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WO2018184597A1 - Module d'appareil photo faisant appel à une structure d'absorption infrarouge et son application - Google Patents

Module d'appareil photo faisant appel à une structure d'absorption infrarouge et son application Download PDF

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Publication number
WO2018184597A1
WO2018184597A1 PCT/CN2018/082208 CN2018082208W WO2018184597A1 WO 2018184597 A1 WO2018184597 A1 WO 2018184597A1 CN 2018082208 W CN2018082208 W CN 2018082208W WO 2018184597 A1 WO2018184597 A1 WO 2018184597A1
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WO
WIPO (PCT)
Prior art keywords
group
lens
camera module
filter
atom
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2018/082208
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English (en)
Chinese (zh)
Inventor
郭楠
刘春梅
王明珠
俞丝丝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ningbo Sunny Opotech Co Ltd
Original Assignee
Ningbo Sunny Opotech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201710224070.9A external-priority patent/CN108696672A/zh
Priority claimed from CN201710223892.5A external-priority patent/CN108693683A/zh
Priority claimed from CN201720359008.6U external-priority patent/CN208141102U/zh
Priority claimed from CN201720365416.2U external-priority patent/CN207820030U/zh
Application filed by Ningbo Sunny Opotech Co Ltd filed Critical Ningbo Sunny Opotech Co Ltd
Publication of WO2018184597A1 publication Critical patent/WO2018184597A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/22—Absorbing filters
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/02—Bodies
    • G03B17/12—Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets

Definitions

  • the invention relates to the field of a camera module, in particular to an infrared absorption structure and an imaging module based on an infrared absorption structure and an application thereof, wherein a material having a near infrared absorption characteristic is disposed on a lens, a filter or a photosensitive chip, The camera module is brought to an image color reproduction effect.
  • CCD and CMOS are widely used in digital photography, but because CCD and CMOS can sense the characteristics of infrared rays, the image obtained when the infrared cut filter is not used will be greenish, which is very inconsistent with the human eye. Therefore, most of the camera modules pass through the infrared cut filter to achieve image color reproduction, so that the obtained image is consistent with the color observed by the human eye.
  • FIG. 1 it is a schematic diagram of a conventional camera module.
  • the camera module includes a circuit board assembly 1P, a light sensing chip 2P, a bracket 3P, an infrared cut filter 4P, a motor 5P and a lens 6P.
  • the photosensitive chip 2P is mounted to the circuit board assembly 1P
  • the infrared cut filter 4P is mounted to the bracket 3P
  • the lens 6P is mounted to the motor 5P
  • the motor 5P is mounted to the bracket 3P to facilitate the
  • the lens 6P is located above the photosensitive chip 2P.
  • the sensor chip 2P of the camera module mostly uses a charge coupled device (CCD) and a complementary metal oxide semiconductor (CMOS, Complementary Metal Oxide Semiconductor) sensor.
  • CCD charge coupled device
  • CMOS complementary metal oxide semiconductor
  • the infrared cut filter of the conventional camera module is coated on ordinary glass to achieve the infrared cutoff effect, with the camera.
  • the development of the module further replaces the traditional infrared cut filter by coating the blue glass. Since the blue glass substrate itself has near-infrared light absorption characteristics, the absorption effect on the red light is close to the human eye's perception of red light through the reception of the chip.
  • the requirements for the thickness of blue glass are getting thinner and thinner, but because of the difficulty in processing and high cost, the size cannot be reduced to less than 0.14 mm, and there is fragile characteristics. There are limitations in everything.
  • the infrared cut filter or the blue glass of the conventional camera module limits the development of the camera module to a certain extent to a certain extent. Therefore, the present invention is applied to a camera module through a novel infrared absorbing structure to solve the problem that the blue glass is fragile and cannot be thinned, thereby breaking the limitation of the camera module in the development of thin and light.
  • An object of the present invention is to provide a camera module based on an infrared absorption lens structure, wherein a material having a near-infrared absorption characteristic is applied to a lens, and the lens is changed into an infrared absorption lens structure, thereby removing the conventional filter. Or make the filter thinner.
  • Another object of the present invention is to provide a camera module based on an infrared absorption lens structure, wherein the lens of the lens is made of an organic material having near-infrared spectroscopy absorption characteristics, and the lens is changed into an infrared absorption lens structure. Thereby removing the conventional filter or making the filter thinner.
  • Another object of the present invention is to provide a camera module based on an infrared absorption lens structure, which adopts the infrared absorption lens of the invention, and the imaging module has better imaging effect than the camera module with the traditional infrared filter, and has blue glass.
  • the imaging module of the filter has the same imaging effect, so that it can meet the high-pixel image requirements of the camera module of the current electronic device, and at the same time save the production cost and structural thickness of the camera module of the electronic device.
  • Another object of the present invention is to provide a camera module based on an infrared absorption lens structure, in which the structure and assembly manner of the camera module are not changed. Therefore, the present invention further achieves the filtering effect and the structure of the thin and light camera module without changing the lens structure.
  • Another object of the present invention is to provide a camera module based on an infrared absorption lens structure, wherein the blue glass filter can be eliminated when applied to a high pixel camera module. Therefore, the absorption lens structure is equivalent to moving the optical system of the near-infrared absorbing structure forward, and the thickness of the filter can be reduced to ⁇ 1 mm.
  • An object of the present invention is to provide an imaging module based on an infrared absorption structure, wherein an organic material or compound having near-infrared absorption characteristics is applied to a filter or a photosensitive chip, so that the camera module achieves image color reproduction.
  • the effect is to meet the requirements of the ultra-thinning trend of the camera module to a certain extent, especially for the camera module of the mobile phone.
  • Another object of the present invention is to provide an imaging module based on an infrared absorption structure, wherein an organic material or compound having near-infrared absorption characteristics makes an imaging effect superior to that of a conventional infrared filter, and is equivalent to blue glass imaging. Therefore, it can meet the high-pixel image requirements of the camera module of the current mobile phone, and at the same time save the production cost of the camera module of the mobile phone, effectively occupying the market advantage.
  • Another object of the present invention is to provide a camera module based on an infrared absorbing structure, wherein an organic material having a near-infrared spectroscopy absorption property is suitable for a day/night camera module, and the imaging effect during daytime is comparable to that of blue glass. It is superior to the traditional day and night camera module imaging effect.
  • the present invention is based on an infrared absorption lens structure camera module, comprising: at least one circuit board, at least one lens, at least one photosensitive chip, wherein the photosensitive chip is electrically connected to the circuit board,
  • the lens is located in a photosensitive path of the photosensitive chip, wherein the lens comprises at least one lens and at least one lens barrel, wherein one or more of the at least one lens is an infrared absorption lens and is disposed on the lens barrel,
  • the lens is formed into an infrared absorption lens to achieve near-infrared absorption.
  • the present invention also provides a lens, wherein the lens comprises at least one lens, wherein one or more of the at least one lens is an infrared absorbing lens to form the lens into an infrared absorbing lens to achieve near infrared spectroscopy Absorption effect.
  • the present invention further provides a camera module, including:
  • At least one circuit board assembly, at least one lens, and at least one photosensitive chip wherein the photosensitive chip is electrically connected to the circuit board assembly, the lens is located in a photosensitive path of the photosensitive chip, wherein the photosensitive chip includes at least one a chip body and at least one absorption filter layer, wherein the absorption filter layer is located on a photosensitive surface of the chip body, thereby providing the camera module to filter.
  • the present invention further provides a camera module comprising: at least one circuit board assembly, at least one lens, at least one photosensitive chip, and at least one filter, wherein the photosensitive chip is electrically connected to the On the circuit board assembly, the lens is located in a photosensitive path of the photosensitive chip, and the filter is disposed on a light path of the lens or a photosensitive path of the photosensitive chip, wherein the filter includes a filter a sheet body and at least one absorbing filter layer, wherein the absorbing filter layer is located on at least one surface of the filter body, and is disposed on the camera module through the filter for filtering.
  • Another aspect of the present invention provides a method for manufacturing an infrared absorption structure of a camera module, which includes the following steps:
  • Another aspect of the present invention provides a method for manufacturing an infrared absorption structure of another camera module, which includes the following steps:
  • FIG. 1 is a cross-sectional view of a conventional camera module.
  • FIG. 2A is a cross-sectional view showing the structure of a camera module based on an infrared absorption lens structure according to a first preferred embodiment of the present invention, in which a zoom camera module is illustrated.
  • FIG. 2B is a cross-sectional view showing the structure of a camera module based on an infrared absorption lens structure according to a first preferred embodiment of the present invention, in which a fixed focus camera module is illustrated.
  • FIG 3 is a cross-sectional view showing the structure of a camera module based on an infrared absorption lens structure according to a first preferred embodiment of the present invention.
  • FIG. 4 is a schematic view of a single lens of a camera module based on an infrared absorption lens structure in accordance with a first preferred embodiment of the present invention, wherein an infrared absorbing layer is applied to an outer surface of the lens.
  • Figure 5 is a schematic illustration of a wafer level processing lens in accordance with a first preferred embodiment of the present invention, wherein the infrared absorbing layer is illustrated as a liquid material and is spin coated onto the lens by centrifugal force.
  • Figure 6 is a cross-sectional view showing the structure of a camera module according to a first modified embodiment of the first preferred embodiment of the present invention.
  • Figure 7 is a cross-sectional view showing the structure of a camera module according to a first modified embodiment of the first preferred embodiment of the present invention.
  • Figure 8 is a cross-sectional view showing the structure of a camera module according to a first modified embodiment of the first preferred embodiment of the present invention.
  • Figure 9 is a cross-sectional view showing the structure of a camera module according to a second modified embodiment of the first preferred embodiment of the present invention.
  • Figure 10 is a cross-sectional view showing the structure of a camera module according to a second modified embodiment of the first preferred embodiment of the present invention.
  • Figure 11 is a cross-sectional view showing the structure of a camera module according to a third modified embodiment of the first preferred embodiment of the present invention.
  • Figure 12 is a cross-sectional view showing the structure of a camera module according to a third modified embodiment of the first preferred embodiment of the present invention.
  • Figure 13 is a cross-sectional view showing the structure of a camera module according to a third modified embodiment of the first preferred embodiment of the present invention.
  • Figure 14 is a cross-sectional view showing the structure of a camera module according to a third modified embodiment of the first preferred embodiment of the present invention.
  • Figure 15 is a cross-sectional view showing the structure of a camera module according to a third modified embodiment of the first preferred embodiment of the present invention.
  • Figure 16 is a cross-sectional view showing the structure of a camera module according to a fourth modified embodiment of the first preferred embodiment of the present invention.
  • Figure 17 is a cross-sectional view showing the structure of a camera module based on an infrared absorption lens structure in accordance with a second preferred embodiment of the present invention.
  • Figure 18 is a cross-sectional view showing the structure of a camera module based on an infrared absorption lens structure in accordance with a second preferred embodiment of the present invention.
  • Figure 19 is a cross-sectional view showing the structure of a camera module in accordance with a second preferred embodiment of the present invention.
  • a split lens is illustrated that has multiple barrels.
  • Figure 20 is a cross-sectional view showing the structure of a camera module according to a first modified embodiment of the second preferred embodiment of the present invention.
  • Figure 21 is a cross-sectional view showing the structure of a camera module based on an infrared absorption lens structure in accordance with a third preferred embodiment of the present invention.
  • Figure 22 is a cross-sectional view showing the structure of a camera module based on an infrared absorption lens structure in accordance with a third preferred embodiment of the present invention.
  • Figure 23 is a cross-sectional view showing the structure of a camera module in accordance with a third preferred embodiment of the present invention.
  • Figure 24 is a cross-sectional view showing the structure of a camera module according to a first modified embodiment of the third preferred embodiment of the present invention.
  • Figure 25 is a cross-sectional view showing the structure of a camera module according to a second modified embodiment of the third preferred embodiment of the present invention.
  • Figure 26 is a cross-sectional view showing the structure of a filter module including an infrared absorbing structure according to a fourth preferred embodiment of the present invention, in which a zoom camera module is illustrated.
  • Figure 27 is a cross-sectional view showing the structure of a filter module including an infrared absorbing structure according to a fourth preferred embodiment of the present invention, in which a fixed focus camera module is illustrated.
  • Figure 28 is a schematic illustration of an absorbing filter coating process on a filter in accordance with a fourth preferred embodiment of the present invention.
  • Figure 29 is a schematic view showing the coating of the absorption filter layer after the filter in accordance with the fourth preferred embodiment of the present invention.
  • Figure 30 is a schematic illustration of a wafer level processing filter in accordance with a fourth preferred embodiment of the present invention, wherein the absorptive filter layer is a liquid material and is spin coated onto the filter body by centrifugal force.
  • Figure 31 is a cross-sectional view showing the structure of a first modified embodiment of a camera module in accordance with a fourth preferred embodiment of the present invention. It is indicated that the circuit board assembly, the filter and the photosensitive chip are simultaneously molded.
  • Figure 32 is a cross-sectional view showing the structure of a first modified embodiment of a camera module in accordance with a fourth preferred embodiment of the present invention. It is indicated that the circuit board assembly and the photosensitive chip are simultaneously molded.
  • Figure 33 is a cross-sectional view showing the structure of a second modified embodiment of the camera module in accordance with a fourth preferred embodiment of the present invention.
  • the filter is placed in the mounting groove of the molded bracket.
  • Figure 34 is a cross-sectional view showing the structure of a third modified embodiment of the camera module in accordance with a fourth preferred embodiment of the present invention. It is stated that the top surface of the molding is an integral planar extension, and the support is located on the top surface to support the filter.
