IV, Μ represents two hydrogen atoms, two monovalent metal atoms, a divalent metal atom, or a substituted metal atom containing a trivalent or tetravalent metal atom, and a plurality of R a , R b , R c And R d are independently represented by a hydrogen atom, a halogen atom, a hydroxyl group, a carboxyl group, a nitro group, an amino group, an amide group, an imide group, a cyano group, a silane group, -L 1 , -SL 2 , -SS-L. 2 , -S0 2 -L 3 , -N=NL 4 , or in combination with at least one of Ra and R b , R b and R c , and R c and R d . Wherein at least one of R a , R b , R c and R d bonded to the same aromatic ring is not a hydrogen atom.
所述氨基、酰胺基、酰亚胺基及硅烷基可具有所述式Ⅰ中所定义的取代基L，The amino group, the amide group, the imide group, and the silane group may have the substituent L defined in the formula I,
L
1与所述式Ⅰ中所定义的L
1同义，
L 1 in the formula as defined Ⅰ L 1 of synonymous,
L
2表示氢原子或所述式Ⅰ中所定义的L
a～L
e的任一个，
L 2 represents a hydrogen atom or any of L a to L e defined in the formula I,
L
3表示羟基或所述L
a～L
e的任一个，
L 3 represents a hydroxyl group or any of the above L a to L e ,
L
4表示所述L
a～L
e的任一个。
L 4 represents any of the above L a to L e .
在本发明的这个实施例中，所述感光芯片50被设置于所述线路板主体121的上表面，所述模制支架11围绕于所述感光芯片50的外侧。在制造所述线路板组件10时，可以选择不同制造顺序，举例地但不限于，在一种实施方式中，可以先在所述线路板主体121上安装所述感光芯片50，而后在所述感光芯片50外侧，所述线路板主体121上模塑形成所述模制支架11。而在本发明的另一种实施方式中，可以先在所述线路板主体121上模塑形成所述模制支架11，继而将所述感光芯片50安装于所述线路板主体121，使其位于所述模制支架11的内侧。In this embodiment of the invention, the photosensitive chip 50 is disposed on an upper surface of the wiring board main body 121, and the molded bracket 11 surrounds an outer side of the photosensitive chip 50. In the manufacture of the circuit board assembly 10, different manufacturing sequences may be selected, for example, but not limited to, in one embodiment, the photosensitive chip 50 may be first mounted on the circuit board main body 121, and then in the On the outside of the photosensitive chip 50, the molded holder 11 is molded on the wiring board main body 121. In another embodiment of the present invention, the molded holder 11 may be molded on the circuit board main body 121, and then the photosensitive chip 50 may be mounted on the circuit board main body 121. Located inside the molded bracket 11.
值得一提的，所述感光芯片50通过一系列引线53连接于所述线路板组件10。所述引线53可以被实施为，举例地但不限于，金线、铜线、铝线、银线。特别地，所述感光芯片50的所述系列引线53可以通过传统的COB方式连接于所述线 路板组件10，举例地但不限于，焊接的方式。It is worth mentioning that the photosensitive chip 50 is connected to the circuit board assembly 10 through a series of leads 53. The lead 53 may be implemented as, for example but not limited to, a gold wire, a copper wire, an aluminum wire, a silver wire. In particular, the series of leads 53 of the photosensitive chip 50 can be attached to the circuit board assembly 10 by conventional COB means, such as, but not limited to, soldering.
根据本实施例，本发明还提供一摄像模组的近红外光谱吸收方法，其中包括如下步骤：According to the embodiment, the present invention further provides a near infrared spectroscopy absorption method of a camera module, which includes the following steps:
(a)光通过镜头20，并由其吸收红外光；以及(a) light passes through the lens 20 and absorbs infrared light therefrom;
(b)投射于感光芯片50。(b) Projected on the photosensitive chip 50.
根据步骤(a)，其中所述镜头包括至少一镜片21和至少一红外吸收层22，其中所述红外吸收层22通过一涂布方式位于其中某一片或多片所述镜片21的表面。因此，可以理解的，根据步骤(a)，是由涂覆于所述镜片21上的红外吸收层22吸收红外光。可以理解的是，所述红外吸收层22也可以通过其他附贴方式形成于所述镜片21的表面。According to the step (a), wherein the lens comprises at least one lens 21 and at least one infrared absorbing layer 22, wherein the infrared absorbing layer 22 is located on the surface of one or more of the lenses 21 by a coating method. Therefore, it can be understood that, according to the step (a), infrared light is absorbed by the infrared absorbing layer 22 coated on the lens 21. It can be understood that the infrared absorbing layer 22 can also be formed on the surface of the lens 21 by other attachment means.
所述涂覆方式可以是采用浸泡、离心力旋涂的物理气相沉积技术或化学气相沉积技术。The coating method may be a physical vapor deposition technique or a chemical vapor deposition technique using immersion, centrifugal force spin coating.
根据步骤(a)，其中所述红外吸收层22为有机材料或化合物，且存在近红外光谱吸收的特性，其中所述近红外光谱为565nm～1200nm波段。According to the step (a), wherein the infrared absorbing layer 22 is an organic material or a compound, and has a characteristic of absorption in the near-infrared spectrum, wherein the near-infrared spectrum is in the band of 565 nm to 1200 nm.
根据步骤(a)，其中所述红外吸收层22在涂覆前为液体材料。According to step (a), wherein the infrared absorbing layer 22 is a liquid material prior to coating.
如图6和图8所示，是根据本发明的第一个优选实施例的摄像模组的第一变形实施例，其中阐述所述模制支架11同时封装所述线路板12和所述感光芯片50，即MOC(molding on chip)。如图6所示，所述滤光片40直接位于所述感光芯片50的上方，并经由所述模制支架11一体塑封。也就是说，所述感光芯片50贴装于所述线路板组件10的所述线路板主体121，继而将各所述感光芯片50与所述线路板主体121进行电连接，然后将所述滤光片40置于所述感光芯片50的上方后，进行一体封装，如模塑封装或通过半导体封装中常用的模压工艺形成所述模制支架11。另外，如图7所示，在所述模制支架11同时封装所述线路板12和所述感光芯片50后，其中所述模制支架11的顶表面112一体平面延伸，所述滤光片40被安装于所述模制支架11的所述顶表面112。特别地，所述模制支架11的所述顶表面112为一体平面延伸，所述驱动器30可被安装于所述模制支架11的所述顶表面112。如图8所示，在所述模制支架11同时封装所述线路板12和所述感光芯片50后，其中所述模制支架11具有一安装槽113，其以用于安装所述滤光片40。进一步地说，所述模制支架11的所述顶表面112呈台阶状结构，而并不是一体延伸，所述顶表面112的各台阶上可用于安装所述滤光片 40和所述驱动器30。As shown in FIG. 6 and FIG. 8, a first modified embodiment of the camera module according to the first preferred embodiment of the present invention, wherein the molded bracket 11 is described to simultaneously package the circuit board 12 and the photosensitive Chip 50, that is, MOC (molding on chip). As shown in FIG. 6, the filter 40 is directly above the photosensitive chip 50 and integrally molded via the molded bracket 11. That is, the photosensitive chip 50 is attached to the circuit board main body 121 of the circuit board assembly 10, and then the photosensitive chips 50 are electrically connected to the circuit board main body 121, and then the filter is applied. After the light sheet 40 is placed over the photosensitive chip 50, it is integrally packaged, such as a molded package or formed by a molding process commonly used in a semiconductor package. In addition, as shown in FIG. 7, after the molding bracket 11 simultaneously encapsulates the circuit board 12 and the photosensitive chip 50, wherein the top surface 112 of the molded bracket 11 extends integrally in a plane, the filter 40 is mounted to the top surface 112 of the molded bracket 11. In particular, the top surface 112 of the molded bracket 11 extends in an integral plane, and the driver 30 can be mounted to the top surface 112 of the molded bracket 11. As shown in FIG. 8, after the molded bracket 11 simultaneously encapsulates the circuit board 12 and the photosensitive chip 50, the molded bracket 11 has a mounting groove 113 for mounting the filter. Sheet 40. Further, the top surface 112 of the molded bracket 11 has a stepped structure and does not extend integrally. The steps of the top surface 112 can be used to mount the filter 40 and the driver 30. .
如图9和图10所示，是根据本发明的第一个优选实施例的摄像模组的第二变形实施例，其中所述摄像模组包括一支座70，其被安装于所述模制支架11。所述支座70具有一第一支座槽71和一第二支座槽72，所述滤光片40安装于所述第一支座槽71，以使得所述滤光片40的表面不会凸出于所述支座70的顶端。所述第二支座槽72安装于所述模制支架11，以使得所述模制支架11沿所述支座70向上延伸，而所述滤光片40的位置相对向下，从而减小所述摄像模组的后焦距。如图9所示，所述模制支架11的顶表面112一体平面延伸，所述支座70的所述第二支座槽72被安装于所述模制支架11的所述顶表面112，所述驱动器30或所述镜头20被安装于所述支座70。所述支座70的所述第一支座槽71向所述摄像模组内部和向下延伸，从而将所述滤光片40支撑于所述感光芯片30上方，使得所述滤光片40被稳定安装的同时，不会占用结构空间。另外，如图10所示，所述模制支架11具有一安装槽113，其中所述支座70设置于所述模制支架11的所述安装槽113。进一步地说，所述滤光片40安装于所述第一支座槽71，并使得所述滤光片40的表面不会凸出于所述支座70的顶端。所述第二支座槽72安装于所述安装槽113，以使得所述模制支架11沿所述支座70向上延伸，而所述滤光片40的位置相对向下，从而减小所述摄像模组的后焦距。另外，所述驱动器30可安装于所述模制支架11。As shown in FIG. 9 and FIG. 10, a second modified embodiment of the camera module according to the first preferred embodiment of the present invention, wherein the camera module includes a stand 70 mounted to the die. Bracket 11. The holder 70 has a first seating groove 71 and a second seating groove 72. The filter 40 is mounted on the first seating groove 71 such that the surface of the filter 40 is not It will protrude from the top end of the holder 70. The second seating groove 72 is mounted to the molded bracket 11 such that the molded bracket 11 extends upward along the support 70, and the position of the filter 40 is relatively downward, thereby reducing The back focus of the camera module. As shown in FIG. 9, the top surface 112 of the molded bracket 11 extends integrally planarly, and the second seating groove 72 of the holder 70 is mounted to the top surface 112 of the molded bracket 11, The driver 30 or the lens 20 is mounted to the holder 70. The first seating groove 71 of the support 70 extends toward the inside and the lower side of the camera module, thereby supporting the filter 40 above the photosensitive chip 30, so that the filter 40 It is not installed and does not occupy structural space. In addition, as shown in FIG. 10, the molded bracket 11 has a mounting groove 113, wherein the holder 70 is disposed in the mounting groove 113 of the molded bracket 11. Further, the filter 40 is mounted to the first seating groove 71 such that the surface of the filter 40 does not protrude from the top end of the holder 70. The second seat groove 72 is mounted to the mounting groove 113 such that the molded bracket 11 extends upward along the support 70, and the filter 40 is positioned relatively downward, thereby reducing the position The back focus of the camera module. Additionally, the driver 30 can be mounted to the molded bracket 11.
如图11和图15所示，是根据本发明的第一个优选实施例的摄像模组的第三变形实施例，其中所述滤光片40可安装于所述驱动器30或所述镜头20。如图11所示，所述驱动器30包括一下端部31，所述下端部31适于安装所述滤光片40。另外，如图12所示，所述驱动器30D包括一上端部32，所述上端部32适于安装所述滤光片40。另外，如图13所示，所述镜筒23包括一底部231，其用于安装所述滤光片40。另外，如图14所示，所述镜筒23包括一顶部232，其用于安装所述滤光片40。另外，如图15所示，所述镜筒23的数量可以是1个或多个，其中所述镜筒23的数量若为2个以上时，可相互接合，并使所述滤光片40接在其中一个所述镜筒23，以达到滤光效果。进一步地说，所述镜筒23包括第一镜筒233和第二镜筒234，其中所述第二镜筒234接合于所述第一镜筒233，其中接合实施方式可采用目前常见的各种接合技术，像是锁扣组件、螺纹组件、热熔接、超声波接合等。因此，所述第一镜筒233和所述第二镜筒234的接合实 施方式并不为本发明的限制。可以理解的，上述举例的镜筒23数量不为本发明的限制。As shown in FIG. 11 and FIG. 15, a third modified embodiment of the camera module according to the first preferred embodiment of the present invention, wherein the filter 40 is mountable to the driver 30 or the lens 20 . As shown in FIG. 11, the driver 30 includes a lower end portion 31 adapted to mount the filter 40. Additionally, as shown in FIG. 12, the driver 30D includes an upper end portion 32 that is adapted to mount the filter 40. In addition, as shown in FIG. 13, the lens barrel 23 includes a bottom portion 231 for mounting the filter 40. In addition, as shown in FIG. 14, the lens barrel 23 includes a top portion 232 for mounting the filter 40. In addition, as shown in FIG. 15, the number of the lens barrels 23 may be one or more, and when the number of the lens barrels 23 is two or more, they may be joined to each other, and the filter 40 may be used. One of the barrels 23 is attached to achieve a filtering effect. Further, the lens barrel 23 includes a first lens barrel 233 and a second lens barrel 234, wherein the second lens barrel 234 is joined to the first lens barrel 233, wherein the joint embodiment can adopt various currently common ones. Bonding techniques, such as a latch assembly, a threaded component, a heat seal, an ultrasonic joint, and the like. Therefore, the engagement embodiment of the first barrel 233 and the second barrel 234 is not a limitation of the present invention. It is to be understood that the number of the lens barrels 23 exemplified above is not a limitation of the present invention.
如图16所示，是根据本发明的第一个优选实施例的摄像模组的第四变形实施例，其中所述感光芯片50采用芯片倒装方式FC(Flip Chip)安装于所述线路板组件10。所述芯片倒装方式FC(Flip Chip)即是将所述感光芯片50从所述线路板组件10的背面方向安装于所述线路板组件10，且所述感光芯片50的感光区朝上地安装于所述线路板组件10。这样的结构以及安装方式，使得所述感光芯片50和所述模制支架11相对独立，所述感光芯片50的安装不会受到所述模制支架11的影响，所述模制支架11的模塑成型对所述感光芯片50的影响也较小。进一步的说，所述线路板12包括一线路板主体121，所述线路板主体121具有一通路1211，所述通路1211的下部适于安装所述感光芯片30。所述通路1211使得所述线路板主体121上下两侧相连通，从而当所述感光芯片50由所述线路板主体121的背面、并且感光区朝上地安装于所述线路板主体121时，所述感光芯片50的感光区能够接收到由所述镜头20进入的光线。另外，所述线路板主体121具有一外凹槽1212，所述外凹槽1212连通于对应的所述通路，提供所述感光芯片50的安装位置。As shown in FIG. 16, a fourth modified embodiment of the camera module according to the first preferred embodiment of the present invention, wherein the photosensitive chip 50 is mounted on the circuit board by a flip chip type FC (Flip Chip). Component 10. The flip chip type FC (Flip Chip) is mounted on the circuit board assembly 10 from the back side of the circuit board assembly 10, and the photosensitive area of the photosensitive chip 50 faces upward. Mounted to the circuit board assembly 10. Such a structure and mounting manner are such that the photosensitive chip 50 and the molded holder 11 are relatively independent, and the mounting of the photosensitive chip 50 is not affected by the molded bracket 11, and the mold of the molded bracket 11 The influence of the molding on the photosensitive chip 50 is also small. Further, the circuit board 12 includes a circuit board main body 121 having a passage 1211, and a lower portion of the passage 1211 is adapted to mount the photosensitive chip 30. The via 1211 allows the upper and lower sides of the wiring board main body 121 to communicate, so that when the photosensitive chip 50 is mounted on the back surface of the wiring board main body 121 and the photosensitive area is mounted on the wiring board main body 121, The photosensitive area of the photosensitive chip 50 is capable of receiving light entering by the lens 20. In addition, the circuit board main body 121 has an outer recess 1212, and the outer recess 1212 communicates with the corresponding passage to provide a mounting position of the photosensitive chip 50.
如图17至图19所示，是根据本发明的第二个优选实施例的基于红外吸收镜头结构的摄像模组，所述摄像模组可以是一动焦摄像模组，其中包括一线路板组件10，一镜头20、一驱动器30，和一感光芯片50。所述镜头20位于所述感光芯片50的感光路径，从而在所述摄像模组用于采集物体的影像时，被物体反射的光线能够在藉由所述镜头20的处理之后进一步被所述感光芯片50接受以适于进行光电转化。所述感光芯片50电连接于所述线路板组件10。所述驱动器30被安装于所述线路板组件10，所述镜头20被安装于所述驱动器30，以使得所述镜头20被支撑于所述线路板组件10上方。As shown in FIG. 17 to FIG. 19, a camera module based on an infrared absorption lens structure according to a second preferred embodiment of the present invention may be a moving focus camera module including a circuit board assembly. 10. A lens 20, a driver 30, and a sensor chip 50. The lens 20 is located in the photosensitive path of the photosensitive chip 50, so that when the camera module is used to collect an image of an object, the light reflected by the object can be further subjected to the light sensing after being processed by the lens 20. Chip 50 is accepted to be suitable for photoelectric conversion. The photosensitive chip 50 is electrically connected to the circuit board assembly 10. The driver 30 is mounted to the circuit board assembly 10, and the lens 20 is mounted to the driver 30 such that the lens 20 is supported above the circuit board assembly 10.
值得一提的，本发明的所述摄像模组亦可实施为一定焦摄像模组，其与所述动焦摄像模组的主要差异在于所述动焦摄像模组通过对焦装置可改变焦距。可以理解的，所述红外吸收镜头结构的所述摄像模组并不因所述摄像模组的类型而受影响，因此，不管是定焦或变焦的摄像模组并不为本发明的限制。It is worth mentioning that the camera module of the present invention can also be implemented as a fixed focus camera module, and the main difference between the camera module and the focus camera module is that the focus camera module can change the focal length through the focus device. It can be understood that the camera module of the infrared absorption lens structure is not affected by the type of the camera module. Therefore, the camera module regardless of the focus or zoom is not limited by the present invention.
根据本发明的实施例，所述线路板组件10通过模塑方式形成一模制支架11和一线路板12，其中所述模制支架11一体地封装连接于所述线路板12。特别地， 所述模制支架11亦可将位于所述线路板组件10上的电子组件包覆保护之。具体地，在制造所述线路板组件10时，可以选择一传统的线路板作为一线路板主体121，其中在所述线路板主体121表面进行模塑。比如，在一实施例中，可以用注塑机，通过嵌入成型(Insert Molding)工艺将进行SMT工艺(Surface Mount Technology表面贴装工艺)后的线路板进行一体封装，比如模塑封装，形成所述模制支架11，或通过半导体封装中常用的模压工艺形成所述模制支架11。所述线路板主体121可以选择为，举例地但不限于，软硬结合板、陶瓷基板(不带软板)、PCB硬板(不带软板)等。所述模制支架11形成的方式可以选择为，举例地但不限于，注塑工艺、模压工艺等。所述模制支架11可以选择的材料为，举例地但不限于，注塑工艺可以选择尼龙、LCP(Liquid Crystal Polymer，液晶高分子聚合物)、PP(Polypropylene，聚丙烯)等，模压工艺可以采用环氧树脂。本领域技术人员应当理解的是，前述可以选择的制造方式以及可以选择的材料，仅作为举例说明本发明的可以实施的方式，并不是本发明的限制。According to an embodiment of the present invention, the circuit board assembly 10 is formed by molding a molded bracket 11 and a circuit board 12, wherein the molded bracket 11 is integrally packaged and connected to the circuit board 12. In particular, the molded bracket 11 can also protect the electronic components located on the circuit board assembly 10. Specifically, in manufacturing the circuit board assembly 10, a conventional wiring board can be selected as a wiring board main body 121 in which molding is performed on the surface of the wiring board main body 121. For example, in an embodiment, the circuit board after the SMT process (Surface Mount Technology surface mount process) may be integrally packaged by an injection molding machine by an insert molding process, such as molding, to form the The molded bracket 11 is molded or formed by a molding process commonly used in a semiconductor package. The circuit board main body 121 may be selected, for example, but not limited to, a soft and hard bonding board, a ceramic substrate (without a soft board), a PCB hard board (without a soft board), and the like. The manner in which the molded bracket 11 is formed may be selected, for example, but not limited to, an injection molding process, a molding process, and the like. The mold holder 11 can be selected from materials such as, but not limited to, nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene, polypropylene), etc. for the injection molding process, and the molding process can be adopted. Epoxy resin. It should be understood by those skilled in the art that the foregoing alternatives and the materials that can be selected are merely illustrative of the embodiments of the invention and are not intended to be limiting.
根据本发明的这个实施例，所述线路板组件10的所述模制支架11可用于支撑所述驱动器30。也就是说，相对传统摄像模组利用支架支撑驱动器的组装制程中，还需通过胶水贴合支架和线路板的方式，本发明则是通过模塑方式一体成型于所述线路板组件10的所述模制支架11支撑所述驱动器30。According to this embodiment of the invention, the molded bracket 11 of the circuit board assembly 10 can be used to support the driver 30. That is to say, in the assembly process of the conventional camera module using the bracket supporting the driver, the bracket and the circuit board are glued together by the glue, and the present invention is integrally molded on the circuit board assembly 10 by molding. The molded bracket 11 supports the driver 30.
根据本发明的这个实施例，所述模制支架11的顶表面112一体平面延伸，其中基于模塑工艺，能够得到良好的表面平整性，故使所述模制支架11不易出现偏移、倾斜现象，以便于为所述驱动器30提供稳定、平整的安装条件。特别地，如图17所示，所述感光芯片50被设置于所述线路板主体121的上表面，所述模制支架11围绕于所述感光芯片50的外侧。另外，如图18所示，在所述模制支架11可同时封装所述线路板12和所述感光芯片50。因此，可以理解的，所述模制支架11的制程和封装的组件并不会成为本发明的限制。According to this embodiment of the invention, the top surface 112 of the molded bracket 11 is integrally planarly extended, wherein a good surface flatness can be obtained based on the molding process, so that the molded bracket 11 is less likely to be displaced or tilted. A phenomenon is provided to provide stable, flat mounting conditions for the driver 30. Specifically, as shown in FIG. 17, the photosensitive chip 50 is disposed on the upper surface of the wiring board main body 121, and the molded bracket 11 surrounds the outer side of the photosensitive chip 50. In addition, as shown in FIG. 18, the wiring board 12 and the photosensitive chip 50 can be simultaneously packaged in the molded holder 11. Accordingly, it will be appreciated that the process and package components of the molded stent 11 are not a limitation of the present invention.
根据本发明的这个实施例，所述镜头20包括至少一镜片21，至少一红外吸收层22以及一镜筒23，其中所述红外吸收层22涂覆于某一片或多片所述镜片21的表面。值得一提的是，所述表面可以是物侧面或像侧面。也就是说，所述红外吸收层22可以只涂覆于所述镜片21的物侧面或像侧面，或者可以涂覆于所述镜片21的两个表面。另外，各所述镜片21被安装于所述镜筒23内。特别地，所述红外吸收层22为有机材料或化合物，其具有存在近红外光谱吸收的特性。 因此，可以理解的，通过所述红外吸收层22阻挡成像系统部分干扰成像质量的红外光，使得所述摄像模组所成影像更加符合人眼的最佳感觉。According to this embodiment of the invention, the lens 20 comprises at least one lens 21, at least one infrared absorbing layer 22 and a lens barrel 23, wherein the infrared absorbing layer 22 is applied to one or more of the lenses 21. surface. It is worth mentioning that the surface may be the side of the object or the side of the image. That is, the infrared absorbing layer 22 may be applied only to the object side or the image side of the lens 21, or may be applied to both surfaces of the lens 21. Further, each of the lenses 21 is mounted in the lens barrel 23. In particular, the infrared absorbing layer 22 is an organic material or compound having characteristics of absorption in the near infrared spectrum. Therefore, it can be understood that the infrared absorbing layer 22 blocks the infrared light of the imaging system partially interfering with the imaging quality, so that the image formed by the camera module is more in line with the best feeling of the human eye.
