WO2018191835A1

WO2018191835A1 - Flat loop heat pipe-based closed machine case cooling system

Info

Publication number: WO2018191835A1
Application number: PCT/CN2017/000654
Authority: WO
Inventors: 刘东晓; 张红星; 满广龙; 李国广
Original assignee: 北京空间飞行器总体设计部; 刘东晓; 张红星; 满广龙; 李国广
Priority date: 2017-04-19
Filing date: 2017-10-31
Publication date: 2018-10-25
Also published as: CN106909210A

Abstract

Disclosed in the present invention is a flat loop heat pipe-based closed machine case cooling system, capable of realizing a closed design of a cooled machine case while solving the problem of cooling a high-power consumption component. The closed machine case cooling system comprises: a closed machine case, a cooling fin installed outside of the closed machine case and one or more sets of flat loop heat pipes installed inside the closed machine case; an evaporator of the flat loop heat pipe is closely affixed to the device in the closed machine case requiring cooling. The closed machine case comprises: a movable side panel, a machine case frame and a cooling side panel; one end of the machine case frame is closed by means of the movable side panel, and another end is closed by means of the cooling side panel; the cooling fin and a condenser of the flat loop heat pipe are assembled on the cooling side panel. The present cooling system transmits heat to the outside of a machine case to be dissipated by means of a flat loop heat pipe, implementing a sealed design of a machine case, implementing dust-proofing and moisture-proofing of the machine case, and can increase lifetime, reliability and adaptability to a complex and harsh use environment of corresponding equipment.

Description

Closed chassis cooling system based on flat loop heat pipe

Technical field

The invention relates to a heat dissipation system, in particular to a heat dissipation system based on a flat loop heat pipe heat transfer technology, and belongs to the technical field of heat dissipation.

Background technique

With the development of computer and Internet technologies, desktop computers have become an indispensable part of people's lives. The popularity of computers has made the environment of computers complicated and diverse. Computers are electronic products. Dust and humid environments can cause computer failures. Cleaning and maintenance, fault repair, and machine replacement caused by failures will increase the additional cost to the user.

The CPU and GPU are the core power consumption components of the computer. In order to ensure the performance of the computer, it is necessary to effectively dissipate heat to maintain its operating temperature. At present, the heat dissipation of the computer chassis is mainly based on ventilation and heat dissipation, and the ventilation and heat dissipation requires the chassis to be opened. In order to maintain the system heat dissipation boundary, the heat dissipation method can not achieve the enclosure closure, and can not prevent the entry of dust and moisture. Therefore, the open chassis design is the core factor causing the computer failure. The closed chassis design is an effective means to solve the above problems, but it is transmitted. The impact of the level of thermal technology development has not been promoted and applied.

Summary of the invention

In view of this, the present invention provides a closed chassis heat dissipation system based on a flat loop heat pipe, and realizes a closed design of the heat dissipation chassis on the basis of solving the heat dissipation problem of the high power component.

The closed loop heat dissipation system based on a flat loop heat pipe, wherein the flat loop heat pipe comprises: a liquid storage device, an evaporator, a condenser, a steam pipeline, and a liquid pipeline;

The closed chassis heat dissipation system comprises: a closed chassis, heat dissipating fins mounted on the outside of the closed chassis, and a set of flat loop heat pipes installed inside the closed chassis; the evaporator of the flat loop heat pipe is closely attached Enclose a device in the chassis that requires heat dissipation;

The enclosed chassis includes: a movable side panel, a chassis frame and a heat dissipation side panel; one end of the chassis frame is closed by a movable side panel, and the other end is closed by a heat dissipation side panel; the heat dissipation fin and the flat loop heat pipe condenser The heat dissipation side plate is integrated on the heat dissipation side plate. Specifically, the condenser of the flat loop heat pipe is integrated on one end surface of the heat dissipation side plate facing the chassis frame, and the heat dissipation fin is integrated on one end surface of the chassis frame. .

As a preferred mode of the present invention, a flexible joint is provided on both the steam line and the liquid line of the flat loop heat pipe, and the flexible joint realizes flexible bending of the duct steam line and the liquid line.

As a preferred mode of the present invention, the accumulator and the evaporator are integrated and integrated.

In a preferred embodiment of the present invention, the heat dissipating fins are integrally formed with the heat dissipating side plates, and the condenser side plates of the flat ring heat pipes are integrated with the heat dissipating side plates by brazing or pasting.

Beneficial effects:

(1) Compared with the traditional copper water heat pipe, the flat ring heat pipe has higher heat transfer capacity and limited heat flux heat dissipation capability, and can solve the heat dissipation problem under the condition of unforced convection of high power devices such as CPU and GPU;

(2) The heat is transmitted to the outside of the chassis through the flat-loop heat pipe to realize the closed design of the chassis, which realizes the dustproof and moisture-proof of the chassis, and can improve the life, reliability and complex and demanding environment of the corresponding equipment. Adaptability

(3) The fanless design realizes the mute effect of the chassis, and at the same time, the compact design of the chassis and the size and volume of the effective compressor box can be realized.

DRAWINGS

1 is a schematic diagram of a fully enclosed computer case based on a flat loop heat pipe;

Figure 2 is a diagram showing the external structure of a fully enclosed computer case;

3 is a structural diagram of a heat dissipation side plate of a fully enclosed computer case;

Among them: 10--closed computer case, 11-active side plate, 12-chassis frame, 13-heat side plate, 13-1- side plate base, 20-heat fins, 30-plate loop heat pipe, 31-storage Liquid, 32-evaporator, 33-condenser, 34-catheter, 34-1-vapor line, 34-2-liquid line, 34-3-flexible joint.

detailed description

The present invention will be described in detail below with reference to the drawings and embodiments.