  • Figure 35 is a cross-sectional view showing the structure of a fourth modified embodiment of the camera module in accordance with a fourth preferred embodiment of the present invention.
  • the support is located on the mounting groove to support the filter.
  • Figure 36 is a cross-sectional view showing the structure of a fifth modified embodiment of the camera module in accordance with a fourth preferred embodiment of the present invention.
  • the filter device is illustrated at the lower end of the driver.
  • Figure 37 is a cross-sectional view showing the structure of a fifth modified embodiment of the camera module in accordance with a fourth preferred embodiment of the present invention.
  • the filter device is illustrated at the upper end of the driver.
  • Figure 38 is a cross-sectional view showing the structure of a sixth modification of the camera module in accordance with a fourth preferred embodiment of the present invention.
  • the filter device is illustrated at the bottom of the lens barrel.
  • Figure 39 is a cross-sectional view showing the structure of a sixth modification of the image pickup module according to the fourth preferred embodiment of the present invention.
  • the filter device is placed on the top of the lens barrel.
  • Figure 40 is a cross-sectional view showing the structure of a seventh modified embodiment of the camera module in accordance with a fourth preferred embodiment of the present invention.
  • the photosensitive core is mounted on the circuit board assembly by flip chip FC.
  • Figure 41 is a cross-sectional view showing the structure of a photosensitive chip including an infrared absorbing structure of a camera module according to a fifth preferred embodiment of the present invention.
  • Figure 42 is a schematic illustration of a wafer level processing photosensitive chip in accordance with a fifth preferred embodiment of the present invention.
  • Figure 43 is a schematic illustration of the transmittance spectrum of an absorbing filter layer in accordance with a preferred embodiment of the present invention.
  • the term “a” is understood to mean “at least one” or “one or more”, that is, in one embodiment, the number of one component can be one, and in another embodiment, the component The number can be multiple, and the term “a” cannot be construed as limiting the quantity.
  • the camera module may be a zoom camera module including a circuit board assembly.
  • a lens 20, a driver 30, a filter 40 and a sensor chip 50 The lens 20 is located in the photosensitive path of the photosensitive chip 50, so that when the camera module is used to collect an image of an object, the light reflected by the object can be further subjected to the light sensing after being processed by the lens 20.
  • Chip 50 is accepted to be suitable for photoelectric conversion.
  • the filter 40 is disposed between the light path of the lens 20 and the photosensitive chip 50, and the photosensitive chip 50 is electrically connected to the circuit board assembly 10.
  • the driver 30 is mounted to the circuit board assembly 10, and the lens 20 is mounted to the driver 30 such that the lens 20 is supported above the circuit board assembly 10. It is worth mentioning that the driver 30 can be implemented as a motor, a thermal driver or a micro-brake (MEMS) or the like.
  • MEMS micro-brake
  • the camera module of the present invention can also be implemented as a fixed focus camera module, and the main difference between the camera module and the focus camera module is that the focus camera module can change the focal length through the focus device. It can be understood that the camera module of the infrared absorption lens structure is not affected by the type of the camera module. Therefore, the camera module regardless of the focus or zoom is not limited by the present invention.
  • the camera module based on the infrared absorbing structure of the present invention comprises a circuit board assembly 10, a lens 20, a filter 40, a photosensitive chip 50 and a lens holder 60.
  • the lens 20 is located in the photosensitive path of the photosensitive chip 50, so that when the camera module is used to collect an image of an object, the light reflected by the object can be further subjected to the light sensing after being processed by the lens 20.
  • Chip 50 is accepted to be suitable for photoelectric conversion.
  • the filter 40 is disposed on a light path of the lens 20 or a photosensitive path of the photosensitive chip 50.
  • the photosensitive chip 50 is electrically connected to the circuit board assembly 10.
  • the lens holder 60 is mounted to the circuit board assembly 10, and the lens 20 is mounted to the lens holder 60 such that the lens 20 is supported above the circuit board assembly 10.
  • the circuit board assembly 10 can be coupled to the electronic device for use with the electronic device.
  • the circuit board assembly 10 includes a bracket 101 and a circuit board 12 that can be mounted or integrally packaged on the circuit board 12.
  • the bracket 101 is molded to form a molded bracket 11 on a wiring board 12.
  • the molded bracket 11 is integrally packaged and connected to the circuit board 12.
  • the molded bracket 11 can also protect the electronic components located on the circuit board assembly 10.
  • a conventional wiring board can be selected as a wiring board main body 121 in which molding is performed on the surface of the wiring board main body 121.
  • the circuit board after performing the SMT process may be integrally packaged to form the molded bracket 11 by an injection molding machine using an injection molding machine, or
  • the molded holder 11 is formed by a molding process such as molding or molding which is commonly used in semiconductor packaging.
  • the circuit board main body 121 may be selected, for example, but not limited to, a soft and hard bonding board, a ceramic substrate (without a soft board), a PCB hard board (without a soft board), and the like.
  • the manner in which the molded bracket 11 is formed may be selected, for example, but not limited to, an injection molding process, a molding process, and the like.
  • the mold holder 11 can be selected from materials such as, but not limited to, nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene, polypropylene), etc. for the injection molding process, and the molding process can be adopted. Epoxy resin. It should be understood by those skilled in the art that the foregoing alternatives and the materials that can be selected are merely illustrative of the embodiments of the invention and are not intended to be limiting. It is worth mentioning that the molded stent 11 has a film-drawing slope which is inclined on the inner surface of the molding. That is to say, in this manner, after the molded bracket 11 is integrally sealed to the wiring board 12, it is easy to release the mold and prevent stray light.
  • the molded bracket 11 of the circuit board assembly 10 can be used to support the driver 30. That is to say, in the assembly process of the conventional camera module using the bracket supporting the driver, the bracket and the circuit board are glued together by the glue, and the present invention is integrally molded on the circuit board assembly 10 by molding.
  • the molded bracket 11 supports the driver 30.
  • the molded bracket 11 can also be used to support the filter 40.
  • the driver 30 and the filter 40 are mounted to the molded bracket 11, and based on the molding process, good surface flatness can be obtained, and thus
  • the driver 30 and the filter 40 provide flat mounting conditions and are integrally formed such that the molded bracket 11 is less prone to offset and tilting, so as to facilitate the driver 30 and the filter 40.
  • Stable, flat mounting conditions are provided to further reduce the cumulative tolerances of the driver 30 and the filter 40 when installed.
  • the top surface 112 of the molded bracket 11 is integrally planarly extended, and the driver 30 and the filter 40 are mounted to the top surface 112 of the molded bracket 11. . That is, the filter 40 and the driver 30 coordinately occupy the top surface 112 of the molded bracket 11.
  • the top surface 112 of the molded bracket 11 may also be a stepped structure rather than being integrally extended. That is, the molded bracket 11 has a mounting groove 113 for mounting the filter 40, and can also be used to mount the driver 30 on the step of the top surface 112.
  • the lens 20 includes at least one lens 21, at least one infrared absorbing layer 22, and a lens barrel 23, wherein the infrared absorbing layer 22 is applied to the outer surface of the lens 21.
  • Each of the lenses 21 is mounted in the lens barrel 23.
  • the infrared absorbing layer 22 may be a material having a near-infrared spectral absorption characteristic. Therefore, it can be understood that the infrared absorbing layer 22 blocks the infrared light of the imaging system partially interfering with the imaging quality, so that the image formed by the camera module is more in line with the best feeling of the human eye.
  • the infrared absorbing layer 22 may be applied to the surface of the lens 21 according to actual needs. It is worth mentioning that the surface may be the side of the object or the side of the image. That is, the infrared absorbing layer 22 may be applied only to the object side or the image side of the lens 21, or may be applied to both surfaces of the lens 21. In addition, the infrared absorbing layer 22 may also be applied to only one of the lenses 21 or simultaneously to a plurality of the lenses 21, wherein the infrared absorbing layer 22 may alternatively be applied to the mirror. The outermost, middle or innermost lens 21 in the barrel 23 is coated with the infrared absorbing layer 22.
  • the lens 20 can be assembled by using one or more of the lenses 21 coated with the infrared absorbing layer 22 according to actual needs. It should be understood by those skilled in the art that the foregoing ⁇ RTIgt; ⁇ / RTI> ⁇ RTIgt; ⁇ / RTI> ⁇ RTIgt; ⁇ / RTI> ⁇ RTIgt;
  • the lens 21 is coated with the infrared absorbing layer 22 to form an absorption lens, and then one or more of the absorption lenses are assembled to the lens barrel 23 to form a lens.
  • Absorption lens is assembled in the same manner as the conventional camera module.
  • the number of the infrared absorbing layers 22 may be two, that is, two infrared absorbing layers 22 are respectively applied to the inner and outer surfaces of the lens 21, and further, the infrared absorbing layer 22 may be coated.
  • One or both sides of the lens 21 are disposed, and preferably one side. Those skilled in the art will appreciate that this is not a limitation of the invention.
  • the camera module passes through the infrared absorbing layer 22 on the lens 21, so that the camera module can achieve the function of filtering, and adjust the properties of the filter 40.
  • the reduced structure makes the overall structure of the camera module thin.
  • the blue glass filter can be eliminated, and the filter 40 is implemented as a common glass filter to save The cost and structural thickness of the camera module. Therefore, the absorption lens is equivalent to moving the optical system of the near-infrared absorbing structure forward, and the thickness of the filter 40 can be reduced to ⁇ 0.15 mm by taking the embodiment as an example.
  • the lens 21 may be made of a resin, a plastic or a glass material.
  • the infrared absorbing layer 22 is a compound or an organic material having an absorbing property, in particular, a characteristic of absorption in a near-infrared spectrum, wherein the near-infrared spectrum is in a wavelength band of 565 nm to 1200 nm.
  • the infrared absorbing layer 22 is formed on the lens 21 by coating and baking a liquid material, wherein the coating method can select physical vapor deposition technology such as immersion, centrifugal spin coating or the like. Or chemical vapor deposition techniques, which are not limiting of the invention.
  • the lens 21 can coat and bake the infrared absorbing layer 22 by imposition or wafer level work to improve product production efficiency and reduce manufacturing costs.
  • the compound is preferably a solvent-soluble pigment compound, and more preferably selected from the group consisting of a phthalocyanine compound, a squaraine lanthanide compound, a naphthalocyanine compound, and a hexavalent porphyrin compound. At least one of the group consisting of a ketone oxime compound and a cyanine compound. Therefore, when the compound is applied to the lens 21 as the infrared absorbing layer 22, it may be applied as a single layer, a double layer or a plurality of layers.
  • a group consisting of a phthalocyanine compound, a squarylium ruthenium compound, a naphthalocyanine compound, a hexavalent porphyrin compound, a ketone oxime compound, and a cyanine compound A plurality of coatings are applied to the lens 21, that is, a compound having an absorbing property is applied to the lens 21.
  • the compound, Formula I and Formula II represent the squaraine lanthanide compound.
  • R a , R b and Y in the formula I satisfy the conditions of the following (a) or (b)
  • R a independently representing a hydrogen atom, a halogen atom, a sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a pity acid group, a -L 1 or a -NR e R f group.
  • R e and R f each independently represent a hydrogen atom, -L a , -L b , -L c , -L d or -L e .
  • the plurality of R b present independently represent a hydrogen atom, a halogen atom sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a pity acid group, a -L 1 or a -NR g R h group.
  • R g and R h each independently represent a hydrogen atom, -L a , -L b , -L c , -L d or -L e or -C(O)R i group (R i represents -L a , -L b , -L c , -L d or -L e ).
  • R j and R k each independently represent a hydrogen atom, -L a , -L b , -L c , -L d or -L e .
  • L 1 is L a , L b , L c , L d , L e , L f , L g or L h .
  • the L a to L h represent the following groups:
  • L a may have an aliphatic hydrocarbon group having a carbon number of 1 to 12 of the substituent L
  • L b may have a substituent L of a halogen-substituted alkyl group having 1 to 12 carbon atoms
  • L c may have a substituent L of an alicyclic hydrocarbon group having 3 to 14 carbon atoms
  • L d may have an aromatic hydrocarbon group having a substituent L of 6 to 14 carbon atoms
  • L e may have a substituent L of a heterocyclic group having 3 to 14 carbon atoms
  • L f may have a substituent A having an alkoxy group having 1 to 9 carbon atoms
  • L g may have an acyl group having a substituent L of 1 to 9 carbon atoms
  • L h may have alkoxycarbonyl group having a substituent of L of 1 to 9 carbon atoms
  • the substituent 1 is an aromatic hydrocarbon group selected from the group consisting of an aliphatic hydrocarbon group having 1 to 12 carbon atoms, a halogen-substituted alkyl group having 1 to 12 carbon atoms, an alicyclic hydrocarbon group having 3 to 14 carbon atoms, and an aromatic group having 6 to 14 carbon atoms. At least one of a group consisting of a hydrocarbon group, a heterocyclic group having 3 to 14 carbon atoms, a halogen atom, a sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a pity acid group, and an amino group.
  • the total number of carbon atoms including the substituent is preferably 50 or less, more preferably 40 or less, and particularly preferably 30 or less.
  • the carbon number is more than the above range, it may be difficult to synthesize a compound, and the absorption intensity per unit weight of light tends to be small.
  • At least one of the two R a on one benzene ring is bonded to Y on the same benzene ring to form a hetero ring having at least one nitrogen atom and having 5 or 6 atoms.
  • the heterocyclic ring may have a substituent, and R b and R a not participating in the formation of the heterocyclic ring are each independently synonymous with R b and RR a of the condition (a).
  • Examples of the aliphatic hydrocarbon group having 1 to 12 carbon atoms in the L a and L include methyl (Me), ethyl (Et), n-propyl (n-Pr), and isopropyl (i).