特别地，当所述镜头20包括多个镜片21时，所述红外吸收层22可根据实际需求涂覆于所述镜片21的外表面。也就是说，所述红外吸收层22可以只涂覆于一个所述镜片21或同时涂覆于多个所述镜片21，其中所述红外吸收层22亦可选则涂覆于装置于所述镜筒23内的最外、中间或最内的所述镜片21涂覆所述红外吸收层22。换言之，所述镜头20可以采用一枚或多枚涂覆有所述红外吸收层22的所述镜片21，依实际需求进行组装而成。本领域技术人员应当理解的是，前述可以选择的制造或组装方式，仅作为举例说明本发明的可以实施的方式，并不是本发明的限制。In particular, when the lens 20 includes a plurality of lenses 21, the infrared absorbing layer 22 may be applied to the outer surface of the lens 21 according to actual needs. That is, the infrared absorbing layer 22 may be applied to only one of the lenses 21 or simultaneously to a plurality of the lenses 21, wherein the infrared absorbing layer 22 is also optionally coated on the device. The outermost, middle or innermost lens 21 in the lens barrel 23 is coated with the infrared absorbing layer 22. In other words, the lens 20 can be assembled by using one or more of the lenses 21 coated with the infrared absorbing layer 22 according to actual needs. It should be understood by those skilled in the art that the foregoing <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt;
因此，可以理解的，所述镜片21涂覆有所述红外吸收层22后以形成吸收式镜片，将一枚或多枚的所述吸收式镜片组装于所述镜筒23后以形成一吸收式镜头。值得一提的，所述吸收式镜头的组装方式和常规摄像模组镜头组装方式相同。另外，所述红外吸收层22的数量可以为2，也就是说，二个所述红外吸收层22分别涂覆于所述镜片21的内外表面，进一步地说，所述红外吸收层22可涂布于所述镜片21的一面或双面，其中优选为1面。本领域技术人员应当理解的是，这并不为本发明的限制。Therefore, it can be understood that the lens 21 is coated with the infrared absorbing layer 22 to form an absorption lens, and one or more of the absorption lenses are assembled to the lens barrel 23 to form an absorption. Lens. It is worth mentioning that the absorption lens is assembled in the same manner as the conventional camera module. In addition, the number of the infrared absorbing layers 22 may be two, that is, two infrared absorbing layers 22 are respectively applied to the inner and outer surfaces of the lens 21, and further, the infrared absorbing layer 22 may be coated. One or both sides of the lens 21 are disposed, and preferably one side. Those skilled in the art will appreciate that this is not a limitation of the invention.
另外，如图19所示，所述镜筒23的数量可以是1个或多个，其中所述镜筒23的数量若为2个以上时，可相互接合，并使所述滤光片40接在其中一个所述镜筒23，以达到滤光效果。进一步地说，所述镜筒23包括第一镜筒233和第二镜筒234，其中所述第二镜筒234接合于所述第一镜筒233，其中接合实施方式可采用目前常见的各种接合技术，像是锁扣组件、螺纹组件、热熔接、超声波接合等。因此，所述第一镜筒233和所述第二镜筒234的接合实施方式并不为本发明的限制。可以理解的，上述举例的镜筒23数量不为本发明的限制。另外，根据实际的摄像需求，所述镜筒23内的镜片数量亦不为本发明的限制。也就是说，所述第一镜筒233可以装置有一或多个所述镜片21。所述第二镜筒234也可以装置有一或多个所述镜片21。进一步地举例，所述第一镜筒233可以装置有二个所述镜片21。所述第二镜筒234可以装置有三个所述镜片21。In addition, as shown in FIG. 19, the number of the lens barrels 23 may be one or more, and when the number of the lens barrels 23 is two or more, they may be joined to each other, and the filter 40 may be used. One of the barrels 23 is attached to achieve a filtering effect. Further, the lens barrel 23 includes a first lens barrel 233 and a second lens barrel 234, wherein the second lens barrel 234 is joined to the first lens barrel 233, wherein the joint embodiment can adopt various currently common ones. Bonding techniques, such as a latch assembly, a threaded component, a heat seal, an ultrasonic joint, and the like. Therefore, the joint embodiment of the first barrel 233 and the second barrel 234 is not a limitation of the present invention. It is to be understood that the number of the lens barrels 23 exemplified above is not a limitation of the present invention. In addition, the number of lenses in the lens barrel 23 is not limited by the present invention according to actual imaging requirements. That is, the first barrel 233 can be equipped with one or more of the lenses 21. The second barrel 234 can also be equipped with one or more of the lenses 21. Further by way of example, the first barrel 233 can be equipped with two of the lenses 21. The second barrel 234 can be equipped with three of the lenses 21.
值得一提的，所述摄像模组通过所述镜片21上的所述红外吸收层22，从而可使所述摄像模组既达到滤光的功能，因此，可以理解的，本实施例无需通过所 述滤光片40进行滤光。It is to be noted that the camera module can pass the infrared absorbing layer 22 on the lens 21, so that the camera module can achieve the function of filtering. Therefore, it can be understood that the embodiment does not need to pass. The filter 40 is filtered.
另外，所述镜片21可由树脂、塑料或玻璃材质所制。所述红外吸收层22为具有吸收性质的化合物或有机材料，特别是存在近红外光谱吸收的特性，其中所述近红外光谱为565nm～1200nm波段。另外，值得一提的是，所述红外吸收层22为液体材料经过涂布、烘烤方式加工形成于所述镜片21，其中所述涂布方式可选择浸泡、离心力旋涂等物理气相沉积技术或化学气相沉积技术，这并为本发明的限制。另外，所述镜片21可以通过拼版或晶圆级(wafer level)作业进行涂布和烘烤所述红外吸收层22，以提高产品生产效率，减少制作成本。Further, the lens 21 may be made of a resin, a plastic or a glass material. The infrared absorbing layer 22 is a compound or an organic material having an absorbing property, in particular, a characteristic of absorption in a near-infrared spectrum, wherein the near-infrared spectrum is in a wavelength band of 565 nm to 1200 nm. In addition, it is worth mentioning that the infrared absorbing layer 22 is formed on the lens 21 by coating and baking a liquid material, wherein the coating method can select physical vapor deposition technology such as immersion, centrifugal spin coating or the like. Or chemical vapor deposition techniques, which are a limitation of the invention. In addition, the lens 21 can coat and bake the infrared absorbing layer 22 by imposition or wafer level work to improve product production efficiency and reduce manufacturing costs.
值得一提的，所述化合物，其优选为溶剂可溶型色素化合物，更优选地为系选自由酞菁系化合物、方酸内鎓系化合物、萘酞菁系化合物、六元卟啉系化合物、克酮鎓系化合物以及花青系化合物所组成的群组中的至少一种。因此，当所述化合物作为所述红外吸收层22涂布于所述镜片21时，可以涂布为单层、双层或多层。可以理解的，即将酞菁系化合物、方酸内鎓系化合物、萘酞菁系化合物、六元卟啉系化合物、克酮鎓系化合物以及花青系化合物所组成的群组中的至少一种或多种涂布于所述镜片21，也就是说将具有吸收性质的化合物涂布于所述镜片21。It is to be noted that the compound is preferably a solvent-soluble pigment compound, and more preferably selected from the group consisting of a phthalocyanine compound, a squaraine lanthanide compound, a naphthalocyanine compound, and a hexavalent porphyrin compound. At least one of the group consisting of a ketone oxime compound and a cyanine compound. Therefore, when the compound is applied to the lens 21 as the infrared absorbing layer 22, it may be applied as a single layer, a double layer or a plurality of layers. It is understood that at least one of a group consisting of a phthalocyanine compound, a squarylium ruthenium compound, a naphthalocyanine compound, a hexavalent porphyrin compound, a ketone oxime compound, and a cyanine compound A plurality of coatings are applied to the lens 21, that is, a compound having an absorbing property is applied to the lens 21.
在本发明的这个实施例中，所述感光芯片50被设置于所述线路板主体121的上表面，其中在制造所述线路板组件10时，可以选择不同制造顺序，举例地但不限于，在一种实施方式中，可以先在所述线路板主体121上安装所述感光芯片50，而后在所述感光芯片50外侧，所述线路板主体121上模塑形成所述模制支架11。而在本发明的另一种实施方式中，可以先在所述线路板主体121上模塑形成所述模制支架11，继而将所述感光芯片50安装于所述线路板主体121，使其位于所述模制支架11的内侧。In this embodiment of the invention, the photosensitive chip 50 is disposed on an upper surface of the wiring board main body 121, wherein when manufacturing the circuit board assembly 10, different manufacturing sequences may be selected, for example, but not limited to, In one embodiment, the photosensitive chip 50 may be first mounted on the wiring board main body 121, and then the molded bracket 11 is molded on the wiring board main body 121 outside the photosensitive chip 50. In another embodiment of the present invention, the molded holder 11 may be molded on the circuit board main body 121, and then the photosensitive chip 50 may be mounted on the circuit board main body 121. Located inside the molded bracket 11.
值得一提的，所述感光芯片50通过一系列引线53连接于所述线路板组件10。所述引线53可以被实施为，举例地但不限于，金线、铜线、铝线、银线。特别地，所述感光芯片50的所述系列引线53可以通过传统的COB方式连接于所述线路板组件10，举例地但不限于，焊接的方式。It is worth mentioning that the photosensitive chip 50 is connected to the circuit board assembly 10 through a series of leads 53. The lead 53 may be implemented as, for example but not limited to, a gold wire, a copper wire, an aluminum wire, a silver wire. In particular, the series of leads 53 of the photosensitive chip 50 can be attached to the circuit board assembly 10 by conventional COB means, such as, but not limited to, soldering.
如图20所示，是根据本发明的第二个优选实施例的摄像模组的第一变形实施例，其中所述感光芯片50采用芯片倒装方式FC(Flip Chip)安装于所述线路板组件10。所述芯片倒装方式FC(Flip Chip)即是将所述感光芯片50从所述线 路板组件10的背面方向安装于所述线路板组件10，且所述感光芯片50的感光区朝上地安装于所述线路板组件10。这样的结构以及安装方式，使得所述感光芯片50和所述模制支架11相对独立，所述感光芯片50的安装不会受到所述模制支架11的影响，所述模制支架11的模塑成型对所述感光芯片50的影响也较小。进一步的说，所述线路板12包括一线路板主体121，所述线路板主体121具有一通路1211，所述通路1211的下部适于安装所述感光芯片30。所述通路1211使得所述线路板主体121上下两侧相连通，从而当所述感光芯片50由所述线路板主体121的背面、并且感光区朝上地安装于所述线路板主体121时，所述感光芯片50的感光区能够接收到由所述镜头20进入的光线。另外，所述线路板主体121具有一外凹槽1212，所述外凹槽1212连通于对应的所述通路，提供所述感光芯片50的安装位置。As shown in FIG. 20, it is a first modified embodiment of the camera module according to the second preferred embodiment of the present invention, wherein the photosensitive chip 50 is mounted on the circuit board by using a flip chip FC (Flip Chip). Component 10. The flip chip type FC (Flip Chip) is mounted on the circuit board assembly 10 from the back side of the circuit board assembly 10, and the photosensitive area of the photosensitive chip 50 faces upward. Mounted to the circuit board assembly 10. Such a structure and mounting manner are such that the photosensitive chip 50 and the molded holder 11 are relatively independent, and the mounting of the photosensitive chip 50 is not affected by the molded bracket 11, and the mold of the molded bracket 11 The influence of the molding on the photosensitive chip 50 is also small. Further, the circuit board 12 includes a circuit board main body 121 having a passage 1211, and a lower portion of the passage 1211 is adapted to mount the photosensitive chip 30. The via 1211 allows the upper and lower sides of the wiring board main body 121 to communicate, so that when the photosensitive chip 50 is mounted on the back surface of the wiring board main body 121 and the photosensitive area is mounted on the wiring board main body 121, The photosensitive area of the photosensitive chip 50 is capable of receiving light entering by the lens 20. In addition, the circuit board main body 121 has an outer recess 1212, and the outer recess 1212 communicates with the corresponding passage to provide a mounting position of the photosensitive chip 50.
根据本实施例，本发明还提供一摄像模组的近红外光谱吸收方法，其中包括如下步骤：According to the embodiment, the present invention further provides a near infrared spectroscopy absorption method of a camera module, which includes the following steps:
(a)光通过镜头20，并由其吸收红外光；以及(a) light passes through the lens 20 and absorbs infrared light therefrom;
(b)投射于感光芯片50。(b) Projected on the photosensitive chip 50.
根据步骤(a)，其中所述镜头包括至少一镜片21和至少一红外吸收层22，其中所述红外吸收层22通过一涂布方式位于所述镜片21的表面。其中所述涂覆方式采用浸泡、离心力旋涂的物理气相沉积技术或化学气相沉积技术。According to the step (a), wherein the lens comprises at least one lens 21 and at least one infrared absorbing layer 22, wherein the infrared absorbing layer 22 is located on the surface of the lens 21 by a coating method. The coating method adopts physical vapor deposition technology or chemical vapor deposition technology of immersion, centrifugal force spin coating.
根据步骤(a)，其中所述红外吸收层22为有机材料，且存在近红外光谱吸收的特性，其中所述近红外光谱为565nm～1200nm波段。According to the step (a), wherein the infrared absorbing layer 22 is an organic material and has a characteristic of absorption in the near-infrared spectrum, wherein the near-infrared spectrum is in the band of 565 nm to 1200 nm.
根据步骤(a)，其中所述红外吸收层22在涂覆前为液体材料。According to step (a), wherein the infrared absorbing layer 22 is a liquid material prior to coating.
如图21至图23所示，是根据本发明的第三个优选实施例的基于红外吸收镜头结构的摄像模组，所述摄像模组可以是一动焦摄像模组，其中包括一线路板组件10、一镜头20、一驱动器30，和一感光芯片50。所述镜头20位于所述感光芯片50的感光路径，从而在所述摄像模组用于采集物体的影像时，被物体反射的光线能够在藉由所述镜头20的处理之后进一步被所述感光芯片50接受以适于进行光电转化。所述感光芯片50电连接于所述线路板组件10上。所述驱动器30被安装于所述线路板组件10，所述镜头20被安装于所述驱动器30，以使得所述镜头20被支撑于所述线路板组件10上方。As shown in FIG. 21 to FIG. 23, a camera module based on an infrared absorption lens structure according to a third preferred embodiment of the present invention, the camera module may be a dynamic focus camera module including a circuit board assembly. 10. A lens 20, a driver 30, and a sensor chip 50. The lens 20 is located in the photosensitive path of the photosensitive chip 50, so that when the camera module is used to collect an image of an object, the light reflected by the object can be further subjected to the light sensing after being processed by the lens 20. Chip 50 is accepted to be suitable for photoelectric conversion. The photosensitive chip 50 is electrically connected to the circuit board assembly 10. The driver 30 is mounted to the circuit board assembly 10, and the lens 20 is mounted to the driver 30 such that the lens 20 is supported above the circuit board assembly 10.
值得一提的，本发明的所述摄像模组亦可实施为一定焦摄像模组，其与所述 动焦摄像模组的主要差异在于所述动焦摄像模组通过对焦装置可改变焦距。可以理解的，所述红外吸收镜头结构的所述摄像模组并不因所述摄像模组的类型而受影响，因此，不管是定焦或变焦的摄像模组并不为本发明的限制。It is worth mentioning that the camera module of the present invention can also be implemented as a fixed focus camera module, and the main difference between the camera module and the focus camera module is that the focus camera module can change the focal length through the focus device. It can be understood that the camera module of the infrared absorption lens structure is not affected by the type of the camera module. Therefore, the camera module regardless of the focus or zoom is not limited by the present invention.
根据本发明的实施例，所述线路板组件10通过模塑方式形成一模制支架11和一线路板12，其中所述模制支架11一体地封装连接于所述线路板12。特别地，所述模制支架11亦可将位于所述线路板组件10上的电子组件包覆保护之。具体地，在制造所述线路板组件10时，可以选择一传统的线路板作为一线路板主体121，其中在所述线路板主体121表面进行模塑。比如，在一实施例中，可以用注塑机，通过嵌入成型(Insert Molding)工艺将进行SMT工艺(Surface Mount Technology表面贴装工艺)后的线路板进行一体封装，比如模塑封装，形成所述模制支架11，或通过半导体封装中常用的模压工艺形成所述模制支架11。所述线路板主体121可以选择为，举例地但不限于，软硬结合板、陶瓷基板(不带软板)、PCB硬板(不带软板)等。所述模制支架11形成的方式可以选择为，举例地但不限于，注塑工艺、模压工艺等。所述模制支架11可以选择的材料为，举例地但不限于，注塑工艺可以选择尼龙、LCP(Liquid Crystal Polymer，液晶高分子聚合物)、PP(Polypropylene，聚丙烯)等，模压工艺可以采用环氧树脂。本领域技术人员应当理解的是，前述可以选择的制造方式以及可以选择的材料，仅作为举例说明本发明的可以实施的方式，并不是本发明的限制。According to an embodiment of the present invention, the circuit board assembly 10 is formed by molding a molded bracket 11 and a circuit board 12, wherein the molded bracket 11 is integrally packaged and connected to the circuit board 12. In particular, the molded bracket 11 can also protect the electronic components located on the circuit board assembly 10. Specifically, in manufacturing the circuit board assembly 10, a conventional wiring board can be selected as a wiring board main body 121 in which molding is performed on the surface of the wiring board main body 121. For example, in an embodiment, the circuit board after the SMT process (Surface Mount Technology surface mount process) may be integrally packaged by an injection molding machine by an insert molding process, such as molding, to form the The molded bracket 11 is molded or formed by a molding process commonly used in a semiconductor package. The circuit board main body 121 may be selected, for example, but not limited to, a soft and hard bonding board, a ceramic substrate (without a soft board), a PCB hard board (without a soft board), and the like. The manner in which the molded bracket 11 is formed may be selected, for example, but not limited to, an injection molding process, a molding process, and the like. The mold holder 11 can be selected from materials such as, but not limited to, nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene, polypropylene), etc. for the injection molding process, and the molding process can be adopted. Epoxy resin. It should be understood by those skilled in the art that the foregoing alternatives and the materials that can be selected are merely illustrative of the embodiments of the invention and are not intended to be limiting.
根据本发明的这个实施例，所述线路板组件10的所述模制支架11可用于支撑所述驱动器30。也就是说，相对传统摄像模组利用支架支撑驱动器的组装制程中，还需通过胶水贴合支架和线路板的方式，本发明则是通过模塑方式一体成型于所述线路板组件10的所述模制支架11支撑所述驱动器30。According to this embodiment of the invention, the molded bracket 11 of the circuit board assembly 10 can be used to support the driver 30. That is to say, in the assembly process of the conventional camera module using the bracket supporting the driver, the bracket and the circuit board are glued together by the glue, and the present invention is integrally molded on the circuit board assembly 10 by molding. The molded bracket 11 supports the driver 30.
根据本发明的这个实施例，所述模制支架11的顶表面112一体平面延伸，其中基于模塑工艺，能够得到良好的表面平整性，故使所述模制支架11不易出现偏移、倾斜现象，以便于为所述驱动器30提供稳定、平整的安装条件。特别地，如图21所示，所述感光芯片50被设置于所述线路板主体121的上表面，所述模制支架11围绕于所述感光芯片50的外侧。另外，如图22所示，在所述模制支架11可同时封装所述线路板12和所述感光芯片50。因此，可以理解的，所述模制支架11的制程和封装的组件并不会成为本发明的限制。According to this embodiment of the invention, the top surface 112 of the molded bracket 11 is integrally planarly extended, wherein a good surface flatness can be obtained based on the molding process, so that the molded bracket 11 is less likely to be displaced or tilted. A phenomenon is provided to provide stable, flat mounting conditions for the driver 30. Specifically, as shown in FIG. 21, the photosensitive chip 50 is disposed on the upper surface of the wiring board main body 121, and the molded bracket 11 surrounds the outer side of the photosensitive chip 50. In addition, as shown in FIG. 22, the wiring board 12 and the photosensitive chip 50 can be simultaneously packaged in the mold holder 11. Accordingly, it will be appreciated that the process and package components of the molded stent 11 are not a limitation of the present invention.
值得一提的，所述镜头20包括至少一镜片21和至少一镜筒23，其中所述镜 片21为有机材料或化合物所制，其中所述镜片21存在近红外光谱吸收的特性并装置于所述镜筒23内。特别地，所述近红外光谱为565nm～1200nm波段。进一步地说，所述镜片21通过所述有机材料或化合物制成一吸收式镜片。可以理解的所述镜头20可以采用一枚或多枚吸收式镜片组装而成。也就是说，将一枚或多枚的所述吸收式镜片组装后以形成一吸收式镜头。值得一提的，所述吸收式镜头的组装方式和常规摄像模组镜头组装方式相同。It is worth mentioning that the lens 20 comprises at least one lens 21 and at least one lens barrel 23, wherein the lens 21 is made of an organic material or a compound, wherein the lens 21 has a characteristic of absorption in the near infrared spectrum and is installed in the device. Inside the lens barrel 23. In particular, the near-infrared spectrum is in the 565 nm to 1200 nm band. Further, the lens 21 is made of an absorbent lens by the organic material or compound. It will be appreciated that the lens 20 can be assembled from one or more absorbent lenses. That is, one or more of the absorption lenses are assembled to form an absorption lens. It is worth mentioning that the absorption lens is assembled in the same manner as the conventional camera module.
另外，如图23所示，所述镜筒23的数量可以是1个或多个，其中所述镜筒23的数量若为2个以上时，可相互接合，并使所述滤光片40接在其中一个所述镜筒23，以达到滤光效果。进一步地说，所述镜筒23包括第一镜筒233和第二镜筒234，其中所述第二镜筒234接合于所述第一镜筒233，其中接合实施方式可采用目前常见的各种接合技术，像是锁扣组件、螺纹组件、热熔接、超声波接合等。因此，所述第一镜筒233和所述第二镜筒234的接合实施方式并不为本发明的限制。可以理解的，上述举例的镜筒23数量不为本发明的限制。另外，根据实际的摄像需求，所述镜筒23内的镜片数量亦不为本发明的限制。也就是说，所述第一镜筒233可以装置有一或多个所述镜片21。所述第二镜筒234也可以装置有一或多个所述镜片21。进一步地举例，所述第一镜筒233可以装置有二个所述镜片21。所述第二镜筒234可以装置有三个所述镜片21。In addition, as shown in FIG. 23, the number of the lens barrels 23 may be one or more, and when the number of the lens barrels 23 is two or more, they may be joined to each other, and the filter 40 may be used. One of the barrels 23 is attached to achieve a filtering effect. Further, the lens barrel 23 includes a first lens barrel 233 and a second lens barrel 234, wherein the second lens barrel 234 is joined to the first lens barrel 233, wherein the joint embodiment can adopt various currently common ones. Bonding techniques, such as a latch assembly, a threaded component, a heat seal, an ultrasonic joint, and the like. Therefore, the joint embodiment of the first barrel 233 and the second barrel 234 is not a limitation of the present invention. It is to be understood that the number of the lens barrels 23 exemplified above is not a limitation of the present invention. In addition, the number of lenses in the lens barrel 23 is not limited by the present invention according to actual imaging requirements. That is, the first barrel 233 can be equipped with one or more of the lenses 21. The second barrel 234 can also be equipped with one or more of the lenses 21. Further by way of example, the first barrel 233 can be equipped with two of the lenses 21. The second barrel 234 can be equipped with three of the lenses 21.
值得一提的，所述化合物，其优选为溶剂可溶型色素化合物，更优选地为系选自由酞菁系化合物、方酸内鎓系化合物、萘酞菁系化合物、六元卟啉系化合物、克酮鎓系化合物以及花青系化合物所组成的群组中的至少一种。因此，当由所述化合物作制成所述镜片21时。可以理解的，即是将酞菁系化合物、方酸内鎓系化合物、萘酞菁系化合物、六元卟啉系化合物、克酮鎓系化合物以及花青系化合物所组成的群组中的至少一种或多种制成所述镜片21，这样所述镜片即具有吸收性质。It is to be noted that the compound is preferably a solvent-soluble pigment compound, and more preferably selected from the group consisting of a phthalocyanine compound, a squaraine lanthanide compound, a naphthalocyanine compound, and a hexavalent porphyrin compound. At least one of the group consisting of a ketone oxime compound and a cyanine compound. Therefore, when the lens 21 is made of the compound. It is understood that at least a group consisting of a phthalocyanine compound, a squaraine lanthanide compound, a naphthalocyanine compound, a hexavalent porphyrin compound, a ketone oxime compound, and a cyanine compound The lens 21 is made of one or more such that the lens has an absorbing property.