The embodiment provides a closed computer cooling system based on a flat loop heat pipe, which changes the heat dissipation mode of the conventional computer chassis, and uses a flat loop heat pipe heat transfer technology to the high power device on the basis of fully sealing the computer case. Cool down.

As shown in FIG. 1 , the fully enclosed computer cooling system includes: a closed chassis 10 , a heat dissipating fin 20 , and a flat loop heat pipe 30 ; wherein the flat ring heat pipe 30 can be set according to the needs of the heat sink component, as shown in FIG. 1 . Two sets of flat loop heat pipes 30 are disposed in the enclosed casing 10.

A closed loop heat pipe 30 is installed inside the closed chassis 10, and the heat dissipating fins 20 are externally mounted. The flat loop heat pipe 30 collects heat of the large power consumption device, and is transmitted to the heat dissipating fins 20 through the closed chassis 10 for dissipation, and the heat dissipating fins 20 are integrated. On the enclosed chassis 10, the condensing end of the flat loop heat pipe 30 is also integrated on the enclosed chassis 10.

The flat loop heat pipe 30 includes a reservoir 31, an evaporator 32, a condenser 33, and a conduit 34. Liquid reservoir 31 and the evaporator 32 adopt an integrated integrated design. In use, the evaporator 32 is closely attached to the high-power device in the closed chassis 10. The condenser 33 is integrated with the closed chassis 10 and the heat dissipating fins, and the loop working medium is used. The gas-liquid two-state circulation flows along the flat-loop heat pipe 30, so that the heat of the high-power device is dissipated to the external environment of the heat-dissipating fins 20.

The conduit 34 includes a vapor line 34-1, a liquid line 34-2, and a flexible joint 34-3. The working medium in the accumulator 31 is in a liquid state, the working medium absorbs heat in the evaporator 32, and the steam flows along the steam line 34-1 to the condenser 33. The working medium is condensed and liquefied in the condenser 33, and then along the liquid line 34. -2 is returned to the accumulator 31 to achieve a two-phase circulating flow of the working gas. A flexible joint 34-3 is disposed on the steam line 34-1 and the liquid line 34-2. The flexible joint 34-3 can realize flexible bending of the duct 34 to facilitate the installation arrangement of the flat loop heat pipe 30.

As shown in FIG. 2, the enclosed computer case 10 includes a movable side panel 11, a chassis frame 12, and a heat dissipation side panel 13. The chassis frame 12 has one end fixed to the movable side panel 11 and closed, and the other end is fixed after being fixed to the heat dissipation side panel 13. The movable side panel 11 is connected to the chassis frame 12, which can be easily disassembled, and provides a convenient space for disassembly and assembly of the computer. The chassis frame 12 and the heat dissipation side panel 13 are connected and fixed as a mounting and fixing support structure for the internal board and components of the computer. The connection between the movable side panel 11 and the chassis frame 12, the heat dissipation side panel 13 and the chassis frame 12 can be sealed or even sealed according to actual environmental requirements.

As shown in FIG. 3, the heat dissipation side plate 13 of the fully enclosed computer case 10 is a composite structure, and includes a side plate substrate 13-1 and a flat ring integrated on the inner surface of the heat dissipation side plate 13 (ie, an end surface located in the chassis frame 12). The condenser of the heat pipe 10 and the heat dissipating fins integrated on the outer surface of the heat dissipation side plate 13 (i.e., the end surface located outside the chassis frame 12). The side plate substrate 13-1 and the heat dissipating fins 20 are integrally formed, and the side plate substrate 13-1 and the condenser 33 of the flat ring heat pipe 10 are integrated by a process such as brazing and bonding, and the integrated composite structure helps to reduce the number of The contact thermal resistance can effectively improve the heat dissipation performance of the system.

In conclusion, the above is only the preferred embodiment of the present invention and is not intended to limit the scope of the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and scope of the present invention are intended to be included within the scope of the present invention.

Claims

The closed loop heat dissipation system based on the flat loop heat pipe includes: a liquid storage device, an evaporator, a condenser, a steam pipeline, and a liquid pipeline;

The closed chassis heat dissipation system comprises: a closed chassis, heat dissipating fins mounted on the outside of the closed chassis, and a set of flat loop heat pipes installed inside the closed chassis; the evaporator of the flat loop heat pipe is closely attached Enclose a device in the chassis that requires heat dissipation;

The enclosed chassis includes: a movable side panel, a chassis frame and a heat dissipation side panel; one end of the chassis frame is closed by a movable side panel, and the other end is closed by a heat dissipation side panel; the heat dissipation fin and the flat loop heat pipe condenser The heat dissipation side plate is integrated on the heat dissipation side plate. Specifically, the condenser of the flat loop heat pipe is integrated on one end surface of the heat dissipation side plate facing the chassis frame, and the heat dissipation fin is integrated on one end surface of the chassis frame. .
The enclosed chassis heat dissipation system based on a flat loop heat pipe according to claim 1 , wherein a flexible joint is disposed on the steam line and the liquid line of the flat loop heat pipe, and the flexible joint implements the conduit Flexible bending of the steam and liquid lines.
The enclosed chassis heat dissipation system based on a flat loop heat pipe according to claim 1 or 2, wherein the accumulator and the evaporator are integrated and integrated.
The enclosed chassis heat dissipation system based on a flat loop heat pipe according to claim 1 or 2, wherein the heat dissipating fins are integrally formed with the heat dissipating side plates, and the condenser side plates of the flat ring heat pipes are brazed The welding or bonding method is integrated with the heat dissipation side plate.