  • -Pr n-butyl (n-Bu), sec-butyl (s-Bu), tert-butyl (t-Bu), pentyl, hexyl, octyl, decyl, decyl and dodecyl Alkyl; vinyl, 1-propenyl, 2-propenyl, butenyl, 1,3-butadienyl, 2-methyl-1-propenyl, 2-pentenyl, hexenyl and octyl
  • An alkenyl group such as an alkenyl group
  • an alkynyl group such as an ethynyl group, a propynyl group, a butynyl group, a 2-methyl
  • Examples of the halogen-substituted alkyl group having 1 to 12 carbon atoms in the L b and L include trichloromethyl, trifluoromethyl, 1,1-dichloroethyl, pentachloroethyl and five. Fluoroethyl, heptachloropropyl and heptafluoropropyl.
  • Examples of the alicyclic hydrocarbon group having 3 to 14 carbon atoms in L c and L include a cycloalkyl group such as a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, a cycloheptyl group and a cyclooctyl group; A polycyclic alicyclic group such as an alkyl group or an adamantyl group.
  • Examples of the aromatic hydrocarbon group having 6 to 14 carbon atoms in the L d and L include a phenyl group, a tolyl group, a xylyl group, a mesityl group, a cumenyl group, a 1-naphthyl group, and 2 Naphthyl, onion, phenanthryl, anthryl, phenalenyl, tetraamendyl, indanyl and biphenyl.
  • heterocyclic group having 3 to 14 carbon atoms of L e and L examples include, for example, furan, porphin, pyrrole, pyrazole, imidazole, triazole, oxazole, oxadiazole, thiazole, and thiadiazole.
  • Examples of the alkoxy group having a carbon number of -12 in the L f include a methoxy group, an ethoxy group, a n-propoxy group, an isopropoxy group, a butoxy group, a pentyloxy group, and a hexyloxy group. , octyloxy.
  • Examples of the acyl group having 1 to 9 carbon atoms in the L g include an acetyl group, a propionyl group, a butyryl group, an isobutyryl group, a valeryl group, an isovaleryl group, and a benzoyl group.
  • alkoxycarbonyl group having 1 to 9 carbon atoms in the L h examples include a methoxycarbonyl group, an ethoxycarbonyl group, a propoxycarbonyl group, an isopropoxycarbonyl group, a butoxycarbonyl group, and a pentyl group.
  • Oxycarbonyl, hexyloxycarbonyl and octyloxycarbonyl examples include a methoxycarbonyl group, an ethoxycarbonyl group, a propoxycarbonyl group, an isopropoxycarbonyl group, a butoxycarbonyl group, and a pentyl group.
  • L a is preferably methyl, ethyl, n-propyl, isopropyl, n-butyl, sec-butyl, tert-butyl, pentyl, hexyl, octyl, 4-phenylbutyl, 2-
  • the cyclohexylethyl group is more preferably a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a n-butyl group, a sec-butyl group or a t-butyl group.
  • the L b is preferably trichloromethyl, pentachloroethyl, trifluoromethyl, pentafluoroethyl, 5-cyclohexyl-2,2,3,3-tetrafluoropentyl, more preferably trichloro Methyl, pentachloroethyl, trifluoromethyl, pentafluoroethyl.
  • the L c is preferably a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, a 4-ethylcyclohexyl group, a cyclooctyl group or a 4-phenylcycloheptyl group, more preferably a cyclopentyl group, a cyclohexyl group or a 4-ethyl group.
  • a phenyl group, a 1-naphthyl group, a 2-naphthyl group, a tolyl group, a xylyl group, a mesityl group, a cumenyl group, a 3,5-di-tert-butylphenyl group, and 4 are preferable.
  • the L e is preferably a group containing furan, thiophene, pyrrole, anthracene, porphyrin, pyrene, benzofuran, benzothiophene, morpholine, and more preferably contains furan, thiophene, pyrrole, or a group of porphyrins.
  • a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group, a butoxy group, a methoxymethyl group, a methoxyethyl group, a 2-phenylethoxy group, and 3 are preferable.
  • the L g is preferably acetyl, propionyl, butyryl, isobutyryl, benzoyl, 4-propylbenzoyl or trifluoromethylcarbonyl, more preferably acetyl, propionyl or benzoyl.
  • the L h is preferably a methoxycarbonyl group, an ethoxycarbonyl group, a propoxycarbonyl group, an isopropoxycarbonyl group, a butoxycarbonyl group, a 2-trifluoromethylethoxycarbonyl group, or a 2-phenylethoxy group.
  • the carbonyl group is more preferably a methoxycarbonyl group or an ethoxycarbonyl group.
  • the L a to L h may further have at least one atom or group selected from the group consisting of a halogen atom, a sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a phosphoric acid group, and an amino group.
  • a halogen atom e.g., a fluoride
  • a sulfo group e.g., a sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a phosphoric acid group, and an amino group.
  • 4-sulfobutyl group, 4-cyanobutyl group, 5-carboxypentyl group, 5-aminopentyl group, 3-hydroxypropyl group, 2-phosphorylethyl group, and 6-amino group are mentioned.
  • R a in the condition (a) is preferably a hydrogen atom, a chlorine atom, a fluorine atom, a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a n-butyl group, a sec-butyl group, a t-butyl group or a ring.
  • the hexyl group, the phenyl group, the hydroxyl group, the amino group, the dimethylamino group, and the nitro group are more preferably a hydrogen atom, a chlorine atom, a fluorine atom, a methyl group, an ethyl group, a n-propyl group, an isopropyl group or a hydroxyl group.
  • R b in the condition (a) is preferably a hydrogen atom, a chlorine atom, a fluorine atom, a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a n-butyl group, a sec-butyl group, a t-butyl group or a ring.
  • the Y is preferably an amino group, a methylamino group, a dimethylamino group, a diethylamino group, a di-n-propylamino group, a diisopropylamino group, a di-n-butylamino group or a di-tert-butylamino group.
  • the number of constituent atoms including at least one nitrogen atom formed by bonding at least one of two R a on one benzene ring in the condition (b) of the formula I to the Y on the same benzene ring is 5
  • the heterocyclic ring of 6 or more include pyrrolidine, pyrrole, imidazole, pyrazole, piperidine, pyridine, piperazine, pyridazine, pyrimidine and pyrazine.
  • a heterocyclic ring constituting the heterocyclic ring and constituting one of the carbon atoms of the benzene ring is a nitrogen atom, and more preferably a pyrrolidine.
  • X independently represents 0, S, Se, NR c or C(R d R d ), and a plurality of R c independently represent a hydrogen atom, L a , L b , Lc, L d Or L e , a plurality of R d independently represent a hydrogen atom, a halogen atom sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a phosphate group, a -L 1 or a -NR e R f group, and an adjacent R d may be linked to each other to form a ring may have a substituent group, L a ⁇ L e, L 1, L a R e and R f in the formula I as defined in ⁇ L e, L 1, R e , and R f Synonymous.
  • a hydrogen atom, a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a n-butyl group, a sec-butyl group, a tert-butyl group, a n-pentyl group, a n-hexyl group, and a ring are preferable.
  • R d in the formula II is preferably a hydrogen atom, a chlorine atom, a fluorine atom, a methyl group, an ethyl group, a n-propyl group, an isopropyl butyl group, a sec-butyl group, a t-butyl group, a n-pentyl group or a hexyl group.
  • the X is preferably 0, S, Se, N-Me, N-Et, CH 2 , C-Me 2 or C-Et 2 , and more preferably S, C-Me 2 or C-Et 2 .
  • adjacent R d are bonded to each other to form a ring.
  • a ring include a benzopyridinium ring, an ⁇ -naphthylimidazole ring, a ⁇ -naphthylimidazole ring, an ⁇ -naphthoxazole ring, a ⁇ -naphthoxazole ring, and an ⁇ -naphthyl group.
  • the compound, Formula III also represents the squaraine lanthanide compound.
  • X independently represents an oxygen atom, a sulfur atom, a selenium atom or -NH-
  • R 1 to R 7 each independently represent a hydrogen atom, a halogen atom, a sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, or a phosphoric acid.
  • Base -L 1 or -NR g R h group.
  • R g and R h each independently represent a hydrogen atom, -L a , -L b , -L c , -L d or -L e or -C(O)R i group (R i represents -L a , -L b , -L c , -L d or -L e ).
  • L 1 is L a , L b , L c , L d , L e , L f , L g or L h .
  • L a to L h are synonymous with L a to L h as defined in the above formula I.
  • a hydrogen atom, a chlorine atom, a fluorine atom, a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a n-butyl group, a sec-butyl group, a t-butyl group, a cyclohexyl group, a phenyl group, a hydroxyl group are preferable.
  • the amino group, the dimethylamino group, and the nitro group are more preferably a hydrogen atom, a chlorine atom, a fluorine atom, a methyl group, an ethyl group, a n-propyl group, an isopropyl group or a hydroxyl group.
  • a hydrogen atom, a chlorine atom, a fluorine atom, a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a n-butyl group, a sec-butyl group, a t-butyl group, a cyclohexyl group, and a benzene are preferable.
  • Base hydroxy, amino, dimethylamino, cyano, nitro, acetylamino, propionylamino, N-methylethylamino, trifluorocarbonylamino, pentafluoroacetylamino, tert-butyrylamino a cyclohexanoylamino group, more preferably a hydrogen atom, a chlorine atom, a fluorine atom, a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a hydroxyl group, a dimethylamino group, a nitro group, an acetylamino group, a propionylamino group, Trifluoroformylamino, pentafluoroacetylamino, tert-butyrylamino, cyclohexanoylamino.
  • the X is preferably an oxygen atom or a sulfur atom, and particularly preferably an oxygen atom.
  • the compound, Formula IV represents the phthalocyanine-based compound.
  • ⁇ represents two hydrogen atoms, two monovalent metal atoms, a divalent metal atom, or a substituted metal atom containing a trivalent or tetravalent metal atom, and a plurality of R a , R b , R c And R d are independently represented by a hydrogen atom, a halogen atom, a hydroxyl group, a carboxyl group, a nitro group, an amino group, an amide group, an imide group, a cyano group, a silane group, -L 1 , -SL 2 , -SS-L.
  • R a , R b , R c and R d bonded to the same aromatic ring is not a hydrogen atom.
  • the amino group, the amide group, the imide group, and the silane group may have the substituent L defined in the formula I,
  • L 2 represents a hydrogen atom or any of L a to L e defined in the formula I,
  • L 3 represents a hydroxyl group or any of the above L a to L e ,
  • L 4 represents any of the above L a to L e .
  • the photosensitive chip 50 is disposed on an upper surface of the wiring board main body 121, and the molded bracket 11 surrounds an outer side of the photosensitive chip 50.
  • the photosensitive chip 50 may be first mounted on the circuit board main body 121, and then in the On the outside of the photosensitive chip 50, the molded holder 11 is molded on the wiring board main body 121.
  • the molded holder 11 may be molded on the circuit board main body 121, and then the photosensitive chip 50 may be mounted on the circuit board main body 121. Located inside the molded bracket 11.
  • the photosensitive chip 50 is connected to the circuit board assembly 10 through a series of leads 53.
  • the lead 53 may be implemented as, for example but not limited to, a gold wire, a copper wire, an aluminum wire, a silver wire.
  • the series of leads 53 of the photosensitive chip 50 can be attached to the circuit board assembly 10 by conventional COB means, such as, but not limited to, soldering.
  • the present invention further provides a near infrared spectroscopy absorption method of a camera module, which includes the following steps:
  • the lens comprises at least one lens 21 and at least one infrared absorbing layer 22, wherein the infrared absorbing layer 22 is located on the surface of one or more of the lenses 21 by a coating method. Therefore, it can be understood that, according to the step (a), infrared light is absorbed by the infrared absorbing layer 22 coated on the lens 21. It can be understood that the infrared absorbing layer 22 can also be formed on the surface of the lens 21 by other attachment means.
  • the coating method may be a physical vapor deposition technique or a chemical vapor deposition technique using immersion, centrifugal force spin coating.
  • the infrared absorbing layer 22 is an organic material or a compound, and has a characteristic of absorption in the near-infrared spectrum, wherein the near-infrared spectrum is in the band of 565 nm to 1200 nm.
  • step (a) wherein the infrared absorbing layer 22 is a liquid material prior to coating.
  • a first modified embodiment of the camera module according to the first preferred embodiment of the present invention, wherein the molded bracket 11 is described to simultaneously package the circuit board 12 and the photosensitive Chip 50, that is, MOC (molding on chip).
  • the filter 40 is directly above the photosensitive chip 50 and integrally molded via the molded bracket 11. That is, the photosensitive chip 50 is attached to the circuit board main body 121 of the circuit board assembly 10, and then the photosensitive chips 50 are electrically connected to the circuit board main body 121, and then the filter is applied. After the light sheet 40 is placed over the photosensitive chip 50, it is integrally packaged, such as a molded package or formed by a molding process commonly used in a semiconductor package.
  • the filter 40 is mounted to the top surface 112 of the molded bracket 11.
  • the top surface 112 of the molded bracket 11 extends in an integral plane, and the driver 30 can be mounted to the top surface 112 of the molded bracket 11.
  • the molded bracket 11 has a mounting groove 113 for mounting the filter. Sheet 40.
  • the top surface 112 of the molded bracket 11 has a stepped structure and does not extend integrally. The steps of the top surface 112 can be used to mount the filter 40 and the driver 30. .
  • a second modified embodiment of the camera module according to the first preferred embodiment of the present invention, wherein the camera module includes a stand 70 mounted to the die. Bracket 11.
  • the holder 70 has a first seating groove 71 and a second seating groove 72.