因此，可以理解的，所述摄像模组的红外吸收结构是通过所述镜片21的制制材质本身的特性所形成，进一步可以理解的，通过具有近红外光谱吸收的特性的所述镜片21，以在所述摄像模组中省略传统的滤光片，从而可使所述摄像模组既达到滤光的功能又能减化结构，从而使所述摄像模组的整体结构变薄。也就是说，所述镜片21取代一般的滤光片，进而使所述摄像模组的结构变薄。另外，所述吸收式镜片，可通过球状蓝玻璃非球面压型加工得到。Therefore, it can be understood that the infrared absorption structure of the camera module is formed by the characteristics of the material of the lens 21 itself, and it is further understood that the lens 21 has the characteristics of absorption near the infrared spectrum. In order to omit the conventional filter in the camera module, the camera module can achieve both the filtering function and the reduced structure, thereby making the overall structure of the camera module thin. That is to say, the lens 21 replaces a general filter, thereby making the structure of the camera module thin. Further, the absorption lens can be obtained by aspherical blue glass aspherical surface forming.
根据本发明的这个实施例，所述感光芯片50通过一系列引线53连接于所述线路板组件10。所述引线53可以被实施为，举例地但不限于，金线、铜线、铝线、银线。特别地，所述感光芯片50的所述系列引线53可以通过传统的COB方式连接于所述线路板组件10，举例地但不限于，焊接的方式。值得一提的，所述感光芯片50安装于所述线路板组件10时，不管是采用板上芯片封装(COB)或是芯片倒装方式(Flip Chip)皆不为本发明的限制。According to this embodiment of the invention, the photosensitive chip 50 is attached to the wiring board assembly 10 through a series of leads 53. The lead 53 may be implemented as, for example but not limited to, a gold wire, a copper wire, an aluminum wire, a silver wire. In particular, the series of leads 53 of the photosensitive chip 50 can be attached to the circuit board assembly 10 by conventional COB means, such as, but not limited to, soldering. It should be noted that when the photosensitive chip 50 is mounted on the circuit board assembly 10, neither the chip-on-board package (COB) nor the chip flipping method (Flip Chip) is limited by the present invention.
如图24所示，是根据本发明的第三个优选实施例的摄像模组的第一变形实施例，其中采用不同于传统的芯片安装方式，即芯片倒装方式FC(Flip Chip)。所述传统的芯片安装方式即是将所述感光芯片50封装安装于所述线路板组件10的上方。所述芯片倒装方式FC(Flip Chip)即是将所述感光芯片50从所述线路板组件10的背面方向安装于所述线路板组件10，且所述感光芯片50的感光区朝上地安装于所述线路板组件10。这样的结构以及安装方式，使得所述感光芯片50和所述模制支架11相对独立，所述感光芯片50的安装不会受到所述模制支架11的影响，所述模制支架11的模塑成型对所述感光芯片50的影响也较小。本领域的技术人员应理解，所述感光芯片50安装方式，并不为本发明的限制。As shown in FIG. 24, it is a first modified embodiment of the camera module according to the third preferred embodiment of the present invention, in which a different chip mounting method, that is, a flip chip FC (Flip Chip) is used. The conventional chip mounting method is to package the photosensitive chip 50 above the circuit board assembly 10. The flip chip type FC (Flip Chip) is mounted on the circuit board assembly 10 from the back side of the circuit board assembly 10, and the photosensitive area of the photosensitive chip 50 faces upward. Mounted to the circuit board assembly 10. Such a structure and mounting manner are such that the photosensitive chip 50 and the molded holder 11 are relatively independent, and the mounting of the photosensitive chip 50 is not affected by the molded bracket 11, and the mold of the molded bracket 11 The influence of the molding on the photosensitive chip 50 is also small. Those skilled in the art should understand that the manner in which the photosensitive chip 50 is mounted is not a limitation of the present invention.
另外，如图25所示，是根据本发明的第三个优选实施例的摄像模组的第二变形实施例，其中所述摄像模组可增加一滤光片40，设置于所述镜头20的光行经路径。将所述滤光片40实施为一普通玻璃滤光片，以节省所述摄像模组的成本和结构厚度。所述滤光片40的厚度减薄至<0.15mm。In addition, as shown in FIG. 25, a second modified embodiment of the camera module according to the third preferred embodiment of the present invention, wherein the camera module can add a filter 40 disposed on the lens 20 The light travels through the path. The filter 40 is implemented as a common glass filter to save cost and structural thickness of the camera module. The thickness of the filter 40 is reduced to <0.15 mm.
根据本实施例，本发明还提供一摄像模组的近红外光谱吸收方法，其中包括如下步骤：According to the embodiment, the present invention further provides a near infrared spectroscopy absorption method of a camera module, which includes the following steps:
(a)光通过镜头20，并由其吸收红外光；以及(a) light passes through the lens 20 and absorbs infrared light therefrom;
(b)投射于感光芯片50。(b) Projected on the photosensitive chip 50.
根据步骤(a)，其中所述镜头包括至少一镜片，所述镜片21为有机材料所制，其中存在近红外光谱吸收的特性。所述近红外光谱为565nm～1200nm波段。According to the step (a), wherein the lens comprises at least one lens, the lens 21 is made of an organic material in which there is a characteristic of absorption in the near infrared spectrum. The near-infrared spectrum is in the range of 565 nm to 1200 nm.
如图26至图30所示，是根据本发明的第四个优选实施例的摄像模组，其为基于红外吸收结构的摄像模组。所述摄像模组可实施为变焦摄像模组或定焦摄像模组，其中主要差异为所述动焦摄像模组通过对焦装置可改变焦距。如图26所示，以动焦摄像模组进行阐述，本发明中基于红外吸收结构的所述摄像模组包括一线路板组件10，一镜头20，一驱动器30，一滤光片40和一感光芯片50。所 述镜头20位于所述感光芯片50的感光路径，从而在所述摄像模组用于采集物体的影像时，被物体反射的光线能够在藉由所述镜头20的处理之后进一步被所述感光芯片50接受以适于进行光电转化。所述滤光片40设置于所述镜头20的光行经路径或所述感光芯片50的感光路径。所述感光芯片50电连接于所述线路板组件10上。所述驱动器30被安装于所述线路板组件10，所述镜头20被安装于所述驱动器30，以使得所述镜头20被支撑于所述线路板组件10上方。所述线路板组件10可以被耦接至所述电子设备，从而与所述电子设备配合使用。值得一提的是，所述驱动器30可实施为马达、热驱动器或微致动器(MEMS)等。如图27所示，以定焦摄像模组进行阐述，本发明中基于红外吸收结构的所述摄像模组包括一线路板组件10，一镜头20，一滤光片40，一感光芯片50和一镜头支架60。所述镜头20位于所述感光芯片50的感光路径，从而在所述摄像模组用于采集物体的影像时，被物体反射的光线能够在藉由所述镜头20的处理之后进一步被所述感光芯片50接受以适于进行光电转化。所述滤光片40设置于所述镜头20的光行经路径或所述感光芯片50的感光路径。所述感光芯片50电连接于所述线路板组件10上。所述镜头支架60被安装于所述线路板组件10，所述镜头20被安装于所述镜头支架60，以使得所述镜头20被支撑于所述线路板组件10上方。所述线路板组件10可以被耦接至所述电子设备，从而与所述电子设备配合使用。As shown in FIG. 26 to FIG. 30, it is a camera module according to a fourth preferred embodiment of the present invention, which is an imaging module based on an infrared absorption structure. The camera module can be implemented as a zoom camera module or a fixed focus camera module, wherein the main difference is that the focus camera module can change the focal length through the focus device. As shown in FIG. 26, the camera module based on the infrared absorption structure of the present invention includes a circuit board assembly 10, a lens 20, a driver 30, a filter 40 and a Photosensitive chip 50. The lens 20 is located in the photosensitive path of the photosensitive chip 50, so that when the camera module is used to collect an image of an object, the light reflected by the object can be further subjected to the light sensing after being processed by the lens 20. Chip 50 is accepted to be suitable for photoelectric conversion. The filter 40 is disposed on a light path of the lens 20 or a photosensitive path of the photosensitive chip 50. The photosensitive chip 50 is electrically connected to the circuit board assembly 10. The driver 30 is mounted to the circuit board assembly 10, and the lens 20 is mounted to the driver 30 such that the lens 20 is supported above the circuit board assembly 10. The circuit board assembly 10 can be coupled to the electronic device for use with the electronic device. It is worth mentioning that the driver 30 can be implemented as a motor, a thermal driver or a microactuator (MEMS) or the like. As shown in FIG. 27, the camera module based on the infrared absorption structure of the present invention includes a circuit board assembly 10, a lens 20, a filter 40, a sensor chip 50, and A lens holder 60. The lens 20 is located in the photosensitive path of the photosensitive chip 50, so that when the camera module is used to collect an image of an object, the light reflected by the object can be further subjected to the light sensing after being processed by the lens 20. Chip 50 is accepted to be suitable for photoelectric conversion. The filter 40 is disposed on a light path of the lens 20 or a photosensitive path of the photosensitive chip 50. The photosensitive chip 50 is electrically connected to the circuit board assembly 10. The lens holder 60 is mounted to the circuit board assembly 10, and the lens 20 is mounted to the lens holder 60 such that the lens 20 is supported above the circuit board assembly 10. The circuit board assembly 10 can be coupled to the electronic device for use with the electronic device.
值得一提的，所述滤光片40包括一滤光片本体41，至少一吸收式滤光层42，以及二镀膜层43，其中所述吸收式滤光层42通过一涂布方式位于所述滤光片本体41的一表面。二所述镀膜层43分别为于所述滤光片本体41的另一表面和所述吸收式滤光层42的表面。进一步地说，所述滤光片本体41，所述吸收式滤光层42，以及二所述镀膜层43形成三明治结构，其中所述吸收式滤光层42位于所述滤光片本体41的上表面，二所述镀膜层43则分别位于所述吸收式滤光层42的上表面和所述滤光片本体41的下表面。另外，可以理解的，所述吸收式滤光层42亦可为二层，即分别位于所述滤光片本体41的上下表面。因此，二所述镀膜层43则分别位于二所述吸收式滤光层42。或者，所述吸收式滤光层42可位于所述滤光片本体41的下表面，二所述镀膜层43则分别位于所述吸收式滤光层42的下表面和所述滤光片本体41的上表面。因此，可以理解的，所述摄像模组的红外吸收结构是通过所述滤光片40所形成，与传统蓝玻璃镀膜滤光片不同 的是无厚度的限制，因此，可使所述摄像模组既达到滤光的功能又能使整体结构变薄。It is worth mentioning that the filter 40 comprises a filter body 41, at least one absorption filter layer 42, and a two-coat layer 43, wherein the absorption filter layer 42 is located by a coating method. A surface of the filter body 41 is described. The coating layer 43 is on the other surface of the filter body 41 and the surface of the absorption filter layer 42, respectively. Further, the filter body 41, the absorbing filter layer 42, and the two coating layers 43 form a sandwich structure, wherein the absorbing filter layer 42 is located at the filter body 41. The upper surface, the two coating layers 43 are respectively located on the upper surface of the absorption filter layer 42 and the lower surface of the filter body 41. In addition, it can be understood that the absorption filter layer 42 can also be two layers, that is, respectively located on the upper and lower surfaces of the filter body 41. Therefore, the two coating layers 43 are respectively located on the two absorption filter layers 42. Alternatively, the absorption filter layer 42 may be located on a lower surface of the filter body 41, and the coating layer 43 is respectively located on a lower surface of the absorption filter layer 42 and the filter body. The upper surface of 41. Therefore, it can be understood that the infrared absorption structure of the camera module is formed by the filter 40, and unlike the conventional blue glass coating filter, there is no thickness limitation, and therefore, the imaging mode can be made. The group achieves both the function of filtering and the thinning of the overall structure.
另外，所述滤光片本体41可由树脂、塑料或玻璃材质所制。所述吸收式滤光层42为具有吸收性质的化合物，特别是存在近红外光谱吸收的特性，其中所述近红外光谱为565nm～1200nm波段。另外，值得一提的是，所述吸收式滤光层42为液体材料经过涂布、烘烤方式加工形成于所述滤光片本体41，其中所述涂布方式可选择浸泡、离心力旋涂等物理气相沉积技术或化学气相沉积技术，这并不成为本发明的限制。另外，所述滤光片40可以通过拼版或wafer level作业进行涂布和烘烤方式加工，以提高产品生产效率，减少制作成本。值得一提的，所述吸收式滤光层42为液体材料涂布于所述滤光片本体41时，可以涂布为单层、双层或多层，其不为本发明的限制。更具体地，通过在所述摄像模组的成像系统中加入所述滤光片40，以利用所述吸收式滤光层42阻挡成像系统部分干扰成像质量的红外光，使得所述摄像模组所成影像更加符合人眼的最佳感觉。Further, the filter body 41 may be made of a resin, a plastic or a glass material. The absorption filter layer 42 is a compound having an absorption property, particularly a characteristic of absorption in the near-infrared spectrum, wherein the near-infrared spectrum is in the range of 565 nm to 1200 nm. In addition, it is worth mentioning that the absorption filter layer 42 is formed by coating and baking a liquid material on the filter body 41, wherein the coating method can be selected by immersion or centrifugal spin coating. Such as physical vapor deposition techniques or chemical vapor deposition techniques, this is not a limitation of the present invention. In addition, the filter 40 can be processed by coating or baking by imposition or wafer level work to improve product production efficiency and reduce manufacturing cost. It should be noted that when the liquid filter material 42 is applied to the filter body 41, the absorptive filter layer 42 may be coated as a single layer, a double layer or a plurality of layers, which is not limited by the invention. More specifically, the filter module 40 is added to the imaging system of the camera module to block the infrared light of the imaging system partially interfering with the imaging quality by using the absorption filter layer 42 to make the camera module The resulting image is more in line with the best feeling of the human eye.
另外，所述化合物，可相同于上述实施例中的红外吸收层22，其优选为溶剂可溶型色素化合物，更优选地为系选自由酞菁系化合物、方酸内鎓系化合物、萘酞菁系化合物、六元卟啉系化合物、克酮鎓系化合物以及花青系化合物所组成的群组中的至少一种。因此，当所述化合物作为所述吸收式滤光层42涂布于所述滤光片本体41时，可以涂布为单层、双层或多层。可以理解的，即可将酞菁系化合物、方酸内鎓系化合物、萘酞菁系化合物、六元卟啉系化合物、克酮鎓系化合物以及花青系化合物所组成的群组中的至少一种或多种涂布于所述滤光片本体41，也就是说将具有吸收性质的化合物涂布于所述滤光片本体41即可。Further, the compound may be the same as the infrared absorbing layer 22 in the above embodiment, which is preferably a solvent-soluble pigment compound, more preferably selected from the group consisting of a phthalocyanine compound, a squaraine lanthanide compound, and naphthoquinone. At least one of the group consisting of a cyanine compound, a hexavalent porphyrin compound, a ketone oxime compound, and a cyanine compound. Therefore, when the compound is applied to the filter body 41 as the absorption filter layer 42, it may be applied as a single layer, a double layer or a plurality of layers. It is understood that at least at least a group consisting of a phthalocyanine-based compound, a squaraine-based ruthenium-based compound, a naphthalocyanine-based compound, a hexa-valent porphyrin-based compound, a ketone oxime-based compound, and a cyanine compound can be used. One or more kinds are applied to the filter body 41, that is, a compound having an absorbing property is applied to the filter body 41.
值得一提的，所述化合物，式Ⅰ和式Ⅱ表示所述方酸内鎓系化合物。It is worth mentioning that the compound, Formula I and Formula II represent the squaraine lanthanide compound.
其中，式Ⅰ中R
a、R
b及Y满足下述(a)或(b)的条件
Wherein, R a , R b and Y in the formula I satisfy the conditions of the following (a) or (b)
条件(a)Condition (a)
存在多个的R
a分别独立表示氢原子、卤素原子、磺基、羟基、氰基、硝基、羧基、怜酸基、-L
1或-NR
eR
f基。R
e及R
f分别独立地表示氢原子、-L
a、-L
b、-L
c、-L
d或-L
e。
There are a plurality of R a independently representing a hydrogen atom, a halogen atom, a sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a pity acid group, a -L 1 or a -NR e R f group. R e and R f each independently represent a hydrogen atom, -L a , -L b , -L c , -L d or -L e .
存在多个的R
b分别独立表示氢原子、卤素原子磺基、羟基、氰基、硝基、羧基、怜酸基、-L
1或-NR
gR
h基。R
g及R
h分别独立地表示氢原子、-L
a、-L
b、-L
c、-L
d或-L
e或-C(O)R
i基(R
i表示-L
a、-L
b、-L
c、-L
d或-L
e)。
The plurality of R b present independently represent a hydrogen atom, a halogen atom sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a pity acid group, a -L 1 or a -NR g R h group. R g and R h each independently represent a hydrogen atom, -L a , -L b , -L c , -L d or -L e or -C(O)R i group (R i represents -L a , -L b , -L c , -L d or -L e ).
存在多个的Y分别独立表示-NR
jR
k基。R
j及R
k分别独立地表示氢原子、-L
a、-L
b、-L
c、-L
d或-L
e。
There are a plurality of Ys respectively representing the -NR j R k basis. R j and R k each independently represent a hydrogen atom, -L a , -L b , -L c , -L d or -L e .
L
1为L
a、L
b、L
c、L
d、L
e、L
f、L
g或L
h。
L 1 is L a , L b , L c , L d , L e , L f , L g or L h .
所述L
a～L
h表示以下的基团：
The L a to L h represent the following groups:
L
a可具有取代基L的碳数为1～12的脂肪族烃基
L a may have an aliphatic hydrocarbon group having a carbon number of 1 to 12 of the substituent L
L
b可具有取代基L的碳数为1～12的卤素取代烷基
L b may have a substituent L of a halogen-substituted alkyl group having 1 to 12 carbon atoms
L
c可具有取代基L的碳数为3～14的脂环式烃基
L c may have a substituent L of an alicyclic hydrocarbon group having 3 to 14 carbon atoms
L
d可具有取代基L的碳数为6～14的芳香族烃基
L d may have an aromatic hydrocarbon group having a substituent L of 6 to 14 carbon atoms
L
e可具有取代基L的碳数为3～14的杂环基
L e may have a substituent L of a heterocyclic group having 3 to 14 carbon atoms
L
f可具有取代基L的碳数为1～9的烷氧基
L f may have a substituent A having an alkoxy group having 1 to 9 carbon atoms
L
g可具有取代基L的碳数为1～9的酰基
L g may have an acyl group having a substituent L of 1 to 9 carbon atoms
L
h可具有取代基L的碳数为1～9的烷氧基羰基
L h L may have a substituent group having a carbon number of alkoxycarbonyl group having 1 to 9
取代基l为选自由碳数为1～12的脂肪族烃基、碳数为1～12的卤素取代烷基、碳数为3～14的脂环式烃基、碳数为6～14的芳香族烃基、碳数为3～14的杂环基、卤素原子、磺基、羟基、氰基、硝基、羧基、怜酸基及氨基所组成的群组的至少一种。The substituent 1 is an aromatic hydrocarbon group selected from the group consisting of an aliphatic hydrocarbon group having 1 to 12 carbon atoms, a halogen-substituted alkyl group having 1 to 12 carbon atoms, an alicyclic hydrocarbon group having 3 to 14 carbon atoms, and an aromatic group having 6 to 14 carbon atoms. At least one of a group consisting of a hydrocarbon group, a heterocyclic group having 3 to 14 carbon atoms, a halogen atom, a sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a pity acid group, and an amino group.
所述L
a～L
h中，包括取代基的碳数的合计优选为分别为50以下，更优选为碳数为40以下，特别优选为碳数为30以下。若碳数多于所述范围，则有难以合成化合物的情况，并且有每单位重量的光的吸收强度变小的倾向。
In the above-mentioned L a to L h , the total number of carbon atoms including the substituent is preferably 50 or less, more preferably 40 or less, and particularly preferably 30 or less. When the carbon number is more than the above range, it may be difficult to synthesize a compound, and the absorption intensity per unit weight of light tends to be small.
条件(b)Condition (b)
1个苯环上的2个R
a中的至少一个与同一苯环上的Y相互键结，形成包含至少 一个氮原子的构成原子数为5或6的杂环。所述杂环可具有取代基，R
b及未参与所述杂环的形成的R
a分别独立地与所述条件(a)的R
b及RR
a同义。
At least one of the two R a on one benzene ring is bonded to Y on the same benzene ring to form a hetero ring having at least one nitrogen atom and having 5 or 6 atoms. The heterocyclic ring may have a substituent, and R b and R a not participating in the formation of the heterocyclic ring are each independently synonymous with R b and RR a of the condition (a).
各基团的具体例Specific examples of each group
作为所述L
a及L中的碳数为1～12的脂肪族烃基，例如可列举：甲基(Me)、乙基(Et)、正丙基(n-Pr)、异丙基(i-Pr)、正丁基(n-Bu)、仲丁基(s-Bu)、叔丁基(t-Bu)、戊基、己基、辛基、壬基、癸基及十二烷基等烷基；乙烯基、1-丙烯基、2-丙烯基、丁烯基、1,3-丁二烯基、2-甲基-1-丙烯基、2-戊烯基、己烯基及辛烯基等烯基；以及乙炔基、丙炔基、丁炔基、2-甲基-1-丙炔基、己炔基及辛炔基等炔基。
Examples of the aliphatic hydrocarbon group having 1 to 12 carbon atoms in the L a and L include methyl (Me), ethyl (Et), n-propyl (n-Pr), and isopropyl (i). -Pr), n-butyl (n-Bu), sec-butyl (s-Bu), tert-butyl (t-Bu), pentyl, hexyl, octyl, decyl, decyl and dodecyl Alkyl; vinyl, 1-propenyl, 2-propenyl, butenyl, 1,3-butadienyl, 2-methyl-1-propenyl, 2-pentenyl, hexenyl and octyl An alkenyl group such as an alkenyl group; and an alkynyl group such as an ethynyl group, a propynyl group, a butynyl group, a 2-methyl-1-propynyl group, a hexynyl group, and an octynyl group.
作为所述L
b及L中的碳数为1～12的卤素取代烷基，例如可列举：三氯甲基、三氟甲基、1,1-二氯乙基、五氯乙基、五氟乙基、七氯丙基及七氟丙基。
Examples of the halogen-substituted alkyl group having 1 to 12 carbon atoms in the L b and L include trichloromethyl, trifluoromethyl, 1,1-dichloroethyl, pentachloroethyl and five. Fluoroethyl, heptachloropropyl and heptafluoropropyl.
作为所述L
c及L中的碳数为3～14的脂环式烃基，例如可列举:环丁基、环戊基、环己基、环庚基及环辛基等环烷基；降冰片烷基及金刚烷基等多环脂环式基。
Examples of the alicyclic hydrocarbon group having 3 to 14 carbon atoms in L c and L include a cycloalkyl group such as a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, a cycloheptyl group and a cyclooctyl group; A polycyclic alicyclic group such as an alkyl group or an adamantyl group.
作为所述L
d及L中的碳数为6～14的芳香族烃基，例如可列举:苯基、甲苯基、二甲苯基、均三甲苯基、枯烯基、1-萘基、2-萘基、葱基、菲基、苊基、丙烯合萘基(phenalenyl)、四氨萘基、二氢茚基及联苯基。
Examples of the aromatic hydrocarbon group having 6 to 14 carbon atoms in the L d and L include a phenyl group, a tolyl group, a xylyl group, a mesityl group, a cumenyl group, a 1-naphthyl group, and 2 Naphthyl, onion, phenanthryl, anthryl, phenalenyl, tetraamendyl, indanyl and biphenyl.
作为所述L
e及L的碳数为3～14的杂环基，例如可列举:包含呋喃、嚷吩、吡咯、吡唑、咪唑、三唑、恶唑、恶二唑、噻唑、噻二唑、吲哚、吲哚啉、假吲哚、苯并呋喃、苯并噻吩、咔唑、二苯并呋喃、二苯并噻吩、吡啶、嘧啶、吡嗪、哒嗪、喹啉、异喹啉、吖啶、吗啉及吩嗪嗦等杂环的基团。
Examples of the heterocyclic group having 3 to 14 carbon atoms of L e and L include, for example, furan, porphin, pyrrole, pyrazole, imidazole, triazole, oxazole, oxadiazole, thiazole, and thiadiazole. Oxazole, anthracene, porphyrin, pseudoanthracene, benzofuran, benzothiophene, carbazole, dibenzofuran, dibenzothiophene, pyridine, pyrimidine, pyrazine, pyridazine, quinoline, isoquinoline a heterocyclic group such as acridine, morpholine or phenazine.
作为所述L
f中的碳数为～12的烷氧基，例如可列举：甲氧基、乙氧基、正丙氧基、异丙氧基、丁氧基、戊氧基、己氧基、辛氧基。
Examples of the alkoxy group having a carbon number of -12 in the L f include a methoxy group, an ethoxy group, a n-propoxy group, an isopropoxy group, a butoxy group, a pentyloxy group, and a hexyloxy group. , octyloxy.
作为所述L
g中的碳数1～9的酰基，例如可列举：乙酰基、丙酰基、丁酰基、异丁酰基、戊酰基、异戊酰基及苯甲酰基。
Examples of the acyl group having 1 to 9 carbon atoms in the L g include an acetyl group, a propionyl group, a butyryl group, an isobutyryl group, a valeryl group, an isovaleryl group, and a benzoyl group.
作为所述L
h中的碳数1～9的烷氧基羰基，例如可列举：甲氧基羰基、乙氧基羰基、丙氧基几羰基、异丙氧基羰基、丁氧基羰基、戊氧基羰基、己氧基羰基及辛氧基羰基。
Examples of the alkoxycarbonyl group having 1 to 9 carbon atoms in the L h include a methoxycarbonyl group, an ethoxycarbonyl group, a propoxycarbonyl group, an isopropoxycarbonyl group, a butoxycarbonyl group, and a pentyl group. Oxycarbonyl, hexyloxycarbonyl and octyloxycarbonyl.
作为所述L
a优选为甲基、乙基、正丙基、异丙基、正丁基、仲丁基、叔丁基、戊基、己基、辛基、4-苯基丁基、2-环己基乙基，更优选为甲基、乙基、正丙基、异丙基、正丁基、仲丁基、叔丁基。
As the L a is preferably methyl, ethyl, n-propyl, isopropyl, n-butyl, sec-butyl, tert-butyl, pentyl, hexyl, octyl, 4-phenylbutyl, 2- The cyclohexylethyl group is more preferably a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a n-butyl group, a sec-butyl group or a t-butyl group.
作为所述L
b优选为三氯甲基、五氯乙基、三氟甲基、五氟乙基、5-环己基-2,2,3,3-四氟戊基，更优选为三氯甲基、五氯乙基、三氟甲基、五氟乙基。
The L b is preferably trichloromethyl, pentachloroethyl, trifluoromethyl, pentafluoroethyl, 5-cyclohexyl-2,2,3,3-tetrafluoropentyl, more preferably trichloro Methyl, pentachloroethyl, trifluoromethyl, pentafluoroethyl.
作为所述L
c优选为环丁基、环戊基、环己基、4-乙基环己基、环辛基、4-苯基环庚基，更优选为环戊基、环己基、4-乙基环己基。
The L c is preferably a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, a 4-ethylcyclohexyl group, a cyclooctyl group or a 4-phenylcycloheptyl group, more preferably a cyclopentyl group, a cyclohexyl group or a 4-ethyl group. Base ring hexyl.
作为所述L
d，优选为苯基、1-萘基、2-萘基、甲苯基、二甲苯基、均三甲苯基、枯烯基、3，5-二-叔丁基苯基、4-环戊基苯基、2，3，6-三苯基苯基、2，3，4，5，6-五苯基苯基，更优选为苯基、甲苯基、二甲苯基、均三甲苯基、枯烯基、2,3,4,5,6-五苯基苯基。
As the L d , a phenyl group, a 1-naphthyl group, a 2-naphthyl group, a tolyl group, a xylyl group, a mesityl group, a cumenyl group, a 3,5-di-tert-butylphenyl group, and 4 are preferable. - cyclopentylphenyl, 2,3,6-triphenylphenyl, 2,3,4,5,6-pentaphenylphenyl, more preferably phenyl, tolyl, xylyl, homogenous Tolyl, cumenyl, 2,3,4,5,6-pentaphenylphenyl.
作为所述L
e优选为包含呋喃、噻吩、吡咯、吲哚、吲哚啉、假吲哚、苯并呋喃、苯并噻吩、吗啉的基团，更优选为包含呋喃、噻吩、吡咯、吗啉的基团。
The L e is preferably a group containing furan, thiophene, pyrrole, anthracene, porphyrin, pyrene, benzofuran, benzothiophene, morpholine, and more preferably contains furan, thiophene, pyrrole, or a group of porphyrins.
作为所述L
f，优选为甲氧基、乙氧基、丙氧基、异丙氧基、丁氧基、甲氧基甲基、甲氧基乙基、2-苯基乙氧基、3-环己基丙氧基、戊氧基、己氧基、辛氧基，更优选为甲氧基、乙氧基、丙氧基、异丙氧基、丁氧基。
As the L f , a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group, a butoxy group, a methoxymethyl group, a methoxyethyl group, a 2-phenylethoxy group, and 3 are preferable. a cyclohexylpropoxy group, a pentyloxy group, a hexyloxy group or an octyloxy group, more preferably a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group or a butoxy group.
作为所述L
g优选为乙酰基、丙酰基、丁酰基、异丁酰基、苯甲酰基、4-丙基苯甲酰基、三氟甲基羰基，更优选为乙酰基、丙酰基、苯甲酰基。
The L g is preferably acetyl, propionyl, butyryl, isobutyryl, benzoyl, 4-propylbenzoyl or trifluoromethylcarbonyl, more preferably acetyl, propionyl or benzoyl. .
作为所述L
h优选为甲氧基羰基、乙氧基羰基、丙氧基羰基、异丙氧基羰基、丁氧基羰基、2-三氟甲基乙氧基羰基、2-苯基乙氧基羰基，更优选为甲氧基羰基、乙氧基羰基。
The L h is preferably a methoxycarbonyl group, an ethoxycarbonyl group, a propoxycarbonyl group, an isopropoxycarbonyl group, a butoxycarbonyl group, a 2-trifluoromethylethoxycarbonyl group, or a 2-phenylethoxy group. The carbonyl group is more preferably a methoxycarbonyl group or an ethoxycarbonyl group.
所述L
a～L
h可进一步具有选自由卤素原子、磺基、羟基、氰基、硝基、羧基、磷酸基及氨基所组成的组群的至少一种原子或基团。作为此种例子，可列举:4-磺基丁基、4-氰基丁基、5-羧基戊基、5-氨基戊基、3-羟基丙基、2-磷酰基乙基、6-氨基-2，2-二氯己基、2-氯-4-羟基丁基、2-氰基环丁基、3-羟基环戊基、3-羧基环戊基、4-氨基环己基、4-羟基环己基、4-羟基苯基、五氟苯基、2-羟基萘基、4-氨基苯基、4-硝基苯基、包含3-甲基吡咯的基团、2-羟基乙氧基、3-氰基丙氧基、4-氟苯甲酰基、2-羟基乙氧基羰基、4-氰基丁氧基羰基。
The L a to L h may further have at least one atom or group selected from the group consisting of a halogen atom, a sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a phosphoric acid group, and an amino group. As such an example, 4-sulfobutyl group, 4-cyanobutyl group, 5-carboxypentyl group, 5-aminopentyl group, 3-hydroxypropyl group, 2-phosphorylethyl group, and 6-amino group are mentioned. -2,2-dichlorohexyl, 2-chloro-4-hydroxybutyl, 2-cyanocyclobutyl, 3-hydroxycyclopentyl, 3-carboxycyclopentyl, 4-aminocyclohexyl, 4-hydroxyl Cyclohexyl, 4-hydroxyphenyl, pentafluorophenyl, 2-hydroxynaphthyl, 4-aminophenyl, 4-nitrophenyl, a group containing 3-methylpyrrole, 2-hydroxyethoxy, 3-cyanopropoxy, 4-fluorobenzoyl, 2-hydroxyethoxycarbonyl, 4-cyanobutoxycarbonyl.
作为所述条件(a)中的R
a,优选为氢原子、氯原子、氟原子、甲基、乙基、正丙基、异丙基、正丁基、仲丁基、叔丁基、环己基、苯基、羟基、氨基、二甲基氨基、硝基，更优选为氢原子、氯原子、氟原子、甲基、乙基、正丙基、异丙基、羟基。
R a in the condition (a) is preferably a hydrogen atom, a chlorine atom, a fluorine atom, a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a n-butyl group, a sec-butyl group, a t-butyl group or a ring. The hexyl group, the phenyl group, the hydroxyl group, the amino group, the dimethylamino group, and the nitro group are more preferably a hydrogen atom, a chlorine atom, a fluorine atom, a methyl group, an ethyl group, a n-propyl group, an isopropyl group or a hydroxyl group.
作为所述条件(a)中的R
b，优选为氢原子、氯原子、氟原子、甲基、乙基、 正丙基、异丙基、正丁基、仲丁基、叔丁基、环己基、苯基、羟基、氨基、二甲基氨基、氰基、硝基、乙酰基氨基、丙酰基氨基、N-甲基乙酷基氨基、三氟甲酰基氨基、五氟乙酰基氨基、叔丁酰基氨基、环己酰基氨基，更优选为氢原子、氯原子、氟原子、甲基、乙基、正丙基、异丙基、羟基、二甲基氨基、硝基、乙酰基氨基、丙酰基氨基、三氟甲酰基氨基、五氟乙酰基氨基、叔丁酰基氨基、环己酰基氨基。
R b in the condition (a) is preferably a hydrogen atom, a chlorine atom, a fluorine atom, a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a n-butyl group, a sec-butyl group, a t-butyl group or a ring. Hexyl, phenyl, hydroxy, amino, dimethylamino, cyano, nitro, acetylamino, propionylamino, N-methylethylamino, trifluorocarbonylamino, pentafluoroacetylamino, uncle Butyrylamino, cyclohexanoylamino, more preferably hydrogen, chlorine, fluorine, methyl, ethyl, n-propyl, isopropyl, hydroxy, dimethylamino, nitro, acetylamino, propyl An acylamino group, a trifluoroformylamino group, a pentafluoroacetylamino group, a tert-butyrylamino group, a cyclohexanoylamino group.
作为所述Y，优选为氨基、甲基氨基、二甲基氨基、二乙基氨基、二-正丙基氨基、二异丙基氨基、二-正丁基氨基、二-叔丁基氨基、N-乙基-N-甲基氨基、N-环己基-N-甲基氨基，更优选为二甲基氨基、二乙基氨基、二-正丙基氨基、二异丙基氨基、二-正丁基氨基、二-叔丁基氨基。The Y is preferably an amino group, a methylamino group, a dimethylamino group, a diethylamino group, a di-n-propylamino group, a diisopropylamino group, a di-n-butylamino group or a di-tert-butylamino group. N-ethyl-N-methylamino, N-cyclohexyl-N-methylamino, more preferably dimethylamino, diethylamino, di-n-propylamino, diisopropylamino, di- n-Butylamino, di-tert-butylamino.
作为所述式I的条件(b)中的1个苯环上的2个R
a中的至少一个与同一苯环上的Y相互键结而形成的包含至少一个氮原子的构成原子数为5或6的杂环，例如可列举:吡咯啶、吡咯、咪唑、吡唑、哌啶、吡啶、哌嗪、哒嗪、嘧啶及吡嗪等。所述杂环中，优选为构成所述杂环、且构成所述苯环的碳原子的邻近的1个原子为氮原子的杂环，更优选为吡咯啶。
The number of constituent atoms including at least one nitrogen atom formed by bonding at least one of two R a on one benzene ring in the condition (b) of the formula I to the Y on the same benzene ring is 5 Examples of the heterocyclic ring of 6 or more include pyrrolidine, pyrrole, imidazole, pyrazole, piperidine, pyridine, piperazine, pyridazine, pyrimidine and pyrazine. Among the heterocyclic rings, a heterocyclic ring constituting the heterocyclic ring and constituting one of the carbon atoms of the benzene ring is a nitrogen atom, and more preferably a pyrrolidine.
其中，式Ⅱ中，X独立地表示0、S、Se、N-R
c或C(R
dR
d)，存在多个的R
c分别独立地表示氢原子、L
a、L
b、Lc、L
d或L
e，存在多个的R
d分别独立地表示氢原子、卤素原子磺基、羟基、氰基、硝基、羧基、磷酸基、-L
1或-NR
eR
f基，相邻的R
d彼此可连结而形成可具有取代基的环，L
a～L
e、L
1、R
e及R
f与所述式I中所定义的L
a～L
e、L
1、R
e及R
f同义。
Wherein, in Formula II, X independently represents 0, S, Se, NR c or C(R d R d ), and a plurality of R c independently represent a hydrogen atom, L a , L b , Lc, L d Or L e , a plurality of R d independently represent a hydrogen atom, a halogen atom sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a phosphate group, a -L 1 or a -NR e R f group, and an adjacent R d may be linked to each other to form a ring may have a substituent group, L a ~ L e, L 1, L a R e and R f in the formula I as defined in ~ L e, L 1, R e , and R f Synonymous.
作为所述式Ⅱ中的R
c，优选为氢原子、甲基、乙基、正丙基、异丙基、正丁基、仲丁基、叔下丁基、正戊基、正己基、环己基、苯基、三氟甲基、五氟乙基，更优选为氢原子、甲基、乙基、正丙基、异丙基。
As R c in the formula II, a hydrogen atom, a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a n-butyl group, a sec-butyl group, a tert-butyl group, a n-pentyl group, a n-hexyl group, and a ring are preferable. Hexyl, phenyl, trifluoromethyl, pentafluoroethyl, more preferably a hydrogen atom, a methyl group, an ethyl group, a n-propyl group or an isopropyl group.
作为所述式Ⅱ中的Rd，优选为氢原子、氯原子、氟原子、甲基、乙基、正丙基、异丙基丁基、仲丁基、叔丁基、正戊基、正己基、环己基、苯基、甲氧基、三氟甲基、五氟乙基、4-氨基环己基，更优选为氢原子、氯原子、氟原子、甲基、乙基、正丙基、异丙基三氟甲基、五氟乙基。As the Rd in the formula II, a hydrogen atom, a chlorine atom, a fluorine atom, a methyl group, an ethyl group, a n-propyl group, an isopropyl butyl group, a sec-butyl group, a t-butyl group, a n-pentyl group or a n-hexyl group are preferable. , cyclohexyl, phenyl, methoxy, trifluoromethyl, pentafluoroethyl, 4-aminocyclohexyl, more preferably hydrogen, chlorine, fluorine, methyl, ethyl, n-propyl, iso Propyltrifluoromethyl, pentafluoroethyl.
作为所述X，优选为0、S、Se、N-Me、N-Et、CH
2、C-Me
2、C-Et
2，更优选为S、C-Me
2、C-Et
2。
The X is preferably 0, S, Se, N-Me, N-Et, CH 2 , C-Me 2 or C-Et 2 , and more preferably S, C-Me 2 or C-Et 2 .
在所述式Ⅱ中，相邻的R
d彼此连结可形成环。作为此种环，例如可列举:苯并 假吲哚环、α-萘并咪唑环、β-萘并咪唑环、α-萘并恶唑环、β-萘并恶唑环、α-萘并噻唑环、β-萘并噻唑环、α-萘并唒唑环、β-萘并唒唑环。
In the formula II, adjacent R d are bonded to each other to form a ring. Examples of such a ring include a benzopyridinium ring, an α-naphthylimidazole ring, a β-naphthylimidazole ring, an α-naphthoxazole ring, a β-naphthoxazole ring, and an α-naphthyl group. Thiazole ring, β-naphthylthiazole ring, α-naphthoxazole ring, β-naphthoxazole ring.
另外，所述化合物，式Ⅲ表示所述酞菁系化合物。Further, the compound, Formula III, represents the phthalocyanine-based compound.
其中式Ⅲ中，Μ表示2个氢原子、2个1价金属原子、2价金属原子、或包含3价或4价金属原子的取代金属原子，存在多个的R
a、R
b、R
c及R
d分别独立地表示选自由氢原子、卤素原子、羟基、羧基、硝基、氨基、酰胺基、酰亚胺基、氰基、硅烷基、-L
1、-S-L
2、-SS-L
2、-S0
2-L
3、-N＝N-L
4、或与Ra与R
b、R
b与R
c、及R
c与R
d中至少一个组合键结。其中，键结于同一芳香环的R
a、R
b、R
c及R
d中至少一个不为氢原子。
In the formula III, Μ represents two hydrogen atoms, two monovalent metal atoms, a divalent metal atom, or a substituted metal atom containing a trivalent or tetravalent metal atom, and a plurality of R a , R b , R c are present. And R d are independently represented by a hydrogen atom, a halogen atom, a hydroxyl group, a carboxyl group, a nitro group, an amino group, an amide group, an imide group, a cyano group, a silane group, -L 1 , -SL 2 , -SS-L. 2 , -S0 2 -L 3 , -N=NL 4 , or in combination with at least one of Ra and R b , R b and R c , and R c and R d . Wherein at least one of R a , R b , R c and R d bonded to the same aromatic ring is not a hydrogen atom.
所述氨基、酰胺基、酰亚胺基及硅烷基可具有所述式Ⅰ中所定义的取代基L，The amino group, the amide group, the imide group, and the silane group may have the substituent L defined in the formula I,
L
1与所述式Ⅰ中所定义的L
1同义，
L 1 in the formula as defined Ⅰ L 1 of synonymous,
L
2表示氢原子或所述式Ⅰ中所定义的L
a～L
e的任一个，
L 2 represents a hydrogen atom or any of L a to L e defined in the formula I,
L
3表示羟基或所述L
a～L
e的任一个，
L 3 represents a hydroxyl group or any of the above L a to L e ,
L
4表示所述L
a～L
e的任一个。
L 4 represents any of the above L a to L e .
根据本发明的这个优选实施例，所述线路板组件10包括一支架101和一线路板12，所述支架101贴装或一体封于所述线路板12，例如本发明的这个实施例中，所述支架101实施为模制支架11，可以理解的，所述线路板组件10包括一模制支架11和一线路板12，所述模制支架11一体地封装连接于所述线路板12，如模塑地连接于所述线路板12。更具体地，所述模制支架11通过模塑于线路板的方式(Molding On Board，MOB)模塑连接于所述线路板12，模塑工艺可以是注塑或模压等工艺。值得一提的，所述模制支架11具有一拔膜斜度，其在模塑内表面呈倾斜的。也就是说，这样方式，使所述模制支架11一体封于所述线路板12后，容易脱模制造和防止杂散光。In accordance with this preferred embodiment of the present invention, the circuit board assembly 10 includes a bracket 101 and a circuit board 12 that is mounted or integrally sealed to the circuit board 12, such as in this embodiment of the invention, The bracket 101 is implemented as a molded bracket 11 . It can be understood that the circuit board assembly 10 includes a molded bracket 11 and a circuit board 12 , and the molded bracket 11 is integrally packaged and connected to the circuit board 12 . It is molded to the circuit board 12 as molded. More specifically, the molded holder 11 is molded and attached to the wiring board 12 by molding in a mold (Molding On Board, MOB), and the molding process may be a process such as injection molding or molding. It is worth mentioning that the molded stent 11 has a film-drawing slope which is inclined on the inner surface of the molding. That is to say, in this manner, after the molded bracket 11 is integrally sealed to the wiring board 12, it is easy to release the mold and prevent stray light.
另外，值得一提的，所述线路板组件10的所述模制支架11可用于支撑所述 驱动器30。也就是说，相对传统摄像模组利用支架支撑驱动器的组装制程中，还需通过胶水贴合支架和线路板的方式，本发明则是通过模塑方式一体成型于所述线路板组件10的所述模制支架11支撑所述驱动器30。另外，所述模制支架11亦可用于支撑所述滤光片40。Additionally, it is worth mentioning that the molded bracket 11 of the circuit board assembly 10 can be used to support the driver 30. That is to say, in the assembly process of the conventional camera module using the bracket supporting the driver, the bracket and the circuit board are glued together by the glue, and the present invention is integrally molded on the circuit board assembly 10 by molding. The molded bracket 11 supports the driver 30. In addition, the molded bracket 11 can also be used to support the filter 40.
所述线路板12包括一线路板主体121，所述模制支架11一体连接于所述线路板主体121。所述模制支架11形成一通孔111，以使得所述模制支架11围绕于所述感光芯片30外侧，并且提供所述镜头20和所述感光芯片50的光线通路。所述感光芯片50被设置于所述通孔111对应位置的所述线路板主体121。The circuit board 12 includes a circuit board main body 121, and the molded bracket 11 is integrally connected to the circuit board main body 121. The molded bracket 11 forms a through hole 111 such that the molded bracket 11 surrounds the outside of the photosensitive chip 30 and provides a light path of the lens 20 and the photosensitive chip 50. The photosensitive chip 50 is disposed on the circuit board main body 121 at a position corresponding to the through hole 111.
在本发明这个实施例中，所述模制支架11凸起地围绕于所述感光芯片50外侧，特别地，所述模制支架11一体地闭合连接，使其具有良好的密封性，从而当所述镜头20被安装于所述感光芯片50的感光路径时，所述感光芯片50被密封于内部，从而形成对应的封闭内空间。In this embodiment of the invention, the molded bracket 11 is convexly surrounding the outer side of the photosensitive chip 50, in particular, the molded bracket 11 is integrally closed and connected, so that it has a good sealing property, so that when When the lens 20 is mounted on the photosensitive path of the photosensitive chip 50, the photosensitive chip 50 is sealed inside to form a corresponding closed inner space.
具体地，在制造所述线路板组件10时，可以选择一传统的线路板作为所述线路板主体121，在所述线路板主体121表面进行模塑。比如，在一实施例中，可以用注塑机，通过嵌入成型(Insert Molding)工艺将进行SMT工艺(Surface Mount Technology表面贴装工艺)后的线路板进行一体封装形成所述模制支架11，或通过半导体封装中常用的模压或传递模塑等模制工艺形成所述模制支架11。进一步，将各所述感光芯片50贴装于所述线路板主体121，继而将各所述感光芯片50与所述线路板主体121进行电连接，比如打金线电连接。所述线路板主体121可以选择为，举例地但不限于，软硬结合板、陶瓷基板(不带软板)、PCB硬板(不带软板)、FPCB柔性线路板等。所述模制支架11形成的方式可以选择为，举例地但不限于，注塑工艺、模压工艺等。所述模制支架11可以选择的材料为，举例地但不限于，注塑工艺可以选择尼龙、LCP(Liquid Crystal Polymer，液晶高分子聚合物)、PP(Polypropylene，聚丙烯)等，模压工艺可以采用环氧树脂。本领域技术人员应当理解的是，前述可以选择的制造方式以及可以选择的材料，仅作为举例说明本发明的可以实施的方式，并不是本发明的限制。Specifically, in manufacturing the circuit board assembly 10, a conventional wiring board can be selected as the wiring board main body 121, and molding is performed on the surface of the wiring board main body 121. For example, in an embodiment, the circuit board after performing the SMT process (Surface Mount Technology surface mount process) may be integrally packaged to form the molded bracket 11 by an injection molding machine using an injection molding machine, or The molded bracket 11 is formed by a molding process such as molding or transfer molding which is commonly used in a semiconductor package. Further, each of the photosensitive chips 50 is attached to the wiring board main body 121, and then the photosensitive chips 50 are electrically connected to the wiring board main body 121, for example, by a gold wire. The circuit board main body 121 may be selected, for example, but not limited to, a soft and hard bonding board, a ceramic substrate (without a soft board), a PCB hard board (without a soft board), an FPCB flexible wiring board, and the like. The manner in which the molded bracket 11 is formed may be selected, for example, but not limited to, an injection molding process, a molding process, and the like. The mold holder 11 can be selected from materials such as, but not limited to, nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene, polypropylene), etc. for the injection molding process, and the molding process can be adopted. Epoxy resin. It should be understood by those skilled in the art that the foregoing alternatives and the materials that can be selected are merely illustrative of the embodiments of the invention and are not intended to be limiting.