  • the filter 40 is mounted on the first seating groove 71 such that the surface of the filter 40 is not It will protrude from the top end of the holder 70.
  • the second seating groove 72 is mounted to the molded bracket 11 such that the molded bracket 11 extends upward along the support 70, and the position of the filter 40 is relatively downward, thereby reducing The back focus of the camera module. As shown in FIG.
  • the top surface 112 of the molded bracket 11 extends integrally planarly, and the second seating groove 72 of the holder 70 is mounted to the top surface 112 of the molded bracket 11,
  • the driver 30 or the lens 20 is mounted to the holder 70.
  • the first seating groove 71 of the support 70 extends toward the inside and the lower side of the camera module, thereby supporting the filter 40 above the photosensitive chip 30, so that the filter 40 It is not installed and does not occupy structural space.
  • the molded bracket 11 has a mounting groove 113, wherein the holder 70 is disposed in the mounting groove 113 of the molded bracket 11.
  • the filter 40 is mounted to the first seating groove 71 such that the surface of the filter 40 does not protrude from the top end of the holder 70.
  • the second seat groove 72 is mounted to the mounting groove 113 such that the molded bracket 11 extends upward along the support 70, and the filter 40 is positioned relatively downward, thereby reducing the position The back focus of the camera module.
  • the driver 30 can be mounted to the molded bracket 11.
  • the filter 40 is mountable to the driver 30 or the lens 20 .
  • the driver 30 includes a lower end portion 31 adapted to mount the filter 40.
  • the driver 30D includes an upper end portion 32 that is adapted to mount the filter 40.
  • the lens barrel 23 includes a bottom portion 231 for mounting the filter 40.
  • the lens barrel 23 includes a top portion 232 for mounting the filter 40.
  • the number of the lens barrels 23 may be one or more, and when the number of the lens barrels 23 is two or more, they may be joined to each other, and the filter 40 may be used.
  • One of the barrels 23 is attached to achieve a filtering effect.
  • the lens barrel 23 includes a first lens barrel 233 and a second lens barrel 234, wherein the second lens barrel 234 is joined to the first lens barrel 233, wherein the joint embodiment can adopt various currently common ones. Bonding techniques, such as a latch assembly, a threaded component, a heat seal, an ultrasonic joint, and the like. Therefore, the engagement embodiment of the first barrel 233 and the second barrel 234 is not a limitation of the present invention. It is to be understood that the number of the lens barrels 23 exemplified above is not a limitation of the present invention.
  • a fourth modified embodiment of the camera module according to the first preferred embodiment of the present invention wherein the photosensitive chip 50 is mounted on the circuit board by a flip chip type FC (Flip Chip). Component 10.
  • the flip chip type FC (Flip Chip) is mounted on the circuit board assembly 10 from the back side of the circuit board assembly 10, and the photosensitive area of the photosensitive chip 50 faces upward. Mounted to the circuit board assembly 10.
  • Such a structure and mounting manner are such that the photosensitive chip 50 and the molded holder 11 are relatively independent, and the mounting of the photosensitive chip 50 is not affected by the molded bracket 11, and the mold of the molded bracket 11 The influence of the molding on the photosensitive chip 50 is also small.
  • the circuit board 12 includes a circuit board main body 121 having a passage 1211, and a lower portion of the passage 1211 is adapted to mount the photosensitive chip 30.
  • the via 1211 allows the upper and lower sides of the wiring board main body 121 to communicate, so that when the photosensitive chip 50 is mounted on the back surface of the wiring board main body 121 and the photosensitive area is mounted on the wiring board main body 121, The photosensitive area of the photosensitive chip 50 is capable of receiving light entering by the lens 20.
  • the circuit board main body 121 has an outer recess 1212, and the outer recess 1212 communicates with the corresponding passage to provide a mounting position of the photosensitive chip 50.
  • a camera module based on an infrared absorption lens structure may be a moving focus camera module including a circuit board assembly. 10.
  • the lens 20 is located in the photosensitive path of the photosensitive chip 50, so that when the camera module is used to collect an image of an object, the light reflected by the object can be further subjected to the light sensing after being processed by the lens 20.
  • Chip 50 is accepted to be suitable for photoelectric conversion.
  • the photosensitive chip 50 is electrically connected to the circuit board assembly 10.
  • the driver 30 is mounted to the circuit board assembly 10, and the lens 20 is mounted to the driver 30 such that the lens 20 is supported above the circuit board assembly 10.
  • the camera module of the present invention can also be implemented as a fixed focus camera module, and the main difference between the camera module and the focus camera module is that the focus camera module can change the focal length through the focus device. It can be understood that the camera module of the infrared absorption lens structure is not affected by the type of the camera module. Therefore, the camera module regardless of the focus or zoom is not limited by the present invention.
  • the circuit board assembly 10 is formed by molding a molded bracket 11 and a circuit board 12, wherein the molded bracket 11 is integrally packaged and connected to the circuit board 12.
  • the molded bracket 11 can also protect the electronic components located on the circuit board assembly 10.
  • a conventional wiring board can be selected as a wiring board main body 121 in which molding is performed on the surface of the wiring board main body 121.
  • the circuit board after the SMT process may be integrally packaged by an injection molding machine by an insert molding process, such as molding, to form the
  • the molded bracket 11 is molded or formed by a molding process commonly used in a semiconductor package.
  • the circuit board main body 121 may be selected, for example, but not limited to, a soft and hard bonding board, a ceramic substrate (without a soft board), a PCB hard board (without a soft board), and the like.
  • the manner in which the molded bracket 11 is formed may be selected, for example, but not limited to, an injection molding process, a molding process, and the like.
  • the mold holder 11 can be selected from materials such as, but not limited to, nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene, polypropylene), etc. for the injection molding process, and the molding process can be adopted. Epoxy resin. It should be understood by those skilled in the art that the foregoing alternatives and the materials that can be selected are merely illustrative of the embodiments of the invention and are not intended to be limiting.
  • the molded bracket 11 of the circuit board assembly 10 can be used to support the driver 30. That is to say, in the assembly process of the conventional camera module using the bracket supporting the driver, the bracket and the circuit board are glued together by the glue, and the present invention is integrally molded on the circuit board assembly 10 by molding.
  • the molded bracket 11 supports the driver 30.
  • the top surface 112 of the molded bracket 11 is integrally planarly extended, wherein a good surface flatness can be obtained based on the molding process, so that the molded bracket 11 is less likely to be displaced or tilted.
  • a phenomenon is provided to provide stable, flat mounting conditions for the driver 30.
  • the photosensitive chip 50 is disposed on the upper surface of the wiring board main body 121, and the molded bracket 11 surrounds the outer side of the photosensitive chip 50.
  • the wiring board 12 and the photosensitive chip 50 can be simultaneously packaged in the molded holder 11. Accordingly, it will be appreciated that the process and package components of the molded stent 11 are not a limitation of the present invention.
  • the lens 20 comprises at least one lens 21, at least one infrared absorbing layer 22 and a lens barrel 23, wherein the infrared absorbing layer 22 is applied to one or more of the lenses 21.
  • the surface may be the side of the object or the side of the image. That is, the infrared absorbing layer 22 may be applied only to the object side or the image side of the lens 21, or may be applied to both surfaces of the lens 21.
  • each of the lenses 21 is mounted in the lens barrel 23.
  • the infrared absorbing layer 22 is an organic material or compound having characteristics of absorption in the near infrared spectrum. Therefore, it can be understood that the infrared absorbing layer 22 blocks the infrared light of the imaging system partially interfering with the imaging quality, so that the image formed by the camera module is more in line with the best feeling of the human eye.
  • the infrared absorbing layer 22 may be applied to the outer surface of the lens 21 according to actual needs. That is, the infrared absorbing layer 22 may be applied to only one of the lenses 21 or simultaneously to a plurality of the lenses 21, wherein the infrared absorbing layer 22 is also optionally coated on the device.
  • the outermost, middle or innermost lens 21 in the lens barrel 23 is coated with the infrared absorbing layer 22.
  • the lens 20 can be assembled by using one or more of the lenses 21 coated with the infrared absorbing layer 22 according to actual needs. It should be understood by those skilled in the art that the foregoing ⁇ RTIgt; ⁇ / RTI> ⁇ RTIgt; ⁇ / RTI> ⁇ RTIgt; ⁇ / RTI> ⁇ RTIgt;
  • the lens 21 is coated with the infrared absorbing layer 22 to form an absorption lens, and one or more of the absorption lenses are assembled to the lens barrel 23 to form an absorption.
  • the absorption lens is assembled in the same manner as the conventional camera module.
  • the number of the infrared absorbing layers 22 may be two, that is, two infrared absorbing layers 22 are respectively applied to the inner and outer surfaces of the lens 21, and further, the infrared absorbing layer 22 may be coated.
  • One or both sides of the lens 21 are disposed, and preferably one side. Those skilled in the art will appreciate that this is not a limitation of the invention.
  • the number of the lens barrels 23 may be one or more, and when the number of the lens barrels 23 is two or more, they may be joined to each other, and the filter 40 may be used.
  • One of the barrels 23 is attached to achieve a filtering effect.
  • the lens barrel 23 includes a first lens barrel 233 and a second lens barrel 234, wherein the second lens barrel 234 is joined to the first lens barrel 233, wherein the joint embodiment can adopt various currently common ones. Bonding techniques, such as a latch assembly, a threaded component, a heat seal, an ultrasonic joint, and the like. Therefore, the joint embodiment of the first barrel 233 and the second barrel 234 is not a limitation of the present invention.
  • the number of the lens barrels 23 exemplified above is not a limitation of the present invention.
  • the number of lenses in the lens barrel 23 is not limited by the present invention according to actual imaging requirements. That is, the first barrel 233 can be equipped with one or more of the lenses 21.
  • the second barrel 234 can also be equipped with one or more of the lenses 21. Further by way of example, the first barrel 233 can be equipped with two of the lenses 21. The second barrel 234 can be equipped with three of the lenses 21.
  • the camera module can pass the infrared absorbing layer 22 on the lens 21, so that the camera module can achieve the function of filtering. Therefore, it can be understood that the embodiment does not need to pass.
  • the filter 40 is filtered.
  • the lens 21 may be made of a resin, a plastic or a glass material.
  • the infrared absorbing layer 22 is a compound or an organic material having an absorbing property, in particular, a characteristic of absorption in a near-infrared spectrum, wherein the near-infrared spectrum is in a wavelength band of 565 nm to 1200 nm.
  • the infrared absorbing layer 22 is formed on the lens 21 by coating and baking a liquid material, wherein the coating method can select physical vapor deposition technology such as immersion, centrifugal spin coating or the like. Or chemical vapor deposition techniques, which are a limitation of the invention.
  • the lens 21 can coat and bake the infrared absorbing layer 22 by imposition or wafer level work to improve product production efficiency and reduce manufacturing costs.
  • the compound is preferably a solvent-soluble pigment compound, and more preferably selected from the group consisting of a phthalocyanine compound, a squaraine lanthanide compound, a naphthalocyanine compound, and a hexavalent porphyrin compound. At least one of the group consisting of a ketone oxime compound and a cyanine compound. Therefore, when the compound is applied to the lens 21 as the infrared absorbing layer 22, it may be applied as a single layer, a double layer or a plurality of layers.
  • a group consisting of a phthalocyanine compound, a squarylium ruthenium compound, a naphthalocyanine compound, a hexavalent porphyrin compound, a ketone oxime compound, and a cyanine compound A plurality of coatings are applied to the lens 21, that is, a compound having an absorbing property is applied to the lens 21.
  • the photosensitive chip 50 is disposed on an upper surface of the wiring board main body 121, wherein when manufacturing the circuit board assembly 10, different manufacturing sequences may be selected, for example, but not limited to,
  • the photosensitive chip 50 may be first mounted on the wiring board main body 121, and then the molded bracket 11 is molded on the wiring board main body 121 outside the photosensitive chip 50.
  • the molded holder 11 may be molded on the circuit board main body 121, and then the photosensitive chip 50 may be mounted on the circuit board main body 121. Located inside the molded bracket 11.
  • the photosensitive chip 50 is connected to the circuit board assembly 10 through a series of leads 53.
  • the lead 53 may be implemented as, for example but not limited to, a gold wire, a copper wire, an aluminum wire, a silver wire.
  • the series of leads 53 of the photosensitive chip 50 can be attached to the circuit board assembly 10 by conventional COB means, such as, but not limited to, soldering.
  • FIG. 20 it is a first modified embodiment of the camera module according to the second preferred embodiment of the present invention, wherein the photosensitive chip 50 is mounted on the circuit board by using a flip chip FC (Flip Chip).
  • FC flip Chip
  • Component 10 The flip chip type FC (Flip Chip) is mounted on the circuit board assembly 10 from the back side of the circuit board assembly 10, and the photosensitive area of the photosensitive chip 50 faces upward. Mounted to the circuit board assembly 10.
  • FC Flip Chip
  • Such a structure and mounting manner are such that the photosensitive chip 50 and the molded holder 11 are relatively independent, and the mounting of the photosensitive chip 50 is not affected by the molded bracket 11, and the mold of the molded bracket 11 The influence of the molding on the photosensitive chip 50 is also small.
  • the circuit board 12 includes a circuit board main body 121 having a passage 1211, and a lower portion of the passage 1211 is adapted to mount the photosensitive chip 30.
  • the via 1211 allows the upper and lower sides of the wiring board main body 121 to communicate, so that when the photosensitive chip 50 is mounted on the back surface of the wiring board main body 121 and the photosensitive area is mounted on the wiring board main body 121, The photosensitive area of the photosensitive chip 50 is capable of receiving light entering by the lens 20.