在本发明的其他实施例中，制造所述线路板组件10的过程还可以是，先对所述线路板主体121进行SMT工艺，进而将所述感光芯片50贴装于所述线路板主体121，并且将所述感光芯片50与所述线路板主体121进行电连接，比如打金线电连接，继而将对所述线路板主体121进行一体封装，比如模塑封装，通过 嵌入成型的方式形成所述模制支架11，或通过半导体封装中常用的模压工艺形成所述模制支架11。本领域的技术人员应当理解的是，所述线路板组件10的制造顺序并不是本发明的限制。In another embodiment of the present invention, the process of manufacturing the circuit board assembly 10 may be performed by performing an SMT process on the circuit board main body 121, and then mounting the photosensitive chip 50 on the circuit board main body 121. And electrically connecting the photosensitive chip 50 to the circuit board main body 121, such as a gold wire electrical connection, and then integrally packaging the circuit board main body 121, such as a molded package, by insert molding. The molded bracket 11 is formed by the molding bracket 11, or by a molding process commonly used in a semiconductor package. It will be understood by those skilled in the art that the order of manufacture of the circuit board assembly 10 is not a limitation of the present invention.
根据本发明的这个实施例，所述感光芯片50通过一系列引线53连接于所述线路板组件10的所述线路板12。所述引线53可以被实施为，举例地但不限于，金线、铜线、铝线、银线。特别地，所述感光芯片50和线路板12也可以采用其他方式，如焊接、导电胶贴合等方式。According to this embodiment of the invention, the photosensitive chip 50 is attached to the wiring board 12 of the wiring board assembly 10 through a series of leads 53. The lead 53 may be implemented as, for example but not limited to, a gold wire, a copper wire, an aluminum wire, a silver wire. In particular, the photosensitive chip 50 and the circuit board 12 may also be in other manners, such as soldering, conductive adhesive bonding, and the like.
在本发明的这个优选实施例中，所述滤光片40被安装于所述模制支架11，并且基于模塑工艺，能够得到良好的表面平整性，因此能够为所述滤光片40提供平整的安装条件，且一体成型的方式，使得所述模制支架11不易出现偏移、倾斜现象，以便于为所述滤光片40提供稳定、平整的安装条件，进而减小所述滤光片40安装时的累积公差。In this preferred embodiment of the invention, the filter 40 is mounted to the molded support 11, and based on the molding process, good surface flatness can be obtained, and thus the filter 40 can be provided The flat mounting condition and the integrally formed manner make the molding bracket 11 less prone to offset and tilting, so as to provide stable and flat mounting conditions for the filter 40, thereby reducing the filtering. The cumulative tolerance of the piece 40 when it is installed.
在本发明的这个优选实施例中，所述模制支架11的顶表面112一体平面延伸，所述滤光片40被安装于所述模制支架11的所述顶表面112。特别地，所述滤光片40可以通过粘接的方式连接于所述模制支架11的所述顶表面112。In this preferred embodiment of the invention, the top surface 112 of the molded stent 11 extends integrally planarly, and the filter 40 is mounted to the top surface 112 of the molded stent 11. In particular, the filter 40 may be attached to the top surface 112 of the molded stent 11 by bonding.
在本发明的这个优选实施例中，所述驱动器30被安装于所述线路板组件10的所述模制支架11。进一步地说，所述驱动器30被安装于所述模制支架11的所述顶表面112，也就是说，所述滤光片40和所述驱动器30相互协调占用所述模制支架11的所述顶表面112。In this preferred embodiment of the invention, the driver 30 is mounted to the molded bracket 11 of the circuit board assembly 10. Further, the driver 30 is mounted to the top surface 112 of the molded bracket 11, that is, the filter 40 and the driver 30 coordinate with each other to occupy the molded bracket 11 The top surface 112 is described.
在本发明的这个实施例中，所述感光芯片50被设置于所述线路板主体121的上表面，所述模制支架11围绕于所述感光芯片50的外侧。在制造所述线路板组件10时，可以选择不同制造顺序，举例地但不限于，在一种实施方式中，可以先在所述线路板主体121上安装所述感光芯片50，而后在所述感光芯片50外侧，所述线路板主体121上模塑形成所述模制支架11。而在本发明的另一种实施方式中，可以先在所述线路板主体121上模塑形成所述模制支架11，继而将所述感光芯片50安装于所述线路板主体121，使其位于所述模制支架11的内侧。In this embodiment of the invention, the photosensitive chip 50 is disposed on an upper surface of the wiring board main body 121, and the molded bracket 11 surrounds an outer side of the photosensitive chip 50. In the manufacture of the circuit board assembly 10, different manufacturing sequences may be selected, for example, but not limited to, in one embodiment, the photosensitive chip 50 may be first mounted on the circuit board main body 121, and then in the On the outside of the photosensitive chip 50, the molded holder 11 is molded on the wiring board main body 121. In another embodiment of the present invention, the molded holder 11 may be molded on the circuit board main body 121, and then the photosensitive chip 50 may be mounted on the circuit board main body 121. Located inside the molded bracket 11.
根据本实施例，本发明还提供一摄像模组的红外吸收结构制程方法，其中包括如下步骤：According to the embodiment, the present invention further provides an infrared absorption structure processing method for a camera module, which includes the following steps:
(a)涂覆吸收式滤光层42于滤光片本体41；以及(a) coating the absorptive filter layer 42 on the filter body 41;
(b)烘烤所述吸收式滤光层42于所述滤光片本体41。(b) baking the absorptive filter layer 42 to the filter body 41.
根据步骤(a)，其中涂覆方式采用浸泡、离心力旋涂等物理气相沉积技术或化学气相沉积技术。According to the step (a), the coating method is a physical vapor deposition technique such as immersion or centrifugal spin coating or a chemical vapor deposition technique.
根据步骤(a)，所述滤光片本体41由树脂材料所制。According to the step (a), the filter body 41 is made of a resin material.
根据步骤(a)，其中所述吸收式滤光层42为有机材料，且存在近红外光谱吸收的特性，其中所述近红外光谱为565nm～1200nm波段。According to the step (a), wherein the absorption filter layer 42 is an organic material and has a characteristic of absorption in the near-infrared spectrum, wherein the near-infrared spectrum is in the band of 565 nm to 1200 nm.
根据步骤(a)，其中所述吸收式滤光层42为液体材料。According to step (a), wherein the absorptive filter layer 42 is a liquid material.
如图31和图32所示，是根据本发明的第四个优选实施例的摄像模组的第一变形实施例，其中阐述所述模制支架11同时封装所述线路板12和所述感光芯片50，即MOC(molding on chip)。如图31所示，不同于上述第一优选实施例的是，所述滤光片40直接位于所述感光芯片50的上方，并经由所述模制支架11一体塑封。也就是说，所述感光芯片50贴装于所述线路板组件10的所述线路板主体121，继而将各所述感光芯片50与所述线路板主体121进行电连接，然后将所述滤光片40置于所述感光芯片50的上方后，进行一体封装，如模塑封装或通过半导体封装中常用的模压工艺形成所述模制支架11。另外，如图32所示，在所述模制支架11同时封装所述线路板12和所述感光芯片50后，其中所述模制支架11的顶表面112一体平面延伸，所述滤光片40被安装于所述模制支架11的所述顶表面112。特别地，所述滤光片40可以通过粘接的方式连接于所述模制支架11的所述顶表面112。值得一提的，所述模制支架11具有一拔膜斜度，其在模塑内表面呈倾斜的。也就是说，这样方式，使所述模制支架11一体封于所述线路板12后，容易脱模制造和防止杂散光。31 and 32 are a first modified embodiment of a camera module according to a fourth preferred embodiment of the present invention, wherein the molded bracket 11 is illustrated to simultaneously package the circuit board 12 and the photosensitive Chip 50, that is, MOC (molding on chip). As shown in FIG. 31, unlike the first preferred embodiment described above, the filter 40 is directly above the photosensitive chip 50 and integrally molded via the molded bracket 11. That is, the photosensitive chip 50 is attached to the circuit board main body 121 of the circuit board assembly 10, and then the photosensitive chips 50 are electrically connected to the circuit board main body 121, and then the filter is applied. After the light sheet 40 is placed over the photosensitive chip 50, it is integrally packaged, such as a molded package or formed by a molding process commonly used in a semiconductor package. In addition, as shown in FIG. 32, after the molded bracket 11 simultaneously encapsulates the circuit board 12 and the photosensitive chip 50, wherein the top surface 112 of the molded bracket 11 extends integrally in a plane, the filter 40 is mounted to the top surface 112 of the molded bracket 11. In particular, the filter 40 may be attached to the top surface 112 of the molded stent 11 by bonding. It is worth mentioning that the molded stent 11 has a film-drawing slope which is inclined on the inner surface of the molding. That is to say, in this manner, after the molded bracket 11 is integrally sealed to the wiring board 12, it is easy to release the mold and prevent stray light.
如图33所示，是根据本发明的第四个优选实施例的摄像模组的第二变形实施例，其中阐述所述滤光片40的设置位置。不同于上述优选实施例的是，所述模制支架11具有一安装槽113A，所述安装槽113A连通于所述通孔111，以便为所述滤光片40提供充足的安装空间。也就是说，所述模制支架11的所述顶表面112A呈台阶状结构，而并不是一体延伸，所述顶表面112A的各台阶上可用于安装所述滤光片40、所述镜头20或所述驱动器30。也就是说，所述安装槽113A可以用于安装所述滤光片40，而在本发明的其他实施中，所述安装槽113A可以用来安装所述摄像模组的驱动器30或所述镜头20等部件，本领域的技术人员应当理解的是，所述安装槽113A的用途并不是本发明的限制。As shown in FIG. 33, it is a second modified embodiment of the camera module according to the fourth preferred embodiment of the present invention, in which the arrangement position of the filter 40 is explained. Unlike the above preferred embodiment, the molded bracket 11 has a mounting groove 113A that communicates with the through hole 111 to provide a sufficient installation space for the filter 40. That is, the top surface 112A of the molded bracket 11 has a stepped structure, and does not extend integrally. The steps of the top surface 112A can be used to mount the filter 40 and the lens 20 . Or the driver 30. That is, the mounting slot 113A can be used to mount the filter 40, and in other implementations of the invention, the mounting slot 113A can be used to mount the driver 30 of the camera module or the lens 20 and the like, it will be understood by those skilled in the art that the use of the mounting groove 113A is not a limitation of the present invention.
进一步，所述安装槽113A的高度大于所述滤光片40的厚度，以使得所述滤 光片40被安装于所述安装槽113A时，所述滤光片40不会凸出于所述模制支架11的顶端。Further, the height of the mounting groove 113A is greater than the thickness of the filter 40, so that when the filter 40 is mounted on the mounting groove 113A, the filter 40 does not protrude from the The top end of the bracket 11 is molded.
特别地，所述滤光片40呈方形，所述安装槽113A的形状与所述滤光片40的形状相适应。也就是说，所述安装槽113A呈方环形，连通于所述通孔111。In particular, the filter 40 has a square shape, and the shape of the mounting groove 113A is adapted to the shape of the filter 40. That is, the mounting groove 113A has a square ring shape and communicates with the through hole 111.
还值得一提的是，附图中以动焦模组为例进行说明，而在本发明的其他实施例中，所述摄像模组可以是一定焦模组，本领域的技术人员应当理解的是，所述摄像模组的类型并不是本发明的限制。It is also worth mentioning that the moving focus module is taken as an example in the drawing, and in other embodiments of the present invention, the camera module may be a certain focus module, which should be understood by those skilled in the art. Yes, the type of camera module is not a limitation of the present invention.
如图34所示，是根据本发明的第四个优选实施例的摄像模组的第三变形实施例，其中阐述所述滤光片40的设置位置。不同于上述实施例的是，所述摄像模组包括一支座70B，所述支座70B用于安装所述滤光片40。所述支座70B被安装于所述模制支架11，所述驱动器30或所述镜头20被安装于所述支座70B。As shown in FIG. 34, it is a third modified embodiment of the camera module according to the fourth preferred embodiment of the present invention, in which the arrangement position of the filter 40 is explained. Different from the above embodiment, the camera module includes a seat 70B for mounting the filter 40. The holder 70B is mounted to the molded bracket 11, and the driver 30 or the lens 20 is mounted to the holder 70B.
根据本发明的这个实施例，所述支座70B具有一第一支座槽71B和一第二支座槽72B，所述滤光片40安装于所述第一支座槽71B，以使得所述滤光片40的底面低于所述支座70B的顶端。所述第二支座槽72B安装于所述模制支架11，以使得所述模制支架11沿所述支座70B向上延伸，而所述滤光片40的位置相对向下，从而减小所述摄像模组的后焦距。According to this embodiment of the invention, the holder 70B has a first seating groove 71B and a second seating groove 72B, and the filter 40 is mounted to the first seating groove 71B so that The bottom surface of the filter 40 is lower than the top end of the holder 70B. The second seating groove 72B is mounted to the molded bracket 11 such that the molded bracket 11 extends upward along the holder 70B, and the position of the filter 40 is relatively downward, thereby reducing The back focus of the camera module.
换句话说，所述支座70B向所述通孔111内延伸，且向下延伸，从而将所述滤光片40支撑于所述感光芯片30上方，有效利用所述通孔111内的空间，使得滤光片40被稳定安装的同时，所述滤光片40不会占用外部空间。In other words, the holder 70B extends into the through hole 111 and extends downward to support the filter 40 above the photosensitive chip 30, effectively utilizing the space in the through hole 111. When the filter 40 is stably mounted, the filter 40 does not occupy an external space.
值得一提的是，所述支座70B向内延伸的位置位于所述感光芯片30的感光路线之外，也就是说，所述支座70B不会遮挡所述感光芯片30的所述感光区，以避免影响所述感光芯片30的感光过程，所述支座70B的尺寸可以具体需求设计。It is worth mentioning that the inwardly extending position of the holder 70B is outside the photosensitive route of the photosensitive chip 30, that is, the holder 70B does not block the photosensitive area of the photosensitive chip 30. In order to avoid affecting the photosensitive process of the photosensitive chip 30, the size of the holder 70B can be specifically designed.
在本发明的这个实施例中，以动焦模组为例进行说明，所述镜头20被安装于所述驱动器30，所述驱动器30被安装于所述支座70B。也就是说，所述支座70B为所述滤光片40和所述驱动器30提供安装位置。而在本发明的其他实施例中，所述摄像模组还可以是一定焦模组。所述镜头20被安装于所述支座70B，也就是说，所述支座70B为所述滤光片40和所述镜头20提供安装位置，本领域的技术人员应当理解的是，所述支座70B的具体结构和所述摄像模组的类型并不是本发明的限制。In this embodiment of the present invention, a moving focus module is described as an example. The lens 20 is mounted to the driver 30, and the driver 30 is mounted to the holder 70B. That is, the holder 70B provides a mounting position for the filter 40 and the driver 30. In other embodiments of the present invention, the camera module may also be a fixed focus module. The lens 20 is mounted to the holder 70B, that is, the holder 70B provides a mounting position for the filter 40 and the lens 20, as will be understood by those skilled in the art. The specific structure of the holder 70B and the type of the camera module are not limitations of the present invention.
如图35所示，是根据本发明的第四个优选实施例的摄像模组的第四变形实施例，其中阐述所述滤光片40的设置位置。不同于上述实施例的是，所述模制支架11具有一安装槽113C，所述安装槽113C连通于所述通孔111。也就是说，所述模制支架11的所述顶表面112C呈台阶状结构，而并不是一体延伸。As shown in FIG. 35, it is a fourth modified embodiment of the camera module according to the fourth preferred embodiment of the present invention, in which the arrangement position of the filter 40 is explained. Different from the above embodiment, the molded bracket 11 has a mounting groove 113C, and the mounting groove 113C communicates with the through hole 111. That is, the top surface 112C of the molded bracket 11 has a stepped structure and does not extend integrally.
所述摄像模组包括一支座70C，所述支座70C用于安装所述滤光片40。所述支座70C被安装于所述模制支架11，所述驱动器30或所述镜头20被安装于所述模制支架11。The camera module includes a seat 70C for mounting the filter 40. The holder 70C is mounted to the molded bracket 11, and the driver 30 or the lens 20 is mounted to the molded bracket 11.
进一步，所述支座70C被安装于所述模制支架11的所述安装槽113C，且所述安装槽113C的高度大于所述支座70C的安装高度，从而使得所述支座70C不会凸出于所述模制支架11的所述端部。Further, the holder 70C is mounted to the mounting groove 113C of the molded bracket 11, and the height of the mounting groove 113C is greater than the mounting height of the holder 70C, so that the holder 70C does not Projecting from the end of the molded bracket 11.
根据本发明的这个实施例，所述支座70C具有一第一支座槽71C和一第二支座槽72C。所述滤光片40安装于所述第一支座槽71C，并使得所述滤光片40的表面不会凸出于所述支座70C的顶端。所述第二支座槽72C安装于所述安装槽113C，以使得所述模制支架11沿所述支座70C向上延伸，而所述滤光片40的位置相对向下，从而减小所述摄像模组的后焦距。可以理解的是，在其他变形实施例中，所述支座70C也可以没有上述第二支座槽72C，所述支座72C的平整底表面直接贴装于所述模制支架11。According to this embodiment of the invention, the holder 70C has a first seating groove 71C and a second seating groove 72C. The filter 40 is mounted to the first holder groove 71C such that the surface of the filter 40 does not protrude from the top end of the holder 70C. The second seating groove 72C is mounted to the mounting groove 113C such that the molded bracket 11 extends upward along the support 70C, and the position of the filter 40 is relatively downward, thereby reducing the position The back focus of the camera module. It can be understood that, in other modified embodiments, the support 70C may not have the second seat groove 72C, and the flat bottom surface of the support 72C is directly attached to the molded bracket 11.
值得一提的是，所述支座70C向内延伸的位置位于所述感光芯片50的感光路线之外，也就是说，所述支座70C不会遮挡所述感光芯片50，以避免影响所述感光芯片50的感光过程，所述支座70C的尺寸可以具体需求设计。It is worth mentioning that the inwardly extending position of the holder 70C is outside the photosensitive route of the photosensitive chip 50, that is, the holder 70C does not block the photosensitive chip 50 to avoid affecting the object. The photosensitive process of the photosensitive chip 50, the size of the support 70C can be designed according to specific needs.
不同于第三变形实施例的是，所述第二支座槽71C和所述封装的所述安装槽113C相互配合，形成匹配的卡接结构，从而使得所述支座70C得以稳定的安装于所述安装槽113C内。相对第三变形实施例，这个实施例中的所述滤光片40距离所述感光芯片50更小，可以获得具有更小后焦距的所述摄像模组。Different from the third modified embodiment, the second seating groove 71C and the mounting groove 113C of the package cooperate with each other to form a matching snap-fit structure, so that the support 70C is stably mounted on the support 70C. The inside of the mounting groove 113C. With respect to the third modified embodiment, the filter 40 in this embodiment is smaller than the photosensitive chip 50, and the camera module having a smaller back focus can be obtained.
在本发明的这个实施例中，以动焦模组为例进行说明，所述镜头20被安装于所述驱动器30，所述驱动器30被安装于所述模制支架11。也就是说，所述支座70C为所述滤光片40提供安装位置，所述模制支架11为所述驱动器30提供安装位置。而在本发明的其他实施例中，所述摄像模组还可以是一定焦模组。所述镜头20被安装于所述模制支架11，也就是说，所述支座70C为所述滤光片40提供安装位置，所述模制支架11为所述驱动器30提供安装位置。本领域的技术 人员应当理解的是，所述支座70C和所述模制支架11的具体结构和所述摄像模组的类型并不是本发明的限制。In this embodiment of the present invention, a moving focus module is described as an example. The lens 20 is mounted to the driver 30, and the driver 30 is mounted to the molded bracket 11. That is, the holder 70C provides a mounting position for the filter 40, and the molded bracket 11 provides a mounting position for the driver 30. In other embodiments of the present invention, the camera module may also be a fixed focus module. The lens 20 is mounted to the molded bracket 11, that is, the mount 70C provides a mounting position for the filter 40, and the molded bracket 11 provides a mounting position for the driver 30. It will be understood by those skilled in the art that the specific structure of the holder 70C and the molded bracket 11 and the type of the camera module are not limited by the present invention.
如图36至图37所示，是根据本发明的第四个优选实施例的摄像模组的第五变形实施例，其中阐述所述滤光片40的设置位置。不同于上述实施例的是，所述滤光片40被安装于所述驱动器30D，这样当所述驱动器30D被安装于所述模制支架11，其为所述驱动器30D提供平整的安装条件，并且所述驱动器30D安装支撑所述滤光片40，从而所述摄像模组不需要提供额外的部件来安装所述滤光片40。36 to 37 show a fifth modified embodiment of the camera module according to the fourth preferred embodiment of the present invention, in which the arrangement position of the filter 40 is explained. Unlike the above embodiment, the filter 40 is mounted to the driver 30D such that when the driver 30D is mounted to the molded bracket 11, it provides a flat mounting condition for the driver 30D, And the driver 30D is mounted to support the filter 40 such that the camera module does not need to provide additional components to mount the filter 40.
如图36所示，所述驱动器30D包括一下端部31D，所述下端部31D适于安装于所述滤光片40。也就是说，所述镜头20被安装于所述驱动器30D的上端，所述滤光片40被安装于所述驱动器30D的所述下端部31D，位于所述镜头50的下方。As shown in FIG. 36, the driver 30D includes a lower end portion 31D that is adapted to be mounted to the filter 40. That is, the lens 20 is attached to the upper end of the driver 30D, and the filter 40 is attached to the lower end portion 31D of the driver 30D, below the lens 50.
另外，如图37所示，所述驱动器30D包括一上端部32D，所述上端部32D适于安装于所述滤光片40。也就是说，所述镜头20被安装于所述驱动器30D的下端，所述滤光片40被安装于所述驱动器30D的所述上端部32D，位于所述镜头50的上方。特别，所述滤光片40位于在所述摄像模组的所述镜头20前方，以做入射滤光作用。In addition, as shown in FIG. 37, the driver 30D includes an upper end portion 32D that is adapted to be mounted to the filter 40. That is, the lens 20 is mounted to the lower end of the driver 30D, and the filter 40 is mounted to the upper end portion 32D of the driver 30D, above the lens 50. In particular, the filter 40 is located in front of the lens 20 of the camera module for incident filtering.
如图38至图39所示，是根据本发明的第四个优选实施例的摄像模组的第六变形实施例，其中阐述所述滤光片40的设置位置。不同于上述实施例的是，所述滤光片40被按安装于所述镜头20E，其中所述镜头20E包括至少一镜筒923E和至少一镜片921E，各所述镜片921E被安装于所述镜筒923E内，其中所述滤光片40被按安装于所述镜头20E的所述镜筒923E内。38 to 39, a sixth modified embodiment of the image pickup module according to the fourth preferred embodiment of the present invention, in which the arrangement position of the filter 40 is explained. Different from the above embodiment, the filter 40 is mounted to the lens 20E, wherein the lens 20E includes at least one lens barrel 923E and at least one lens 921E, and each of the lenses 921E is mounted on the lens Inside the lens barrel 923E, the filter 40 is press-fitted into the lens barrel 923E of the lens 20E.
如图38所示，所述镜筒923E包括一底部9231E，所述底部9231E用于安装所述滤光片40。所述镜筒923E的所述底部9231E与所述滤光片40的形状相适应，以便于将所述滤光片40安装于其中。所述镜筒923E上部用于安装所述镜片921E，且所述镜片921E的形状相适应，而下部用于安装所述滤光片40，且与所述滤光片40的形状相适应。特别地，所述驱动器30被安装于所述模制支架11，所述滤光片40被安装于所述镜筒923E，从而不需要提供额外的部件来安装所述滤光片40。As shown in FIG. 38, the lens barrel 923E includes a bottom portion 9231E for mounting the color filter 40. The bottom portion 9231E of the lens barrel 923E is adapted to the shape of the filter 40 to facilitate mounting the filter 40 therein. The upper portion of the lens barrel 923E is used to mount the lens 921E, and the shape of the lens 921E is adapted, and the lower portion is used to mount the filter 40, and is adapted to the shape of the filter 40. In particular, the driver 30 is mounted to the molded bracket 11, and the filter 40 is mounted to the barrel 923E, so that no additional components need to be provided to mount the filter 40.