  • the circuit board main body 121 has an outer recess 1212, and the outer recess 1212 communicates with the corresponding passage to provide a mounting position of the photosensitive chip 50.
  • the present invention further provides a near infrared spectroscopy absorption method of a camera module, which includes the following steps:
  • the lens comprises at least one lens 21 and at least one infrared absorbing layer 22, wherein the infrared absorbing layer 22 is located on the surface of the lens 21 by a coating method.
  • the coating method adopts physical vapor deposition technology or chemical vapor deposition technology of immersion, centrifugal force spin coating.
  • the infrared absorbing layer 22 is an organic material and has a characteristic of absorption in the near-infrared spectrum, wherein the near-infrared spectrum is in the band of 565 nm to 1200 nm.
  • step (a) wherein the infrared absorbing layer 22 is a liquid material prior to coating.
  • the camera module may be a dynamic focus camera module including a circuit board assembly.
  • a lens 20, a driver 30, and a sensor chip 50 The lens 20 is located in the photosensitive path of the photosensitive chip 50, so that when the camera module is used to collect an image of an object, the light reflected by the object can be further subjected to the light sensing after being processed by the lens 20.
  • Chip 50 is accepted to be suitable for photoelectric conversion.
  • the photosensitive chip 50 is electrically connected to the circuit board assembly 10.
  • the driver 30 is mounted to the circuit board assembly 10, and the lens 20 is mounted to the driver 30 such that the lens 20 is supported above the circuit board assembly 10.
  • the camera module of the present invention can also be implemented as a fixed focus camera module, and the main difference between the camera module and the focus camera module is that the focus camera module can change the focal length through the focus device. It can be understood that the camera module of the infrared absorption lens structure is not affected by the type of the camera module. Therefore, the camera module regardless of the focus or zoom is not limited by the present invention.
  • the circuit board assembly 10 is formed by molding a molded bracket 11 and a circuit board 12, wherein the molded bracket 11 is integrally packaged and connected to the circuit board 12.
  • the molded bracket 11 can also protect the electronic components located on the circuit board assembly 10.
  • a conventional wiring board can be selected as a wiring board main body 121 in which molding is performed on the surface of the wiring board main body 121.
  • the circuit board after the SMT process may be integrally packaged by an injection molding machine by an insert molding process, such as molding, to form the
  • the molded bracket 11 is molded or formed by a molding process commonly used in a semiconductor package.
  • the circuit board main body 121 may be selected, for example, but not limited to, a soft and hard bonding board, a ceramic substrate (without a soft board), a PCB hard board (without a soft board), and the like.
  • the manner in which the molded bracket 11 is formed may be selected, for example, but not limited to, an injection molding process, a molding process, and the like.
  • the mold holder 11 can be selected from materials such as, but not limited to, nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene, polypropylene), etc. for the injection molding process, and the molding process can be adopted. Epoxy resin. It should be understood by those skilled in the art that the foregoing alternatives and the materials that can be selected are merely illustrative of the embodiments of the invention and are not intended to be limiting.
  • the molded bracket 11 of the circuit board assembly 10 can be used to support the driver 30. That is to say, in the assembly process of the conventional camera module using the bracket supporting the driver, the bracket and the circuit board are glued together by the glue, and the present invention is integrally molded on the circuit board assembly 10 by molding.
  • the molded bracket 11 supports the driver 30.
  • the top surface 112 of the molded bracket 11 is integrally planarly extended, wherein a good surface flatness can be obtained based on the molding process, so that the molded bracket 11 is less likely to be displaced or tilted.
  • a phenomenon is provided to provide stable, flat mounting conditions for the driver 30.
  • the photosensitive chip 50 is disposed on the upper surface of the wiring board main body 121, and the molded bracket 11 surrounds the outer side of the photosensitive chip 50.
  • the wiring board 12 and the photosensitive chip 50 can be simultaneously packaged in the mold holder 11. Accordingly, it will be appreciated that the process and package components of the molded stent 11 are not a limitation of the present invention.
  • the lens 20 comprises at least one lens 21 and at least one lens barrel 23, wherein the lens 21 is made of an organic material or a compound, wherein the lens 21 has a characteristic of absorption in the near infrared spectrum and is installed in the device. Inside the lens barrel 23. In particular, the near-infrared spectrum is in the 565 nm to 1200 nm band. Further, the lens 21 is made of an absorbent lens by the organic material or compound. It will be appreciated that the lens 20 can be assembled from one or more absorbent lenses. That is, one or more of the absorption lenses are assembled to form an absorption lens. It is worth mentioning that the absorption lens is assembled in the same manner as the conventional camera module.
  • the number of the lens barrels 23 may be one or more, and when the number of the lens barrels 23 is two or more, they may be joined to each other, and the filter 40 may be used.
  • One of the barrels 23 is attached to achieve a filtering effect.
  • the lens barrel 23 includes a first lens barrel 233 and a second lens barrel 234, wherein the second lens barrel 234 is joined to the first lens barrel 233, wherein the joint embodiment can adopt various currently common ones. Bonding techniques, such as a latch assembly, a threaded component, a heat seal, an ultrasonic joint, and the like. Therefore, the joint embodiment of the first barrel 233 and the second barrel 234 is not a limitation of the present invention.
  • the number of the lens barrels 23 exemplified above is not a limitation of the present invention.
  • the number of lenses in the lens barrel 23 is not limited by the present invention according to actual imaging requirements. That is, the first barrel 233 can be equipped with one or more of the lenses 21.
  • the second barrel 234 can also be equipped with one or more of the lenses 21. Further by way of example, the first barrel 233 can be equipped with two of the lenses 21. The second barrel 234 can be equipped with three of the lenses 21.
  • the compound is preferably a solvent-soluble pigment compound, and more preferably selected from the group consisting of a phthalocyanine compound, a squaraine lanthanide compound, a naphthalocyanine compound, and a hexavalent porphyrin compound. At least one of the group consisting of a ketone oxime compound and a cyanine compound. Therefore, when the lens 21 is made of the compound.
  • the lens 21 is made of one or more such that the lens has an absorbing property.
  • the infrared absorption structure of the camera module is formed by the characteristics of the material of the lens 21 itself, and it is further understood that the lens 21 has the characteristics of absorption near the infrared spectrum.
  • the camera module can achieve both the filtering function and the reduced structure, thereby making the overall structure of the camera module thin. That is to say, the lens 21 replaces a general filter, thereby making the structure of the camera module thin.
  • the absorption lens can be obtained by aspherical blue glass aspherical surface forming.
  • the photosensitive chip 50 is attached to the wiring board assembly 10 through a series of leads 53.
  • the lead 53 may be implemented as, for example but not limited to, a gold wire, a copper wire, an aluminum wire, a silver wire.
  • the series of leads 53 of the photosensitive chip 50 can be attached to the circuit board assembly 10 by conventional COB means, such as, but not limited to, soldering. It should be noted that when the photosensitive chip 50 is mounted on the circuit board assembly 10, neither the chip-on-board package (COB) nor the chip flipping method (Flip Chip) is limited by the present invention.
  • FIG. 24 it is a first modified embodiment of the camera module according to the third preferred embodiment of the present invention, in which a different chip mounting method, that is, a flip chip FC (Flip Chip) is used.
  • the conventional chip mounting method is to package the photosensitive chip 50 above the circuit board assembly 10.
  • the flip chip type FC (Flip Chip) is mounted on the circuit board assembly 10 from the back side of the circuit board assembly 10, and the photosensitive area of the photosensitive chip 50 faces upward. Mounted to the circuit board assembly 10.
  • Such a structure and mounting manner are such that the photosensitive chip 50 and the molded holder 11 are relatively independent, and the mounting of the photosensitive chip 50 is not affected by the molded bracket 11, and the mold of the molded bracket 11 The influence of the molding on the photosensitive chip 50 is also small.
  • the manner in which the photosensitive chip 50 is mounted is not a limitation of the present invention.
  • a second modified embodiment of the camera module according to the third preferred embodiment of the present invention wherein the camera module can add a filter 40 disposed on the lens 20
  • the light travels through the path.
  • the filter 40 is implemented as a common glass filter to save cost and structural thickness of the camera module.
  • the thickness of the filter 40 is reduced to ⁇ 0.15 mm.
  • the present invention further provides a near infrared spectroscopy absorption method of a camera module, which includes the following steps:
  • the lens 21 is made of an organic material in which there is a characteristic of absorption in the near infrared spectrum.
  • the near-infrared spectrum is in the range of 565 nm to 1200 nm.
  • the camera module As shown in FIG. 26 to FIG. 30, it is a camera module according to a fourth preferred embodiment of the present invention, which is an imaging module based on an infrared absorption structure.
  • the camera module can be implemented as a zoom camera module or a fixed focus camera module, wherein the main difference is that the focus camera module can change the focal length through the focus device.
  • the camera module based on the infrared absorption structure of the present invention includes a circuit board assembly 10, a lens 20, a driver 30, a filter 40 and a Photosensitive chip 50.
  • the lens 20 is located in the photosensitive path of the photosensitive chip 50, so that when the camera module is used to collect an image of an object, the light reflected by the object can be further subjected to the light sensing after being processed by the lens 20.
  • Chip 50 is accepted to be suitable for photoelectric conversion.
  • the filter 40 is disposed on a light path of the lens 20 or a photosensitive path of the photosensitive chip 50.
  • the photosensitive chip 50 is electrically connected to the circuit board assembly 10.
  • the driver 30 is mounted to the circuit board assembly 10, and the lens 20 is mounted to the driver 30 such that the lens 20 is supported above the circuit board assembly 10.
  • the circuit board assembly 10 can be coupled to the electronic device for use with the electronic device.
  • the driver 30 can be implemented as a motor, a thermal driver or a microactuator (MEMS) or the like.
  • the camera module based on the infrared absorption structure of the present invention includes a circuit board assembly 10, a lens 20, a filter 40, a sensor chip 50, and A lens holder 60.
  • the lens 20 is located in the photosensitive path of the photosensitive chip 50, so that when the camera module is used to collect an image of an object, the light reflected by the object can be further subjected to the light sensing after being processed by the lens 20.
  • Chip 50 is accepted to be suitable for photoelectric conversion.
  • the filter 40 is disposed on a light path of the lens 20 or a photosensitive path of the photosensitive chip 50.
  • the photosensitive chip 50 is electrically connected to the circuit board assembly 10.
  • the lens holder 60 is mounted to the circuit board assembly 10, and the lens 20 is mounted to the lens holder 60 such that the lens 20 is supported above the circuit board assembly 10.
  • the circuit board assembly 10 can be coupled to the electronic device for use with the electronic device.
  • the filter 40 comprises a filter body 41, at least one absorption filter layer 42, and a two-coat layer 43, wherein the absorption filter layer 42 is located by a coating method.
  • a surface of the filter body 41 is described.
  • the coating layer 43 is on the other surface of the filter body 41 and the surface of the absorption filter layer 42, respectively.
  • the filter body 41, the absorbing filter layer 42, and the two coating layers 43 form a sandwich structure, wherein the absorbing filter layer 42 is located at the filter body 41.
  • the upper surface, the two coating layers 43 are respectively located on the upper surface of the absorption filter layer 42 and the lower surface of the filter body 41.
  • the absorption filter layer 42 can also be two layers, that is, respectively located on the upper and lower surfaces of the filter body 41. Therefore, the two coating layers 43 are respectively located on the two absorption filter layers 42.
  • the absorption filter layer 42 may be located on a lower surface of the filter body 41, and the coating layer 43 is respectively located on a lower surface of the absorption filter layer 42 and the filter body.
  • the group achieves both the function of filtering and the thinning of the overall structure.
  • the filter body 41 may be made of a resin, a plastic or a glass material.
  • the absorption filter layer 42 is a compound having an absorption property, particularly a characteristic of absorption in the near-infrared spectrum, wherein the near-infrared spectrum is in the range of 565 nm to 1200 nm.
  • the absorption filter layer 42 is formed by coating and baking a liquid material on the filter body 41, wherein the coating method can be selected by immersion or centrifugal spin coating. Such as physical vapor deposition techniques or chemical vapor deposition techniques, this is not a limitation of the present invention.
  • the filter 40 can be processed by coating or baking by imposition or wafer level work to improve product production efficiency and reduce manufacturing cost.
  • the absorptive filter layer 42 may be coated as a single layer, a double layer or a plurality of layers, which is not limited by the invention. More specifically, the filter module 40 is added to the imaging system of the camera module to block the infrared light of the imaging system partially interfering with the imaging quality by using the absorption filter layer 42 to make the camera module The resulting image is more in line with the best feeling of the human eye.
  • the compound may be the same as the infrared absorbing layer 22 in the above embodiment, which is preferably a solvent-soluble pigment compound, more preferably selected from the group consisting of a phthalocyanine compound, a squaraine lanthanide compound, and naphthoquinone. At least one of the group consisting of a cyanine compound, a hexavalent porphyrin compound, a ketone oxime compound, and a cyanine compound. Therefore, when the compound is applied to the filter body 41 as the absorption filter layer 42, it may be applied as a single layer, a double layer or a plurality of layers.
  • a solvent-soluble pigment compound more preferably selected from the group consisting of a phthalocyanine compound, a squaraine lanthanide compound, and naphthoquinone.
  • a phthalocyanine-based compound a squaraine-based ruthenium-based compound, a naphthalocyanine-based compound, a hexa-valent porphyrin-based compound, a ketone oxime-based compound, and a cyanine compound
  • One or more kinds are applied to the filter body 41, that is, a compound having an absorbing property is applied to the filter body 41.
  • R a , R b and Y in the formula I satisfy the conditions of the following (a) or (b)
  • R a independently representing a hydrogen atom, a halogen atom, a sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a pity acid group, a -L 1 or a -NR e R f group.
  • R e and R f each independently represent a hydrogen atom, -L a , -L b , -L c , -L d or -L e .
  • the plurality of R b present independently represent a hydrogen atom, a halogen atom sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a pity acid group, a -L 1 or a -NR g R h group.
  • R g and R h each independently represent a hydrogen atom, -L a , -L b , -L c , -L d or -L e or -C(O)R i group (R i represents -L a , -L b , -L c , -L d or -L e ).
  • R j and R k each independently represent a hydrogen atom, -L a , -L b , -L c , -L d or -L e .
  • L 1 is L a , L b , L c , L d , L e , L f , L g or L h .
  • the L a to L h represent the following groups:
  • L a may have an aliphatic hydrocarbon group having a carbon number of 1 to 12 of the substituent L
  • L b may have a substituent L of a halogen-substituted alkyl group having 1 to 12 carbon atoms
  • L c may have a substituent L of an alicyclic hydrocarbon group having 3 to 14 carbon atoms
  • L d may have an aromatic hydrocarbon group having a substituent L of 6 to 14 carbon atoms
  • L e may have a substituent L of a heterocyclic group having 3 to 14 carbon atoms
  • L f may have a substituent A having an alkoxy group having 1 to 9 carbon atoms
  • L g may have an acyl group having a substituent L of 1 to 9 carbon atoms
  • L h L may have a substituent group having a carbon number of alkoxycarbonyl group having 1 to 9
  • the substituent 1 is an aromatic hydrocarbon group selected from the group consisting of an aliphatic hydrocarbon group having 1 to 12 carbon atoms, a halogen-substituted alkyl group having 1 to 12 carbon atoms, an alicyclic hydrocarbon group having 3 to 14 carbon atoms, and an aromatic group having 6 to 14 carbon atoms. At least one of a group consisting of a hydrocarbon group, a heterocyclic group having 3 to 14 carbon atoms, a halogen atom, a sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a pity acid group, and an amino group.
  • the total number of carbon atoms including the substituent is preferably 50 or less, more preferably 40 or less, and particularly preferably 30 or less.
  • the carbon number is more than the above range, it may be difficult to synthesize a compound, and the absorption intensity per unit weight of light tends to be small.
  • At least one of the two R a on one benzene ring is bonded to Y on the same benzene ring to form a hetero ring having at least one nitrogen atom and having 5 or 6 atoms.
  • the heterocyclic ring may have a substituent, and R b and R a not participating in the formation of the heterocyclic ring are each independently synonymous with R b and RR a of the condition (a).
  • Examples of the aliphatic hydrocarbon group having 1 to 12 carbon atoms in the L a and L include methyl (Me), ethyl (Et), n-propyl (n-Pr), and isopropyl (i).
  • -Pr n-butyl (n-Bu), sec-butyl (s-Bu), tert-butyl (t-Bu), pentyl, hexyl, octyl, decyl, decyl and dodecyl Alkyl; vinyl, 1-propenyl, 2-propenyl, butenyl, 1,3-butadienyl, 2-methyl-1-propenyl, 2-pentenyl, hexenyl and octyl
  • An alkenyl group such as an alkenyl group
  • an alkynyl group such as an ethynyl group, a propynyl group, a butynyl group, a 2-methyl
  • Examples of the halogen-substituted alkyl group having 1 to 12 carbon atoms in the L b and L include trichloromethyl, trifluoromethyl, 1,1-dichloroethyl, pentachloroethyl and five. Fluoroethyl, heptachloropropyl and heptafluoropropyl.
  • Examples of the alicyclic hydrocarbon group having 3 to 14 carbon atoms in L c and L include a cycloalkyl group such as a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, a cycloheptyl group and a cyclooctyl group; A polycyclic alicyclic group such as an alkyl group or an adamantyl group.
  • Examples of the aromatic hydrocarbon group having 6 to 14 carbon atoms in the L d and L include a phenyl group, a tolyl group, a xylyl group, a mesityl group, a cumenyl group, a 1-naphthyl group, and 2 Naphthyl, onion, phenanthryl, anthryl, phenalenyl, tetraamendyl, indanyl and biphenyl.
  • heterocyclic group having 3 to 14 carbon atoms of L e and L examples include, for example, furan, porphin, pyrrole, pyrazole, imidazole, triazole, oxazole, oxadiazole, thiazole, and thiadiazole.
  • Examples of the alkoxy group having a carbon number of -12 in the L f include a methoxy group, an ethoxy group, a n-propoxy group, an isopropoxy group, a butoxy group, a pentyloxy group, and a hexyloxy group. , octyloxy.
  • Examples of the acyl group having 1 to 9 carbon atoms in the L g include an acetyl group, a propionyl group, a butyryl group, an isobutyryl group, a valeryl group, an isovaleryl group, and a benzoyl group.
  • alkoxycarbonyl group having 1 to 9 carbon atoms in the L h examples include a methoxycarbonyl group, an ethoxycarbonyl group, a propoxycarbonyl group, an isopropoxycarbonyl group, a butoxycarbonyl group, and a pentyl group.
  • Oxycarbonyl, hexyloxycarbonyl and octyloxycarbonyl examples include a methoxycarbonyl group, an ethoxycarbonyl group, a propoxycarbonyl group, an isopropoxycarbonyl group, a butoxycarbonyl group, and a pentyl group.
  • L a is preferably methyl, ethyl, n-propyl, isopropyl, n-butyl, sec-butyl, tert-butyl, pentyl, hexyl, octyl, 4-phenylbutyl, 2-
  • the cyclohexylethyl group is more preferably a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a n-butyl group, a sec-butyl group or a t-butyl group.
  • the L b is preferably trichloromethyl, pentachloroethyl, trifluoromethyl, pentafluoroethyl, 5-cyclohexyl-2,2,3,3-tetrafluoropentyl, more preferably trichloro Methyl, pentachloroethyl, trifluoromethyl, pentafluoroethyl.
  • the L c is preferably a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, a 4-ethylcyclohexyl group, a cyclooctyl group or a 4-phenylcycloheptyl group, more preferably a cyclopentyl group, a cyclohexyl group or a 4-ethyl group.
  • a phenyl group, a 1-naphthyl group, a 2-naphthyl group, a tolyl group, a xylyl group, a mesityl group, a cumenyl group, a 3,5-di-tert-butylphenyl group, and 4 are preferable.
  • the L e is preferably a group containing furan, thiophene, pyrrole, anthracene, porphyrin, pyrene, benzofuran, benzothiophene, morpholine, and more preferably contains furan, thiophene, pyrrole, or a group of porphyrins.
  • a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group, a butoxy group, a methoxymethyl group, a methoxyethyl group, a 2-phenylethoxy group, and 3 are preferable.
  • the L g is preferably acetyl, propionyl, butyryl, isobutyryl, benzoyl, 4-propylbenzoyl or trifluoromethylcarbonyl, more preferably acetyl, propionyl or benzoyl.
  • the L h is preferably a methoxycarbonyl group, an ethoxycarbonyl group, a propoxycarbonyl group, an isopropoxycarbonyl group, a butoxycarbonyl group, a 2-trifluoromethylethoxycarbonyl group, or a 2-phenylethoxy group.
  • the carbonyl group is more preferably a methoxycarbonyl group or an ethoxycarbonyl group.
  • the L a to L h may further have at least one atom or group selected from the group consisting of a halogen atom, a sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a phosphoric acid group, and an amino group.
  • a halogen atom e.g., a fluoride
  • a sulfo group e.g., a sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a phosphoric acid group, and an amino group.
  • 4-sulfobutyl group, 4-cyanobutyl group, 5-carboxypentyl group, 5-aminopentyl group, 3-hydroxypropyl group, 2-phosphorylethyl group, and 6-amino group are mentioned.
  • R a in the condition (a) is preferably a hydrogen atom, a chlorine atom, a fluorine atom, a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a n-butyl group, a sec-butyl group, a t-butyl group or a ring.
  • the hexyl group, the phenyl group, the hydroxyl group, the amino group, the dimethylamino group, and the nitro group are more preferably a hydrogen atom, a chlorine atom, a fluorine atom, a methyl group, an ethyl group, a n-propyl group, an isopropyl group or a hydroxyl group.
  • R b in the condition (a) is preferably a hydrogen atom, a chlorine atom, a fluorine atom, a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a n-butyl group, a sec-butyl group, a t-butyl group or a ring.
  • the Y is preferably an amino group, a methylamino group, a dimethylamino group, a diethylamino group, a di-n-propylamino group, a diisopropylamino group, a di-n-butylamino group or a di-tert-butylamino group.
  • the number of constituent atoms including at least one nitrogen atom formed by bonding at least one of two R a on one benzene ring in the condition (b) of the formula I to the Y on the same benzene ring is 5
  • the heterocyclic ring of 6 or more include pyrrolidine, pyrrole, imidazole, pyrazole, piperidine, pyridine, piperazine, pyridazine, pyrimidine and pyrazine.
  • a heterocyclic ring constituting the heterocyclic ring and constituting one of the carbon atoms of the benzene ring is a nitrogen atom, and more preferably a pyrrolidine.
  • X independently represents 0, S, Se, NR c or C(R d R d ), and a plurality of R c independently represent a hydrogen atom, L a , L b , Lc, L d Or L e , a plurality of R d independently represent a hydrogen atom, a halogen atom sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a phosphate group, a -L 1 or a -NR e R f group, and an adjacent R d may be linked to each other to form a ring may have a substituent group, L a ⁇ L e, L 1, L a R e and R f in the formula I as defined in ⁇ L e, L 1, R e , and R f Synonymous.
  • a hydrogen atom, a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a n-butyl group, a sec-butyl group, a tert-butyl group, a n-pentyl group, a n-hexyl group, and a ring are preferable.
  • a hydrogen atom, a chlorine atom, a fluorine atom, a methyl group, an ethyl group, a n-propyl group, an isopropyl butyl group, a sec-butyl group, a t-butyl group, a n-pentyl group or a n-hexyl group are preferable.
  • cyclohexyl phenyl, methoxy, trifluoromethyl, pentafluoroethyl, 4-aminocyclohexyl, more preferably hydrogen, chlorine, fluorine, methyl, ethyl, n-propyl, iso Propyltrifluoromethyl, pentafluoroethyl.
  • the X is preferably 0, S, Se, N-Me, N-Et, CH 2 , C-Me 2 or C-Et 2 , and more preferably S, C-Me 2 or C-Et 2 .
  • adjacent R d are bonded to each other to form a ring.
  • a ring include a benzopyridinium ring, an ⁇ -naphthylimidazole ring, a ⁇ -naphthylimidazole ring, an ⁇ -naphthoxazole ring, a ⁇ -naphthoxazole ring, and an ⁇ -naphthyl group.
  • the compound, Formula III represents the phthalocyanine-based compound.
  • ⁇ represents two hydrogen atoms, two monovalent metal atoms, a divalent metal atom, or a substituted metal atom containing a trivalent or tetravalent metal atom, and a plurality of R a , R b , R c are present.
  • R d are independently represented by a hydrogen atom, a halogen atom, a hydroxyl group, a carboxyl group, a nitro group, an amino group, an amide group, an imide group, a cyano group, a silane group, -L 1 , -SL 2 , -SS-L.
  • R a , R b , R c and R d bonded to the same aromatic ring is not a hydrogen atom.
  • the amino group, the amide group, the imide group, and the silane group may have the substituent L defined in the formula I,
  • L 2 represents a hydrogen atom or any of L a to L e defined in the formula I,
  • L 3 represents a hydroxyl group or any of the above L a to L e ,
  • L 4 represents any of the above L a to L e .
  • the circuit board assembly 10 includes a bracket 101 and a circuit board 12 that is mounted or integrally sealed to the circuit board 12, such as in this embodiment of the invention,
  • the bracket 101 is implemented as a molded bracket 11 .
  • the circuit board assembly 10 includes a molded bracket 11 and a circuit board 12 , and the molded bracket 11 is integrally packaged and connected to the circuit board 12 . It is molded to the circuit board 12 as molded. More specifically, the molded holder 11 is molded and attached to the wiring board 12 by molding in a mold (Molding On Board, MOB), and the molding process may be a process such as injection molding or molding.
  • MOB Manufacturing On Board
  • the molded stent 11 has a film-drawing slope which is inclined on the inner surface of the molding. That is to say, in this manner, after the molded bracket 11 is integrally sealed to the wiring board 12, it is easy to release the mold and prevent stray light.
  • the molded bracket 11 of the circuit board assembly 10 can be used to support the driver 30. That is to say, in the assembly process of the conventional camera module using the bracket supporting the driver, the bracket and the circuit board are glued together by the glue, and the present invention is integrally molded on the circuit board assembly 10 by molding.
  • the molded bracket 11 supports the driver 30.
  • the molded bracket 11 can also be used to support the filter 40.
  • the circuit board 12 includes a circuit board main body 121, and the molded bracket 11 is integrally connected to the circuit board main body 121.
  • the molded bracket 11 forms a through hole 111 such that the molded bracket 11 surrounds the outside of the photosensitive chip 30 and provides a light path of the lens 20 and the photosensitive chip 50.
  • the photosensitive chip 50 is disposed on the circuit board main body 121 at a position corresponding to the through hole 111.
  • the molded bracket 11 is convexly surrounding the outer side of the photosensitive chip 50, in particular, the molded bracket 11 is integrally closed and connected, so that it has a good sealing property, so that when When the lens 20 is mounted on the photosensitive path of the photosensitive chip 50, the photosensitive chip 50 is sealed inside to form a corresponding closed inner space.