另外，如图39所示，所述镜筒923E包括一顶部9232E，所述顶部9232E用 于安装所述滤光片40。所述镜筒923E的所述顶部9232E与所述滤光片40的形状相适应，以便于将所述滤光片40安装于其中。所述镜筒923E下部用于安装所述镜片921E，且所述镜片921E的形状相适应，而上部用于安装所述滤光片40，且与所述滤光片40的形状相适应。特别地，所述驱动器30被安装于所述模制支架11，所述滤光片40被安装于所述镜筒923E，从而不需要提供额外的部件来安装所述滤光片40。特别地，所述滤光片40可放置在所述摄像模组的所述镜头20前方，以做入射滤光作用。另外，可以理解的，所述镜头20E包括二镜筒923E，其相互接合，并使所述滤光片40接在其中一个所述镜筒923E上，以达到滤光效果。Further, as shown in Fig. 39, the lens barrel 923E includes a top portion 9232E for mounting the color filter 40. The top portion 9232E of the lens barrel 923E is adapted to the shape of the filter 40 to facilitate mounting the filter 40 therein. The lower portion of the lens barrel 923E is used to mount the lens 921E, and the shape of the lens 921E is adapted, and the upper portion is used to mount the filter 40, and is adapted to the shape of the filter 40. In particular, the driver 30 is mounted to the molded bracket 11, and the filter 40 is mounted to the barrel 923E, so that no additional components need to be provided to mount the filter 40. In particular, the filter 40 can be placed in front of the lens 20 of the camera module for incident filtering. In addition, it can be understood that the lens 20E includes two lens barrels 923E that are engaged with each other and that the filter 40 is attached to one of the lens barrels 923E to achieve a filtering effect.
如图40所示，是根据本发明的第四个优选实施例的摄像模组的第七变形实施例，其中阐述所述感光芯片50的安装方式和所述滤光片40的设置位置。不同于上述实施例的是，所述感光芯片50采用芯片倒装方式FC(Flip Chip)安装于所述线路板组件10。所述线路板12包括一线路板主体121F，所述线路板主体121F具有一通路1211F，所述通路1211F的下部适于安装所述感光芯片30。所述通路1211F使得所述线路板主体121F上下两侧相连通，从而当所述感光芯片50由所述线路板主体121F的背面、并且感光区朝上地安装于所述线路板主体121F时，所述感光芯片50的感光区能够接收到由所述镜头20进入的光线。As shown in FIG. 40, a seventh modified embodiment of the image pickup module according to the fourth preferred embodiment of the present invention, in which the mounting manner of the photosensitive chip 50 and the installation position of the filter 40 are explained. Different from the above embodiment, the photosensitive chip 50 is mounted on the circuit board assembly 10 by a flip chip type FC (Flip Chip). The circuit board 12 includes a circuit board main body 121F having a passage 1211F, and a lower portion of the passage 1211F is adapted to mount the photosensitive chip 30. The via 1211F causes the upper and lower sides of the wiring board main body 121F to communicate, so that when the photosensitive chip 50 is mounted on the back surface of the wiring board main body 121F and the photosensitive area is mounted upward on the wiring board main body 121F, The photosensitive area of the photosensitive chip 50 is capable of receiving light entering by the lens 20.
也就是说，本实施例采用不同于传统的芯片安装方式，即芯片倒装方式FC(Flip Chip)。所述传统的芯片安装方式是将所述感光芯片50安装于所述线路板组件10的上方。所述芯片倒装方式FC(Flip Chip)是将所述感光芯片50从所述线路板组件10的背面方向安装于所述线路板组件10，且所述感光芯片50的感光区朝上地安装于所述线路板组件10。本实施例的结构以及安装方式，使得所述感光芯片50和所述模制支架11相对独立，所述感光芯片50的安装不会受到所述模制支架11的影响，所述模制支架11的模塑成型对所述感光芯片50的影响也较小。本领域的技术人员应理解，所述感光芯片50安装方式，并不为本发明的限制。That is to say, this embodiment adopts a chip mounting method different from the conventional one, that is, a flip chip type FC (Flip Chip). The conventional chip mounting method is to mount the photosensitive chip 50 above the circuit board assembly 10. The Flip Chip is mounted on the circuit board assembly 10 from the back side of the circuit board assembly 10, and the photosensitive area of the photosensitive chip 50 is mounted upward. In the circuit board assembly 10. The structure and the mounting manner of the embodiment are such that the photosensitive chip 50 and the molded bracket 11 are relatively independent, and the mounting of the photosensitive chip 50 is not affected by the molded bracket 11, and the molded bracket 11 is The influence of the molding on the photosensitive chip 50 is also small. Those skilled in the art should understand that the manner in which the photosensitive chip 50 is mounted is not a limitation of the present invention.
另外，所述线路板主体121F具有一外凹槽1212F，所述外凹槽1212F连通于对应的所述通路，提供所述感光芯片50的安装位置。特别地，当所述感光芯片50被安装于所述外凹槽1212F时，所述感光芯片50的外表面不高于所述线路板主体121F的外表面，从而保证所述线路板组件10的表面平整性。In addition, the circuit board main body 121F has an outer recess 1212F, and the outer recess 1212F communicates with the corresponding passage to provide a mounting position of the photosensitive chip 50. In particular, when the photosensitive chip 50 is mounted on the outer groove 1212F, the outer surface of the photosensitive chip 50 is not higher than the outer surface of the wiring board main body 121F, thereby securing the circuit board assembly 10 Surface flatness.
在本发明的这个实施例中，所述通路1211F的上端安装所述滤光片40，也就是说，所述滤光片40覆盖于所述线路板主体121F的所述通路1211F，不需要将所述滤光片40安装于所述模制支架11，从而极大地减小所述摄像模组的后焦距，减小所述摄像模组的高度。也就是说，所述滤光片40被安装于所述线路板主体121F，而不需要提供额外的部件。In this embodiment of the invention, the filter 40 is mounted on the upper end of the passage 1211F, that is, the filter 40 covers the passage 1211F of the circuit board main body 121F, and does not need to be The filter 40 is mounted on the molded bracket 11 to greatly reduce the back focus of the camera module and reduce the height of the camera module. That is, the filter 40 is mounted to the wiring board main body 121F without providing additional components.
如图41至图42所示，是根据本发明的第五个优选实施例的摄像模组，其为基于红外吸收结构的摄像模组。所述摄像模组可实施为动焦摄像模组或定焦摄像模组，其中主要差异为所述动焦摄像模组通过对焦装置可改变焦距。本实施例以动焦摄像模组进行阐述。本发明中基于红外吸收结构的所述摄像模组包括一线路板组件10、一镜头20、一驱动器30，和一感光芯片50。所述镜头20位于该感光芯片50的感光路径，从而在所述摄像模组用于采集物体的影像时，被物体反射的光线能够在藉由所述镜头10的处理之后进一步被所述感光芯片50接受以适于进行光电转化。所述线路板组件10包括一线路板和一支架，所述支架可以贴装或一体封装于所述线路板，例如在图中示意的例子中，所述线路板组件10包括一模制支架11和一线路板12，所述感光芯片50电连接于所述线路板12。所述驱动器30被安装于所述线路板组件10，所述镜头20被安装于所述驱动器30，以使得所述镜头20被支撑于所述线路板组件10上方。As shown in FIG. 41 to FIG. 42 , a camera module according to a fifth preferred embodiment of the present invention is an imaging module based on an infrared absorption structure. The camera module can be implemented as a dynamic focus camera module or a fixed focus camera module, wherein the main difference is that the focus camera module can change the focal length through the focus device. This embodiment is described with a moving focus camera module. The camera module based on the infrared absorbing structure in the present invention comprises a circuit board assembly 10, a lens 20, a driver 30, and a sensor chip 50. The lens 20 is located in the photosensitive path of the photosensitive chip 50, so that when the camera module is used to collect an image of an object, the light reflected by the object can be further processed by the photosensitive chip after being processed by the lens 10. 50 accepted to be suitable for photoelectric conversion. The circuit board assembly 10 includes a circuit board and a bracket that can be mounted or integrally packaged on the circuit board. For example, in the example illustrated in the figures, the circuit board assembly 10 includes a molded bracket 11 And a circuit board 12, the photosensitive chip 50 is electrically connected to the circuit board 12. The driver 30 is mounted to the circuit board assembly 10, and the lens 20 is mounted to the driver 30 such that the lens 20 is supported above the circuit board assembly 10.
值得一提的，所述线路板组件10可以通过模塑方式形成所述模制支架11以用于支撑所述驱动器30。也就是说，相对传统摄像模组利用支架支撑驱动器的组装制程中，还需通过胶水贴合支架和线路板的方式，本发明则是通过模塑方式一体成型于所述线路板组件10。特别地，所述模制支架11亦可将位于所述线路板12的电子组件包覆保护之。另外，模塑方式分为MOB(molding on board)和MOC(molding on chip)，其中MOB(molding on board)为一体成型在所述线路板12，MOC(molding on chip)为一体成型在所述线路板12和所述感光芯片50上。另外，所述感光芯片50还可装置于所述线路板组件10上，并通过所述模制支架11一体成型。因此，所述模塑方式并为不本发明的限制。It is worth mentioning that the circuit board assembly 10 can form the molded bracket 11 by molding for supporting the driver 30. That is to say, in the assembly process of the conventional camera module using the bracket supporting the driver, the bracket and the circuit board are glued together by the glue, and the present invention is integrally molded on the circuit board assembly 10 by molding. In particular, the molded bracket 11 can also cover and protect the electronic components located on the circuit board 12. In addition, the molding method is divided into MOB (molding on board) and MOC (molding on chip), wherein MOB (molding on board) is integrally formed on the circuit board 12, and MOMC (molding on chip) is integrally formed in the The circuit board 12 and the photosensitive chip 50 are mounted. In addition, the photosensitive chip 50 may also be mounted on the circuit board assembly 10 and integrally formed by the molded bracket 11. Therefore, the molding method is not limited by the invention.
值得一提的，所述感光芯片50包括至少一芯片本体51和一吸收式滤光层42，其中所述一吸收式滤光层42位于所述芯片本体51的外表面，即感光面。另外，所述芯片吸收式滤光层42为具有吸收性质的化合物，特别是存在近红外光谱吸收的特性，其中所述近红外光谱为565nm～1200nm波段。另外，值得一提的是， 所述吸收式滤光层42为液体材料经过涂布、烘烤方式加工形成于所述芯片本体51，其中所述涂布方式可选择浸泡、离心力旋涂等物理气相沉积技术或化学气相沉积技术，这并为本发明的限制。It is worth mentioning that the photosensitive chip 50 comprises at least one chip body 51 and an absorption filter layer 42 , wherein the absorption filter layer 42 is located on the outer surface of the chip body 51 , that is, the photosensitive surface. In addition, the chip absorption filter layer 42 is a compound having an absorption property, particularly a characteristic of absorption in a near-infrared spectrum, wherein the near-infrared spectrum is in the range of 565 nm to 1200 nm. In addition, it is worth mentioning that the absorption filter layer 42 is formed by coating and baking a liquid material on the chip body 51, wherein the coating method can select immersion, centrifugal force spin coating and the like. Vapor deposition techniques or chemical vapor deposition techniques are also limitations of the invention.
因此，可以理解的，所述摄像模组的红外吸收结构是通过所述感光芯片50的所述吸收式滤光层42所形成，进一步地可省传统的滤光片，从而可使所述摄像模组既达到滤光的功能又能减化结构使所述摄像模组的整体结构变薄。另外，如图34所示，所述感光芯片50可以通过拼版或wafer level作业进行涂布和烘烤所述吸收式滤光层42，以提高产品生产效率，减少制作成本。Therefore, it can be understood that the infrared absorption structure of the camera module is formed by the absorption filter layer 42 of the photosensitive chip 50, and the conventional filter can be further saved, so that the camera can be made. The module not only achieves the function of filtering but also reduces the structure to make the overall structure of the camera module thin. In addition, as shown in FIG. 34, the photosensitive chip 50 can coat and bake the absorption filter layer 42 by imposition or wafer level work to improve product production efficiency and reduce manufacturing cost.
另外，所述化合物，其优选为溶剂可溶型色素化合物，更优选地为系选自由酞菁系化合物、方酸内鎓系化合物、萘酞菁系化合物、六元卟啉系化合物、克酮鎓系化合物以及花青系化合物所组成的群组中的至少一种。因此，当所述化合物作为所述吸收式滤光层42涂布于所述芯片本体51时，可以涂布为单层、双层或多层。可以理解的，即可将酞菁系化合物、方酸内鎓系化合物、萘酞菁系化合物、六元卟啉系化合物、克酮鎓系化合物以及花青系化合物所组成的群组中的至少一种或多种涂布于所述芯片本体51，也就是说将具有吸收性质的化合物涂布于所述芯片本体51即可。Further, the compound is preferably a solvent-soluble pigment compound, and more preferably selected from the group consisting of a phthalocyanine compound, a squaraine lanthanide compound, a naphthalocyanine compound, a hexavalent porphyrin compound, and a ketone. At least one of the group consisting of a lanthanide compound and a cyanine compound. Therefore, when the compound is applied to the chip body 51 as the absorption filter layer 42, it may be applied as a single layer, a double layer or a plurality of layers. It is understood that at least at least a group consisting of a phthalocyanine-based compound, a squaraine-based ruthenium-based compound, a naphthalocyanine-based compound, a hexa-valent porphyrin-based compound, a ketone oxime-based compound, and a cyanine compound can be used. One or more kinds are applied to the chip body 51, that is, a compound having an absorbing property is applied to the chip body 51.
值得一提的，所述化合物，式Ⅰ和式Ⅱ表示所述方酸内鎓系化合物。It is worth mentioning that the compound, Formula I and Formula II represent the squaraine lanthanide compound.
其中，式Ⅰ中R
a、R
b及Y满足下述(a)或(b)的条件
Wherein, R a , R b and Y in the formula I satisfy the conditions of the following (a) or (b)
条件(a)Condition (a)
存在多个的R
a分别独立表示氢原子、卤素原子、磺基、羟基、氰基、硝基、羧基、怜酸基、-L
1或-NR
eR
f基。R
e及R
f分别独立地表示氢原子、-L
a、-L
b、-L
c、-L
d 或-L
e。
There are a plurality of R a independently representing a hydrogen atom, a halogen atom, a sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a pity acid group, a -L 1 or a -NR e R f group. R e and R f each independently represent a hydrogen atom, -L a , -L b , -L c , -L d or -L e .
存在多个的R
b分别独立表示氢原子、卤素原子磺基、羟基、氰基、硝基、羧基、怜酸基、-L
1或-NR
gR
h基。R
g及R
h分别独立地表示氢原子、-L
a、-L
b、-L
c、-L
d或-L
e或-C(O)R
i基(R
i表示-L
a、-L
b、-L
c、-L
d或-L
e)。
The plurality of R b present independently represent a hydrogen atom, a halogen atom sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a pity acid group, a -L 1 or a -NR g R h group. R g and R h each independently represent a hydrogen atom, -L a , -L b , -L c , -L d or -L e or -C(O)R i group (R i represents -L a , -L b , -L c , -L d or -L e ).
存在多个的Y分别独立表示-NR
jR
k基。R
j及R
k分别独立地表示氢原子、-L
a、-L
b、-L
c、-L
d或-L
e。
There are a plurality of Ys respectively representing the -NR j R k basis. R j and R k each independently represent a hydrogen atom, -L a , -L b , -L c , -L d or -L e .
L
1为L
a、L
b、L
c、L
d、L
e、L
f、L
g或L
h。
L 1 is L a , L b , L c , L d , L e , L f , L g or L h .
所述L
a～L
h表示以下的基团：
The L a to L h represent the following groups:
L
a可具有取代基L的碳数为1～12的脂肪族烃基
L a may have an aliphatic hydrocarbon group having a carbon number of 1 to 12 of the substituent L
L
b可具有取代基L的碳数为1～12的卤素取代烷基
L b may have a substituent L of a halogen-substituted alkyl group having 1 to 12 carbon atoms
L
c可具有取代基L的碳数为3～14的脂环式烃基
L c may have a substituent L of an alicyclic hydrocarbon group having 3 to 14 carbon atoms
L
d可具有取代基L的碳数为6～14的芳香族烃基
L d may have an aromatic hydrocarbon group having a substituent L of 6 to 14 carbon atoms
L
e可具有取代基L的碳数为3～14的杂环基
L e may have a substituent L of a heterocyclic group having 3 to 14 carbon atoms
L
f可具有取代基L的碳数为1～9的烷氧基
L f may have a substituent A having an alkoxy group having 1 to 9 carbon atoms
L
g可具有取代基L的碳数为1～9的酰基
L g may have an acyl group having a substituent L of 1 to 9 carbon atoms
L
h可具有取代基L的碳数为1～9的烷氧基羰基
L h may have alkoxycarbonyl group having a substituent of L of 1 to 9 carbon atoms
取代基l为选自由碳数为1～12的脂肪族烃基、碳数为1～12的卤素取代烷基、碳数为3～14的脂环式烃基、碳数为6～14的芳香族烃基、碳数为3～14的杂环基、卤素原子、磺基、羟基、氰基、硝基、羧基、怜酸基及氨基所组成的群组的至少一种。The substituent 1 is an aromatic hydrocarbon group selected from the group consisting of an aliphatic hydrocarbon group having 1 to 12 carbon atoms, a halogen-substituted alkyl group having 1 to 12 carbon atoms, an alicyclic hydrocarbon group having 3 to 14 carbon atoms, and an aromatic group having 6 to 14 carbon atoms. At least one of a group consisting of a hydrocarbon group, a heterocyclic group having 3 to 14 carbon atoms, a halogen atom, a sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a pity acid group, and an amino group.
所述L
a～L
h中，包括取代基的碳数的合计优选为分别为50以下，更优选为碳数为40以下，特别优选为碳数为30以下。若碳数多于所述范围，则有难以合成化合物的情况，并且有每单位重量的光的吸收强度变小的倾向。
In the above-mentioned L a to L h , the total number of carbon atoms including the substituent is preferably 50 or less, more preferably 40 or less, and particularly preferably 30 or less. When the carbon number is more than the above range, it may be difficult to synthesize a compound, and the absorption intensity per unit weight of light tends to be small.
条件(b)Condition (b)
1个苯环上的2个R
a中的至少一个与同一苯环上的Y相互键结，形成包含至少一个氮原子的构成原子数为5或6的杂环。所述杂环可具有取代基，R
b及未参与所述杂环的形成的R
a分别独立地与所述条件(a)的R
b及RR
a同义。
At least one of the two R a on one benzene ring is bonded to Y on the same benzene ring to form a hetero ring having at least one nitrogen atom and having 5 or 6 atoms. The heterocyclic ring may have a substituent, and R b and R a not participating in the formation of the heterocyclic ring are each independently synonymous with R b and RR a of the condition (a).
其中，式Ⅱ中，X独立地表示0、S、Se、N-R
c或C(R
dR
d)，存在多个的R
c分别独立地表示氢原子、L
a、L
b、L
c、L
d或L
e，存在多个的R
d分别独立地表示氢原子、卤素原子磺基、羟基、氰基、硝基、羧基、磷酸基、-L
1或-NR
eR
f基，相邻的R
d彼此 可连结而形成可具有取代基的环，L
a～L
e、L
1、R
e及R
f与所述式I中所定义的L
a～L
e、L
1、R
e及R
f同义。
Wherein, in Formula II, X independently represents 0, S, Se, NR c or C(R d R d ), and a plurality of R c independently represent a hydrogen atom, L a , L b , L c , L d or L e , a plurality of R d independently represent a hydrogen atom, a halogen atom sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a phosphate group, a -L 1 or a -NR e R f group, adjacent R d may be bonded to each other to form a ring which may have a substituent, and L a to L e , L 1 , R e and R f and L a to L e , L 1 , R e and R as defined in the above formula I f is synonymous.
另外，所述化合物，式Ⅲ表示所述酞菁系化合物。Further, the compound, Formula III, represents the phthalocyanine-based compound.
其中式Ⅲ中，Μ表示2个氢原子、2个1价金属原子、2价金属原子、或包含3价或4价金属原子的取代金属原子，存在多个的R
a、R
b、R
c及R
d分别独立地表示选自由氢原子、卤素原子、羟基、羧基、硝基、氨基、酰胺基、酰亚胺基、氰基、硅烷基、-L
1、-S-L
2、-SS-L
2、-S0
2-L
3、-N＝N-L
4、或与Ra与R
b、R
b与R
c、及R
c与R
d中至少一个组合键结。其中，键结于同一芳香环的R
a、R
b、R
c及R
d中至少一个不为氢原子。
In the formula III, Μ represents two hydrogen atoms, two monovalent metal atoms, a divalent metal atom, or a substituted metal atom containing a trivalent or tetravalent metal atom, and a plurality of R a , R b , R c are present. And R d are independently represented by a hydrogen atom, a halogen atom, a hydroxyl group, a carboxyl group, a nitro group, an amino group, an amide group, an imide group, a cyano group, a silane group, -L 1 , -SL 2 , -SS-L. 2 , -S0 2 -L 3 , -N=NL 4 , or in combination with at least one of Ra and R b , R b and R c , and R c and R d . Wherein at least one of R a , R b , R c and R d bonded to the same aromatic ring is not a hydrogen atom.
所述氨基、酰胺基、酰亚胺基及硅烷基可具有所述式Ⅰ中所定义的取代基L，The amino group, the amide group, the imide group, and the silane group may have the substituent L defined in the formula I,
L
1与所述式Ⅰ中所定义的L
1同义，
L 1 in the formula as defined Ⅰ L 1 of synonymous,
L
2表示氢原子或所述式Ⅰ中所定义的L
a～L
e的任一个，
L 2 represents a hydrogen atom or any of L a to L e defined in the formula I,
L
3表示羟基或所述L
a～L
e的任一个，
L 3 represents a hydroxyl group or any of the above L a to L e ,
L
4表示所述L
a～L
e的任一个。
L 4 represents any of the above L a to L e .
值得一提的，在本发明的这个实施例中，可以采用传统的芯片安装方式，亦可采用不同于传统的芯片安装方式，即芯片倒装方式FC(Flip Chip)。所述传统的芯片安装方式即是将所述感光芯片50安装于所述线路板组件10的上方。所述芯片倒装方式FC(Flip Chip)即是将所述感光芯片50从所述线路板组件10的背面方向安装于所述线路板组件10，且所述感光芯片50的感光区朝上地安装于所述线路板组件10。这样的结构以及安装方式，使得所述感光芯片50和所述模制支架11相对独立，所述感光芯片50的安装不会受到所述模制支架11的影响，所述模制支架11的模塑成型对所述感光芯片50的影响也较小。本领域的技术人员应理解，所述感光芯片50安装方式，并不为本发明的限制。It should be noted that in this embodiment of the present invention, a conventional chip mounting method may be adopted, or a chip mounting method different from the conventional chip mounting method, that is, a Flip Chip. The conventional chip mounting method is to mount the photosensitive chip 50 above the circuit board assembly 10. The flip chip type FC (Flip Chip) is mounted on the circuit board assembly 10 from the back side of the circuit board assembly 10, and the photosensitive area of the photosensitive chip 50 faces upward. Mounted to the circuit board assembly 10. Such a structure and mounting manner are such that the photosensitive chip 50 and the molded holder 11 are relatively independent, and the mounting of the photosensitive chip 50 is not affected by the molded bracket 11, and the mold of the molded bracket 11 The influence of the molding on the photosensitive chip 50 is also small. Those skilled in the art should understand that the manner in which the photosensitive chip 50 is mounted is not a limitation of the present invention.
根据本实施例，本发明还提供一摄像模组的红外吸收结构制程方法，其中包 括如下步骤：According to the embodiment, the present invention further provides a method for manufacturing an infrared absorption structure of a camera module, which comprises the following steps:
(a)涂覆吸收式滤光层42于芯片本体51；以及(a) coating the absorptive filter layer 42 on the chip body 51;
(b)固化所述吸收式滤光层42于所述芯片本体51。(b) curing the absorptive filter layer 42 to the chip body 51.
根据步骤(a)，其中涂覆方式采用浸泡、离心力旋涂等物理气相沉积技术或化学气相沉积技术。According to the step (a), the coating method is a physical vapor deposition technique such as immersion or centrifugal spin coating or a chemical vapor deposition technique.
根据步骤(a)，其中所述吸收式滤光层42为有机材料，且存在近红外光谱吸收的特性，其中所述近红外光谱为565nm～1200nm波段。According to the step (a), wherein the absorption filter layer 42 is an organic material and has a characteristic of absorption in the near-infrared spectrum, wherein the near-infrared spectrum is in the band of 565 nm to 1200 nm.
根据步骤(a)，其中所述吸收式滤光层42在涂覆前为液体材料。According to step (a), wherein the absorptive filter layer 42 is a liquid material prior to coating.
本领域的技术人员应理解，上述描述及附图中所示的本发明的实施例只作为举例而并不限制本发明。本发明的目的已经完整并有效地实现。本发明的功能及结构原理已在实施例中展示和说明，在没有背离所述原理下，本发明的实施方式可以有任何变形或修改。Those skilled in the art should understand that the embodiments of the present invention described in the above description and the accompanying drawings are only by way of illustration and not limitation. The object of the invention has been achieved completely and efficiently. The present invention has been shown and described with respect to the embodiments of the present invention, and the embodiments of the present invention may be modified or modified without departing from the principles.
Claims (60)
- 一基于红外吸收镜头结构的摄像模组，其特征在于，包括：至少一线路板，至少一镜头，至少一感光芯片，其中所述感光芯片电连接于所述线路板，所述镜头位于所述感光芯片的感光路径，其中所述镜头包括至少一镜片和至少一镜筒，其中所述至少一镜片中的一个或多个镜片为红外吸收镜片并设置于所述镜筒，以使所述镜头形成一红外吸收式镜头，从而达到近红外光谱吸收效果。A camera module based on an infrared absorption lens structure, comprising: at least one circuit board, at least one lens, at least one photosensitive chip, wherein the photosensitive chip is electrically connected to the circuit board, and the lens is located in the a photosensitive path of the photosensitive chip, wherein the lens comprises at least one lens and at least one lens barrel, wherein one or more of the at least one lens is an infrared absorption lens and is disposed on the lens barrel to make the lens An infrared absorption lens is formed to achieve near-infrared absorption.
- 根据权利要求1所述摄像模组，其中所述红外吸收镜片为存在近红外光谱吸收的特性的材料所制。The camera module according to claim 1, wherein said infrared absorbing lens is made of a material having a characteristic of absorption in the near infrared spectrum.
- 根据权利要求1所述摄像模组，其中所述红外吸收镜片通过在镜片表面设置有至少一红外吸收层而形成。The camera module of claim 1 wherein said infrared absorbing lens is formed by providing at least one infrared absorbing layer on the surface of the lens.
- 根据权利要求2所述摄像模组，其中所述近红外光谱为565nm～1200nm波段。The camera module according to claim 2, wherein said near-infrared spectrum is in a wavelength band of 565 nm to 1200 nm.
- 根据权利要求3所述摄像模组，其中所述近红外光谱为565nm～1200nm波段。The camera module according to claim 3, wherein said near-infrared spectrum is in a wavelength band of 565 nm to 1200 nm.
- 根据权利要求4或5中任一所述摄像模组，其中所述化合物系选自由酞菁系化合物、方酸内鎓系化合物、萘酞菁系化合物、六元卟啉系化合物、克酮鎓系化合物以及花青系化合物所组成的群组中的至少一种。The camera module according to any one of claims 4 or 5, wherein the compound is selected from the group consisting of a phthalocyanine compound, a squaraine lanthanide compound, a naphthalocyanine compound, a hexavalent porphyrin compound, and a ketone oxime. At least one of a group consisting of a compound and a cyanine compound.
- 根据权利要求6所述摄像模组，其中所述化合物为下述式Ⅰ或式Ⅱ所示的化合物：The camera module according to claim 6, wherein said compound is a compound represented by the following formula I or formula II:其中，式Ⅰ中R a、R b及Y满足下述(a)或(b)的条件， Wherein, R a , R b and Y in the formula I satisfy the conditions of the following (a) or (b),条件(a)：Condition (a):存在多个的R a分别独立表示氢原子、卤素原子、磺基、羟基、氰基、硝基、羧基、怜酸基、-L 1或-NR eR f基，R e及R f分别独立地表示氢原子、-L a、-L b、-L c、-L d或-L e， There are a plurality of R a independently representing a hydrogen atom, a halogen atom, a sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a pity acid group, a -L 1 or a -NR e R f group, and R e and R f are each independently Ground represents a hydrogen atom, -L a , -L b , -L c , -L d or -L e ,存在多个的R b分别独立表示氢原子、卤素原子磺基、羟基、氰基、硝基、羧基、怜酸基、-L 1或-NR gR h基，R g及R h分别独立地表示氢原子、-L a、-L b、-L c、-L d或-L e或-C(O)R i基(R i表示-L a、-L b、-L c、-L d或-L e)， There are a plurality of R b independently representing a hydrogen atom, a halogen atom sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a pity acid group, a -L 1 or a -NR g R h group, and R g and R h are independently Represents a hydrogen atom, -L a , -L b , -L c , -L d or -L e or -C(O)R i group (R i represents -L a , -L b , -L c , -L d or -L e ),存在多个的Y分别独立表示-NR jR k基。R j及R k分别独立地表示氢原子、-L a、-L b、-L c、-L d或-L e， There are a plurality of Ys respectively representing the -NR j R k basis. R j and R k each independently represent a hydrogen atom, -L a , -L b , -L c , -L d or -L e ,L 1为L a、L b、L c、L d、L e、L f、L g或L h， L 1 is L a , L b , L c , L d , L e , L f , L g or L h ,所述L a～L h表示以下的基团： The L a to L h represent the following groups:L a可具有取代基L的碳数为1～12的脂肪族烃基 L a may have an aliphatic hydrocarbon group having a carbon number of 1 to 12 of the substituent LL b可具有取代基L的碳数为1～12的卤素取代烷基 L b may have a substituent L of a halogen-substituted alkyl group having 1 to 12 carbon atomsL c可具有取代基L的碳数为3～14的脂环式烃基 L c may have a substituent L of an alicyclic hydrocarbon group having 3 to 14 carbon atomsL d可具有取代基L的碳数为6～14的芳香族烃基 L d may have an aromatic hydrocarbon group having a substituent L of 6 to 14 carbon atomsL e可具有取代基L的碳数为3～14的杂环基 L e may have a substituent L of a heterocyclic group having 3 to 14 carbon atomsL f可具有取代基L的碳数为1～9的烷氧基 L f may have a substituent A having an alkoxy group having 1 to 9 carbon atomsL g可具有取代基L的碳数为1～9的酰基 L g may have an acyl group having a substituent L of 1 to 9 carbon atomsL h可具有取代基L的碳数为1～9的烷氧基羰基 L h L may have a substituent group having a carbon number of alkoxycarbonyl group having 1 to 9其中，取代基l为选自由碳数为1～12的脂肪族烃基、碳数为1～12的卤素取代烷基、碳数为3～14的脂环式烃基、碳数为6～14的芳香族烃基、碳数为3～14的杂环基、卤素原子、磺基、羟基、氰基、硝基、羧基、怜酸基及氨基所组成的群组的至少一种，The substituent 1 is selected from the group consisting of an aliphatic hydrocarbon group having 1 to 12 carbon atoms, a halogen-substituted alkyl group having 1 to 12 carbon atoms, an alicyclic hydrocarbon group having 3 to 14 carbon atoms, and a carbon number of 6 to 14. At least one of a group consisting of an aromatic hydrocarbon group, a heterocyclic group having 3 to 14 carbon atoms, a halogen atom, a sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a pity acid group, and an amino group,条件(b)：Condition (b):1个苯环上的2个R a中的至少一个与同一苯环上的Y相互键结，形成包含至少一个氮原子的构成原子数为5或6的杂环，所述杂环可具有取代基，R b及未参与所述杂环的形成的R a分别独立地与所述条件(a)的R b及RR a同义， At least one of the two R a on one benzene ring is bonded to Y on the same benzene ring to form a hetero ring having at least one nitrogen atom and having a number of atoms of 5 or 6, and the hetero ring may have a substitution. The radicals, R b and R a not participating in the formation of the heterocyclic ring are each independently synonymous with R b and RR a of the condition (a),其中，式Ⅱ中，X独立地表示0、S、Se、N-R c或C(R dR d)，存在多个的R c分别独立地表示氢原子、L a、L b、Lc、L d或L e，存在多个的R d分别独立地表示氢原子、卤 素原子磺基、羟基、氰基、硝基、羧基、磷酸基、-L 1或-NR eR f基，相邻的R d彼此可连结而形成可具有取代基的环，L a～L e、L 1、R e及R f与所述式I中所定义的L a～L e、L 1、R e及R f同义。 Wherein, in Formula II, X independently represents 0, S, Se, NR c or C(R d R d ), and a plurality of R c independently represent a hydrogen atom, L a , L b , Lc, L d Or L e , a plurality of R d independently represent a hydrogen atom, a halogen atom sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a phosphate group, a -L 1 or a -NR e R f group, and an adjacent R d may be linked to each other to form a ring may have a substituent group, L a ~ L e, L 1, L a R e and R f in the formula I as defined in ~ L e, L 1, R e , and R f Synonymous.
- 根据权利要求6所述摄像模组，其中所述化合物为下述式Ⅲ所示的化合物：The camera module according to claim 6, wherein said compound is a compound represented by the following formula III:其中，X独立地表示氧原子、硫原子、硒原子或-NH-，R 1～R 7分别独立地表示氢原子、卤素原子、磺基、羟基、氰基、硝基、羧基、磷酸基、-L 1或-NR gR h基。R g及R h分别独立地表示氢原子、-L a、-L b、-L c、-L d或-L e或-C(O)R i基(R i表示-L a、-L b、-L c、-L d或-L e)， Wherein X independently represents an oxygen atom, a sulfur atom, a selenium atom or -NH-, and R 1 to R 7 each independently represent a hydrogen atom, a halogen atom, a sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a phosphate group, -L 1 or -NR g R h group. R g and R h each independently represent a hydrogen atom, -L a , -L b , -L c , -L d or -L e or -C(O)R i group (R i represents -L a , -L b , -L c , -L d or -L e ),L 1为L a、L b、L c、L d、L e、L f、L g或L h， L 1 is L a , L b , L c , L d , L e , L f , L g or L h ,L a～L h与所述式Ⅰ中所定义的L a～L h同义， L a to L h are synonymous with L a to L h as defined in the formula I,作为所述R 1，优选为氢原子、氯原子、氟原子、甲基、乙基、正丙基、异丙基、正丁基、仲丁基、叔丁基、环己基、苯基、羟基、氨基、二甲基氨基、硝基，更优选为氢原子、氯原子、氟原子、甲基、乙基、正丙基、异丙基、羟基， As the R 1 , a hydrogen atom, a chlorine atom, a fluorine atom, a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a n-butyl group, a sec-butyl group, a t-butyl group, a cyclohexyl group, a phenyl group, a hydroxyl group are preferable. , an amino group, a dimethylamino group, a nitro group, more preferably a hydrogen atom, a chlorine atom, a fluorine atom, a methyl group, an ethyl group, a n-propyl group, an isopropyl group or a hydroxyl group.作为所述R 2～R 7,优选为氢原子、氯原子、氟原子、甲基、乙基、正丙基、异丙基、正丁基、仲丁基、叔丁基、环己基、苯基、羟基、氨基、二甲基氨基、氰基、硝基、乙酰基氨基、丙酰基氨基、N-甲基乙酷基氨基、三氟甲酰基氨基、五氟乙酰基氨基、叔丁酰基氨基、环己酰基氨基，更优选为氢原子、氯原子、氟原子、甲基、乙基、正丙基、异丙基、羟基、二甲基氨基、硝基、乙酰基氨基、丙酰基氨基、三氟甲酰基氨基、五氟乙酰基氨基、叔丁酰基氨基、环己酰基氨基， As the R 2 to R 7 , a hydrogen atom, a chlorine atom, a fluorine atom, a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a n-butyl group, a sec-butyl group, a t-butyl group, a cyclohexyl group, and a benzene are preferable. Base, hydroxy, amino, dimethylamino, cyano, nitro, acetylamino, propionylamino, N-methylethylamino, trifluorocarbonylamino, pentafluoroacetylamino, tert-butyrylamino a cyclohexanoylamino group, more preferably a hydrogen atom, a chlorine atom, a fluorine atom, a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a hydroxyl group, a dimethylamino group, a nitro group, an acetylamino group, a propionylamino group, Trifluoroformylamino, pentafluoroacetylamino, tert-butyrylamino, cyclohexanoylamino,作为所述X，优选为氧原子、硫原子，特别优选为氧原子。The X is preferably an oxygen atom or a sulfur atom, and particularly preferably an oxygen atom.
- 根据权利要求6所述摄像模组，其中所述化合物为下述式Ⅳ所示的化合物：The camera module according to claim 6, wherein said compound is a compound represented by the following formula IV:其中式Ⅳ中，Μ表示2个氢原子、2个1价金属原子、2价金属原子、或包含3价或4价金属原子的取代金属原子，存在多个的R a、R b、R c及R d分别独立地表示选自由氢原子、卤素原子、羟基、羧基、硝基、氨基、酰胺基、酰亚胺基、氰基、硅烷基、-L 1、-S-L 2、-SS-L 2、-S0 2-L 3、-N＝N-L 4、或与Ra与R b、R b与R c、及R c与R d中至少一个组合键结。其中，键结于同一芳香环的R a、R b、R c及R d中至少一个不为氢原子， In the formula IV, Μ represents two hydrogen atoms, two monovalent metal atoms, a divalent metal atom, or a substituted metal atom containing a trivalent or tetravalent metal atom, and a plurality of R a , R b , R c And R d are independently represented by a hydrogen atom, a halogen atom, a hydroxyl group, a carboxyl group, a nitro group, an amino group, an amide group, an imide group, a cyano group, a silane group, -L 1 , -SL 2 , -SS-L. 2 , -S0 2 -L 3 , -N=NL 4 , or in combination with at least one of Ra and R b , R b and R c , and R c and R d . Wherein at least one of R a , R b , R c and R d bonded to the same aromatic ring is not a hydrogen atom,所述氨基、酰胺基、酰亚胺基及硅烷基可具有所述式Ⅰ中所定义的取代基L，The amino group, the amide group, the imide group, and the silane group may have the substituent L defined in the formula I,L 1与所述式Ⅰ中所定义的L 1同义， L 1 in the formula as defined Ⅰ L 1 of synonymous,L 2表示氢原子或所述式Ⅰ中所定义的L a～L e的任一个， L 2 represents a hydrogen atom or any of L a to L e defined in the formula I,L 3表示羟基或所述L a～L e的任一个， L 3 represents a hydroxyl group or any of the above L a to L e ,L 4表示所述L a～L e的任一个。 L 4 represents any of the above L a to L e .
- 根据权利要求3所述摄像模组，其中所述红外吸收层在涂布前为液体材料。The camera module according to claim 3, wherein said infrared absorbing layer is a liquid material before coating.
- 根据权利要求3所述摄像模组，其中所述红外吸收层的涂布方式系选自浸泡、离心力旋涂、喷涂的物理沉积技术和化学沉积。The camera module according to claim 3, wherein the coating method of the infrared absorbing layer is selected from the group consisting of immersion, centrifugal spin coating, physical deposition techniques of spraying, and chemical deposition.
- 根据权利要求1-11中任一的所述摄像模组，还包括至少一驱动器，其被安装于所述线路板组件，所述镜头被安装于所述驱动器，以使得所述镜头被支撑于所述线路板组件上方。The camera module according to any one of claims 1 to 11, further comprising at least one driver mounted to the circuit board assembly, the lens being mounted to the driver such that the lens is supported by Above the circuit board assembly.
- 根据权利要求1-11中任一所述摄像模组，其中还包括至少一支架，所述支架贴装或一体地封装于所述线路板。The camera module according to any one of claims 1-11, further comprising at least one bracket mounted or integrally packaged on the circuit board.
- 根据权利要求1-11中任一所述摄像模组，其中还包括至少一滤光片，其位 于所述感光芯片之前，厚度<1mm。A camera module according to any one of claims 1-11, further comprising at least one filter positioned before said photosensitive chip and having a thickness of < 1 mm.
- 根据权利要求3所述摄像模组，其中所述红外吸收层设置于所述镜片一面或两面。The camera module according to claim 3, wherein said infrared absorbing layer is disposed on one or both sides of said lens.
- 根据权利要求1所述摄像模组，其中所述镜片由非球面压型加工得到。The camera module of claim 1 wherein said lens is machined from an aspherical profile.
- 一镜头，其特征在于，所述镜头包括至少一镜片，其中所述至少一镜片中的一个或多个镜片为红外吸收镜片以使所述镜头形成一红外吸收式镜头，从而达到近红外光谱吸收效果。A lens, characterized in that the lens comprises at least one lens, wherein one or more of the at least one lens is an infrared absorbing lens to form the infrared absorbing lens to achieve near infrared spectroscopy absorption effect.
- 据权利要求17所述镜头，其中所述红外吸收镜片由存在近红外光谱吸收的特性的材料制得。The lens according to claim 17, wherein said infrared absorbing lens is made of a material having a property of absorption in a near-infrared spectrum.
- 根据权利要求17所述镜头，其中所述红外吸收镜片通过在镜片表面设置有至少一红外吸收层而形成。The lens according to claim 17, wherein said infrared absorbing lens is formed by providing at least one infrared absorbing layer on the surface of the lens.
- 根据权利要求18或19中任一所述镜头，其中所述化合物系选自由酞菁系化合物、方酸内鎓系化合物、萘酞菁系化合物、六元卟啉系化合物、克酮鎓系化合物以及花青系化合物所组成的群组中的至少一种。The lens according to any one of claims 18 or 19, wherein the compound is selected from the group consisting of a phthalocyanine compound, a squaraine lanthanide compound, a naphthalocyanine compound, a hexavalent porphyrin compound, and a ketone oxime compound. And at least one of the group consisting of cyanine compounds.
- 根据权利要求20所述镜头，其中所述化合物为下述式Ⅰ或式Ⅱ所示的化合物：The lens according to claim 20, wherein said compound is a compound represented by the following formula I or formula II:其中，式Ⅰ中R a、R b及Y满足下述(a)或(b)的条件， Wherein, R a , R b and Y in the formula I satisfy the conditions of the following (a) or (b),条件(a)：Condition (a):存在多个的R a分别独立表示氢原子、卤素原子、磺基、羟基、氰基、硝基、羧基、怜酸基、-L 1或-NR eR f基，R e及R f分别独立地表示氢原子、-L a、-L b、-L c、-L d或-L e， There are a plurality of R a independently representing a hydrogen atom, a halogen atom, a sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a pity acid group, a -L 1 or a -NR e R f group, and R e and R f are each independently Ground represents a hydrogen atom, -L a , -L b , -L c , -L d or -L e ,存在多个的R b分别独立表示氢原子、卤素原子磺基、羟基、氰基、硝基、羧基、怜酸基、-L 1或-NR gR h基，R g及R h分别独立地表示氢原子、-L a、-L b、-L c、-L d或-L e或-C(O)R i基(R i表示-L a、-L b、-L c、-L d或-L e)， There are a plurality of R b independently representing a hydrogen atom, a halogen atom sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a pity acid group, a -L 1 or a -NR g R h group, and R g and R h are independently Represents a hydrogen atom, -L a , -L b , -L c , -L d or -L e or -C(O)R i group (R i represents -L a , -L b , -L c , -L d or -L e ),存在多个的Y分别独立表示-NR jR k基。R j及R k分别独立地表示氢原子、-L a、-L b、-L c、-L d或-L e， There are a plurality of Ys respectively representing the -NR j R k basis. R j and R k each independently represent a hydrogen atom, -L a , -L b , -L c , -L d or -L e ,L 1为L a、L b、L c、L d、L e、L f、L g或L h， L 1 is L a , L b , L c , L d , L e , L f , L g or L h ,所述L a～L h表示以下的基团： The L a to L h represent the following groups:L a可具有取代基L的碳数为1～12的脂肪族烃基 L a may have an aliphatic hydrocarbon group having a carbon number of 1 to 12 of the substituent LL b可具有取代基L的碳数为1～12的卤素取代烷基 L b may have a substituent L of a halogen-substituted alkyl group having 1 to 12 carbon atomsL c可具有取代基L的碳数为3～14的脂环式烃基 L c may have a substituent L of an alicyclic hydrocarbon group having 3 to 14 carbon atomsL d可具有取代基L的碳数为6～14的芳香族烃基 L d may have an aromatic hydrocarbon group having a substituent L of 6 to 14 carbon atomsL e可具有取代基L的碳数为3～14的杂环基 L e may have a substituent L of a heterocyclic group having 3 to 14 carbon atomsL f可具有取代基L的碳数为1～9的烷氧基 L f may have a substituent A having an alkoxy group having 1 to 9 carbon atomsL g可具有取代基L的碳数为1～9的酰基 L g may have an acyl group having a substituent L of 1 to 9 carbon atomsL h可具有取代基L的碳数为1～9的烷氧基羰基 L h L may have a substituent group having a carbon number of alkoxycarbonyl group having 1 to 9其中，取代基l为选自由碳数为1～12的脂肪族烃基、碳数为1～12的卤素取代烷基、碳数为3～14的脂环式烃基、碳数为6～14的芳香族烃基、碳数为3～14的杂环基、卤素原子、磺基、羟基、氰基、硝基、羧基、怜酸基及氨基所组成的群组的至少一种，The substituent 1 is selected from the group consisting of an aliphatic hydrocarbon group having 1 to 12 carbon atoms, a halogen-substituted alkyl group having 1 to 12 carbon atoms, an alicyclic hydrocarbon group having 3 to 14 carbon atoms, and a carbon number of 6 to 14. At least one of a group consisting of an aromatic hydrocarbon group, a heterocyclic group having 3 to 14 carbon atoms, a halogen atom, a sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a pity acid group, and an amino group,条件(b)：Condition (b):1个苯环上的2个R a中的至少一个与同一苯环上的Y相互键结，形成包含至少一个氮原子的构成原子数为5或6的杂环，所述杂环可具有取代基，R b及未参与所述杂环的形成的R a分别独立地与所述条件(a)的R b及RR a同义， At least one of the two R a on one benzene ring is bonded to Y on the same benzene ring to form a hetero ring having at least one nitrogen atom and having a number of atoms of 5 or 6, and the hetero ring may have a substitution. The radicals, R b and R a not participating in the formation of the heterocyclic ring are each independently synonymous with R b and RR a of the condition (a),其中，式Ⅱ中，X独立地表示0、S、Se、N-R c或C(R dR d)，存在多个的R c分别独立地表示氢原子、L a、L b、Lc、L d或L e，存在多个的R d分别独立地表示氢原子、卤 素原子磺基、羟基、氰基、硝基、羧基、磷酸基、-L 1或-NR eR f基，相邻的R d彼此可连结而形成可具有取代基的环，L a～L e、L 1、R e及R f与所述式I中所定义的L a～L e、L 1、R e及R f同义。 Wherein, in Formula II, X independently represents 0, S, Se, NR c or C(R d R d ), and a plurality of R c independently represent a hydrogen atom, L a , L b , Lc, L d Or L e , a plurality of R d independently represent a hydrogen atom, a halogen atom sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a phosphate group, a -L 1 or a -NR e R f group, and an adjacent R d may be linked to each other to form a ring may have a substituent group, L a ~ L e, L 1, L a R e and R f in the formula I as defined in ~ L e, L 1, R e , and R f Synonymous.