  • a conventional wiring board can be selected as the wiring board main body 121, and molding is performed on the surface of the wiring board main body 121.
  • the circuit board after performing the SMT process may be integrally packaged to form the molded bracket 11 by an injection molding machine using an injection molding machine, or The molded bracket 11 is formed by a molding process such as molding or transfer molding which is commonly used in a semiconductor package.
  • SMT process Surface Mount Technology surface mount process
  • the molded bracket 11 is formed by a molding process such as molding or transfer molding which is commonly used in a semiconductor package.
  • each of the photosensitive chips 50 is attached to the wiring board main body 121, and then the photosensitive chips 50 are electrically connected to the wiring board main body 121, for example, by a gold wire.
  • the circuit board main body 121 may be selected, for example, but not limited to, a soft and hard bonding board, a ceramic substrate (without a soft board), a PCB hard board (without a soft board), an FPCB flexible wiring board, and the like.
  • the manner in which the molded bracket 11 is formed may be selected, for example, but not limited to, an injection molding process, a molding process, and the like.
  • the mold holder 11 can be selected from materials such as, but not limited to, nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene, polypropylene), etc. for the injection molding process, and the molding process can be adopted. Epoxy resin. It should be understood by those skilled in the art that the foregoing alternatives and the materials that can be selected are merely illustrative of the embodiments of the invention and are not intended to be limiting.
  • the process of manufacturing the circuit board assembly 10 may be performed by performing an SMT process on the circuit board main body 121, and then mounting the photosensitive chip 50 on the circuit board main body 121. And electrically connecting the photosensitive chip 50 to the circuit board main body 121, such as a gold wire electrical connection, and then integrally packaging the circuit board main body 121, such as a molded package, by insert molding.
  • the molded bracket 11 is formed by the molding bracket 11, or by a molding process commonly used in a semiconductor package. It will be understood by those skilled in the art that the order of manufacture of the circuit board assembly 10 is not a limitation of the present invention.
  • the photosensitive chip 50 is attached to the wiring board 12 of the wiring board assembly 10 through a series of leads 53.
  • the lead 53 may be implemented as, for example but not limited to, a gold wire, a copper wire, an aluminum wire, a silver wire.
  • the photosensitive chip 50 and the circuit board 12 may also be in other manners, such as soldering, conductive adhesive bonding, and the like.
  • the filter 40 is mounted to the molded support 11, and based on the molding process, good surface flatness can be obtained, and thus the filter 40 can be provided
  • the flat mounting condition and the integrally formed manner make the molding bracket 11 less prone to offset and tilting, so as to provide stable and flat mounting conditions for the filter 40, thereby reducing the filtering.
  • the top surface 112 of the molded stent 11 extends integrally planarly, and the filter 40 is mounted to the top surface 112 of the molded stent 11.
  • the filter 40 may be attached to the top surface 112 of the molded stent 11 by bonding.
  • the driver 30 is mounted to the molded bracket 11 of the circuit board assembly 10. Further, the driver 30 is mounted to the top surface 112 of the molded bracket 11, that is, the filter 40 and the driver 30 coordinate with each other to occupy the molded bracket 11 The top surface 112 is described.
  • the photosensitive chip 50 is disposed on an upper surface of the wiring board main body 121, and the molded bracket 11 surrounds an outer side of the photosensitive chip 50.
  • the photosensitive chip 50 may be first mounted on the circuit board main body 121, and then in the On the outside of the photosensitive chip 50, the molded holder 11 is molded on the wiring board main body 121.
  • the molded holder 11 may be molded on the circuit board main body 121, and then the photosensitive chip 50 may be mounted on the circuit board main body 121. Located inside the molded bracket 11.
  • the present invention further provides an infrared absorption structure processing method for a camera module, which includes the following steps:
  • the coating method is a physical vapor deposition technique such as immersion or centrifugal spin coating or a chemical vapor deposition technique.
  • the filter body 41 is made of a resin material.
  • the absorption filter layer 42 is an organic material and has a characteristic of absorption in the near-infrared spectrum, wherein the near-infrared spectrum is in the band of 565 nm to 1200 nm.
  • step (a) wherein the absorptive filter layer 42 is a liquid material.
  • 31 and 32 are a first modified embodiment of a camera module according to a fourth preferred embodiment of the present invention, wherein the molded bracket 11 is illustrated to simultaneously package the circuit board 12 and the photosensitive Chip 50, that is, MOC (molding on chip).
  • the filter 40 is directly above the photosensitive chip 50 and integrally molded via the molded bracket 11. That is, the photosensitive chip 50 is attached to the circuit board main body 121 of the circuit board assembly 10, and then the photosensitive chips 50 are electrically connected to the circuit board main body 121, and then the filter is applied. After the light sheet 40 is placed over the photosensitive chip 50, it is integrally packaged, such as a molded package or formed by a molding process commonly used in a semiconductor package.
  • the filter 40 is mounted to the top surface 112 of the molded bracket 11.
  • the filter 40 may be attached to the top surface 112 of the molded stent 11 by bonding.
  • the molded stent 11 has a film-drawing slope which is inclined on the inner surface of the molding. That is to say, in this manner, after the molded bracket 11 is integrally sealed to the wiring board 12, it is easy to release the mold and prevent stray light.
  • the molded bracket 11 has a mounting groove 113A that communicates with the through hole 111 to provide a sufficient installation space for the filter 40. That is, the top surface 112A of the molded bracket 11 has a stepped structure, and does not extend integrally. The steps of the top surface 112A can be used to mount the filter 40 and the lens 20 . Or the driver 30.
  • the mounting slot 113A can be used to mount the filter 40, and in other implementations of the invention, the mounting slot 113A can be used to mount the driver 30 of the camera module or the lens 20 and the like, it will be understood by those skilled in the art that the use of the mounting groove 113A is not a limitation of the present invention.
  • the height of the mounting groove 113A is greater than the thickness of the filter 40, so that when the filter 40 is mounted on the mounting groove 113A, the filter 40 does not protrude from the The top end of the bracket 11 is molded.
  • the filter 40 has a square shape
  • the shape of the mounting groove 113A is adapted to the shape of the filter 40. That is, the mounting groove 113A has a square ring shape and communicates with the through hole 111.
  • the moving focus module is taken as an example in the drawing, and in other embodiments of the present invention, the camera module may be a certain focus module, which should be understood by those skilled in the art. Yes, the type of camera module is not a limitation of the present invention.
  • the camera module includes a seat 70B for mounting the filter 40.
  • the holder 70B is mounted to the molded bracket 11, and the driver 30 or the lens 20 is mounted to the holder 70B.
  • the holder 70B has a first seating groove 71B and a second seating groove 72B, and the filter 40 is mounted to the first seating groove 71B so that The bottom surface of the filter 40 is lower than the top end of the holder 70B.
  • the second seating groove 72B is mounted to the molded bracket 11 such that the molded bracket 11 extends upward along the holder 70B, and the position of the filter 40 is relatively downward, thereby reducing The back focus of the camera module.
  • the holder 70B extends into the through hole 111 and extends downward to support the filter 40 above the photosensitive chip 30, effectively utilizing the space in the through hole 111.
  • the filter 40 When the filter 40 is stably mounted, the filter 40 does not occupy an external space.
  • the inwardly extending position of the holder 70B is outside the photosensitive route of the photosensitive chip 30, that is, the holder 70B does not block the photosensitive area of the photosensitive chip 30.
  • the size of the holder 70B can be specifically designed.
  • a moving focus module is described as an example.
  • the lens 20 is mounted to the driver 30, and the driver 30 is mounted to the holder 70B. That is, the holder 70B provides a mounting position for the filter 40 and the driver 30.
  • the camera module may also be a fixed focus module.
  • the lens 20 is mounted to the holder 70B, that is, the holder 70B provides a mounting position for the filter 40 and the lens 20, as will be understood by those skilled in the art.
  • the specific structure of the holder 70B and the type of the camera module are not limitations of the present invention.
  • FIG. 35 it is a fourth modified embodiment of the camera module according to the fourth preferred embodiment of the present invention, in which the arrangement position of the filter 40 is explained.
  • the molded bracket 11 has a mounting groove 113C, and the mounting groove 113C communicates with the through hole 111. That is, the top surface 112C of the molded bracket 11 has a stepped structure and does not extend integrally.
  • the camera module includes a seat 70C for mounting the filter 40.
  • the holder 70C is mounted to the molded bracket 11, and the driver 30 or the lens 20 is mounted to the molded bracket 11.
  • the holder 70C is mounted to the mounting groove 113C of the molded bracket 11, and the height of the mounting groove 113C is greater than the mounting height of the holder 70C, so that the holder 70C does not Projecting from the end of the molded bracket 11.
  • the holder 70C has a first seating groove 71C and a second seating groove 72C.
  • the filter 40 is mounted to the first holder groove 71C such that the surface of the filter 40 does not protrude from the top end of the holder 70C.
  • the second seating groove 72C is mounted to the mounting groove 113C such that the molded bracket 11 extends upward along the support 70C, and the position of the filter 40 is relatively downward, thereby reducing the position The back focus of the camera module.
  • the support 70C may not have the second seat groove 72C, and the flat bottom surface of the support 72C is directly attached to the molded bracket 11.
  • the inwardly extending position of the holder 70C is outside the photosensitive route of the photosensitive chip 50, that is, the holder 70C does not block the photosensitive chip 50 to avoid affecting the object.
  • the photosensitive process of the photosensitive chip 50, the size of the support 70C can be designed according to specific needs.
  • the second seating groove 71C and the mounting groove 113C of the package cooperate with each other to form a matching snap-fit structure, so that the support 70C is stably mounted on the support 70C.
  • the filter 40 in this embodiment is smaller than the photosensitive chip 50, and the camera module having a smaller back focus can be obtained.
  • a moving focus module is described as an example.
  • the lens 20 is mounted to the driver 30, and the driver 30 is mounted to the molded bracket 11. That is, the holder 70C provides a mounting position for the filter 40, and the molded bracket 11 provides a mounting position for the driver 30.
  • the camera module may also be a fixed focus module.
  • the lens 20 is mounted to the molded bracket 11, that is, the mount 70C provides a mounting position for the filter 40, and the molded bracket 11 provides a mounting position for the driver 30. It will be understood by those skilled in the art that the specific structure of the holder 70C and the molded bracket 11 and the type of the camera module are not limited by the present invention.
  • the filter 40 is mounted to the driver 30D such that when the driver 30D is mounted to the molded bracket 11, it provides a flat mounting condition for the driver 30D, And the driver 30D is mounted to support the filter 40 such that the camera module does not need to provide additional components to mount the filter 40.
  • the driver 30D includes a lower end portion 31D that is adapted to be mounted to the filter 40. That is, the lens 20 is attached to the upper end of the driver 30D, and the filter 40 is attached to the lower end portion 31D of the driver 30D, below the lens 50.
  • the driver 30D includes an upper end portion 32D that is adapted to be mounted to the filter 40. That is, the lens 20 is mounted to the lower end of the driver 30D, and the filter 40 is mounted to the upper end portion 32D of the driver 30D, above the lens 50. In particular, the filter 40 is located in front of the lens 20 of the camera module for incident filtering.
  • the filter 40 is mounted to the lens 20E, wherein the lens 20E includes at least one lens barrel 923E and at least one lens 921E, and each of the lenses 921E is mounted on the lens Inside the lens barrel 923E, the filter 40 is press-fitted into the lens barrel 923E of the lens 20E.
  • the lens barrel 923E includes a bottom portion 9231E for mounting the color filter 40.
  • the bottom portion 9231E of the lens barrel 923E is adapted to the shape of the filter 40 to facilitate mounting the filter 40 therein.
  • the upper portion of the lens barrel 923E is used to mount the lens 921E, and the shape of the lens 921E is adapted, and the lower portion is used to mount the filter 40, and is adapted to the shape of the filter 40.
  • the driver 30 is mounted to the molded bracket 11, and the filter 40 is mounted to the barrel 923E, so that no additional components need to be provided to mount the filter 40.
  • the lens barrel 923E includes a top portion 9232E for mounting the color filter 40.
  • the top portion 9232E of the lens barrel 923E is adapted to the shape of the filter 40 to facilitate mounting the filter 40 therein.
  • the lower portion of the lens barrel 923E is used to mount the lens 921E, and the shape of the lens 921E is adapted, and the upper portion is used to mount the filter 40, and is adapted to the shape of the filter 40.
  • the driver 30 is mounted to the molded bracket 11, and the filter 40 is mounted to the barrel 923E, so that no additional components need to be provided to mount the filter 40.
  • the filter 40 can be placed in front of the lens 20 of the camera module for incident filtering.
  • the lens 20E includes two lens barrels 923E that are engaged with each other and that the filter 40 is attached to one of the lens barrels 923E to achieve a filtering effect.
  • a seventh modified embodiment of the image pickup module according to the fourth preferred embodiment of the present invention in which the mounting manner of the photosensitive chip 50 and the installation position of the filter 40 are explained.
  • the photosensitive chip 50 is mounted on the circuit board assembly 10 by a flip chip type FC (Flip Chip).
  • the circuit board 12 includes a circuit board main body 121F having a passage 1211F, and a lower portion of the passage 1211F is adapted to mount the photosensitive chip 30.
  • the via 1211F causes the upper and lower sides of the wiring board main body 121F to communicate, so that when the photosensitive chip 50 is mounted on the back surface of the wiring board main body 121F and the photosensitive area is mounted upward on the wiring board main body 121F,
  • the photosensitive area of the photosensitive chip 50 is capable of receiving light entering by the lens 20.
  • this embodiment adopts a chip mounting method different from the conventional one, that is, a flip chip type FC (Flip Chip).
  • the conventional chip mounting method is to mount the photosensitive chip 50 above the circuit board assembly 10.
  • the Flip Chip is mounted on the circuit board assembly 10 from the back side of the circuit board assembly 10, and the photosensitive area of the photosensitive chip 50 is mounted upward.
  • the structure and the mounting manner of the embodiment are such that the photosensitive chip 50 and the molded bracket 11 are relatively independent, and the mounting of the photosensitive chip 50 is not affected by the molded bracket 11, and the molded bracket 11 is The influence of the molding on the photosensitive chip 50 is also small.
  • the manner in which the photosensitive chip 50 is mounted is not a limitation of the present invention.
  • the circuit board main body 121F has an outer recess 1212F, and the outer recess 1212F communicates with the corresponding passage to provide a mounting position of the photosensitive chip 50.
  • the outer surface of the photosensitive chip 50 is not higher than the outer surface of the wiring board main body 121F, thereby securing the circuit board assembly 10 Surface flatness.
  • the filter 40 is mounted on the upper end of the passage 1211F, that is, the filter 40 covers the passage 1211F of the circuit board main body 121F, and does not need to be
  • the filter 40 is mounted on the molded bracket 11 to greatly reduce the back focus of the camera module and reduce the height of the camera module. That is, the filter 40 is mounted to the wiring board main body 121F without providing additional components.
  • a camera module is an imaging module based on an infrared absorption structure.
  • the camera module can be implemented as a dynamic focus camera module or a fixed focus camera module, wherein the main difference is that the focus camera module can change the focal length through the focus device. This embodiment is described with a moving focus camera module.
  • the camera module based on the infrared absorbing structure in the present invention comprises a circuit board assembly 10, a lens 20, a driver 30, and a sensor chip 50.
  • the lens 20 is located in the photosensitive path of the photosensitive chip 50, so that when the camera module is used to collect an image of an object, the light reflected by the object can be further processed by the photosensitive chip after being processed by the lens 10. 50 accepted to be suitable for photoelectric conversion.
  • the circuit board assembly 10 includes a circuit board and a bracket that can be mounted or integrally packaged on the circuit board.
  • the circuit board assembly 10 includes a molded bracket 11 And a circuit board 12, the photosensitive chip 50 is electrically connected to the circuit board 12.
  • the driver 30 is mounted to the circuit board assembly 10, and the lens 20 is mounted to the driver 30 such that the lens 20 is supported above the circuit board assembly 10.
  • the circuit board assembly 10 can form the molded bracket 11 by molding for supporting the driver 30. That is to say, in the assembly process of the conventional camera module using the bracket supporting the driver, the bracket and the circuit board are glued together by the glue, and the present invention is integrally molded on the circuit board assembly 10 by molding.
  • the molded bracket 11 can also cover and protect the electronic components located on the circuit board 12.
  • the molding method is divided into MOB (molding on board) and MOC (molding on chip), wherein MOB (molding on board) is integrally formed on the circuit board 12, and MOMC (molding on chip) is integrally formed in the The circuit board 12 and the photosensitive chip 50 are mounted.
  • the photosensitive chip 50 may also be mounted on the circuit board assembly 10 and integrally formed by the molded bracket 11. Therefore, the molding method is not limited by the invention.
  • the photosensitive chip 50 comprises at least one chip body 51 and an absorption filter layer 42 , wherein the absorption filter layer 42 is located on the outer surface of the chip body 51 , that is, the photosensitive surface.
  • the chip absorption filter layer 42 is a compound having an absorption property, particularly a characteristic of absorption in a near-infrared spectrum, wherein the near-infrared spectrum is in the range of 565 nm to 1200 nm.
  • the absorption filter layer 42 is formed by coating and baking a liquid material on the chip body 51, wherein the coating method can select immersion, centrifugal force spin coating and the like. Vapor deposition techniques or chemical vapor deposition techniques are also limitations of the invention.
  • the infrared absorption structure of the camera module is formed by the absorption filter layer 42 of the photosensitive chip 50, and the conventional filter can be further saved, so that the camera can be made.
  • the module not only achieves the function of filtering but also reduces the structure to make the overall structure of the camera module thin.
  • the photosensitive chip 50 can coat and bake the absorption filter layer 42 by imposition or wafer level work to improve product production efficiency and reduce manufacturing cost.
  • the compound is preferably a solvent-soluble pigment compound, and more preferably selected from the group consisting of a phthalocyanine compound, a squaraine lanthanide compound, a naphthalocyanine compound, a hexavalent porphyrin compound, and a ketone. At least one of the group consisting of a lanthanide compound and a cyanine compound. Therefore, when the compound is applied to the chip body 51 as the absorption filter layer 42, it may be applied as a single layer, a double layer or a plurality of layers.
  • a phthalocyanine-based compound a squaraine-based ruthenium-based compound, a naphthalocyanine-based compound, a hexa-valent porphyrin-based compound, a ketone oxime-based compound, and a cyanine compound
  • One or more kinds are applied to the chip body 51, that is, a compound having an absorbing property is applied to the chip body 51.
  • R a , R b and Y in the formula I satisfy the conditions of the following (a) or (b)
  • R a independently representing a hydrogen atom, a halogen atom, a sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a pity acid group, a -L 1 or a -NR e R f group.
  • R e and R f each independently represent a hydrogen atom, -L a , -L b , -L c , -L d or -L e .
  • the plurality of R b present independently represent a hydrogen atom, a halogen atom sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a pity acid group, a -L 1 or a -NR g R h group.
  • R g and R h each independently represent a hydrogen atom, -L a , -L b , -L c , -L d or -L e or -C(O)R i group (R i represents -L a , -L b , -L c , -L d or -L e ).
  • R j and R k each independently represent a hydrogen atom, -L a , -L b , -L c , -L d or -L e .
  • L 1 is L a , L b , L c , L d , L e , L f , L g or L h .
  • the L a to L h represent the following groups:
  • L a may have an aliphatic hydrocarbon group having a carbon number of 1 to 12 of the substituent L
  • L b may have a substituent L of a halogen-substituted alkyl group having 1 to 12 carbon atoms
  • L c may have a substituent L of an alicyclic hydrocarbon group having 3 to 14 carbon atoms
  • L d may have an aromatic hydrocarbon group having a substituent L of 6 to 14 carbon atoms
  • L e may have a substituent L of a heterocyclic group having 3 to 14 carbon atoms
  • L f may have a substituent A having an alkoxy group having 1 to 9 carbon atoms
  • L g may have an acyl group having a substituent L of 1 to 9 carbon atoms
  • L h may have alkoxycarbonyl group having a substituent of L of 1 to 9 carbon atoms
  • the substituent 1 is an aromatic hydrocarbon group selected from the group consisting of an aliphatic hydrocarbon group having 1 to 12 carbon atoms, a halogen-substituted alkyl group having 1 to 12 carbon atoms, an alicyclic hydrocarbon group having 3 to 14 carbon atoms, and an aromatic group having 6 to 14 carbon atoms. At least one of a group consisting of a hydrocarbon group, a heterocyclic group having 3 to 14 carbon atoms, a halogen atom, a sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a pity acid group, and an amino group.
  • the total number of carbon atoms including the substituent is preferably 50 or less, more preferably 40 or less, and particularly preferably 30 or less.
  • the carbon number is more than the above range, it may be difficult to synthesize a compound, and the absorption intensity per unit weight of light tends to be small.
  • At least one of the two R a on one benzene ring is bonded to Y on the same benzene ring to form a hetero ring having at least one nitrogen atom and having 5 or 6 atoms.
  • the heterocyclic ring may have a substituent, and R b and R a not participating in the formation of the heterocyclic ring are each independently synonymous with R b and RR a of the condition (a).
  • X independently represents 0, S, Se, NR c or C(R d R d ), and a plurality of R c independently represent a hydrogen atom, L a , L b , L c , L d or L e , a plurality of R d independently represent a hydrogen atom, a halogen atom sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a phosphate group, a -L 1 or a -NR e R f group, adjacent R d may be bonded to each other to form a ring which may have a substituent, and L a to L e , L 1 , R e and R f and L a to L e , L 1 , R e and R as defined in the above formula I f is synonymous.
  • the compound, Formula III represents the phthalocyanine-based compound.
  • ⁇ represents two hydrogen atoms, two monovalent metal atoms, a divalent metal atom, or a substituted metal atom containing a trivalent or tetravalent metal atom, and a plurality of R a , R b , R c are present.
  • R d are independently represented by a hydrogen atom, a halogen atom, a hydroxyl group, a carboxyl group, a nitro group, an amino group, an amide group, an imide group, a cyano group, a silane group, -L 1 , -SL 2 , -SS-L.
  • R a , R b , R c and R d bonded to the same aromatic ring is not a hydrogen atom.
  • the amino group, the amide group, the imide group, and the silane group may have the substituent L defined in the formula I,
  • L 2 represents a hydrogen atom or any of L a to L e defined in the formula I,
  • L 3 represents a hydroxyl group or any of the above L a to L e ,
  • L 4 represents any of the above L a to L e .
  • a conventional chip mounting method may be adopted, or a chip mounting method different from the conventional chip mounting method, that is, a Flip Chip.
  • the conventional chip mounting method is to mount the photosensitive chip 50 above the circuit board assembly 10.
  • the flip chip type FC (Flip Chip) is mounted on the circuit board assembly 10 from the back side of the circuit board assembly 10, and the photosensitive area of the photosensitive chip 50 faces upward. Mounted to the circuit board assembly 10.
  • Such a structure and mounting manner are such that the photosensitive chip 50 and the molded holder 11 are relatively independent, and the mounting of the photosensitive chip 50 is not affected by the molded bracket 11, and the mold of the molded bracket 11 The influence of the molding on the photosensitive chip 50 is also small.
  • the manner in which the photosensitive chip 50 is mounted is not a limitation of the present invention.
  • the present invention further provides a method for manufacturing an infrared absorption structure of a camera module, which comprises the following steps:
  • the coating method is a physical vapor deposition technique such as immersion or centrifugal spin coating or a chemical vapor deposition technique.
  • the absorption filter layer 42 is an organic material and has a characteristic of absorption in the near-infrared spectrum, wherein the near-infrared spectrum is in the band of 565 nm to 1200 nm.
  • step (a) wherein the absorptive filter layer 42 is a liquid material prior to coating.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Optical Filters (AREA)

Abstract

L'invention concerne un module d'appareil photo faisant appel à une structure d'absorption infrarouge, comprenant : une carte de circuit imprimé, une tête de lentille et une puce photosensible; la puce photosensible est connectée électriquement à la carte de circuit imprimé; la tête de lentille est située sur le trajet photosensible de la puce photosensible; la tête de lentille comprend au moins une lentille, et une ou une pluralité de lentilles de ladite lentille est une lentille d'absorption infrarouge et est disposée dans le tube de lentille de telle sorte que la tête de lentille forme une tête de lentille absorbant les infrarouges, ce qui permet d'obtenir la réalisation d'une absorption spectrale de l'infrarouge proche.
PCT/CN2018/082208 2017-04-07 2018-04-08 Module d'appareil photo faisant appel à une structure d'absorption infrarouge et son application Ceased WO2018184597A1 (fr)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
CN201720365416.2 2017-04-07
CN201710224070.9A CN108696672A (zh) 2017-04-07 2017-04-07 基于红外吸收结构的摄像模组及其应用
CN201710223892.5A CN108693683A (zh) 2017-04-07 2017-04-07 基于红外吸收镜头结构的摄像模组及其应用
CN201710223892.5 2017-04-07
CN201710224070.9 2017-04-07
CN201720359008.6U CN208141102U (zh) 2017-04-07 2017-04-07 基于红外吸收镜头结构的摄像模组及其镜头
CN201720365416.2U CN207820030U (zh) 2017-04-07 2017-04-07 基于红外吸收结构的摄像模组
CN201720359008.6 2017-04-07

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WO2018184597A1 true WO2018184597A1 (fr) 2018-10-11

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103135155A (zh) * 2011-12-02 2013-06-05 鸿富锦精密工业（深圳）有限公司 镜头模组
CN103163582A (zh) * 2011-12-19 2013-06-19 鸿富锦精密工业（深圳）有限公司 玻璃镜片及使用该玻璃镜片的镜头模组
CN103364858A (zh) * 2012-03-30 2013-10-23 鸿富锦精密工业（深圳）有限公司 光学元件、镜头模组及光学元件制造方法
CN105452911A (zh) * 2013-10-17 2016-03-30 Jsr株式会社 光学滤波器、固体摄像装置及照相机模块
CN205484995U (zh) * 2016-01-06 2016-08-17 深圳市成像通科技有限公司 一种摄像头模组
CN205787194U (zh) * 2016-05-04 2016-12-07 白金科技股份有限公司 吸收式近红外线滤光片及影像传感器

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103135155A (zh) * 2011-12-02 2013-06-05 鸿富锦精密工业（深圳）有限公司 镜头模组
CN103163582A (zh) * 2011-12-19 2013-06-19 鸿富锦精密工业（深圳）有限公司 玻璃镜片及使用该玻璃镜片的镜头模组
CN103364858A (zh) * 2012-03-30 2013-10-23 鸿富锦精密工业（深圳）有限公司 光学元件、镜头模组及光学元件制造方法
CN105452911A (zh) * 2013-10-17 2016-03-30 Jsr株式会社 光学滤波器、固体摄像装置及照相机模块
CN205484995U (zh) * 2016-01-06 2016-08-17 深圳市成像通科技有限公司 一种摄像头模组
CN205787194U (zh) * 2016-05-04 2016-12-07 白金科技股份有限公司 吸收式近红外线滤光片及影像传感器

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