- 根据权利要求20所述镜头，其中所述化合物为下述式Ⅲ所示的化合物：The lens according to claim 20, wherein said compound is a compound represented by the following formula III:其中，X独立地表示氧原子、硫原子、硒原子或-NH-，R 1～R 7分别独立地表示氢原子、卤素原子、磺基、羟基、氰基、硝基、羧基、磷酸基、-L 1或-NR gR h基。R g及R h分别独立地表示氢原子、-L a、-L b、-L c、-L d或-L e或-C(O)R i基(R i表示-L a、-L b、-L c、-L d或-L e)， Wherein X independently represents an oxygen atom, a sulfur atom, a selenium atom or -NH-, and R 1 to R 7 each independently represent a hydrogen atom, a halogen atom, a sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a phosphate group, -L 1 or -NR g R h group. R g and R h each independently represent a hydrogen atom, -L a , -L b , -L c , -L d or -L e or -C(O)R i group (R i represents -L a , -L b , -L c , -L d or -L e ),L 1为L a、L b、L c、L d、L e、L f、L g或L h， L 1 is L a , L b , L c , L d , L e , L f , L g or L h ,L a～L h与所述式Ⅰ中所定义的L a～L h同义， L a to L h are synonymous with L a to L h as defined in the formula I,作为所述R 1，优选为氢原子、氯原子、氟原子、甲基、乙基、正丙基、异丙基、正丁基、仲丁基、叔丁基、环己基、苯基、羟基、氨基、二甲基氨基、硝基，更优选为氢原子、氯原子、氟原子、甲基、乙基、正丙基、异丙基、羟基， As the R 1 , a hydrogen atom, a chlorine atom, a fluorine atom, a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a n-butyl group, a sec-butyl group, a t-butyl group, a cyclohexyl group, a phenyl group, a hydroxyl group are preferable. , an amino group, a dimethylamino group, a nitro group, more preferably a hydrogen atom, a chlorine atom, a fluorine atom, a methyl group, an ethyl group, a n-propyl group, an isopropyl group or a hydroxyl group.作为所述R 2～R 7,优选为氢原子、氯原子、氟原子、甲基、乙基、正丙基、异丙基、正丁基、仲丁基、叔丁基、环己基、苯基、羟基、氨基、二甲基氨基、氰基、硝基、乙酰基氨基、丙酰基氨基、N-甲基乙酷基氨基、三氟甲酰基氨基、五氟乙酰基氨基、叔丁酰基氨基、环己酰基氨基，更优选为氢原子、氯原子、氟原子、甲基、乙基、正丙基、异丙基、羟基、二甲基氨基、硝基、乙酰基氨基、丙酰基氨基、三氟甲酰基氨基、五氟乙酰基氨基、叔丁酰基氨基、环己酰基氨基， As the R 2 to R 7 , a hydrogen atom, a chlorine atom, a fluorine atom, a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a n-butyl group, a sec-butyl group, a t-butyl group, a cyclohexyl group, and a benzene are preferable. Base, hydroxy, amino, dimethylamino, cyano, nitro, acetylamino, propionylamino, N-methylethylamino, trifluorocarbonylamino, pentafluoroacetylamino, tert-butyrylamino a cyclohexanoylamino group, more preferably a hydrogen atom, a chlorine atom, a fluorine atom, a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a hydroxyl group, a dimethylamino group, a nitro group, an acetylamino group, a propionylamino group, Trifluoroformylamino, pentafluoroacetylamino, tert-butyrylamino, cyclohexanoylamino,作为所述X，优选为氧原子、硫原子，特别优选为氧原子。The X is preferably an oxygen atom or a sulfur atom, and particularly preferably an oxygen atom.
- 根据权利要求20所述镜头，其中所述化合物为下述式Ⅳ所示的化合物：The lens according to claim 20, wherein said compound is a compound represented by the following formula IV:其中式Ⅳ中，Μ表示2个氢原子、2个1价金属原子、2价金属原子、或包含3价或4价金属原子的取代金属原子，存在多个的R a、R b、R c及R d分别独立地表示选自由氢原子、卤素原子、羟基、羧基、硝基、氨基、酰胺基、酰亚胺基、氰基、硅烷基、-L 1、-S-L 2、-SS-L 2、-S0 2-L 3、-N＝N-L 4、或与Ra与R b、R b与R c、及R c与R d中至少一个组合键结。其中，键结于同一芳香环的R a、R b、R c及R d中至少一个不为氢原子， In the formula IV, Μ represents two hydrogen atoms, two monovalent metal atoms, a divalent metal atom, or a substituted metal atom containing a trivalent or tetravalent metal atom, and a plurality of R a , R b , R c And R d are independently represented by a hydrogen atom, a halogen atom, a hydroxyl group, a carboxyl group, a nitro group, an amino group, an amide group, an imide group, a cyano group, a silane group, -L 1 , -SL 2 , -SS-L. 2 , -S0 2 -L 3 , -N=NL 4 , or in combination with at least one of Ra and R b , R b and R c , and R c and R d . Wherein at least one of R a , R b , R c and R d bonded to the same aromatic ring is not a hydrogen atom,所述氨基、酰胺基、酰亚胺基及硅烷基可具有所述式Ⅰ中所定义的取代基L，The amino group, the amide group, the imide group, and the silane group may have the substituent L defined in the formula I,L 1与所述式Ⅰ中所定义的L 1同义， L 1 in the formula as defined Ⅰ L 1 of synonymous,L 2表示氢原子或所述式Ⅰ中所定义的L a～L e的任一个， L 2 represents a hydrogen atom or any of L a to L e defined in the formula I,L 3表示羟基或所述L a～L e的任一个， L 3 represents a hydroxyl group or any of the above L a to L e ,L 4表示所述L a～L e的任一个。 L 4 represents any of the above L a to L e .
- 根据权利要求19所述镜头，其中所述红外吸收层在涂布前为液体材料。The lens according to claim 19, wherein said infrared absorbing layer is a liquid material before coating.
- 根据权利要求19所述镜头，其中所述涂布方式系选自浸泡、离心力旋涂、喷涂的物理沉积技术或化学沉积。The lens according to claim 19, wherein said coating means is selected from the group consisting of soaking, centrifugal spin coating, physical deposition techniques of spraying, or chemical deposition.
- 根据权利要求18或19所述镜头，其中所述镜头是一体式或多段式组装而成。The lens according to claim 18 or 19, wherein said lens is assembled in one piece or in multiple stages.
- 一摄像模组，其特征在于，包括：至少一线路板组件，至少一镜头，和至少一感光芯片，其中所述感光芯片电连接于所述线路板组件，所述镜头位于所述感光芯片的感光路径，其中所述感光芯片包括至少一芯片本体和至少一吸收式滤光层，其中所述吸收式滤光层位于所述芯片本体的感光面，从而供所述摄像模组 进行滤光。A camera module, comprising: at least one circuit board assembly, at least one lens, and at least one photosensitive chip, wherein the photosensitive chip is electrically connected to the circuit board assembly, and the lens is located at the photosensitive chip a photosensitive path, wherein the photosensitive chip comprises at least one chip body and at least one absorption filter layer, wherein the absorption filter layer is located on a photosensitive surface of the chip body for filtering by the camera module.
- 据权利要求27所述摄像模组，其中所述吸收式滤光层为具有吸收性质的化合物，且存在近红外光谱吸收的特性，其中所述近红外光谱为565nm～1200nm波段。The camera module according to claim 27, wherein said absorption filter layer is a compound having an absorption property and has a characteristic of absorption in a near-infrared spectrum, wherein said near-infrared spectrum is in a wavelength band of 565 nm to 1200 nm.
- 根据权利要求28所述摄像模组，其中所述吸收式滤光层系选自由酞菁系化合物、方酸内鎓系化合物、萘酞菁系化合物、六元卟啉系化合物、克酮鎓系化合物以及花青系化合物所组成的群组中的至少一种。The image pickup module according to claim 28, wherein said absorption filter layer is selected from the group consisting of a phthalocyanine compound, a squaraine lanthanide compound, a naphthalocyanine compound, a hexavalent porphyrin compound, and a ketone oxime system. At least one of a group consisting of a compound and a cyanine compound.
- 根据权利要求28所述摄像模组，其中所述化合物为下述式Ⅰ或式Ⅱ所示的化合物：The camera module according to claim 28, wherein said compound is a compound represented by the following formula I or formula II:其中，式Ⅰ中Ra、Rb及Y满足下述(a)或(b)的条件，Wherein, in the formula I, Ra, Rb and Y satisfy the conditions of the following (a) or (b),条件(a)：Condition (a):存在多个的Ra分别独立表示氢原子、卤素原子、磺基、羟基、氰基、硝基、羧基、怜酸基、-L1或-NReRf基，Re及Rf分别独立地表示氢原子、-La、-Lb、-Lc、-Ld或-Le，There are a plurality of Ra independently representing a hydrogen atom, a halogen atom, a sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a pity acid group, a -L1 or a -NReRf group, and Re and Rf each independently represent a hydrogen atom, -La , -Lb, -Lc, -Ld or -Le,存在多个的Rb分别独立表示氢原子、卤素原子磺基、羟基、氰基、硝基、羧基、怜酸基、-L1或-NRgRh基，Rg及Rh分别独立地表示氢原子、-La、-Lb、-Lc、-Ld或-Le或-C(O)Ri基(Ri表示-La、-Lb、-Lc、-Ld或-Le)，A plurality of Rbs independently represent a hydrogen atom, a halogen atom sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a pity acid group, a -L1 or a -NRgRh group, and Rg and Rh each independently represent a hydrogen atom, -La, -Lb, -Lc, -Ld or -Le or -C(O)Ri group (Ri represents -La, -Lb, -Lc, -Ld or -Le),存在多个的Y分别独立表示-NRjRk基。Rj及Rk分别独立地表示氢原子、-La、 -Lb、-Lc、-Ld或-Le，There are a plurality of Ys respectively representing the -NRjRk basis. Rj and Rk each independently represent a hydrogen atom, -La, -Lb, -Lc, -Ld or -Le,L1为La、Lb、Lc、Ld、Le、Lf、Lg或Lh，L1 is La, Lb, Lc, Ld, Le, Lf, Lg or Lh,所述La～Lh表示以下的基团：The La to Lh represent the following groups:La可具有取代基L的碳数为1～12的脂肪族烃基La may have an aliphatic hydrocarbon group having a substituent L of 1 to 12 carbon atomsLb可具有取代基L的碳数为1～12的卤素取代烷基Lb may have a substituent L of a halogen-substituted alkyl group having 1 to 12 carbon atomsLc可具有取代基L的碳数为3～14的脂环式烃基Lc may have a substituent L of an alicyclic hydrocarbon group having 3 to 14 carbon atomsLd可具有取代基L的碳数为6～14的芳香族烃基Ld may have an aromatic hydrocarbon group having a substituent L of 6 to 14 carbon atomsLe可具有取代基L的碳数为3～14的杂环基Le may have a substituent L of a heterocyclic group having 3 to 14 carbon atomsLf可具有取代基L的碳数为1～9的烷氧基Lf may have alkoxy group having a substituent of L of 1 to 9 carbon atomsLg可具有取代基L的碳数为1～9的酰基Lg may have a substituent L having an acyl group having 1 to 9 carbon atomsLh可具有取代基L的碳数为1～9的烷氧基羰基Lh may have alkoxycarbonyl group having a substituent of L of 1 to 9 carbon atoms其中，取代基l为选自由碳数为1～12的脂肪族烃基、碳数为1～12的卤素取代烷基、碳数为3～14的脂环式烃基、碳数为6～14的芳香族烃基、碳数为3～14的杂环基、卤素原子、磺基、羟基、氰基、硝基、羧基、怜酸基及氨基所组成的群组的至少一种，The substituent 1 is selected from the group consisting of an aliphatic hydrocarbon group having 1 to 12 carbon atoms, a halogen-substituted alkyl group having 1 to 12 carbon atoms, an alicyclic hydrocarbon group having 3 to 14 carbon atoms, and a carbon number of 6 to 14. At least one of a group consisting of an aromatic hydrocarbon group, a heterocyclic group having 3 to 14 carbon atoms, a halogen atom, a sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a pity acid group, and an amino group,条件(b)：Condition (b):1个苯环上的2个Ra中的至少一个与同一苯环上的Y相互键结，形成包含至少一个氮原子的构成原子数为5或6的杂环，所述杂环可具有取代基，Rb及未参与所述杂环的形成的Ra分别独立地与所述条件(a)的Rb及RRa同义，At least one of the two Ras on one benzene ring is bonded to Y on the same benzene ring to form a heterocyclic ring having at least one nitrogen atom and having a molecular number of 5 or 6, and the heterocyclic ring may have a substituent. , Rb and Ra not participating in the formation of the heterocyclic ring are independently synonymous with Rb and RRa of the condition (a), respectively.其中，式Ⅱ中，X独立地表示0、S、Se、N-Rc或C(RdRd)，存在多个的Rc分别独立地表示氢原子、La、Lb、Lc、Ld或Le，存在多个的Rd分别独立地表示氢原子、卤素原子磺基、羟基、氰基、硝基、羧基、磷酸基、-L1或-NReRf基，相邻的Rd彼此可连结而形成可具有取代基的环，La～Le、L1、Re及Rf与所述式I中所定义的La～Le、L1、Re及Rf同义。Wherein, in Formula II, X independently represents 0, S, Se, N-Rc or C(RdRd), and a plurality of Rc independently represent a hydrogen atom, La, Lb, Lc, Ld or Le, and a plurality of Rd independently represents a hydrogen atom, a halogen atom sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a phosphoric acid group, a -L1 or a -NReRf group, and adjacent Rds may be bonded to each other to form a ring which may have a substituent. La to Le, L1, Re and Rf are synonymous with La to Le, L1, Re and Rf as defined in the above formula I.
- 根据权利要求27所述摄像模组，其中所述吸收式滤光层在涂布前为液体材料。The camera module of claim 27, wherein said absorbing filter layer is a liquid material prior to coating.
- 根据权利要27所述摄像模组，其中所述吸收式滤光层系由浸泡、离心力旋涂、喷涂的物理沉积技术或化学沉积技术形成于所述芯片本体的所述感光面。The camera module according to claim 27, wherein said absorption filter layer is formed on said photosensitive surface of said chip body by a physical deposition technique of immersion, centrifugal force spin coating, spray coating or chemical deposition technique.
- 根据权利要求27-32中任一的所述摄像模组，其中所述线路板组件包括一支架和一线路板，所述支架贴装或一体地封装于所述线路板，所述感光芯片电连接于所述线路板，其中所述支架具有一通孔，为所述感光芯片提供感光路径。The camera module according to any one of claims 27 to 32, wherein said circuit board assembly comprises a bracket and a circuit board, said bracket being mounted or integrally packaged on said circuit board, said photosensitive chip being electrically Connected to the circuit board, wherein the bracket has a through hole to provide a photosensitive path for the photosensitive chip.
- 根据权利要求27-32中任一的所述摄像模组，其中所述线路板组件包括一模制支架和一线路板，所述模制支架一体地封装连接于所述线路板和所述感光芯片。The camera module according to any one of claims 27 to 32, wherein said circuit board assembly comprises a molded bracket and a wiring board, and said molded bracket is integrally packaged and connected to said wiring board and said photosensitive chip.
- 根据权利要求33所述摄像模组，其中所述摄像模组包括至少一驱动器，所述镜头被安装于所述驱动器，所述驱动器被安装于所述支架。The camera module according to claim 33, wherein said camera module comprises at least one driver, said lens being mounted to said driver, said driver being mounted to said bracket.
- 根据权利要求27所述摄像模组，其中所述摄像模组包括一镜头支架，其被安装于所述线路板组件，其中所述镜头被安装于所述镜头支架，以使得所述镜头被支撑于所述线路板组件上方。The camera module according to claim 27, wherein said camera module comprises a lens holder mounted to said circuit board assembly, wherein said lens is mounted to said lens holder such that said lens is supported Above the circuit board assembly.
- 一摄像模组，其特征在于，包括：至少一线路板组件，至少一镜头，至少一感光芯片，以及至少一滤光片，其中所述感光芯片电连接于所述线路板组件上，所述镜头位于所述感光芯片的感光路径，所述滤光片设置于所述镜头的光行经路径或所述感光芯片的感光路径，其中所述滤光片包括一滤光片本体和至少一吸收式滤光层，其中所述吸收式滤光层位于所述滤光片本体的至少一表面，从而通过所述滤光片设置于所述摄像模组以进行滤光。A camera module, comprising: at least one circuit board assembly, at least one lens, at least one photosensitive chip, and at least one filter, wherein the photosensitive chip is electrically connected to the circuit board assembly, The lens is located in a photosensitive path of the photosensitive chip, the filter is disposed on a light path of the lens or a photosensitive path of the photosensitive chip, wherein the filter comprises a filter body and at least one absorption type a filter layer, wherein the absorption filter layer is located on at least one surface of the filter body, and is disposed on the camera module through the filter for filtering.
- 根据权利要求37所述摄像模组，其中所述线路板组件包括一支架和一线路板，所述支架贴装或一体地封装于所述线路板，所述感光芯片电连接于所述线路板，其中所述支架具有一通孔，为所述感光芯片提供感光路径。The camera module according to claim 37, wherein said circuit board assembly comprises a bracket and a circuit board, said bracket being mounted or integrally packaged on said circuit board, said photosensitive chip being electrically connected to said circuit board The bracket has a through hole to provide a photosensitive path for the photosensitive chip.
- 根据权利要求37所述摄像模组，其中所述线路板组件包括一模制支架和一线路板，所述模制支架一体地封装连接于所述线路板和所述感光芯片。A camera module according to claim 37, wherein said circuit board assembly comprises a molded bracket and a wiring board, and said molded bracket is integrally packaged and coupled to said wiring board and said photosensitive chip.
- 根据权利要求37所述摄像模组，其中所述线路板组件包括一模制支架和一 线路板，所述模制支架一体地封装连接于所述线路板、所述感光芯片以及所述滤光片，其中所述感光芯片被设置于所述线路板主体的上表面，所述滤光片被设置于所述感光芯片的上表面。The camera module according to claim 37, wherein said circuit board assembly comprises a molded bracket and a circuit board, and said molded bracket is integrally packaged and connected to said circuit board, said photosensitive chip, and said filter a sheet, wherein the photosensitive chip is disposed on an upper surface of the wiring board main body, and the filter is disposed on an upper surface of the photosensitive chip.
- 根据权利要求38-39中任一的所述摄像模组，其中所述滤光片被安装于所述支架。The camera module according to any one of claims 38 to 39, wherein said filter is mounted to said holder.
- 根据权利要求38-39中任一的所述摄像模组，其中所述支架具有一顶表面，其平面地延伸，所述滤光片被安装于所述顶表面。The camera module according to any one of claims 38 to 39, wherein said holder has a top surface extending in a plane, and said filter is mounted on said top surface.
- 根据权利要求38-39中任一的所述摄像模组，其中所述支架具有一安装槽，所述滤光片被安装于所述安装槽。The camera module according to any one of claims 38 to 39, wherein said holder has a mounting groove, and said filter is mounted to said mounting groove.
- 根据权利要求42所述摄像模组，其中所述摄像模组包括至少一支座，所述支架是一模制支架，所述支座设置于所述模制支架的所述顶表面，所述滤光片被安装于所述支座。The camera module of claim 42, wherein the camera module comprises at least one seat, the bracket is a molded bracket, and the bracket is disposed on the top surface of the molded bracket, A filter is mounted to the holder.
- 根据权利要求43所述摄像模组，其中所述摄像模组包括至少一支座，所述支架是一模制支架，所述支座设置于所述模制支架的所述顶表面，所述滤光片被安装于所述支座。The camera module of claim 43, wherein the camera module comprises at least one seat, the bracket is a molded bracket, and the bracket is disposed on the top surface of the molded bracket, A filter is mounted to the holder.
- 根据权利要求44-45所述摄像模组，其中所述支座在顶部的内侧具有一第一支座槽和在底部的外侧具有一第二支座槽，所述第一支座槽用于安装所述滤光片，所述第二支座槽使所述支座卡合于所述模制支架，以使所述滤光片与所述感光芯片的距离减小。The camera module according to claim 44-45, wherein the holder has a first seat groove on the inner side of the top portion and a second seat groove on the outer side of the bottom portion, the first seat groove is used for The filter is mounted, and the second seating groove engages the holder to the molded bracket to reduce a distance between the filter and the photosensitive chip.
- 根据权利要求37所述摄像模组，其中所述镜头包括至少一镜筒和至少一镜片，各所述镜片被安装于所述镜筒内，其中所述滤光片被安装于所述镜头的所述镜筒内。A camera module according to claim 37, wherein said lens comprises at least one lens barrel and at least one lens, each of said lenses being mounted in said lens barrel, wherein said filter is mounted to said lens Inside the lens barrel.
- 根据权利要求47所述摄像模组，其中所述镜筒包括一底部，其用于安装所述滤光片，所述滤光片设置于所述感光芯片的感光路径。The camera module according to claim 47, wherein said lens barrel comprises a bottom for mounting said filter, said filter being disposed in a photosensitive path of said photosensitive chip.
- 根据权利要求47所述摄像模组，其中所述镜筒包括一顶部，其用于安装所述滤光片，从而使所述滤光片放置在所述摄像模组的所述镜头前方，以做入射滤光作用。A camera module according to claim 47, wherein said lens barrel includes a top portion for mounting said filter, such that said filter is placed in front of said lens of said camera module, Do the incident filter.
- 根据权利要求39所述摄像模组，其中所述摄像模组包括至少一驱动器，所述镜头被安装于所述驱动器，所述驱动器被安装于所述模塑部。The camera module according to claim 39, wherein said camera module comprises at least one driver, said lens being mounted to said driver, said driver being mounted to said molding portion.
- 根据权利要求50所述摄像模组，其中所述驱动器具有一下端部，其中所述滤光片被安装于所述驱动器的所述下端部，并位于所述镜头的下方。A camera module according to claim 50, wherein said driver has a lower end portion, wherein said filter is mounted to said lower end portion of said driver and located below said lens.
- 根据权利要求50所述摄像模组，其中所述驱动器具有一上端部，其中所述滤光片被安装于所述驱动器的所述上端部，并位于所述镜头的上方。A camera module according to claim 50, wherein said driver has an upper end portion, and said filter is mounted to said upper end portion of said driver and above said lens.
- 根据权利要求38所述摄像模组，其中所述线路板部包括具有至少一外凹槽和至少一通路的一线路板主体，其中所述外凹槽连通于对应的所述通路，所述感光芯片的感光区朝上地安装于所述外凹槽。The camera module of claim 38, wherein said circuit board portion comprises a circuit board body having at least one outer recess and at least one passage, wherein said outer recess communicates with said corresponding passage, said photosensitive The photosensitive region of the chip is mounted upwardly on the outer groove.
- 根据权利要求38所述摄像模组，其中所述滤光片相对于所述通路覆盖于所述线路板主体。A camera module according to claim 38, wherein said filter covers said circuit board body with respect to said path.
- 根据权利要求41所述摄像模组，其中所述滤光片本体的材料系选自由树脂、塑料或玻璃材料所组成的群组。The camera module of claim 41, wherein the material of the filter body is selected from the group consisting of a resin, a plastic or a glass material.
- 根据权利要求37所述摄像模组，其中所述吸收式滤光层为具有吸收性质的化合物，且存在近红外光谱吸收的特性，其中所述近红外光谱为565nm～1200nm波段。The camera module according to claim 37, wherein said absorption filter layer is a compound having an absorption property and has a characteristic of absorption in a near-infrared spectrum, wherein said near-infrared spectrum is in a wavelength band of 565 nm to 1200 nm.
- 根据权利要求56所述摄像模组，其中所述吸收式滤光层系选自由酞菁系化合物、方酸内鎓系化合物、萘酞菁系化合物、六元卟啉系化合物、克酮鎓系化合物以及花青系化合物所组成的群组中的至少一种。The image pickup module according to claim 56, wherein said absorption filter layer is selected from the group consisting of a phthalocyanine compound, a squaraine lanthanide compound, a naphthalocyanine compound, a hexavalent porphyrin compound, and a ketone oxime system. At least one of a group consisting of a compound and a cyanine compound.
- 根据权利要求37所述摄像模组，其中所述吸收式滤光层在涂布前为液体材料。A camera module according to claim 37, wherein said absorption filter layer is a liquid material prior to coating.
- 根据权利要37所述摄像模组，其中所述吸收式滤光层系由浸泡、离心力旋涂、喷涂的物理沉积技术或化学沉积技术形成于所述滤光片本体的表面。The camera module according to claim 37, wherein said absorption filter layer is formed on a surface of said filter body by a physical deposition technique of immersion, centrifugal force spin coating, spray coating or chemical deposition technique.
- 根据权利要求37所述摄像模组，其中所述滤光片还包括至少一镀膜层，其分别位于所述滤光片本体的另一表面或/和所述吸收式滤光层的表面。A camera module according to claim 37, wherein said filter further comprises at least one coating layer respectively located on the other surface of said filter body or/and the surface of said absorbing filter layer.
Applications Claiming Priority (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720359008.6 | 2017-04-07 | ||
| CN201720365416.2U CN207820030U (en) | 2017-04-07 | 2017-04-07 | Camera module based on infrared absorption structure |
| CN201710224070.9 | 2017-04-07 | ||
| CN201710223892.5A CN108693683A (en) | 2017-04-07 | 2017-04-07 | Camera module based on infrared absorption lens construction and its application |
| CN201710224070.9A CN108696672A (en) | 2017-04-07 | 2017-04-07 | Camera module based on infrared absorption structure and its application |
| CN201710223892.5 | 2017-04-07 | ||
| CN201720365416.2 | 2017-04-07 | ||
| CN201720359008.6U CN208141102U (en) | 2017-04-07 | 2017-04-07 | Camera module and its camera lens based on infrared absorption lens construction |
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| Publication Number | Publication Date |
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| WO2018184597A1 true WO2018184597A1 (en) | 2018-10-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| PCT/CN2018/082208 WO2018184597A1 (en) | 2017-04-07 | 2018-04-08 | Camera module based on infrared absorption structure, and application thereof |
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